Radio-frequency electronic device

Abstract

The present description relates to an electronic device (107) comprising: - a power divider circuit (115) comprising an input intended to receive a radio-frequency signal (SIG); - at least one first radio-frequency transition terminal (119b) connected to a first output of the power divider circuit; and - at least one phase-shifting circuit (117) connecting a second output of the power divider circuit to a second radio-frequency transition terminal (119a), the first and second radio-frequency transition terminals being intended to be placed in contact with an outer face of a metal enclosure (101).

Description

DESCRIPTION Radio frequency electronic device This application is based on, and claims priority from, French patent application 2304314 filed on April 28, 2023 and entitled "Radio Frequency Electronic Device", which is considered to form an integral part of this description within the limits provided by law. technical field

[0001] This description relates generally to electronic devices, and more specifically to radio frequency electronic devices. Previous technique

[0002] Radio frequency electronic devices capable of powering and / or communicating remotely with other electronic devices have been proposed. However, existing radio frequency electronic devices suffer from several drawbacks. In particular, when a transmitting device is used to generate a radio frequency electromagnetic field intended to power and / or communicate with a receiving device located inside a metallic enclosure, the radio frequency electromagnetic field produced by the transmitting device is subject to constraints due to the existence of excitation modes imposed by the dimensions and geometry of the enclosure. This results in undesirable phenomena, such as a reduction in bandwidth and the appearance of local drops in field strength, impairing the power supply to the receiving device by the transmitting device and / or the remote communication between these devices.

[0003] To overcome these drawbacks, it has been proposed, in particular, to act on the natural modes of a metallic enclosure by modifying its geometry using parasitic elements placed inside the metal enclosure. However, such a modification of the internal geometry of the metal enclosure may prove difficult, or even impossible, to implement, particularly due to layout constraints tending to limit the number of possible locations for placing the parasitic elements inside the metal enclosure, and also has the disadvantage of being optimized only for a very limited range of emission frequencies.

[0004] Alternatively, another strategy involves choosing the dimensions of the metallic enclosure so that several excitation modes can be established within the enclosure at the desired transmission frequency. Transmitters are then distributed inside the enclosure and controlled, for example, incoherently, to establish the field at the desired frequency. However, this has the drawback of requiring the dimensions of the metallic enclosure to be determined by the frequency. Furthermore, it necessitates integrating the transmitters inside the enclosure, which can prove difficult, or even impossible, due to the ambient conditions (pressure, temperature, humidity, etc.) within the enclosure. Summary of the invention

[0005] It would be desirable to overcome the drawbacks of existing radio frequency electronic devices. In particular, there is a need to improve devices designed to emit a field inside a metallic enclosure.

[0006] To this end, one embodiment provides for an electronic device comprising: - a power divider circuit comprising an input intended to receive a radio frequency signal; - at least one first radio frequency transition terminal connected to a first output of the power divider circuit; and - at least one phase-shifting circuit linking a second output of the power divider circuit to a second radio frequency transition terminal, the first and second radio frequency transition terminals being intended to be in contact with an outer face of a metallic enclosure.

[0007] According to one embodiment, each phase-shifting circuit includes a delay line.

[0008] According to one embodiment, the delay line includes a microstrip line.

[0009] According to one embodiment, the input of the power divider circuit is connected to a coaxial connector.

[0010] According to one embodiment, the power divider circuit is a Wilkinson divider.

[0011] According to one embodiment, the power divider circuit, the phase shifter circuit and the first and second radio frequency transition terminals are formed in the same metallization level of a printed circuit board.

[0012] One embodiment provides for a system comprising: - a metal enclosure; - at least one first electronic device located inside the metal enclosure; and - at least one second device as described.

[0013] According to one embodiment, the metal enclosure includes a lid sealing a tank.

[0014] According to one embodiment, the radio frequency transition terminals are in contact with the enclosure lid.

[0015] According to one embodiment, each first device is a sensor, preferably a temperature sensor.

[0016] According to one embodiment, each first device is an energy receiver.

[0017] According to one embodiment, each first device includes an antenna and a surface acoustic wave sensor.

[0018] According to one embodiment, the system comprises a single second device.

[0019] Furthermore, one embodiment provides for an electronic device comprising: - at least one first radio frequency transition terminal intended to receive a radio frequency signal; and - at least one capacitive or inductive element connected to a second radio frequency transition terminal, the first and second radio frequency transition terminals being intended to be in contact with an outer face of a metallic enclosure.

[0020] According to one embodiment, said at least one capacitive or inductive element is a single capacitor of variable capacitance.

[0021] According to one embodiment, said at least one capacitive or inductive element is a single coil of variable inductance.

[0022] According to one embodiment, said at least one capacitive or inductive element is connected to the second radio frequency transition terminal by a microstrip line.

[0023] According to one embodiment, the first radio frequency transition terminal is connected to a coaxial connector by a microstrip line.

[0024] According to one embodiment, said at least one capacitive or inductive element and the first and second radio frequency transition terminals are formed in the same level of metallization of a printed circuit board. Brief description of the drawings

[0025] These features and advantages, as well as others, will be described in detail in the following description of particular embodiments, given by way of non-limiting example, in relation to the attached figures, among which:

[0026] Figure 1 is a schematic and partial side and cross-sectional view of an example of a system comprising radio frequency electronic devices according to one embodiment;

[0027] Figure 2 is a graph illustrating variations, as a function of an emission frequency, of a reflection coefficient of the radio frequency electronic devices of the system in Figure 1;

[0028] Figure 3 is a schematic and partial top view of an example of a system comprising a radio frequency electronic device according to one embodiment;

[0029] Figure 4 is a schematic and partial top view of the radio frequency electronic device of the system in Figure 3 according to one embodiment;

[0030] Figure 5 is a schematic and partial side and cross-sectional view of an example of a system comprising radio frequency electronic devices according to one embodiment;

[0031] Figure 6 is a graph illustrating variations, as a function of an emission frequency, of a reflection coefficient of the radio frequency electronic devices of the system in Figure 5;

[0032] Figure 7 is a schematic and partial top view of an example of a system comprising a radio frequency electronic device according to one embodiment;

[0033] Figure 8 is a schematic and partial top view of a portion of the radio frequency electronic device of the system in Figure 7, according to one embodiment; and

[0034] Figure 9 is a schematic and partial top view of another part of the radio frequency electronic device of the system of Figure 7 according to one embodiment. Description of the implementation methods

[0035] The same elements have been designated by the same reference numerals in the different figures. In particular, structural and / or functional elements common to the different embodiments may have the same reference numerals and may have identical structural, dimensional and material properties.

[0036] For the sake of clarity, only the steps and elements necessary for understanding the described embodiments have been shown and are detailed. In particular, the metallic enclosures on which the described radio frequency electronic devices can be placed are not detailed, as the embodiments of this description are compatible with all or most metallic enclosures that can benefit from the implementation of a radio frequency electronic device to power and / or communicate with one or more other radio frequency electronic devices located inside the metallic enclosure.

[0037] Unless otherwise specified, when referring to two connected elements, this means directly connected without any intermediate elements other than conductors, and when referring to two coupled elements, this means that These two elements can be connected or linked via one or more other elements.

[0038] In the description that follows, when referring to absolute positional qualifiers, such as the terms "front", "back", "top", "bottom", "left", "right", etc., or relative terms such as "above", "below", "superior", "inferior", etc., or orientation qualifiers such as "horizontal", "vertical", etc., refers, unless otherwise specified, to the orientation of the figures.

[0039] Unless otherwise specified, the expressions "approximately", "roughly", "about", and "on the order of" mean within 10%, preferably within 5%.

[0040] Figure 1 is a schematic and partial side and cross-sectional view of an example of a system 100 comprising radio frequency electronic devices according to one embodiment.

[0041] In the example shown, the system 100 comprises a container 101 with a tank 103 whose upper part is sealed by a lid 105. The tank 103 and the lid 105 thus form a chamber, or cavity, delimited by the walls and bottom of the tank 103, and by the inner face of the lid 105 (the underside of the lid 105, in the orientation of Figure 1). The container 101 of the system 100 is, for example, essentially made of a conductive material, such as a metal or a conductive metal alloy. The lid 105 may be made of the same material as the tank 103, or of a different material. Although Figure 1 illustrates an example in which the enclosure 101 comprises the tank 103 sealed by the lid 105, this example is not limiting; the enclosure 101 of the system 100 can, more generally, be made by means of any elements that allow a cavity to be formed, or room, entirely delimited by walls made mostly of a conductive material.

[0042] Although not detailed in Figure 1, the lid 105 is electrically isolated from the tank 103. For example, the lid 105 is separated from the tank 103 by an insulating element, for example a gasket made of a dielectric material, interposed between the lid 105 and the tank 103. The tank 103 is, for example, brought to a reference potential, for example ground.

[0043] In the illustrated example, the system 100 further includes a radio frequency electronic device 107 located outside the enclosure 101. The radio frequency electronic device 107 is, for example, intended to communicate, by electromagnetic coupling, with one or more other radio frequency electronic devices 109 located inside the enclosure 101. More specifically, in this example, the radio frequency electronic device 107 is intended to power the cover 105, so that the cover 105 produces an electromagnetic field inside the enclosure 101 to enable communication with the radio frequency electronic devices 109.Although Figure 1 illustrates an example in which five radio frequency electronic devices 109-1, 109-2, 109-3, 109-4 and 109-5 are placed inside enclosure 101, this example is not limiting, enclosure 101 being able to contain any non-zero number of radio frequency electronic devices 109 capable of communicating with the radio frequency electronic device 107 placed outside enclosure 101.

[0044] In the example illustrated in Figure 1, the radio frequency electronic devices 109 are attached to a substrate 111. The substrate 111 is, for example, a wafer or a piece of wafer in and on which the Radio frequency electronic devices 109. In the example shown, the substrate 111 rests on a support 113, for example, a heating plate. The support 113 has, for example, in side view, a T-shape, one end of the vertical part resting on the bottom of the tank 103 and the horizontal part being substantially parallel to the bottom of the tank 103 and to the lower and upper faces of the lid 105. In the illustrated example, the radio frequency electronic devices 109 are located on the side of a face of the substrate 111 opposite the support 113 (on the side of the upper face of the substrate 111, in the orientation of Figure 1), the radio frequency electronic devices 109 being positioned opposite the lid 105 of the enclosure 101.

[0045] For example, the radio frequency electronic devices 109 of the system 100 are sensors, for example temperature or pressure sensors, intended to be powered by an electromagnetic field (EMF) produced by the lid 105 excited by the device 107 and to transmit back to the device 107 information relating to physical quantities, for example the temperature or pressure prevailing inside the enclosure 101. In a case where the radio frequency electronic devices 109 are temperature sensors, this makes it possible, for example, to know the temperature at different locations inside the enclosure 101, for example at different points on the surface of the substrate 111, in order, for example, to allow the temperature to be mapped in different areas located inside the enclosure 101.As an example, this allows for real-time monitoring of the temperature of substrate 111 while substrate 111 is being heated by support 113.

[0046] Although not detailed in Figure 1, each radio frequency electronic device 109 of the system 100 includes, for example, in the case where the devices 109 are sensors, an antenna connected to a Surface Acoustic Wave (SAW) sensor. The SAW sensor of each radio frequency electronic device 109 has, for example, a resonant frequency that varies depending on the temperature to which the radio frequency electronic device 109 is subjected, in the case where the devices 109 are temperature sensors. As an example, the resonant frequencies of devices 109-1, 109-2, 109-3, 109-4, and 109-5 vary around center frequencies 101, ...

[0047] In the example shown, the radio frequency electronic device 107 includes a power divider circuit 115 (DIV) one output of which is connected, via a phase shifter circuit 117 (c|)), to a radio frequency transition terminal 119a and another output of which is connected to another radio frequency transition terminal 119b. In the illustrated example, the radio frequency transition terminals 119a and 119b of the radio frequency electronic device 107 are on and in contact with an outer face of the enclosure 101. More specifically, in the example shown, the terminals 119a and 119b are on and in contact with the outer face of the cover 105 of the enclosure 101 (the upper face of the cover 105, in the orientation of Figure 1), so as to excite the cover 105 by means of the radio frequency signals applied by the radio frequency transition terminals 119a and 119b.

[0048] As an example, each radio frequency transition terminal 119a, 119b is a metallic pad featuring, Viewed from above, the perimeter is approximately circular in shape. This example is not exhaustive, however, as each radio frequency transition terminal 119a, 119b may, as an alternative, have any shape.

[0049] The power divider circuit 115 of device 107 is, for example, designed to receive a radio frequency signal SIG and retransmit the radio frequency signal to each of its outputs. The signal power at each output of circuit 115 is, for example, approximately equal to half the power of the input signal SIG. The radio frequency signal is then transmitted to the radio frequency transition terminals 119a and 119b so as to allow the emission of the electromagnetic field EMF by means of the cover 105. In the example shown, the electromagnetic field EMF is produced inside the enclosure 101, for example, in the direction of the radio frequency electronic devices 109.The electromagnetic field (EMF) can, for example, be used to power and communicate with radio frequency electronic devices 109, and to determine the resonant frequency of each device 109 in order to estimate the temperature to which that device 109 is exposed, in the case where the devices 109 are temperature sensors. The SIG signal is, for example, a voltage referenced to the potential applied to the tank 103.

[0050] Figure 2 is a graph illustrating the variations, as a function of an emission frequency f, of a reflection coefficient Su of the radio frequency electronic devices 107 and 109 of system 100 in Figure 1. More specifically, Figure 2 includes a curve 207 illustrating the variations of the reflection coefficient Su of the radio frequency electronic device 107 as a function of the emission frequency f, and curves 209-1, 209-2, 209-3, 209-4, and 209-5 illustrating the variations of the reflection coefficient Su of the devices radio frequency electronics 109-1, 109-2, 109-3, 109-4 and 109-5, respectively, depending on the emission frequency f.

[0051] To simplify, Figure 2 illustrates an example in which the reflection coefficient Su of each radio frequency electronic device 109-1, 109-2, 109-3, 109-4, 109-5 is minimal when the emission frequency f is equal to the center frequency fi, f2, fs, fv fs of the device in question. In other words, Figure 2 illustrates an example in which the resonant frequency, or natural frequency, of each radio frequency electronic device 109-1, 109-2, 109-3, 109-4, 109-5 is approximately equal to its center frequency. This example is not exhaustive, however, as the resonant frequency of each radio frequency electronic device 109-1, 109-2, 109-3, 109-4, 109-5 can, of course, be different from its center frequency fi, fs, fs, f fs.As an example, the shift in the resonance frequency of a radio frequency electronic device 109-1, 109-2, 109-3, 109-4, 109-5 from its center frequency fi, fs, fs, f fs depends on a temperature difference to which the device 109 is exposed from a temperature corresponding to the case where the resonance frequency of the device 109-1, 109-2, 109-3, 109-4, 109-5 is equal to its center frequency fi, f2, fs, f fs- This thus makes it possible to know the temperature to which each device 109 considered is exposed inside the enclosure 101.

[0052] Furthermore, Figure 2 illustrates an example in which the center frequencies fi, f2, fs, f4, and f5 are uniformly spaced from each other. This example is not exhaustive, however; the center frequencies fi, f2, fs, f4, and fs could, alternatively, be spaced from each other in any way.

[0053] One advantage of including two radio frequency transition terminals 119a and 119b in the radio frequency electronic device 107, transmitting signals that are out of phase with each other, is that it allows for a wider bandwidth of the radio frequency electromagnetic field (EMF) produced by the device 107 (curve 207) compared to the bandwidth that would be obtained by using, for example, a single radio frequency transition terminal (dashed curve 207'), such as terminal 119b. This makes it possible, for example, to address several devices 109, or a larger number of devices 109.

[0054] One advantage of the radio frequency electronic device 107 is that it does not require any modifications to the geometry of the enclosure 101. This allows the device 107 to be integrated into enclosures of various shapes and sizes. Another advantage of the device 107 is that it does not require the integration of any components, such as one or more radio frequency field emitters, inside the enclosure 101. This allows the device 107 to be used in applications where the devices 109 are exposed to harsh environmental conditions, for example, temperatures on the order of several hundred degrees, making it impossible to integrate all or part of the radio frequency electronic device 107 inside the enclosure.

[0055] For example, the center frequencies fi, f2, fs, f4 and fs are on the order of several hundred megahertz, for example between 800 and 1000 MHz. The frequency band including the center frequencies fi, fs, fs, f4 and fs has a width that is all the greater as the number of devices 109 is greater.

[0056] Figure 3 is a schematic, partial top view of an example of a 300 system comprising the radio frequency electronic device 107 according to one embodiment. The system 300 of figure 3 differs from the system 100 of figure 1 in that, in the system 300 of figure 3, the radio frequency electronic device 107 is interposed between the cover 105 and the tank 103 (not shown) of the enclosure 101.

[0057] In the example shown, the cover 105 includes several access points or ports 301 (five ports 301-1, 301-2, 301-3, 301-4, and 301-5, in the example illustrated in Figure 3). The radio frequency transition terminals 119a and 119b of the radio frequency electronic device 107 are, for example, arranged to be in contact with ports 301-1 and 301-2, respectively. As an example, the ports 301 correspond to holes for fasteners, such as bolts, to mechanically secure the cover 105 to the tank 103. Insulating elements, not shown in Figure 3, may be provided to achieve electrical insulation between the cover 105 and the tank 103.

[0058] In the example shown, ports 301-1 and 301-2, where radio frequency transition terminals 119a and 119b are located, are adjacent. However, this example is not exhaustive; ports 301 receiving terminals 119a and 119b could, alternatively, be non-adjacent. For example, ports 301 where radio frequency transition terminals 119a and 119b are located are selected based on results obtained using numerical simulation tools, taking into account factors such as the geometry of enclosure 101, the number of available ports 301, the field frequency, etc., in order to obtain the widest possible bandwidth.

[0059] Figure 4 is a schematic and partial top view of the radio frequency electronic device 107 of system 300 of figure 3 according to one embodiment.

[0060] In the example shown, the power divider circuit 115 is a Wilkinson divider comprising an input terminal connected to the input of the radio frequency electronic device 107. In the example shown, the input of device 107 includes a connector 401, for example a coaxial connector, for example of type SMA (SubMiniature version A), for receiving the SIG signal. The power divider circuit 115 includes two conductive traces connected to connector 401 and a resistive element 403, for example a resistor, connecting the two conductive traces in the vicinity of the outputs of circuit 115. As an example, the resistive element 403 has a resistance on the order of 100 Ω.

[0061] In the example shown, the outputs of the power divider circuit 115 are connected to the radio frequency transition terminals 119a and 119b by conductive tracks of different lengths. The phase shifter circuit 117 thus includes a delay line. More precisely, in the example illustrated in Figure 4, the radio frequency transition terminal 119a is connected to one output of the power divider circuit 115 by a conductive track 405a that is longer than another conductive track 405b connecting the radio frequency transition terminal 119b to the other output of the power divider circuit 115. As an example, the difference in length between tracks 405a and 405b is such that the signal transmitted to the radio frequency transition terminal 119a is phase-shifted by approximately 90° with respect to the signal transmitted to the radio frequency transition terminal 119b. This example is not exhaustive, however; the respective lengths of the tracks conductive 405a and 405b can be chosen to obtain any phase shift between the signals applied to the radio frequency transition terminals 119a and 119b, the phase shift between these signals can for example be determined by means of numerical simulation tools so as to maximize the bandwidth of the EMF field produced by the device 107.

[0062] For example, the power divider circuit 115, the phase shifter circuit 117, the conductive traces 405a and 405b, and the radio frequency transition terminals 119a and 119b are formed in one metallization layer of a printed circuit board. The conductive traces 405a and 405b are, for example, part of microstrip lines which further include a ground plane formed in another metallization layer located on one side of the printed circuit board opposite the side on which the circuits 115 and 117, the traces 405a and 405b, and the terminals 119a and 119b are formed. In a case where the radio frequency transition terminals 119a and 119b are in contact with the cover 105 of the enclosure 101, the ground plane located on the opposite side of the printed circuit board is for example in contact with the tank 103.This example is not limiting, however; the conductive tracks 405a and 405b can, as an alternative, be implemented using any type of transmission line, for example a stripline, a coplanar waveguide, a coaxial cable, etc. Furthermore, although a case in which the printed circuit board comprises two metallization levels has been presented for the sake of simplification, the described embodiments are not limited to this case; the printed circuit board can more generally have any number, for example, two or more, of metallization levels. which are formed the conducting elements of device 107.

[0063] Although we have detailed above in relation to figure 4 an example in which the power divider circuit 115 is of the "Wilkinson divider" type and in which the phase shifter circuit 117 includes a delay line, formed on one side of a printed circuit board, these circuits can of course be made by any other means and on any type of support suitable for the application.

[0064] Alternatively, structures other than that illustrated in Figure 4 may be provided by a person skilled in the art based on the information in this description, particularly to meet system compactness objectives. For example, a person skilled in the art may provide a more compact structure than that illustrated in Figure 4, in which the power divider circuit 115 has a generally oval or elliptical shape. In this case, a conductive trace substantially orthogonal to the major axis of the ellipse formed by the circuit 115 connects, for example, connector 401 to the circuit 115, and conductive traces 405a and 405b are, for example, respectively connected to the circuit 115 near foci of the ellipse. Alternatively, conductive traces 405a and 405b to the circuit 115 are connected, for example, at points on the circuit 115 separated by a distance substantially equal to the major axis of the ellipse.Furthermore, each conductive track 405a, 405b may, as an alternative, have a non-angular shape.

[0065] Figure 5 is a schematic, partial side and cross-sectional view of an example of a 500 system comprising radio frequency electronic devices according to one embodiment. The 500 system in Figure 5 and the 100 system in Figure 1 share common elements. These common elements will not be detailed again below.

[0066] The system 500 of Figure 5 differs from the system 100 of Figure 1 in that the system 500 comprises a radio frequency electronic device 507 analogous to the radio frequency electronic device 107 of the system 100 of Figure 1, and notably includes the radio frequency transition terminals 119a and 119b. In the device 507, the radio frequency transition terminal 119a is connected to a reference potential application terminal, for example, ground, via an adjustable or controllable element 517, and the radio frequency signal SIG to be transmitted is applied to the radio frequency transition terminal 119b. The controllable element 517 includes, for example, at least one controllable capacitive element and / or at least one controllable inductive element. As an example, the controllable element 517 includes a single variable capacitance capacitor, a single varactor diode, a set of switchable capacitors, or a set of switchable varactor diodes.The controllable element 517 may, in addition or as an alternative, comprise a single variable inductor coil or a set of switchable coils. The capacitance and / or inductance of the controllable element 517 may vary discretely or substantially continuously. The element 517 is, for example, controlled by a control signal from a control circuit (not shown in Figure 5) external or internal to the radio frequency electronic device 507. The controllable element 517 acts, for example, as a controllable parasitic element, allowing the center frequency of the signal produced by the device 507 to be modified, via the cover 105, inside the enclosure 101.

[0067] Figure 6 is a graph illustrating the variations, as a function of an emission frequency f, of a reflection coefficient Su of the radio frequency electronic devices 507 and 109 of the system 500 of Figure 5. More specifically, Figure 6 includes a curve 607 illustrating the variations of the reflection coefficient Su of the radio frequency electronic device 507 as a function of the emission frequency f. Figure 6 further includes curves 209-1, 209-2, 209-3, 209-4 and 209-5 illustrating the variations of the reflection coefficient Su of the radio frequency electronic devices 109-1, 109-2, 109-3, 109-4 and 109-5 as a function of the emission frequency f as previously described in relation to Figure 2.

[0068] One advantage of including the controllable element 517 in the radio frequency electronic device 507 is that it allows the resonant frequency of device 507 (arrows pointing left and right in the orientation of Figure 6) to be shifted compared to what would be obtained by using, for example, only the radio frequency transition terminal 119b. This makes it possible, for example, to address several devices 109, or a larger number of devices 109, by controlling element 517 in such a way as to sweep the frequency range within which the resonant frequencies of devices 109 are likely to be found.

[0069] Figure 7 is a schematic, partial top view of an example of a system 700 comprising the radio frequency electronic device 507 of Figure 5, according to one embodiment. The system 700 of Figure 7 differs, for example, from the system 500 of Figure 5 in that, in the system 700 of Figure 7, the radio frequency electronic device 507 is interposed between the cover 105 and the tank 103 (not shown) of the enclosure 101.

[0070] In the example shown, the radio frequency electronic device 507 comprises two separate parts 507a and 507b. In this example, part 507a of the device 507 includes, for example, the radio frequency transition terminal 119a, and part 507b of the device 507 includes the radio frequency transition terminal 119b.

[0071] The radio frequency transition terminals 119a and 119b of the radio frequency electronic device 507 are, for example, arranged to be in contact with ports 301-4 and 301-2, respectively. In the example shown, ports 301-4 and 301-2, where radio frequency transition terminals 119a and 119b are located, are not adjacent. This example is not limiting, however; the ports 301 receiving terminals 119a and 119b could, alternatively, be adjacent. As an example, the ports 301 where the radio frequency transition terminals 119a and 119b are placed are chosen from results obtained using numerical simulation tools, depending for example on the geometry of the enclosure 101, the number of ports 301 available, the frequency of the field, etc., for example so as to be able to sweep the widest possible range of frequencies.

[0072] Figure 8 is a schematic and partial top view of part 507b of the radio frequency electronic device 507 of system 700 of figure 7 according to one embodiment.

[0073] In the example shown, part 507b of device 507 includes a connector 801 for receiving the SIG signal. Connector 801 is, for example, similar or identical to connector 401 described earlier in relation to Figure 4.

[0074] Connector 801 is connected, via a conductive track 803, to the radio frequency transition terminal 119b. For example, the radio frequency transition terminal 119b is formed in a metallization layer of a printed circuit board. The conductive trace 803, for instance, is part of a microstrip line that also includes a ground plane formed in another metallization layer located on one side of the printed circuit board opposite the side on which terminal 119b is formed. In a case where the radio frequency transition terminals 119a and 119b are in contact with the cover 105 of the enclosure 101, the ground plane on the opposite side of the printed circuit board is, for example, in contact with the tank 103. This example is not limiting, however; the conductive trace 803 could, alternatively, be made using any type of transmission line as detailed previously for the conductive traces 405a and 405b.

[0075] Figure 9 is a schematic and partial top view of part 507a of the radio frequency electronic device 507 of system 700 of figure 7 according to one embodiment.

[0076] In the example shown, part 507a of device 507 includes a conductive trace 903 connecting the radio frequency transition terminal 119a to the controllable element 517. For example, the radio frequency transition terminal 119a is formed in a metallization layer of a printed circuit board. The conductive trace 903 is, for instance, part of a microstrip line further comprising a ground plane formed in another metallization layer located on one side of the printed circuit board opposite the side on which terminal 119a is formed. In a case where the radio frequency transition terminals 119a and 119b are in contact with the cover 105 of the enclosure 101, the ground plane located on the opposite side of the printed circuit board is, for example, in contact with the tank 103.

[0077] As an example, the controllable element 517 is a surface-mount component located on the side of the printed circuit board where the conductive trace 903 is formed.

[0078] Various embodiments and variations have been described. Those skilled in the art will understand that certain features of these various embodiments and variations could be combined, and other variations will become apparent to them. In particular, although the description in relation to Figures 1 to 4 takes as an example a case in which systems 100 and 300 comprise a single device 107 including two radio frequency transition terminals 119a and 119b, those skilled in the art are able, from the indications in this description, to foresee in each of systems 100 and 300: - any number, greater than or equal to two, of devices identical or similar to device 107, for example at least two devices 107, the terminals 119a and 119b of each device 107 being arranged in locations different from those where the terminals 119a and 119b of the other device(s) 107 are arranged; and / or - any number, greater than or equal to two, of radio frequency transition terminals analogous to terminals 119a and 119b and allowing to apply, in different places on the outer face of the enclosure 101, signals out of phase with each other, the terminals being for example connected to outputs of the same power divider circuit by microstrip lines of different lengths.

[0079] Furthermore, although the description in relation to Figures 5 to 9 uses as an example a case in which systems 500 and 700 comprise a single controllable element 517 connected to a radio frequency transition terminal 119a, a person skilled in the art is able, from the indications in this description, to predict any number, greater than or equal to two, of controllable elements identical or similar to element 517, for example a number greater than or equal to two of controllable elements 517 each connected to radio frequency transition terminals in different locations on the outer face of the enclosure 101, for example a device 507 comprising a single part 507b and several parts 507a arranged on several ports 301 of the cover 105.

[0080] Although examples of metrological applications in which devices 109 are sensors exchanging data with device 107 have been described above, the embodiments described also apply to wireless power transfer applications, for example applications in which devices 109 are energy receivers not exchanging data with device 107.

[0081] Finally, the practical implementation of the described embodiments and variants is within the grasp of a person skilled in the art, based on the functional specifications given above. In particular, determining the number and position of the radio frequency transition terminals, as well as the phase shift values ​​between the signals transmitted by these terminals, is within the grasp of a person skilled in the art, based on the information provided in this description.

[0082] Furthermore, the skilled person is capable of producing parts 507a and 507b of device 507 on the same printed circuit board, and of producing device 107 on several printed circuit boards.

Claims

CLAIMS 1. Electronic device (107) comprising: - a power divider circuit (115) comprising an input intended to receive a radio frequency signal (SIG); - at least one first radio frequency transition terminal (119b) connected to a first output of the power divider circuit; and - at least one phase shifter circuit (117) connecting a second output of the power divider circuit to a second radiofrequency transition terminal (119a), the first and second radiofrequency transition terminals being intended to be placed in contact with an external face of a metal enclosure (101).

2. Device according to claim 1, in which each phase shifter circuit (117) comprises a delay line.

3. Device according to claim 2, in which the delay line comprises a microstrip line.

4. Device according to any one of claims 1 to 3, wherein the input of the power divider circuit (115) is connected to a coaxial connector (401).

5. Device according to any one of claims 1 to 4, in which the power divider circuit (115) is a Wilkinson divider.

6. Device according to any one of claims 1 to 5, in which the power divider circuit (115), the phase shifter circuit (117) and the first and second radio frequency transition terminals (119a, 119b) are formed in the same metallization level of a printed circuit board.

7. System (100; 300) comprising: - a metal enclosure (101); - at least one first electronic device (109-1, 109-2, 109-3, 109-4, 109-5) arranged inside the metal enclosure; and - at least one second device (107) according to any one of claims 1 to 6.

8. System according to claim 7, in which the metal enclosure (101) comprises a cover (105) closing a tank (103).

9. System according to claim 8, in which the radiofrequency transition terminals (119a, 119b) are in contact with the cover (105) of the enclosure (101).

10. System according to any one of claims 7 to 10. 9, wherein each first device (109-1, 109-2, 109-3, 109-4, 109-5) is a sensor, preferably a temperature sensor.

11. System according to any one of claims 7 to 9, wherein each first device (109-1, 109-2, 109-3, 109-4, 109-5) is an energy receiver.

12. System according to any one of claims 7 to 10. 11, wherein each first device (109-1, 109-2, 109-3, 109-4, 109-5) comprises an antenna and a surface acoustic wave sensor.

13. System according to any one of claims 7 to 10. 12, comprising a single second device (107).

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