Plating and solder mask apparatus and methods

Abstract

An electrical connector comprising, one or more aerosol structures deposited on one or more surfaces of the electrical connector and a method of depositing one or more aerosol materials onto one or more conductors comprising, providing one or more electrical conductors having one or more surfaces, aerosol jetting one or more aerosol structures on the one or more surfaces of the one or more electrical conductors, and at least one of masking, containing, and / or excluding one or more materials on the one or more surfaces of the one or more electrical conductors.

Description

PLATING AND SOLDER MASK APPARATUS AND METHODSTECHNICAL FIELD

[0001] The present embodiments relate generally to plating and masking technology, with particular embodiments shown for electrical connectors / conductors.BACKGROUND

[0002] Typical aerosol and inkjet solder masks lack configurability, have poor resolution, may be difficult to apply to multiple sides of connectors (e.g. small pins), may not be readily compatible with some bath chemistries, may need to be removed prior to post-processing of the pins / connectors, and may need laser ablation following plating to remove material (e.g. metals) to establish a barrier to wicking. Thus, there is a need to increase resolution, increase repeatability, apply to one or more sides of a connector, be compatible with a variety of bath chemistries, to not require removal, and / or create a barrier / mask to wicking. i

[0003] The present invention is directed at overcoming, or at least improving upon, the disadvantages of the prior art.BRIEF DESCRIPTION OF THE ILLUSTRATIONS

[0004] In the drawings, like reference characters generally refer to the same parts throughout the different views. Also, the drawings are not necessarily to scale, emphasis instead generally being placed upon illustrating the principles of the invention.

[0005] Figure 1 is a view of one embodiment of an aerosol jetting system for a reel-to-reel application.

[0006] Figure 2A is a perspective view of the aerosol jet head applying material to a pin(s) for a reel-to-reel application.

[0007] Figure 2B is an enlarged view of Fig. 2A.

[0008] Figure 3 is a diagram illustrating an embodiment of an aerosol trial with an enlarged view thereof.

[0009] Figure 4 is a cross sectional view of an embodiment of the aerosol structure attached to the substrate or conductor (e.g. pin).

[0010] Figure 5 is a cross sectional view of another embodiment of the aerosol structure.

[0011] Figure 6 is a cross sectional view of another embodiment of the aerosol structure.

[0012] Figure 7 is a cross sectional view of another embodiment of the aerosol structure.

[0013] Figure 8 is a cross sectional view of another embodiment of the aerosol structure.

[0014] Figure 9 is a cross sectional view of another embodiment of the aerosol structure.

[0015] Figure 10 is a cross sectional view of another embodiment of the aerosol structure.DETAILED DESCRIPTION

[0016] Embodiments may further be understood with reference to the various Figures. With reference to Figs. 1-10, an embodiment provides one or more aerosol structures 20 for an electrical connector 30 (e.g. pin, substrate, conductor), or portions thereof, printed / deposited via aerosol jetting. The aerosol structure 20 may be printed with one or more aerosol jets. The aerosol structure may be a mask and / or barrier upon one or more surfaces of the application (e.g. connector, pin 30a, conductor). As a mask, the aerosol structure may protect / cover the surface / area covered or underneath thereof. For example, the aerosol structure may be a solder and / or plating mask where plating / solder is not desirable. As a barrier, the aerosol structure may contain and / or exclude one or more materials from and / or within a desired surface / area / direction of the application (e.g. connector, pin). For example, the aerosol structure may contain / exclude a lube, solder, metal, etc. Further for example, the aerosol structure 20 may exclude debris from an area or surface. The aerosol structure may be mechanical / electrical in application. The aerosol structure may provide impedance control. The aerosol structure may be maintained, remain on, or be left on the one or more surfaces deposited on or may be removed. Alternatively, the aerosol structure, or portions thereof, may be removed physically and / or by ultraviolet, solvent, etc. The aerosol structure may be removed before or after a plating step.

[0017] In some implementations, the one or more aerosol jets may print one or more materials to create the one or more aerosol structures 20. The aerosol structure 20 may be one or more layers L of materials (e.g. built up, stacked, members, wall(s), overhangs) depositedto create a variety of heights (see Fig. 5). For example, the overall height may be .1 mm in some embodiments. The aerosol structure 20 may be a single layer or a plurality of layers. The one or more materials / layers may be deposited successively in contact with each other and / or separately from each other. The layers / material may be the same or different in some embodiments. The material may be printed / deposited in one or more directions away from and / or along the surface of the conductor or connector. The aerosol structure may include a first material printed and at least one second material (e.g. same, different as the first material) printed in some embodiments. The aerosol material or particles may be nanoparticles in some embodiments. The one or more aerosol materials may be a polymer, metal, ceramic, lubricants, composites thereof, etc. If a polymer or another material is used, additional particles may be used or combined therewith such as, but is not limited to, metal(s) or ceramic(s). For example, the one or more aerosol material / structure 20 may be a LOCTITE brand polymer (e.g. AA3104, printed at 15mm / s, about 120micron wide, trace) as shown in the one embodiment in Fig. 3. This polymer may be without or with additional particles such as, but is not limited to, metal / ceramic particles. One or more of the aerosol materials may be removeable or remain with the connector 30 (e.g. substrate / pin / conductor). For example, the one or more aerosol structures may remain on finished parts and be a trace, a boundary, a lubricant, a via structure, etc. The aerosol structure may provide lubrication or contain lubrication. The aerosol material may not be an ink in some embodiments. Additional processes may be conducted upon the deposited aerosol material / structure such as, but is not limited to, curing.

[0018] In some implementations, the one or more aerosol materials / structures 20 may create a boundary (e.g. negative area, positive area, contain, exclude) to one or more materials 10 of the application(s) (e.g. conductor, pin 30a, substrate, connector 30). The aerosol structure(s) formed may contain / exclude a variety of materials 10 on the surfaces deposited thereon. For example, but is not limited to, lubricant, solder, gold, silver, or similar materials. The boundary or structure 20 may be one or more one walls 21 as shown in Figs. 4-10, connected or disconnected or spaced from each other. The boundary or structure 20 may be a plurality of walls 21 (e.g. adjacent walls) defining or forming one or more channels 22 as shown in Fig. 10, disconnected or spaced from each other. For example, the walls may be a straight, a curved, or an angle wall in one or more directions along the surface 31 deposited thereon and / or projecting outwardly from the surface 31 (e.g. substrate, connector, pin, etc.) deposited thereon. Further, for example, the structure 20 may define a hollow cylinder or enclosed structure / shape (e.g. 360 periphery) projecting outwardly from the surface (e.g. substrate, connector, pin, etc.) deposited thereon. The one or more structures may be a variety of heights H from the surface and extend for one or more distances along the surface deposited thereon. The one or more structures 20 may be a variety of widths W on the surface at one or more elevations. In some embodiments, the width W of the deposited material or layer may be about 20 micrometers to about 120 micrometers. For example, the width may be about 20 micrometers to about 25 micrometers. For example, the width may be about 20 micrometers in some embodiments. As shown in the example in Fig. 3, the width W may be about 120 micrometers. In some embodiments, the width W of the deposited structure20 may decrease / narrow with an increase in distance / elevation / height from the surface. In other embodiments, the width W of the deposited structure 20 may increase / expand with an increase in distance / elevation / height from the surface. A variety of widths, shapes, quantities, sizes, constructions, and / or heights of structure 20 or layers L are contemplated.

[0019] One example of an aerosol jet system 1 is shown in Fig. 1. The aerosol cartridge 2 (e.g. removeable, interchangeable) may be in fluid communication with the fluid dispense tip or aerosol jet head(s) 3 via a detachable flow cell 4 (e.g. detachable), if used, and atomizer base 5, if used. In some embodiments, one or more micro dispense pumps may be used. The aerosol jet system 1 and / or aerosol structure 20 may be used for a reel-to- reel 12 application / process of a plurality of pins 30a as shown in Figs. 2A-2B. The increased resolution / tolerances of the aerosol jetting, for example as compared to inkjet printing, may provide for more consistent and repeatable applications.

[0020] In some implementations, the deposited aerosol structure 20 may be a variety of shapes, sizes (e.g. area, height, length, width), quantities, and constructions to contain / exclude a material. The thickness / height H and / or width W of deposited structure / material can be sculptured to help contain / exclude / mask a plating or a solder or a lubrication material, etc. The deposited structure may reduce the wicking thereupon.

[0021] In some implementations, the deposited aerosol structure or barrier 20 may extend substantially perpendicular away from the surface 31 deposited thereon (e.g. substrate, pin, conductor, connector, etc.) on one or more sides / directions relative to the material 10 being contained / excluded. For example, as shown in the one embodiment in Figs. 4, 5, 7,and 10, the material / structure 20 (e.g. first member 23) is substantially perpendicular from / adjacent the surface 31 deposited thereon. The one or more structures may reduce wi eking of the material 10.

[0022] In some implementations, the deposited aerosol structure or barrier 20 may extend at an angle or transverse to the surface 31 deposited thereon (e.g. substrate, pin, conductor, etc.) on one or more sides / directions relative to the material 10 being contained / excluded. For example, as shown in the one embodiment in Figs. 6, 8, and 9, the material / structure 20 (e.g. first member 23) is substantially angled from / adjacent the surface 31 deposited thereon. The first member 23 may be angled towards the materials 10. The angle Al of the material / structure may be a variety of angles relative to the surface 31 deposited thereon. The angle Al may be an acute angle in the directions towards the contained / excluded material 10 (e.g. solder, lubricant, metal, etc.). The angle Al may be in the range of about 30 degrees to about 40 degrees in some embodiments. The angle Al may be about 30 degrees in some embodiments. The angle Al and / or first member 23 may decrease the wicking away from the surface 31 deposited thereon.

[0023] In some implementations, the deposited aerosol structure or barrier 20 may include an overhang or projection or second member 24 (e.g. second member / portion) extending from a distal end of the material / structure 20 (e.g. angled, perpendicular, first member / portion) extending from the surface 31 deposited thereon (e.g. substrate, pin, connector, etc.) on one or more sides / directions relative to the material 10 being contained / excluded. As shown in Figs. 4, 6, 7, 9, and 10, the projection may extend towards the material being contained. The projection or second member, if used, may beorientated in a variety of angles A2 relative to the first member 23 or distal end of the first member. The projection or first member 23, if used, may be parallel to or angled relative the surface deposited thereon or parallel plane to the surface 31. As shown in Figs. 4, 9, and 10, the projection or second member 24 may be substantially parallel to the surface 31 deposited thereon. As shown in the one embodiment in Figs. 5 and 6, the projection / material / structure 24 (e.g. second member) is substantially angled from or transverse to the surface 31 deposited thereon. The angle A2 of the material / structure may be a variety of angles relative to the surface deposited thereon (e.g. plane). The angle may be an acute angle in the directions towards the contained / excluded material 10. The angle A2 may be in the range of about 30 degrees to about 40 degrees in some embodiments. The angle may be about 30 degrees in some embodiments. The angle A2 and / or or second member 24 may decrease the wi eking away from the surface 31 deposited thereon. Further, for example, the one or more projections may be at one or more heights / layers / lengths of the first member and extend for a variety of distances / orientations / directions. In some embodiments, the second member 24 may extend away from the material 10. In some embodiments, one or more second members may extend towards the contained material 10 and / or one or more second members 24 may extend in the opposing direction. The second member may be on one wall and not on another adjacent wall in some embodiments. The second member may be on two adjacent walls as shown in Fig. 10.

[0024] In some implementations, the crimp area of the application may be masked to exclude plating, solder, and / or lubricant.

[0025] In some implementations, the use of belts and tracks may be reduced or not used.Typical belts and tracks may have undesirable overplate and wander, and may be expensive and part specific. The one or more present embodiments may provide for further miniaturization and control, and may not be part specific. The increase in control by the aerosol structure(s) may increase control of plating, reduce contamination after multiple wipes, and / or increase consistency. Some embodiments of the invention may provide lower maintenance, repeatability, and / or fewer moving parts. Further, the linespeed may be increased.

[0026] In some implementations, the aerosol jetting may provide for local and shape-specific plating of gold, nickel, palladium, etc. For example, metal shapes (e.g. trace, via structure) may be defined / formed / jetted. Further, for example, plating baths may be reduced or not used.

[0027] In some implementations, the aerosol jetting may provide for high ceramics loading. For example, fully ceramic loading.

[0028] In some implementations, ink masking may be reduced or not used. The ink may be water based. In some embodiments, the material for the aerosol structure may not be water based and / or not ink. One or more embodiments may be beneficial to the reduction of solvents needed and the reduction of waste.

[0029] In some implementations, the laser ablation of plated material may be reduced or not used.

[0030] In some implementations, the lubricant application of the aerosol structure may be targeted to specific areas rather than to larger / adjacent / remaining areas or the entire parttypically. The lubricant may also be contained within the target area or specific surface deposited thereon.[003 l]In some embodiments, the aerosol structure may be useful as a plating mask. For example, less precious metal may be used and / or less toxic / metals-of concern may be used.

[0032] In some implementations, the aerosol structure may be soluble / removable. Alternatively, the aerosol structure, or portions thereof, may be retained / maintained on the surface(s) 31. If retained in some embodiments, the aerosol structure may provide increased or better adhesion for housing and / or overmold polymers to attach to pins better. Stated alternatively, the aerosol structure may be a mechanical anchor for additional material.

[0033] In some implementations, the aerosol structure may be applicable to a variety of substrates. For example, polymer shapeholders / structure (e.g. miniature DLP prints of pins) may have local metal / ceramic specificity. Further, in some embodiments, metal added to polymers deposited by aerosol may be subsequently cured.

[0034] In some embodiments, an electrical connector may include one or more aerosol structures deposited on one or more surfaces of the electrical connector.

[0035] In addition, in some embodiments, one or more aerosol structures may be a mask protecting the one or more surfaces. In various embodiments, one or more aerosol structures may be a barrier containing and / or excluding a material. In some embodiments, the electrical connector may be devoid of solvent removal. In various embodiments, the electrical connector may include plating. In some embodiments, the one or more aerosol structures may be mechanical and / or electrical. In variousembodiments, the electrical connector may be devoid of laser ablation. In some embodiments, the one or more aerosol structures may be one or more via structures. In various embodiments, the one or more aerosol structures may be one or more traces. In some embodiments, the one or more aerosol structures may be a single wall. In various embodiments, the one or more aerosol structures may be one or more channels. In some embodiments, the one or more aerosol structures may include one or more first members projecting from the one or more surfaces. In some embodiments, one or more aerosol structures may include one or more second members projecting from the first member. In various embodiments, the first member and / or second member may be angled relative to the one or more surfaces. In some embodiments, the first member may be perpendicular to the one or more surfaces. In various embodiments, the second member may be parallel to the one or more surfaces. In some embodiments, the first member and / or second member may be angled at an acute angle to the one or more surfaces. In various embodiments, the one or more aerosol structures may remain on the one or more surfaces. In some embodiments, the one or more aerosol structures may be removed from the one or more surfaces. In various embodiments, the one or more aerosol structures may be a polymer, a metal, a ceramic, a lubricant, and / or combination thereof. In some embodiments, one or more aerosol structures may include a width of about 20 micrometers.

[0036] In some embodiments, an electrical connector may include a plurality of pins of a reel-to- reel process. In various embodiments, the plurality of pins may be deposited with one ormore aerosol structures in one or more layers. In some embodiments, the one or more aerosol structures may include a width of about 20 micrometers.

[0037] In addition, in some embodiments, the one or more aerosol structures remain with the plurality of pins. In various embodiments, the one or more aerosol structures may be a polymer, a metal, a ceramic, a lubricant, and / or combination thereof.

[0038] In some embodiments, a method of depositing one or more aerosol materials onto one or more conductors may include providing one or more electrical conductors having one or more surfaces. In various embodiments, the method may include aerosol jetting one or more aerosol structures on the one or more surfaces of the one or more electrical conductors. In some embodiments, the method may include at least one of masking, containing, and / or excluding one or more materials on the one or more surfaces of the one or more electrical conductors.

[0039] In addition, in some embodiments, the method may include the masking of the one or more materials on the one or more surfaces of the one or more electrical conductors. In various embodiments, the method may include the containing of the one or more materials on the one or more surfaces of the one or more electrical conductors. In some embodiments, the method may include the excluding of the one or more materials on the one or more surfaces of the one or more electrical conductors. In various embodiments, the method may include containing a plating or solder or lubrication material. In some embodiments, the one or more materials may provide lubrication. In various embodiments, the method may include removing the one or more aerosol structures from the one or more surfaces of the one or more electrical conductors. In some embodiments,the method may include maintaining the one or more aerosol structures on the one or more surfaces of the one or more electrical conductors. In various embodiments, the one or more aerosol structures may be a channel or a single wall. In some embodiments, the one or more materials may be a trace or a via structure or a lubricant. In various embodiments, the method may be devoid of a plating bath. In some embodiments, jetting one or more aerosol structures may include one or more layers. In various embodiments, the one or more aerosol structures may include one or more first members and / or one or more second members.

[0040] While several embodiments have been described and illustrated herein, those of ordinary skill in the art will readily envision a variety of other means and / or structures for performing the function and / or obtaining the results and / or one or more of the advantages described herein, and each of such variations and / or modifications is deemed to be within the scope of the embodiments described herein. More generally, those skilled in the art will readily appreciate that all parameters, dimensions, materials, and configurations described herein are meant to be exemplary and that the actual parameters, dimensions, materials, and / or configurations will depend upon the specific application or applications for which the teachings is / are used. Those skilled in the art will recognize, or be able to ascertain using no more than routine experimentation, many equivalents to the specific embodiments described herein. It is, therefore, to be understood that the foregoing embodiments are presented by way of example only and that, within the scope of the appended claims and equivalents thereto, embodiments may be practiced otherwise than as specifically described and claimed. Embodiments of the present disclosure aredirected to each individual feature, system, article, material, and / or method described herein. In addition, any combination of two or more such features, systems, articles, materials, and / or methods, if such features, systems, articles, materials, and / or methods are not mutually inconsistent, is included within the scope of the present disclosure.

[0041] All definitions, as defined and used herein, should be understood to control over dictionary definitions, definitions in documents incorporated by reference, and / or ordinary meanings of the defined terms.

[0042] The indefinite articles “a” and “an,” as used herein in the specification and in the claims, unless clearly indicated to the contrary, should be understood to mean “at least one.”

[0043] The phrase “and / or,” as used herein in the specification and in the claims, should be understood to mean “either or both” of the elements so conjoined, i.e., elements that are conjunctively present in some cases and disjunctively present in other cases. Multiple elements listed with “and / or” should be construed in the same fashion, i.e., “one or more” of the elements so conjoined. Other elements may optionally be present other than the elements specifically identified by the “and / or” clause, whether related or unrelated to those elements specifically identified. Thus, as a non-limiting example, a reference to “A and / or B”, when used in conjunction with open-ended language such as “comprising” can refer, in one embodiment, to A only (optionally including elements other than B); in another embodiment, to B only (optionally including elements other than A); in yet another embodiment, to both A and B (optionally including other elements); etc.

[0044] As used herein in the specification and in the claims, “or” should be understood to have the same meaning as “and / or” as defined above. For example, when separating items in alist, “or” or “and / or” shall be interpreted as being inclusive, i.e., the inclusion of at least one, but also including more than one, of a number or list of elements, and, optionally, additional unlisted items. Only terms clearly indicated to the contrary, such as “only one of’ or “exactly one of,” or, when used in the claims, “consisting of,” will refer to the inclusion of exactly one element of a number or list of elements. In general, the term “or” as used herein shall only be interpreted as indicating exclusive alternatives (i.e. “one or the other but not both”) when preceded by terms of exclusivity, such as “either,” “one of,” “only one of,” or “exactly one of.” “Consisting essentially of,” when used in the claims, shall have its ordinary meaning as used in the field of patent law.

[0045] As used herein in the specification and in the claims, the phrase “at least one,” in reference to a list of one or more elements, should be understood to mean at least one element selected from any one or more of the elements in the list of elements, but not necessarily including at least one of each and every element specifically listed within the list of elements and not excluding any combinations of elements in the list of elements. This definition also allows that elements may optionally be present other than the elements specifically identified within the list of elements to which the phrase “at least one” refers, whether related or unrelated to those elements specifically identified. Thus, as a non-limiting example, “at least one of A and B” (or, equivalently, “at least one of A or B,” or, equivalently “at least one of A and / or B”) can refer, in one embodiment, to at least one, optionally including more than one, A, with no B present (and optionally including elements other than B); in another embodiment, to at least one, optionally including more than one, B, with no A present (and optionally including elements otherthan A); in yet another embodiment, to at least one, optionally including more than one, A, and at least one, optionally including more than one, B (and optionally including other elements); etc.

[0046] It should also be understood that, unless clearly indicated to the contrary, in any methods claimed herein that include more than one step or act, the order of the steps or acts of the method is not necessarily limited to the order in which the steps or acts of the method are recited.

[0047] In the claims, as well as in the specification above, all transitional phrases such as “comprising,” “including,” “carrying,” “having,” “containing,” “involving,” “holding,” “composed of,” and the like are to be understood to be open-ended, i.e., to mean including but not limited to. Only the transitional phrases “consisting of’ and “consisting essentially of’ shall be closed or semi-closed transitional phrases, respectively, as set forth in the United States Patent Office Manual of Patent Examining Procedures, Section 2111.03.

[0048] It is to be understood that the embodiments are not limited in its application to the details of construction and the arrangement of components set forth in the description or illustrated in the drawings. The invention is capable of other embodiments and of being practiced or of being carried out in various ways. Unless limited otherwise, the terms “connected,” “coupled,” “in communication with,” and “mounted,” and variations thereof herein are used broadly and encompass direct and indirect connections, couplings, and mountings. In addition, the terms “connected” and “coupled” and variations thereof are not restricted to physical or mechanical connections or couplings.

[0049] The foregoing description of several embodiments of the invention has been presented for purposes of illustration. It is not intended to be exhaustive or to limit the invention to the precise steps and / or forms disclosed, and obviously many modifications and variations are possible in light of the above teaching.

Claims

CLAIMS1. An electrical connector comprising: one or more aerosol structures deposited on one or more surfaces of the electrical connector.

2. The electrical connector of claim 1 wherein the one or more aerosol structures is a mask protecting the one or more surfaces.

3. The electrical connector of any one of claims 1-2 wherein the one or more aerosol structures is a barrier containing and / or excluding a material.

4. The electrical connector of any one of claims 1-3 devoid of solvent removal.

5. The electrical connector of any one of claims 1-4 further comprising plating.

6. The electrical connector of any one of claims 1-5 wherein the one or more aerosol structures is mechanical and / or electrical.

7. The electrical connector of any one of claims 1-6 devoid of laser ablation.

8. The electrical connector of any one of claims 1-7 wherein the one or more aerosol structures is one or more via structures.

9. The electrical connector of any one of claims 1-8 wherein the one or more aerosol structures is one or more traces.

10. The electrical connector of any one of claims 1-9 wherein the one or more aerosol structures is a single wall.

11. The electrical connector of any one of claims 1-10 wherein the one or more aerosol structures is one or more channels.

12. The electrical connector of any one of claims 1-11 wherein the one or more aerosol structures includes one or more first members projecting from the one or more surfaces.

13. The electrical connector of claim 12 wherein the one or more aerosol structures includes one or more second members projecting from the first member.

14. The electrical connector of any one of claims 12-13 wherein the first member and / or second member is angled relative to the one or more surfaces.

15. The electrical connector of any one of claims 12-13 wherein the first member is perpendicular to the one or more surfaces.

16. The electrical connector of any one of claims 12-13 wherein the second member is parallel to the one or more surfaces.

17. The electrical connector of any one of claims 12-16 wherein the first member and / or second member is angled at an acute angle to the one or more surfaces.

18. The electrical connector of any one of claims 1-17 wherein the one or more aerosol structures remains on the one or more surfaces.

19. The electrical connector of any one of claims 1-17 wherein the one or more aerosol structures is removed from the one or more surfaces.

20. The electrical connector of any one of claims 1-19 wherein the one or more aerosol structures is a polymer, a metal, a ceramic, a lubricant, and / or combination thereof.

21. The electrical connector of any one of claims 1 -20 wherein the one or more aerosol structures include a width of about 20 micrometers.

22. An electrical connector comprising: a plurality of pins of a reel-to-reel process, the plurality of pins are deposited with one or more aerosol structures in one or more layers, and wherein the one or more aerosol structures have a width of about 20 micrometers.

23. The electrical connector of claim 22 wherein the one or more aerosol structures remain with the plurality of pins.

24. The electrical connector of any one of claims 22-23 wherein the one or more aerosol structures is a polymer, a metal, a ceramic, a lubricant, and / or combination thereof.

25. A method of depositing one or more aerosol materials onto one or more conductors comprising: providing one or more electrical conductors having one or more surfaces; aerosol jetting one or more aerosol structures on the one or more surfaces of the one or more electrical conductors; and at least one of masking, containing, and / or excluding one or more materials on the one or more surfaces of the one or more electrical conductors.

26. The method of claim 25 comprising the masking of the one or more materials on the one or more surfaces of the one or more electrical conductors.

27. The method of any one of claims 25-26 comprising the containing of the one or more materials on the one or more surfaces of the one or more electrical conductors.

28. The method of any one of claims 25-27 comprising the excluding of the one or more materials on the one or more surfaces of the one or more electrical conductors.

29. The method of any one of claims 25-28 further comprising containing a plating or solder or lubrication material.

30. The method of any one of claims 25-29 wherein the one or more materials provide lubrication.

31. The method of any one of claims 25-30 further comprising removing the one or more aerosol structures from the one or more surfaces of the one or more electrical conductors.

32. The method of any one of claims 25-31 further comprising maintaining the one or more aerosol structures on the one or more surfaces of the one or more electrical conductors.

33. The method of any one of claims 25-32 wherein the one or more aerosol structures is a channel or a single wall.

34. The method of any one of claims 25-33 wherein the one or more materials is a trace or a via structure or a lubricant.

35. The method of any one of claims 25-34 devoid of a plating bath.

36. The method of any one of claims 25-35 wherein jetting one or more aerosol structures includes one or more layers.

37. The method of any one of claims 25-36 wherein the one or more aerosol structures includes one or more first members and / or one or more second members.

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