Electrode assembly for an ionisation device

Abstract

The present invention relates to an electrode arrangement (1) for an ionization device, a method for manufacturing an electrode arrangement (1), a base carrier (2), a high-voltage resistance arrangement (3), and an electrode (6) for an electrode arrangement (1) according to the invention. The present invention is based on the general concept of providing an electrode arrangement (1) with a hybrid resistance carrier comprising a plastic base carrier (2) and a ceramic carrier (4) which are connected to one another, in particular by material bonding, positive locking, force-locking, and / or bonding, wherein electrodes (6) of the electrode arrangement (1) are fixed to the plastic base carrier (2).

Description

[0001] The present invention relates to an electrode arrangement for an ionization device, in particular for an antistatic device, according to the preamble of claim 1. The invention also relates to a method for producing an electrode arrangement and to an ionization device comprising such an electrode arrangement.

[0002] An ionization device is used to generate ions and can also be referred to as an ionizer or ioniser. The ionization device can be used in particular to change an electrostatic charge. Depending on the application, an electrostatic charge can be generated, increased or reduced on an object and / or in an environment with the help of the ionization device. In particular, an undesirable static charge can develop on moving webs of material, which must be reduced to avoid spontaneous spark discharge with an arc. In this case, an ionization device acting as an antistatic device is used. In contrast, when painting large metal components, for example, it can be advantageous to specifically charge the respective component statically, in order to achieve better adhesion and more even distribution of a spray paint.In this case, an ionization device designed as a static device can be used.

[0003] DE 10 2011 007 138 B4 describes a conventional electrode arrangement for an antistatic device for reducing electrostatic charge on a moving material web. The electrode arrangement has at least one high-voltage resistor arrangement comprising a plastic carrier material onto which several resistor tracks made of a polymer paste are printed and arranged next to one another in a longitudinal direction of the carrier material, wherein the resistor tracks form high-voltage resistors in the range of 100 kΩ to 100 GΩ. Furthermore, the electrode arrangement comprises several electrodes, each having an electrode tip, each of which is electrically contacted with a resistor track of the high-voltage resistor arrangement.

[0004] When printing the plastic substrate with the polymer paste, a sufficiently high level of flatness of the surface to be printed must be ensured. Even the slightest depressions or elevations on this surface lead to variations in the thickness of the printed resistor tracks during conventional screen printing, and thus to different resistance values ​​between the individual resistor tracks. The permissible height deviations of the surface to be printed compared to a flat surface should be in the single-digit µm range to avoid significant influences on the resistance values ​​of the individual resistor tracks. These strict requirements lead to a high reject rate of up to 50% within a production order.

[0005] Conventional screen printing pastes used to produce high-ohm resistors are printed on ceramic and processed at approximately 850°C. Since the substrate material of DE 10 2011 007 138 B4 is made of plastic or thermoset, the maximum permissible processing temperature is limited to values ​​below 250°C, so conventional screen printing pastes cannot be used. For this reason, DE 10 2011 007 138 B4 uses polymer-based resistor pastes that are processed at temperatures around 200°C.

[0006] Due to the chemical and physical properties of the polymer-based resistor pastes, the permissible operating temperature is limited to values ​​below 80°C. If higher operating temperatures are reached, the printed resistor track begins to continuously change or decrease its resistance value.

[0007] If a short circuit occurs between one or more electrodes and a ground potential when using such an electrode arrangement, the resulting electrical short-circuit power causes a temperature increase at the polymer-based resistance track, thus leading to a reduction in the resistance value of the resistance track. This short-circuit behavior of the resistance tracks is not permitted for applications in potentially explosive environments (e.g., environments subject to the ATEX regulation). Resistance tracks based on this polymer-based technology cannot and must not be used under ATEX conditions.

[0008] A generic electrode arrangement is known from DE 10 2015 000 800 B3. It is held in a metal profile with an insulating encapsulation.

[0009] The present invention therefore addresses the problem of providing an improved or at least an alternative embodiment of an electrode arrangement for an ionization device and an ionization device equipped therewith, which is improved in particular with regard to manufacturing costs and / or with regard to the area of ​​application.

[0010] This problem is solved according to the invention by the subject matter of the independent claims. Advantageous embodiments are the subject matter of the dependent claims.

[0011] The present invention is based on the general idea of ​​specifying an electrode arrangement with a hybrid resistance carrier, which has a plastic base carrier and a ceramic carrier, which are connected to one another, in particular by a material fit, a form fit, a force fit and / or adhesive bond, wherein electrodes of the electrode arrangement are fixed to the plastic base carrier, while resistors of the resistance arrangement are located on the ceramic carrier.

[0012] The electrode arrangement can be used in the high-voltage range (approx. 1 kV to 150 kV) to generate electric fields for ionizing and / or discharging objects and / or spaces and can therefore form an ionization and / or discharge electrode arrangement.

[0013] The electrode arrangement according to the invention for an ionization device, in particular for an antistatic device, for generating ions and / or for modifying electrostatic charge, has at least one base support designed as a plastic component. The base support can be designed as a rigid plastic component or as a flexible plastic component, in particular as a film. The electrode arrangement can be used in an ionization device, e.g., as an antistatic device, for reducing electrostatic charge on a moving material web or for reducing electrostatic charge on a stationary body or component. The electrode arrangement can also be used in an ionization device, e.g., as a static device, for charging a body, e.g., during a painting process.

[0014] The electrode arrangement further comprises at least one high-voltage resistor arrangement having a ceramic carrier on which a plurality of resistor tracks are printed from a resistor paste, preferably by screen printing. The ceramic carrier can be made of a ceramic material and / or a ceramic-based carrier material. The ceramic carrier can be designed as a rigid ceramic component. Due to the ceramic material, the ceramic carrier has high temperature resistance and can be produced comparatively easily and cost-effectively with a high-quality, flat surface that is particularly easy to print evenly.

[0015] The base carrier designed as a plastic component can be designed and / or manufactured separately from the ceramic carrier.

[0016] The resistance paste can be a conventional resistance paste and / or conventional screen printing paste used for the production of high-ohm resistors. The conventional resistance paste or screen printing paste can be a polymer-free resistance paste and / or a glass-ceramic-based resistance paste and / or a cermet-based resistance paste and / or a thick-film resistance paste. Compared to polymer-based resistance pastes, conventional resistance pastes or screen printing pastes exhibit a lower and / or weaker and / or negligible temperature dependence of the electrical resistance for the electrode arrangement, so that, particularly with a temperature increase, no irreversible reduction in resistance relevant to the operation of the electrode arrangement occurs.

[0017] Such a conventional resistance paste and / or conventional screen printing paste can be printed onto a surface of the ceramic carrier and subsequently processed at at least 800°C, in particular at 850°C, in particular dried and / or cured and / or baked on the ceramic carrier.

[0018] The electrode arrangement, especially the high-voltage resistor arrangement, can be used at voltages ranging from approximately 1 kV to 150 kV. For this purpose, each resistance track printed on the ceramic substrate can have ohmic resistance values ​​of 100 kΩ to 100 GΩ.

[0019] On the ceramic carrier, which is in particular formed in one piece and / or in one part, a plurality of resistance tracks made of the resistance paste can be printed and / or arranged next to one another in a longitudinal direction of the electrode arrangement and / or the ceramic carrier, in particular next to one another and spaced from one another.

[0020] The resistance tracks can be printed on a surface of the ceramic substrate facing away from the base substrate, the printing surface. The resistance tracks can be designed as meander-shaped resistance tracks.

[0021] The electrode arrangement comprises a plurality of electrodes that are secured to the base support and each have an electrode tip spaced apart from the base support. The plurality of electrodes can be formed separately from one another.

[0022] The expression "fixed to the base support" can be understood here to mean that the electrodes are attached to the base support in at least partial contact and / or that the electrodes are attached in the base support in at least partial contact, wherein the positional fixation and / or alignment of the electrodes within the electrode arrangement is determined by the base support. In this case, the electrodes can be spaced apart from the ceramic support. The attachment of the electrodes to the base support and / or in the base support can be positively and / or materially bonded and / or non-positively bonded. In particular, the base support can be injection-molded onto the electrodes. Accordingly, the electrodes can form so-called inlays or inserts in the injection mold of the base body during injection molding of the base body.

[0023] The base support, designed as a plastic component, and the ceramic support are connected to one another, in particular by a material fit, a form fit, and / or a force fit. The base support, designed as a plastic component, and the ceramic support can be connected to one another by means of a non-detachable connection that does not allow non-destructive separation of the base support and the ceramic support. The base support, designed as a plastic component, and the ceramic support can be glued to one another. The connection between the base support, designed as a plastic component, and the ceramic support can be designed as a permanent or durable connection. The base support and the ceramic support can be referred to as hybrid resistor supports.

[0024] The base carrier and the ceramic carrier can be bonded using an adhesive or glue that forms an adhesive layer between the base carrier and the ceramic carrier upon curing or drying. For this purpose, the ceramic carrier can have an adhesive surface on the ceramic carrier side, which can be opposite a printing surface of the ceramic carrier and / or facing the base carrier.

[0025] The electrodes are each electrically contacted with a resistance track of the high-voltage resistor array. The electrical contact can be formed, for example, via an electrically conductive adhesive and / or soldered connection. It can be provided that the number of electrodes corresponds to the number of resistance tracks, so that exactly one electrode can be electrically contacted with exactly one resistance track of the high-voltage resistor array.

[0026] Regarding the required surface flatness, the ceramic carrier can be manufactured within the required flatness tolerances with less technical effort than a plastic component, particularly without additional manufacturing steps. The electrodes can be attached to the base carrier, which is designed as a plastic component, cost-effectively. Furthermore, any unevenness in the base carrier can be compensated for during bonding of the base carrier to the ceramic carrier, thus reducing the manufacturing requirements for the base carrier. Overall, the scrap rate of the electrode assembly and / or the components of the electrode assembly within a production order can be significantly reduced, resulting in low manufacturing costs.

[0027] A further advantage is that a conventional resistance paste or screen printing paste can be used with the ceramic carrier, so that the resistance tracks do not experience a significant reduction in resistance when the temperature increases and consequently the electrode arrangement can be used in applications in potentially explosive environments (e.g. environments where the ATEX regulation applies).

[0028] According to the invention, the resistance tracks of the high-voltage resistor array are arranged on a side of the ceramic substrate facing away from the base substrate. This simplifies the attachment of the ceramic substrate to the base substrate. Heat that may be generated at the high-voltage resistors during operation of the electrode array can also be more effectively dissipated or radiated.

[0029] Another embodiment proposes that the base support be bonded to the ceramic support. In particular, an adhesive layer can be arranged between the base support and the ceramic support, connecting the base support to the ceramic support. This simplifies the series production of the electrode assembly.

[0030] In an advantageous further development of the solution according to the invention, it is provided that the base support is designed as an injection-molded component, in particular as a duromer injection-molded component, and / or that the base support is injection-molded onto the electrodes.

[0031] The design of the base carrier as an injection-molded component, in particular as a duromer injection-molded component, enables more cost-effective production, whereby the entire structure of the electrode arrangement is independent of the injection-molded process and associated process fluctuations with regard to the flatness of the surfaces, since the base carrier is not directly printed with the resistance paste, but is glued to the ceramic carrier, which has a comparatively higher surface flatness.

[0032] The electrodes can be fixed to the base support in a single assembly step with a material fit and / or a force fit and / or a form fit, whereby the assembly step takes place after the formation of the injection-molded component base support using an injection molding process. Alternatively or additionally, it can be provided that the base support is molded onto at least one, several, or all of the electrodes during the injection molding process. This can reduce the number of assembly steps in order to further reduce manufacturing costs. By molding the base support onto the electrodes, the electrodes can be fixed to the base support with a material fit and / or a force fit and / or a form fit. A duromer injection-molded component can also be formed by molding the base support onto the electrodes.

[0033] In an advantageous development of the solution according to the invention, the electrode arrangement comprises an airflow guidance system designed to guide the airflow so that the airflow is directed to the electrode tips. The airflow guidance system may be formed by the base support with fixed electrodes.

[0034] The air flow guidance system can be designed such that at least one or more components of the electrode arrangement can be at least partially and / or sectionally flowed through by the guided air flow.

[0035] The air flow guidance system can be designed such that one or more air flows are guided to the electrode tips along an air flow direction that is oriented transversely and / or perpendicularly to a longitudinal direction of the electrode arrangement.

[0036] The airflow guidance system allows the guided airflow to be used to increase the discharge range of the electrode tip and / or to cool the electrode tips and / or to clean the electrode tips.

[0037] In an advantageous development of the solution according to the invention, it is provided that the base support has a plurality of air flow guide channels for forming the air flow guide system, which are each designed to guide an air flow and which are each at least partially formed in the base support, and / or that the electrodes each have an electrode body with a flow-through channel for forming the air flow guide system, wherein the respective flow-through channel is designed to guide an air flow.

[0038] The base support can have a plurality of separately formed, in particular fluidically separated, air flow guide channels. The separately formed air flow channels can be spaced apart from one another with respect to a longitudinal direction of the electrode arrangement and / or arranged parallel to one another. These air flow channels can extend completely through the base support.

[0039] The electrode body can be hollow-cylindrical to form a flow channel. The electrode body can be arranged between the electrode tip and the base support with respect to an air flow direction that is oriented transversely and / or perpendicularly to a longitudinal direction of the electrode arrangement.

[0040] By using airflow guide channels in the base support and / or flow channels in the electrode bodies, an airflow guide system can be formed without the need for additional components, thus reducing the number of required components and the associated manufacturing steps.

[0041] In an advantageous development of the solution according to the invention, it is provided that at least in one electrode body the flow channel is fluidically connected to an air flow guide channel of the base support. In this case, it can be provided that the flow channel of each electrode body is fluidically connected to a separate air flow guide channel of the base support. One, several or all electrode bodies can be at least partially arranged in an air flow guide channel of the base support, in particular arranged coaxially, in order to form a fluidic connection of the respective flow channel to the respective air flow guide channel. One, several or all electrode bodies can be at least partially connected in a force-fitting and / or form-fitting and / or material-fitting manner to a wall of the base support which forms the respective air flow guide channel of the base support.

[0042] This allows the airflow guide channels to fulfill multiple functions, with the first function being to form the airflow guide system and the second function being to secure the electrodes to the base support. This allows the overall structure of the electrode arrangement to be simplified.

[0043] In an advantageous development of the solution according to the invention, it is provided that the air flow guide channels of the base support have a circular cross-section transverse to the air flow direction, and / or that the electrodes are each formed from a wire, wherein the respective electrode body is wound in a helical manner, so that a hollow electrode interior is created which forms the respective flow channel.

[0044] The airflow guide channels of the base support can be formed, for example, as bores or injection-molded recesses. The circular cross-section transverse to the airflow direction can have a substantially constant diameter along the airflow direction. Alternatively, the circular cross-section transverse to the airflow direction can vary along the airflow direction, in particular continuously or in steps.

[0045] The helically wound electrode body can have a circular-cylindrical outer contour or an enveloping outer sheath boundary surface. Adjacent windings of the electrode body can be designed to be in contact with one another. The circular-cylindrical outer contour or enveloping outer sheath boundary surface can be adapted to the circular cross-section of the air flow guide channels of the base support.

[0046] In an advantageous development of the solution according to the invention, it is provided that, with regard to the resistance tracks, separate conductor tracks made of a conductive paste are printed on the ceramic carrier, and / or that the electrical contacting of the electrodes with the resistance tracks is formed by means of an electrically conductive adhesive connection and / or by means of an electrically conductive solder connection.

[0047] The separate conductor tracks can form several separate contact zones and / or a single contact track. The conductive paste can have lower resistance values ​​than the resistance paste. The conductive paste can be formed from conductive silver. Each contact zone can be printed on the ceramic carrier at a distance from the contact track in a direction transverse to the longitudinal direction of the electrode arrangement. The separate contact zones can be printed on the ceramic carrier at a distance from one another in a longitudinal direction of the electrode arrangement. The contact zones can be designed for electrical contacting of an electrically conductive adhesive and / or soldered connection.

[0048] At least one or more, in particular all, resistance tracks can each be electrically contacted at one of their ends with a contact zone that is printed on the ceramic carrier.

[0049] At least two or more, in particular all, resistance tracks can each be electrically contacted at one of their ends with a common electrical contact track printed on the ceramic carrier.

[0050] In an advantageous development of the inventive solution, it is provided that the base carrier has a contacting recess for each electrode, and that the ceramic carrier has contacting openings corresponding to the contacting recesses. The contacting openings are at least partially delimited by a printed conductor track, in particular contact zones, wherein each conductor track electrically contacts a resistance track. For electrically contacting the electrodes with the resistance tracks, an electrically conductive adhesive and / or an electrically conductive solder is introduced into the contacting recess in such a way that the adhesive and / or the solder forms an electrically conductive connection between the respective electrode and an associated conductor track.

[0051] In this case, it can be provided that the adhesive and / or the solder is introduced into the respective contacting recess while still in a liquid state in such a way that the adhesive and / or the solder at least partially wets the electrode body of the respective electrode and also at least partially wets the conductor track associated with the electrode, in particular the contact zone, in order to form an electrically conductive connection between the electrode and the associated conductor tracks during curing.

[0052] In an advantageous development of the solution according to the invention, it is provided that a plurality of electrodes are spaced apart from one another and / or arranged parallel to one another with respect to a longitudinal direction of the electrode arrangement.

[0053] In an advantageous development of the solution according to the invention, it is provided that the plurality of resistance tracks on the ceramic carrier are arranged at a distance from one another with respect to a longitudinal direction of the electrode arrangement.

[0054] An ionization device according to the invention serves for electrostatically charging and / or discharging a substrate and is equipped with at least one electrode arrangement of the type described above. For this purpose, the ionization device can have at least one electrode holder for holding the respective electrode arrangement. Likewise, the ionization device can be equipped with an electrical power supply device, such as a control unit, which is electrically connected to the respective electrode arrangement.

[0055] Furthermore, the invention relates to a method for producing an electrode arrangement according to the invention with the following method steps: a) Provision of a base carrier formed as a plastic component with several fixed electrodes. b) Provision of a high-voltage resistor array with a ceramic carrier. c) Connection of the base carrier to the ceramic carrier. d) Electrical contacting of the electrodes with a resistance track of the high-voltage resistor array printed on the ceramic carrier by soldering and / or gluing.

[0056] The above steps can be performed in alphanumeric order.

[0057] Before process step a), the electrodes can be fixed to the base support in an assembly step with a material fit and / or a force fit and / or a form fit. This assembly step can take place after the formation of the base support of the injection-molded component, in particular a duromer injection-molded component, using an injection molding process. Alternatively or additionally, it can be provided that the base support is injection-molded onto at least one, several, or all of the electrodes during the injection molding process. By injection-molding the base support onto the electrodes, the electrodes can be fixed to the base support with a material fit and / or a force fit and / or a form fit. A duromer injection-molded component can also be formed when the base support is injection-molded onto the electrodes.

[0058] In process step c), the base carrier can be connected to the ceramic carrier by means of a material-to-material, form-fitting, and / or force-fitting connection. The base carrier can be connected to the ceramic carrier by means of a non-detachable connection that does not allow non-destructive separation of the base carrier and the ceramic carrier. The base carrier can be glued to the ceramic carrier. The connection between the base carrier, which is designed as a plastic component, and the ceramic carrier can be designed as a permanent or durable connection. The base carrier can be permanently connected to the ceramic carrier, e.g., glued.

[0059] Furthermore, the invention relates to the use of the method according to the invention for producing the electrode arrangement according to the invention.

[0060] Furthermore, the invention relates to a base support for an electrode arrangement according to the invention, wherein the base support is designed as a plastic component, in particular as a duromer component and / or as an injection-molded component and / or as a duromer injection-molded component.

[0061] The base carrier for an electrode arrangement according to the invention can have the above-mentioned and the following features with regard to the base carrier in the respectively specified combination, in other combinations or on their own.

[0062] Furthermore, the invention relates to the use of the base carrier according to the invention in an electrode arrangement according to the invention.

[0063] In an advantageous further development of the solution according to the invention, it is provided that the base support has a plurality of air flow guide channels for forming an air flow guide system, each of which is designed to guide an air flow.

[0064] Furthermore, the invention relates to a high-voltage resistor arrangement for an electrode arrangement according to the invention with a ceramic carrier on which several resistor tracks made of a resistor paste are printed.

[0065] The high-voltage resistance arrangement for an electrode arrangement according to the invention can have the above-mentioned and the following features with regard to the high-voltage resistance arrangement in the respectively specified combination, in other combinations or on their own.

[0066] Furthermore, the invention relates to the use of the high-voltage resistor arrangement according to the invention in an electrode arrangement according to the invention.

[0067] Furthermore, the invention relates to an electrode for an electrode arrangement according to the invention with an electrode body which has a flow channel for forming an air flow guidance system, wherein the flow channel is designed to guide an air flow.

[0068] The electrode for an electrode arrangement according to the invention can have the above-mentioned and the following features with regard to the electrode in the respectively specified combination, in other combinations or on their own.

[0069] Furthermore, the invention relates to the use of an electrode according to the invention in the electrode arrangement according to the invention.

[0070] Further important features and advantages of the invention emerge from the subclaims, from the drawings and from the associated description of the figures based on the drawings.

[0071] It is understood that the features mentioned above and those to be explained below can be used not only in the combination specified in each case, but also in other combinations or on their own, without departing from the scope of the present invention.

[0072] Preferred embodiments of the invention are illustrated in the drawings and are explained in more detail in the following description, wherein the same reference numerals refer to the same or similar or functionally identical components.

[0073] They show, schematically Fig. 1 is a perspective exploded view of an electrode arrangement according to the invention, Fig. 2 is a perspective view of a base support of the electrode arrangement of the Fig. 1 with fixed electrodes, Fig. 3 an enlarged partial section of the Fig. 2 .

[0074] The Fig. 1 shows a perspective exploded view of an electrode arrangement 1 according to the invention, which has a base carrier 2 made of plastic and a high-voltage resistor arrangement 3 comprising a ceramic-based ceramic carrier 4.

[0075] The base support 2 has a base support-side adhesive surface 18, which, with respect to a transverse direction 17 of the electrode assembly, is arranged opposite and / or facing a ceramic support-side adhesive surface 19 of the ceramic support 4. During the manufacturing process of the electrode assembly according to the invention, the base support-side adhesive surface 18 and the ceramic support-side adhesive surface 19 are wetted with an adhesive, in particular wetted over the entire surface, so that the adhesive, after curing, forms a bond in the form of an adhesive layer 22 between the base support 2 and the ceramic support 4.

[0076] The base support 2 is a rigid injection-molded plastic component, in particular a rigid injection-molded thermoset component, to which several electrodes 6 are attached, each having an electrode tip 7 spaced apart from the base support 2. The electrodes 6 are arranged equidistantly spaced from one another with respect to a longitudinal direction 16 of the electrode arrangement 1 and aligned parallel to one another. The longitudinal direction 16 of the electrode arrangement 1 is aligned transversely to the transverse direction 16 of the electrode arrangement 1.

[0077] The base support 2 has a longitudinal extension along a longitudinal direction 16 of the electrode assembly 1 and a transverse extension along the transverse direction 17 of the electrode assembly 1, wherein the longitudinal extension of the base support 2 is greater than the transverse extension or thickness of the base support 2. Accordingly, the base support is flat and elongated.

[0078] All electrodes 6 shown are aligned parallel to an air flow direction 12 which is aligned transversely to the longitudinal direction 16 of the electrode arrangement 1 and transversely to the transverse direction 17 of the electrode arrangement 1.

[0079] The ceramic carrier 4 has a longitudinal extension along the longitudinal direction 16 of the electrode assembly 1 and a transverse extension along the transverse direction 17 of the electrode assembly 1, wherein the longitudinal extension of the ceramic carrier 4 is greater than the transverse extension or thickness of the ceramic carrier 4. Accordingly, the ceramic carrier is also flat and elongated. The transverse extension or thickness of the ceramic carrier 4 is smaller than the transverse extension or thickness of the base carrier 2.

[0080] A surface of the ceramic carrier 4 facing away from the base carrier 2, particularly with respect to the transverse direction 17, forms a printing surface 20. A plurality of resistance tracks 5 made of a resistance paste are printed onto this printing surface of the ceramic carrier 4. The resistance tracks 5 can be designed as meandering resistance tracks. The plurality of resistance tracks are arranged adjacent to one another and spaced apart from one another with respect to the longitudinal direction 16 of the electrode arrangement 1. In the finished state of the electrode arrangement 1, the resistance tracks 5 are thus located on a side of the ceramic carrier 4 facing away from the base carrier 2, namely on the printing surface 20.

[0081] The base carrier 2 has a contacting recess 13 for each electrode 6, wherein the ceramic carrier 4 has contacting openings 14 corresponding to the contacting recesses 13.

[0082] While the contacting recesses 13 of the base carrier 2 only partially or not completely penetrate the base carrier 2 with respect to the transverse direction 17, starting from the adhesive surface 18 on the base carrier side, the corresponding contacting openings 14 of the ceramic carrier completely penetrate the ceramic carrier 4 with respect to the transverse direction 17.

[0083] On the printing surface 20 of the ceramic carrier 4, separate conductor tracks 15 made of a conductive paste are printed with respect to the resistance tracks 5.

[0084] The contact openings 14 are each at least partially delimited or surrounded by a printed conductor track 15, 15a. These printed conductor tracks 15, 15a form several separate contact zones. The resistance tracks 5 are each electrically contacted at one of their ends with a contact zone 15, 15a.

[0085] At least one printed conductor track 15, 15b forms a contact track, wherein all resistance tracks 5 are each electrically contacted at one of their ends with a common electrical contact track 15, 15b.

[0086] For electrically contacting the electrodes 6 with the resistance tracks 5, an electrically conductive adhesive and / or an electrically conductive solder is introduced into the contacting recess 13 in such a way that the adhesive and / or the solder forms an electrically conductive connection between the respective electrode 6 and an associated conductor track 15, 15a or contact zone.

[0087] In this case, it can be provided that the adhesive and / or the solder is introduced into the respective contacting recess 13 while still in a liquid state in such a way that the adhesive and / or the solder at least partially wets an electrode body 10 of the respective electrode 6 and also at least partially wets the conductor track 15, 15a or contact zone associated with the electrode, in order to form an electrically conductive connection between the electrode 6 and the associated 5, 15a or contact zone upon curing. Since the resistance tracks 5 are each electrically contacted at one of their ends with a contact zone 15, 15a or contact zone, the introduced adhesive and / or the solder effects electrical contact between an electrode 6 and the associated resistance track 5.

[0088] The number of resistance tracks 5 corresponds to the number of electrodes 6, wherein each electrode 6 is electrically contacted with a resistance track 5 of the high-voltage resistance arrangement 3.

[0089] The electrode arrangement 1 has an air flow guide system 8, which is designed to guide an air flow in such a way that an air flow is guided to the electrode tips 7. This is described with reference to the Fig. 2 and the Fig. 3 explained in more detail. In particular, the base support 2 with fixed electrodes 6 has such an air flow guidance system 8.

[0090] The base support 2 has a plurality of separately formed, in particular fluidically separated, air flow guide channels 9, which are arranged in the Fig. 2 and 3are indicated by dashed lines. The separately formed air flow channels 9 are spaced apart from one another with respect to a longitudinal direction 16 of the electrode arrangement 1 and aligned parallel to one another. These air flow channels 16 completely penetrate the base support with respect to the air flow direction 12, with an inlet opening 21 being arranged at one end of each of the air flow channels 16, while an electrode 6 is arranged at an end of the respective air flow channel opposite the inlet opening 21.

[0091] The electrodes 6 each have an electrode body 10 with a flow channel 11 for forming the air flow guidance system 8, wherein the respective flow channel 11 is designed to guide an air flow. A flow channel 11 of an electrode 6 is shown in the enlarged section 23, which is shown in the Fig. 3 Enlarged, indicated by broken lines. The electrodes 6 can, for example, each be formed from a wire, with the respective electrode body 10 wound in a helical manner to form a hollow electrode interior that forms the respective flow channel 11.

[0092] In the Fig. 3 It is particularly clearly visible that, at least in one electrode body 8, the flow channel 11 is fluidically connected to an air flow guide channel 9 of the base support 2. An air flow entering the base support 2 through the flow opening 16 flows through both the air flow channel 9 and the flow channel 11, so that the air flow is guided along the air flow direction 12 to the electrode tip 7.

[0093] The required air flow can be provided by an air conveying system not shown.

Claims

1. Electrode assembly (1) for an ionization device, - with at least one base support (2), - with at least one high-voltage resistor arrangement (3), which has a ceramic support (4), on which a plurality of resistor tracks (5) are printed, - with a plurality of electrodes (6), which are fixed to the base support (2) and which each have an electrode tip (7) spaced apart from the base support (2), - wherein the base support (2) and the ceramic support (4) are connected to one another, - wherein the electrodes (6) are each in electrical contact with a resistor track (5) of the high-voltage resistor arrangement (3), characterized in that - the base support (2) is designed as a plastic component, - the resistor track (5) is printed from resistor paste on the ceramic support (4), - the resistor tracks (5) of the high-voltage resistor arrangement (3) are arranged on a side of the ceramic support (4) facing away from the base support (2).

2. Electrode assembly (1) according to claim 1, characterized in that the base support (2) is adhesively bonded to the ceramic support (4).

3. Electrode assembly (1) according to any one of the preceding claims, characterized in that an adhesive layer (22) is arranged between the base support (2) and the ceramic support (4), which connects the base support (2) to the ceramic support (4).

4. Electrode assembly (1) according to any one of the preceding claims, characterized in that the base support (2) is designed as an injection-molded component, in particular as a duromer injection-molded component.

5. Electrode assembly (1) according to any one of the preceding claims, characterized in that the base support (2) is molded onto the electrodes (6).

6. Electrode assembly (1) according to any one of the preceding claims, characterized in that the electrode assembly (1) has an air flow guide system (8), which is designed to guide an air flow such that an air flow is guided to the electrode tips (7).

7. Electrode assembly (1) according to claim 6, characterized in that - the base support (2) has a plurality of air flow guide channels (9) for forming the air flow guide system (8), which are each designed to guide an air flow and which are each formed at least partially in the base support (2), and / or - the electrodes (6) each have an electrode body (10) with a throughflow channel (11) for forming the air flow guide system (8), wherein the respective throughflow channel (11) is designed to guide an air flow.

8. Electrode assembly (1) according to claim 7, characterized in that at least in the case of an electrode body (8), the throughflow channel (11) is fluidly connected to an air flow guide channel (9) of the base support (2).

9. Electrode assembly (1) according to any one of the preceding claims, characterized in that - as regards the resistor tracks (5), separate conductor tracks (15) made from conductive paste are printed on the ceramic support (4).

10. Electrode assembly (1) according to any one of the preceding claims, characterized in that - the electrical contact of the electrodes (6) with the resistor tracks (5) is formed by means of an electrically conductive adhesive bond and / or by means of an electrically conductive solder connection.

11. Electrode assembly (1) according to any one of the preceding claims, characterized in that - the base support (2) has a contact recess (13) for each electrode (6), in that the ceramic support (4) has contact openings (14) corresponding to the contact recesses (13), - wherein the contact openings (14) are at least partially delimited by a printed conductor track (15), - wherein a conductor track (15) is in electrical contact with a resistor track (5) in each case, - wherein, in order to place the electrodes (6) in electrical contact with the resistor tracks (5), in each case, an electrically conductive adhesive and / or an electrically conductive solder is introduced into the contact recess (13) such that the adhesive and / or the solder forms an electrically conductive connection between the respective electrode (6) and a related conductor track (15).

12. Electrode assembly (1) according to any one of the preceding claims, characterized in that a plurality of electrodes (6) are arranged spaced apart from one another and / or parallel to one another in relation to a longitudinal direction (16) of the electrode assembly (1).

13. Electrode assembly (1) according to any one of the preceding claims, characterized in that the plurality of resistor tracks (5) are arranged spaced apart from one another on the ceramic support (4) in relation to a longitudinal direction (16) of the electrode assembly (1).

14. Ionization device for electrostatically charging and / or discharging a substrate, with at least one electrode assembly (1) according to any one of the preceding claims and with at least one electrode support for holding the respective electrode assembly (1) and / or with an electrical power supply device, which is electrically connected to the respective electrode assembly (1).

15. Method for producing an electrode assembly (1) according to any one of claims 1 to 13, - wherein a base support (2) designed as a plastic component is provided with a plurality of fixed electrodes (6), - wherein a high-voltage resistor arrangement (3) is provided with a ceramic support (4), - wherein the base support (2) is connected to the ceramic support (4), - wherein the electrodes (6) are placed in electrical contact with a resistor track (5) printed on the ceramic support (4) of the high-voltage resistor arrangement (3) by soldering and / or adhesive bonding, in each case.

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