Imaging lens drive module, camera module and electronic device

Abstract

An imaging lens drive module, comprising: an imaging lens arrangement (110) with an optical axis (X); a lens carrier (120) configured for the installation of the imaging lens assembly (110); a frame element (130) which is arranged according to the lens carrier (120); a set of balls (140) arranged between the lens carrier (120) and the frame element (130), wherein the set of balls (140) is physically in contact with the lens carrier (120) and the frame element (130); a wiring substrate (150) arranged on an image side of the imaging lens arrangement (110); a resilience wiring plate (160) configured to connect the lens carrier (120) and the wiring substrate (150), and comprising: a movable end (161) which is connected to and attached to the lens carrier (120) without any movement relative to the lens carrier (120); a fixed end (162) which is connected to and attached to the wiring substrate (150) without any movement relative to the wiring substrate (150); a connecting section (163) which is connected to the movable end (161); an elastic section (164) connecting the fixed end (162) and the connecting section (163), wherein the elastic section (164) extends in a direction parallel to the optical axis (X) and comprises: at least two meandering branches (166) extending towards the fixed end (162) and overlapping in a particular viewing direction; and a node (167), wherein the at least two meandering branches (166) extend towards the fixed end (162) and converge at the node (167); and a principal constraint component (165) coupled to the connecting section (163) and the elastic section (164) such that a first angle is formed between the connecting section (163) and the elastic section (164); and a drive unit configured to drive the lens carrier (120) to move relative to the wiring substrate (150) in a direction parallel to the optical axis (X) or in a direction perpendicular to the optical axis (X), and comprising: a first coil (171) which is arranged at the movable end (161) of the resilience wiring plate (160); a second coil (172) arranged on a surface of the wiring substrate (150); and a first magnetic element (173) arranged on a mounting section (131) of the frame element (130), wherein the first magnetic element (173) is opposite and arranged in relation to both the first coil (171) and the second coil (172); wherein a straight length of the elastic section (164) in a direction along the optical axis (X) is D, a total length of the at least two meandering branches (166) is L and the following conditions are met: D < L ; and 1.4 < L / D < 17.

Description

BACKGROUND Technical area

[0001] The present disclosure relates to an imaging lens drive module and a camera module. In particular, the present disclosure relates to an imaging lens drive module and a camera module applicable to portable electronic devices. Description of the state of the art

[0002] In recent years, portable electronic devices have developed rapidly. For example, smart electronic devices and tablets have become commonplace in modern life, and imaging lens drive modules, used in portable electronic devices and mobile transportation systems, have also experienced a surge in popularity. However, with technological advancements, the quality requirements for imaging lens drive modules are also increasing. Therefore, an imaging lens drive module must be developed that contributes to improved structural strength. SUMMARY

[0003] According to one aspect of the present disclosure, an imaging lens drive module comprises an imaging lens assembly, a lens carrier, a frame element, a ball set, a wiring substrate, a resilient wiring plate, and a drive unit. The imaging lens assembly has an optical axis, the lens carrier is configured to mount the imaging lens assembly, and the frame element is arranged correspondingly to the lens carrier. The ball set is positioned between the lens carrier and the frame element, with the ball set being in physical contact with both the lens carrier and the frame element.The wiring substrate is located on an image-side of the imaging lens assembly. The resilience wiring plate is configured to connect the lens holder and the wiring substrate. The resilience wiring plate comprises a movable end, a fixed end, a connecting section, an elastic section, and a main restraint component. The movable end is coupled and secured to the lens holder without movement relative to the lens holder. The fixed end is coupled and secured to the wiring substrate without movement relative to the wiring substrate. The connecting section is attached to the movable end. The elastic section connects the fixed end and the connecting section. The elastic section extends in a direction parallel to the optical axis and comprises at least two meandering branches and a node.The at least two meandering branches extend towards the fixed end, overlap in a specific viewing direction, and converge at the node. The main limiting component is coupled to the connecting section and the elastic section such that a first angle is formed between the connecting section and the elastic section. The drive unit is configured to drive the lens carrier to move relative to the wiring substrate in a direction parallel to the optical axis or in a direction perpendicular to the optical axis, and the drive unit comprises a first coil, a second coil, and a first magnetic element.The first coil is located at the movable end of the resilience wiring plate, the second coil is located on a surface of the wiring substrate, the first magnetic element is located on a mounting section of the frame element, and the first magnetic element faces and is positioned accordingly for both the first and second coils. If the straight length of the elastic section in one direction along the optical axis is D and the total length of the at least two meandering branches is L, the following conditions are met: D < L; and 1.4 < L / D < 17.

[0004] According to the imaging lens drive module of the aforementioned aspect, wherein, if the straight length of the elastic section in one direction along the optical axis is D and the total length of the at least two meandering branches is L, the following condition is satisfied: 2.1 < L / D < 14.3.

[0005] According to the imaging lens drive module of the aforementioned aspect, wherein the drive unit is configured to drive the lens carrier to move relative to the frame element in a direction parallel to the optical axis.

[0006] According to the imaging lens drive module of the aforementioned aspect, wherein the drive unit is configured to drive the frame element to move relative to the wiring substrate in a direction perpendicular to the optical axis.

[0007] According to the imaging lens drive module of the aforementioned aspect, wherein the at least two meandering branches diverge away from each other after converging at the node, extend further towards the fixed end and then approach each other.

[0008] According to the imaging lens drive module of the aforementioned aspect, wherein the resilience wiring plate contains polyimide.

[0009] According to the imaging lens drive module of the aforementioned aspect, wherein the elastic section further comprises a gain section and an auxiliary constraint component. The gain section is connected to at least one of the at least two meandering branches. The auxiliary constraint component is coupled to the gain section and the at least one of the at least two meandering branches, such that a second angle is formed between the gain section and the at least one of the at least two meandering branches.

[0010] According to the imaging lens drive module of the aforementioned aspect, the drive unit further comprises a third coil and a second magnetic element. The third coil is arranged on the other surface of the wiring substrate. The second magnetic element is arranged on the other mounting section of the frame element, the second magnetic element facing the third coil and being arranged in accordance with the third coil.

[0011] According to one aspect of the present disclosure, an imaging lens drive module comprises an imaging lens assembly, a lens carrier, a frame element, a ball set, a wiring substrate, a resilient wiring plate, and a drive unit. The imaging lens assembly has an optical axis, the lens carrier is configured to mount the imaging lens assembly, and the frame element is arranged correspondingly to the lens carrier. The ball set is positioned between the lens carrier and the frame element, with the ball set being in physical contact with both the lens carrier and the frame element.The wiring substrate is located on an image-side of the imaging lens assembly. The resilience wiring plate is configured to connect the lens carrier and the wiring substrate. The resilience wiring plate comprises a movable end, a fixed end, a connecting section, and an elastic section. The movable end is coupled and fixed to the lens carrier without movement relative to the lens carrier. The fixed end is coupled and fixed to the wiring substrate without movement relative to the wiring substrate. The connecting section is attached to the movable end. The elastic section connects the fixed end and the connecting section. The elastic section extends in a direction parallel to the optical axis and comprises at least two meandering branches.The at least two meandering branches extend towards the fixed end and overlap in a specific viewing direction. The drive unit is configured to drive the lens holder to move relative to the wiring substrate in a direction parallel to the optical axis or in a direction perpendicular to the optical axis. The drive unit comprises a first coil, a second coil, and a first magnetic element. The first coil is located at the moving end of the resilient wiring plate, the second coil is located on a surface of the wiring substrate, and the first magnetic element is located on a mounting section of the frame element. The first magnetic element faces and is positioned accordingly towards both the first and second coils.If a maximum width of the elastic section close to the connecting section is Wc and a minimum width of each of the at least two meandering branches close to the fixed end is Wf, then the following conditions are met: Wf < Wc; and 1.5 < Wc / Wf < 16.

[0012] According to the imaging lens drive modulus of the aforementioned aspect, wherein, if the maximum width of the elastic section close to the connecting section is Wc and the minimum width of each of the at least two meandering branches close to the fixed end is Wf, the following condition is satisfied: 1.9 < Wc / Wf < 12.7.

[0013] According to the imaging lens drive module of the aforementioned aspect, wherein, if a straight length of the elastic section in one direction along the optical axis is D and a total length of the at least two meandering branches is L, the following conditions are met: D < L; and 2.1 < L / D < 14.3.

[0014] According to the imaging lens drive module of the aforementioned aspect, wherein the drive unit is configured to drive the lens carrier to move relative to the frame element in a direction parallel to the optical axis.

[0015] According to the imaging lens drive module of the aforementioned aspect, wherein the drive unit is configured to drive the frame element to move relative to the wiring substrate in a direction perpendicular to the optical axis.

[0016] According to the imaging lens drive module of the aforementioned aspect, wherein the resilience wiring plate further comprises a main limiting component coupled to the connecting section and the elastic section, such that a first angle is formed between the connecting section and the elastic section.

[0017] According to the imaging lens drive module of the aforementioned aspect, wherein the elastic section of the resilience wiring plate further comprises a node. The at least two meandering branches extend towards the fixed end and converge at the node. The at least two meandering branches diverge from each other after converging at the node, continue to extend towards the fixed end, and then approach each other.

[0018] According to the imaging lens drive module of the aforementioned aspect, wherein the resilience wiring plate comprises polyimide.

[0019] According to the imaging lens drive module of the aforementioned aspect, wherein the elastic section further comprises a gain section and an auxiliary constraint component. The gain section is connected to at least one of the at least two meandering branches. The auxiliary constraint component is coupled to the gain section and the at least one of the at least two meandering branches, such that a second angle is formed between the gain section and the at least one of the at least two meandering branches.

[0020] According to the imaging lens drive module of the aforementioned aspect, the drive unit further comprises a third coil and a second magnetic element. The third coil is arranged on the other surface of the wiring substrate. The second magnetic element is arranged on the other mounting section of the frame element, with the second magnetic element facing the third coil and positioned in accordance with the third coil.

[0021] According to one aspect of the present disclosure, an imaging lens drive module comprises an imaging lens assembly, a lens carrier, a frame element, a ball set, a wiring substrate, a resilient wiring plate, and a drive unit. The imaging lens assembly has an optical axis, the lens carrier is configured to mount the imaging lens assembly, and the frame element is arranged correspondingly to the lens carrier. The ball set is positioned between the lens carrier and the frame element, with the ball set being in physical contact with both the lens carrier and the frame element.The wiring substrate is located on an image-side of the imaging lens assembly. The resilience wiring plate is configured to connect the lens carrier and the wiring substrate. The resilience wiring plate comprises a movable end, a fixed end, a connecting section, and an elastic section. The movable end is coupled and fixed to the lens carrier without movement relative to the lens carrier. The fixed end is coupled and fixed to the wiring substrate without movement relative to the wiring substrate. The connecting section is attached to the movable end. The elastic section connects the fixed end and the connecting section. The elastic section extends in a direction parallel to the optical axis and comprises at least two meandering branches and a node.The at least two meandering branches extend towards the fixed end, overlap in a specific viewing direction, and converge at the node. The drive unit is configured to drive the lens holder to move relative to the wiring substrate in a direction parallel to the optical axis, and the drive unit comprises a first coil and a first magnetic element. The first coil is located at the moving end of the resilient wiring plate, the first magnetic element is located on a mounting section of the frame element, and the first magnetic element faces and is positioned in relation to the first coil.If the shortest distance between the fixed end and the node in a direction parallel to the optical axis is Hn, and the straight length of the elastic section in a direction along the optical axis is D, then the following conditions are met: Hn < D; and 0.1 ≤ Hn / D ≤ 0.7.

[0022] According to the imaging lens drive module of the aforementioned aspect, wherein, if the shortest distance between the fixed end and the node in a direction parallel to the optical axis is Hn and the straight length of the elastic section in a direction along the optical axis is D, the following condition is satisfied: 0.2 ≤ Hn / D ≤ 0.55.

[0023] According to the imaging lens drive module of the aforementioned aspect, wherein the drive unit is configured to drive the lens carrier to move relative to the frame element in a direction parallel to the optical axis.

[0024] According to the imaging lens drive module of the aforementioned aspect, the drive unit further comprises a second coil arranged on a surface of the wiring substrate. The first magnetic element faces both the first coil and the second coil and is arranged accordingly.

[0025] According to the imaging lens drive module of the aforementioned aspect, wherein the drive unit is configured to drive the frame element to move relative to the wiring substrate in a direction perpendicular to the optical axis.

[0026] According to the imaging lens drive module of the aforementioned aspect, the resilience wiring plate further comprises a main limiting component coupled to the connecting section and the elastic section, such that a first angle is formed between the connecting section and the elastic section.

[0027] According to the imaging lens drive module of the aforementioned aspect, wherein the at least two meandering branches diverge away from each other after converging at the node, extend further towards the fixed end and then approach each other.

[0028] According to the imaging lens drive module of the aforementioned aspect, wherein the resilience wiring plate comprises polyimide.

[0029] According to the imaging lens drive module of the aforementioned aspect, wherein the elastic section further comprises a reinforcement section and an auxiliary limiting component. The reinforcement section is connected to at least one of the at least two meandering branches. The auxiliary limiting component is coupled to the reinforcement section and the at least one of the at least two meandering branches, such that a second angle is formed between the reinforcement section and the at least one of the at least two meandering branches.

[0030] According to the imaging lens drive module of the aforementioned aspect, the drive unit further comprises a third coil and a second magnetic element. The third coil is arranged on the other surface of the wiring substrate. The second magnetic element is arranged on the other mounting section of the frame element, with the second magnetic element facing the third coil and positioned in accordance with the third coil.

[0031] According to one aspect of the present disclosure, a camera module comprises the imaging lens drive module of the aforementioned aspect and an image sensor corresponding to an image area of ​​the imaging lens arrangement of the imaging lens drive module.

[0032] According to one aspect of the present disclosure, an electronic device comprises the camera module of the aforementioned aspect. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] The present disclosure may be better understood by reading the following detailed description of the embodiment with reference to the accompanying drawings: Fig. 1A is a three-dimensional view of a camera module according to the first example of the first embodiment of the present disclosure. Fig. 1B is a partially enlarged view of the camera module according to the first example of the first embodiment in Fig. 1A. Fig. 1C is a top view of the camera module according to the first example of the first embodiment in Fig. 1A. Fig. Figure 1D is a cross-sectional view of the first example of the first embodiment along a cross-sectional line 1D-1D in Fig. 1C. Fig. Figure 1E is an exploded view of the camera module according to the first example of the first embodiment in Fig. 1A. Fig. 1F is another exploded view of the camera module according to the first example of the first embodiment in Fig. 1A. Fig. 1G is another exploded view of the camera module according to the first example of the first embodiment in Fig. 1A. Fig. 1H is a three-dimensional view of the resilience wiring board according to the first example of the first embodiment in Fig. 1A. Fig. Figure 1I is a side view of the resilience wiring board according to the first example of the first embodiment in Fig. 1H. Fig. Figure 1J is a top view of the resilience wiring plate according to the first example of the first embodiment in Fig. 1H. Fig. Figure 1K is a schematic representation of the parameters of the resilience wiring board according to the first example of the first embodiment in Fig. 1A. Fig. Figure 1L is a partially enlarged view of the resilience wiring board according to the first example of the first embodiment in Fig. 1K. Fig. Figure 1M is a three-dimensional view of a resilience wiring board according to the second example of the first embodiment in Fig. 1A. Fig. Figure 1N is a side view of the resilience wiring board according to the second example of the first embodiment in Fig. 1M. Fig. Figure 1O is a top view of the resilience wiring plate according to the second example of the first embodiment in Fig. 1M. Fig. Figure 1P is a schematic view of an elastic section according to the second example of the first embodiment in Fig. 1M. Fig. 2A is a three-dimensional view of a camera module according to the first example of the second embodiment of the present disclosure. Fig. 2B is a top view of the camera module according to the first example of the second embodiment in Fig. 2A. Fig. 2C is a cross-sectional view of the camera module along a cross-sectional line 2C-2C according to the first example of the second embodiment in Fig. 2B. Fig. 2D is an exploded view of the camera module according to the first example of the second embodiment in Fig. 2A. Fig. 2E is another exploded view of the camera module according to the first example of the second embodiment in Fig. 2A. Fig. 2F is another exploded view of the camera module according to the first example of the second embodiment in Fig. 2A. Fig. Figure 2G is a three-dimensional view of the resilience wiring board according to the first example of the second embodiment in Fig. 2A. Fig. 2H is a side view of the resilience wiring board according to the first example of the second embodiment in Fig. 2G. Fig. Figure 2I is an enlarged view of the resilience wiring board according to the first example of the second embodiment in Fig. 2H. Fig. Figure 2J is a top view of the resilience wiring plate according to the first example of the second embodiment in Fig. 2A. Fig. Figure 2K is a schematic representation of the parameters of the resilience wiring board according to the first example of the second embodiment in Fig. 2A. Fig. Figure 2L is a partially enlarged view of the resilience wiring board according to the first example of the second embodiment in Fig. 2K. Fig. Figure 2M is a three-dimensional view of a resilience wiring board according to the second example of the second embodiment in Fig. 2A. Fig. 2N is a side view of the resilience wiring board according to the second example of the second embodiment in Fig. 2M. Fig. Figure 2O is a top view of the resilience wiring plate according to the second example of the second embodiment in Fig. 2M. Fig. 2P is a schematic view of an elastic section according to the second example of the second embodiment in Fig. 2M. Fig. 3A is a three-dimensional view of a camera module according to the first example of the third embodiment of the present disclosure. Fig. 3B is a top view of the camera module according to the first example of the third embodiment in Fig. 3A. Fig. 3C is a cross-sectional view of the camera module along a cross-sectional line 3C-3C according to the first example of the third embodiment in Fig. 3B. Fig. 3D is an exploded view of the camera module according to the first example of the third embodiment in Fig. 3A. Fig. 3E is another exploded view of the camera module according to the first example of the third embodiment in Fig. 3A. Fig. 3F is another exploded view of the camera module according to the first example of the third embodiment in Fig. 3A. Fig. Figure 3G is a partial exploded view of the camera module according to the first example of the third embodiment in Fig. 3E. Fig. 3H is a partial exploded view of the camera module according to the first example of the third embodiment in Fig. 3G. Fig. Figure 3I is a side view of the resilience wiring board according to the first example of the third embodiment in Fig. 3A. Fig. Figure 3J is a partially enlarged view of the resilience wiring board according to the first example of the third embodiment in Fig. 31. Fig. Figure 3K is a top view of the resilience wiring board according to the first example of the third embodiment in Fig. 3A. Fig. Figure 3L is a schematic representation of the parameters of the resilience wiring board according to the first example of the third embodiment in Fig. 3A. Fig. 3M is a partially enlarged view of the resilience wiring board according to the first example of the third embodiment in Fig. 3L. Fig. Figure 3N is a three-dimensional view of a resilience wiring board according to the second example of the third embodiment in Fig. 3A. Fig. Figure 3O is a side view of the resilience wiring board according to the second example of the third embodiment in Fig. 3N. Fig. Figure 3P is a top view of the resilience wiring board according to the second example of the third embodiment in Fig. 3N. Fig. 3Q is a schematic representation of an elastic section according to the second example of the third embodiment in Fig. 3N. Fig. 4A is a three-dimensional view of a lens carrier, a frame element and a resilience wiring plate according to the first example of the fourth embodiment of the present disclosure. Fig. Figure 4B is an exploded view of the lens carrier, the frame element, and the resilience wiring plate according to the first example of the fourth embodiment in Fig. 4A. Fig. Figure 4C is a three-dimensional view of the resilience wiring board according to the first example of the fourth embodiment in Fig. 4A. Fig. Figure 4D shows a side view of the resilience wiring board according to the first example of the fourth embodiment in Fig. 4C. Fig. Figure 4E is a top view of the resilience wiring board according to the first example of the fourth embodiment in Fig. 4C. Fig. Figure 4F is a schematic view of the elastic section according to the first example of the fourth embodiment in Fig. 4C. Fig. Figure 5A is a schematic view of an electronic device according to the fifth embodiment of the present disclosure. Fig. 5B is another schematic view of the electronic device according to the fifth embodiment in Fig. 5A. Fig. 5C is a schematic representation of an image produced by the electronic device according to the fifth embodiment in Fig. 5A was recorded. Fig. 5D is a schematic representation of another image produced by the electronic device according to the fifth embodiment in Fig. 5A was recorded. Fig. 5E is a schematic representation of another image that is produced by the electronic device according to the fifth embodiment in Fig. 5A was recorded. Fig. Figure 6 is a schematic representation of an electronic device according to the sixth embodiment of the present disclosure. Fig. 7A is a schematic representation of an electronic device used in a vehicle according to the seventh embodiment of the present disclosure. Fig. Figure 7B is a further schematic representation of the electronic device according to the seventh embodiment in Fig. 7A is configured on the vehicle. Fig. Figure 7C is a further schematic representation of the electronic device, which according to the seventh embodiment in Fig. 7A is configured on the vehicle. DETAILED DESCRIPTION

[0034] The present disclosure provides an imaging lens drive module comprising an imaging lens assembly, a lens carrier, a frame element, a ball set, a wiring substrate, a resilient wiring plate, and a drive unit. The imaging lens assembly has an optical axis, the lens carrier is configured to accommodate the imaging lens assembly, and the frame element is arranged correspondingly to the lens carrier. The ball set is positioned between the lens carrier and the frame element, with the ball set being in physical contact with both the lens carrier and the frame element.The wiring substrate is located on an image-facing side of the imaging lens assembly. The resilience wiring plate is configured to connect the lens carrier and the wiring substrate. The resilience wiring plate comprises a movable end, a fixed end, a connecting section, and an elastic section. The movable end is coupled and fixed to the lens carrier, preventing any movement relative to the lens carrier. The fixed end is coupled and fixed to the wiring substrate, preventing any movement relative to the wiring substrate. The connecting section is attached to the movable end. The elastic section connects the fixed end and the connecting section. The elastic section extends in a direction parallel to the optical axis and comprises at least two meandering branches.The at least two meandering branches extend towards the fixed end and overlap in a specific viewing direction. The drive unit is configured to drive the lens carrier to move relative to the wiring substrate in a direction parallel to the optical axis or in a direction perpendicular to the optical axis. The drive unit comprises a first coil and a first magnetic element. The first coil is located at the moving end of the resilient wiring plate, and the first magnetic element is located on a mounting section of the frame element, facing and aligned with the first coil.Therefore, the ball set provides translational freedom for the lens holder, which moves in a direction parallel to the optical axis and relative to the frame element, and the resilience wiring plate can reduce or even compensate for the tensile force on the fixed end to improve the stability of the imaging lens drive module.

[0035] Specifically, the wiring substrate can be, but is not limited to, a printed circuit board (PCB), a flexible printed circuit board (FPC), a rigid-flex printed circuit board, or a ceramic substrate. The resilient wiring plate can be, but is not limited to, the form of a thin plate. When the movable end moves with the lens carrier for autofocus, both the connecting section and the elastic section can provide the deformation clearance to ensure that the resilient wiring plate does not break and that the fixed end is not affected by the tensile force. Specifically, the movable end can be, but is not limited to, where the resilient wiring plate and the lens carrier adhere to each other. The fixed end can be, but is not limited to, where the resilient wiring plate and the wiring substrate are welded together.The at least two meandering branches have a serpentine curve shape, which can be a paperclip shape, a crab claw shape, etc., and whose specific direction can be perpendicular to the optical axis or to the resilience wiring plate, but is not limited to these. Furthermore, the shape of the elastic section is wide at the top and narrow at the bottom, thus improving its ability to absorb the tensile force of the resilience wiring plate.

[0036] Furthermore, the elastic section of the resilience wiring plate can feature a node. The at least two meandering branches extend towards the fixed end and converge at the node. After converging at the node, the at least two meandering branches diverge from each other, continue extending towards the fixed end, and then converge again. This is advantageous for the mechanical design, taking into account the requirements of the electrical connection and the ability to absorb tensile forces. The mechanical strength of each of the at least two coiled branches connected to the node can be improved by positioning the node in such a way as to enhance the resilience wiring plate's ability to absorb tensile forces during autofocus (AF) or optical image stabilization (OIS).

[0037] Furthermore, the elastic section can also include a reinforcing section and an additional limiting component. The reinforcing section is connected to at least one of the at least two meandering branches, and the additional limiting component is coupled to the reinforcing section and the at least one of the at least two meandering branches, such that a second angle is formed between the reinforcing section and the at least one of the at least two meandering branches. The mechanical strength of the meandering branches connected to the reinforcing section can be improved by arranging the reinforcing section in such a way as to enhance the tensile force absorption capacity of the resilience wiring plate. In particular, the reinforcing section can be a lateral bearing surface that extends from, but is not limited to, the meandering branches at a bending angle.

[0038] Furthermore, the resilience wiring board can include a main limiting component. This main limiting component is coupled to the connecting section and the elastic section, forming a first angle between them. Therefore, limiting the degree of bending of the resilience wiring board is advantageous for adapting the wiring design to confined spaces and thus improving space utilization efficiency. Specifically, the main limiting component can be, but is not limited to, an iron sheet with a bending angle to limit the degree of bending of the resilience wiring board.

[0039] Specifically, the drive unit can further comprise a second coil. The second coil is arranged on a surface of the wiring substrate, and the first magnetic element faces and is positioned accordingly towards both the first and second coils. In particular, the Lorentz force generated by the electromagnetic interaction between the first coil and the first magnetic element causes the lens carrier to move relative to the frame element in a direction parallel to the optical axis.

[0040] Furthermore, the drive unit can also include a third coil and a second magnetic element. The third coil is located on the opposite surface of the wiring substrate, and the second magnetic element is located on the opposite mounting section of the frame element. The second magnetic element faces the third coil and is positioned in accordance with the third coil. In particular, the Lorentz force generated by the electromagnetic interaction between the third coil and the second magnetic element causes the frame element to move relative to the wiring substrate in a direction perpendicular to the optical axis.

[0041] Furthermore, the drive unit can be configured to drive the lens carrier to move relative to the frame element in a direction parallel to the optical axis. Therefore, the autofocus function is achieved by the lens carrier, which carries the first coil located at the moving end.

[0042] Furthermore, the drive unit can be configured to drive the frame element to move relative to the wiring substrate in a direction perpendicular to the optical axis. Therefore, the optical image stabilization function is achieved by the frame element, which supports the lens carrier. Specifically, the Lorentz force generated by the electromagnetic interaction between the second coil and the first magnetic element forces the frame element to move relative to the wiring substrate in a direction perpendicular to the optical axis.

[0043] Specifically, the resilient wiring board can contain polyimide. This can reduce electromagnetic interference and improve the mechanical properties of the resilient wiring board.

[0044] Furthermore, if the straight length of the elastic section in one direction along the optical axis is D and the total length of the at least two meandering branches is L, the following conditions can be met: D < L; and 1.4 < L / D < 17. Therefore, the length adjustment range can result in the resilience wiring plate having a better tensile force absorption capacity. Additionally, if the straight length of the elastic section in one direction along the optical axis is D and the total length of the at least two meandering branches is L, the following condition can also be met: 2.1 < L / D < 14.3.

[0045] If the maximum width of the elastic section terminating at the connecting section is Wc, and the minimum width of each of the at least two meandering branches terminating at the fixed end is Wf, then the following conditions can also be met: Wf < Wc; and 1.5 < Wc / Wf < 16. Therefore, the width adjustment range can result in the resilience wiring plate having a better tensile strength absorption capacity. If the maximum width of the elastic section terminating at the connecting section is Wc, and the minimum width of each of the at least two meandering branches terminating at the fixed end is Wf, then the following condition can be met: 1.9 < Wc / Wf < 12.7.

[0046] If the shortest distance between the fixed end and the node in a direction parallel to the optical axis is Hn, and the straight length of the elastic section in a direction along the optical axis is D, then the following conditions can also be met: Hn < D; and 0.1 ≤ Hn / D ≤ 0.7. The ability of the resilience wiring plate to adsorb the tensile force can be further improved by adjusting the Hn / D value. Additionally, if the shortest distance between the fixed end and the node in a direction parallel to the optical axis is Hn, and the straight length of the elastic section in a direction along the optical axis is D, then the following condition can also be met: 0.2 ≤ Hn / D ≤ 0.55.

[0047] Each of the aforementioned features of the imaging lens drive module can be used in various combinations to achieve the corresponding effects.

[0048] The present disclosure relates to a camera module comprising the aforementioned imaging lens drive module and an image sensor, wherein the image sensor corresponds to an image area of ​​the imaging lens arrangement of the imaging lens drive module. In particular, the image sensor can be installed on the wiring substrate of the imaging lens drive module, but is not limited to this.

[0049] The present disclosure relates to an electronic device comprising the aforementioned camera module.

[0050] According to the embodiment described above, specific examples are provided and illustrated with figures. <1. Design>

[0051] Fig. 1A is a three-dimensional view of a camera module 100 according to the first example of the first embodiment of the present disclosure, Fig. Figure 1C is a top view of the camera module 100 according to the first example of the first embodiment in Fig. 1A, and Fig. Figure 1E is an exploded view of the camera module 100 according to the first example of the first embodiment in Fig. 1A. In Fig. 1A, Fig. 1C and Fig. 1E comprises the camera module 100, an imaging lens drive module (whose reference numeral is omitted), and an image sensor 101, and the image sensor 101 corresponds to an image area (whose reference numeral is omitted) of the imaging lens assembly 110 of the imaging lens drive module. The imaging lens drive module comprises the imaging lens assembly 110, a lens carrier 120, a frame element 130, a ball set 140, a wiring substrate 150, a resilience wiring plate 160, and a drive unit (whose reference number is omitted). The imaging lens assembly 110 has an optical axis X, the lens carrier 120 is configured to install the imaging lens assembly 110, the frame element 130 is arranged according to the lens carrier 120, and the wiring substrate 150 is arranged on the image side of the imaging lens assembly 110.

[0052] In particular, the wiring substrate 150 can be, but is not limited to, a printed circuit board, a flexible printed circuit board, a rigid-flexible printed circuit board or a ceramic substrate.

[0053] Fig. Figure 1F is another exploded view of the camera module 100 according to the first example of the first embodiment in Fig. 1A, and Fig. Figure 1G is another exploded view of the camera module 100 according to the first example of the first embodiment in Fig. 1A. In Fig. 1E to Fig. In 1G, the ball assembly 140 is arranged between the lens carrier 120 and the frame element 130, the ball assembly 140 being in physical contact with the lens carrier 120 and the frame element 130. Specifically, the imaging lens drive module of the camera module 100 can further comprise a base 103, a movable plate 102, a first ball assembly 141, and a second ball assembly 142. The base 103 is arranged relative to the frame element 130, and the base 103 is coupled to and fixed with the wiring substrate 150 without any movement relative to the wiring substrate 150. The movable plate 102 is arranged between the frame element 130 and the base 103.Furthermore, the first set of balls 141 is arranged between the frame element 130 and the movable plate 102, and the first set of balls 141 provides translational freedom for the frame element 130, which moves in a direction perpendicular to the optical axis X and relative to the movable plate 102. The second set of balls 142 is arranged between the movable plate 102 and the base 103, and the second set of balls 142 provides further translational freedom for the movable plate 102, which moves in a direction perpendicular to the optical axis X and relative to the base 103.

[0054] Fig. Figure 1B is a partially enlarged view of the camera module 100 according to the first example of the first embodiment in Fig. 1A, Fig. Figure 1H is a three-dimensional view of the resilience wiring plate 160 according to the first example of the first embodiment in Fig. 1A, Fig. Figure 1I is a side view of the resilience wiring plate 160 according to the first example of the first embodiment in Fig. 1H, Fig. Figure 1J is a top view of the resilience wiring plate 160 according to the first example of the first embodiment in Fig. 1H, Fig. 1K is a schematic representation of the parameters of the resilience wiring board 160 according to the first example of the first embodiment in Fig. 1A, and Fig. Figure 1L is a partially enlarged view of the resilience wiring board 160 according to the first example of the first embodiment in Fig. 1K. In Fig. 1A, Fig. 1B, Fig. 1F, Fig. 1 hour to Fig. In 1L, the resilience wiring plate 160 is configured to connect the lens carrier 120 and the wiring substrate 150, and the resilience wiring plate 160 comprises a movable end 161, two fixed ends 162, a connecting section 163, two elastic sections 164, and a main limiting component 165. The movable end 161 is coupled and fixed to the lens carrier 120, preventing any movement relative to the lens carrier 120; the two fixed ends 162 are coupled and fixed to the wiring substrate 150, preventing any movement relative to the wiring substrate 150; and the connecting section 163 is connected to the movable end 161. Furthermore, the main limiting component 165 is coupled to the connecting section 163 and the two elastic sections 164 in such a way that a first angle is formed between the connecting section 163 and the two elastic sections 164.Furthermore, the resilience wiring board can contain 160 polyimide.

[0055] In particular, the resilience wiring plate 160 can be in the form of a thin plate, but is not limited to this. The movable end 161 can be located where the resilience wiring plate 160 and the lens carrier 120 adhere to each other, but is not limited to this. The main limiting component 165 can be an iron plate with a bending angle to limit the degree of bending of the resilience wiring plate 160, but is not limited to this. Fig. 1B The two fixed ends 162 can be arranged at the point where the resilience wiring plate 160 and the wiring substrate 150 are welded together, but are not limited to this. Furthermore, the two fixed ends 162 and the wiring substrate 150 can be attached by solder, but are not limited to this.

[0056] In Fig. 1 hour to Fig. 1L connects the two elastic sections 164 to the two fixed ends 162 and the two ends of the connecting section 163, wherein the two elastic sections 164 extend in a direction parallel to the optical axis X and each of the two elastic sections 164 has at least two meandering branches 166 and a node 167. The at least two meandering branches 166 of each of the two elastic sections 164 extend towards one of the two fixed ends 162, the at least two meandering branches 166 overlap in a certain viewing direction, and the at least two meandering branches 166 extend towards one of the two fixed ends 162 and converge at the node 167.Furthermore, the at least two meandering branches 166 of each of the two elastic sections 164 diverge from each other after converging at the node 167, and the at least two meandering branches 166 extend further towards one of the two fixed ends 162 and then approach each other. In particular, the at least two meandering branches 166 have a serpentine curve shape, wherein the so-called serpentine curve shape can be a paperclip shape, a crab claw shape, etc., and the specific direction can be, but is not limited to, a direction perpendicular to the optical axis X or a direction perpendicular to the resilience wiring plate 160. In addition, the shape of each of the elastic sections 164 is wide at the top and narrow at the bottom, so that the ability to absorb the tensile force of the resilience wiring plate 160 can be improved.

[0057] Fig. Figure 1D is a cross-sectional view of the first example of the first embodiment along a cross-sectional line 1D-1D in Fig. 1C. In Fig. 1C, Fig. 1D, Fig. 1E and Fig. In 1F, the drive unit is configured to drive the lens carrier 120 to move relative to the wiring substrate 150 in a direction parallel to the optical axis X or in a direction perpendicular to the optical axis X. The drive unit comprises a first coil 171, a second coil 172, and a first magnetic element 173. The first coil 171 is located at the movable end 161 of the resilient wiring plate 160. The second coil 172 is located on a surface of the wiring substrate 150. The first magnetic element 173 is located on a mounting section 131 of the frame element 130, and the first magnetic element 173 faces and is arranged to face both the first coil 171 and the second coil 172. Furthermore, the drive unit may also include a third coil 174 and a second magnetic element 175.The third coil 174 is arranged on the other surface of the wiring substrate 150, the second magnetic element 175 is arranged on the other mounting section 131 of the frame element 130, the second magnetic element 175 faces the third coil 174 and the second magnetic element 175 is arranged in accordance with the third coil 174.

[0058] Specifically, the drive unit can be configured to drive the lens carrier 120 to move relative to the frame element 130 in a direction parallel to the optical axis X, and the drive unit can be configured to drive the frame element 130 to move relative to the wiring substrate 150 in a direction perpendicular to the optical axis X.

[0059] In particular, the Lorentz force generated by the electromagnetic interaction between the first coil 171 and the first magnetic element 173 causes the lens carrier 120 to move relative to the frame element 130 in a direction parallel to the optical axis X. The Lorentz force generated by the electromagnetic interaction between the second coil 172 and the first magnetic element 173 causes the frame element 130 to move relative to the wiring substrate 150 in a direction perpendicular to the optical axis X. Furthermore, the Lorentz force generated by the electromagnetic interaction between the third coil 174 and the second magnetic element 175 causes the frame element 130 to move relative to the wiring substrate 150 in a direction perpendicular to the optical axis X.

[0060] In Fig. 1K, if a straight length of one of the two elastic sections 164 in a direction along the optical axis XD is, a total length of the at least two meandering branches 166 is L, a maximum width of one of the two elastic sections 164, terminated with the connecting section 163, is Wc, a minimum width of each of the at least two meandering branches 166, terminated with one of the two fixed ends 162, is Wf, and a shortest distance between one of the two fixed ends 162 and the node 167 in a direction parallel to the optical axis X Hn is, the aforementioned parameters satisfy the following conditions in Table 1. Tabelle 1 D (mm) 5,548 Hn (mm) 2,841 L (mm) 40,340 L / D 7,27 Wc (mm) 8,515 Wc / Wf 7,62 Wf (mm) 1,118 Hn / D 0,51

[0061] Fig. Figure 1M is a three-dimensional view of a resilience wiring board 180 according to the second example of the first embodiment in Fig. 1A, Fig. Figure 1N is a side view of the resilience wiring plate 180 according to the second example of the first embodiment in Fig. 1M, Fig. Figure 10 is a top view of the resilience wiring plate 180 according to the second example of the first embodiment in Fig. 1M, and Fig. Figure 1P is a schematic view of an elastic section 184 according to the second example of the first embodiment in Fig. 1M. In Fig. 1M to Fig. In 1P, the resilience wiring plate 180 according to the second example of the first embodiment is similar to the resilience wiring plate 160 according to the first example of the first embodiment, except that the resilience wiring plate 180 comprises a movable end 181, two fixed ends 182, a connecting section 183, and two elastic sections 184. The two elastic sections 184 each connect the two fixed ends 182 and the two ends of the connecting section 183, with each of the two elastic sections 184 comprising at least two meandering branches 186. The at least two meandering branches 186 extend toward one of the two fixed ends 182, and the at least two meandering branches 186 overlap in a certain viewing direction.

[0062] The structures, positions, and connection relationships of the other elements according to the second example of the first embodiment are the same as or similar to the elements according to the first example of the first embodiment and are not described again here. <2nd embodiment>

[0063] Fig. 2A is a three-dimensional view of a camera module 200 according to the first example of the second embodiment of the present disclosure, Fig. 2B is a top view of the camera module 200 according to the first example of the second embodiment in Fig. 2A, and Fig. Figure 2D is an exploded view of the camera module 200 according to the first example of the second embodiment in Fig. 2A. In Fig. 2A, Fig. 2B and Fig. In 2D, the camera module 200 comprises an imaging lens drive module (whose reference numeral is omitted) and an image sensor 201, wherein the image sensor 201 corresponds to an image area (whose reference numeral is omitted) of the imaging lens assembly 210 of the imaging lens drive module. The imaging lens drive module comprises the imaging lens assembly 210, a lens carrier 220, a frame element 230, a ball set 240, a wiring substrate 250, a resilience wiring plate 260, and a drive unit (whose reference number is omitted). The imaging lens assembly 210 has an optical axis X, the lens carrier 220 is configured to install the imaging lens assembly 210, the frame element 230 is arranged according to the lens carrier 220, and the wiring substrate 250 is arranged on the image side of the imaging lens assembly 210.

[0064] In particular, the wiring substrate 250 can be, but is not limited to, a printed circuit board, a flexible printed circuit board, a rigid-flexible printed circuit board or a ceramic substrate.

[0065] Fig. Figure 2D is an exploded view of the camera module 200 according to the first example of the second embodiment in Fig. 2A, Fig. Figure 2E is another exploded view of the camera module 200 according to the first example of the second embodiment in Fig. 2A, and Fig. Figure 2F is another exploded view of the camera module 200 according to the first example of the second embodiment in Fig. 2A. In Fig. 2D to Fig. In 2F, the ball assembly 240 is arranged between the lens carrier 220 and the frame element 230, the ball assembly 240 being in physical contact with the lens carrier 220 and the frame element 230. Specifically, the imaging lens drive module of the camera module 200 can further comprise a base 203, a movable plate 202, a first ball assembly 241, and a second ball assembly 242. The base 203 is arranged relative to the frame element 230, and the base 203 is coupled to and fixed with the wiring substrate 250, preventing any movement relative to the wiring substrate 250. The movable plate 202 is arranged between the frame element 230 and the base 203.Furthermore, the first set of balls 241 is arranged between the frame element 230 and the movable plate 202, and the first set of balls 241 provides translational freedom for the frame element 230, which moves in a direction perpendicular to the optical axis X and relative to the movable plate 202. The second set of balls 242 is arranged between the movable plate 202 and the base 203, and the second set of balls 242 provides further translational freedom for the movable plate 202, which moves in a direction perpendicular to the optical axis X and relative to the base 203.

[0066] Fig. Figure 2G is a three-dimensional view of the resilience wiring board 260 according to the first example of the second embodiment in Fig. 2A, Fig. Figure 2H is a side view of the resilience wiring plate 260 according to the first example of the second embodiment in Fig. 2G, Fig. Figure 2I is an enlarged view of the resilience wiring plate 260 according to the first example of the second embodiment in Fig. 2H, Fig. Figure 2J is a top view of the resilience wiring plate 260 according to the first example of the second embodiment in Fig. 2A, Fig. 2K is a schematic representation of the parameters of the resilience wiring board 260 according to the first example of the second embodiment in Fig. 2A, and Fig. Figure 2L is a partially enlarged view of the resilience wiring board 260 according to the first example of the second embodiment in Fig. 2K. In Fig. 2A, Fig. 2B, Fig. 2E, Fig. 2G to Fig. In 2L, the resilience wiring plate 260 is configured to connect the lens carrier 220 and the wiring substrate 250, and the resilience wiring plate 260 comprises a movable end 261, two fixed ends 262, a connecting section 263, two elastic sections 264, and a main limiting component 265. The movable end 261 is coupled and fixed to the lens carrier 220, preventing any movement relative to the lens carrier 220; the two fixed ends 262 are coupled and fixed to the wiring substrate 250, preventing any movement relative to the wiring substrate 250; and the connecting section 263 is connected to the movable end 261. Furthermore, the main limiting component 265 is coupled to the connecting section 263 and the two elastic sections 264 in such a way that a first angle is formed between the connecting section 263 and the two elastic sections 264.Furthermore, the resilience wiring board can contain 260 polyimide.

[0067] In particular, the resilience wiring plate 260 can be in the form of a thin plate, but is not limited to this. The movable end 261 can be located at the point where the resilience wiring plate 260 and the lens carrier 220 adhere to each other, but is not limited to this. The main limiting component 265 can be an iron plate with a bending angle to limit the degree of bending of the resilience wiring plate 260, but is not limited to this. The two fixed ends 262 can be located at the point where the resilience wiring plate 260 and the wiring substrate 250 are welded together, but are not limited to this.

[0068] In Fig. 2H to Fig. 2L connects the two elastic sections 264 to the two fixed ends 262 and the two ends of the connecting section 263, wherein the two elastic sections 264 extend in a direction parallel to the optical axis X and each of the two elastic sections 264 comprises at least two meandering branches 266 and a node 267. The at least two meandering branches 266 of each of the two elastic sections 264 extend towards one of the two fixed ends 262, the at least two meandering branches 266 overlap in a certain viewing direction, and the at least two meandering branches 266 extend towards one of the two fixed ends 262 and converge at the node 267. In particular, the at least two meandering branches 266 have a serpentine curve shape, wherein the so-called serpentine curve shape is a paperclip shape, a crab claw shape, etc.The specific direction can be perpendicular to the optical axis X or perpendicular to the resilience wiring plate 260, but is not limited to either. Furthermore, the shape of each of the elastic sections 264 is wide at the top and narrow at the bottom, thus improving the ability of the resilience wiring plate 260 to absorb the tensile force.

[0069] Furthermore, each of the two elastic sections 264 can also comprise a reinforcing section 268 and an auxiliary limiting component 269. The reinforcing section 268 is connected to at least one of the at least two meandering branches 266 of each of the two elastic sections 264, and the auxiliary limiting component 269 is coupled to the reinforcing section 268 and the at least one of the at least two meandering branches 266, such that a second angle is formed between the reinforcing section 268 and the at least one of the at least two meandering branches 266. In particular, the reinforcing section 268 can be, but is not limited to being, a lateral bearing surface extending from the meandering branches 266 at a bending angle.

[0070] Fig. 2C is a cross-sectional view of the camera module 200 along a cross-sectional line 2C-2C according to the first example of the second embodiment in Fig. 2B. In Fig. 2B, Fig. 2C, Fig. 2D and Fig. In 2F, the drive unit is configured to drive the lens carrier 220 to move relative to the wiring substrate 250 in a direction parallel to the optical axis X or in a direction perpendicular to the optical axis X. The drive unit comprises a first coil 271, a second coil 272, and a first magnetic element 273. The first coil 271 is located at the movable end 261 of the resilient wiring plate 260, the second coil 272 is located on a surface of the wiring substrate 250, and the first magnetic element 273 is located on a mounting section 231 of the frame element 230. The first magnetic element 273 faces and is arranged to face both the first coil 271 and the second coil 272. Furthermore, the drive unit may also include a third coil 274 and a second magnetic element 275.The third coil 274 is arranged on the other surface of the wiring substrate 250, the second magnetic element 275 is arranged on the other mounting section 231 of the frame element 230, the second magnetic element 275 faces the third coil 274 and the second magnetic element 275 is arranged in accordance with the third coil 274.

[0071] Specifically, the drive unit can be configured to drive the lens carrier 220 to move relative to the frame element 230 in a direction parallel to the optical axis X, and the drive unit can be configured to drive the frame element 230 to move relative to the wiring substrate 250 in a direction perpendicular to the optical axis X.

[0072] In particular, the Lorentz force generated by the electromagnetic interaction between the first coil 271 and the first magnetic element 273 causes the lens carrier 220 to move relative to the frame element 230 in a direction parallel to the optical axis X. The Lorentz force generated by the electromagnetic interaction between the second coil 272 and the first magnetic element 273 causes the frame element 230 to move relative to the wiring substrate 250 in a direction perpendicular to the optical axis X. Furthermore, the Lorentz force generated by the electromagnetic interaction between the third coil 274 and the second magnetic element 275 causes the frame element 230 to move relative to the wiring substrate 250 in a direction perpendicular to the optical axis X.

[0073] In Fig. 2N, if a straight length of one of the two elastic sections 264 in a direction along the optical axis XD is, a total length of the at least two meandering branches 266 is L, a maximum width of one of the two elastic sections 264 terminating at the connecting section 263 is Wc, a minimum width of each of the at least two meandering branches 266 terminating at one of the two fixed ends 262 is Wf, and a shortest distance between one of the two fixed ends 262 and the node 267 in a direction parallel to the optical axis X Hn is, the parameters mentioned satisfy the following conditions in Table 2. Tabelle 2 D (mm) 5,588 Hn (mm) 1,687 L (mm) 47.081 L / D 8,43 Wc (mm) 5,06 Wc / Wf 5,27 Wf (mm) 0,96 Hn / D 0,30

[0074] Fig. Figure 2M is a three-dimensional view of a resilience wiring board 280 according to the second example of the second embodiment in Fig. 2A, Fig. Figure 2N is a side view of the resilience wiring plate 280 according to the second example of the second embodiment in Fig. 2M, Fig. Figure 2O is a top view of the resilience wiring plate 280 according to the second example of the second embodiment in Fig. 2M, and Fig. 2P is a schematic view of an elastic section 284 according to the second example of the second embodiment in Fig. 2M. In Fig. 2M to Fig. In the second embodiment, the resilience wiring plate 280 of the second embodiment is similar to the resilience wiring plate 260 of the first embodiment, except that the resilience wiring plate 280 comprises a movable end 281, two fixed ends 282, a connecting section 283, and two elastic sections 284. The two elastic sections 284 each connect the two fixed ends 282 and the two ends of the connecting section 283, with each of the two elastic sections 284 comprising at least two meandering branches 286. The at least two meandering branches 286 extend toward one of the two fixed ends 282 and overlap in a certain viewing direction.

[0075] The structures, positions, and connection relationships of the other elements according to the second example of the second embodiment are the same as or similar to the elements according to the first example of the second embodiment and are not described again here. <3. Design>

[0076] Fig. 3A is a three-dimensional view of a camera module 300 according to the first example of the third embodiment of the present disclosure, Fig. Figure 3B is a top view of the camera module 300 according to the first example of the third embodiment in Fig. 3A, and Fig. 3D is an exploded view of the camera module 300 according to the first example of the third embodiment in Fig. 3A. In Fig. 3A, Fig. 3B and Fig. The 3D camera module 300 comprises an imaging lens drive module (whose reference numeral is omitted) and an image sensor 301, and the image sensor 301 corresponds to an image area (whose reference numeral is omitted) of the imaging lens assembly 310 of the imaging lens drive module. The imaging lens drive module comprises the imaging lens assembly 310, a lens carrier 320, a frame element 330, a ball set 340, a wiring substrate 350, a resilience wiring plate 360, and a drive unit (whose reference number is omitted). The imaging lens assembly 310 has an optical axis X, the lens carrier 320 is configured to install the imaging lens assembly 310, the frame element 330 is arranged according to the lens carrier 320, and the wiring substrate 350 is arranged on the image side of the imaging lens assembly 310.

[0077] In particular, the wiring substrate 350 can be, but is not limited to, a printed circuit board, a flexible printed circuit board, a rigid-flexible printed circuit board or a ceramic substrate.

[0078] Fig. Figure 3E is another exploded view of the camera module 300 according to the first example of the third embodiment in Fig. 3A, Fig. Figure 3F is another exploded view of the camera module 300 according to the first example of the third embodiment in Fig. 3A, Fig. Figure 3G is a partial exploded view of the camera module 300 according to the first example of the third embodiment in Fig. 3E, and Fig. Figure 3H is a partial exploded view of the camera module 300 according to the first example of the third embodiment in Fig. 3G. In Fig. 3D up to Fig. In 3H, the ball assembly 340 is in physical contact with the lens carrier 320 and the frame element 330. Specifically, the imaging lens drive module of the camera module 300 can further comprise a base (whose reference numeral is omitted), a movable plate 302, a first ball assembly 341, and a second ball assembly 342. The base is arranged according to the frame element 330 and is coupled and fixed to the wiring substrate 350 without any movement relative to the wiring substrate 350. The movable plate 302 is arranged between the frame element 330 and the base. Furthermore, the first ball assembly 341 is arranged between the frame element 330 and the movable plate 302, and the first ball assembly 341 provides translational freedom for the frame element 330, which moves in a direction perpendicular to the optical axis X and relative to the movable plate 302.The second set of balls 342 is arranged between the movable plate 302 and the base, and the second set of balls 342 provides further translational freedom for the movable plate 302, which moves in a direction perpendicular to the optical axis X and relative to the base. In particular, part of the wiring substrate 350 is integrally formed with the base.

[0079] Fig. Figure 3I is a side view of the elastic wiring plate 360 ​​according to the first example of the third embodiment in Fig. 3A, Fig. Figure 3J is a partially enlarged view of the resilience wiring board 360 according to the first example of the third embodiment in Fig. 31, Fig. Figure 3K is a top view of the resilience wiring board 360 according to the first example of the third embodiment in Fig. 3A, Fig. Figure 3L is a schematic view of the parameters of the resilience wiring board 360 according to the first example of the third embodiment in Fig. 3A, and Fig. 3M is a partially enlarged view of the resilience wiring board 360 according to the first example of the third embodiment in Fig. 3L. In Fig. 3A, Fig. 3B, Fig. 3H, Fig. 3G to Fig. 3M's resilience wiring plate 360 ​​is configured to connect the lens carrier 320 and the wiring substrate 350. The resilience wiring plate 360 ​​comprises a movable end 361, two fixed ends 362, a connecting section 363, two elastic sections 364, and a main limiting component 365. The movable end 361 is connected to and fixed with the lens carrier 320 without movement relative to the lens carrier 320. The two fixed ends 362 are connected to and fixed with the wiring substrate 350 without movement relative to the wiring substrate 350. The connecting section 363 is connected to the movable end 361. Furthermore, the main limiting component 365 is coupled to the connecting section 363 and the two elastic sections 364 in such a way that a first angle is formed between the connecting section 363 and the two elastic sections 364.Furthermore, the resilience wiring board can contain 360 polyimide.

[0080] Specifically, the connecting section 363 of the resilience wiring plate 360 ​​can be annular and surround the imaging lens assembly 310, but is not limited to this. In particular, the resilience wiring plate 360 ​​can be in the form of a thin plate, but is not limited to this. The movable end 361 can be located at the point where the resilience wiring plate 360 ​​and the lens carrier 320 adhere to one another, but is not limited to this. The main limiting component 365 can be an iron plate with a bending angle to limit the degree of bending of the resilience wiring plate 360, but is not limited to this. The two fixed ends 362 can be located at the point where the resilience wiring plate 360 ​​and the wiring substrate 350 are welded together, but are not limited to this.

[0081] In Fig. 3I to Fig. 3M connects the two elastic sections 364 to the two fixed ends 362 and the two ends of the connecting section 363, wherein the two elastic sections 364 extend in a direction parallel to the optical axis X and each of the two elastic sections 364 comprises at least two meandering branches 366 and a node 367. The at least two meandering branches 366 of each of the two elastic sections 364 extend in the direction of one of the two fixed ends 362, the at least two meandering branches 366 overlap in a certain viewing direction, and the at least two meandering branches 366 extend in the direction of one of the two fixed ends 362 and converge at the node 367. In particular, the at least two meandering branches 366 have a serpentine curve shape, wherein the so-called serpentine curve shape is a paperclip shape, a crab claw shape, etc.The specific direction can be perpendicular to the optical axis X or perpendicular to the resilience wiring plate 360, but is not limited to these. Furthermore, the shape of each of the elastic sections 364 is wide at the top and narrow at the bottom, thus improving the ability of the resilience wiring plate 360 ​​to absorb the tensile force.

[0082] Furthermore, each of the two elastic sections 364 can also comprise a reinforcing section 368 and an auxiliary limiting component 369. The reinforcing section 368 is connected to at least one of the at least two meandering branches 366 of each of the two elastic sections 364, and the auxiliary limiting component 369 is coupled to the reinforcing section 368 and the at least one of the at least two meandering branches 366, such that a second angle is formed between the reinforcing section 368 and the at least one of the at least two meandering branches 366. In particular, the reinforcing section 368 can be, but is not limited to being, a lateral bearing surface extending from the meandering branches 366 at a bending angle.

[0083] Fig. Figure 3C is a cross-sectional view of the camera module 300 along a cross-sectional line 3C-3C according to the first example of the third embodiment in Fig. 3B. In Fig. 3B, Fig. 3C, Fig. 3D and Fig. In 3F, the drive unit is configured to drive the lens carrier 320 to move relative to the wiring substrate 350 in a direction parallel to the optical axis X or in a direction perpendicular to the optical axis X. The drive unit comprises a first coil 371, a second coil 372, and a first magnetic element 373. The first coil 371 is located at the movable end 361 of the resilient wiring plate 360, the second coil 372 is located on a surface of the wiring substrate 350, and the first magnetic element 373 is located on a mounting section 331 of the frame element 330. The first magnetic element 373 faces and is positioned to face both the first coil 371 and the second coil 372. Furthermore, the drive unit can include two third coils 374 and two second magnetic elements 375.The two third coils 374 are arranged on the two other surfaces of the wiring substrate 350, the two second magnetic elements 375 are arranged on the frame element 330, the two second magnetic elements 375 are facing the two third coils 374, and the two second magnetic elements 375 are arranged according to the two third coils 374.

[0084] Specifically, the drive unit can be configured to drive the lens carrier 320 to move relative to the frame element 330 in a direction parallel to the optical axis X, and the drive unit can be configured to drive the frame element 330 to move relative to the wiring substrate 350 in a direction perpendicular to the optical axis X.

[0085] In particular, the Lorentz force generated by the electromagnetic interaction between the first coil 371 and the first magnetic element 373 causes the lens holder 320 to move relative to the frame element 330 in a direction parallel to the optical axis X. The Lorentz force generated by the electromagnetic interaction between the second coil 372 and the first magnetic element 373 causes the frame element 330 to move relative to the wiring substrate 350 in a direction perpendicular to the optical axis X. Furthermore, the Lorentz force generated by the electromagnetic interaction between the two third coils 374 and the two second magnetic elements 375 causes the frame element 330 to move relative to the wiring substrate 350 in a direction perpendicular to the optical axis X.

[0086] In Fig. 3L, if a straight length of one of the two elastic sections 364 in a direction along the optical axis XD is, a total length of the at least two meandering branches 366 is L, a maximum width of one of the two elastic sections 364 terminating at the connecting section 363 is Wc, the minimum width of each of the at least two coiled branches 366 terminating at one of the two fixed ends 362 is Wf, and the shortest distance between one of the two fixed ends 362 and the node 367 in a direction parallel to the optical axis X is Hn, the parameters mentioned satisfy the following conditions in Table 3. Tabelle 3 D (mm) 5,588 Hn (mm) 1,687 L (mm) 48,224 L / D 8,63 Wc (mm) 5,58 Wc / Wf 5,81 Wf (mm) 0,96 Hn / D 0,30

[0087] Fig. Figure 3N is a three-dimensional view of a resilience wiring board 380 according to the second example of the third embodiment in Fig. 3A, Fig. Figure 3O is a side view of the resilience wiring plate 380 according to the second example of the third embodiment in Fig. 3N, Fig. Figure 3P is a top view of the resilience wiring plate 380 according to the second example of the third embodiment in Fig. 3N, and Fig. 3Q is a schematic view of an elastic section 384 according to the second example of the third embodiment in Fig. 3N. In Fig. 30 to Fig. The resilience wiring plate 380 according to the second example of the third embodiment is similar to the resilience wiring plate 360 ​​according to the first example of the third embodiment, except that the resilience wiring plate 380 comprises a movable end 381, two fixed ends 382, ​​a connecting section 383, and two elastic sections 384. The two elastic sections 384 each connect the two fixed ends 382 and the two ends of the connecting section 383, with each of the two elastic sections 384 comprising at least two meandering branches 386. The at least two meandering branches 386 extend toward one of the two fixed ends 382, ​​and the at least two meandering branches 386 overlap in a certain viewing direction.

[0088] The structures, positions, and connection relationships of the other elements according to the second example of the third embodiment are the same as or similar to the elements according to the first example of the third embodiment and are not described again here. <4. Design>

[0089] Fig. 4A is a three-dimensional view of a lens carrier 420, a frame element 430 and a resilience wiring plate 460 according to the first example of the fourth embodiment of the present disclosure. Fig. Figure 4B is an exploded view of the lens carrier 420, the frame element 430 and the resilience wiring plate 460 according to the first example of the fourth embodiment in Fig. 4A, and Fig. Figure 4C is a three-dimensional view of the resilience wiring plate 460 according to the first example of the fourth embodiment in Fig. 4A. In Fig. 4A to Fig. In 4C, the resilience wiring plate 460 is configured to connect and fix the lens carrier 420, wherein the resilience wiring plate 460 can fix the lens carrier 420 in the frame element 430. Specifically, the resilience wiring plate 460 comprises a movable end 461, two fixed ends 462, a connecting section 463, two elastic sections 464, and a main limiting component 465. The imaging lens drive module (not shown) according to the first example of the fourth embodiment is identical to or similar to the imaging lens drive module according to the first example of the second embodiment, except that the connecting section 463 of the resilience wiring plate 460 according to the first example of the fourth embodiment of the imaging lens drive module has a serpentine curve shape. Therefore, the connecting section 463 has a similar function to the two elastic sections 464.

[0090] Fig. Figure 4D is a side view of the resilience wiring plate 460 according to the first example of the fourth embodiment in Fig. 4C, Fig. Figure 4E is a top view of the resilience wiring plate 460 according to the first example of the fourth embodiment in Fig. 4C, and Fig. 4F is a schematic view of the elastic section 464 according to the first example of the fourth embodiment in Fig. 4C. In Fig. 4B to Fig. 4F, the movable end 461 is coupled and fixed to the lens carrier 420 without movement relative to the lens carrier 420, and the connecting section 463 is connected to the movable end 461. Furthermore, the main limiting component 465 is coupled to the connecting section 463 and the two elastic sections 464 such that a first angle is formed between the connecting section 463 and the two elastic sections 464. In addition, the resilience wiring plate 460 may contain polyimide. In particular, the resilience wiring plate 460 may, but is not limited to, having the form of a thin plate. The movable end 461 may, but is not limited to, being located where the resilience wiring plate 460 and the lens carrier 420 adhere to one another.The main limiting component 465 can be an iron plate with a bending angle to limit the degree of bending of the resilience wiring plate 460, but is not limited to this.

[0091] Furthermore, the two elastic sections 464 each connect the two fixed ends 462 and the two ends of the connecting section 463, wherein the two elastic sections 464 extend in a direction parallel to the optical axis X and each of the two elastic sections 464 comprises at least two meandering branches 466. The at least two meandering branches 466 of each of the two elastic sections 464 extend in the direction of one of the two fixed ends 462, and the at least two meandering branches 466 overlap in a certain viewing direction. In particular, the at least two meandering branches 466 have a serpentine curve shape, wherein the so-called serpentine curve shape is a paperclip shape, a crab claw shape, etc.may be, and the specific direction may be a direction perpendicular to the optical axis X or a direction perpendicular to the resilience wiring plate 460, but is not limited to these. <5. Design>

[0092] Fig. 5A is a schematic representation of an electronic device 10 according to the 5th embodiment of the present disclosure, and Fig. Figure 5B is a further schematic representation of the electronic device 10 according to the 5th embodiment in Fig. 5A. In Fig. 5A and Fig. In 5B, the electronic device 10 is a smartphone, and the electronic device 10 comprises camera modules and a user interface 11. Furthermore, the camera modules are an ultra-wide-angle camera module 12, a high-resolution camera module 13, and a telephoto camera module 14, and the user interface 11 is a touchscreen, but the present disclosure is not limited thereto. In particular, the camera module can be the camera module according to any one of the first to fourth embodiments mentioned above, but the present disclosure is not limited thereto.

[0093] A user calls up a recording mode via the user interface 11, which is configured to display an image and allows the recording angle to be manually adjusted to switch between different camera modules. At this moment, the imaging light is collected on an image sensor of the electronic device 10, and an electronic signal about the image is output to an image signal processor (ISP) 15.

[0094] In Fig. 5B The electronic device 10 may further include an optical image stabilization mechanism (not shown) to meet a camera specification of the electronic device 10. Furthermore, the electronic device 10 may also include at least one focus assist module (not shown) and at least one sensor element (not shown). The focus assist module may be a flash module (not shown) for color temperature compensation, an infrared distance-measuring component, a laser focus module, etc. The sensor element may have functions for detecting physical momentum and kinetic energy, such as an accelerometer, a gyroscope, or a Hall effect element to detect vibrations or shakes caused by the user's hands or by the external environment.Accordingly, the camera module of the electronic device 10, which is equipped with an autofocus mechanism and an optical image stabilization mechanism, can be improved to achieve superior image quality. Furthermore, according to the present disclosure, the electronic device 10 can have a multi-mode shooting function, such as taking optimized selfies, high dynamic range (HDR) in low light conditions, 4K resolution recording, etc. In addition, the user can visually view a captured image from the camera via the user interface 11 and manually control the field of view on the user interface 11 to achieve the "what you see is what you get" autofocus function.

[0095] Furthermore, the camera module, the optical image stabilization mechanism, the sensor element, and the focus assist module can be arranged on a flexible printed circuit board (FPC) (not shown) and electrically connected to the image signal processor 15 and other associated components via a connector (not shown) to perform a recording operation. Since current electronic devices such as smartphones tend to be compact, firstly, arranging the camera module and associated components on the flexible printed circuit board, and secondly, integrating the circuitry into the main board of the electronic device via the connector, can meet the mechanical design and circuit layout requirements of the limited space inside the electronic device, thus creating more room for maneuver. The autofocus function of the camera module can also be controlled more flexibly via the touchscreen of the electronic device.According to the fifth embodiment, the electronic device 10 can comprise a plurality of sensor elements and a plurality of focus assistance modules. The sensor elements and focus assistance modules are arranged on the flexible printed circuit board and at least one further flexible printed circuit board (not shown) and are electrically connected via appropriate connectors to the image signal processor 15 and other associated components to perform the acquisition process. In other embodiments (not shown), the sensor elements and focus assistance modules can also be arranged on the main board of the electronic device or on carrier boards of other types, according to the requirements of the mechanical design and circuit layout.

[0096] Furthermore, the electronic device 10 may also, but is not limited to, include a display, a control unit, a storage unit, a random access memory (RAM), a read-only memory (ROM) or a combination thereof.

[0097] Fig. 5C is a schematic representation of an image that is transmitted via the electronic device 10 according to the fifth embodiment in Fig. 5A was recorded. In Fig. 5C allows the larger area of ​​the image to be captured via the ultra-wide camera module 12, and the ultra-wide camera module 12 has the function of capturing a larger area of ​​the scene.

[0098] Fig. 5D is a schematic representation of another image produced by the electronic device 10 according to the fifth embodiment in Fig. 5A was recorded. In Fig. In 5D, the image of a specific area can be captured with high resolution via the high-resolution camera module 13, where the high-resolution camera module 13 has the function of high resolution and low deformation.

[0099] Fig. 5E is a schematic representation of another image that is transmitted via the electronic device 20 according to the fifth embodiment in Fig. 5A was recorded. In Fig. The 5E telephoto lens camera module 14 has a high magnification function, and the distant image can be captured and magnified via the telephoto lens camera module 14 with high magnification.

[0100] In Fig. 5C to Fig. 5E, the zoom function can be achieved via the electronic device 10 when the scene is captured via the camera modules with different focal lengths in conjunction with the image processing function. <6. Design>

[0101] Fig. Figure 6 is a schematic representation of an electronic device 20 according to the sixth embodiment of the present disclosure. Fig. In Section 6, the electronic device 20 is a smartphone, and the electronic device 20 comprises camera modules. Furthermore, the camera modules are ultra-wide-angle camera modules 21, wide-angle camera modules 22, telephoto camera modules 23, 24, and a time-of-flight (TOF) module 26. The TOF module 26 can be a different type of camera module, and the arrangement is not limited thereto. In particular, the camera module can be the camera module according to any one of the first to fourth embodiments mentioned above, but the present disclosure is not limited thereto.

[0102] Furthermore, the telephoto camera modules 24 are configured to bend the light, but the present disclosure is not limited to this.

[0103] To meet a specification of the camera module of the electronic device 20, the electronic device 20 may further include an optical image stabilization mechanism (not shown). In addition, the electronic device 20 may further include at least one focus assist module (not shown) and at least one sensor element (not shown). The focus assist module may be a flash module 25 for color temperature compensation, an infrared distance-measuring component, a laser focus module, etc. The sensor element may have functions for detecting physical momentum and kinetic energy, such as an accelerometer, a gyroscope, or a Hall effect sensor to detect vibrations or shaking caused by the user's hands or by the external environment.Accordingly, the camera module of the electronic device 20, which is equipped with an autofocus mechanism and an optical image stabilization mechanism, can be improved to achieve superior image quality. Furthermore, according to the present disclosure, the electronic device 20 can have a multi-mode shooting function, such as optimized selfie shooting, high dynamic range (HDR) in low light conditions, 4K resolution shooting, etc.

[0104] Furthermore, all other component structures and arrangements according to the sixth embodiment are identical to the component structures and arrangements according to the sixth embodiment and are not described again here. <7. Design>

[0105] Fig. 7A is a schematic representation of an electronic device which, according to the seventh embodiment of the present disclosure, is attached to a vehicle 30, Fig. Figure 7B is a further schematic representation of the electronic device, which according to the seventh embodiment in Fig. 7A is configured on the vehicle 30, and Fig. Figure 7C is a further schematic representation of the electronic device, which according to the seventh embodiment in Fig. 7A is configured on vehicle 30. In Fig. 7A to Fig. 7C the electronic device (whose reference numeral is omitted) is attached to the vehicle 30, and the electronic device comprises camera modules 31. In the seventh embodiment, the number of camera modules 31 is six, the camera modules 31 are vehicle camera modules, and the camera module structures can be the camera module according to any of the first to fourth embodiments mentioned above, but the present disclosure is not limited thereto.

[0106] In Fig. 7A to Fig. In 7C, two of the camera modules 31 are arranged below a left and a right rearview mirror, respectively, to capture image information with a viewing angle θ. In particular, the viewing angle θ can satisfy the following condition: 40 degrees < θ < 90 degrees. Therefore, image information can be captured within a left lane and a right lane.

[0107] In Fig. 7A to Fig.7C Two further camera modules 31 can be arranged in an interior space of the vehicle 30. In particular, the two further camera modules 31 are each arranged near a rearview mirror and near a rear window in the vehicle 30. Furthermore, the camera modules 31 can each be arranged on the non-mirror surfaces of the left and right rearview mirrors of the vehicle 30, but the present disclosure is not limited to this.

[0108] The two other camera modules 31 can each be arranged at a front and a rear end of the vehicle 30, with the camera modules 31 being located at a front and a rear end of the vehicle 30 and below the left and right rearview mirrors. It is advantageous for a driver to obtain information about the outside environment, such as exterior environment information I1, I2, I3, I4, but the present disclosure is not limited to this. Therefore, more viewing angles can be provided to reduce the blind spot, thus improving driving safety. Furthermore, it is helpful to identify traffic information from the vehicle 30 by arranging the camera modules 31 around the vehicle 30, which is advantageous for implementing an autopilot function.

Claims

[1] An imaging lens drive module comprising: an imaging lens arrangement (110) with an optical axis (X); a lens carrier (120) configured for the installation of the imaging lens assembly (110); a frame element (130) which is arranged according to the lens carrier (120); a set of balls (140) arranged between the lens carrier (120) and the frame element (130), wherein the set of balls (140) is physically in contact with the lens carrier (120) and the frame element (130); a wiring substrate (150) arranged on an image side of the imaging lens arrangement (110); a resilience wiring plate (160) configured to connect the lens carrier (120) and the wiring substrate (150), and comprising: a movable end (161) which is connected to and attached to the lens carrier (120) without any movement relative to the lens carrier (120); a fixed end (162) which is connected to and attached to the wiring substrate (150) without any movement relative to the wiring substrate (150); a connecting section (163) which is connected to the movable end (161); an elastic section (164) connecting the fixed end (162) and the connecting section (163), wherein the elastic section (164) extends in a direction parallel to the optical axis (X) and comprises: at least two meandering branches (166) extending towards the fixed end (162) and overlapping in a particular viewing direction; and a node (167), wherein the at least two meandering branches (166) extend towards the fixed end (162) and converge at the node (167); and a principal constraint component (165) coupled to the connecting section (163) and the elastic section (164) such that a first angle is formed between the connecting section (163) and the elastic section (164); and a drive unit configured to drive the lens carrier (120) to move relative to the wiring substrate (150) in a direction parallel to the optical axis (X) or in a direction perpendicular to the optical axis (X), and comprising: a first coil (171) which is arranged at the movable end (161) of the resilience wiring plate (160); a second coil (172) arranged on a surface of the wiring substrate (150); and a first magnetic element (173) arranged on a mounting section (131) of the frame element (130), wherein the first magnetic element (173) is opposite and arranged in relation to both the first coil (171) and the second coil (172); wherein a straight length of the elastic section (164) in a direction along the optical axis (X) is D, a total length of the at least two meandering branches (166) is L and the following conditions are met: D <L; und 1.4 <L / D<17. [2] The imaging lens drive module according to claim 1, wherein the straight length of the elastic section (164) in a direction along the optical axis (X) is D, the total length of the at least two meandering branches (166) is L and the following condition is met: 2.1 <L / D<14,3. [3] The imaging lens drive module according to claim 1, wherein the drive unit is configured to drive the lens carrier (120) to move relative to the frame element (130) in a direction parallel to the optical axis (X). [4] The imaging lens drive module according to claim 1, wherein the drive unit is configured to drive the frame element (130) to move relative to the wiring substrate (150) in a direction perpendicular to the optical axis (X). [5] The imaging lens drive module according to claim 1, wherein the at least two meandering branches (166) diverge away from each other after converging at the node (167), extend further towards the fixed end (162) and then approach each other. [6] The imaging lens drive module according to claim 1, wherein the resilience wiring plate (160) comprises polyimide. [7] Imaging lens drive module according to claim 1, wherein the elastic section (264) further comprises: a reinforcing section (268) connected to at least one of the at least two meandering branches (266); and an auxiliary limiting component (269) which is connected to the reinforcing section (268) and to at least one of the at least two meandering branches (266) such that a second angle is formed between the reinforcing section (268) and to at least one of the at least two meandering branches (266). [8] Imaging lens drive module according to claim 1, wherein the drive unit further comprises: a third coil (174) arranged on the other surface of the wiring substrate (150); and a second magnetic element (175) which is arranged on the other mounting section (131) of the frame element (130), wherein the second magnetic element (175) is opposite the third coil (174) and the second magnetic element (175) is arranged correspondingly to the third coil (174). [9] Camera module (100), comprising: the imaging lens drive module according to claim 1; and an image sensor (101) corresponding to an image area of ​​the imaging lens arrangement (110) of the imaging lens drive module. [10] Electronic device (10) comprising: the camera module according to claim 9. [11] Imaging lens drive module comprising: an imaging lens arrangement (110) with an optical axis (X); a lens carrier (120) configured for the installation of the imaging lens assembly (110); a frame element (130) which is arranged according to the lens carrier (120); a set of balls (140) arranged between the lens carrier (120) and the frame element (130), wherein the set of balls (140) is physically in contact with the lens carrier (120) and the frame element (130); a wiring substrate (150) arranged on an image side of the imaging lens arrangement (110); a resilience wiring plate (160) configured to connect the lens holder (120) and the wiring substrate (150), and comprising: a movable end (161) which is connected to and attached to the lens holder (120), without movement relative to the lens holder (120); a fixed end (162) which is connected to and attached to the wiring substrate (150) without movement relative to the wiring substrate (150); a connecting section (163) which is connected to the movable end (161); and an elastic section (164) connecting the fixed end (162) and the connecting section (163), wherein the elastic section (164) extends in a direction parallel to the optical axis (X) and comprises: at least two meandering branches (166) extending towards the fixed end (162) and overlapping in a particular viewing direction; and a drive unit configured to drive the lens carrier (120) to move relative to the wiring substrate (150) in a direction parallel to the optical axis (X) or in a direction perpendicular to the optical axis (X), and comprising: a first coil (171) which is arranged at the movable end (161) of the resilience wiring plate (160); a second coil (172) arranged on a surface of the wiring substrate (150); and a first magnetic element (173) arranged on a mounting section (131) of the frame element (130), wherein the first magnetic element (173) is opposite and arranged in relation to both the first coil (171) and the second coil (172); wherein a maximum width of the elastic section (164) close to the connecting section (163) is Wc, a minimum width of each of the at least two meandering branches (166) close to the fixed end (162) is Wf, and the following conditions are met: Wf <Wc; und 1.5 <Wc / Wf<16. [12] Imaging lens drive module according to claim 11, wherein the maximum width of the elastic section (164) adjacent to the connecting section (163) is Wc, the minimum width of each of the at least two meandering branches (166) adjacent to the fixed end (162) is Wf and the following condition is met: 1.9 <Wc / Wf<12,7. [13] Imaging lens drive module according to claim 11, wherein a straight length of the elastic section (164) in a direction along the optical axis (X) is D, a total length of the at least two meandering branches (166) is L and the following conditions are met: D <L; und 2.1 <L / D<14,3. [14] The imaging lens drive module according to claim 11, wherein the drive unit is configured to drive the lens carrier (120) to move relative to the frame element (130) in a direction parallel to the optical axis (X). [15] Imaging lens drive module according to claim 11, wherein the drive unit is configured to drive the frame element (130) to move relative to the wiring substrate (150) in a direction perpendicular to the optical axis (X). [16] The imaging lens drive module according to claim 11, wherein the resilience wiring plate (160) further comprises: a main limiting component (165) which is connected to the connecting section (163) and the elastic section (164) such that a first angle is formed between the connecting section (163) and the elastic section (164). [17] Imaging lens control module according to claim 12, wherein the elastic section (164) of the resilience wiring plate (160) further comprises: a node (167), wherein the at least two meandering branches (166) extend towards the fixed end (162) and converge at the node (167); wherein the at least two meandering branches (166) diverge away from each other after converging at the node (167), extend further towards the fixed end (162) and then approach each other. [18] The imaging lens drive module according to claim 11, wherein the resilience wiring plate (160) comprises polyimide. [19] Imaging lens drive module according to claim 11, wherein the elastic section (264) further comprises: a reinforcing section (268) connected to at least one of the at least two meandering branches (266); and an auxiliary limiting component (269) which is connected to the reinforcing section (268) and at least one of the at least two meandering branches (266) such that a second angle is formed between the reinforcing section (268) and the at least one of the at least two meandering branches (266). [20] Imaging lens drive module according to claim 11, wherein the drive unit further comprises: a third coil (174) arranged on the other surface of the wiring substrate (150); and a second magnetic element (175) which is arranged on the other mounting section (131) of the frame element (130), wherein the second magnetic element (175) is opposite the third coil (174) and the second magnetic element (175) is arranged correspondingly to the third coil (174). [21] Imaging lens drive module comprising: an imaging lens arrangement (110) with an optical axis (X); a lens carrier (120) configured for the installation of the imaging lens assembly (110); a frame element (130) which is arranged according to the lens carrier (120); a set of balls (140) arranged between the lens carrier (120) and the frame element (130), wherein the set of balls (140) is physically in contact with the lens carrier (120) and the frame element (130); a wiring substrate (150) arranged on an image side of the imaging lens arrangement (110); a resilience wiring plate (160) configured to connect the lens holder (120) and the wiring substrate (150), and comprising: a movable end (161) which is connected to and attached to the lens holder (120), without movement relative to the lens holder (120); a fixed end (162) which is connected to and attached to the wiring substrate (150) without movement relative to the wiring substrate (150); a connecting section (163) that is connected to the movable end (161); and an elastic section (164) connecting the fixed end (162) and the connecting section (163), wherein the elastic section (164) extends in a direction parallel to the optical axis (X) and comprises: at least two meandering branches (166) extending towards the fixed end (162) and overlapping in a particular viewing direction; and a node (167), wherein the at least two meandering branches (166) extend towards the fixed end (162) and converge at the node (167); and a drive unit configured to drive the lens carrier (120) to move relative to the wiring substrate (150) in a direction parallel to the optical axis (X), and comprising: a first coil (171) arranged at the movable end (161) of the resilience wiring plate (160); and a first magnetic element (173) which is arranged on a mounting section (131) of the frame element (130), wherein the first magnetic element (173) is opposite the first coil (171) and is arranged accordingly; where the shortest distance between the fixed end (162) and the node (167) in a direction parallel to the optical axis (X) is Hn, the straight length of the elastic section (164) in a direction along the optical axis (X) is D, and the following conditions are met: Hn <D; und 0.1≤Hn / D≤0.

7. [22] Imaging lens drive module according to claim 21, wherein the shortest distance between the fixed end (162) and the node (167) in a direction parallel to the optical axis (X) is Hn, the straight length of the elastic section (164) in a direction along the optical axis (X) is D and the following condition is satisfied: 0.2≤Hn / D≤0.

55. [23] The imaging lens drive module according to claim 21, wherein the drive unit is configured to drive the lens carrier (120) to move relative to the frame element (130) in a direction parallel to the optical axis (X). [24] Imaging lens drive module according to claim 21, wherein the drive unit further comprises: a second coil (172) arranged on a surface of the wiring substrate (150); wherein the first magnetic element (173) is opposite both the first coil (171) and the second coil (172) and is arranged accordingly. [25] Imaging lens drive module according to claim 24, wherein the drive unit is configured to drive the frame element (130) to move relative to the wiring substrate (150) in a direction perpendicular to the optical axis (X). [26] Imaging lens drive module according to claim 21, wherein the resilience wiring plate (160) further comprises: a main limiting component (165) which is connected to the connecting section (163) and the elastic section (164) such that a first angle is formed between the connecting section (163) and the elastic section (164). [27] Imaging lens drive module according to claim 21, wherein the at least two meandering branches (166) diverge away from each other after converging at the node (167), extend further towards the fixed end (162), and then approach each other again. [28] Imaging lens drive module according to claim 21, wherein the resilience wiring plate (160) comprises polyimide. [29] The imaging lens drive module according to claim 21, wherein the elastic section (264) further comprises: a reinforcing section (268) connected to at least one of the at least two meandering branches (266); and an auxiliary limiting component (269) which is connected to the reinforcing section (268) and to at least one of the at least two meandering branches (266) such that a second angle is formed between the reinforcing section (268) and the at least one of the at least two meandering branches (266). [30] Imaging lens drive module according to claim 24, wherein the drive unit further comprises: a third coil (174) arranged on the other surface of the wiring substrate (150); and a second magnetic element (175) which is arranged on the other mounting section (131) of the frame element (130), wherein the second magnetic element (175) is opposite the third coil (174) and the second magnetic element (175) is arranged correspondingly to the third coil (174).

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