Multilayer substrate, method for producing a multilayer substrate and electronic device
DE112024003735T5Undetermined Publication Date: 2026-07-09MURATA MFG CO LTD
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Patent Information
- Application Number
- DE112024003735
- Authority / Receiving Office
- DE · DE
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2024-10-29
- Filing Date
- 2024-10-29
- Publication Date
- 2026-07-09
Abstract
A multilayer substrate (101) comprises a plurality of base layers and conductor structures, the base layers being laminated. The multilayer substrate (101) is provided with a first section (10) and a second section (20) that is continuous with the first section (10), each having a constant or nearly constant thickness between its facing front and back surfaces. The front surface of the first section (10) is at least one projecting curved surface, the back surface of the first section (10) is a recessed curved surface facing the projecting curved surface, and the front and back surfaces of the second section (20) are flat surfaces.Each base layer extends continuously from the first section (10) to the second section (20) and at least part of the conductor structures extends continuously from the first section (10) to the second section (20) inside the multilayer substrate (101).
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Citation Information
Patent Citations
Support of electronic device
JP2004082564A
2004-82564