Quadrature coupler

Abstract

A quadrature coupler having: a pair of overlying strip conductors separated by a first dielectric layer to provide a coupling region between the coupling region of overlying strip conductors; a pair of opposing ground pads, the coupling region being disposed between the pair of opposing ground pads; a second dielectric layer disposed over the coupling region and between the pair of opposing ground pads; and an electrically conductive shield layer disposed over the second dielectric layer, extending over opposing sides of the dielectric layer and onto the pair of opposing ground pads. Portions of coupler are formed by printing or additive manufacturing.

Description

TECHNICAL FIELD

[0001] This disclosure relates generally to quadrature hybrid couplers.BACKGROUND

[0002] As is known in the art, quadrature couplers are used in a variety of microwave circuits to split an input signal into a pair of output signals, usually with equal magnitudes, that are ninety degrees apart in phase. Examples of such quadrature couplers are an embedded stripline broadside coupler or a topside quadrature coupler, such as a Lange or hybrid (branchline) splitter. One use of quadrature couplers is to impedance match pairs of devices. The devices are arranged so that reflections from them are terminated in a load that is isolated from the quadrature coupler's input because of the 90 degree (quadrature) phase difference.

[0003] As is also known in the art, prior art quadrature couplers are integrated into a larger board that has many functions. As such, the design such as the degree of coupling, is not easy alterable. An internal coupling structure in surface mount coupler is known from CN101958450A. A HF coupler or Hf power splitter, especially a narrow-band and / or 3dB coupler or power splitter is known from US2009 / 0051462A1. A strip line coupler is known from JPH08084007A. Quasi-ideal multilayer two- and three-strip dimensional couplers for monolithic and hybrid MIC's are known from K Sachse ET AL, "Quasi-ideal multilayer two-and three-strip dimensional couplers for monolithic and hybrid MICs", IEEE Transactions on Microwave Theory and Techniques, doi:10.1109 / 22.788525, (19990101), pages 1873-1882.

[0004] US 2005 / 017821A describes a multilayer coupled-lines directional coupler of the quarter wavelength type that comprises a first, a second and a third conductive layer, joined by means of dielectric layers. The first conductive layer comprises a first and a second conductive strip, separated, mutually parallel, each in one end connected to a first output and in another end connected to a second output. The second conductive layer comprises a third conductive strip, parallel to the first and the second conductive strip, in one end connected to a third output and in another end connected to a fourth output. The first conductive layer comprises a fourth conductive strip, parallel to and located between the first and the second conductive strip, in one end connected to the third output, and in another end connected to the fourth output.SUMMARY

[0005] There is provided, according to the present invention, a quadrature coupler according to claim 1. Further embodiments are provided in the dependent claims.

[0006] With such an arrangement, the shield provides improved electrical isolation for the coupling region.

[0007] In one embodiment, portions of the coupler are formed by printing or additive manufacturing.

[0008] With such an arrangement, printing or additive manufacturing enables the coupler strip conductor widths and hence the degree of coupling between the pair of strip conductors to be adjusted, or tuned, while the coupler is still on a board having multiple functionality.

[0009] In one embodiment, a directional coupler includes a second pair of ground pads, the coupling region being disposed between the second pair of ground pads, and the first-mentioned pair of ground pads. The first-mentioned pair of ground pads and the second pair of ground pads are disposed along perpendicular lines. The electrically conductive shield layer is disposed over a second pair of opposing sides of the dielectric layer and onto the second pair of ground pads.

[0010] There is also provided a method for tuning a quadrature coupler according to claim 8.

[0011] The details of one or more embodiments of the disclosure are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the disclosure will be apparent from the description and drawings, and from the claims.DESCRIPTION OF DRAWINGS

[0012] FIGS. 1A-1C through 5A-5C are diagrammatical plan, perspective, and cross sectional views of a quadrature coupler according to the disclosure at various stages in the fabrication thereof; FIGS. 1B and 1C being taken along lines 1B-1B and 1C-1C, respectively in FIG. 1A; FIGS. 2B and 2C being taken along lines 2B-2B and 2C-2C, respectively in FIG. 2A; FIGS. 3B and 3C being taken along lines 3B-3B and 3C-3C, respectively in FIG. 3A; FIG. 3D being a perspective view of a region indicated as 3D-3D in FIG. 2A; FIGS. 4B and 4C being taken along lines 4B-4B and 4C-4C, respectively in FIG. 4A; FIGS. 5B and 5C being taken along lines 5B-5B and 5C-5C, respectively in FIG. 5A; and FIGS. 5A-5C being diagrammatical plan and cross sectional views of the completed quadrature coupler according to the disclosure; and FIG. 6A and 6B are flow charts of steps used in the process used to fabricate the quadrature coupler of FIGS. 5A-5C.

[0013] Like reference symbols in the various drawings indicate like elements.DETAILED DESCRIPTION

[0014] Referring now to FIGS 1A, 1B and 1C, a dielectric substrate 12 is shown having: a first metal layer 14 disposed on an upper surface of the substrate 12; and a ground plane conductor 13, here for example gold, is disposed on a bottom surface of the substrate 12. The first metal layer 14 is patterned to provide: a two pairs of ground pads; pair 16a 1 , 16a 2 , and pair 16b 1 , 16b 2 , respectively, as shown; a first lower strip conductor 18, spaced from the pair of ground pads, having: an input at first end 18 I , an output at a second end 18 O ; and, a coupling region 20 disposed between the first end 18 I , the second end 18 O , and between the two pairs on ground pads 16a 1 , 16a 2 , and pair 16b 1 , 16b 2 , respectively, as shown; a second lower strip conductor 22 having: an input end 22 I and an output end 22 O ; and, a third lower strip conductor 24 having an input end 24 I and an output end 24 O , as shown. The first metal layer 14 may be printed, formed using additive manufacturing, or formed using conventional photolithographic-etching processing, as used in forming printed circuit boards, for example.

[0015] Referring now to FIGS. 2A-2C, a first dielectric layer 26, here for example epoxy based dielectric ink 118-12 from Creative Materials, Ayer, MA is disposed over the coupling region 20 using printing or additive manufacturing, for example.

[0016] Referring now to FIGS. 3A-3D, a second metal layer, strip conductor 28 here printed or formed by additive manufacturing, for example, using a conductive ink, for example, Paru nanosilver PG-007 or Dupont CB028, as a strip conductor disposed on the first dielectric layer 20. It is noted that portions 28a and 28b of the second metal layer are formed over portions of the outer sidewalls of the first dielectric layer 26 onto portions of the output end 24 o of the third lower strip conductor 24 and onto portions of the input end 22 I of the second lower strip conductor 22. Thus, second metal layer 28 has one end 28a disposed on, and electrically connected to, the input end 22 I of the second lower strip conductor 22 and has a second end 28b disposed on, and electrically connected to the output end 24 O of the third lower strip conductor 24. The width of the second metal layer 28 over the coupling region 20 may be adjusted by the additive manufacturing or printing process to tune the quadrature coupler 10.

[0017] Referring now to FIGS. 4A-4C, a second dielectric layer 30 is disposed over the second metal layer 28 and between the two pairs of ground pads 16a 1 , 16a, and pair 16b 1 , 16b 2 , as shown. The second dielectric layer 30 may be printed or formed by additive manufacturing, for example, using any suitable dielectric, for example epoxy based dielectric ink 118-12 from Creative Materials, Ayer, MA

[0018] Referring now to FIGS, 5A-5C, an electrically conductive shield layer 32 is disposed on an upper surface of the second dielectric layer 30 extending over sides of the second dielectric layer 30 and onto the pair of ground pads 16a 1 , 16a 2 , and pair 16b 1 , 16b 2 , as shown. Conductive layers 34a, 34b are disposed on the sides of the substrate 12 to electrically connect the ground pads 16a 1 , 16a 2 to the ground plane conductor 13, as shown, thereby completing the quadrature coupler 10. It is noted that the conductive shield layer 32 and conductive layers 34a, 34b are here printed or formed by additive manufacturing, for example, using a conductive ink, for example Para nanosilver PG-007 or DuPont CB028.

[0019] Because of the additive manufacturing printing process, the quadrature coupler 10 can be easily tuned. More particularly, referring to FIGS. 6A and 6B, first, prior to the manufacturing process a determination is made as to the width required for the strip conductor 28 prior to forming the dielectric material 30 (FIGS 5A-5C) so that the competed quadrature coupler 10 will have a proper width to produce quadrature coupler 10 with a desired, predetermined degree of coupling between the upper strip conductor 28 and the lower strip conductor 20 after forming the dielectric material 30 and shield 34. Thus, referring to FIG.6A, a computer simulation, using, for example 3-dimensional electromagnetic simulator such as Ansys-HFFS (Ansys corporation, Canonsburg, PA 15317) is used to model a completed quadrature coupler 10 comprising: entering parameters of the simulated completed quadrature coupler, such parameters including: a width for upper strip conductor 28 estimated to provide a predetermined, desired degree of coupling between the lower strip conductor 20 and the upper strip conductor 28; the dielectric materiel 26, its thickness and its dielectric constant; the dielectric materiel 30, its thickness and its dielectric constant; and shield layer 32 into a computer simulator to have the computer generate the actual degree of coupling produced by the simulated quadrature coupler. From the generated actual degree of coupling, a comparison is made between the generated actual degree of coupling and a predetermined desired degree of coupling. If the generated actual degree of coupling and the predetermined desired degree of coupling are different, the width of the upper strip conductor 28 in the simulation is changed and the process continues until they are equal. Next, the dielectric material 26, its thickness and its dielectric constant; and shield layer 32 are removed from the simulation to thereby provide a computer model of the coupler at an intermediate stage in its fabrication, shown in FIGS. 3A-3C . Next, the degree of coupling of such coupler at the intermediate stage in its fabrication is recorded.

[0020] This recorded degree of coupling is used during the actual fabrication of the quadrature coupler 10. More particularly, referring to FIG. 6B, the fabrication process includes: (a) providing the quadrature coupler after completion of the structure shown in FIGS. 3A-3C with the width of the upper strip conductor 28 having a minimum predicted width; (b) measuring the degree coupling between the pair of strip conductors using any conventional process such as for example an S-parameter analyzer; (c) comparing the measured degree of coupling with the recorded degree of coupling; (d) incrementally increasing the width of the upper strip conductor 28 (FIGS. 3A-3C); (e) repeating (b) through (d) until the degree of coupling reaches the recorded degree coupling; and (f) complete the quadrature coupler 10 as described above and in connection with FIGS. 4A-4C through 5A-5C. It should be understood that instead of setting a minimum coupler specification and line width 28 and increasing line width 28 to achieve the desired coupler, a nominal or larger line width for 28 for the coupler can be used and techniques such as laser trim or milling tools can be used to reduce the line width to the desired level.

[0021] It should now be appreciated a quadrature coupler according to an example that does not have all the claimed features includes: a pair of overlying strip conductors separated by a first dielectric layer to provide a coupling region between the pair of overlying strip conductors; a pair of opposing ground pads, the coupling region being disposed between the pair of opposing ground pads; a second dielectric layer disposed over the coupling region and between the pair of opposing ground pads; and an electrically conductive shield layer disposed over the second dielectric layer, extending over opposing sides of the dielectric layer and onto the pair of opposing ground pads. The quadrature coupler may also include the feature including a second pair of ground pads, the coupling region being disposed between the second pair of ground pads, the first-mentioned pair of ground pads, the first-mentioned pair of ground pads and the second pair of ground pads being disposed along perpendicular lines, the electrically conductive shield layer being disposed over a second pair of opposing sides of the dielectric layer and onto the second pair of ground pads.

[0022] A number of embodiments of the disclosure have been described. Nevertheless, it will be understood that various modifications may be made without departing from the scope of the appended claims. For example, instead of Conductive layers 34a, 34b disposed on the sides of the substrate 12 to electrically connect the ground pads 16a 1 , 16a 2 to the ground plane conductor 13, the ground pads 16a 1 , 16a 2 , and pair 16b 1 , 16b 2 , may be connected to the ground plane conductor 13 with electrically conductive vias passing through the substrate 12. These vias may be formed prior to forming the first metal layer 14 (FIGS. 1A-1C). Accordingly, other embodiments are within the scope of the following claims.

Examples

Embodiment Construction

[0014]Referring now to FIGS 1A, 1B and 1C, a dielectric substrate 12 is shown having: a first metal layer 14 disposed on an upper surface of the substrate 12; and a ground plane conductor 13, here for example gold, is disposed on a bottom surface of the substrate 12. The first metal layer 14 is patterned to provide: a two pairs of ground pads; pair 16a 1 , 16a 2 , and pair 16b 1 , 16b 2 , respectively, as shown; a first lower strip conductor 18, spaced from the pair of ground pads, having: an input at first end 18 I , an output at a second end 18 O ; and, a coupling region 20 disposed between the first end 18 I , the second end 18 O , and between the two pairs on ground pads 16a 1 , 16a 2 , and pair 16b 1 , 16b 2 , respectively, as shown; a second lower strip conductor 22 having: an input end 22 I and an output end 22 O ; and, a third lower strip conductor 24 having an input end 24 I and an output end 24 O , as shown. The first metal layer 14 may be printed, formed using additive ...

TECHNICAL FIELD

[0001] This disclosure relates generally to quadrature hybrid couplers.BACKGROUND

[0002] As is known in the art, quadrature couplers are used in a variety of microwave circuits to split an input signal into a pair of output signals, usually with equal magnitudes, that are ninety degrees apart in phase. Examples of such quadrature couplers are an embedded stripline broadside coupler or a topside quadrature coupler, such as a Lange or hybrid (branchline) splitter. One use of quadrature couplers is to impedance match pairs of devices. The devices are arranged so that reflections from them are terminated in a load that is isolated from the quadrature coupler's input because of the 90 degree (quadrature) phase difference.

[0003] As is also known in the art, prior art quadrature couplers are integrated into a larger board that has many functions. As such, the design such as the degree of coupling, is not easy alterable. An internal coupling structure in surface mount coupler is known from CN101958450A. A HF coupler or Hf power splitter, especially a narrow-band and / or 3dB coupler or power splitter is known from US2009 / 0051462A1. A strip line coupler is known from JPH08084007A. Quasi-ideal multilayer two- and three-strip dimensional couplers for monolithic and hybrid MIC's are known from K Sachse ET AL, "Quasi-ideal multilayer two-and three-strip dimensional couplers for monolithic and hybrid MICs", IEEE Transactions on Microwave Theory and Techniques, doi:10.1109 / 22.788525, (19990101), pages 1873-1882.

[0004] US 2005 / 017821A describes a multilayer coupled-lines directional coupler of the quarter wavelength type that comprises a first, a second and a third conductive layer, joined by means of dielectric layers. The first conductive layer comprises a first and a second conductive strip, separated, mutually parallel, each in one end connected to a first output and in another end connected to a second output. The second conductive layer comprises a third conductive strip, parallel to the first and the second conductive strip, in one end connected to a third output and in another end connected to a fourth output. The first conductive layer comprises a fourth conductive strip, parallel to and located between the first and the second conductive strip, in one end connected to the third output, and in another end connected to the fourth output.SUMMARY

[0005] There is provided, according to the present invention, a quadrature coupler according to claim 1. Further embodiments are provided in the dependent claims.

[0006] With such an arrangement, the shield provides improved electrical isolation for the coupling region.

[0007] In one embodiment, portions of the coupler are formed by printing or additive manufacturing.

[0008] With such an arrangement, printing or additive manufacturing enables the coupler strip conductor widths and hence the degree of coupling between the pair of strip conductors to be adjusted, or tuned, while the coupler is still on a board having multiple functionality.

[0009] In one embodiment, a directional coupler includes a second pair of ground pads, the coupling region being disposed between the second pair of ground pads, and the first-mentioned pair of ground pads. The first-mentioned pair of ground pads and the second pair of ground pads are disposed along perpendicular lines. The electrically conductive shield layer is disposed over a second pair of opposing sides of the dielectric layer and onto the second pair of ground pads.

[0010] There is also provided a method for tuning a quadrature coupler according to claim 8.

[0011] The details of one or more embodiments of the disclosure are set forth in the accompanying drawings and the description below. Other features, objects, and advantages of the disclosure will be apparent from the description and drawings, and from the claims.DESCRIPTION OF DRAWINGS

[0012] FIGS. 1A-1C through 5A-5C are diagrammatical plan, perspective, and cross sectional views of a quadrature coupler according to the disclosure at various stages in the fabrication thereof; FIGS. 1B and 1C being taken along lines 1B-1B and 1C-1C, respectively in FIG. 1A; FIGS. 2B and 2C being taken along lines 2B-2B and 2C-2C, respectively in FIG. 2A; FIGS. 3B and 3C being taken along lines 3B-3B and 3C-3C, respectively in FIG. 3A; FIG. 3D being a perspective view of a region indicated as 3D-3D in FIG. 2A; FIGS. 4B and 4C being taken along lines 4B-4B and 4C-4C, respectively in FIG. 4A; FIGS. 5B and 5C being taken along lines 5B-5B and 5C-5C, respectively in FIG. 5A; and FIGS. 5A-5C being diagrammatical plan and cross sectional views of the completed quadrature coupler according to the disclosure; and FIG. 6A and 6B are flow charts of steps used in the process used to fabricate the quadrature coupler of FIGS. 5A-5C.

[0013] Like reference symbols in the various drawings indicate like elements.DETAILED DESCRIPTION

[0014] Referring now to FIGS 1A, 1B and 1C, a dielectric substrate 12 is shown having: a first metal layer 14 disposed on an upper surface of the substrate 12; and a ground plane conductor 13, here for example gold, is disposed on a bottom surface of the substrate 12. The first metal layer 14 is patterned to provide: a two pairs of ground pads; pair 16a 1 , 16a 2 , and pair 16b 1 , 16b 2 , respectively, as shown; a first lower strip conductor 18, spaced from the pair of ground pads, having: an input at first end 18 I , an output at a second end 18 O ; and, a coupling region 20 disposed between the first end 18 I , the second end 18 O , and between the two pairs on ground pads 16a 1 , 16a 2 , and pair 16b 1 , 16b 2 , respectively, as shown; a second lower strip conductor 22 having: an input end 22 I and an output end 22 O ; and, a third lower strip conductor 24 having an input end 24 I and an output end 24 O , as shown. The first metal layer 14 may be printed, formed using additive manufacturing, or formed using conventional photolithographic-etching processing, as used in forming printed circuit boards, for example.

[0015] Referring now to FIGS. 2A-2C, a first dielectric layer 26, here for example epoxy based dielectric ink 118-12 from Creative Materials, Ayer, MA is disposed over the coupling region 20 using printing or additive manufacturing, for example.

[0016] Referring now to FIGS. 3A-3D, a second metal layer, strip conductor 28 here printed or formed by additive manufacturing, for example, using a conductive ink, for example, Paru nanosilver PG-007 or Dupont CB028, as a strip conductor disposed on the first dielectric layer 20. It is noted that portions 28a and 28b of the second metal layer are formed over portions of the outer sidewalls of the first dielectric layer 26 onto portions of the output end 24 o of the third lower strip conductor 24 and onto portions of the input end 22 I of the second lower strip conductor 22. Thus, second metal layer 28 has one end 28a disposed on, and electrically connected to, the input end 22 I of the second lower strip conductor 22 and has a second end 28b disposed on, and electrically connected to the output end 24 O of the third lower strip conductor 24. The width of the second metal layer 28 over the coupling region 20 may be adjusted by the additive manufacturing or printing process to tune the quadrature coupler 10.

[0017] Referring now to FIGS. 4A-4C, a second dielectric layer 30 is disposed over the second metal layer 28 and between the two pairs of ground pads 16a 1 , 16a, and pair 16b 1 , 16b 2 , as shown. The second dielectric layer 30 may be printed or formed by additive manufacturing, for example, using any suitable dielectric, for example epoxy based dielectric ink 118-12 from Creative Materials, Ayer, MA

[0018] Referring now to FIGS, 5A-5C, an electrically conductive shield layer 32 is disposed on an upper surface of the second dielectric layer 30 extending over sides of the second dielectric layer 30 and onto the pair of ground pads 16a 1 , 16a 2 , and pair 16b 1 , 16b 2 , as shown. Conductive layers 34a, 34b are disposed on the sides of the substrate 12 to electrically connect the ground pads 16a 1 , 16a 2 to the ground plane conductor 13, as shown, thereby completing the quadrature coupler 10. It is noted that the conductive shield layer 32 and conductive layers 34a, 34b are here printed or formed by additive manufacturing, for example, using a conductive ink, for example Para nanosilver PG-007 or DuPont CB028.

[0019] Because of the additive manufacturing printing process, the quadrature coupler 10 can be easily tuned. More particularly, referring to FIGS. 6A and 6B, first, prior to the manufacturing process a determination is made as to the width required for the strip conductor 28 prior to forming the dielectric material 30 (FIGS 5A-5C) so that the competed quadrature coupler 10 will have a proper width to produce quadrature coupler 10 with a desired, predetermined degree of coupling between the upper strip conductor 28 and the lower strip conductor 20 after forming the dielectric material 30 and shield 34. Thus, referring to FIG.6A, a computer simulation, using, for example 3-dimensional electromagnetic simulator such as Ansys-HFFS (Ansys corporation, Canonsburg, PA 15317) is used to model a completed quadrature coupler 10 comprising: entering parameters of the simulated completed quadrature coupler, such parameters including: a width for upper strip conductor 28 estimated to provide a predetermined, desired degree of coupling between the lower strip conductor 20 and the upper strip conductor 28; the dielectric materiel 26, its thickness and its dielectric constant; the dielectric materiel 30, its thickness and its dielectric constant; and shield layer 32 into a computer simulator to have the computer generate the actual degree of coupling produced by the simulated quadrature coupler. From the generated actual degree of coupling, a comparison is made between the generated actual degree of coupling and a predetermined desired degree of coupling. If the generated actual degree of coupling and the predetermined desired degree of coupling are different, the width of the upper strip conductor 28 in the simulation is changed and the process continues until they are equal. Next, the dielectric material 26, its thickness and its dielectric constant; and shield layer 32 are removed from the simulation to thereby provide a computer model of the coupler at an intermediate stage in its fabrication, shown in FIGS. 3A-3C . Next, the degree of coupling of such coupler at the intermediate stage in its fabrication is recorded.

[0020] This recorded degree of coupling is used during the actual fabrication of the quadrature coupler 10. More particularly, referring to FIG. 6B, the fabrication process includes: (a) providing the quadrature coupler after completion of the structure shown in FIGS. 3A-3C with the width of the upper strip conductor 28 having a minimum predicted width; (b) measuring the degree coupling between the pair of strip conductors using any conventional process such as for example an S-parameter analyzer; (c) comparing the measured degree of coupling with the recorded degree of coupling; (d) incrementally increasing the width of the upper strip conductor 28 (FIGS. 3A-3C); (e) repeating (b) through (d) until the degree of coupling reaches the recorded degree coupling; and (f) complete the quadrature coupler 10 as described above and in connection with FIGS. 4A-4C through 5A-5C. It should be understood that instead of setting a minimum coupler specification and line width 28 and increasing line width 28 to achieve the desired coupler, a nominal or larger line width for 28 for the coupler can be used and techniques such as laser trim or milling tools can be used to reduce the line width to the desired level.

[0021] It should now be appreciated a quadrature coupler according to an example that does not have all the claimed features includes: a pair of overlying strip conductors separated by a first dielectric layer to provide a coupling region between the pair of overlying strip conductors; a pair of opposing ground pads, the coupling region being disposed between the pair of opposing ground pads; a second dielectric layer disposed over the coupling region and between the pair of opposing ground pads; and an electrically conductive shield layer disposed over the second dielectric layer, extending over opposing sides of the dielectric layer and onto the pair of opposing ground pads. The quadrature coupler may also include the feature including a second pair of ground pads, the coupling region being disposed between the second pair of ground pads, the first-mentioned pair of ground pads, the first-mentioned pair of ground pads and the second pair of ground pads being disposed along perpendicular lines, the electrically conductive shield layer being disposed over a second pair of opposing sides of the dielectric layer and onto the second pair of ground pads.

[0022] A number of embodiments of the disclosure have been described. Nevertheless, it will be understood that various modifications may be made without departing from the scope of the appended claims. For example, instead of Conductive layers 34a, 34b disposed on the sides of the substrate 12 to electrically connect the ground pads 16a 1 , 16a 2 to the ground plane conductor 13, the ground pads 16a 1 , 16a 2 , and pair 16b 1 , 16b 2 , may be connected to the ground plane conductor 13 with electrically conductive vias passing through the substrate 12. These vias may be formed prior to forming the first metal layer 14 (FIGS. 1A-1C). Accordingly, other embodiments are within the scope of the following claims.

Examples

Embodiment Construction

[0014]Referring now to FIGS 1A, 1B and 1C, a dielectric substrate 12 is shown having: a first metal layer 14 disposed on an upper surface of the substrate 12; and a ground plane conductor 13, here for example gold, is disposed on a bottom surface of the substrate 12. The first metal layer 14 is patterned to provide: a two pairs of ground pads; pair 16a 1 , 16a 2 , and pair 16b 1 , 16b 2 , respectively, as shown; a first lower strip conductor 18, spaced from the pair of ground pads, having: an input at first end 18 I , an output at a second end 18 O ; and, a coupling region 20 disposed between the first end 18 I , the second end 18 O , and between the two pairs on ground pads 16a 1 , 16a 2 , and pair 16b 1 , 16b 2 , respectively, as shown; a second lower strip conductor 22 having: an input end 22 I and an output end 22 O ; and, a third lower strip conductor 24 having an input end 24 I and an output end 24 O , as shown. The first metal layer 14 may be printed, formed using additive ...

Claims

1. A quadrature coupler, comprising: a dielectric substrate (12); a first metal layer disposed on an upper surface of the substrate, the first metal layer being patterned to provide: a first pair of ground pads (16b1, 16b2); a first lower strip conductor (18), spaced from the first pair of ground pads, having an input (18I) at a first end, an output (18O) at a second end, and a coupling region (20) disposed between the first end and the second end, and between the first pair of ground pads; a second lower strip conductor (22) having an input end (22I) and an output end (22O); and a third lower strip conductor (24) having an input end (24I) and an output end (24O); a first dielectric layer (26) disposed over the coupling region; a second metal layer (28) configured as a strip conductor disposed on the first dielectric layer over the coupling region, the second metal layer having one end (28b) disposed on, and electrically connected to, the output end (24O) of the third lower strip conductor (24) and having another end (28a) disposed on, and electrically connected to, the input end (22I) of the second lower strip conductor (22); a second dielectric layer (30) disposed over the second metal layer and between the first pair of ground pads; and an electrically conductive shield layer (34) disposed on an upper surface of the second dielectric layer; characterized in that: the electrically conductive shield layer (34) extends over a first pair of opposing sides of the second dielectric layer and onto the first pair of ground pads.

2. The quadrature coupler recited in claim 1 further including a second pair of ground pads (16a1, 16a2), the coupling region being disposed between the second pair of ground pads, the first pair of ground pads and the second pair of ground pads being disposed along perpendicular lines, the electrically conductive shield layer being disposed over a second pair of opposing sides of the second dielectric layer and onto the second pair of ground pads.

3. The quadrature coupler recited in claim 1, wherein the electrically conductive shield layer comprises a conductive ink.

4. The quadrature coupler recited in claim 1, further comprising a ground plane conductor (13) disposed on a bottom surface of the dielectric substrate (12).

5. The quadrature coupler recited in claim 4, further comprising conductive layers (34a, 34b) disposed on sides of the dielectric substrate (12) to electrically connect the first pair of ground pads (16b1, 16b2) to the ground plane conductor (13).

6. The quadrature coupler recited in claim 4, further comprising electrically conductive vias passing through the dielectric substrate (12) to electrically connect the first pair of ground pads (16b1, 16b2) to the ground plane conductor (13).

7. The quadrature coupler recited in claim 1, wherein the second dielectric layer is disposed on: the input (18I) at the first end of the first lower strip conductor (18), the output (18O) at the second end of the first lower strip conductor (18), the input end (22I) of the second lower strip conductor (22), and the output end (24O) of the third lower strip conductor (24).

8. A method for tuning a quadrature coupler, comprising: a) providing a quadrature coupler comprising: a dielectric substrate (12); a first metal layer disposed on an upper surface of the substrate, the first metal layer being patterned to provide: a first pair of ground pads (16b1, 16b2); a first lower strip conductor (18), spaced from the first pair of ground pads, having an input (18I) at a first end, an output (18O) at a second end, and a coupling region (20) disposed between the first end and the second end, and between the first pair of ground pads; a second lower strip conductor (22) having an input end (22I) and an output end (22O); and a third lower strip conductor (24) having an input end (24I) and an output end (24O); a first dielectric layer (26) disposed over the coupling region; and a second metal layer (28) configured as a strip conductor disposed on the first dielectric layer over the coupling region and having a minimum predicted width, the second metal layer having one end (28b) disposed on, and electrically connected to, the output end (24O) of the third lower strip conductor (24) and having another end (28a) disposed on, and electrically connected to, the input end (22I) of the second lower strip conductor (22), b) measuring a degree of coupling between the first lower strip conductor and the strip conductor; c) comparing the measured degree of coupling with a recorded degree of coupling; d) increasing a width of the strip conductor; e) repeating steps b) through d) until the measured degree of coupling reaches the recorded degree coupling; and f) completing the quadrature coupler by: disposing a second dielectric layer (30) over the second metal layer; and disposing an electrically conductive shield layer (34) on an upper surface of the second dielectric layer; wherein the second dielectric layer (30) is disposed between the first pair of ground pads; and wherein the electrically conductive shield layer (34) extends over a first pair of opposing sides of the second dielectric layer and onto the first pair of ground pads.

9. The method recited in claim 8, wherein: the quadrature coupler provided in step (a) further comprises a second pair of ground pads (16a1, 16a2) provided in the first metal layer, the coupling region being disposed between the second pair of ground pads, the first pair of ground pads and the second pair of ground pads being disposed along perpendicular lines, and step (f) further comprises disposing the electrically conductive shield layer (34) over a second pair of opposing sides of the second dielectric layer (30) and onto the second pair of ground pads (16a1, 16a2).

10. The method recited in claim 8, wherein the electrically conductive shield layer (34) comprises a conductive ink.

11. The method recited in claim 8, wherein the quadrature coupler provided in step (a) further comprises a ground plane conductor (13) disposed on a bottom surface of the dielectric substrate (12).

12. The method recited in claim 11, wherein step (f) further comprises disposing conductive layers (34a, 34b) on sides of the dielectric substrate (12) to electrically connect the first pair of ground pads (16b1, 16b2) to the ground plane conductor (13).

13. The method recited in claim 11, wherein the quadrature coupler provided in step (a) further comprises electrically conductive vias passing through the dielectric substrate (12) to electrically connect the first pair of ground pads (16b1, 16b2) to the ground plane conductor (13).

14. The method recited in claim 13, wherein the second dielectric layer (30) is disposed on: the input (18I) at the first end of the first lower strip conductor (18), the output (18O) at the second end of the first lower strip conductor (18), the input end (22I) of the second lower strip conductor (22), and the output end (24O) of the third lower strip conductor (24).

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