Core component for a sensor assembly, and sensor assembly

Abstract

The invention relates to a core component (100) for a sensor assembly (1000), comprising: a circuit carrier (102) having an upper face (102a) and a lower face (102b) opposite from the upper face (102a); a pressure sensor element (104); and a temperature sensor element (105), wherein the circuit carrier (102) has a central region (113) and an edge region (114) surrounding the central region (113), the central region (113) has a sealing region (113a) which adjoins the edge region (114), the pressure sensor element (104) and the temperature sensor element (105) are mounted on the circuit carrier (102) in the central region (113), at least the temperature sensor element (105) is mounted on the lower face (102b) in the central region (113) and is electrically connected to first connection points (101a) on the lower face (102b), and the circuit carrier (102) is free of electrical feedthroughs which lead from the lower face (102b) in the central region (113) to the upper face (102a) in the central region (113). The invention also relates to a sensor assembly (1000) comprising the core component (100).

Description

[0001] Description

[0002] Core component for a sensor array and sensor array

[0003] A core component for a sensor arrangement, in particular a core component with at least one sensor element, and a sensor arrangement are specified.

[0004] Many applications in industrial and automotive engineering, for example heat engines, filters, cooling circuits and air conditioning systems, require simultaneous, location-specific measurement of the pressure and temperature of a fluid. The sensors used for this can be exposed to high pressure loads, for example up to 100 bar, as well as high temperatures, for example up to 180 °C, and very low temperatures, for example down to -40 °C. It is desirable if the sensors used can be spatially combined, for example in a common housing. In order to prevent the escape of environmentally harmful media such as refrigerants over the lifetime of a sensor and to ensure trouble-free operation, special requirements are placed on tightness, particularly with regard to signal feedthroughs.

[0005] At least one object of certain embodiments is to specify a core component for a sensor arrangement. At least one further object of certain embodiments is to specify a sensor arrangement.

[0006] These objects are achieved by subject matter according to the independent patent claims. Advantageous embodiments and developments of the subject matter are characterized in the dependent claims and will further emerge from the following description and the drawings.

[0007] According to at least one embodiment, a core component, which can in particular be a core component for a sensor arrangement, is specified. According to at least one further embodiment, a sensor arrangement is specified which has the core component. The sensor arrangement can in particular be provided and configured to measure properties of a fluid, for example a temperature and / or a pressure of a fluid. The term “fluid” here and below refers to liquid and gaseous media. For example, a fluid can be a heat transfer medium or coolant, for example in a heat engine, a cooling circuit or an air conditioning system, a fuel or oil, or can have such a medium. The following description refers equally to the core component and the sensor arrangement.

[0008] According to a further embodiment, the core component has at least one sensor element. The at least one sensor element can preferably have or be a pressure sensor element or a temperature sensor element. The core component particularly preferably has at least two sensor elements. The at least two sensor elements can particularly preferably have or be a pressure sensor element and a temperature sensor element. The following descriptions relating to the at least one sensor element can equally apply to the at least two sensor elements. According to a further embodiment, the core component has a circuit carrier. The at least one sensor element can be mounted on the circuit carrier. "Mounted" here and below can mean that the at least one sensor element is mechanically and electrically connected to the circuit carrier.The electrical and mechanical connections can be made together, for example using SMD technology (SMD: "surface-mounted device"). Furthermore, the electrical and mechanical connections can also be separate from one another, for example using mechanical soldering or adhesive connections and, in conjunction with an electrical connection, using wire connections such as bond wires.

[0009] According to a further embodiment, the circuit carrier has a top side and a bottom side opposite the top side. The top side and the bottom side can in particular be formed by opposite surfaces of the circuit carrier which are connected to one another by side surfaces. A distance from the top side to the bottom side can define a thickness direction along which the thickness of the circuit carrier is measured. The thickness of the circuit carrier is preferably smaller than all dimensions of the circuit carrier perpendicular to the thickness direction. The circuit carrier is particularly preferably plate-shaped, wherein the surfaces on the top side and the bottom side can also have elevations and depressions.Here and in the following, it is assumed purely by way of example that the circuit carrier in the sensor arrangement is arranged such that the underside faces a fluid whose properties, such as temperature and pressure, are to be measured. A portion of the underside may also be exposed to the fluid. The upper side is accordingly facing away from the fluid and therefore, when the sensor arrangement is used as intended, preferably has no contact with the fluid.

[0010] Electrical connection points, in particular in the form of adhesive pads, bond pads and / or solder pads, can be formed on the underside and on the top side, on which electrical components such as sensor elements, semiconductor components and other interconnection elements such as resistors, capacitors, diodes and other passive or active elements can be mounted, i.e. can be mechanically and electrically connected. Electrical components can therefore be mounted on the top side and on the bottom side. Electrical conductor structures, for example in the form of conductor tracks and / or electrical vias, can be formed inside the circuit carrier, via which electrical connection points on one side, i.e. the top side or the bottom side, can be interconnected with electrical connection points on the other side or even on the same side.In particular, the circuit carrier can have electrical feedthroughs, i.e., conductor structures that electrically connect connection points on the underside with connection points on the top. Such feedthroughs can also be referred to as signal feedthroughs.

[0011] The circuit carrier can, for example, have a substrate with or made of a ceramic material, for example selected from oxides and / or nitrides with aluminum and / or silicon, and / or with or made of a plastic material, for example FR4, which can furthermore be formed with or without a metallic core. On the substrate, which can particularly preferably comprise the top and bottom of the circuit carrier, connection points are formed as described above, which can be connected to one another by conductor structures in the interior of the circuit carrier. For example, the circuit carrier can have or be a ceramic substrate with conductor structures, a printed circuit board (PCB), a printed circuit board with a metallic core or an injection-molded circuit carrier (molded interconnect device (MID).Furthermore, layered ceramics, i.e. multi-layer sintered ceramics such as LTCC (low temperature cofired ceramics) and HTCC (high temperature cofired ceramics) are possible.

[0012] According to a further embodiment, the circuit carrier and thus the core component has a central region and an edge region surrounding the central region. The central region and the edge region particularly preferably border on one another laterally, with lateral directions being referred to in particular as directions along the top side and along the bottom side and thus directions perpendicular to the thickness direction of the circuit carrier. At least a part of the central region can in particular be that region of the circuit carrier which is arranged in the pressure-bearing region in the sensor arrangement, i.e. which can be exposed to the pressure of a fluid. The edge region can in particular be the region which is not arranged in the pressure-bearing region.The central region can have a sealing area that borders the edge area and can have a sealing surface on the underside, on which a sealing element, such as a sealing ring, can be arranged. On the underside, the edge area of ​​the circuit carrier can thus be separated from the pressure-bearing area by the sealing element.

[0013] According to a further embodiment, the circuit carrier is free of electrical feedthroughs that lead from the underside in the central region to the top side in the central region. This ensures that no leaks can occur in the circuit carrier at electrical feedthroughs that would extend from the underside to the top side of the circuit carrier in the central region, as the pressure-bearing region in the sensor arrangement. A direct signal feedthrough between the top side and the underside through the central region and thus in the pressure-bearing region of the circuit carrier is therefore particularly preferably not present.

[0014] According to a further embodiment, the at least one sensor element is mounted in the central region on the circuit carrier. In particular, the at least one sensor element can be mounted on the underside in the central region. Particularly preferably, both the pressure sensor element and the temperature sensor element are mounted in the central region on the circuit carrier. This can mean, in particular, that at least the temperature sensor element is mounted in the central region on the underside and can therefore be electrically connected to first connection points on the underside in the central region. In particular, the temperature sensor element can be mounted using SMD technology, so that the first connection points serve for the mechanical and electrical connection. The first connection points are preferably connected to electrical conductor structures which lead within the circuit carrier from the central region to the edge region.Furthermore, the electrical conductor structures can be connected to second connection points on the upper side in the edge region. A signal feedthrough can thus be provided in the circuit carrier for the temperature sensor element, which leads from the underside in the central region to the upper side in the edge region, since in particular the sealing area is bridged or tunneled by the conductor structures running within the circuit carrier. The second connection points can enable direct readout of an electrical signal from the temperature sensor element, for example an analog signal, which can be further processed via external signal processing.Furthermore, at least one further electrical component, for example a semiconductor chip for signal processing or as part of a signal processing circuit of the core component, can be connected to the second connection points, so that electrical signals from the temperature sensor element can be processed by the core component itself. This can make it possible, for example, to convert analog signals from the temperature sensor element into digital signals, which can then be further processed, for example, by external signal processing. Since the second connection points are located outside the central region, it can be ensured that the signals from the temperature sensor element are available on the upper side of the circuit carrier without there being an electrical feedthrough in the central region from the underside to the upper side.

[0015] Furthermore, the pressure sensor element can be mounted in the central region on the underside. As in the case of the temperature sensor element, the pressure sensor element can be mounted on first connection points on the underside or at least electrically connected to these, which are connected via internal conductor structures in the circuit carrier to second connection points on the upper side in the edge region.

[0016] The pressure sensor element can preferably be mounted in the middle region on the upper side. In this case, the pressure sensor element can be mounted on first connection points on the upper side or at least electrically connected to these, which can be connected to second connection points, preferably in the edge region, on the upper side via internal conductor structures in the circuit carrier and / or via conductor tracks on the upper side. In the case of a pressure sensor element mounted on the upper side in the middle region, the circuit carrier has a feedthrough which extends in the middle region from the underside to the top side and which is designed, for example, as a through-hole, i.e. approximately in the form of a through-bore. The feedthrough is designed in particular as a pressure feedthrough and serves to feed the fluid to be measured from the underside of the circuit carrier to the pressure sensor element on the upper side of the circuit carrier.In particular, the print feedthrough may be the only feedthrough of the circuit carrier in the middle area, i.e. leading from the bottom in the middle area to the top in the middle area.

[0017] According to a further embodiment, the pressure sensor element is a MEMS element (MEMS: "micro-electromechanical system"), in particular a piezoresistive silicon MEMS element. Compared to other pressure sensor elements, for example compared to ceramic pressure sensor elements, piezoresistive silicon MEMS elements are characterized by a smaller design and a lower price. For example, when using ceramic measuring cells, the detection of low pressure ranges such as less than 5 bar is difficult to implement in the often required small installation space. Furthermore, when using ceramic measuring cells, only absolute pressure measurement is usually possible. Furthermore, the capacitive measuring principle of the ceramic measuring cells or a resistive measuring principle in combination with thick-film technology place increased demands on signal processing and promote electrical interference.Through the preferred use of a piezoresistive silicon MEMS element as a pressure sensor element in the core component described here, the effective area on which the fluid acts on the pressure sensor element can be made very small and the forces acting on the core component can therefore be kept low. This can also contribute to reducing the required installation space and the weight of the core component and thus of the sensor arrangement. The pressure sensor element, in particular the piezoresistive silicon MEMS element, can be sensitive in a pressure range between 50 mbar and 50 bar. The piezoresistive silicon MEMS element can typically deliver an output signal of up to 120 mV or even greater or lesser.Compared to capacitive pressure sensors, the piezoresistive silicon MEMS element can cover a larger measuring range and also generate a stronger output signal that is less sensitive to interference. The pressure sensor element, in particular the piezoresistive silicon MEMS element, can be designed for absolute or relative pressure measurement. It can be used at temperatures between -40 °C and +180 °C.

[0018] The temperature sensor element can particularly preferably be an NTC thermistor. The temperature sensor element particularly preferably has elongated supply lines, in particular contact wires in the form of contact legs, with which the temperature sensor element is mounted on the circuit carrier and which extend away from the underside of the circuit carrier. A sensor cell with an NTC element can be arranged at an end of the supply lines opposite the circuit carrier. The sensor cell can thus be positioned away from the circuit carrier in the media flow of the fluid, so that the temperature signal cannot be distorted by components of the circuit carrier.

[0019] According to a further embodiment, the core component has a support element which is arranged on the upper side of the circuit carrier. The support element is particularly preferably arranged in the central region on the upper side of the circuit carrier. The edge region of the circuit carrier can particularly preferably be free or at least substantially free of the support element. An outer circumference of the support element can run at least partially along a boundary between the edge region and the central region of the circuit carrier. The support element can in particular be mounted on the circuit carrier, i.e. on the upper side of the circuit carrier, and can thus be fastened to the circuit carrier and in particular to the upper side of the circuit carrier.For example, the support element can be fastened to the circuit carrier in a form-fitting manner, for example by a clip or clamp connection, or preferably in a material-fitting manner, for example by an adhesive connection.

[0020] According to a further embodiment, the sensor arrangement has an upper housing element. The upper housing element can enclose the core component. The upper housing element can, in particular, rest on an upper side of the support element when the sensor arrangement is in the assembled state. The support element can, in particular, have a stop surface which rests on a stop surface of the upper housing element. A force exerted on the core component can be transmitted to the upper housing element via the stop surface of the support element. By arranging the support element in the central region of the circuit carrier, a force transmission from the core component to the upper housing element can be designed in such a way that bending moments experienced by the core component are minimized.For this purpose, the force can be transmitted via a central region located centrally on the circuit carrier, which is designed to be sufficiently large to prevent dome-shaped deformation of the circuit carrier. The bending loads occurring in the core component can be minimized in this way. This allows for increased bursting strength and reduced mechanical stresses in the core component. A compact design of the sensor arrangement and reduced material usage are possible.

[0021] According to a preferred embodiment, the sensor arrangement comprises the upper housing element and the core component with the temperature sensor element, the pressure sensor element, the circuit carrier and the support element. According to a further embodiment, the support element is designed and arranged on the circuit carrier in such a way that each distance of the support element from an edge point of the circuit carrier can be at least 5%, preferably at least 10% or at least 20% of a length of a straight line that connects the edge point to an opposite edge point of the circuit carrier and runs through the center point of the circuit carrier. This arrangement of the support element in the central region of the circuit carrier ensures that the force exerted by the fluid on the core component is transmitted from regions of the core component that are sufficiently far away from the edges of the core component.This prevents undesirable bending moments in the circuit carrier due to forces exerted on the edges.

[0022] An outer circumference of the support element can run along a boundary between the central region and the edge region of the circuit carrier. The central region can take up at least 10% of the surface area of ​​the circuit carrier. Preferably, the central region takes up at least 25% of the surface area of ​​the circuit carrier. In this way, it can be ensured that a sufficiently large surface area is available for the support element and thus the support element can be sufficiently large to transmit a force to the upper housing element over a large area and not almost in a point-like manner. In this way, force peaks can be avoided which could lead to mechanical stresses in the core component and which could shorten the service life of the sensor arrangement. The central region can be designed such that it takes up no more than 80% of the surface area of ​​the circuit carrier. Preferably, the central region takes up less than 60% of the surface area of ​​the circuit carrier.In this way, it can be ensured that the forces are applied sufficiently far away from the edge of the circuit carrier so that the circuit carrier does not bend.

[0023] Particularly preferably, when the pressure sensor element is arranged on the top side of the circuit carrier, the support element can have a frame which encloses an inner region in which the pressure sensor element is arranged. In particular, the frame can have a height which is greater than the height of the pressure sensor element. This means that when the pressure sensor element is mounted on the top side of the circuit carrier, it can be arranged in an area which is completely enclosed laterally by the support element and the support element can project beyond it in terms of height. As a result, a force from the core component to the upper housing element is not transferred directly from the circuit carrier itself or from the pressure sensor element. Instead, the support element is used for this purpose. The support element has a purely mechanical function, so that elements with a metrological function, such as the pressure sensor element, are protected from force peaks.A design as a frame can ensure that a force is not transferred in a point-like manner but over a surface to the upper housing element, so that there is no point-like deformation of the circuit carrier and thus of the core component.

[0024] The inner region can preferably be filled with a potting material. The potting material, which can be a soft plastic such as silicone, can protect the pressure sensor element.

[0025] The support element can have at least one web, i.e. one or more webs, which extend away from the frame. The stop surface of the support element can be formed by the upper sides of the frame and the at least one web. The at least one web therefore also contributes to the transmission of force to the upper housing element and additionally distributes the force over a larger area, thus avoiding the occurrence of mechanical stress peaks and overloading of the materials used. For example, the support element can have two webs, between which one or more electrical components can be arranged on the circuit carrier. The two webs, which preferably have a height that is greater than the height of the electrical component(s), can protect the component(s) in a similar way to the pressure sensor.

[0026] According to a further embodiment, the upper housing element is part of a housing of the sensor arrangement. In particular, the upper housing element and a lower housing element, to which the upper housing element can be connected, can form the housing of the sensor arrangement. A fluid, the temperature of which is measured by the temperature sensor element and / or the pressure of which is measured by the pressure sensor element, can be conducted to the core component via the lower housing element. The upper housing element can have at least one contact element that is electrically connected to the circuit carrier.

[0027] In particular, the lower housing element can have a media connection channel which is designed to guide a fluid to the underside of the core component in the middle part of the circuit carrier. In particular, the sensor arrangement can be designed so that the fluid is guided to the core component. A sealing element can particularly preferably be arranged between the circuit carrier and the lower housing element, directly adjacent to the sealing surface on the underside of the circuit carrier. The sealing element can in particular enclose the media connection channel, so that the fluid can only be supplied to the middle region on the underside of the circuit carrier, but not to the edge region on the underside of the circuit carrier.The sealing element can be arranged squeezed between the sealing surface of the circuit carrier and a sealing surface of the lower housing element and thus seal the underside of the core component against the lower housing element.

[0028] The temperature sensor element can preferably extend into the media connection channel. Furthermore, a protective element, for example with or made of a plastic, can be inserted into the media connection channel. The protective element can laterally surround the temperature sensor element and protect it from damaging external mechanical influences. The protective element can preferably be held in the media connection channel in a form-fitting and / or force-fitting manner, for example by one or more webs on an outer side in contact with an inner side of the media connection channel.

[0029] An axial direction can be defined as a direction along the media connection channel towards the core component. The lower housing element can extend beyond the core component in the axial direction. The lower housing element can have a flange which encloses a lower end of the upper housing element in the axial direction. The lower and the upper housing element can be designed such that a force which is transmitted from the core component to the stop surface of the upper housing element is transferred from the upper housing element to the flange of the lower housing element. The core component can be designed to transmit a force via the support element to the upper housing element, wherein the upper housing element is designed to divert the force absorbed by the core component to the flange of the lower housing element. For this purpose, the upper housing element is designed to be sufficiently rigid.The upper housing element can be positioned directly against the flange. The flange can be sealed with a potting compound.

[0030] According to a further embodiment, in methods for producing a plurality of the core components or sensor arrangements described above, the core components are manufactured and calibrated in a panel assembly.

[0031] According to particularly preferred embodiments, the sensor arrangement has in particular the core component, a plug housing formed by the upper housing element, and a pressure connection for supplying a medium such as a fluid, formed by the lower housing element, wherein the force resulting from the medium pressure is conducted near the center of force through the core component to the plug housing. According to particularly preferred embodiments, the core component has the circuit carrier with the pressure sensor element and the temperature sensor element as well as with evaluation electronics formed from one or more electrical components on the circuit carrier. According to further preferred embodiments, the core component furthermore has the support element, which particularly preferably has a frame.According to further preferred embodiments, the forces generated by the media pressure are transmitted through the core component to the upper housing element directly or, particularly preferably, via the support element. The support element is particularly preferably designed in such a way that bending stresses in the circuit carrier are minimized. According to further preferred embodiments, the supply lines of the temperature sensor element are joined to the circuit carrier, in particular to electrical connection points, wherein, furthermore, the temperature signal is particularly preferably transmitted from the pressure- and media-carrying space without a feedthrough in the central region of the circuit carrier.

[0032] The core component described here, and thus also the sensor arrangement, can preferably be used, for example, in applications in the automotive sector, in applications related to thermal management, and in refrigeration technology, particularly with refrigerants. In particular, the core component and the sensor arrangement can be used, for example, for sensor applications in automotive powertrains and for coolant and hydrogen pressure sensors for monitoring industrial processes.

[0033] Further advantages, advantageous embodiments and further developments will become apparent from the exemplary embodiments described below in conjunction with the figures. Figures 1 to 3 show schematic representations of a core component in various views according to an exemplary embodiment.

[0034] Figure 4 shows a schematic representation of a circuit carrier of the core component,

[0035] Figures 5 and 6 show schematic representations of a sensor arrangement according to a further embodiment,

[0036] Figures 7 and 8 show schematic representations of an upper and lower housing element of the sensor arrangement,

[0037] Figure 9 shows a schematic representation of a force flow in the sensor arrangement.

[0038] In the exemplary embodiments and figures, identical, similar, or similarly acting elements may be provided with the same reference numerals. The illustrated elements and their relative sizes are not to be considered true to scale; rather, individual elements, such as layers, components, structural elements, and regions, may be exaggerated for clarity and / or clarity.

[0039] Figures 1 to 3 show various views of a core component 100 which is intended and configured, for example, to be used for a sensor arrangement such as the sensor arrangement 1000 described in connection with Figures 5 to 9. Figure 1 shows a plan view of an upper side 100a of the core component 100. Figure 2 shows a plan view of an underside 100b of the core component 100. Figure 3 shows a simplified sectional view of a part of the core component 100. The following description refers equally to Figures 1 to 3.

[0040] The core component 100 has a circuit carrier 102 and at least one sensor element 104, 105 on the circuit carrier 102. The core component 100 is provided and configured to measure at least one property of a medium, in particular a fluid, as part of a sensor arrangement 1000. In the exemplary embodiment shown, the core component 100 has two sensor elements 104, 105 in the form of a pressure sensor element 104 and a temperature sensor element 105. Alternatively, other numbers and types of sensor elements are also possible. The sensor elements 104, 105 are mounted on the circuit carrier 102 and, in particular, are electrically contacted via the circuit carrier 102.

[0041] The circuit carrier has an upper side 102a on the upper side 100a of the core component 100, on which the pressure sensor element 104 is mounted. Furthermore, the circuit carrier 102 has an underside 102b on the underside 100b of the core component 100, which underside is opposite the upper side 102a and on which the temperature sensor element 105 is mounted. The upper side 102a and the underside 102b are connected to one another by side surfaces 102c, wherein a distance from the upper side 102a to the underside 102b defines a thickness direction along which the thickness of the circuit carrier 102 is measured. Particularly preferably, the circuit carrier 102 is plate-shaped, as shown, so that the thickness of the circuit carrier 102 is smaller than all dimensions of the circuit carrier 102 perpendicular to the thickness direction.When core component 100 is used as intended in a sensor assembly, the underside 100b faces the fluid whose temperature and pressure are to be measured. The upper side 100a is correspondingly facing away from the fluid and therefore preferably has no contact with the fluid when the sensor assembly is used as intended.

[0042] The pressure sensor element 104 is provided and configured to determine an absolute or a relative pressure of a fluid, i.e. a liquid or a gas. The pressure sensor element 104 is designed to convert a pressure exerted on a pressure-sensitive surface or a pressure-sensitive region into an electrical signal from which the level of the pressure can be determined. The pressure sensor element 104 can, for example, have a bending plate whose area and thickness are selected with regard to a desired measuring range. Media is applied to a rear side of the pressure sensor element 104 facing the circuit carrier 102. The pressure sensor element 104 is preferably a piezoresistive silicon MEMS element.

[0043] The temperature sensor element 105 is provided and configured to generate an electrical signal whose magnitude depends on the temperature of the fluid. The temperature sensor element 105 can be an NTC thermistor. The temperature sensor element 105 can protrude into the measuring medium in order to detect its temperature with the least possible distortion and to ensure the shortest possible response time. For this purpose, the temperature sensor element 105 has elongated leads 105a, in particular contact wires in the form of contact legs, with which the temperature sensor element 105 is mounted on the circuit carrier 102 and which extend away from the underside 102b of the circuit carrier 102. A sensor cell 105b with an NTC element is arranged at an end of the leads 105a opposite the circuit carrier 102.The sensor cell 105b can thus be positioned away from the circuit carrier 102 in the media flow of the fluid, so that the temperature signal cannot be distorted, for example, by heat development in other components of the circuit carrier 102.

[0044] Electrical connection points 101, in particular in the form of adhesive pads, bond pads and / or solder pads, are formed on the top side 102a and on the bottom side 102b of the circuit carrier 102, on which components such as the sensor elements 104, 105 and further electrical components 106 such as semiconductor components and other interconnection elements such as resistors, capacitors, diodes and other passive or active elements can be mounted, i.e. can be mechanically and electrically connected. The electrical components 106 arranged on the circuit carrier 102 can, for example, form control and evaluation electronics or a part thereof and can be interconnected with the pressure sensor element 104 and the temperature sensor element 105. For the sake of clarity, only some of the electrical components 106 and some of the electrical connection points 101 are provided with reference symbols in Figures 1 and 2.By means of electrical contacts 107, which in the embodiment shown are formed purely by way of example at the edge of the circuit carrier 102 in the form of indentations in side surfaces 102c, the circuit carrier 102 and thus the core component 100 can be contacted from the outside.

[0045] The circuit carrier 102 has a substrate with or made of a ceramic material and / or with or made of a plastic material, which can further be formed with or without a metallic core. In particular, the circuit carrier 102 has a media-resistant material with regard to the fluid, for example an oxide and / or nitride ceramic, for example with Al and / or Si, and / or a plastic such as FR4, FR4 with a metallic core, or another plastic. For example, the circuit carrier 102 can have or be a ceramic substrate with conductor structures, a printed circuit board (PCB), a printed circuit board with a metallic core, or an injection-molded circuit carrier (molded interconnect device (MID).The selected material is particularly designed to fulfil the required mechanical functions, to have good joining properties, for example for gluing, glass soldering and / or soldering, and to serve as a circuit carrier.

[0046] Electrical conductor structures 108, for example in the form of electrical vias 108a and / or conductor tracks 108b, are formed inside and / or on the surface of the circuit carrier 102, via which electrical connection points 101 on one side, i.e. the top side 102a or the bottom side 102b, can be interconnected with electrical connection points 101 on the other side or even on the same side. In particular, the circuit carrier 102 can have electrical feedthroughs 109, i.e. conductor structures 108 that electrically connect connection points 101 on the bottom side 102b with connection points 101 on the top side 102a. Such feedthroughs 109 can also be referred to as signal feedthroughs.

[0047] The circuit carrier 102 and thus the core component 100 has a central region 113 and an edge region 114 surrounding the central region 114. The central region 113 and the edge region 114 border on one another laterally, i.e. in directions along the top side 102a and along the bottom side 102b and thus in directions perpendicular to the thickness direction of the circuit carrier 102, as indicated by the dashed line in Figures 2 and 3. Deviating from the indicated circular shape, the central region 113 can also have a different shape. At least a part of the central region 113 is that region of the circuit carrier 102 which is arranged in the pressure-carrying region in a sensor arrangement and which, when used as intended in a sensor arrangement, can therefore be exposed to the pressure of the fluid to be measured. The edge area 114 is the area that is not located in the pressure-bearing area.The central region 113 has a sealing region 113a which adjoins the edge region 114 and which has a sealing surface 113b on the underside 102b on which a sealing element such as a sealing ring can be arranged, as can be seen further down in Figure 9. The sealing region 113a of the central region 113 with the sealing surface 113b on the underside 102b is indicated in Figures 2 and 3 as the region which lies between the dashed line and the dotted line. On the underside 102b, when used as intended in a sensor arrangement, the edge region 114 of the circuit carrier 102 is thus separated from the pressure-bearing region, i.e. from the central region 113, by a sealing element on the sealing surface 113b.

[0048] The pressure sensor element 104 and the temperature sensor element 105 are mounted in the central region 113 on the circuit carrier 102. Accordingly, the temperature sensor element 105 is mounted in the central region 113 on the underside 102b and is thus electrically connected to first connection points 101a on the underside 102b in the central region 113. In particular, the temperature sensor element 105 can be mounted using SMD technology and thus attached to the circuit carrier 102, so that the first connection points 101a serve for the mechanical and electrical connection. For example, the temperature sensor element 105 can be soldered to the first connection points 101a on the underside 102b, glued using an electrically conductive adhesive, or fastened using another suitable joining method.The first connection points 101a are connected to electrical conductor structures 108, which lead partially on the surface and within the circuit carrier 102 or completely within the circuit carrier 102 from the central region 113 to the edge region 114, as indicated in Figure 3, and which are connected to second connection points 101b on the upper side 102a in the edge region 114. For the temperature sensor element 105, an electrical feedthrough 109 for a signal feedthrough is thus provided in the circuit carrier 102, which leads from the underside 102b in the central region 113 to the upper side 102a in the edge region 114, since in particular the sealing region 113a is bridged or tunneled by the conductor structures 108 of the electrical feedthrough 109 running within the circuit carrier 102, as indicated in Figure 3.Purely by way of example, the conductor structure 108 shown in Figure 3 has a via 108a from the underside 102b to the top side 102a and a conductor track 108b on the top side 102a. Alternatively, for example, a via 108a can extend from the top side 102a and from the underside 102b into the interior of the circuit carrier 102, which are connected by means of an internal conductor track, or, to form a conductor structure 108 for an electrical feedthrough 109, a via 108a can extend from the second connection point 101b to the underside 102b and a conductor track 108b can be present on the underside 102b. The second connection points 101b can enable direct readout of an electrical signal from the temperature sensor element 105, for example an analog signal, which can be further processed via external signal processing.Furthermore, the second connection points 101b can be connected to the previously described further electrical components 106, so that electrical signals of the temperature sensor element 105 can be processed by the core component 100 itself.

[0049] The pressure sensor element 104 is mounted in the central region 113 on the upper side 102a of the circuit carrier 102, for example by means of gluing, glass soldering or soldering. In an alternative embodiment, the pressure sensor element 104 can also be mounted in the central region 113 on the underside 102b of the circuit carrier 102. In the exemplary embodiment shown, the pressure sensor element 104 is mounted on first connection points on the upper side 102 or at least electrically connected to these, which are connected via internal conductor structures in the circuit carrier 102 and / or via conductor tracks on the upper side 102a to second connection points in the edge region 114 on the upper side 102a. For example, the pressure sensor element

[0050] 104 be electrically connected by means of bonding wires.

[0051] As can be seen in Figure 2, the circuit carrier 102 has a feedthrough designed as a pressure feedthrough 112, which extends in the central region 113 from the underside 102b to the top side 102a and which is designed as a through-hole, i.e., approximately in the form of a through-bore. The pressure feedthrough 112 serves to feed the fluid to be measured from the underside 102b of the circuit carrier 102 to the pressure sensor element 104 on the top side 102a of the circuit carrier 102.

[0052] In the edge region 114, further electrical components 106 may be present on the underside 102b at further connection points 101, which are interconnected, for example, via internal conductor structures in the edge region 114 with electrical components 106 on the top side 102a. The components 106 shown and their arrangements are purely exemplary and should not be understood as limiting.

[0053] The circuit carrier 10 is free of electrical feedthroughs that lead from the underside 102b in the central region 113 to the top side 102a in the central region 113. This ensures that no leaks can occur in the circuit carrier 102 at electrical feedthroughs that would extend from the underside 102b to the top side 102a of the circuit carrier 102 in the central region 113, as the pressure-bearing region in a sensor arrangement. A direct signal feedthrough between the top side 102a and the underside 102b through the central region 113 and thus in the pressure-bearing region of the circuit carrier 102 is therefore not present. In particular, the pressure feedthrough 112 is the only feedthrough of the circuit carrier 102 in the central region, which therefore leads from the underside 102b in the central region 113 to the top side 102a in the central region 113.Since the second connection points 101b, which are connected to the first connection points 101a on which the temperature sensor 105 is mounted, are located outside the central region 113, it can thus be achieved that the signals of the temperature sensor element 105 are available at the top side 102a of the circuit carrier 102 without an electrical feedthrough being present in the central region 113 from the bottom side 102b to the top side 102a.

[0054] The interconnection structure integrated in the circuit carrier 102, comprising the electrical connection points 101, the possibly present internal conductor structures 108, and any conductor tracks on the surface, enables transmission of the signals from the sensor elements 104, 105, i.e., in particular, transmission of the temperature signal and the pressure signal, and interconnection of the existing electrical components 106 for signal processing and / or control, as well as conduction of the output signals and a supply voltage. Furthermore, the connection points serve to attach the electrical components, as explained above using the example of the temperature sensor element 105, by means of surface mounting.

[0055] The core component 100 further has on its upper side 100a a support element 103 which is arranged in the central region 113 on the upper side 102a of the circuit carrier 102. The edge region 114 of the circuit carrier 102 can particularly preferably be free or at least substantially free of the support element 103, so that there is space for electrical components 106 on the upper side 102a in the edge region 114. An outer circumference of the support element 103 can run at least partially along a boundary between the edge region 114 and the central region 113 of the circuit carrier 102. In particular, the support element 103 can be fastened to the circuit carrier 102 in a form-fitting and / or material-fitting manner, for example by an adhesive connection. As described further below, a force exerted on the core component 100 can in particular be transmitted to an upper housing element of a housing of a sensor arrangement via the support element 103.The support element 103 is perpendicular to the upper side 102a of the circuit carrier 102 upwards and forms a stop surface against which an upper housing element rests when installed in a sensor arrangement as intended and via which forces can be transmitted to such an upper housing element, as described further and.

[0056] The support element 103 has a frame 103a which encloses an inner region in which the pressure sensor element 104 is arranged. The frame 103a particularly preferably has a height which is greater than a height of the pressure sensor element 104. The pressure sensor element 104 is therefore arranged in a region which is completely enclosed laterally by the support element 103 and is surmounted in height by the support element 103, so that a force from the core component 100 to a housing element of a sensor arrangement is transmitted neither directly from the circuit carrier 102 itself nor from the pressure sensor element 104. Rather, the support element 103 is used for this purpose. The support element 103 has a purely mechanical function, so that the elements with a metrological function, such as the circuit carrier 102 and the pressure sensor element 104, are protected from force peaks.A design with a frame 103a can ensure that a force is transmitted over a surface rather than a point, thus preventing local stress states in the circuit carrier 102 and thus in the core component 100. The inner region within the frame 103a is filled with a potting material 110. The potting material 110, which can be, for example, a soft plastic such as silicone in the form of a silicone gel, can protect the pressure sensor element 104.

[0057] Furthermore, in the exemplary embodiment shown, the support element 103 has two webs 103b which extend away from the frame 103a. The previously described stop surface of the support element 103 is formed by the upper sides of the frame 103a and the webs 103b. The webs 103b therefore also contribute to the transmission of force to a housing element of a sensor arrangement and additionally distribute the force over a larger area, thus preventing the occurrence of mechanical stress peaks and overloading of the materials used. In the exemplary embodiment shown, an electrical component 106 is arranged on the circuit carrier 102 between the two webs 103b, which electrical component 106 may be particularly sensitive and may, for example, be an integrated circuit or another semiconductor component.By means of the two webs 103b, which preferably have a height greater than the height of the electrical component 106 therebetween, the electrical component 106 can be protected therebetween in a similar way to the pressure sensor 104. Alternatively to the illustrated embodiment, the support element 103 can also have more or fewer webs and other geometric configurations.

[0058] have shapes .

[0059] The support element 103 thus serves to accommodate functional elements of the core component 100 and to dissipate forces. In particular, the support element 103 serves to protect the pressure sensor element 104, with the frame 103a forming a boundary for a potting material 110, formed for example from a gel, for passivating the pressure sensor element 104. The support element 103 serves to introduce forces with the largest possible contact surface at the center of force to the circuit carrier 102 and to dissipate the forces with the largest possible contact surface at the center of force to a connector housing. The radii shown for rounding edges and corners of the support element 103 can serve to reduce stress peaks.

[0060] As described, the circuit carrier 102 enables a mechanical and electrical connection of the electrical components 106 and the sensor elements 104, 105. The core component 100 is preferably manufactured and calibrated in a panel assembly. In this way, the manufacturing process can be improved and, in particular, made more cost-effective.

[0061] Figure 4 shows a schematic representation of the central region 113 with the sealing region 113a and the edge region 114 of the circuit carrier 102 in order to explain preferred geometric properties of these. The central region 113 comprises in particular the geometric center point MP of the circuit carrier. The central region 113 comprises at least 10% of the area of ​​the circuit carrier 102 and preferably at least 25% of the area of ​​the circuit carrier 102. An outer contour of the central region 113 is defined, for example, by a sealing element and / or by the support element or parts thereof, wherein the outer edge of the frame 103a or parts thereof can form a boundary between the central region 113 and the edge region 114.

[0062] Each distance AA of the central region 113 and / or of the support element from an edge point PI of the circuit carrier 102 is at least 5%, preferably at least 10% or at least 20%, of a length L of a straight line which connects the edge point PI to an opposite edge point P2 of the circuit carrier 102 and which runs through a center point MP of the circuit carrier 102. The length L of the straight line indicates a diameter of the circuit carrier 102 along the direction defined by PI and P2. The described arrangement makes it possible for the central region 113 and thus preferably also the support element to be arranged centrally on the circuit carrier 102 and to be at a sufficiently large distance from the edges of the circuit carrier 102.

[0063] Figures 5 and 6 show exploded views in an external view and in a sectional view of a sensor arrangement 1000 which has the core component 100 according to the previous description as well as an upper housing element 200 and a lower housing element 300. The elements of the core component 100 are not provided with reference symbols in Figures 5 and 6 for the sake of clarity. Descriptions of the core component 100 and its components therefore also refer equally to Figures 1 to 4. Figures 7 and 8 show sectional views of the upper housing element 200 and the lower housing element 300. Figure 9 shows a sectional view of a section of the sensor arrangement 1000, with acting forces indicated by arrows. The representation of the forces in Figure 9 is intended only to show the basic force progression.The length and density of the arrows do not allow any conclusions to be drawn about the magnitude of the forces acting. The following description applies equally to Figures 5 to 9.

[0064] The lower housing element 300 has a media connection channel 302, via which the fluid, whose pressure and temperature are to be measured, can be supplied to the sensor elements 104, 105 of the core component 100. The upper housing element 200 is connected to the lower housing element 300 and encloses the core component 100, thus protecting it from environmental influences, wherein an underside 100b of the core component 100 is not covered by the upper housing element 200. The sensor arrangement 1000 is designed such that forces exerted by the fluid on the core component 100 can be transmitted via the upper housing element 200 to the lower housing element 300. In the following, the arrangement direction of the lower and upper housing elements 200, 300 is referred to as the axial direction, so that the axial direction is oriented vertically in the illustrations in Figures 5 to 9.The media connection channel 302 preferably extends in the axial direction.

[0065] The top side 102a of the circuit carrier 102 faces away from the media connection channel 302 of the lower housing element 300. The bottom side 102b of the circuit carrier 102 faces towards the

[0066] Media connection channel 302 of the lower housing element 300.

[0067] A force exerted on the core component 100 by the fluid is transmitted to the upper housing element 200 via the support element 103. The arrangement of the support element 103 in the central region 113 of the circuit carrier 102 ensures that bending moments exerted by the force on the core component 100 are minimized. The force is transmitted by the support element 103 via the central region 113 and thus also via the center point of the core component 100 to the upper housing element 200. Since the central region 113 is used for force transmission, bending of the core component 100 can be avoided, which could occur if the force were transmitted via the edge region 114.

[0068] Since the central region 113, as described above, comprises at least 10% and preferably 25% of the area of ​​the circuit carrier 102 and the support element 103 is arranged in the central region 113, it is ensured that the force is transmitted over a sufficiently large area and not approximately in a point-like manner, so that the occurrence of individual force peaks in the core component 100 can be avoided, which could otherwise lead to measurement inaccuracies and / or to reduced long-term stability.

[0069] The upper housing element 200 has a plastic element 201 and contact elements 202. The plastic element 201, which is preferably designed as a plug, extends essentially in the axial direction. In its lower region, the plastic element 201 has a collar 203, i.e. a region which has a larger cross-section than the other regions of the upper housing element 200. The collar 203 of the upper housing element 200 has a rigidity which is sufficient to redirect a force in the axial direction to a flange 301 of the lower housing element 300 which bears against the collar 203 in the axial direction.

[0070] The collar 203 is particularly designed to enclose the core component 100 and to project downwards beyond the core component 100 in the axial direction. A stop surface 204 is formed inside the collar 203, against which the support element 103 of the core component 100 bears. Forces are transmitted from the support element 103 to the upper housing element 200 via the stop surface 204. The upper housing element 200 is designed to transfer these forces to the flange 301 of the lower housing element 300.

[0071] Furthermore, the upper housing element 200 has contact elements 202 that are electrically connected to the circuit carrier 102, for example, to the contacts 107 arranged on the edge. The contact elements 202 enable electrical contact between the circuit carrier 102 and external electronics. The contact elements 202 are designed as metallic, spring-loaded contact pins. They are configured, for example, to be inserted into the contacts 107 of the circuit carrier 102 and thus to position the core component 100 during assembly.

[0072] Each of the contact elements 202 has two bends, wherein the contact elements 202 run parallel to one another at a short distance in an upper region of the upper housing element 200 in the axial direction and are arranged further apart from one another in the collar 203 of the upper housing element 200. The contact elements 202 are spring-loaded by the two bends. The plastic part 201 has guide elements which determine the path of the contact elements 202 and which have a clearance, thus enabling the contact elements 202 to spring. This makes it possible to compensate for manufacturing tolerances.

[0073] Furthermore, a potting compound 206 is applied to an outer surface 205 of the collar 203, which bears against the flange 301 of the lower housing element 300, and by means of which the upper housing element 200 and the lower housing element 300 are sealed. The potting compound 206 seals the interior of the upper housing element 200 and the lower housing element 300 against environmental influences. In addition, the potting compound 206 ensures mechanical stabilization of the connection between the housing elements 200, 300. The potting compound 206 can have a sealing compound that compensates for differences in the expansion coefficients of the upper and lower housing elements 200, 300. In this way, the occurrence of mechanical stresses can be reduced or avoided, thus ensuring a long-term stable seal between the connection between the flange and the collar.

[0074] The lower housing element 300 is designed to be connected to the upper housing element 200. The lower housing element 300 can have a sealing ring 303 located on the outside of the lower housing element. The lower housing element can also have a nozzle-shaped protective element 304. The lower housing element 300 has an upper region with a large cross-section, which is designed to enclose the core component 100 and also to enclose the collar 203 of the upper housing element 200. The upper region has the inward-facing flange 301 at its upper end. This flange lies either directly or via the potting 206 on the outer surface 205 of the collar 203 of the upper housing element 200.

[0075] A sealing element 130, formed by an internal sealing ring, seals the media connection channel 302 against the core component 100. The sealing element 130 forms an axial seal with the lower housing element 300 and the core component 100. In particular, the sealing element 130 is arranged between the circuit carrier 102 of the core component 100 and the lower housing element 300, directly adjacent to the sealing surface 113b on the underside 102b of the circuit carrier 102. The sealing element 130 can in particular laterally surround the inner outlet opening of the media connection channel 302 facing the core component 100, so that the fluid can only be supplied to the central region 113 on the underside 102b of the circuit carrier 102, but not to the edge region 114 on the underside 102b of the circuit carrier 102.The sealing element 130 can be arranged squeezed between the sealing surface 113b of the circuit carrier 102 and a sealing surface of the lower housing element 300 and thus seal the underside 100b of the core component 100 against the lower housing element 300.

[0076] The lower region of the lower housing element 300, which has the media connection channel 302, has a smaller diameter than the upper region. The lower region with the media connection channel 302 is tubular and hollow in its interior. In particular, the interior of the lower region forms the interior of the media connection channel 302, via which a fluid is conducted to the core component 100. The outer wall of the lower region can be designed as a thread. The sealing ring 303 can be arranged on the outer side of the lower housing element 300 in the transition from the lower region to the upper region. This is designed to seal the lower housing element 300 when the sensor arrangement 1000 is installed. Alternative designs of the sealing region of the lower housing element 300 are possible.

[0077] The protective element 304 can be designed such that it encloses the temperature sensor element 105 and thus provides mechanical protection. At the same time, it must allow good access of the fluid to the temperature sensor element 105. Since the protective element 304 is not attached to the core component 100, no mechanical stress is exerted by the protective element 304 on the core component 100. A positive fit on both sides between the protective element 304 and the media connection channel 302 in the lower region of the lower housing element 300 ensures that the protective element 304 is held in the lower housing element 300. The positive fit can be formed, for example, by deformation, for example heat caulking.The protective element 304 can, in particular, be a plastic part and can have at least one or more webs 305, which, by force-fitting and / or form-fitting with the wall of the media connection channel 302, can prevent twisting or slipping of the protective element 304. Furthermore, the protective element 304 can electrically and thermally insulate the temperature sensor element 105 from the lower housing element 300 and thus increase the measurement accuracy. In an alternative embodiment, the sensor arrangement can.

[0078] 1000 do not have a protective element 304 .

[0079] In the media connection channel 302 formed in the lower housing element 300, a pressure acts which acts in the axial direction, but also in the radial direction. The fluid guided through the media connection channel 302 exerts a force directed upwards in the axial direction on the core component 100 with its pressure, as indicated by the arrows in Figure 9. This force is exerted on the circuit carrier 102, which seals the media connection channel 302 with the sealing element 130. The force is transmitted via the circuit carrier 102 to the support element 103. The support element 103 has a stop surface which bears against the stop surface 204 of the upper housing element 200, so that the force is transmitted from the support element 103 to the upper housing element 200.The upper housing element 200 is designed in such a way that it transmits the force to the flange 301 of the lower housing element 300, against which the collar 203 of the upper housing element 200 bears in the axial direction, as is indicated purely by way of example in Figure 9 on the left side of the sensor arrangement 1000.

[0080] In the circuit carrier 102, the force acts in the central region 113, but not on the edge region 114. Since the support element 103 is arranged in the central region 113 of the circuit carrier 102 and bears against the stop surface 204 of the upper housing element 200, the support element 103 absorbs the force and transmits it to the upper housing element 200. This prevents bending of the circuit carrier 102. Supports in the edge region 114 of the circuit carrier 102 can be dispensed with. The edge region 114 of the circuit carrier 102 can therefore be used for the electrical components 106.

[0081] The features and exemplary embodiments described in conjunction with the figures can be combined with one another according to further exemplary embodiments, even if not all combinations are explicitly described. Furthermore, the exemplary embodiments described in conjunction with the figures can alternatively or additionally comprise further features according to the description in the general part.

[0082] The invention is not limited to the embodiments described herein. Rather, the invention encompasses any novel feature and any combination of features, including, in particular, any combination of features in the claims, even if this feature or combination itself is not explicitly stated in the claims or embodiments.

[0083] Reference symbol

[0084] 100 core components

[0085] 100a top

[0086] 100b bottom

[0087] 101 Junction

[0088] 101a junction

[0089] 101b junction

[0090] 102 circuit boards

[0091] 102a top

[0092] 102b bottom

[0093] 102c side surface

[0094] 103 Support element

[0095] 103a frame

[0096] 103b Bridge

[0097] 104 Pressure sensor element

[0098] 105 Temperature sensor element

[0099] 105a supply line

[0100] 105b sensor cell

[0101] 106 Electrical component

[0102] 107 Contact

[0103] 108 ladder structure

[0104] 108a Via

[0105] 108b Conductor track

[0106] 109 electrical feedthrough

[0107] 110 Potting material

[0108] 112 Print implementation

[0109] 113 middle range

[0110] 113a Sealing area

[0111] 113b Sealing surface

[0112] 114 Marginal area

[0113] 130 Sealing element

[0114] 200 upper housing element 201 plastic element

[0115] 202 Contact element

[0116] 203 collar

[0117] 204 Stop surface

[0118] 205 Outer surface of the collar

[0119] 206 Casting

[0120] 300 lower housing element

[0121] 301 flanging

[0122] 302 Media connection channel

[0123] 303 sealing ring

[0124] 304 protective element

[0125] 305 jetty

[0126] 1000 sensor array

[0127] AA distance

[0128] PI boundary point

[0129] P2 edge point

[0130] MP center point

[0131] L Length of the straight line from PI to P2

Claims

Patent claims 1. Core component (100) for a sensor arrangement (1000), comprising - a circuit carrier (102) with an upper side (102a) and a lower side (102b) opposite the upper side (102a), - a pressure sensor element (104) and - a temperature sensor element (105), wherein - the circuit carrier (102) has a central region (113) and an edge region (114) surrounding the central region (113), - the central region (113) has a sealing region (113a) which adjoins the edge region (114), - the pressure sensor element (104) and the Temperature sensor element (105) is mounted in the central region (113) on the circuit carrier (102), - at least the temperature sensor element (105) in the middle Area (113) is mounted on the underside (102b) and is electrically connected to first connection points (101a) on the underside (102b), - the circuit carrier (102) is free from electrical passages that lead from the bottom (102b) in the middle area (113) to the top (102a) in the middle area (113).

2. Core component (100) according to claim 1, wherein the first Connection points (101a) with electrical Conductor structures (108) are connected, which lead within the circuit carrier (102) from the central region (113) to the edge region (114).

3. Core component (100) according to claim 2, wherein the electrical conductor structures (108) are connected to second connection points (101b) on the upper side (102a) of the circuit carrier (102) in the edge region (114).

4. Core component (100) according to one of the preceding claims, wherein the pressure sensor element (104) is mounted in the central region (113) on the upper side (102a).

5. Core component (100) according to claim 4, wherein a pressure feedthrough (112) in the central region (113) leads from the bottom side (102b) to the top side (102a) to the pressure sensor element (104).

6. Core component (100) according to claim 5, wherein the pressure feedthrough (112) is the only feedthrough of the circuit carrier (102) leading from the bottom side (102b) in the central region (113) to the top side (102a) in the central region (113).

7. Core component (100) according to one of the preceding claims, wherein the circuit carrier (102) has a sealing surface (113b) for a sealing element (130) on the underside (102b) in the sealing region (113a).

8. Core component (100) according to one of the preceding claims, wherein a support element (103) is arranged in the central region (113) on the upper side (102a).

9. Core component (100) according to claim 8, wherein the support element (103) has a frame (103a) which encloses an inner region in which the pressure sensor element (104) is arranged.

10. Core component (100) according to claim 9, wherein the inner region is filled with a potting material (110).

11. Core component (100) according to one of claims 8 to 10, wherein the support element (103) has at least two webs (103b), between which an electrical component (106) is mounted on the upper side (102a).

12. Sensor arrangement (1000) comprising - a core component (100) according to one of the previous Claims and - an upper housing element (200) which contains the core component (100) encloses.

13. Sensor arrangement (1000) according to claim 12 with reference to one of claims 8 to 11, wherein the upper housing element (200) rests against an upper side of the support element (103).

14. Sensor arrangement (1000) according to claim 12 or 13, wherein the sensor arrangement (1000) comprises a lower housing element (300) having a media connection channel (302) configured to guide a fluid to a bottom side (100b) of the core component (100).

15. Sensor arrangement (1000) according to claim 14, wherein between the circuit carrier (102) and the lower Housing element (300) directly adjacent to the A sealing element (130) is arranged on the sealing surface (113a) on the underside (102b) of the circuit carrier (102).

16. Sensor arrangement (1000) according to claim 14 or 15, further comprising a protective element (304) which is inserted into the media connection channel (302).

17. Sensor arrangement (1000) according to one of claims 14 to 16, wherein an axial direction along the media connection channel (302) points to the core component (100), wherein the lower housing element (300) projects beyond the core component (100) in the axial direction and wherein the lower housing element (300) has a flange (301) which encloses an axially lower end of the upper housing element (200).

18. Sensor arrangement (1000) according to claim 17 with reference back to claim 13, wherein the core component (100) is designed to transmit a force via the support element (103) to the upper housing element (200), and wherein the upper housing element (200) is designed to divert the force absorbed by the core component (100) to the flange (301) of the lower housing element (300).

19. Sensor arrangement (1000) according to claim 17 or 18, wherein the upper housing element (200) and the flange (301) are sealed to one another by a potting compound (206).

Images