Multilayer substrate, method for producing a multilayer substrate and electronic device

DE112024003735T5Undetermined Publication Date: 2026-07-09MURATA MFG CO LTD
1 Cites 0 Cited by

Patent Information

Application Number
DE112024003735
Authority / Receiving Office
DE · DE
Patent Type
Applications
Current Assignee / Owner
Priority Date
2024-10-29
Filing Date
2024-10-29
Publication Date
2026-07-09
Patent Text Reader

Abstract

A multilayer substrate (101) comprises a plurality of base layers and conductor structures, the base layers being laminated. The multilayer substrate (101) is provided with a first section (10) and a second section (20) that is continuous with the first section (10), each having a constant or nearly constant thickness between its facing front and back surfaces. The front surface of the first section (10) is at least one projecting curved surface, the back surface of the first section (10) is a recessed curved surface facing the projecting curved surface, and the front and back surfaces of the second section (20) are flat surfaces.Each base layer extends continuously from the first section (10) to the second section (20) and at least part of the conductor structures extends continuously from the first section (10) to the second section (20) inside the multilayer substrate (101).
Need to check novelty before this filing date? Find Prior Art

Citation Information

Patent Citations

  • Support of electronic device

    JP2004082564A

  • 2004-82564