COMPONENT CARRIER WITH HIGH PASSIVE INTERMODULATION PERFORMANCE (PIM)
Patent Information
- Application Number
- DE602019085548
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2019-04-10
- Publication Date
- 2026-06-10
- Estimated Expiration
- 2039-04-10
AI Technical Summary
The increasing miniaturization and functionality of component carriers with electronic components, along with the generation of heat and interference from high-frequency signal mixing, lead to passive intermodulation (PIM) distortions, degrading signal transmission and requiring mechanically robust and electrically reliable solutions.
A component carrier design with electrically conductive wiring structures having a smooth surface finish, low roughness, and specific patterning to suppress PIM distortions, ensuring a PIM value of less than -153 dBc, achieved through controlled surface roughness and adhesion promoters.
The solution effectively suppresses signal distortions, ensuring high signal strength and quality, particularly in high-frequency applications like 5G, by minimizing signal loss and interference.