MANUFACTURING METHOD OF A µLED LIGHT-EMPLOYING DISPLAY DEVICE WITH ONE-SIDED ELECTRICAL CONTACT AND ONE-SIDED CHARGE CARRIER INJECTION

Description

BACKGROUND OF THE INVENTION1. Technical Field

[0001] The invention relates to the field of display and light-emitting device design, in particular to a µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection, and a manufacturing method thereof.2. Description of Related Art

[0002] In the technical field of flat panel display, µLED has many advantages, and the most notable advantage is low power consumption, high brightness, ultra-high definition, high color saturation, higher response speed, longer service life and higher work efficiency and the like. It is a new transformational display technology and is expected to replace almost all applications of TFT liquid crystal display in the field of flat panel display.

[0003] The current µLED production process follows a traditional LED manufacturing method, in which a pn junction grows on the base surface by various thin film growth methods and then is cut into micro-sized LED chips. The µLED chips are transferred to a circuit substrate by various mechanical tools, and the accurate electrical contact between the µLED chips and a driving electrode needs to be achieved through accurate alignment and bonding, so the device manufacturing efficiency is low and the yield is low. In order to solve the above problems and improve the efficiency of the µLED industry, it is urgent to develop and design a new µLED.

[0004] Patent CN 104465921 A discloses a light emitting diode integrated chip of a capacitive structure and a manufacturing method of the light emitting diode integrated chip. The chip comprises an outer connecting port, a transparent electrode layer with the conductive capacity, insulating medium filling layers and light emitting source light emitting diode chips. A capacitor structure is formed through the light emitting diode chips of a certain number and the insulating medium filling layers, and two insulating medium filling layers are conductive medium layers, so that the capacitor structure is formed, and the whole structure is connected with the outer connecting port through a lead Pad point on an electrode. According to the light emitting diode integrated chip, a novel drive mode and the novel chip structure are adopted, an insulating medium material with a high dielectric constant is adopted, the chip can be directly driven by an alternating current power source, and the chip is easy to manufacture and low in cost.

[0005] Patent US 2019 / 004105 A1 discloses functional test methods useful for fabricating products containing Light Emitting Diode (LED) structures. In particular, LED arrays are functionally tested by injecting current via a displacement current coupling device using a field plate comprising of an electrode and insulator placed in close proximity to the LED array. A controlled voltage waveform is then applied to the field plate electrode to excite the LED devices in parallel for high-throughput. A camera records the individual light emission resulting from the electrical excitation to yield a function test of a plurality of LED devices. Changing the voltage conditions can excite the LEDs at differing current density levels to functionally measure external quantum efficiency and other important device functional parameters. Spectral filtering is used to improve measurement contrast and LED defect detection. External light irradiation is used to excite the LED array and improve onset of charge injection light emission and throughput.

[0006] Patent US 2015 / 380390 A1 discloses a LED package (10) suitable for capacitive driving, comprising at least one pair of anti-parallel oriented LEDs (20, 30). These LEDs are provided with electrical terminals (21, 22, 31, 32) at opposing surfaces of the LEDs. The LEDs are sandwiched between two substantially parallel oriented substrates (40, 50) of a dielectric material, which substrates are provided on their facing surfaces (41, 51) with a film (42, 52) of electrically conductive material, so that electrical contacts (61, 62) are available between the electrical terminals and the films of electrically conductive material. The LED package is cheap, technically simple, reliable and small-dimensioned, and can be applied in a LED assembly. A method for manufacturing such LED packages is claimed as well.BRIEF SUMMARY OF THE INVENTION

[0007] In view of this, the purpose of the present invention is to propose a µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection and a manufacturing method of the µLED light-emitting and display device, which avoids the complicated bonding process and is expected to improve the market competitiveness of the µLED light-emitting and display device.

[0008] The present invention is achieved using the following scheme: a manufacturing method of a µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection comprising more than one pixel unit, each pixel unit sequentially comprising a lower pixel electrode, µLED chips, an insulating layer, and an upper pixel electrode from bottom to top, wherein the µLED chips directly contact with the lower pixel electrode, external carriers are injected into the µLED chips through the lower pixel electrode, the insulating layer is set to prevent the external carriers from being injected into the µLED chips through the upper pixel electrode, and the µLED chips are lit by an alternating electric field applied between the upper pixel electrode and the lower pixel electrode; the µLED chips comprise a P-type semiconductor layer, a light-emitting layer and a N-type semiconductor layer, and the P-type semiconductor layer, the light-emitting layer and the N-type semiconductor layer are stacked to form a semiconductor junction capable of emitting light under the action of an electric field; the semiconductor junction in the µLED chips comprises a single PN junction, a single heterojunction, a composite PN junction comprising a plurality of PN junctions, or a combined semiconductor junction comprising a PN junction and a heterojunction; the manufacturing method of the µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection, comprising the following steps: S1: preparing a lower pixel electrode array and a connection wire thereof on the surface of a base plate; S2: disposing a patterned µLED chip array on the surface of the base plate of a substrate; S3: providing an insulating layer on the surfaces of the µLED chip array, the lower pixel electrode array and a connection wire thereof using an insulating layer manufacturing process; and S4: preparing an upper pixel electrode array and a connection wire thereof on the surface of the insulating layer.

[0009] Further, preferably, the semiconductor junction is located on the surface or in the inside of the µLED chips.

[0010] Further, preferably, the p-type semiconductor layer has a thickness of 1 nm-2.0 µm, the light-emitting layer has a thickness of 1 nm-1.0 µm, and the n-type semiconductor layer has a thickness of 1 nm-2.5 µm.

[0011] Further, preferably, one or more than two chips are present in each pixel unit.

[0012] Further, preferably, the size of the upper pixel electrode or the lower pixel electrode in a pixel unit is not smaller than the sum of the sizes of all the µLED chips in the pixel unit. Further, preferably, the µLED chips have a size of 1 nm to 1000 µm and a thickness of 1 nm to 100 µm.

[0013] Further, preferably, at least one of the upper pixel electrode and the lower pixel electrode is a transparent electrode, so that the two sides of the device can be completely transparent, or one side of the device is transparent and the other side of the device is non-transparent, wherein the material of the transparent electrode comprises graphene, indium tin oxide, carbon nanotubes, silver nanowires, copper nanowires or a combination thereof, and the material of a non-transparent electrode comprises gold, silver, aluminum, copper or a combination thereof.

[0014] Further, preferably, wherein the material of the insulating layer has a light transmittance of greater than or equal to 80% in a visible light range, and the material is an organic insulating material, an inorganic insulating material, air or a combination thereof.

[0015] Further, preferably, the insulating layer has a thickness of 1 nm to 1000 µm.

[0016] Further, preferably, the waveform of the alternating electric field comprises sine wave, triangle wave, square wave, pulse or a combination thereof.

[0017] Preferably, the alternating electric field has a frequency of 1 Hz to 1000 MHz.

[0018] Further, preferably, the µLED chips emit light (comprising infrared light or ultraviolet light) of different colors by selecting different semiconductor materials.

[0019] Further, preferably, the µLED chips can emit light of the same color or light of different mixed colors by using a composite PN junction or a combined semiconductor junction. Further, preferably, the µLED light-emitting and display device is prepared on a rigid material comprising glass, ceramics and sapphire or prepared on a flexible material comprising PI.

[0020] Further, preferably, S2 specifically comprises: arranging µLED chips emitting light of different colors on the surface of the base plate of the substrate by means of inkjet printing, silk-screen printing, spin coating, brush coating, roll coating, chemical self-assembly, electromagnetic self-assembly and the like.

[0021] Further, preferably, S2 specifically comprises: disposing a patterned µLED chip array on the surface of the base plate of the substrate using an in-situ growth method.

[0022] Compared with the prior art, the present invention has the following beneficial effects: the µLED of the present invention utilizes electron-hole recombination to generate radiative transition, only single-ended electrical contact exists between the n-type semiconductor layer and p-type semiconductor layer of the µLED chips of the present invention and the external driving electrode and no bonding is required, which differs from a traditional µLED device. Therefore, the µLED device proposed by the present invention avoids the complicated bonding process, can shorten the manufacturing cycle of the µLED light-emitting and display screen and improve the yield, and is expected to greatly improve the market competitiveness of the µLED.BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

[0023] FIG. 1 is a cross-section structural diagram of a pixel unit of a µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection according to an embodiment of the present invention. FIG. 2 is a cross-section structural diagram of a pixel unit of a µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection according to another embodiment of the present invention. FIG. 3 is a schematic diagram of a manufacturing process of the pixel unit in FIG. 1. FIG. 4 is another pixel unit and a manufacturing process thereof according to an embodiment of the present invention.

[0024] In the drawings, 1 is the lower base plate, 101 is the patterned lower pixel electrode arranged on the surface of the lower base plate, 102 is the injection electrode, 2 is the upper base plate, 201 is the patterned upper pixel electrode arranged on the surface of the upper base plate, 202 is the insulating layer, 3 is the µLED chips, 301 is the P-type semiconductor layer, 302 is the N-type semiconductor layer, 303 and 304 are light-emitting layers, and 305 is the P-type semiconductor layer.DETAILED DESCRIPTION OF THE INVENTION

[0025] The present invention will be further described below with reference to the drawings and the embodiments.

[0026] It should be noted that the following detailed description is exemplary and intended to provide further explanation of the present application. Unless otherwise defined, all technical and scientific terms used herein have the same meanings as those commonly understood by those skilled in the art.

[0027] It should be noted that the terms used herein are only intended to describe specific embodiments, and not intended to limit the exemplary embodiments according to the present application. As used herein, unless it is clearly indicated otherwise in the context, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprises" and / or "comprising" are used in the present specification, they indicate the presence of features, steps, operations, devices, components and / or a combination thereof.

[0028] The present embodiment provides a µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection comprising more than one pixel unit, and each pixel unit sequentially comprises a lower pixel electrode, µLED chips, an insulating layer, and an upper pixel electrode from bottom to top, wherein the µLED chips directly contact with the lower pixel electrode, external carriers are injected into the µLED chips through the lower pixel electrode, the insulating layer prevents the external carriers from being injected into the µLED chips through the upper pixel electrode, and the µLED chips are lit by an alternating electric field applied between the upper pixel electrode and the lower pixel electrode.

[0029] In this embodiment, the µLED chips comprise a P-type semiconductor layer, a light-emitting layer and a N-type semiconductor layer, and the P-type semiconductor layer, the light-emitting layer and the N-type semiconductor layer are stacked to form a semiconductor junction capable of emitting light under the action of an electric field.

[0030] In this embodiment, the semiconductor junction in the µLED chips comprises a single PN junction, a single heterojunction, a composite PN junction comprising a plurality of PN junctions, or a combined semiconductor junction comprising a PN junction and a heterojunction.

[0031] In this embodiment, the semiconductor junction is located on the surface or in the inside of the µLED chips.

[0032] In this embodiment, the p-type semiconductor layer has a thickness of 1 nm-2.0 µm, the light-emitting layer has a thickness of 1 nm-1.0 µm, and the n-type semiconductor layer has a thickness of 1 nm-2.5 µm.

[0033] In this embodiment, one or more than two chips are present in each pixel unit.

[0034] In this embodiment, the size of the upper pixel electrode or the lower pixel electrode in a pixel unit is not smaller than the sum of the sizes of all the µLED chips in the pixel unit.

[0035] In this embodiment, the µLED chips have a size of 1 nm to 1000 µm and a thickness of 1 nm to 100 µm.

[0036] In this embodiment, at least one of the upper pixel electrode and the lower pixel electrode is a transparent electrode, so that the two sides of the device can be completely transparent, or one side of the device is transparent and the other side of the device is non-transparent, wherein the material of the transparent electrode comprises graphene, indium tin oxide, carbon nanotubes, silver nanowires, copper nanowires or a combination thereof, and the material of a non-transparent electrode comprises gold, silver, aluminum, copper or a combination thereof.

[0037] In this embodiment, the material of the insulating layer has a light transmittance of greater than or equal to 80% in a visible light range, and the material is an organic insulating material, an inorganic insulating material, air or a combination thereof.

[0038] In this embodiment, the insulating layer has a thickness of 1 nm to 1000 µm.

[0039] In this embodiment, the waveform of the alternating electric field comprises sine wave, triangle wave, square wave, pulse or a combination thereof. The alternating electric field has a frequency of 1 Hz to 1000 MHz.

[0040] In this embodiment, the µLED chips emit light (comprising infrared light or ultraviolet light) of different colors by selecting different semiconductor materials.

[0041] In this embodiment, the µLED chips can emit light of the same color or light of different mixed colors by using a composite PN junction or a combined semiconductor junction.

[0042] In this embodiment, the µLED light-emitting and display device is prepared on a rigid material comprising glass, ceramics and sapphire or prepared on a flexible material comprising PI.

[0043] As shown in FIG. 1, FIG. 1 is a cross-section schematic diagram of a first pixel unit structure according to the present embodiment, wherein the µLED chips have a single semiconductor junction with a structure of p-type semiconductor material-multiple quantum well-n-type semiconductor material. The µLED3, e.g., a GaN-based LED formed by an epitaxial method, comprises a N-type doped GaN layer 302, a P-doped GaN layer 301 and a multiple-quantum-well light-emitting layer 303. The µLED3 has a plane size of 20 µm × 20 µm.

[0044] The µLED3 is arranged on the surface of the lower pixel electrode 101, the insulating layer 202 is arranged on the surface of the µLED3, the upper pixel electrode 201 is arranged on the surface of the insulating layer 202, the upper pixel electrode is indium tin oxide, and the sizes of the lower pixel electrode 101 and the upper pixel electrode 201 are both 60 µm × 60 µm.

[0045] The insulating layer 202 has a thickness of 100 nm, and the insulating layer 202 is aluminum oxide.

[0046] When an alternating current signal is applied between the lower pixel electrode 101 and the upper pixel electrode 201, the µLED3 can emit light.

[0047] As shown in FIG. 2 , FIG. 2 is a cross-section schematic diagram of a second pixel unit structure according to the present embodiment. The µLED chips have a compound semiconductor junction with a structure of p-type semiconductor material-multiple quantum well-n-type semiconductor material-multiple quantum well-p-type semiconductor material. The µLED3, e.g., a GaN-based LED which is formed by an epitaxial method and has a semiconductor junction structure, comprises: a P-doped GaN layer 305, a N-doped GaN layer 302, a P-doped GaN layer 301, and multiple-quantum-well light-emitting layers 303 and 304. The µLED3 has a plane size of 20 µm × 20 µm.

[0048] The µLED3 is arranged on the surface of the lower pixel electrode 101, the insulating layer 202 is arranged on the surface of the µLED3, the upper pixel electrode 201 is arranged on the surface of the insulating layer 202, the upper pixel electrode is indium tin oxide, and the sizes of the lower pixel electrode 101 and the upper pixel electrode 201 are both 60 µm × 60 µm.

[0049] The insulating layer 202 has a thickness of 100 nm, and the insulating layer 202 is aluminum oxide.

[0050] When an alternating current signal is applied between the lower pixel electrode 101 and the upper pixel electrode 201, the µLED3 can emit light.

[0051] The present embodiment also provides a manufacturing method of a µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection, comprising the following steps: S1: preparing a lower pixel electrode array and a connection wire thereof on the surface of a base plate; S2: disposing a patterned µLED chip array on the surface of the base plate of a substrate; S3: providing an insulating layer on the surfaces of the µLED chip array, the lower pixel electrode array and a connection wire thereof using an insulating layer manufacturing process; and S4: preparing an upper pixel electrode array and a connection wire thereof on the surface of the insulating layer.

[0052] The operation of the µLED device is achieved by applying an AC driving signal to the upper pixel electrode array and the lower pixel electrode array.

[0053] In this embodiment, S2 specifically comprises: arranging µLED chips emitting light of different colors on the surface of the base plate of the substrate by means of inkjet printing, silk-screen printing, spin coating, brush coating, roll coating, chemical self-assembly, electromagnetic self-assembly and the like.

[0054] In this embodiment, S2 specifically comprises: disposing a patterned µLED chip array on the surface of the base plate of the substrate using an in-situ growth method.

[0055] In particular, specifically as shown in FIG. 3, FIG. 3 shows a device manufacturing method using the pixel unit of FIG. 1, wherein the µLED chips of the µLED light-emitting and display device are arranged on the surface of the lower base plate 1 by means of a transfer method, and the manufacturing method comprises the following steps: (1) the µLED3 is, for example, a GaN-based LED which is formed by an epitaxial method and comprises a N-type doped GaN layer 302, a P-doped GaN layer 301 and a multiple-quantum-well light-emitting layer 303. Peeling is conducted to obtain self-supporting µLED chips. The µLED3 has a plane size of 20 µm × 20 µm. (2) A lower pixel electrode 101 array and a connection wire thereof are prepared on the surface of a lower base plate 1 by electron beam evaporation and lithography, the lower pixel electrode 101 is indium tin oxide, and the lower pixel electrode 101 has a size of 60 microns × 60 microns. (3) The µLED3 is transferred to the surface of the lower pixel electrode 101 using a µLED array manufacturing technology.

[0056] Optionally, the µLED array manufacturing technology comprises inkjet printing, screen printing, spin coating, brush coating, roll coating, chemical self-assembly, electromagnetic self-assembly, and the like. (4) An aluminum oxide insulating layer 202 is deposited on the surface of the base plate provided with a µLED3 array and a lower pixel electrode array by an atomic layer deposition process, and the insulating layer 202 has a thickness of 500 nm. (5) The upper pixel electrode 201 array and a connection wire thereof are prepared on the surface of the insulating layer by electron beam evaporation and photolithography.

[0057] In particular, the present embodiment also provides another µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection, wherein the µLED chips are grown on the surface of the lower base plate 1 in situ, and the material of the lower base plate can be but not limited to sapphire, silicon, etc., wherein the µLED3 chips are leaked out of a n-type GaN mesa, and the n-type GaN serves as the lower pixel electrode 101. The manufacturing method specifically comprises the following steps: (1) a GaN-based µLED3 array is grown on the surface of the lower base plate 1 by an epitaxial method and photolithography, and comprises a N-doped GaN layer 302, a P-doped GaN layer 301 and a multiple-quantum-well light-emitting layer 303. The µLED3 has a plane size of 20 µm × 20 µm. The µLED3 is leaked out of the n-type GaN mesa, and the n-type GaN serves as the lower pixel electrode 101; (2) an injection electrode 102 is prepared on the surface of the lower base plate 1 by electron beam evaporation and photolithography, and the injection electrode 102 is electrically connected with the N-type GaN mesa (the lower pixel electrode). (3) An aluminum oxide insulating layer 202 is deposited on the surface of the base plate provided with the µLED3 array and the injection electrode 102 by an atomic layer deposition process, and the insulating layer 202 has a thickness of 500 nm. (4) The upper pixel electrode 201 array and a connection wire thereof are prepared on the surface of the insulating layer by electron beam evaporation and photolithography.

[0058] The above are only preferred embodiments of the present invention, and are not intended to limit the present invention in other forms. Any person skilled in the art may change or modify the technical content disclosed above into an equivalent embodiment with equivalent changes. However, any simple modifications, equivalent changes and modifications made to the above embodiments according to the technical essence of the present invention without departing from the content of the technical solution of the present invention as defined in the appended claims still fall within the protection scope of the technical solution of the present invention.

Claims

1. A manufacturing method of a µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection, comprising more than one pixel unit, each pixel unit sequentially comprising a lower pixel electrode (101), µLED chips (3), an insulating layer (202), and an upper pixel electrode (201) from bottom to top, wherein the µLED chips (3) directly contact with the lower pixel electrode (101) , external carriers are injected into the µLED chips (3) through the lower pixel electrode (101), the insulating layer (202) is set to prevent the external carriers from being injected into the µLED chips (3) through the upper pixel electrode (201), and the µLED chips (3) are lit by an alternating electric field applied between the upper pixel electrode (201) and the lower pixel electrode (101); the µLED chips (3) comprise a P-type semiconductor layer (301), a light-emitting layer and a N-type semiconductor layer (302), and the P-type semiconductor layer (301), the light-emitting layer and the N-type semiconductor layer (302) are stacked to form a semiconductor junction capable of emitting light under the action of an electric field; the semiconductor junction in the µLED chips (3) comprises a single PN junction, a single heterojunction, a composite PN junction comprising a plurality of PN junctions, or a combined semiconductor junction comprising a PN junction and a heterojunction; the manufacturing method of the µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection, comprising the following steps: S1: preparing a lower pixel electrode (101) array and a connection wire thereof on the surface of a base plate; S2: disposing a patterned µLED chip (3) array on the surface of the base plate of a substrate; S3: providing an insulating layer (202) on the surfaces of the µLED chip array, the lower pixel electrode array and a connection wire thereof using an insulating layer manufacturing process; and S4: preparing an upper pixel electrode (201) array and a connection wire thereof on the surface of the insulating layer (202).

2. The manufacturing method of the µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection according to claim 1, wherein the semiconductor junction is located on the surface or in the inside of the µLED chips (3).

3. The manufacturing method of the µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection according to claim 1, wherein the p-type semiconductor layer (301) has a thickness of 1 nm-2.0 µm, the light-emitting layer has a thickness of 1 nm-1.0 µm, and the n-type semiconductor layer (302) has a thickness of 1 nm-2.5 µm.

4. The manufacturing method of the µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection according to claim 1, wherein one or more than two µLED chips (3) are present in each pixel unit.

5. The manufacturing method of the µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection according to claim 4, wherein the size of the upper pixel electrode (201) or the lower pixel electrode (101) in a pixel unit is not smaller than the sum of the sizes of all the µLED chips (3) in the pixel unit.

6. The manufacturing method of the µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection according to claim 1, wherein the µLED chips (3) have a size of 1 nm to 1000 µm and a thickness of 1 nm to 100 µm.

7. The manufacturing method of the µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection according to claim 1, wherein at least one of the upper pixel electrode (201) and the lower pixel electrode (101) is a transparent electrode, and wherein the material of the transparent electrode comprises graphene, indium tin oxide, carbon nanotubes, silver nanowires, copper nanowires or a combination thereof, and the material of a non-transparent electrode comprises gold, silver, aluminum, copper or a combination thereof.

8. The manufacturing method of the µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection according to claim 1, wherein the material of the insulating layer (202) has a light transmittance of greater than or equal to 80% in a visible light range, and the material is an organic insulating material, an inorganic insulating material, air or a combination thereof.

9. The manufacturing method of the µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection according to claim 1, wherein the insulating layer (202) has a thickness of 1 nm to 1000 µm.

10. The manufacturing method of the µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection according to claim 1, wherein the waveform of the alternating electric field comprises sine wave, triangle wave, square wave, pulse or a combination thereof.

11. The manufacturing method of the µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection according to claim 1, wherein the alternating electric field has a frequency of 1 Hz to 1000 MHz.

12. The manufacturing method of the µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection according to claim 1, wherein the µLED chips (3) emit light (comprising infrared light or ultraviolet light) of different colors by selecting different semiconductor materials.

13. The manufacturing method of the µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection according to claim 1, wherein the µLED chips (3) can emit light of the same color or light of different mixed colors by using a composite PN junction or a combined semiconductor junction.

14. The manufacturing method of the µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection according to claim 1, wherein the µLED light-emitting and display device is prepared on a rigid material comprising glass, ceramics and sapphire or prepared on a flexible material comprising PI.

15. The manufacturing method of the µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection according to claim 1, wherein S2 specifically comprises: arranging µLED chips (3) emitting light of different colors on the surface of the base plate of the substrate by means of inkjet printing, silk-screen printing, spin coating, brush coating, roll coating, chemical self-assembly, electromagnetic self-assembly and the like.

16. The manufacturing method of the µLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection according to claim 1, wherein S2 specifically comprises: arranging a patterned µLED chip array on the surface of the base plate of the substrate using an in-situ growth method.