METHOD AND DEVICE FOR PREPARING PLATES FOR THE TREATMENT OF ARTICLES OF THE PAPER PROCESSING INDUSTRY
Patent Information
- Authority / Receiving Office
- DE · DE
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2022-08-04
- Publication Date
- 2026-04-08
AI Technical Summary
Existing methods for preparing plates in the paper processing industry face challenges such as non-uniform fusion of powder layers, leading to irregularities and inefficiencies in producing treating profiles, which are time-consuming and costly due to the need for curing procedures and high precision requirements.
A method using selective laser sintering with continuous-wave mode scans to uniformly premelt and sinter polymeric powder layers on a roughened support surface, eliminating the need for preheating and ensuring precise, uniform distribution and retention of powder, thereby enhancing production efficiency and precision.
The method achieves high precision and flexibility in producing treating profiles with improved uniformity and reduced time, avoiding irregularities between layers and eliminating the need for costly curing processes.