Sonar antenna

Abstract

The invention relates to a sonar antenna (20) having the following features: a base plate (22) to which a material (24) for influencing sound waves is applied; and a printed circuit board (24) which contacts a plurality of waterborne sound transducers arranged thereon. The waterborne sound transducers (28) of the plurality of waterborne sound transducers are arranged in recesses (30) in the material for acoustically influencing sound waves.

Description

[0001] Sonar antenna

[0002] Description

[0003] The invention relates to a sonar antenna and its manufacturing method.

[0004] In addition to the necessary underwater sound transducers, sonar antennas often include a backing to influence incoming sound waves. This can involve dampening or deliberately generating reflections of the incoming sound waves and rearward sound. The backing often has a base plate with one or more sound-influencing materials arranged on it, such as foam (layers) or one or more metal layers. The underwater sound transducers are inserted into the material to influence the sound waves, i.e. they are at least partially enclosed by it. The insertion and electrical contact of the underwater sound transducers is now done manually. However, this results in slight manufacturing tolerances. The higher the frequencies, the more important the exact relative positioning of the underwater sound transducers to one another becomes for signal processing.

[0005] The object of the present invention is therefore to create an improved concept for sonar antennas.

[0006] This problem is solved by the subject matter of the independent patent claims. Further advantageous embodiments are the subject matter of the dependent patent claims.

[0007] Exemplary embodiments show a sonar antenna with a base plate to which a material for influencing sound waves is applied. A foam material, for example, is suitable as a material for influencing the sound waves. Optionally, it is possible to use a stack of different materials, such as different foams. Furthermore, metal layers can optionally be present in the stack. The combination of the base plate and one or more materials for influencing the sound waves is also referred to as a backing or backing stack.

[0008] The sonar antenna further comprises a circuit board that contacts a plurality of water-based sound transducers arranged thereon. The water-based sound transducers are arranged in recesses in the material for acoustically influencing sound waves. The water-based sound transducers of the plurality of water-based sound transducers are then preferably arranged between the base plate and the circuit board. The water-based sound transducers can be arranged linearly or two-dimensionally, i.e. in a regular or irregular matrix, to form a surface array. Remaining cavities between the recess and the water-based sound transducer can be filled with a potting compound, for example an epoxy resin or a polyurethane encapsulation compound. Optionally, further electronics can be arranged on the circuit board. For example, the signal processing can take place partially or entirely on the circuit board.In particular, it is possible to preprocess the output signals of the waterborne sound transducers.

[0009] The idea is that the waterborne sound transducers can be positioned precisely on the circuit board. This can be done fully automated and is then highly precise. This means that the positions of the waterborne sound transducers relative to one another can be maintained precisely, which improves signal processing. Furthermore, the contacting of the waterborne sound transducers takes place in a single work step. Likewise, because the position of the waterborne sound transducers is known, it is possible to pre-cut the recesses into which the waterborne sound transducers are inserted into the material to influence the sound waves. The position of the recesses can thus be checked before the waterborne sound transducers are inserted. It is also possible to test the circuit board for functionality before the waterborne sound transducers are usually inseparably bonded to the backing. This reduces waste in the event of a defective production.

[0010] In exemplary embodiments, the water-based sound transducers are arranged in lines on the circuit board. The lines can have any shape. In particular, the lines can be straight, curved, or angled. The recesses can be in the form of trenches in the material for influencing sound waves, so that the water-based sound transducers of the plurality of water-based sound transducers are arranged in the trenches. The trenches thus run parallel to the lines. The trench structure simplifies, for example, filling the recesses, i.e. the trenches in this case. Potting compound does not need to be introduced for each water-based sound transducer, but only once per trench. An epoxy resin, for example, is a suitable potting compound.

[0011] Furthermore, a method for producing a sonar antenna is disclosed. The method comprises the following steps: a) providing a base plate with a material applied thereto for influencing sound waves; b) providing a circuit board with a plurality of water-based sound transducers arranged thereon; c) introducing recesses into the material for influencing sound waves at positions that correlate with the positions of the water-based sound transducers; d) inserting the circuit board, in particular with the water-based sound transducers first, into the recesses of the material for influencing sound waves; e) gluing the circuit board or the water-based sound transducers into the recesses. A potting compound, for example epoxy resin, can be used for the bonding. This means that in step e), the recesses can be filled with a potting compound, in particular an epoxy resin, in order to glue the circuit board or the water-based sound transducers into the recesses.

[0012] In exemplary embodiments, the circuit board has a first fixed point partner, and the base plate or the material for influencing sound waves has a second fixed point partner corresponding to the first fixed point partner. The positions of the waterborne sound transducers of the plurality of waterborne sound transducers relative to the first fixed point partner are known. The position of the recesses can be determined in step c) by using the positions of the waterborne sound transducers relative to the first fixed point and introducing the recesses at the same positions relative to the second fixed point partner. In other words, there is a common fixed point between the recesses and the waterborne sound transducers, through which the subsequent positions of the waterborne sound transducers in the material for influencing the sound waves are known.The insertion of the circuit board in step d) into the recesses in the material for influencing sound waves can thus be carried out in such a way that the first fixed point partner and the second fixed point partner are congruent. This is possible, for example, by having one of the two fixed point partners with a projection and the other of the two fixed point partners with a corresponding recess.

[0013] Preferred embodiments of the present invention are explained below with reference to the accompanying drawings. It shows:

[0014] Fig. 1 : a schematic perspective exploded view of a sonar antenna in an embodiment with precisely fitting recesses for the water sound transducers;

[0015] Fig. 2: a schematic perspective exploded view of a sonar antenna with trenches as recesses for the waterborne sound transducers;

[0016] Fig. 3: a schematic perspective exploded view of a sonar antenna with a common fixed point for backing and circuit board;

[0017] Fig. 4: a schematic sectional view according to a section plane AA indicated in Fig. 3.

[0018] Before exemplary embodiments of the present invention are explained in more detail below with reference to the drawings, it is pointed out that identical, functionally equivalent or equivalent elements, objects and / or structures in the different figures are provided with the same reference numerals, so that the description of these elements shown in different exemplary embodiments is interchangeable or can be applied to one another.

[0019] Fig. 1 . Shows a schematic perspective exploded view of a sonar antenna 20. The sonar antenna 20 comprises a base plate 22 and a material 24 for influencing sound waves. Instead of the material 24, a stack of different materials can also be used. The base plate 22 together with the material(s) for influencing the sound waves is also referred to as backing 25. Furthermore, the sonar antenna 20 has a circuit board 26 with water sound transducers 28 arranged thereon and contacted by the circuit board 26. Overall, an (irregular) array of 8 water sound transducers is shown as an example. However, any other number of water sound transducers can also be used. The material 24 now has recesses 30 corresponding to the water sound transducers 28 in order to accommodate the water sound transducers 28.Two recesses 30 are visualized by arrows 32, into which two corresponding water sound transducers 28 engage in the assembled state.

[0020] Fig. 2 shows a similar representation to Fig. 1, but here the recesses 30 are shown in the form of trenches in the backing 25, in particular the material 24. As in Fig. 1, the waterborne sound transducers 28 are arranged on the circuit board in the form of lines 26'. The lines are not necessarily straight, but can also be curved or angled. An angled line reveals the right-hand line 34' of waterborne sound transducers, while the other two lines 34" are straight.

[0021] The circuit board has tracks 26' analogous to lines 34', 34". This means that the circuit board has gaps between the tracks. This is not absolutely necessary, but has the advantage that the trenches can be filled more easily with the potting compound. Furthermore, it is easier to cover the entire circuit board with the potting compound 26. One such embodiment is shown in Fig. 4.

[0022] In addition to the exemplary embodiment according to FIG. 2, FIG. 3 discloses mutually corresponding fixed point partners 36a, 36b of the printed circuit board 26 and the backing 25. The printed circuit board has a first fixed point partner 36a. The backing 25, for example the material 24 for influencing sound waves or the base plate 22, has a fixed point partner 36b corresponding to the first fixed point partner 36a. The first fixed point partner 36a is shown as a recess, e.g. a hole, in the printed circuit board 26. The second fixed point partner 36b is shown as a projection, e.g. a pin. Other mutually corresponding connection partners are also possible. The connection partners simplify the production of the backing, independent of the production of the printed circuit board with the water-borne sound transducers.If the backing and circuit board are assembled so that the first fixed point partner lies on the second fixed point partner, the waterborne sound transducers 28 impinge on the corresponding recesses. Corresponding fixed point partners that specify a predetermined alignment of the circuit board to the backing are advantageous here (e.g., fixed point partners with few corners (e.g., cube) or the provision of several, e.g., two corresponding connection partners each on the circuit board and the backing). However, alignment is also easily possible with the round connection partners shown, since only the rotation and not the translation needs to be adjusted.

[0023] Fig. 4 shows a schematic sectional view of the sonar antenna 20 in the section plane AA, which is shown in Fig. 3. The material 24 for influencing the sound waves is arranged on the base plate 22. Trenches 30 are cut out of the material 24. The only visible waterborne sound transducer 28 in this illustration is arranged in the central trench 30. The trenches 30 are filled with a potting compound 38. Here, the potting compound 38 also encloses the tracks 26' of the circuit board. However, this is optional. It is also possible for the potting compound 38 to only reach up to an arbitrary height, e.g., the upper edge, of the trenches.

[0024] The disclosed (water) sound transducers are designed for use underwater, particularly in the sea. The sound transducers can convert water sound into an electrical signal (e.g., voltage or current) corresponding to the sound pressure, the water sound signal. Furthermore, it is possible for the sound transducers to convert an applied electrical voltage into water sound. The sound transducers can therefore be used as water sound receivers and / or as water sound transmitters. The sound transducers can have a piezoelectric material, such as a piezoceramic, as the sensor material. The sound transducers can be used for (active and / or passive) sonar (sound navigation and ranging, dl: sound navigation and ranging). Hydrophones, for example, can be used as water sound transducers. The sound transducers are preferably not suitable for medical applications and are not used for medical applications.Although some aspects have been described in connection with a device, it is to be understood that these aspects also represent a description of the corresponding method, so that a block or component of a device can also be understood as a corresponding method step or as a feature of a method step. Analogously, aspects described in connection with or as a method step also represent a description of a corresponding block, detail, or feature of a corresponding device. The embodiments described above merely illustrate the principles of the present invention. It is to be understood that modifications and variations of the arrangements and details described herein will be apparent to others skilled in the art.Therefore, it is intended that the invention be limited only by the scope of the following claims and not by the specific details presented in the description and explanation of the embodiments herein.

[0025] List of reference symbols:

[0026] 20 sonar antenna

[0027] 22 Base plate

[0028] 24 Material for influencing sound waves

[0029] 25 backing

[0030] 26 circuit board

[0031] 26' tracks of the circuit board

[0032] 28 waterborne sound transducers

[0033] 30 recesses

[0034] 32 reference point arrows

[0035] 34' angled line

[0036] 34" straight lines

[0037] 36 fixed point partners

[0038] 38 Potting compound

Claims

Patent claims 1 . Sonar antenna (20) with the following features: - a base plate (22) to which a material (24) for influencing sound waves is applied; - a circuit board (24) which contacts a plurality of water sound transducers arranged thereon; - wherein the water sound transducers (28) of the plurality of water sound transducers are arranged in recesses (30) of the material for acoustically influencing sound waves.

2. Sonar antenna (20) according to claim 1, wherein the water sound transducers (28) of the plurality of water sound transducers are arranged between the base plate (22) and the circuit board (24).

3. Sonar antenna (20) according to one of the preceding claims, wherein the material (24) for influencing sound waves comprises a foam.

4. Sonar antenna (20) according to one of the preceding claims, wherein a stack of different materials for influencing sound waves is applied to the base plate (22), wherein the water sound transducers (28) of the plurality of water sound transducers are arranged in recesses (30) of the stack of different materials for acoustically influencing sound waves.

5. Sonar antenna (20) according to claim 4, wherein the stack of different materials for influencing sound waves comprises different foams.

6. Sonar antenna (20) according to one of the preceding claims, - wherein the water sound transducers (28) of the plurality of water sound transducers are arranged in lines (34', 34") on the circuit board (24); - wherein the recesses (30) are formed in the form of trenches in the material (24) for influencing sound, so that the Water sound transducers (28) of the plurality of water sound transducers are arranged in the trenches.

7. Sonar antenna (20) according to one of the preceding claims, wherein the recesses (30) are filled with a potting compound (38).

8. Sonar antenna (20) according to claim 7, wherein the potting compound (38) is or at least comprises an epoxy resin.

9. Sonar antenna according to one of the preceding claims, wherein the circuit board (24) has a first fixed point partner (36a) and the base plate (22) or the material (24) for influencing sound waves has a second fixed point partner (36b) corresponding to the first fixed point partner (36a), wherein the first fixed point partner (36a) and the second fixed point partner (36b) are congruent and thus form a common fixed point.

10. A method for producing a sonar antenna (20) comprising the following steps: a) providing a base plate (22) with a material (24) applied thereto for influencing sound waves; b) providing a circuit board (24) with a plurality of water-based sound transducers arranged thereon; c) making recesses (30) in the material (24) for influencing sound waves at positions that correlate with the positions of the water-based sound transducers (28); d) inserting the circuit board (24), in particular with the water-based sound transducers first, into the recesses (30) in the material for influencing sound waves; e) gluing the circuit board (24) or the water-based sound transducers (28) into the recesses.

11. Method according to claim 10, wherein step e) comprises filling the recesses (30) with a casting compound (38), in particular a Epoxy resin or a polyurethane encapsulation compound, in order to glue the circuit board (24) or the water sound transducers (28) into the recesses (30).

12. Method according to claim 10 or 11, - wherein the circuit board (24) has a first fixed point partner (36a) and the base plate (22) or the material (24) for influencing sound waves has a second fixed point partner (36b) corresponding to the first fixed point partner (36a), wherein the positions of the water sound transducers (28) of the plurality of water sound transducers relative to the first fixed point partner are known; - wherein in step c) the position of the recesses (30) is determined by using the positions of the water sound transducers (28) relative to the first fixed point partner (36a) and the recesses (30) are introduced at the same positions relative to the second fixed point partner (36b).

13. The method according to claim 12, wherein step d) the insertion of the circuit board (24) into the recesses (30) of the material for influencing sound waves is carried out in such a way that the first fixed point partner (36a) and the second fixed point partner (36b) are congruent and thus form a common fixed point.

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