METHOD AND DEVICE FOR THE ADDITIVE MANUFACTURING OF A COMPONENT AND COMPONENT MANUFACTURED ACCORDINGLY

Description

[0001] The invention relates to a method and a device for the additive manufacturing of a component.

[0002] Various methods for powder deposition are known in additive manufacturing. Electrophotographic powder deposition offers advantages over other deposition mechanisms, particularly in terms of powder consumption and processing times. For electrophotographic powder deposition, the powders to be processed are electrostatically charged. This leads to the accumulation of charges in the component to be manufactured.

[0003] DE 11 2015 004 226 T5, US 2021 / 0291445 A1 and WO 2012 / 164015 A1 describe methods and devices for additive manufacturing.

[0004] It is an object of the present invention to improve a method for additive manufacturing, in particular to avoid charge accumulation during powder deposition.

[0005] This object is achieved by a method having the steps specified in claim 1. At least one powder is provided. Several component layers of a component to be manufactured are produced, wherein at least a powder portion of the at least one powder is applied to produce a component layer. To apply a powder portion, the powder portion is electrostatically charged, an application unit is electrostatically charged at least in some areas, and the electrostatically charged powder portion is picked up by the application unit, which is electrostatically charged at least in some areas, and transferred to an application surface. Different powder portions to be applied to produce the component layers are electrostatically charged with different polarities.

[0006] To transfer the powder portion to the application surface, the application unit is mechanically stimulated using an actuator, in particular a piezo actuator, in the application unit. This mechanical excitation enables particularly effective and targeted transfer of the powder portion to the application surface. The mechanical excitation overcomes the inertia of the powder particles adhering to the application unit. This mechanical excitation increases the distances between individual powder particles, which reduces both the interparticle attractive forces resulting from van der Waals interactions and the electrostatic attractive forces. Mechanical excitation using an actuator, in particular a piezo actuator, has proven particularly suitable. A piezo actuator can be used to generate particularly efficient excitation patterns, particularly vibrations.For example, the piezo actuator can be subjected to a periodic voltage to generate an oscillation.

[0007] According to the invention, it was recognized that by charging different powder components with different polarities, charge accumulation in the produced component layers is reduced. This improves the powder deposition of additional powder components. Advantageously, electrostatic repulsion between different powder components and between the powder particles is reduced. The number of component layers that can be produced on top of one another is not limited by a successively increasing charge accumulation. In particular, powder deposition is supported by the electrostatic attraction of powder components charged with different polarities. Additional powder components can also be applied with greater precision and higher packing density. This allows the density and porosity of the manufactured component to be specifically adjusted. The overall design freedom during component production is increased.The component can be manufactured with high density and low porosity, enabling components with improved mechanical properties.

[0008] Particularly preferred is electrostatically charging the powder components used to create different component layers with different polarities. This creates an additional attractive force between the successively applied powder components and component layers. The resulting component layers are further stabilized.

[0009] Preferably, several different powders are provided. When creating the component layers, powder fractions from different powders can be used to combine different materials in the component. For example, different component layers can be manufactured from powder fractions of different materials. It is also possible to combine different materials in one component layer. For example, to create a component layer, several powder fractions of different powders can be applied sequentially. Preferably, the powder fractions to be combined in a component layer are charged with the same polarity.

[0010] The at least one powder can be a polymer powder, a metal powder, and / or a ceramic powder. Polymer powders and / or ceramic powders can be directly electrostatically charged. Dielectric components can be added to metallic powders for electrostatic charging. For example, metallic powders can have a coating of a dielectric material. The at least one powder can contain further components, for example, binders and / or additives. Suitable additives are, in particular, flow aids and / or charge control substances. Charge control substances can assist in charging the powder, in particular in triboelectric charging of the powder.

[0011] The process is particularly suitable for multi-material processing. By providing different powders, the process can be used to combine different materials into a single component. The result is a one-piece component that consists of different materials in certain areas. Subsequent joining of prefabricated component components made of different materials is not necessary. For example, a combination of different commercially available materials, in particular commercially available polymer materials, is possible. Materials with very different properties can be combined, particularly with very different mechanical and / or thermal properties, for example with very different melting temperatures. This makes it possible to manufacture components with specifically adjustable, particularly locally adjustable, properties.

[0012] The electrostatic charging of the powder components can be achieved using the triboelectric effect and / or gas discharge. Charging based on the principle of gas discharge can be carried out in particular using a corona wire and / or a scorotron. A scorotron, also called a corona grid, has proven particularly suitable because it enables control of the electric acceleration field for the ions generated by gas discharge. This allows for more precise adjustment of the desired surface potential of the powder layer to be charged. To generate different polarities, a powder charging unit can have a reversible voltage source. Using the reversible voltage source, a corona wire and / or a scorotron in particular can be subjected to electrical voltage of different polarity.

[0013] The application unit can be electrostatically charged at least in certain areas, in particular selectively. This enables selective powder application. Electrophotographic methods have proven particularly suitable for area-specific, in particular selective, electrostatic charging. For example, the application unit has a photoconductive layer, in particular a layer of arsenic(III) selenide (As 2 Se 3 ). A photoconductive layer is dielectric, but becomes conductive in the exposed area when exposed to suitable radiation. This is referred to as the photoelectric effect. The photoconductive layer of the application unit is also referred to below as the photoconductor layer. The photoconductive layer can be electrostatically charged by gas discharge, in particular with the aid of a corona wire and / or a scorotron.By selectively exposing individual areas of the electrostatically charged photoconductive layer, the exposed areas can be selectively discharged. Exposure is achieved, for example, using a light-emitting diode. For a photoconductive layer made of arsenic(III) selenide, exposure at a wavelength of approximately 613 nm has proven particularly suitable.

[0014] To absorb the electrostatically charged powder portion, the powder particles of the powder portion are electrostatically attracted by the application unit, which is at least partially electrostatically charged. Depending on the relative polarity of the charge of the application unit and the powder portion, the powder particles adhere to electrostatically charged areas or to selectively discharged areas of the application unit, particularly a photoconductive layer of the application unit. The electrostatic charging of the powder portion and the absorption of the electrostatically charged powder portion by the application unit is also referred to as a development step.

[0015] To assist in absorbing the electrostatically charged powder portion, the application unit preferably has a conductive base body. The base body can be made of aluminum, for example. The conductive base body of the application unit can be subjected to a receiving voltage that promotes the attraction and adhesion of the powder portion. The receiving voltage has a polarity opposite to the charge of the powder portion. The application unit preferably has a reversible application unit voltage source. By means of the reversible application unit voltage source, the application unit, in particular its base body, can be subjected to a receiving voltage with a polarity opposite to the respective charge of the powder portion. The magnitude and polarity of the receiving voltage can be specifically adapted to the powder portion to be absorbed, in particular to the mass of the powder particles and / or their electrostatic charge.

[0016] The powder portion picked up by the application unit is transferred to an application surface. Transferring the powder portion to the application surface particularly involves transferring the application unit with the adhering powder portion into a build chamber and depositing the powder portion onto the application surface. Transferring the powder portion, particularly depositing the powder portion, onto the application surface is also referred to as a printing step. The application surface is the surface onto which the powder portion is to be applied to produce the respective component layer. For the first component layer, this can particularly be a build platform of the build chamber and / or a substrate on which the component is to be produced. For further component layers, the application surface is formed by the previously produced component layer.

[0017] For transfer into the build space, the application unit can be displaceable, in particular translationally displaceable. Preferably, the application unit is displaceable in at least two translational degrees of freedom, in particular in the direction of a surface normal of the application surface and in a direction perpendicular thereto. This enables simple and precise displacement of the application unit with the powder portion adhering to it into the build space and simple and precise delivery relative to the application surface. The positioning of the application unit in the direction of the surface normal of the application surface can be carried out in particular as a function of a component height already produced. Preferably, a distance between the application unit and the application surface is adjustable independently of component layers already produced. For displacement, the application unit can be arranged, for example, on a positioning system.For example, a linear axis and a precision lifting table have proven suitable for the translational movement and delivery relative to the installation space or the application area.

[0018] Preferably, the adhesion of the powder portion to the application unit, particularly during transfer into the build space, is supported by a holding voltage applied to the application unit, in particular its base body. The holding voltage can, in particular, correspond to the receiving voltage. The holding voltage can be generated, for example, using the application unit's voltage source.

[0019] Preferably, the application unit, in particular its base body, can be subjected to a deposition voltage. The deposition voltage particularly preferably has the same polarity as the electrostatic charge of the powder portion to be transferred. The deposition voltage supports the deposition of the powder portion onto the application surface. The deposition voltage can be generated, for example, by means of the application unit's voltage source. To deposit the powder portion, the application unit's voltage source can advantageously be reversed in order to switch from a holding voltage to the deposition voltage.

[0020] The powder portion transferred to the application surface is preferably solidified to create the respective component layer. For example, the applied powder portion can be thermally solidified. For this purpose, the powder portion or a component of the powder portion, for example a binder, can be melted. Thermal solidification is particularly suitable for processing polymer powders. The build space can be heated for melting, in particular by means of heating rays and / or lasers. Melting of the powder component or at least one component thereof can also be carried out selectively, for example by electron beam melting and / or selective laser sintering. Solidification can also be carried out using alternative methods, for example by binder jetting. This enables solidification without melting the powder, which is particularly advantageous for high-melting powders, for example metallic and / or ceramic powders.

[0021] By creating the component layers layer by layer, the entire component can be completed. However, further manufacturing steps, in particular post-processing steps, can also be provided after the layer-by-layer creation of the component layers. For example, by creating the component layers layer by layer, a green part can be created, from which the component is completed through suitable post-processing steps. In particular, in the event that the applied powder components are not or not completely solidified, further solidification of the component layers can take place in a post-processing step after the layer-by-layer creation of the component layers to complete the component. For example, a previously created green part can be debindered and / or sintered.

[0022] After applying a portion of the powder, any electrostatic charges remaining on the application unit, particularly its photoconductive layer, are erased. For this purpose, the photoconductive layer of the application unit can be fully exposed.

[0023] According to a preferred aspect of the method, the powder components to be applied to create successive component layers are electrostatically charged with alternating polarity. The alternating electrostatic charging of the powder components of successive component layers leads to particularly advantageous application behavior. The mutual electrostatic attraction between the layers promotes powder deposition. The resulting component layers are particularly stable. Charge accumulation is effectively avoided.

[0024] It is also possible to create multiple component layers before changing the polarity of the powder components to be applied. It has been shown that charge accumulation in the component can also be compensated by increasing the deposition voltage. Increasing the deposition voltage is particularly possible until the dielectric strength of the already created component layers and a medium, particularly air, in the gap between the top component layer (application surface) and the application unit is reached. For an example air gap with a gap size of 1 mm, the maximum voltage difference is approximately ±3000 V.

[0025] If multiple component layers are created with powders of the same polarity, the surface potential of the application surface increases. The inventors have recognized that good deposition results can be achieved with an unchanged polarity of the powder portion being applied up to a certain surface potential of the application surface. If the surface potential of the application surface exceeds the surface potential, the polarity of the next powder portion to be applied can be changed. A suitable surface potential, for example, is approximately 1000 V. This allows the number of component layers that are successively applied with the same polarity to be increased, for example, to 2 to 5 component layers.

[0026] According to a preferred aspect of the method, a surface potential of the application surface is measured to determine the polarity of the next powder portion to be applied. The measurement can be used to reliably determine the polarity of the next powder portion to be applied. For example, the next powder portion can be charged with a different polarity. It is also possible to compare the magnitude of the measured surface potential with a limiting surface potential. If the limiting surface potential is exceeded, the polarity of the powder portions to be applied can change. It is also possible to change the polarity of the powder portion to be applied if there is a risk of otherwise exceeding the limiting surface potential.

[0027] According to a preferred aspect of the method, the electrostatically charged powder portion is picked up and / or transferred by the application unit without contact. The contactless application process reliably prevents contamination and / or damage to the application unit, in particular its photoconductor layer. In particular, the risk of powder portions melted in the build space adhering to the application unit is reduced. The contactless transfer, in particular the contactless deposition, of the powder portion on the application surface is facilitated by the reduced charge accumulation according to the invention. This applies in particular when charging the powder portions to be applied to produce successive component layers with alternating polarity, since their attraction supports the transfer to the application surface.

[0028] According to a preferred aspect of the method, the powder portion is preheated at the application unit. Preheating the powder portion allows the temperature of the powder portion to be adjusted to the temperature in the build chamber. Thermal shocks are avoided. This reduces adverse effects, such as thermal stresses in the component to be manufactured. Particularly when processing polymer powders, premature partial crystallization of the powder within the component to be manufactured and the resulting component distortion, known as curling, are avoided.

[0029] The preheating of the powder portion at the application unit can be carried out in particular by means of a temperature control unit of the application unit. The temperature control unit of the application unit enables preheating of the powder during transfer into the build space independently of other components of the manufacturing device. Suitable temperature control units can, for example, comprise fluid channels for a heat transfer fluid, in particular a heat transfer oil. The fluid channels are formed, for example, in a base body of the application unit and preferably run in a meandering manner. The fluid channels are particularly preferably arranged in such a way that they enable uniform heating of the application unit, in particular a photoconductive layer of the application unit. The temperature control unit preferably comprises a temperature control device for heating the heat transfer fluid to a desired temperature and / or a pump for circulating the heat transfer fluid in the fluid channels.Additionally or alternatively, the temperature control unit may comprise heating wires and / or Peltier elements.

[0030] Preheating the powder portion to be applied at the application unit also has the advantage of reducing, or even preventing, cooling of the top component layer in the build chamber. Furthermore, effects that can occur during powder application due to temporary shading by heating devices in the build chamber, such as infrared radiators, are reduced.

[0031] Preheating the powder portion to be applied at the application unit also has the advantage that only the portion of powder being applied is preheated at a time. Compared to doctor- or roller-based coating systems, this eliminates the need for a lengthy, sometimes several-hour warm-up process. In particular, there is no need to heat all of the powder provided, for example, in a powder bed. This increases process efficiency.

[0032] The heating temperature to which the application unit is heated to preheat the powder portion can preferably be selected depending on the quantity and material composition of the powder to be applied. Particularly for polymer powders, such as semi-crystalline polymer powders, a heating temperature 1 °C to 5 °C above a temperature T to which the powder portion is to be preheated has proven to be practical. The powder portion can be further heated in the build chamber, for example, using thermal radiation and / or lasers.

[0033] According to a preferred aspect of the method, the powder portion is preheated at the application unit to a temperature T for which the following applies: TS - ΔT ≤ T < TS, where TS is a melting temperature, in particular the onset melting temperature, of the powder portion and ΔT is 30 °C, in particular 15 °C, in particular 10 °C, in particular 5 °C. The powder portion is heated at the application unit to a temperature just below the melting temperature TS. The melting temperature TS of the powder portion is understood here and below to be the lowest temperature at which at least one constituent of the powder portion begins to melt. Preheating below the melting temperature ensures that the powder portion and its constituents do not melt at the application unit. Contamination and / or damage to the application units by melt residues is avoided.Preheating to just below the melting temperature also allows for a large degree of adaptation of the powder temperature to the temperatures prevailing in the build chamber. Adverse thermal effects are reliably avoided.

[0034] The melting temperature TS can, in particular, be the onset melting temperature of the powder component. This reliably prevents melting of the powder component at the application unit. The onset melting temperature is the temperature at which the powder material begins to melt when heated. The onset melting temperature can be determined, in particular, using differential scanning calorimetry (DSC).

[0035] According to a preferred aspect of the method, the powder portion at the application unit is preheated to a temperature T for which: TR - δT < T, where TR is a recrystallization temperature, in particular the onset recrystallization temperature, of the powder portion and δT is 20 °C, in particular 15 °C, in particular 10 °C, in particular 5 °C, in particular 0 °C. This has the advantage, particularly for (semi-)crystalline powder materials, in particular semi-crystalline polymers, that recrystallization of the powder portion and thus warping of the build material during the application process are avoided. Preheating is preferably carried out to a temperature T above the recrystallization temperature TR, in particular the onset recrystallization temperature (δT = 0 °C). However, it has been shown that preheating to temperatures T slightly below the recrystallization temperature, in particular the onset recrystallization temperature (δT > 0 °C), can also sufficiently reliably prevent recrystallization.

[0036] The recrystallization temperature TR is preferably the onset recrystallization temperature. This reliably prevents recrystallization of the powder material. The onset recrystallization temperature is the temperature at which recrystallization of the powder material begins upon cooling. The onset recrystallization temperature can be determined, in particular, using differential scanning calorimetry (DSC).

[0037] Preferably, the powder portion at the application unit is preheated to a temperature T for which the following applies: TR - δT < T < TS, where δT is 20 °C, in particular 15 °C, in particular 10 °C, in particular 5 °C, preferably 0 °C. The temperature range between the recrystallization temperature TR, in particular the onset recrystallization temperature, and the melting temperature TS, in particular the onset melting temperature, is also referred to as the quasi-isothermal process window. This temperature range has proven particularly advantageous for processing (semi-)crystalline materials, in particular semi-crystalline polymers. Negative effects of recrystallization, such as component distortion, and melting of the powder portion at the application unit are reliably avoided.

[0038] The quasi-isothermal process window is highly material-dependent. For polyamide 12 (PA12), for example, this ranges between approximately 158 °C and approximately 181 °C. For polyamide 11 (PA11), the quasi-isothermal process window ranges between approximately 164 °C and approximately 199 °C. In addition, the quasi-isothermal process window can vary due to different additives, such as flow aids and / or optical scattering particles, and / or starting materials. This can, for example, lead to manufacturer-dependent deviations in the quasi-isothermal process window. The quasi-isothermal process window can preferably be determined in advance by a calibration measurement, in particular using differential scanning calorimetry (DSC).

[0039] According to a preferred aspect of the method, the application surface, in particular an entire build chamber, is preheated to a temperature T2 for which the following applies: TR < T2, in particular TR < T2 < TS. Preferably, the build chamber is kept at a temperature T2 during the application of all powder portions that lies within the quasi-isothermal process window. The temperature T2 preferably corresponds essentially to the temperature T to which the powder portion is preheated at the application unit. A temperature shock during powder application is avoided. In particular, a cooling process of the component to be manufactured can be specifically controlled. Cooling below the recrystallization temperature TR, in particular below the onset recrystallization temperature, preferably only takes place after all component layers have been applied. This avoids premature recrystallization. The cooling process can be controlled.This particularly advantageously allows for the targeted control of the crystallization of the construction material and thus the crystallinity, especially the size of the resulting crystals (so-called spherulites) of the component to be manufactured. This allows for a particularly precise and targeted influence on the mechanical properties of the component to be manufactured.

[0040] According to a preferred aspect of the method, the application unit is set into vibration to transfer the powder portion to the application surface. Suitable voltages include sinusoidal, rectangular, and / or triangular voltages, as well as combinations thereof. The excitation frequency can be, for example, between 100 Hz and 20 kHz. Excitation frequencies in the frequency ranges 100 Hz to 500 Hz, 1 kHz to 2 kHz, and / or 10 kHz to 18 kHz are particularly suitable. The peak-to-peak voltage of the excitation can be, for example, between 300 and 500 volts. Excitation by means of a pulse sequence consisting of a strong pre-pulse and irregular follow-up pulses with a smaller amplitude has proven particularly advantageous. The pre-pulse can, for example, have a peak-to-peak voltage of approximately 1,000 volts. For mechanical excitation, especially for vibration excitation, several corresponding pulse sequences consisting of a strong pre-pulse and weaker follow-up pulses can be used.

[0041] Periodic excitation patterns, especially sinusoidal excitation patterns, with an excitation frequency in the range of one of the natural frequencies of the application unit have proven particularly suitable. Preferably, the excitation frequency essentially corresponds to one of the natural frequencies of the application unit. This allows for particularly high accelerations of the application unit, which facilitates overcoming the van der Waals forces.

[0042] Preferably, the excitation occurs such that the application unit is accelerated essentially in the deposition direction. Acceleration in the deposition direction supports the deposition of the powder particles. In contrast, acceleration perpendicular to the deposition direction can lead to a lateral displacement of individual deposited powder particles (so-called false prints). Strong excitation amplitudes, particularly periodic excitations occurring at a natural frequency of the application unit, can lead to strong accelerations in the deposition direction and / or perpendicular to it. This can increase powder transfer while simultaneously increasing the misprint rate.

[0043] Particularly preferably, the mechanical excitation, in particular a periodic excitation at one of the natural frequencies of the application unit, is combined with an electric transfer field, in particular with a deposition voltage. It has been shown that the combination of mechanical excitation and electric transfer field particularly favors powder deposition. Furthermore, the electric transfer field reduces the misprint rate. The combination of mechanical excitation and electric transfer field ensures powder deposition with high coverage of the deposition area while simultaneously reducing the misprint rate. For example, mechanical excitation and activation of the electric transfer field occur essentially simultaneously.

[0044] According to a preferred aspect of the method, the application unit is mechanically excited after the electrical transfer field has been fully built up. The mechanical excitation only occurs when the electrical transfer field has been fully built up. Preferably, the mechanical excitation occurs immediately after the transfer field has been fully built up. In particular, the voltage supply, in particular the high-voltage supply, for the electrical transfer field is activated first. After the electrical transfer field has been fully built up, the mechanical excitation, in particular at least one piezo actuator, is then activated. This ensures particularly precise powder deposition in the deposition direction. For example, common high-voltage supplies can build up suitable deposition voltages (for example between ± 500 V and ± 3000 V) within approximately 0.1 s to approximately 30 s.

[0045] The mechanical excitation should then only take place after the time required to build up the transfer field has elapsed.

[0046] According to a preferred aspect of the method, an electric transfer field is generated between the application unit and a transfer structure to transfer the powder portion to the application surface. The electric transfer field ensures a particularly targeted and precisely positioned transfer, in particular deposition, of the powder portion on the application surface. The electric transfer field is preferably generated between a conductive base body of the application unit and a grounded transfer structure. For this purpose, the application unit, in particular its base body, can be subjected to a deposition voltage.

[0047] The transfer structure is preferably grounded. The transfer structure can be arranged in the direction of a surface normal of the application surface between the application surface and the application unit. Preferably, the transfer structure can be displaced in the direction of the surface normal of the application surface in order to precisely adjust the electric transfer field regardless of the height of the component layers already produced.

[0048] The transfer structure preferably comprises a transfer frame made of conductive material. The transfer frame can, for example, be formed from frame-shaped conductors, in particular copper rods. The transfer frame preferably has a greater extent than the application unit in the direction perpendicular to the surface normal of the application surface. The transfer frame preferably has an extent in a plane perpendicular to the surface normal of the application surface that exceeds the extent of the application unit, for example, by 1 mm. In the direction perpendicular to the surface normal of the application surface, the transfer frame is preferably arranged circumferentially around the application unit. The transfer frames do not impede the transfer of the powder portion. Lateral deflection of the powder during deposition is minimized.

[0049] According to a preferred aspect of the method, at least two different powders are provided, wherein the at least two different powders are triboelectrically chargeable with two different polarities. The use of such powders allows the powder components with different polarities to be charged in a simple manner using the triboelectric effect. For example, a powder charging unit used to charge the powders can have a magnetic brush system. This allows the respective powders to be electrostatically charged with different polarities. Various of the provided powders can be used to apply powder components charged with different polarities.

[0050] The at least two powders can, for example, contain different charge control substances, which lead to different polarities in the electrostatic charging while the powder properties are otherwise identical. This allows charging with different polarities and otherwise unchanged powder properties.

[0051] Particularly suitable powders for triboelectric charging and their production are described below. The production of the powders and the corresponding powder formulation are an independent aspect of the invention, which is particularly independent of the charging of different powder components with different polarities. The powder formulation comprises polymer particles and charge control substances. Suitable charge control substances are, in particular, functionalized silica particles. In particular, the polymer particles are coated with the charge control substances, in particular the functionalized silica particles. The powder formulation preferably consists of polymer particles coated with functionalized silica particles.

[0052] To produce a preferred powder formulation, polymer particles are coated with silica particles, in particular dry-coated. Any mixer suitable for dry coating can be used for this purpose, for example, shaker mixers, in particular 3D shaker mixers, horizontal and / or vertical mixers, in particular with different agitator geometries, drum mixers, cube mixers, and / or cylindrical mixers. This ensures high flexibility in the production of the powder formulation. Mixing aids, for example in spherical form, can also be used. The mixing aids can consist, for example, of glass and / or zirconium oxide, in particular glass spheres. Suitable glass spheres can have an average diameter of 1.5 mm and an average weight of 180 g. Mixing aids promote deagglomeration of the silica particles and can be easily separated by sieving after the mixing process.

[0053] The polymer particles can consist of any desired polymer. The powder formulation can, in particular, comprise commercially available powders coated with the functionalized silica particles. The powder formulation and its production are advantageously suitable for functionalizing any desired polymer powder for triboelectric charging in additive manufacturing. Examples of polymers are polypropylene (PP), polyethylene (PE), polylactide (PLA), polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polymethyl methacrylate (PMMA), polyamide (PA), polycarbonate (PC), polystyrene (PS), polyoxymethylene (POM), polyetheretherketones (PEEK), polyetherketone (PEK), polyphenylene sulfide (PPS), polyethersulfone (PES), acrylonitrile-butadiene-styrene (ABS), and / or acrylonitrile-butadiene-styrene copolymers. The polymer powders can, in particular, also consist of mixtures, blends, and / or composites of such polymers.

[0054] The polymer particles preferably have a particle size distribution in the range of 1 µm to 200 µm.

[0055] The functionalized silica particles preferably have an average particle size between 10 nm and 60 nm. The functionalized silica particles serve as charge control agents. They function as electron acceptors or electron donors, thus ensuring a targeted shift in the charge spectrum as part of the powder formulation. A further advantage is that the functionalized silica particles act as flow aids, which improves the material feed for powder application.

[0056] For the production of a powder formulation for triboelectric charging with negative polarity, functionalized silica particles in the form of hexamethyldisilazane (HMDS), polydimethylsiloxane (PDMS), or a mixture thereof are particularly suitable. For the production of a powder formulation for triboelectric charging with positive polarity, functionalized silica particles in the form of PDMS, nitrogen compounds -NR 2 and -NR 3 and / or mixtures thereof have proven particularly suitable. Suitable functionalized silica particles are commercially available, for example, under the trade name "HDK" from Wacker Chemie AG. For negative charging, HDK H05TX, for example, can be used. For positive charging, HDK H05TA, for example, can be used.

[0057] The proportion of charge control agents, especially functionalized silica particles, in the powder formulation is preferably between 0.05 wt.% and 1 wt.% based on the mass of the polymer. Such a proportion of charge control agents results in a particularly suitable shift in the charge spectrum.

[0058] As the inventors have discovered, a particular advantage of triboelectric charging is the homogeneous, in particular complete, charging of the powder particles due to charge separation. Unlike gas discharge, which can only charge very thin powder layers, triboelectric charging allows larger powder layers to be charged. This allows the layer thickness of the powder portion picked up by the application unit to be increased. This enables the deposition of component layers with greater layer thicknesses and thus faster production. For example, triboelectric charging can be used to create layer thicknesses of the powder portion to be applied that correspond to between approximately 1 and approximately 5 average particle diameters of the powder particles in the powder portion. Depending on the particle diameter, layer thicknesses between approximately 60 µm and approximately 300 µm can be created.The gas discharge allows layer thicknesses of about 1 to about 2 average particle diameters, for example between about 60 µm and about 120 µm.

[0059] According to a preferred aspect of the method, the powder portion picked up by the application unit has a layer thickness perpendicular to the application unit that is greater than twice the average particle diameter of the powder particles of the powder portion. This enables fast and efficient production. The layer thickness is preferably between 2 and 5 average particle diameters. The powder portion can be charged, in particular, triboelectrically. Particularly preferably, triboelectrically chargeable powders with different polarities are provided in order to be able to apply and produce component layers with high layer thicknesses and different polarities. It is also possible to select different layer thicknesses for different component layers, in particular for different powder portions to be applied.For example, in areas with fine component structures to be created, a smaller layer thickness can be selected than in other areas.

[0060] An additively manufactured component is also described. The component is manufactured using the previously described process. The component is characterized in particular by increased component density and low porosity. The component exhibits improved mechanical properties.

[0061] The component is, in particular, a multi-material component. The component is characterized, in particular, by an integral or one-piece combination of different materials. The component can, for example, consist of different materials, in particular of different polymer materials, in different areas. In particular, various commercially available materials, in particular commercially available polymer materials, can be combined in the component. Particularly preferably, the component has a combination of materials with very different properties, in particular with very different mechanical and / or thermal properties, for example with very different melting temperatures. The thermal and / or mechanical properties of the component can be specifically adjusted, in particular locally. Joins between component components made of different materials are not required.

[0062] For example, the component can be made entirely of polyamide 12 (PA12) and a thermoplastic urethane-based elastomer (TPE-U). Such a component exhibits the strength and mechanical resilience of PA12 in areas where PA12 was used. In areas where TPU was used, the component exhibits the properties typical of TPU elastomers. Joins between TPU and PA12 areas are not required.

[0063] It is a further object of the invention to improve an apparatus for additive manufacturing.

[0064] This object is achieved by a device having the features specified in claim 11. The device has at least one powder reservoir for storing at least one powder, at least one powder charging unit for electrostatically charging powder components of the at least one powder, and at least one application unit that is electrostatically chargeable at least in some regions for receiving and transferring electrostatically charged powder components to an application surface. The at least one powder charging unit is designed to electrostatically charge different powder components of the at least one powder to produce component layers with different polarity. The device enables an improved additive manufacturing process, in particular with the aid of electrophotographic powder application. Disadvantageous charge accumulations in the component to be manufactured are avoided.The device has in particular the features and advantages described with regard to the manufacturing process.

[0065] The application unit has an actuator for generating mechanical excitation, in particular vibration excitation, of the application unit. The mechanical excitation supports the targeted and precise transfer of the powder components to the application surface. Undesired adhesion of the powder components to the application unit is avoided. The actuator is preferably designed as a piezo actuator. Using a piezo actuator, particularly suitable excitation patterns, in particular vibration excitations, can be generated easily and precisely. The mechanical excitation can be flexibly adapted to the powder component to be transferred, in particular to the mass of the powder particles and / or their electrostatic charge.

[0066] The functionality of the at least one powder charging unit is based in particular on the physical effect of gas discharge. The at least one powder charging unit comprises, for example, a corona wire or a scorotron. The at least one powder charging unit can comprise a reversible voltage source to generate different polarities.

[0067] Alternatively or additionally, the at least one powder charging unit can utilize the triboelectric effect. For example, the at least one powder charging unit can comprise a magnetic brush system.

[0068] The device preferably has a control unit which is designed to control the device for carrying out the manufacturing method described above.In particular, the control unit is designed to control the device for additive manufacturing of the component in such a way that a plurality of component layers of the component to be manufactured are produced, wherein at least one powder portion of the at least one powder is applied to produce a component layer, wherein the powder portion is electrostatically charged by means of the at least one powder charging unit, the at least one application unit is electrostatically charged at least in regions, and the electrostatically charged powder portion is picked up by means of the at least one application unit that is electrostatically charged at least in regions and transferred to the application surface, wherein different powder portions to be applied to produce the component layers are electrostatically charged with different polarities. The control unit allows the manufacturing process to be carried out fully automatically using the device.The control unit can further be designed to carry out the advantageous method steps described above.

[0069] According to a preferred aspect of the device, the at least one application unit has a temperature control unit for preheating powder components at the application unit. This reduces, and in particular prevents, adverse thermal effects, particularly thermal stresses in the components to be produced.

[0070] According to a further preferred aspect of the device, the temperature control unit has fluid channels for a heat transfer fluid, which are formed in a base body of the application unit. The fluid channels extend, in particular, in a meandering manner into the base body. The fluid channels are particularly preferably arranged in such a way that uniform preheating of powder components is ensured over the entire surface of the application unit, in particular an entire photoconductive layer of the application unit.

[0071] The temperature control unit preferably comprises a temperature control device for controlling the temperature of the heat transfer fluid and / or a pump for circulating the heat transfer fluid. The use of fluid channels for a heat transfer fluid has the advantage of allowing preheating of the powder and, if necessary, cooling of the application unit to protect it from the temperature prevailing in the build space. Thermal damage to the application unit, particularly its photoconductive layer, is avoided.

[0072] Alternatively or additionally, the temperature control unit can also have heating wires and / or one or more Peltier elements.

[0073] According to a further preferred aspect of the device, the application unit has a conductive base body connected to a reversible application unit voltage source. The conductive base body of the application unit can be subjected to a pick-up voltage, holding voltage, and / or deposit voltage adapted to the polarity of the electrostatic charge of the powder component by means of the reversible application unit voltage source. This supports the pick-up and transfer of the powder component by means of the application unit.

[0074] According to a further preferred aspect, the device has a transfer structure for generating an electric transfer field between the application unit and the transfer structure. The electric transfer field supports the transfer, in particular the deposition, of the powder portion on the application surface. This ensures, in particular, precise deposition of the powder portion. The electric transfer field is formed, in particular, between a conductive base body of the application unit and the transfer structure. For this purpose, the base body of the application unit can be subjected to a deposition voltage. The transfer structure is preferably grounded. The transfer structure, in particular, has a transfer frame. The transfer structure, in particular, has the features and advantages described with reference to the method.

[0075] Further advantages and details of the invention are explained in more detail below with reference to the drawings, which show: Fig. 1 a schematic representation of a device for additive manufacturing of a component, Fig. 2 a schematic representation of an application unit of the device according to Fig. 1 , Fig. 3 a schematic process flow for the additive manufacturing of a component, in particular using the device according to Fig. 1 , Fig. 4 a schematic representation of a charging station of the device according to Fig. 1 during the electrostatic charging of the application unit, Fig. 5 a schematic representation of an exposure station of the device according to Fig. 1 during the selective exposure of the application unit, Fig. 6 a schematic representation of a development station of the device according to Fig. 1when charging a powder portion of a powder for the electrophotographic application process, Fig. 7 the development station according to Fig. 6 when the electrostatically charged powder portion is picked up by the application unit, Fig. 8 a schematic representation of a printing station of the device according to Fig. 1 during the transfer of a powder portion to produce a first component layer of the component to be manufactured, Fig. 9 the printing station according to Fig. 8 after depositing a further powder portion to produce a further component layer of the component to be manufactured, Fig. 10 the printing station according to Fig. 8 after the deposition of a further powder portion of a different powder for the production of a further component layer of the component to be manufactured, and Fig. 11 a schematic representation of a further embodiment of a development station for a device for the additive manufacturing of a component.

[0076] Based on the Figures 1 to 10 A first embodiment of a device 1 for the additive manufacturing of a component and of an additive manufacturing method 2 is described below.

[0077] Fig. 1shows a schematic representation of the device 1, which is set up for additive manufacturing by means of electrophotographic powder deposition. The device 1 has a charging station 3, an exposure station 4, a development station 5 and a printing station 6. An application unit 7 of the device 1 can be moved between the stations of the device 1. The charging station 3 serves to electrostatically charge the application unit 7. At the exposure station 4, the application unit 7 is selectively exposed and thus selectively discharged. The exposure station 4 also serves to erase any remaining electrostatic charges on the application unit 7 after a powder portion has been transferred to the printing station 6. At the development station 5, a powder portion is electrostatically charged and picked up by the application unit 7.The collected powder portion is transported to the printing station 6 by the application unit 7 and deposited there on a deposition surface. The printing station 6 forms a build space for the component to be manufactured layer by layer.

[0078] The powder portion is picked up by the application unit 7 in the development station 5 and deposited in the printing station 6 without contact.

[0079] The device 1 is suitable for multi-material processing. Using the device 1, different materials can be combined to form a component. The materials intended for the production of the component are provided in the form of powders. For this purpose, the device 1 has various powder reservoirs. The Fig. 1The illustrated embodiment has two powder reservoirs R1, R2 for two different powders P1, P2. In the illustrated embodiment, the powders P1, P2 are polymer powders made of different polymer materials. Any polymers can be used for this purpose. Particularly suitable are polymers typically used in additive manufacturing, in particular polyamide 12 (PA12), polypropylene (PP), thermoplastic elastomers (TPE), urethane-based thermoplastic elastomers (TPU or TPE-U), high-density polyethylene (PE-HD), and / or polystyrene (PS).

[0080] In other embodiments not shown, ceramic and / or metallic powders can also be processed. Polymer and ceramic powders can be directly electrostatically charged for the electrophotographic application process. Metal powders, for example, are provided with a dielectric coating to enable electrostatic charging.

[0081] For moving the application unit 7, the device 1 has a positioning system 8. The positioning system 8 enables the application unit 7 to be moved between the stations of the device 1. The movement takes place translationally in the x-direction. By means of the positioning system 8, the application unit 7 can also be advanced in the vertical direction (z-direction). This allows the distance between the application unit 7 and the powder portion to be picked up at the development station 5 and to an application surface at the printing station 6 to be precisely adjusted. The travel speed in the x-direction can be, for example, between 0.2 m / s and 1.0 m / s. The travel speed in the z-direction is, for example, between approximately 10 mm / s and approximately 20 mm / s.

[0082] At the printing station 6, the transferred powder components are solidified. Especially with polymer powders, this can be achieved by melting the powder particles. Therefore, high temperatures regularly prevail at the printing station 6. The application unit 7 is connected to the positioning system 8 via a support arm 9. The support arm 9 ensures sufficient spacing of the positioning system 8 from the build space and the temperatures prevailing therein. The support arm 9 can, for example, have a length of approximately 50 cm. For further thermal shielding of the positioning system 8, a thermal separation device 10 is arranged between the application unit 7 and the positioning system 8. The thermal separation device 10 is, for example, a roller cover made of aluminized Kevlar. The thermal separation device 10 has, for example, a thickness of 0.8 mm and a width of 90 mm.

[0083] Positioning system 8 features a linear axis for displacement in the x-direction and a precision lifting table for displacement in the z-direction. Alternatively, other positioning systems, such as spindle-, belt-, and / or chain-driven positioning systems, are also possible.

[0084] The device 1 has a control unit 11. The control unit 11 controls the device 1 to carry out additive manufacturing. For example, design data, in particular CAD data, for the component to be manufactured are stored on the control unit 11. The control unit 11 controls the device 1 to carry out layer-by-layer production of the component according to the design data.

[0085] In Fig. 2The application unit 7 is shown schematically. The application unit 7 has a base body 12. The base body 12 is designed as an aluminum plate. The base body 12 is square in the plane formed by the x-direction and the y-direction. It has an exemplary side length of 100 mm. In the z-direction, the base body 12 has a height of, for example, 5 mm.

[0086] A photoconductor layer 13 is applied to the surface of the base body 12, which serves to accommodate the powder portion. The photoconductor layer 13 is made of arsenic(III) selenide (As 2 Se 3 ). It has an exemplary layer thickness between 80 µm and 120 µm. The photoconductor layer 13 is dielectric, but upon excitation with light, it becomes locally conductive in the exposed area due to the photoelectric effect.

[0087] The base body 12 is connected to an application unit voltage source 14. Using the application unit voltage source 14, the base body 12 of the application unit 7 can be supplied with a high voltage. The voltage is applied in the form of a pick-up, hold, and / or deposit voltage, as described below. The polarity of the voltage supply can be reversed using switches S14a and S14b. The switches S14a, S14b can be controlled by the control unit 11.

[0088] The application unit 7 has a temperature control unit 15. The temperature control unit 15 serves to preheat the powder portion adhering to the application unit 7 before it is deposited in the printing station 6. By preheating the powder portion, the temperature of the powder is adapted to the temperatures prevailing in the build space of the printing station 6. This reduces thermal stresses in the component to be produced. The adverse effect of curling is avoided, particularly when processing polymer powders. The temperature control unit 15 heats the powder portion to a temperature just below its melting temperature. This prevents components of the powder portion from melting on the application unit 7 and adhering to it. Contamination of and damage to the application unit by melted powder components is avoided.

[0089] The temperature control unit 15 has fluid channels 16 through which a heat transfer fluid in the form of a heat transfer oil is pumped. The fluid channels 16 run in a meandering manner within the base body 12 and evenly cover the entire surface of the base body 12 in the xy plane. The fluid channels 16 can, for example, have a diameter of 4.2 mm. The heat transfer oil is heated to the desired temperature by means of a temperature control device 18 and circulated within the fluid channels 16 by means of a pump 19. Fig. 2 A fluid circuit of the heat transfer oil with the fluid channel 16, the temperature control device 18 and the pump 19 is indicated by arrows.

[0090] The heat transfer fluid pumped through the fluid channels 16 brings the application unit 7 to a desired temperature. This preheats the powder portion to be transferred by the application unit 7. Furthermore, the temperature control unit prevents the application unit 7 from overheating in the build chamber. Damage to the photoconductor layer 13 due to the temperatures prevailing in the build chamber is avoided.

[0091] In other embodiments not shown, the temperature control unit has at least one Peltier element and / or heating wires.

[0092] The application unit 7 has an actuator 17 in the form of a piezo actuator. The actuator 17 serves to mechanically excite the application unit 7. The mechanical excitation simplifies the deposition of the powder portion in the printing station 6. The mechanical excitation increases the distances between individual powder particles, which reduces both the interparticle attractive forces resulting from van der Waals interaction and the electrostatic attractive forces. The mechanical excitation can be achieved in particular by applying a sine, rectangular, and / or triangular voltage, or combinations thereof, to the piezo actuator 17. The peak-to-peak voltage is, for example, between 300 volts and 500 volts. The excitation frequency is, for example, in the frequency ranges 100 Hz to 500 Hz, 1 kHz to 2 kHz, and / or 10 kHz to 18 kHz.Excitation with pulse sequences consisting of a strong pre-pulse followed by several irregular, smaller-amplitude pulses has proven particularly suitable. The peak-to-peak voltage of the pre-pulse, for example, can be approximately 1,000 volts.

[0093] In other embodiments not shown, the actuator 17 is not arranged directly on the application unit 7, but in the area of ​​the support arm 9. In yet other embodiments, mechanical excitation can also be achieved by strong acceleration using the positioning system 8.

[0094] The further design of the device 1 and its stations 3 to 6 are explained in more detail below in the context of the description of the manufacturing process 2. In Figure 3 A schematic process flow of the manufacturing process 2 is shown. The manufacturing process 2 is carried out in particular with the device 1.

[0095] In a provision step 20, the powders required for manufacturing the component, in this case, powders P1, P2, are provided. In provision step 20, design data for the component to be manufactured can also be provided, for example, by transferring them to the control unit 11.

[0096] The preparation step 20 is followed by the layer-by-layer production of the component by creating several component layers. To create a component layer, at least a portion of the powders P1, P2 is applied and solidified. The creation of the component layers is controlled by the control unit 11 and comprises the steps described below.

[0097] In an application unit charging step 21, the photoconductor layer 13 of the application unit 7 is electrostatically charged. The charging of the photoconductor layer 13 of the application unit 7 takes place in the charging station 3, as shown in Figure 4is shown by way of example. The charging station 3 comprises a charging voltage source 22, via which a corona wire 23 can be supplied with high voltage. The polarity of the voltage applied to the corona wire 23 can be set via the switches S22a, S22b, which can be controlled via the control unit 11. To charge the entire photoconductor layer 13, the corona wire 23 is adjustable along the y-direction. For the production of the first component layer, the corona wire 23 is connected to the positive pole of the charging voltage source 22. The photoconductor layer 13 is thereby positively charged, for example to a potential of 600 volts.

[0098] In other embodiments not shown, charging units that operate differently, in particular charging units based on the principle of gas discharge, can be used instead of the corona wire 23. In one advantageous embodiment, a scorotron is used to charge the photoconductor layer 13.

[0099] The application unit charging step 21 is followed by an exposure step 24. The exposure step 24 is carried out using the exposure station 4, as shown in Fig. 5is shown schematically. The exposure station 4 has an exposure device 25 for the selective exposure of the photoconductor layer 13. To generate the radiation 27 required for this purpose, the exposure device 25 has a light-emitting diode 26. With the help of the illumination device 25, the radiation 27 is selectively irradiated onto the areas of the photoconductor layer 13 to be exposed. The areas of the photoconductor layer 13 irradiated with the radiation 27 become temporarily conductive, so that the electrostatic charge generated in the application unit charging step 21 flows away locally. The selective irradiation selectively discharges the photoconductor layer 13 of the application unit 7. When using a photoconductor layer 13 made of arsenic(III) selenide, the use of radiation 27 with a wavelength of 613 nm has proven particularly suitable. The exposure time is preferably adapted to the level of the powder charge.Example exposure times range from 10 ms to 300 ms. The selective irradiation and discharge of the photoconductor layer 13 defines the areas to which powder particles will adhere in a later development step and be transferred into the build space of the printing station 6. The selective exposure thus defines a contour of the component in the component layer to be created.

[0100] A development step 28 is carried out at the development station 5. The development step 28 is divided into a powder charging step 29 and a powder receiving step 30, which are described below with respect to the Figures 6 and 7 respectively.

[0101] The development station 5 has a grounded base surface 31. From the powder reservoir R1, a powder portion A1 of the powder P1 is applied to the base surface 31 in the form of a layer of powder particles. A powder portion A1 is electrostatically charged using a powder charging device 32. The powder charging device 32 has a voltage source 33 connected to a corona wire 34. The corona wire 34 can be subjected to a high voltage using the voltage source 33. The polarity of the voltage applied to the corona wire 34 can be changed using switches S33a, S33b. To electrostatically charge the powder portion A1, the corona wire 34 is guided in the y-direction over the powder layer applied to the base layer 31. The corona wire 34 can also be positioned in the z-direction to ensure optimal adaptation to the powder P1 used, in particular the size of the powder particles.Depending on the switch position of switches S33a and S33b, the corona wire 34 and thus the powder portion A1 are charged with different polarities. In the case shown in . Figure 6 In the powder charging step 29 shown for producing the first component layer, the powder is charged with a positive voltage, for example. The powder is charged to a potential between 400 volts and 1,000 volts, for example.

[0102] The powder charging step 29 can take place in parallel with the application unit charging step 21 and / or the exposure step 24.

[0103] In other embodiments, other charging units, particularly gas-discharge-based charging units, can be used instead of the corona wire 34. Instead of the corona wire 34, a scorotron can be used, which allows for a more precise adjustment of the desired surface potential.

[0104] In the powder pick-up step 30, the powder portion A1 is picked up by the application unit 7. For this purpose, the application unit 7 is moved to the development station 5. For the sake of clarity, Fig. 7 The powder charging device 32 of the development station 5 is not shown. The application unit 7 is also advanced in the z-direction to pick up the powder portion A1. The advancement occurs in such a way that a distance d remains between the photoconductor layer 13 of the application unit 7 and the surface of the charged powder portion A1. The powder portion A1 is picked up without contact. The distance d is selected depending on the mass of the powder particles and their electrostatic charge. The distance d can, for example, be between 1 mm and 8 mm.

[0105] To absorb the powder portion A1, the base body 12 of the application unit 7 is subjected to a receiving voltage by means of the application unit's voltage source 14. The receiving voltage has a polarity opposite to the charge of the powder portion A1 and thus supports the electrostatic attraction of the powder particles. In this case, the photoconductor layer 13 is positively charged in the unexposed areas. The powder portion A1 is also positively charged. The unexposed areas of the photoconductor layer 13 locally reduce the attractive force on the powder particles generated by the receiving voltage. The receiving voltage, the electrostatic charge of the photoconductor layer 13, and the electrostatic charge of the powder portion A1 are coordinated in such a way that only powder particles of the powder portion A1 are attracted to and adhere to previously exposed and thus discharged areas of the photoconductor layer 13.Depending on the polarity, a suitable input voltage can be, for example, between -100 V and -300 V or between 100 V and 300 V.

[0106] A powder portion image in which powder particles adhere to previously exposed and discharged areas of the photoconductor layer 13 is referred to as "discharged area development." Alternatively, it is also possible to charge the photoconductor layer 13 and the powder portion A1 with opposite polarity. The charged areas of the photoconductor layer 13 that were not discharged by exposure then have an attractive effect on the powder particles charged with opposite polarity. In some cases, the powder particles adhere only in the unexposed areas. This procedure is referred to as "charged area development."

[0107] After absorption of the powder portion A1 in the previously exposed areas of the photoconductor layer 13, a transfer step 35 is carried out to transfer the powder from the development station 5 to the printing station 6.

[0108] In the transfer step 35, the powder portion A1 is transported to the printing station 6 with the aid of the application unit 7 by moving the application unit 7 into the printing station 6. During the transfer from the development station 5 to the printing station 6, the base body 12 of the application unit 7 is subjected to a holding voltage corresponding to the receiving voltage. The powder portion A1 adhering to the application unit 7 is preheated with the aid of the temperature control unit 15. The preheating takes place to a temperature T that is just below the melting temperature TS of the powder portion A1, preferably to a temperature within the quasi-isothermal process window. This adapts the temperature of the powder portion A1 to be transferred to the temperature prevailing at the printing station 6.

[0109] At the printing station 6, a printing step 36 takes place. In the printing step 36, the powder portion A1 is transferred by means of the application unit 7 onto an application surface F. For this purpose, the powder portion A1 is deposited onto the application surface F. The printing station 6 and the printing step 36 are described below with reference to Figure 8 explained in more detail.

[0110] The printing station 6 forms a build space 37 with a build platform 38. During the production of the first component layer, the surface of the build platform 38 facing the application unit 7 forms the application surface F. A surface normal N of the application surface F is oriented parallel to the z-direction.

[0111] The build chamber 37 can be filled with air or a protective gas. Suitable protective gases include, for example, nitrogen and / or a noble gas, particularly argon.

[0112] The printing station 6 has a transfer structure 39. The transfer structure 39 has a transfer frame made up of four copper rods 40 arranged in a frame. The copper rods 40 are cylindrical and each have a diameter of 0.8 mm, for example. The copper rods 40 are welded together at their ends, thus forming a square transfer frame. The transfer frame has a side length that exceeds the side length of the application unit 7, in particular its base body 12. In the xy plane, the transfer structure 39 is therefore arranged circumferentially around the application unit 7. The copper rods 40 and thus the transfer structure 39 are grounded.

[0113] The transfer structure 39 is displaceable in the direction of the surface normal N of the application surface F. The transfer structure 39 is thus displaceable in the z-direction.

[0114] The application unit 7 is positioned above the application surface F and advanced in the z-direction. This sets a distance D between the powder particles adhering to the photoconductor layer 13 and the application surface F. The distance D can be selected appropriately for the contactless deposition of the powder particles of powder portion A1, particularly taking into account the charge of the powder particles and their mass. An exemplary distance D is between 1 mm and 8 mm.

[0115] The transfer structure 39 is arranged with the copper rods 40 in the direction of the surface normal N, i.e., in the z-direction, between the application surface F and the application unit 7. The transfer structure 39 is positioned in the z-direction such that a distance between the copper rods 40 and the application surface F essentially corresponds to the particle diameter of the powder particles of the powder portion A1.

[0116] To deposit the powder portion A1, the voltage applied to the base body 12 of the application unit 7 is reversed. The base body 12 is therefore subjected to a deposition voltage corresponding to the polarity of the charge of the powder portion A1. An electric field E, also referred to as a transfer field, forms between the voltage-applied base body 12 and the grounded transfer structure 39. The application unit 7 is mechanically excited by the actuator 17 to overcome interparticle attractive forces between the powder particles and the photoconductor layer 13. The powder particles of the powder portion A1 detach from the photoconductor layer 13 and are deposited along the transfer field E onto the application surface F.

[0117] The powder portion A1 thus applied to the application surface F is solidified. For this purpose, the polymer powders used in the illustrated embodiment are melted by heating the build space 37 to a temperature above the melting temperature TS of the powder P1. The printing station 6 has a heating device 41 for heating the build space 37. The heating device 41 comprises, for example, radiant heaters and / or lasers, in particular CO2 lasers and / or thulium lasers.

[0118] In further embodiments, the printing station has lasers for selectively melting the applied powder components. The lasers can be part of the heating device. In particular, the heating device has radiant heaters for preheating the powder and lasers for selectively melting the powder. This is particularly advantageous for processing different powders with very different melting temperatures. In the case of high-melting powders, lasers can also be present for preheating and melting the powder. When processing a low-melting powder and a high-melting powder, the radiant heater can be used to preheat the low-melting powder, a first laser can be used to preheat the high-melting powder, and a second laser can be used to homogeneously melt the respective powders.

[0119] Ceramic and / or metallic powders have significantly higher melting temperatures than polymer powders. Correspondingly higher temperatures are required for thermal solidification. Solidification of metallic and / or ceramic powders is therefore often achieved through selective energy input, for example, through selective laser beam sintering and / or electron beam melting. Preheating of the metallic and / or ceramic powders may be necessary. Since this frequently requires high temperatures, for example, up to 600°C, there is a risk of damage to the photoconductor layer. Metallic and / or ceramic powders are therefore often applied at room temperature. Solidification is then achieved, for example, by irradiating a correspondingly higher energy input for selective melting. Higher laser intensities and / or different wavelengths can be advantageous for this.

[0120] Solidification of the applied powder components can be achieved alternatively or additionally by non-thermal methods, such as binder jetting. In particular, solidification by binder jetting involves additively manufacturing a green part of the component to be manufactured, which is then debindered in a subsequent step and sintered to form the finished component.

[0121] After application of the powder portion A1, an erasure step 42 follows. In the erasure step 42, any remaining charges on the photoconductor layer 13 of the application unit 7 are erased by exposing the entire surface to radiation 27. The erasure step 42 is carried out using the exposure station 3. Exposure times of approximately 100 ms, for example, can be used to erase the charges.

[0122] The applied powder portion A1 forms a first component layer B1. To apply further component layers, the above steps are repeated, as shown in Fig. 3is indicated by the repetition loop 43. In manufacturing method 2, the powder components used to produce successive component layers are electrostatically charged with different polarities. For this purpose, the polarity of the voltage source 33 of the powder charging unit 32 is reversed using switches S33a, S33b to charge the powder components for different component layers. Accordingly, the pickup voltage, holding voltage, and deposition voltage are applied to the base body 12 of the application unit 7 with appropriately adjusted polarity. For this purpose, the voltage application to the base body 12 is controlled accordingly using switches S14a, S14b of the application unit voltage source 14 during the production of successive component layers. During the application of the powder components, the photoconductor layer 13 of the application unit 7 is charged with the same polarity each time.The alternately charged powder portions are then picked up and held alternately in the charged and discharged areas of the photoconductor layer 13 by means of black and white writing. This procedure has the advantage that common photoconductor layers, each of which can only be charged with one polarity, can be used to apply powder portions with different polarities.

[0123] The alternating charging of the powder components to create successive component layers prevents detrimental charge accumulation in the component being manufactured. Electrostatic repulsion between the powder particles is reduced. Rather, the charging of the powder components with alternating polarity causes the powder components of successive component layers to electrostatically attract each other. This increases the stability of the component layers during production. Furthermore, the packing density of the powder particles is increased during production. The manufactured component exhibits increased density and improved mechanical properties.

[0124] In Fig. 9 The production of a further component layer B2 by applying a powder portion A2 is shown as an example. Figure 9concerns the printing step in printing station 6. The previously applied and solidified component layer B1 forms the application area F for the powder portion A2. The powder portion A2 is in Fig. 9 already deposited on the application surface F. The powder portion A2 is charged with a polarity opposite to that of the powder portion A1. Accordingly, the application unit voltage source 14 for generating the deposition voltage is reversed compared to the previous printing step. To generate the deposition voltage, the base body 12 of the application unit 7 is subjected to a voltage of negative polarity. Accordingly, the electric transfer field E has an opposite direction.

[0125] Due to the ability of the application unit 7 to be displaced in the z-direction, a desired distance D between powder particles adhering to the application unit 7 and the application surface F can be maintained, regardless of the height of the component layers already created. Likewise, the ability of the transfer structure 39 to be displaced in the z-direction allows the position of the transfer device 39 to be adjusted to the height of the component layers already created. By appropriately positioning the transfer structure 39 relative to the application unit 7, the strength of the transfer field E can be adjusted independently of the component height already created.

[0126] In Fig. 10 The creation of another component layer B3 is shown as an example. Fig. 10shows the printing station 6 after the deposition of a powder portion A3 onto the already produced component layers B1, B2. The surface of the last produced component layer B2 forms the application area F for the application of the powder portion A3. The powder portion A3 consists of the powder P2. The component layer B3 is therefore made of a different material than the already produced component layers B1, B2. While the corresponding powder portions A1, A2 were applied over the entire surface to produce the component layers B1, B2, the powder portion A3 is applied selectively.

[0127] In subsequent process steps, an additional powder portion can be applied to areas of component layer B3 where powder portion A3 is not applied. This allows different powder portions, and thus different materials, to be combined within a component layer. Different powder portions used to produce the same component layer are charged with the same polarity.

[0128] In the illustrated embodiment, all powder components of a component layer are charged with the same polarity. The powder components of different component layers are charged with alternating polarities. A powder component to be applied to a subsequent component layer is charged with a polarity opposite to the polarity of the respective application surface, i.e., the polarity of the previously applied component layer. This results in a particularly advantageous electrostatic attraction between successive component layers. Furthermore, charge accumulation in the component being produced is reliably avoided.

[0129] In Fig. 11 Another embodiment of a development station 105, a device for additive manufacturing, is shown. Components that are related to the Figures 1 to 10shown embodiment have already been described, have the same reference numerals and will not be explained again in detail.

[0130] The development station 105 has a powder charging unit 132 for triboelectrically charging the powder components. The powder charging unit 132 is designed as a magnetic brush system. The powder component to be electrostatically charged is guided between the rollers 132a, 132b of the powder charging unit 132 and is thereby triboelectrically charged. The charged powder is applied to the grounded base plate 31 in the form of a powder layer. To charge different powder components with different polarities, two different powders P1, P2 are used, each of which is charged with a different polarity during triboelectric charging. To produce successive component layers, the powders P1, P2 are therefore used alternately so that the respective powder components are charged with different polarities.By triboelectrically charging the powders P1 and P2, powder fractions can be applied with a layer thickness of more than twice the average particle diameter of the respective powders P1 and P2. For example, layer thicknesses of between approximately 1 and approximately 5 average particle diameters can be applied.

[0131] The powders P1, P2 are, for example, powder formulations of polymer particles coated with suitable charge control substances, in particular with functionalized silica particles. The powders P1, P2 have, for example, a base powder in the form of a commercially available polymer powder. For triboelectric charging with different polarities, the base powders are each coated with different charge control substances, in particular other functionalized silica particles. For triboelectric charging with negative polarity, the base powder is coated, for example, with a mixture of hexamethyldisilazane (HMDS) and polydimethylsiloxane (PDMS). For triboelectric charging with positive polarity, the base powder is coated, for example, with a mixture of polydimethylsiloxane (PDMS) and nitrogen compounds - NR 2 and - NR 3. The proportion of functionalized silica particles is in each case between 0.05 wt.-% and 1 wt% based on the mass of the polymer.

Claims

1. Method for the additive manufacturing of a part, having the steps of - providing at least one powder (P1, P2) and - producing a plurality of part layers (B1, B2, B3) of the part to be manufactured, wherein in order to produce a part layer (B1, B2, B3) at least one powder portion (A1, A2, A3) of the at least one powder (P1, P2) is applied, wherein -- the powder portion (A1, A2, A3) is electrostatically charged, -- an application unit (7) is electrostatically charged at least in parts, and -- the electrostatically charged powder portion (A1, A2, A3) is picked up by means of application unit (7) electrostatically charged at least in parts and transferred to an application surface (F), - wherein various powder portions (A1, A2, A3) to be applied to produce the part layers (B1, B2, B3) are electrostatically charged with different polarity, characterised in that in order to transfer the powder portion (A1, A2, A3) to the application surface (F), the application unit (7) is mechanically excited by means of an actuator (17), in particular a piezo actuator, of the application unit (7).

2. Method according to claim 1, characterised in that the application unit (7) picks up and / or transfers the electrostatically charged powder portion (A1, A2, A3) in a contact-free manner.

3. Method according to one of the preceding claims, characterised in that the powder portion (A1, A2, A3) is pre-heated on the application unit (7), in particular by means of a temperature control unit (15) of the application unit (7).

4. Method according to claim 3, characterised in that the powder portion (A1, A2, A3) is pre-heated on the application unit (7) to a temperature T, for which: TS - ΔT ≤ T < TS, wherein TS is a melting temperature of the powder portion (A1, A2, A3) and ΔT is 30 °C, in particular 15 °C, in particular 10 °C, in particular 5 °C.

5. Method according to one of claims 3 or 4, characterised in that the powder portion (A1, A2, A3) is pre-heated on the application unit (7) to a temperature T, for which: TR - δT < T, wherein TR is a recrystallisation temperature of the powder portion (A1, A2, A3) and δT is 20 °C, in particular 15 °C, in particular 10 °C, in particular 5 °C, in particular 0 °C.

6. Method according to one of the preceding claims, characterised in that the application surface (F), in particular an entire installation space (37), is pre-heated to a temperature T2, for which: TR < T2, in particular TR < T2 < TS, wherein TR is a recrystallisation temperature and wherein TS is a melting temperature of the powder portions (A1, A2, A3) to be applied.

7. Method according to one of the preceding claims, characterised in that in order to transfer the powder portion (A1, A2, A3) to the application surface (F), the application unit (7) is caused to vibrate, in particular with an excitation frequency between 100 Hz and 20 kHz, preferably with an excitation frequency in the range of one of the natural frequencies of the application unit.

8. Method according to one of the preceding claims, characterised in that mechanical excitation takes place by means of a pulse sequence consisting of a strong initial pulse and irregular subsequent pulses with a smaller amplitude.

9. Method according to one of the preceding claims, characterised in that in order to transfer the powder portion (A1, A2, A3) to the application surface (F), an electrical transfer field (E) is produced between the application unit (7) and a transfer structure (39).

10. Method according to claim 9, characterised in that the application unit (7) is mechanically excited once the electrical transfer field (E) has been fully established.

11. Device for the additive manufacturing of a part, having - at least one powder reservoir (R1, R2) for storing at least one powder (P1, P2), - at least one powder charging unit (32; 132) for electrostatically charging powder portions (A1, A2, A3) and - at least one application unit (7) which can be electrostatically charged at least in parts for picking up and transferring electrostatically charged powder portions (A1, A2, A3) to an application surface (F), - wherein the at least one powder charging unit (32; 132) is designed to electrostatically charge various powder portions (A1, A2, A3) of the at least one powder (P1, P2) to produce part layers (B1, B2, B3) with different polarity, characterised in that the application unit (7) has an actuator (17) for generating mechanical excitation of the application unit (7).

12. Device according to claim 11, characterised in that the at least one application unit (7) has a temperature control unit (15) for pre-heating powder portions (A1, A2, A3) on the application unit (7).

13. Device according to claim 12, characterised in that the temperature control unit (15) has fluid channels (16) for a heat transfer fluid, which are formed in a base body (12) of the application unit (7).

14. Device according to one of claims 11 to 13, characterised in that the actuator (17) is a piezo actuator.

15. Device according to one of claims 11 to 14, characterised by a transfer structure (39) for producing an electrical transfer field (E) between the application unit (7) and the transfer structure (39).