Dual-band transponder and textile label with dual-band transponder

Description

TECHNICAL AREA OF INVENTION

[0001] The invention relates to a dual-band transponder, in particular a transponder with combined data transmission functionality in the ultra-high frequency (UHF) and near-field communication (NFC) ranges. The invention further relates to a textile label with such a dual-band transponder. The invention also relates to manufacturing methods for such dual-band transponders and textile labels with dual-band transponders. TECHNICAL BACKGROUND

[0002] In the textile value chain, it is common practice to use labels with high-frequency and / or ultra-high-frequency transponders, so-called "radio frequency identification tags" (RFID tags). Data related to the manufacture, identification, distribution, sale, and marketing of the labeled product can be stored on such transponders in a readable format.

[0003] Near Field Communication (NFC) technology builds upon RFID technology in general and has established itself as an international standard for contactless data exchange. This involves temporarily coupling coils separated by a few centimeters of air using the principle of electromagnetic induction. By measuring the feedback effect, data is transmitted from an NFC transponder to an NFC-enabled reader. In the textile industry, such NFC tags can be used for communication with end customers, for example, for marketing purposes.

[0004] Using different wireless data transmission technologies for the same product can offer advantages at various stages of the value chain. One approach is to use two different RFID tags, which complicates the programming and maintenance of the stored data. Another approach is to use tags with transponders that can operate in multiple frequency bands and using different high-frequency data transmission standards. However, embedding multiple transponders side-by-side on a single RFID-enabled tag generally reduces the performance of each individual transponder and increases the tag's footprint.

[0005] Prior art approaches addressing the problem of multiband-capable high-frequency transponders can be found in documents DE 10 2008 022 537 A1, DE 10 2013 111 027 A1, US 2009 / 0231139 A1, US 2011 / 0084888 A1, US 2014 / 0246503 A1, and US 2016 / 0342883 A1. Document US 6,049,461 A discloses a circuit unit with an insulating substrate on which a conductive, flat coil is located. The coil can consist of a plurality of coil layer sections separated by insulating layers. SUMMARY OF THE INVENTION

[0006] One of the objectives of the invention is therefore to find solutions for the miniaturization of dual-band transponders, in particular for use in the textile industry value chain.

[0007] The invention is defined by the independent claims. The dependent claims define preferred embodiments.

[0008] A key aspect of the invention is to avoid spatially or technically separating the two antennas for the ultra-high frequency (UHF) and high frequency (HF) ranges, but instead to integrate the high frequency antenna as a functionally integral component of the ultra-high frequency antenna. The frequency ranges for which the two antennas are responsible are sufficiently far apart to prevent mutual interference in the respective receive and transmit bands. The antennas are tuned to each other so that they can only achieve their full performance when used in conjunction with the other antenna. For example, the ultra-high frequency loop antenna can be tuned to a center frequency of approximately 800 MHz on its own.The high-frequency loop antenna can then be arranged within the outer contour of the ultra-high-frequency loop antenna in such a way that the ultra-high-frequency loop antenna is detuned to a center frequency of about 900 MHz, i.e., that the ultra-high-frequency loop antenna and the high-frequency loop antenna together achieve a center frequency of 900 MHz in the ultra-high-frequency range.

[0009] To make the transponder's antenna structure as compact as possible, one of the main ideas of the invention is to completely enclose the high-frequency (HF) antenna within the ultra-high-frequency (UHF) antenna. In this context, complete enclosure of the HF loop antenna by the UHF loop antenna means that the electromagnetically effective transmission area of ​​the HF loop antenna is entirely contained within the electromagnetically effective transmission area of ​​the UHF loop antenna. In other words, all loops of the UHF loop antenna encompass the loops and, if applicable, other antenna sections of the HF loop antenna in such a way that no antenna part of the HF loop antenna protrudes beyond the effective antenna area of ​​the UHF loop antenna in the plane of the substrate.

[0010] This allows the dimensions of the resulting nested antenna structure to be limited to approximately 13 x 13 mm, i.e., less than 170 mm². This enables the implementation of a compact dual-band transponder, which is particularly well-suited for compact textile labels. Most importantly, implementing the high-frequency loop antenna on two sides of a substrate or a substrate layer of a substrate ensures that the overall length of the high-frequency loop antenna is sufficiently large, while the area required for the high-frequency loop antenna in the plane of the substrate layers remains so small that the ultra-high-frequency loop antenna can completely enclose the high-frequency loop antenna.

[0011] Advantageous designs and further developments result from the additional sub-claims as well as from the description with reference to the figures.

[0012] According to some embodiments of the dual-band transponder according to the invention, the substrate can have at least two planar substrate layers. In some of these embodiments, the ultra-high-frequency loop antenna can be applied to a first side of a first of the at least two planar substrate layers of the substrate. In some of these embodiments, the high-frequency loop antenna can be applied to two opposite sides of a second of the at least two planar substrate layers of the substrate.

[0013] According to some further embodiments of the dual-band transponder according to the invention, the dual-band transponder can have first vias which extend through the second of the at least two planar substrate layers of the substrate and which electrically connect parts of the high-frequency loop antenna on the first side of the second of the at least two planar substrate layers of the substrate to parts of the high-frequency loop antenna on the second side of the second of the at least two planar substrate layers of the substrate. The number of vias can depend on the number of antenna elements of the high-frequency loop antenna to be connected on the two sides of the substrate. For example, two separate vias can be formed in through holes in the substrate substantially perpendicular to the planar extent of the substrate.

[0014] According to some further embodiments of the dual-band transponder according to the invention, the dual-band transponder can comprise second through-hole contact elements which are formed through the first of the at least two planar substrate layers of the carrier substrate.

[0015] According to some further embodiments of the dual-band transponder according to the invention, the dual-band transponder can comprise a dual-band transponder chip which is coupled to the ultra-high frequency loop antenna and the high-frequency loop antenna. A dual-band transponder chip can be a chip that is capable of operating in both the ultra-high frequency and high-frequency ranges and that supports different transmission protocols at the different frequencies.

[0016] According to some alternative embodiments of the dual-band transponder according to the invention, the dual-band transponder can comprise an ultra-high frequency transponder chip coupled to the ultra-high frequency loop antenna and a high frequency transponder chip coupled to the high frequency loop antenna. The ultra-high frequency transponder chip and the high frequency transponder chip can operate in different frequency bands and be designed according to various data transmission protocols such as RAIN RFID and NFC. The ultra-high frequency transponder chip and the high frequency transponder chip can be assembled in two separate processes.The thermode can be 8 mm in size, so it is advantageous to set the lateral distance between the ultra-high frequency transponder chip and the high frequency transponder chip to at least 8 mm, so that the thermode no longer touches the already assembled chip for the second placement process.

[0017] According to some further embodiments of the dual-band transponder according to the invention, the dual-band transponder can have second vias which are formed through the first of the at least two planar substrate layers of the carrier substrate, so that the dual-band transponder chip or the ultra-high frequency transponder chip is coupled to the ultra-high frequency loop antenna via the second vias.

[0018] According to some further embodiments of the dual-band transponder according to the invention, the second through-hole contact elements can also be formed through the second of the at least two planar substrate layers of the carrier substrate.

[0019] According to some further embodiments of the dual-band transponder according to the invention, the dual-band transponder can have an adhesive layer which is arranged between the first of the at least two planar substrate layers of the carrier substrate and the second of the at least two planar substrate layers of the carrier substrate. In some embodiments, the dual-band transponder chip or the ultra-high-frequency transponder chip and the high-frequency transponder chip can be arranged in the adhesive layer.

[0020] According to some alternative embodiments of the dual-band transponder according to the invention, the substrate can have exactly one planar layer. In this case, the ultra-high frequency loop antenna and the high frequency loop antenna can be applied to the sides of this single planar layer.

[0021] According to some further embodiments of the dual-band transponder according to the invention, through-hole components can be formed extending through exactly one planar substrate layer. The ultra-high-frequency loop antenna and the high-frequency loop antenna can be coupled to a dual-band transponder chip.

[0022] According to some alternative embodiments of the dual-band transponder according to the invention, through-hole components can be formed through exactly one planar substrate layer, so that the ultra-high frequency loop antenna is coupled to an ultra-high frequency transponder chip, and the high frequency loop antenna is coupled to a high frequency transponder chip.

[0023] According to some further embodiments of the dual-band transponder according to the invention, the ultra-high frequency loop antenna and the high frequency loop antenna can be matched to each other in such a way that the functionality of the ultra-high frequency loop antenna would be limited without the presence of the high frequency loop antenna.

[0024] According to some further embodiments of the dual-band transponder according to the invention, the area of ​​the surface of the dual-band transponder in the plane of the planar substrate layers of the carrier substrate can be less than 170 mm².

[0025] According to some embodiments of the textile label according to the invention, the textile label can further comprise a dipole antenna which is incorporated or woven into the textile label substrate. In some embodiments, the ultra-high frequency loop antenna can be inductively coupled into the dipole antenna.

[0026] According to some further embodiments of the textile label according to the invention, the dual-band transponder can be coated with a textile transfer adhesive and connected to the textile label substrate in a wash-resistant manner via the textile transfer adhesive.

[0027] According to some further embodiments of the textile label according to the invention, the carrier substrate of the dual-band transponder can comprise at least one of the materials from the group consisting of polyethylene terephthalate (PET), polyimide (PL), FR4 (composite material of glass fiber fabric and epoxy resin), and polyetheretherketone (PEEK). The dual-band transponder can, in principle, be designed as a multi-layered laminate, depending on the requirements regarding wash fastness, water resistance, and / or chemical resistance to substances such as perspiration or cleaning agents.

[0028] According to some further embodiments of the textile label according to the invention, the distance between the ultra-high frequency loop antenna and the high-frequency loop antenna can be at least 0.8 mm. The ultra-high frequency transponder chip and the high-frequency transponder chip can be mounted in two separate processes. The thermode can be 8 mm in size, so it is advantageous to set the lateral distance between the ultra-high frequency transponder chip and the high-frequency transponder chip to at least 8 mm, so that the thermode for the second mounting process no longer touches the chip that has already been mounted.

[0029] According to some embodiments of the method according to the invention, an identification code for the ultra-high frequency transponder chip can be programmed into a memory of the high-frequency transponder chip. According to some further embodiments of the method according to the invention, an identification code for the high-frequency transponder chip can be programmed into a memory of the ultra-high frequency transponder chip.

[0030] The above embodiments and further developments can be combined with one another as appropriate. Further possible embodiments, further developments, and implementations of the invention also include combinations of features of the invention described previously or subsequently with regard to the exemplary embodiments, even if not explicitly mentioned. In particular, the person skilled in the art will also add individual aspects as improvements or additions to the respective basic form of the present invention. BRIEF SUMMARY OF THE CHARACTERS

[0031] The present invention will be explained in more detail below with reference to the exemplary embodiments shown in the schematic figures. These figures show: Fig. 1 a textile label equipped with a dual-band transponder in a schematic top view according to an embodiment of the invention; Fig. 2A bis 2F Schematic sectional views in the area of ​​the dual-band transponder of the Fig. 1 along the intersection line AA' according to various possible embodiments of the invention; Fig. 3 a schematic block diagram of functional components of a transponder chip module for a dual-band transponder according to a further embodiment of the invention; and Fig. 4 an abstracted flowchart of an exemplary process for the production of a textile label according to a further embodiment of the invention.

[0032] The accompanying figures are intended to provide a further understanding of the embodiments of the invention. They illustrate embodiments and, in conjunction with the description, serve to explain the principles and concepts of the invention. Other embodiments and many of the aforementioned advantages become apparent with reference to the drawings. The elements of the drawings are not necessarily shown to scale. Directional terminology such as "above," "below," "left," "right," "over," "below," "horizontal," "vertical," "front," "back," and similar terms are used for explanatory purposes only and are not intended to limit the general public to specific embodiments as shown in the figures.

[0033] In the figures of the drawing, identical, functionally equivalent and similarly acting elements, features and components - unless otherwise stated - are each provided with the same reference symbols. DETAILED DESCRIPTION OF EXAMPLES OF EXECUTION

[0034] RFID transponders according to the present invention are electronic modules that essentially comprise an electronic memory chip and an antenna coupled to and integrated into the module. RFID transponders can transmit and receive electromagnetic signals in various frequency bands, for example, in the 125 kHz ("low frequency", LF) and 5.8 GHz ("super-high frequency", SHF) ranges. The design of the integrated antenna is selected depending on the desired frequency band. Frequency bands around 13.56 MHz ("high frequency", HF) and between 860 MHz and 960 MHz ("ultra-high frequency", UHF) are of particular importance.

[0035] UHF frequency bands can be used in logistics, for example, because they offer a greater access and read range than HF channels. Frequency, antenna shape, and antenna size can be selected accordingly to ensure the desired access and read range, robustness against interference and environmental influences, and robustness against interference between RFID transponders. An electromagnetic field between a reader and the RFID transponder's integrated antenna establishes an air interface, enabling wireless data exchange between the RFID transponder's memory chip and the reader's processor using predefined data exchange protocols.

[0036] RFID transponders can be manufactured from a pre-production stage called inlays. Inlays consist simply of chips and antennas mounted on a substrate. The inlays can then be covered with appropriate housings or protective layers to create a transponder module that is robust against environmental influences and sufficiently insulated against metallic objects.

[0037] Dual-band transponders, as defined in this disclosure, are RFID transponders capable of transmitting and receiving data at least two different frequencies or in two different frequency bands. In particular, dual-band transponders can operate in both the high-frequency range at several MHz, for example, at 13.56 MHz, and the ultra-high-frequency range at several hundred to one thousand MHz, for example, between 860 and 960 MHz. Near-field communication (NFC) technology is an RFID technology based on inductive coupling with a reading distance on the order of centimeters. It operates in the aforementioned high-frequency range of 13.56 MHz and with a maximum transmission rate of 424 kbit per second. NFC is internationally standardized, for example, in ISO 18092, ECMA 340, and ETSI TS 102 190.

[0038] Fig. 1 Figure 1 shows a schematic top view of a textile label 10 equipped with a dual-band transponder 20. The textile label 10 comprises a textile label substrate 19, for example, made of a woven or knitted textile fabric. The textile label 10 can, for example, have a substantially rectangular outer contour and can be designed to be sewn or glued into a garment. A dipole antenna is incorporated or woven into the textile label substrate 19, for example, made of an electrically conductive woven or weft thread. The dipole antenna serves for signal transmission in the ultra-high frequency far field. For this purpose, the dipole antenna can have two elongated arms with a loop antenna 17 located in the center of the textile label substrate 19, open at one end. Meandering extensions 18 of the dipole antenna can be connected to the two elongated arms.Folding dipole antenna arms into meanders or fractal structures allows for good compromises regarding the electrical properties while simultaneously limiting the dimensions of the dipole antenna to save space.

[0039] A dual-band transponder 20 is applied to the textile label substrate 19, for example, centrally above the loop element 17 of the dipole antenna of the textile label substrate 19. The dual-band transponder 20 can, for example, be coated on its underside with a textile transfer adhesive 3. This textile transfer adhesive 3 ensures the permanent adhesion of the dual-band transponder 20 to the textile label substrate 19. In particular, the textile transfer adhesive 3 can be selected such that the textile label 10 can be washed several times without the bond between the dual-band transponder 20 and the textile label substrate 19 deteriorating.

[0040] The dual-band transponder 20 has a carrier substrate 16 on which an ultra-high frequency loop antenna 11 and a high frequency loop antenna 12 are mounted. The ultra-high frequency loop antenna 11 and the high frequency loop antenna 12 are arranged such that the ultra-high frequency loop antenna 11 completely surrounds the high frequency loop antenna 12 in a plane parallel to the broad surface of the carrier substrate 16, i.e., the components of the high frequency loop antenna 12 protrude in the top view of the Fig. 1 not beyond the outer contour of the ultra-high frequency loop antenna 11.

[0041] The ultra-high frequency loop antenna 11, for example, can have a single loop, but it can also have several concentrically arranged spiral loops. Likewise, the high frequency loop antenna 12 can have several concentrically arranged spiral loops. The outer shape of the individual loops can be—as in Fig. 1 For example, it can be circular. However, it is also possible to choose other loop shapes, such as rectangular with rounded corners, polygonal with rounded corners, oval, or combinations thereof.

[0042] The ultra-high frequency loop antenna 11 and the high frequency loop antenna 12 are matched in such a way that the functionality of the ultra-high frequency loop antenna 11 would be limited without the presence of the high frequency loop antenna 12. In other words, the electromagnetic interference between the two loop antennas 11 and 12 is already taken into account in the design phase in order to achieve the full performance of both loop antennas 11 and 12 only when they are both present in the dual-band transponder 20. By interleaving the loop antennas 11 and 12, the surface area of ​​the dual-band transponder 20 can be reduced in the top view. Fig. 1 less than 170 mm², for example limited to a square area of ​​13 mm x 13 mm.

[0043] The ultra-high frequency loop antenna 11 is arranged so that it can inductively couple into the loop element 17 of the dipole antenna. The shape of the dual-band transponder 20 is chosen such that the coupling path between the ultra-high frequency loop antenna 11 and the loop element 17 of the dipole antenna is as long as possible.

[0044] Various exemplary variants for the design of a dual-band transponder 20, which is mounted on the textile label substrate 19 of the Fig. 1 to form a textile label 10, are in the Fig. 2A bis 2F illustrated. It should be clear that individual characteristics of the variants of Fig. 2A bis 2F can be combined with each other to arrive at further variants for a dual-band transponder 20 that are not explicitly shown.

[0045] The carrier substrate 16 can have at least one planar substrate layer and be composed of one or more materials. Examples of materials and material combinations include polyethylene terephthalate (PET), polyimide (PL), FR4, and polyetheretherketone (PEEK). The carrier substrate 16 can additionally be provided with a multilayer laminate of PET films, crosslinking adhesives, and / or pressure-sensitive adhesives (PSAs) to protect the carrier substrate 16 and the circuit elements applied to it from washing cycles or other typical textile treatments and to maintain the functionality of the transponder.

[0046] As in the Fig. 2A, 2B , 2D und 2E As shown, the support substrate 16 can consist of exactly one planar substrate layer. The ultra-high frequency loop antenna 11 can (as in Fig. 2A and 2D(shown) applied to the underside of the planar substrate layer or (as shown in Fig. 2B and 2E (shown) on the top side of the planar substrate layer. The high-frequency loop antenna 12 is applied to both sides of the single planar substrate layer, and its components on both sides can be electrically connected to each other by one or more vias 2 that extend through the substrate layer. Depending on which side the ultra-high-frequency loop antenna 11 is attached to, further vias 1 can be formed through the single planar substrate layer to ensure an electrically conductive connection to the ultra-high-frequency loop antenna 11 from the opposite side.

[0047] The ultra-high frequency loop antenna 11 and the high frequency loop antenna 12 can each be formed from electrically conductive layers of, for example, aluminum or copper, such as by stencil etching, PVD or CVD.

[0048] As in the Fig. 2A bis 2C As shown, the ultra-high frequency loop antenna 11 and the high frequency loop antenna 12 can be coupled together with a single dual-band transponder chip 15. This dual-band transponder chip 15 can operate in both the ultra-high frequency and high frequency ranges and, depending on the frequency range, can interact with the respective loop antennas 11 and 12 to transmit and receive signals.

[0049] Alternatively, it is - as in the Fig. 2D bis 2F As shown, it is also possible to provide a separate chip for each of the loop antennas 11 and 12. For example, the ultra-high frequency loop antenna 11 can be coupled to an ultra-high frequency transponder chip 13, and the high frequency loop antenna 12 can be coupled to a high frequency transponder chip 14. The lateral distance L between the two chips 13 and 14 on the surface of the substrate 16 can be at least 8 mm, for example, to allow assembly in two separate processes without damaging the other chip.

[0050] As in the Fig. 2C and 2FAs shown, the support substrate 16 can also consist of at least two planar substrate layers stacked on top of each other. The ultra-high-frequency loop antenna 11 can, for example, be applied to a first side of a first substrate layer 16a of the at least two planar substrate layers of the support substrate 16. The high-frequency loop antenna 12 can then be applied to two opposite sides of a second substrate layer 16b of the at least two planar substrate layers of the support substrate 16. In the Fig. 2C and 2F The ultra-high frequency loop antenna 11 is shown as being applied to the underside of the first substrate layer 16a; however, it should be clear that it is also possible – in analogy to the variants of the Fig. 2B and 2E- to apply the ultra-high frequency loop antenna 11 to the top surface of the first substrate layer 16a. In these cases, the via elements 1 either need only extend through the second substrate layer 16b or can be omitted entirely.

[0051] As in the Fig. 2C and 2F The vias 2 extend through the second substrate layer 16b of the carrier substrate 16, such that corresponding parts of the high-frequency loop antenna 12 on the first side of the second substrate layer 16b are electrically connected to parts of the high-frequency loop antenna 12 on the second side of the second substrate layer 16b. It may again be possible to provide a common dual-band transponder chip 15, which is coupled to the ultra-high-frequency loop antenna 11 and the high-frequency loop antenna 12 (see Fig. 2C ), or a separate ultra-high frequency transponder chip 13 and a separate high frequency transponder chip 14, each coupling to only one of the loop antennas 11 and 12.

[0052] In the variant with at least two substrate layers 16a and 16b, it may be possible to insert an adhesive layer 5 between the two planar substrate layers of the carrier substrate 16. The dual-band transponder chip 15 can then be embedded in this adhesive layer 5, and the respective loop antennas can be electrically connected from the underside or the top side of the individual planar substrate layers (see Fig. 2C Alternatively, it may be possible to arrange two separate chips, such as the ultra-high frequency transponder chip 13 and the high frequency transponder chip 14, in the adhesive layer 5 (see Fig. 2F ).

[0053] Fig. 4 Figure 1 shows an abstracted flowchart of a process M for producing a textile label. Process M can be used in particular for producing a textile label 10, as described in connection with Fig. 1 As has been explained. In process M, dual-band transponders can be manufactured or used, in particular dual-band transponders 20 as described in connection with the Fig. 2A bis 2F and Fig. 3 explained.

[0054] In a first step M1, an ultra-high frequency loop antenna 11 is deposited on one side of a substrate 16 with at least one planar layer. In a second step M2, a high frequency loop antenna 12 is deposited on two opposite sides of the substrate 16, such that the ultra-high frequency loop antenna 11 completely surrounds the high frequency loop antenna 12 in a plane parallel to the at least one planar layer. The two steps M1 and M2 can also be carried out in reverse order or essentially simultaneously.

[0055] In this context, the complete enclosure of the high-frequency loop antenna 12 by the ultra-high-frequency loop antenna 11 means that the electromagnetically effective transmission area of ​​the high-frequency loop antenna 12 is completely contained within the electromagnetically effective transmission area of ​​the ultra-high-frequency loop antenna 11.

[0056] In a third step M3, an ultra-high frequency transponder chip 13 is coupled to the ultra-high frequency loop antenna 11. In a fourth step M4, a high frequency transponder chip 14 is coupled to the high frequency loop antenna 12. Steps M3 and M4 can be performed in reverse order or essentially simultaneously.

[0057] In a fifth step M5, a dipole antenna is incorporated or woven into a textile label substrate 19, for example, using an electrically conductive antenna thread. The textile label substrate 19 can itself be a woven or knitted textile fabric. In a sixth step M6, the carrier substrate 16 with the ultra-high frequency loop antenna 11, the high frequency loop antenna 12, the ultra-high frequency transponder chip 13, and the high frequency transponder chip 14 are applied to the textile label substrate 19.

[0058] Optionally, in a seventh step M7 and an eighth step M8, it may be possible to store reciprocal mappings between the two chips in each other. In other words, it may be possible to program an identification code for the ultra-high frequency transponder chip 13, for example, a tag identifier, into a memory 14a of the high-frequency transponder chip 14, and an identification code for the high-frequency transponder chip 14, for example, a unique identifier, into a memory 13a of the ultra-high frequency transponder chip 13. The respective memories 13a and 14a can each be memory areas of user-available memory banks of the respective chips 13 and 14.

[0059] In the preceding detailed description, various features have been summarized in one or more examples to improve the clarity of the presentation. However, it should be clear that the above description is merely illustrative and in no way limiting. It serves to cover all alternatives, modifications, and equivalents of the various features and embodiments. Many other examples will be immediately and directly clear to the person skilled in the art based on their technical knowledge, given the above description.

Claims

1. A dual-band transponder (20), comprising: a carrier substrate (16) having at least one planar substrate layer; an ultrahigh-frequency loop antenna (11) applied to an upper side or a lower side of one of the planar substrate layers of the carrier substrate (16); and a high-frequency loop antenna (12), wherein the ultrahigh-frequency loop antenna (11) completely encloses the high-frequency loop antenna (12) in a plane parallel to the at least one planar substrate layer, characterized in that the loops of the high-frequency loop antenna (12) are applied to a lower side and an upper side, opposite to the lower side, of one of the planar substrate layers of the carrier substrate (16).

2. The dual-band transponder (20) according to claim 1, wherein the carrier substrate (16) comprises at least two planar substrate layers (16a, 16b), and wherein the ultrahigh-frequency loop antenna (11) is applied to an upper side or a lower side of a first one of the at least two planar substrate layers of the carrier substrate (16), and the high-frequency loop antenna (12) is applied to a lower side and an upper side, opposite to the lower side, of a second layer of the at least two planar substrate layers of the carrier substrate (16).

3. The dual-band transponder (20) according to claim 2, further comprising: first through-connection elements (2) which are formed through the second layer of the at least two planar substrate layers of the carrier substrate (16) and electrically connect parts of the high-frequency loop antenna (12) on the lower side of the second layer of the at least two planar substrate layers of the carrier substrate (16) to parts of the high-frequency loop antenna (12) on the upper side of the second layer of the at least two planar substrate layers of the carrier substrate (16).

4. The dual-band transponder (20) according to any one of claims 2 and 3, further comprising: second through-connection elements (1) which are formed through the first layer of the at least two planar substrate layers of the carrier substrate (16).

5. The dual-band transponder (20) according to any one of claims 2 and 3, further comprising: a dual-band transponder chip (15) coupled to the ultrahigh-frequency loop antenna (11) and the high-frequency loop antenna (12); or an ultrahigh-frequency transponder chip (13) coupled to the ultrahigh-frequency loop antenna (11), and a high-frequency transponder chip (14) coupled to the high-frequency loop antenna (12).

6. The dual-band transponder (20) according to claim 5, wherein the dual-band transponder (20) further comprises second through-connection elements (1) formed through the first layer of the at least two planar substrate layers of the carrier substrate (16), and wherein the dual-band transponder chip (15) or the ultrahigh-frequency transponder chip (13) is coupled to the ultrahigh-frequency loop antenna (11) via the second through-connection elements (1).

7. The dual-band transponder (20) according to claim 6, wherein the second through-connection elements (1) are further formed through the second layer of at least two planar substrate layers of the carrier substrate (16).

8. The dual-band transponder (20) according to any one of claims 5 and 6, further comprising: an adhesive layer (5) arranged between the first layer of at least two planar substrate layers of the carrier substrate (16) and the second layer of at least two planar substrate layers of the carrier substrate (16), wherein the dual-band transponder chip (15) or the ultrahigh-frequency transponder chip (13) and the high-frequency transponder chip (14) are arranged in the adhesive layer (5).

9. The dual-band transponder (20) according to claim 1, wherein the carrier substrate (16) comprises exactly one planar substrate layer and the ultrahigh-frequency loop antenna (11) is applied to the upper side or the lower side of the exactly one planar substrate layer, and the high-frequency loop antenna (12) is applied to the upper side and the lower side of the exactly one planar substrate layer.

10. The dual-band transponder (20) according to claim 9, wherein through-connection elements (1) are formed through the exactly one planar substrate layer, and the ultrahigh-frequency loop antenna (11) and the high-frequency loop antenna (12) are coupled to a dual-band transponder chip (15).

11. The dual-band transponder (20) according to claim 9, wherein through-connection elements (1) are formed through the exactly one planar substrate layer, the ultrahigh-frequency loop antenna (11) is coupled to an ultrahigh-frequency transponder chip (13), and the high-frequency loop antenna (12) is coupled to a high-frequency transponder chip (14).

12. The dual-band transponder (20) according to any one of claims 1 to 11, wherein the ultrahigh-frequency loop antenna (11) and the high-frequency loop antenna (12) are tuned to each other so that the functionality of the ultrahigh-frequency loop antenna (11) would be restricted without the presence of the high-frequency loop antenna (12), and such that the ultrahigh-frequency loop antenna (11) is tuned itself to a center frequency of approximately 800 MHz and the high-frequency loop antenna (12) is arranged such that the ultrahigh-frequency loop antenna (11) is detuned to a center frequency of approximately 900 MHz.

13. The dual-band transponder (20) according to any one of claims 1 to 12, wherein the surface area of the surface of the dual-band transponder (20) in the plane of the planar substrate layers of the carrier substrate (16) is less than 170 mm2.

14. A textile label (10), comprising: a textile label substrate (19); and a dual-band transponder (20) according to any one of claims 1 to 13, which is applied to the textile label substrate (19).

15. The textile label (10) according to claim 14, further comprising: a dipole antenna (17, 18) which is knitted or woven into the textile label substrate (19), wherein the ultrahigh-frequency loop antenna (11) couples inductively into the dipole antenna (17, 18).

16. The textile label (10) according to any one of claims 14 to 15, wherein the dual-band transponder (20) is coated with a textile transfer adhesive (3) and is bonded to the textile label substrate (19) via the textile transfer adhesive (3) in a wash-proof manner.

17. The textile label (10) according to any one of claims 14 to 16, wherein the carrier substrate (16) of the dual-band transponder (20) comprises at least one of the materials selected from the group consisting of polyethylene terephthalate, PET, polyimide, PI, FR4, and polyether ether ketone, PEEK.

18. The textile label (10) according to any one of claims 14 to 17, wherein the distance (L) between the ultrahigh-frequency loop antenna (11) and the high-frequency loop antenna (12) is at least 0.8 mm.

19. A method (M) for manufacturing a textile label (10), comprising: applying (M1) an ultrahigh-frequency loop antenna (11) to an upper side or a lower side of a carrier substrate (16) having at least one planar substrate layer; applying (M2) the loops of a high-frequency loop antenna (12) to the lower side and the upper side, opposite to the lower side, of the carrier substrate (16), so that the ultrahigh-frequency loop antenna (11) completely encloses the high-frequency loop antenna (12) in a plane parallel to the at least one planar substrate layer; coupling (M3) an ultrahigh-frequency transponder chip (13) to the ultrahigh-frequency loop antenna (11); coupling (M4) a high-frequency transponder chip (14) to the high-frequency loop antenna (12); knitting or weaving (M5) a dipole antenna into a textile label substrate (19); and applying (M6) the carrier substrate (16) comprising the ultrahigh-frequency loop antenna (11), the high-frequency loop antenna (12), the ultrahigh-frequency transponder chip (13), and the high-frequency transponder chip (14) to the textile label substrate (19).

20. The method (M) according to claim 19, further comprising the steps of: programming (M7) an identification code for the ultrahigh-frequency transponder chip (13) into a memory (14a) of the high-frequency transponder chip (14); and programming (M8) an identification code for the high-frequency transponder chip (14) into a memory (13a) of the ultrahigh-frequency transponder chip (13).