Substrate transport apparatus

Abstract

A substrate processing apparatus includes a frame, a substrate transport apparatus having an end effector with a substrate holding station having a predetermined center, a linear image array sensor being configured to effect on the fly, with the substrate transport apparatus in motion, sensing of an edge of a substrate held on the end effector, and at least one simple polygon defining a center deterministic feature integral to the substrate transport apparatus and disposed so that the linear image array sensor crossing the simple polygon resolves, on the fly, the simple polygon in combination with at least one further side or edge of the apparatus different from the simple polygon into a point set of more than three substantially collinear points, the resolution of the point set effecting determination of the predetermined center of the substrate holding station on the end effector.

Description

SUBSTRATE TRANSPORT APPARATUSCROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application is a non-provisional of, and claims the benefit of, United States provisional patent application number 63 / 509,553 filed on June 22, 2023, the disclosure of which is incorporated herein by reference in its entirety.BACKGROUND1. Field

[0002] The present disclosure generally relates to robotic systems, and more particularly, to robotic transport systems.2. Brief Description of Related Developments

[0003] Automated processing systems, such as semiconductor processing systems, include multiple components that support the implementation of processes that effect predetermined levels of quality and reproducibility in semiconductor chip manufacturing. Substrate placement accuracy and motion throughput, in the semiconductor processing systems, are contributors to the substrate quality and reproducibility as placement accuracy and motion throughput directly affect semiconductor yield and cost of tool ownership.

[0004] Generally, semiconductor systems employ through-beam or reflective laser sensors to enable substrate placement along with a control system that is capable of latching substrate transport apparatus positions every time the laser sensors are triggered by the substrate (e.g., as the substrate transitions past the laser sensor). The control system employs an algorithm that estimates the substrate center position in terms of these transitions. These laser sensor systems are limited in the following ways: a limited number of data samples are provided to determine the substrate center; the accuracy of the laser sensor systems are affected by presence of a substrate orientationfeatures (such as orientation notches); and the laser sensors are unable to reliably detect defects on the substrate. Other semiconductor systems employ vision-based sensors to locate the position of the substrate in space to assist proper placement of the substrate at a target location by a substrate transport apparatus. Vision based systems require a field of view large enough to reliably detect the substrate edges as well as reference features on the end-effector, which poses challenges on the mechanical packaging design.

[0005] The above, sensing systems are also subject to additional problems that contribute to deterioration of placement accuracy of substrates by substrate transport apparatus including, but not limited substrate noise and hysteresis, latency (in software or hardware) on substrate edge detection, algorithm limitations, mechanism mechanical hysteresis, slippage of the substrate enroute to the target location, and thermal expansion / contraction of the substrate transport apparatus arm links.

[0006] According, the present disclosure addresses a number of those issues.BRIEF DESCRIPTION OF THE DRAWINGS

[0007] The foregoing aspects and other features of the present disclosure are explained in the following description, taken in connection with the accompanying drawings, wherein:

[0008] Figs. 1A-1I are schematic illustrations of substrate processing apparatus in accordance with the present disclosure;

[0009] Figs. 2A-2H are schematic illustrations of exemplary substrate transport apparatus in accordance with the present disclosure, and which may be employed in any of the substrate processing apparatus of Figs. 1A-1I;

[0010] Fig. 3 is a schematic illustration of a portion of the substrate processing apparatus of Figs. 1A-1I in accordance with the present disclosure;

[0011] Figs. 4A-4I are schematic illustrations of portions of the substrate processing apparatus of Figs. 1A-1I in accordance with the present disclosure;

[0012] Figs. 5A-5C are schematic illustrations of portions of the substrate processing apparatus of Figs. 1 A-1I in accordance with the present disclosure;

[0013] Fig. 5D is a schematic illustration of sensor data in accordance with the present disclosure;

[0014] Figs. 6A-6B and 6C are respectively schematic illustrations of substrate center finding sensor data and convergence of the data in accordance with the present disclosure;

[0015] Figs. 7A-7C are schematic illustrations of substrate center finding sensor data in accordance with the present disclosure;

[0016] Fig. 8 is a schematic illustration of a portion of the substrate transport apparatus of Figs. 2A-2H in accordance with the present disclosure;

[0017] Figs. 9A and 9B are respectively a schematic illustration of a portion of the substrate processing apparatus of Figs. 1A-1I and a schematic illustration of sensor data in accordance with the present disclosure;

[0018] Fig. 10A is a schematic illustration of a portion of the substrate processing apparatus of Figs. 1 A- II in accordance with the present disclosure;

[0019] Fig. 10B is a schematic illustration of a portion of the substrate processing apparatus of Figs. 1A-1I in accordance with the present disclosure;

[0020] Figs. 11A-11F are schematic illustrations of sensor data in accordance with the present disclosure;

[0021] Fig. 12 is a schematic illustration of a portion of the substrate processing apparatus of Figs. 1A-1I in accordance with the present disclosure;

[0022] Fig. 13 is a schematic illustration of a portion of the substrate processing apparatus of Figs. 1A-1I in accordance with the present disclosure;

[0023] Figs. 14-17 are exemplary flow diagrams of methods in accordance with the present disclosure; and

[0024] Fig. 18 is a schematic illustration of a portion of the substrate processing apparatus of Figs. 1A-1I in accordance with the present disclosure.DETAILED DESCRIPTION

[0025] The following detailed description is meant to assist the understanding of one skilled in the art, and is not intended in any way to unduly limit claims connected or related to the present disclosure.

[0026] The following detailed description references various figures, where like reference numbers refer to like components and features across various figures, whether specific figures are referenced, or not.

[0027] The word “each” as used herein refers to a single object (i.e., the object) in the case of a single object or each object in the case of multiple objects. The words “a,” “an,” and “the” as used herein are inclusive of “at least one” and “one or more” so as not to limit the noun being referred to as being in its “singular” form.

[0028] Figs. 1A-1I are schematic illustrations of substrate processing apparatus in accordance with the present disclosure. Although the present disclosure will be described with reference to the drawings, it should be understood that the present disclosure could be embodied in many forms. In addition, any suitable size, shape or type of elements or materials could be used.

[0029] The present disclosure may provide for a metrology system 300 that is configured to resolve and track substrate slippage enroute to a target or destination location. The metrology system 300 may be configured to scan unique edge profiles on an end effector 211 (see Fig. 2A) of a transfer unit module 104 (also referred to herein as a substrate transport apparatus) carrying the substrate so as to resolve and track the location of the end effector 211 in real time. The real time position tracking of the end effector 211 may provide for compensation of temperature effects on both the substrate transport apparatus 104 and end effector kinematics. The metrology system 300, in accordance with the present disclosure, may provide for real time position feedback of the end effector 211 during picking or placing of a substrate at a target location. In accordance withthe present disclosure, the metrology system 300 may provide for simultaneous real time tracking of substrate center and end effector spatial locations. The present disclosure may provide for automatically centering substrates to effect teaching a substrate transport apparatus a substrate processing location within substrate processing equipment.

[0030] Still referring to Figs. 1A-1I, the substrate processing apparatus 100A, 100B, 100C, 100D, 100E, 100F, 100G, such as for example a semiconductor tool station, is shown in accordance with the present disclosure. Although a semiconductor tool station is shown in the drawings, the present disclosure can be applied to any tool station or application employing robotic manipulators. The processing apparatus 100A, 100B, 100C, 100D, 100E, 100F, 100G are shown as having cluster tool arrangements (e.g. having substrate holding stations connected to a central chamber); however, the processing apparatus may be a linearly arranged tool or any suitable tool station. The apparatus 100A, 100B, 100C, 100D, 100E, 100F, 100G generally include an atmospheric front end 101, at least one vacuum load lock 102, 102A, 102B and a vacuum back end 103. The at least one vacuum load lock 102, 102A, 102B may be coupled to any suitable port(s) or opening(s) of the front end 101 and / or back end 103 in any suitable arrangement. For example, the one or more load locks 102, 102A, 102B may be arranged in a common horizontal plane in a side-by-side arrangement as can be seen in Figs. IB, 1D-1H. The one or more load locks may be arranged in a grid format such that at least two load locks 102A, 102B, 102C, 102D are arranged in rows (e.g. having spaced apart horizontal planes) and columns (e.g. having spaced apart vertical planes) as shown in Fig. II. The one or more load lock may be a single in-line load lock 102 as shown in Fig. 1A. The at least one load lock 102, 102E may be arranged in a stacked in-line arrangement as shown in Fig. 1C. While the load locks are illustrated on end 100E1 or facet 100F1 of a transport chamber 125A, 125B, 125C, 125D, 125E, 125F, 125G, the one or more load lock may be arranged on any number of sides 100S1, 100S2, ends 100E1, 100E2 or facets 100F1-100F8 of the transport chamber 125A, 125B, 125C, 125D, 125E, 125F, 125G. Each of the at least one load lock may include one or more substrate resting planes WRP (Fig. 1C) in which substrates are held on suitable supports within the respective load lock. The configurations of the tool station described herein are exemplary and the tool station may have any suitable configuration.

[0031] The components of each of the front end 101, the at least one load lock 102, 102 A, 102B, and back end 103 may be connected to a controller 110 which may be part of any suitable controlarchitecture such as, for example, a clustered architecture control. The control system may be a closed loop controller having a master controller, cluster controllers and autonomous remote controllers such as those disclosed in United States patent number 7,904,182 entitled “Scalable Motion Control System” issued on March 8, 2011, the disclosure of which is incorporated herein by reference in its entirety. Any suitable controller and / or control system may be utilized.

[0032] The front end 101 generally includes load port modules 105 and a mini-environment 106 such as for example an equipment front end module (EFEM). The load port modules 105 may be box opener / loader to tool standard (BOLTS) interfaces that conform to SEMI standards E15.1, E47.1, E62, E19.5 or El.9 for 300 mm load ports, front opening or bottom opening boxes / pods and cassettes. The load port modules may be configured as 200 mm wafer / substrate interfaces, 450 mm wafer / substrate interfaces or any other suitable substrate interfaces such as for example larger or smaller semiconductor wafers / substrates, flat panels for flat panel displays, solar panels, reticles or any other suitable object. Although three load port modules 105 are shown in Figs. 1A, IB, ID, IE, IF, 1G, 1H, any suitable number of load port modules may be incorporated into the front end 101. The load port modules 105 may be configured to receive substrate carriers or cassettes C from an overhead transport system, automatic guided vehicles, person guided vehicles, rail guided vehicles or from any other suitable transport method. The load port modules 105 may interface with the mini-environment 106 through load ports 107. The load ports 107 may allow the passage of substrates between the substrate cassettes and the mini-environment 106.

[0033] The mini-environment 106 generally includes any suitable transfer robot 108, which may incorporate one or more features the present disclosure as described herein. The robot 108 may be a track mounted robot such as that described in, for example, United States Patents 6,002,840 issued on December 14, 1999; 8,419,341 issued April 16, 2013; and 7,648,327 issued on January 19, 2010, the disclosures of which are incorporated by reference herein in their entireties, or the robot 108 may be substantially similar to that described herein with respect to the back end 103. The mini-environment 106 may provide a controlled, clean zone for substrate transfer between multiple load port modules.

[0034] The at least one vacuum load lock 102, 102A, 102B may be located between and connected to the mini-environment 106 and the back end 103; however, the load ports 105 may be coupledsubstantially directly to the at least one load lock 102, 102A, 102B or the transport chamber 125A, 125B, 125C, 125D, 125E, 125F, 125G where the substrate carrier C is pumped down to a vacuum of the transport chamber 125A, 125B, 125C, 125D, 125E, 125F, 125G and substrates are transferred directly between the substrate carrier C and the load lock or transfer chamber. Where the substrate carrier C is pumped down to vacuum, the substrate carrier C may function as a load lock such that a processing vacuum of the transport chamber extends into the substrate carrier C. Where the substrate carrier C is coupled substantially directly to the load lock through a suitable load port any suitable transfer apparatus may be provided within the load lock or otherwise have access to the carrier C for transferring substrates to and from the substrate carrier C. The term vacuum as used herein may denote a high vacuum such as IxlO"5Torr or below in which the substrates are processed. The at least one load lock 102, 102A, 102B generally includes atmospheric and vacuum slot valves. The slot valves of the load locks 102, 102A, 102B (as well as for the processing stations 130) may provide the environmental isolation employed to evacuate the load lock after loading a substrate from the atmospheric front end and to maintain the vacuum in the transport chamber when venting the lock with an inert gas such as nitrogen. The slot valves of the processing apparatus 100A, 100B, 100C, 100D, 100E, 100F, 100G may be located in the same plane, different vertically stacked planes or a combination of slot valves located in the same plane and slot valves located in different vertically stacked planes (as described above with respect to the load ports) to accommodate transfer of substrates to and from at least the processing stations 130 and load locks 102, 102A, 102B coupled to the transport chamber 125A, 125B, 125C, 125D, 125E, 125F, 125G. The at least one load lock 102, 102A, 102B (and / or the front end 101) may include an aligner ALN for aligning a fiducial of the substrate to a desired position for processing or any other suitable substrate metrology equipment. The vacuum load lock may be located in any suitable location of the processing apparatus and have any suitable configuration.

[0035] The vacuum back end 103 generally includes a transport chamber 125A, 125B, 125C, 125D, 125E, 125F, 125G one or more processing station(s) 130 and any suitable number of transfer unit modules 104 (also referred to herein as substrate transport apparatus) that includes one or more transfer robots, which may include one or more features of the present disclosure as described herein. The transport chamber 125A, 125B, 125C, 125D, 125E, 125F, 125G may have any suitable shape and size that, for example, complies with SEMI standard E72 guidelines. The transfer unit modulc(s) 104 and the one or more transfer robot will be described below and may be located atleast partly within the transport chamber 125A, 125B, 125C, 125D, 125E, 125F, 125G to transport substrates between the load lock 102, 102A, 102B (or between a cassette C located at a load port) and the various processing stations 130. The transfer unit module 104 may be removable from the transport chamber 125A, 125B, 125C, 125D, 125E, 125F, 125G as modular unit such that the transfer unit module 104 complies with SEMI standard E72 guidelines.

[0036] The processing stations 130 may operate on the substrates through various deposition, etching, or other types of processes to form electrical circuitry or other desired structure on the substrates. Typical processes include but are not limited to thin film processes that use a vacuum such as plasma etch or other etching processes, chemical vapor deposition (CVD), plasma vapor deposition (PVD), implantation such as ion implantation, metrology, rapid thermal processing (RTP), dry strip atomic layer deposition (ALD), oxidation / diffusion, forming of nitrides, vacuum lithography, epitaxy (EPI), wire bonder and evaporation or other thin film processes that use vacuum pressures. The processing stations 130 are communicably connected to the transport chamber 125A, 125B, 125C, 125D, 125E, 125F, 125G in any suitable manner, such as through slot valves SV, to allow substrates to be passed from the transport chamber 125A, 125B, 125C, 125D, 125E, 125F, 125G to the processing stations 130 and vice versa. The slot valves SV of the transport chamber 125 may be arranged to allow for the connection of twin (e.g. more than one substrate processing chamber located within a common housing) or side-by-side process stations 130T1, 130T2, single process stations 130S and / or stacked process modules / load locks (Figs. 1C and II).

[0037] The transfer of substrates to and from the processing station 130 and / or load locks 102, 102A, 102B (or cassette C) coupled to the transfer chamber 125A, 125B, 125C, 125D, 125E, 125F, 125G may occur when one or more arms of the transfer unit module 104 are aligned with a predetermined processing station 130. One or more substrates may be transferred to a respective predetermined processing station 130 individually or substantially simultaneously (e.g. such as when substrates are picked / placed from side-by-side or tandem processing stations as shown in Figs. IB, ID and 1H. The transfer unit module 104 may be mounted on a boom arm 143 (see, e.g., Figs. IE, IF, 1H) or linear carriage 144 (see, e.g., Fig. 1C) such as that described in United States patent numbers 10,777,438 titled “Processing Apparatus” and issued on September 15, 2020 and International patent application number PCT / US 13 / 25513 entitled “Substrate ProcessingApparatus” and filed on February 11, 2013, the disclosures of which are incorporated herein by reference in their entireties.

[0038] Figs. 2A and 2B illustrate exemplary boom arm configurations, to which the transfer unit module 104 may be coupled. The boom arm 143 and the transfer unit module 104 may collectively be referred to as a substrate transport apparatus (although, where the transfer unit module 104 is employed without the boom arm 143, the transfer unit module may be referred to as the substrate transport apparatus as noted herein). Here, the boom arm 143 may be a single unarticulated link boom arm 220 (Fig. 2A) or an articulated link boom arm 222 (Fig. 2B).

[0039] With reference to Fig. 2A, the single unarticulated link boom arm 220 is rotatably coupled to a frame or base 201 of the transport apparatus. The base 201 includes a drive section 200 configured to rotate the boom arm 220 about a boom arm rotation axis BSX. The transfer unit module 104 is coupled to a distal end of the boom arm 143 (opposite the boom arm rotation axis BSX). While the transfer unit module 104 is illustrated as having a SCARA arm 210 (or dual SCARA arm 210, 210A) configuration, the transfer unit module 104 may have any suitable arm configuration including, but not limited to those described herein.

[0040] With reference to Fig. 2B, the articulated link boom arm 220 includes an upper boom link 220 that is rotatably coupled to a frame or base 201 (at the boom arm rotation axis BAX) of the transport apparatus at a proximate end of the upper boom link 220. The other or distal end of the upper boom link 220 is rotatably coupled to a proximate end of a forearm boom link 221 at a boom joint axis of rotation BEX, where the transfer unit module 104 is coupled to and supported by the forearm boom link 221 at a distal end of the forearm boom link 221. The drive section is configured to drive rotation of the upper boom link about axis 220 and the forearm boom link 221 about the axis BEX in any suitable manner. For example, the upper boom link 220 may be driven by a motor of the drive section 20 while the forearm boom link 221 is slaved in rotation (e.g., a band and pulley transmission slaves rotation of the forearm boom link 221 to the frame 201); however, the forearm boom link 221 and the upper boom link 220 may each be driven by a respective motor of the drive section 200. While the articulated link boom arm 222 is illustrated with two links, the articulated link boom arm 222 may have any suitable number of links serially coupled to each other. Suitable examples of boom arms that may be employed with the presentdisclosure are described in United States patent application number 15 / 215,143 filed on July 20, 2016 and titled “Substrate Processing Apparatus,” the disclosure of which is incorporated herein by reference in its entirety.

[0041] While the transfer unit module 104 in Figs. 2A and 2B is illustrated as having a SCARA arm 210 (or dual SCARA arm 210, 210A) configuration, the transfer unit module 104 may have any suitable transfer arm configuration including, but not limited to those described herein. For example, the transfer unit module 104 may have any other desired arrangement such as a frog-leg arm 216 (Fig. 2C) configuration, a leap-frog arm 217 (Fig. 2D) configuration, a bi-symmetric arm 218 (Fig. 2E) configuration, etc. As another example, referring to Fig. 2F, transfer unit module 104 may be configured as the transfer arm 219. The transfer arm 219 includes at least a first and second articulated SCARA arm 210, 210A where each arm 210, 210A includes an end effector 211 configured to hold at least two substrates SI, S2 side by side in a common transfer plane (each substrate holding location of the end effector 211 shares a common drive for picking and placing the substrates SI, S2) where the spacing DX between the substrates SI, S2 corresponds to a fixed spacing between side by side substrate holding locations. Referring to Figs. 2F and 2G, the SCARA arm 210 (and arm 210A) includes an upper arm 213, a forearm 212, and an end effector 211 that are serially coupled to one another to form an articulated chain of arm links. The end effectors 211 described herein have at least one substrate holding station 21 IS, each substrate holding station 21 IS having a predetermined center or end effector reference point 211C. The end effector 211 is configured to hold a substrate S (also referred to herein as a wafer but may be any suitable substrate including, but not limited to, flat panels, reticles, or other suitable object as noted herein) at the substrate holding station 21 IS and transport the substrate within the substrate processing apparatus. At least one of the arm links 213, 212, 211 is driven by a respective drive motor of the drive section; however, one or more of the arm links, such as the forearm 212 and / or end effector 211 may be slaved in rotation by any suitable band and pulley transmission (or other suitable transmission) to effect extension and retraction of the SCARA arm.

[0042] Suitable examples of transfer arms that may be employed in the present disclosure can be found in United States patents 6,231,297 issued May 15, 2001, 5,180,276 issued January 19, 1993, 6,464,448 issued October 15, 2002, 6,224,319 issued May 1, 2001, 5,447,409 issued September s, 1995, 7,578,649 issued August 25, 2009, 5,794,487 issued August 18, 1998, 7,946,800 issued May24, 2011, 6,485,250 issued November 26, 2002, 7,891,935 issued February 22, 2011, 11,569,111 issued on January 31, 2023, 8,752,449 issued on June 17, 2014, 8,918,203 issued on December 23, 2014, and 11,235,935 issued February 1, 2022, and United States patent application numbers 13 / 293,717 entitled “Dual Arm Robot” and filed on November 10, 2011 and 13 / 270,844 entitled “Coaxial Drive Vacuum Robot” and filed on October 11, 2011 the disclosures of which are all incorporated by reference herein in their entireties. Suitable examples of band / pulley transmission that may be employed in the present disclosure are described in United States patent numbers 5,682,795 issued on November 4, 1997, 5,778,730 issued on July 14, 1998, and 11,201,073 issued December 14, 2021, the disclosures of which are incorporated herein by reference in their entireties.

[0043] Referring to Fig. 2H, another transfer unit module 104 is illustrated. The transfer unit module of Fig. 2H, like the other transfer unit modules described herein, may be coupled to a boom arm 143 (see, e.g., Figs. 1H, 2A and 2B) so as to be transported by the boom arm 143, to a linear carriage 144 (see, e.g., Fig. 1G) so as to be transported by the linear carriage 144, or stationarily fixed to a frame (illustrated in Figs. 1 A- II) of the transport chamber 125A, 125B, 125C, 125D, 125E, 125F, 125G (or a frame of the mini-environment 106). The transfer unit module 104 includes a frame 266F, to which a turret 266 is rotatably coupled for rotation about a turret axis of rotation TAX. The drive section 200 includes a turret drive 200R disposed at the turret axis of rotation TAX that drives rotation of the turret 266 in direction T3. The turret 266 includes transfer arm supports 270A, 270B that extend from opposite sides of the turret 266, and to which a respective transfer arm(s) 210, 210A, 216, 217, 218 are coupled. The transfer arm supports 270A, 270B are spaced apart from each other so that the respective transfer arms are supported by the turret 266 in a side by side arrangement, where the side by side transfer arms each include end effector(s) 211 configured to hold at least one substrate side by side in a common transfer plane where the spacing DX between the substrates SI, S2 corresponds to a fixed spacing between side by side substrate holding locations (e.g., in a manner similar to that described with respect to Fig. 2F and as described in United States patent number 10,134,621 issued on November 20, 2018, the disclosure of which is incorporated herein by reference in its entirety).

[0044] The turret 266 may include one or more linear motors 200LM that are coupled to a respective transfer arm support 270A, 270B for moving the respective transfer arm support 270A,270B in direction 271 A, 27 IB for effecting adjustment of the distance DX (or independent adjustment of the respective distance DX1, DX2 from the axis TAX) to account for substrate- holding- station to substrate-holding-station variability and the independent automatic substrate centering with respect to the transfer arm(s) held on the respective transfer arm support 270A, 270B. The turret 266 provides for individual or independent Cartesian adjustment for each respective transfer arm supports 270A, 270B (and the respective transfer arm(s) coupled thereto) to maintain substrate alignment and reduce substrate swap times as position correction effected by the Cartesian (e.g., X-Y) positioning of the end effector 211 of at least one transfer arm coupled to transfer arm support 270A is performed in parallel with the Cartesian positioning of the end effector 211, 21 IDS, 21 IDE, 21 IDT, 211DQ of at least one other transfer arm coupled to transfer arm support 270B. Each transfer arm support 270A, 270B may include a respective Z-axis drive for moving the respective transfer arm(s) held on the transfer arm support 270A, 270B independent of Z axis movement of the respective transfer arms held on the other transfer arm support 27 OA, 270B; however, another Z-axis drive may be provided for moving the turret 266 and any transfer arms coupled thereto as a unit in the Z direction.

[0045] Referring to Fig. 3, an exemplary metrology system 300 is illustrated. The metrology system includes at least one sensor 310, 310A, 310B, 310C, 310D, 310E, 310F (see also Figs. 5A- 5C and 13) and the controller 110. The at least one sensor 310 is coupled to the frame (such as of the transport chamber or front end modules illustrated in Figs. 1 A- II) and is configured to effect on the fly, with the substrate transport apparatus in motion, sensing of at least an edge of the substrate S held on the end effector 211. The at least one sensor 310, 310A, 310B, 310C, 310D, 310E, 310F is coupled to the controller 110 by any suitable wired or wireless data network 199. For exemplary purposes, the network 199 may be an EtherCat network. The controller 110 is connected, in any suitable wireless or wired manner, to the drive section 200 of the substrate transport apparatus (only a portion of which is illustrated in Fig. 3) so that the controller 110 has real time access to sensor data as well as end effector 211 position within the same execution thread of a control software algorithm employed by the controller 110 to move the substrate transport apparatus (e.g., the controller 110 knows the output from the at least one sensor 310, 310A, 310B, 310C, 310D, 310E, 310F (e.g., sensor output) versus end effector position in space). The position of the at least one sensor 310, 310A, 310B 310C, 310D, 310E, 31 OF within a substrate processing apparatus 100A, 100B, 100C, 100D, 100E, 100F, 100G (sec Figs. 1 A- II) is such thatthe at least one sensor 310, 310A, 310B, 310C, 310D, 310E, 310F captures images of (or otherwise senses) one or more of the substrate S and end effector 211 near the final placement location of the substrate S at a substrate holding location.

[0046] The at least one sensor 310, 310A, 310B, 310C, 310D, 310E, 310F is any suitable linear sensor that effects detection and scanning of an edge profile of the substrate S (e.g., carried on and supported by the end effector 211) and / or a profile of one or more center deterministic (also referred to as datum) features 410, 410A, 410B, 410C, 410D (see also Figs. 5A-5C) of the end effector 211. As an example, each of the at least one sensor 310, 310A, 310B, 310C, 310D, 310E, 310F is linear image array sensor, examples of which include but are not limited to cameras, Lidar (light detection and ranging), CCD line scan sensors, laser scan micrometers, CMOS sensors, CCD sensors, or any other suitable line scan or area scan non-contact inspection and / or measurement tool having a through-beam, reflective beam, or photo imaging configurations configured to detect edge profiles of the substrate and / or end effector features (as described herein). Referring briefly to Figs. 1A-1I, the at least one sensor 310, 310A, 310B, 310C, 310D, 310E, 310F is located within the substrate processing apparatus 100A, 100B, 100C, 100D, 100E, 100F, 100G adjacent a slot valve SV so as to capture images of or scan one or more of the substrate S and end effector 211 as the substrate S and / or end effector passes through the slot valve SV into a process module 130 or load lock 102A, 102B. As the substrate S and / or end effector 211 passes through the slot valve, the at least one sensor 310, 310A, 310B, 310C, 310D, 310E, 310F senses the substrate and / or end effector 211 where the sensor signals are broadcast into the data network 199 so that the controller 110 has access to each of the sensor outputs in a real time execution thread.

[0047] Referring to Figs. 4A-4I and 5A, the center deterministic or datum features 401A-410C of the end effector 211 are shaped and positioned on, for example, the end effector 211 so as to be detected by at least one sensor 310A, 310B (which are substantially similar to sensor 310) during motion 499 (e.g., on the fly) of the substrate transport apparatus moving the substrate S and / or end effector 211 past the at least one sensor 310A, 310B. The motion 499 of the end effector 211 may be one or more of a straight line motion of the end effector 211 (e.g., such as an extension motion of the end effector), a rotational motion of the end effector (such as rotation of the end effector about one or more of the axes SX, EX, WX of the substrate transport apparatus), or any other suitable rectilinear or curved motion. The center deterministic features 401 A-410C arc positionedrelative to the substrate S held on the end effector 211 so as to be sensed by the at least one sensor 310A, 310B while the substrate S is held or carried by the end effector 211. For example, the end effector 211 includes a substrate holding station 21 IS that is unobstructed by the center deterministic features 401A-410C. It is also noted that the center deterministic features 401A- 4 IOC are unobstructed by any substrate S held by the end effector 201.

[0048] The substrate S may be held on the end effector 211 in a centered position (e.g., a center SC of the substrate S is coincident with an end effector reference point 211C). The at least one sensor 310A, 310B is configured to detect transitions of the substrate S past the respective sensor 310A, 310B a well as the transitions of the center deterministic features 401A-410C past the respective sensor 310A, 310B on the fly during motion 499 of the end effector 211. The substrate S may rest on the end effector 211 with an arbitrary eccentricity or offset (where the eccentricity or offset is the distance between the substrate center SC and the end effector reference point 211C - the eccentricity in Figs. 4A-4I and 5 A is illustrated as being substantially zero for illustrative purposes only). The center deterministic features 401 A-410C have a predetermined deterministic spatial relationship with the end effector reference point 211C so as to provide for (decoupled from arm position data obtained from motor encoders) one or more of: the identification of the substrate center offset (e.g., eccentricity) independent from any teaching fixtures; identification of the end effector reference location 211C relative to the at least one sensor 310A, 310B when the substrate transport apparatus (e.g., at least the arm thereof) is under thermal displacement (e.g., expansion or contraction); identification of the end effector reference location 211C relative to the sensor(s) 310A, 310B so that substrate holding location (e.g., of a process module 130 or load lock 102A, 102B) can be identified and taught; and the minimization of hysteresis effects (e.g., sensor latency) in the detection of the positions associated with the end effector position relative to the at least one sensor 310A, 310B.

[0049] Each of the center deterministic features 401A-410C has a known predetermined shape that defines a unique deterministic solution for the detection of respective edge profiles scanned by the at least one sensor 310A, 310B relative to the end effector reference point 211C. This known predetermined shape is detected or sensed by the at least one sensor 310A, 310B to determine the end effector reference point 211C location regardless of thermal effects on the arm links of the substrate transport apparatus and decoupled from arm position data, as will bedescribed herein. The at least one sensor 310A, 310B is positioned within the substrate processing tool so that one or more of the at least one sensor 310A, 31 OB is offset to a longitudinal centerline CL of the end effector 211 as the end effector 211 travels past the at least one sensor 310A, 310B. The at least one sensor 310A, 310B includes two sensors 310A, 310B located on opposite sides of the longitudinal centerline CL; however, the at least one sensor may extend transverse to the centerline CL so that a single sensor spans an entire width of the end effector (and substrate), or there may be more than one sensor located on a common side of the centerline CL, or a single sensor may be located on only a single side of the centerline CL.

[0050] Figs. 4A-4I and 5A illustrate two center deterministic features that are coupled to or otherwise formed in or integral with a respective end effector 211. For example, Fig. 4A illustrates center deterministic features 401 A, 40 IB coupled to (so as to be integral with) the end effector 211. Fig. 4B illustrates center deterministic features 402A, 402B coupled to (so as to be integral with) the end effector 211. Fig. 4C illustrates center deterministic features 403 A, 403B coupled to (so as to be integral with) the end effector 211. Fig. 4D illustrates center deterministic features 404A, 404B coupled to (so as to be integral with) the end effector 211. Fig. 4E illustrates center deterministic features 405A, 405B coupled to (so as to be integral with) the end effector 211. Fig. 4F illustrates center deterministic features 406A, 406B coupled to (so as to be integral with) the end effector 211. Fig. 4G illustrates center deterministic features 407A, 407B coupled to (so as to be integral with) the end effector 211. Fig. 4H illustrates center deterministic features 408 A, 408B coupled to (so as to be integral with) the end effector 211 Fig. 41 illustrates center deterministic features 409A, 409B coupled to (so as to be integral with) the end effector 211. Fig. 5 A illustrates center deterministic features 410A, 410B, 410C coupled to (so as to be integral with) the end effector 211. There may be one center deterministic feature 410 coupled to the end effector 211 (see Fig. 3). With reference to Fig. 4B (noting that the center deterministic features 401A, 401B, 403A-409B in Figs. 4A and 4C-4I and the center deterministic features 410, 410A-410C in Figs. 3 and 5A-5B are similarly configured, but each having a unique edge profile(s)), the two center deterministic features 402A, 402B extend, depend from, or are otherwise formed in opposite lateral (where lateral is generally in the X direction and the longitudinal axis is defined by the end effector centerline CL and may be referred to as the Y direction) sides of the end effector 211, but there may be more or less than two center deterministic features 402A, 402B. While the center deterministic features 402A, 402B arc illustrated as extending from the lateral sides of the endeffector 211, the center deterministic features may be one or more apertures (e.g., slots or holes), recesses, etchings, or other features machined or otherwise formed in the end effector 211 (see, e.g., Figs. 5A and 5B).

[0051] The center deterministic features 402A, 402B each have any suitable edge profile(s) and configuration to effect the determination of the end effector reference point 211C in a manner described herein. For example, one or more of the center deterministic features 402 A, 402B is shaped and sized to be scanned in one or more directions to determine a location and orientation of the scanned edge profile of the respective center deterministic feature 402A, 402B, where the location and orientation are employed by the controller 110 to determine the position and orientation of the end effector (e.g., through a determination of the location of the end effector reference point 211C, which has a known spatial location relative to the determined edge profile of the respective center deterministic feature 402A, 402B) relative to the at least one sensor 310A, 310B. The center deterministic features 402A, 402B are shaped and sized so as to be scanned by the at least one sensor 310A, 310B during motion 499 of the end effector 211 to a substrate holding location, where sensing of the center deterministic features 402A, 402B provide for a direct determination of end effector 211 location for effecting placement of the substrate S at the substrate holding location regardless of thermal effects on the arm links of the substrate transport apparatus, noting that the end effector is constructed of a thermally stable material so that the end effector is substantially invariant with respect to temperature change and again noting that the center deterministic features 402A, 402B have a predetermined spatial relationship with the end effector reference point 211C. While the shape and number of center deterministic features 401A-410C disposed on the respective end effectors are representative, and there may be any suitable number of center deterministic features each having any suitable edge profile(s) to effect determining the spatial orientation and location of the end effector 211 (and its end effector reference point 211C).

[0052] Referring to Figs. 3, 5A, and 5B, the at least one center deterministic feature 410, 410A- 410C includes an array of sides S1-S3 defining the center deterministic feature 410, 410A-410C integral to the substrate transport apparatus and disposed with at least two angled sides SI, S2, orientated at a predetermined angle 0 with respect to each other. At least another side S3 is orientated at a different angle 01, 02 relative to at least one side SI, S2 of the two angled sides SI, S2, so that the at least one sensor 310, 310A, 310B crossing the at least two angled sides SI, S2 incombination with the at least one other side S3 resolves on the fly, the crossed sides S 1 , S2 to more than one substantially aligned linear segments (see Fig. 9A) that effect determination of the predetermined center (e.g., end effector reference point 211 C) of the substrate holding station 21 IS on the end effector 211. While there may be one sensor 310 corresponding to and sensing a respective center deterministic feature 410, the sensor 310 may be a segmented sensor (see Fig. 12) having linear sensor segments 310S1-310S5 where the linear sensor segments 31OS1-31OS5 are substantially aligned with each other and each of the linear sensor segments 310S1-310S5 is disposed to sense a respective side of the array of sides S1-S3.

[0053] The at least one center deterministic feature 410, 410A-410C, and the array of sides S1-S3 thereof, may form at least one simple polygon SP1-SP4 (e.g., a polygon having straight, nonintersecting line segments or sides that are joined pairwise to form a single closed path). While each simple polygon is illustrated as being a triangular, any suitable simple polygon may be employed. At least two sides S1-S3 from the at least one other side S1-S3 and at least one of the at least two angled sides SI, S2 are sides of a common simple polygon. The array of sides and the simple polygons formed thereby may provide for as many sensor transitions that can be resolved by the at least one sensor 310, 310A, 310B. In accordance with the present disclosure, the at least one sensor 310, 310A, 310B senses the sides of the at least one center deterministic feature 410, 410A, 410C to simultaneously read at least three transitions of the sides through the at least one sensor 310, 310A, 310B. From these at least three transitions, the controller 110 determines the rotation of the end effector 211 and the X and Y position of the end effector relative to the at least one sensor 310, 310A, 310B (and the substrate holding location of the load lock or process module associated with the at least one sensor 310, 310A, 310B).

[0054] The center deterministic feature 410, 410A-410C defined by the at least one simple polygon SP1-SP4 is integral to the substrate transport apparatus (such as to the end effector 211 as described herein) and is disposed so that the at least one sensor 310, 310A, 310B (which is arranged to cross the simple polygon SP1-SP4 as described herein) resolves, on the fly, the simple polygon SP1-SP4 in combination with at least one further side or edge S1-S3 of the substrate transport apparatus that is different from the simple polygon SP1-SP4 (e.g., the further side or edge of the substrate transport apparatus being a side or edge of another different simple polygon SP1- SP4 or a side or edge of the end effector 211 disposed in a predetermined relation on the substratetransport apparatus to the simple polygon SP1-SP4) into a point set of more than three substantially collinear points A-E or A-H (see Figs. 9A and 10) that are resolved by the at least one sensor 310, 310A, 31 OB. The resolution of the point set effects a determination of the end effector reference point 211C of the substrate holding station 21 IS on the end effector 211. As can be seen in at least Figs. 3, 5A, and 5B, the simple polygon SP1-SP4 and the at least one further side or edge S1-S3 form a substantially saw tooth shape on the substrate transport apparatus (e.g., at least two sides S 1-S3 and at least another other side S 1-S3 (of the simple polygons) form a substantially saw tooth shape on the substrate transport apparatus).

[0055] The substrate transport apparatus has a substrate handler from which the end effector 211 depends (see Figs. 2A-2H), where the point set of more than three substantially collinear points effect, in real time, pose determination of the end effector 211 in at least three degrees of freedom substantially decoupled from substrate handler position data (e.g., substrate handler position data obtained from motor encoders 200EN of the drive section 200). While the substrate handler is illustrated as an articulated arm in the figures for exemplary purposes only, the substrate handler may have any suitable configuration including, but not limited to, the articulated arm, a carriage, a magnetically levitated platen / cart or any other suitable handler. The at least three degrees of freedom include (see, e.g., Fig. 5A) lateral and longitudinal (X and Y) offsets of the predetermined center from a predetermined location (e.g., such as from kinematic models of the substrate transport apparatus) of the end effector reference point 211C, and a yaw angle of the end effector 211 from a predetermined end effector pose (e.g., such as the longitudinal centerline CL of the end effector 211 in substantial alignment with an axis of extension). The at least three degrees of freedom may include one or more of (e.g., see Fig. 5B) an offset of the end effector 211 in a direction (e.g., the Z direction) normal to a substrate transport plane and a pitch angle of the end effector 211 from the predetermined end effector pose (e.g., such as in substantial alignment with the substrate transport plane). The center deterministic feature 410C of Fig. 5B can provide a redundant Y-longitudinal location (as in Fig. 5A). A set of two deterministic features 410C (oriented along Z direction) located on the left and right sides of the end-effector center line 499, can provide roll angle orientation of the end-effector in real time.

[0056] Referring to Figs. 3 and 5A, the present disclosure may provide for different metrological determinations including, but not limited to, one or more of substrate center finding, substrateslippage detection, end effector reference point 211C determination, and real time position feedback of the end effector such as during a placing of a substrate S. Another metrological determination that may be provided is temperature feedback, to determine a temperature of the center deterministic features 401A-410C, and thus the temperature of the end effector 211. As can be seen in Figs. 3 and 5 A, the different metrological determinations may be effected with the at least one sensor 310 disposed in predetermined regions along the end effector 211 as the end effector moves 499 (e.g., on the fly) past the at least one sensor 310, 310A, 310B.

[0057] Referring to Figs. 3, A, and 6A-7C, the at least one sensor 310, 310A, 310B sensing the edge of the substrate S resolves a substrate edge profile determinative of a substrate center SC, where the substrate edge profile and the substrate center SC are resolved on the fly. For example, with the end effector moved 499 so that the at least one sensor 310, 310A, 310B is within the substrate center finding region, the at least one sensor 310, 310A, 310B detects an edge profile of the substrate S so that the controller 110 maps the substrate edge data received by the controller 110 from the sensor outputs. The determination of the substrate center SC and determination of the end effector reference point 211C of the end effector substrate holding station are effected in a common pass of the end effector 211 relative to the at least one sensor 310, 310A, 310B, so that substrate eccentricity is determined and automatic substrate centering (with respect to a predetermined substrate holding location, e.g., of a process module, a load lock, or other suitable holding location) is effected in real time substantially decoupled from substrate handler position data (such as from motor encoders 200EN).

[0058] Referring to Figs. 7A-7C, the center of the substrate SC may be determined from a calibrated shape corresponding to a portion of the substrate in a manner similar to that described in United States patent number 7,880,155 issued on February 1, 2011, the disclosure of which is incorporated herein by reference in its entirety. Figs. 7A-7C geometrically illustrate the determination of the values AX and AY, the coordinates of the substrate offset. Fig. 7A shows a substrate S with a calibration shape C shown superimposed thereon. The calibration shape C, shown as a shaded area, represents a portion of the substrate that may be sensed with the at least one sensor 310, 310A, 310B in a calibration procedure, or otherwise determined via computer modeling or other techniques. The calibration shape C may represent, for example, a shape on the substrate over which the light beam of the sensor moves during an alignment procedure, when thesubstrate is located in a desired position. Fig. 7A schematically shows sensor 310, 310B in one location relative to the substrate S, though the sensor 310, 310B may have any suitable location. As illustrated in Fig. 7A, the substrate S may or may not pass completely through the sensor 310, 310B during an alignment procedure, as extension of a small portion of the substrate S through the sensor 310, 310B in the movement 499 direction may be sufficient for the sensor 310, 310B to sense the calibration area. As the substrate S position may be determined before the substrate S completely passes the sensor 310, 310B, movement of the substrate transport apparatus may be quickly adjusted in response to the determined substrate position (e.g., upon determination of the end effector reference location 211 C) . Figs. 7B and 7C each show a sensed shape M that may be compared with the calibration shape to determine the substrate position coordinates AX and AY. Shape M may be sensed in a manner similar to the sensing of the calibration shape C. Shape M may be defined, along one straight side that is substantially perpendicular to the movement 499 direction, by an edge of the light beam of sensor 310, 310B. Along the other straight side that is substantially parallel to the movement 499 direction, shape M may be defined by a sensing limit (e.g., the end of the light beam) of the sensor 310, 310B. For example, the controller 110 may begin collecting data representing the sensed shape from the sensor 310, 310B at a predetermined radial extension position of the substrate transport apparatus, and may cease collecting such data at another predetermined radial extension position of the transport apparatus. At the beginning position, the substrate S may be positioned outside of the light beam, while at the ending position the light beam may intersect the substrate. Between these two positions, the sensor may sense a portion of the substrate defining the sensed shape M. Any other suitable arrangement may be employed for sensing a shape on the substrate, and the sensed shape may be defined in any suitable manner. While the sensed shape is illustrated as being two-dimensional, the sensed shape may have any suitable number of dimensions. For example, the shape of a one-dimensional curve along a section of the periphery of the substrate may be sensed. This sensed curve may be used to determine substrate offset in two directions by comparing the sensed curve to a calibration curve, or by calculating the location of the sensed curve on the substrate using a computer model.

[0059] Fog. 7A shows a calibration shape C that may correspond to a sensed shape resulting when the substrate S is in a desired position. The calibration shape C may have various aspects that can be represented quantitatively and used as a basis for comparison with other shapes. For example, the calibration shape C has a definite area. The calibration shape C has a centroid, the location ofwhich may be expressed with the coordinates Xc and Yc as shown in Fig. 7A. The sensed shape M may be compared to the calibration shape C on the basis of the respective areas and the respective centroid coordinates in one direction (for example, Xc); however, centroid coordinates in more than one direction may be used for comparison of the shapes C and M (e.g. using both Xc and Yc), or any other suitable basis of comparison of the shapes may be employed.

[0060] Fig. 7B illustrates an example of a sensed shape M that may result when the substrate is offset in (only) the -X direction from the desired (known calibration) position. The distance marked “-AX” represents the distance that the substrate is offset in the -X direction. In the example illustrated in Fig. 7B, an offset in the -X direction results in a sensed shape M (shown shaded) having a smaller area than the area of the calibration shape C. In Fig. 7B, the values Xc and Yc represent the coordinates of the centroid of the sensed shape M. Fig. 7C illustrates an example of a sensed shape M that may result when the substrate is offset in (only) the -Y direction from the desired position. In Fig. 7C, the values Xcand Yc represent the coordinates of the centroid of the sensed shape M. As illustrated by Figs. 7B and 7C, different substrate positions may result in different sensed shapes M, but it is possible for the area of the sensed shape M to be the same even though the substrate positions are different. Therefore, a comparison of area values alone may not be sufficient to determine substrate position. In this example, the value Xc is used along with the area of the sensed shape M to determine the position of the substrate along both the X and Y axes. Figs. 7B and 7C illustrate two sensed shapes M corresponding to different substrate positions. Although the sensed shapes M are shown with identical areas, the values for Xc are different. In this example, the aspects of the sensed shape that are used to determine substrate position are the area of M and the centroid coordinate Xc (or, alternatively, Yc). For example, knowing AX, AY of the substrate S relative to the known calibration position from the above, the controller may compare the X and Y coordinates of end effector reference point 211C (as determined herein from the at least one center deterministic feature) and the AX, AY of the substrate relative to the known calibration position to obtain the eccentricity of the substrate relative to the end effector reference point 211C. The center SC of the substrate may be determined in any suitable manner such as generating an edge profile of the substrate S (e.g., as the substrate moves past the at least one sensor 310, 310A, 310B) with the one or more sensors 310, 310A, 310B and determining the center SC based on the edge profile. This center SC (determined fromthe edge profile) may be compared with the end effector reference location 211C to determine the substrate eccentricity relative to the end effector 211.

[0061] At the same time sensor outputs are received by the controller 110, the controller 110 may receive spatial position data for the end effector 211 (such as from motor position feedback encoders also referred to as drive motor encoders, 200EN of the drive section 200). Exemplary sensor signals (embodying the detection of the respective substrate edge profile) output from the at least one sensor 310, 310A, 310B are illustrated in Fig. 6A. These sensor signals may be employed by the controller 110 (which includes any suitable center finding algorithms) to determine a center of the substrate SC. Fig. 6B illustrates an exemplary plot of the substrate edge profile(s) with the position of the substrate edge as detected by the at least one sensor 310, 310A, 310B plotted along the vertical axis and the extension position of the end effector (e.g., as determined by any suitable encoders 200EN of the drive section 200) plotted along the horizontal axis. While opposite edges of the substrate are illustrated as being detected and plotted, the center of the substrate SC may be determined (e.g., as a point of convergence or focal point of the substrate edge profile) from the sensor signals output from a single sensor, such as sensor 310. The determined substrate center location SC may be compared to calibration data (e.g., where the calibration data obtained with a calibration substrate held on the end effector 211 so that the substrate center SC is coincident with the end effector reference point 211C, and / or the calibration data is a known or determined spatial location of an end effector reference point 211C, etc.) to determine the substrate offset relative to the end effector reference point 211C. Where motor encoder data is employed, the motor encoder data may be updated as described herein to correct encoder error based on a corresponding position determination (in this example the center position of the substrate s) effected with the center deterministic features 410, 410A, 410B, 410C, 410D.

[0062] During the substrate center determination described above, the controller 110 may monitor deviations of the sensor data and the position data relative to the curve fit established during the substrate scanning so as to detect defects on the substrate S. Where the curve fit deviates from the sensor data and / or position data there may be a defect on the substrate S.

[0063] Still referring to Figs. 3 and 5 A, the at least one sensor 310, 310A, 310B sensing the edge of the substrate resolves the substrate edge profile determinative of at least one of the substratecenter and a substrate slip condition relative to the end effector 211, where the substrate edge profile, the at least one of the substrate center, and the substrate slip condition being resolved on the fly. For example, with movement 499 of the end effector towards and through the at least one sensor 310, 310A, 310B, occurrence of substrate slippage relative to the end effector 211 may be determined. The occurrence of substrate slippage may be determined at least in part simultaneously with the substrate center finding or after determination of the substrate center finding is complete. For example, if no substrate slippage occurs during movement 499, the determined substrate center location SC is expected to be unique, and the convergence or resolution of the substrate center location occurs as an artifact of numerical accuracy of the substrate center-finding algorithm. However, with the occurrence of substrate slippage relative to the end effector 211 during the movement 499, as the substrate S is being detected or scanned by the at least one sensor 310, 310A, 31 OB, the substrate center location would not converge to a unique solution. The non-convcrgcncc of the substrate center is employed by the controller 110 to determine the occurrence of substrate slippage, relative to the end effector 211, with placement of a substrate at a substrate holding location corresponding to the at least one sensor 310, 310A, 310B. Fig. 6C shows a curve fitting process and convergence of the substrate center to a unique location (e.g., in the absence of substrate slippage) as more of the substrate edge is sensed by the at least one sensor 310, 310A, 310B . The shape of the curve fitting can be a circle, more generally an ellipse, or any other suitable shape. The controller 110C may be configured with a least squares type fitting algorithm (or any other suitable fitting algorithm) to fit the curve based on the sensor data. The convergence signature (as illustrated in Fig. 6C) may be recorded in a memory of the controller 110 as part of a calibration and may be performed at different sets of end effector movement speeds and accelerations up to the point substrate slippage occurs. A different numerical convergence signature is expected to be observed for each different set of end effector movement speeds and accelerations. The controller 110 may include a machine-learning model that effects substrate center finding convergence and determination of substrate slippage.

[0064] Still referring to Figs. 3 and 5A and also to Figs. 8 and 18, temperature feedback may be provided to determine a temperature of the center deterministic features 401A-410C, and thus a temperature of the end effector 211. The center deterministic features 401A-410C or end effector 211 includes a temperature determining portion or flag 377 constructed of a material having a high coefficient of thermal expansion so that there is a discernable change in length LI of thetemperature determining portion 377 (e.g., based on temperature changes) that effects a determination of a temperature of the center deterministic features 401A-410C by the controller 110. As an example, the temperature of the center deterministic features 401A-410C may be determined by comparing a measured length LI of the temperature determining portion 377 at a reference temperature Tref with a respective measurement of the length LI at a temperature Tother other than the reference temperature Tref. The length LI changes dependent on temperature and that change in length is employed by the controller 110 to determine the temperature Tother of the center deterministic features 401A-410C. As an example, still referring to Figs. 3, 5A, and 8, the at least one sensor 310, 310A, 310B is disposed / configured to scan the lateral sides of the temperature determining portion 377. The at least one sensor 310, 310A, 310B has an effective length L2 where:

[0065] L2 - X2 - XI = LI [eq. 1]

[0066] where L2 is known as the sensor distance, XI and X2 are the sensor readings, and LI is the length of the temperature determining portion 377. LI is not known (e.g., at a temperature Tother other than the reference temperature Tref) since the length LI expands and contracts depending on the end effector temperature. Where the length LI at the reference temperature Tref is defined as:

[0067] Llref = L2ref - X2ref- Xlref[eq. 2]

[0068] The length of the temperature determining portion 377 at a temperature Tother other than the reference temperature Tref can be determined as:

[0069] L ef+AT = L2ref+AT - X2ref+AT - Xlref+AT [eq. 3]

[0070] and the temperature Tother of the temperature determining portion 377 (and of the end effector 211) can be determined as:

[0071] Tother = Tref + (LLef+AT - LLef) / a [eq. 4]

[0072] where a is the coefficient of thermal expansion of the temperature determining portion 377.

[0073] As can be seen above, the temperature of the end effector 211 may be determined and compared to a temperature of the substrate S to be picked so as to substantially avoid thermal shock to the substrate S as the end effector 211 contacts the substrate S.

[0074] As may be realized, the temperature determination may be employed by the controller 110 to determine any thermal effects on the center deterministic features 401A-410C, in the case the center deterministic features 401A-410C are constructed of a material other than the thermally stable material of the end effector 211. For example, the controller 110 may include a table that correlates temperature to changes in dimensions of the center deterministic features 401A-410C, where the end effector reference point 211C is determined based on center deterministic features 401A-410C dimensions corresponding to the determined temperature T'other in any suitable manner (e.g., such as where the center deterministic features 401A-410C have a common point (e.g., center point, convergence point, etc.) that has a known spatial relationship with the end effector reference point 211C at each temperature Tother as determined by the table or in any other suitable manner).

[0075] Referring now to Figs. 3, 5A, and 9A-10 with motion 499 of the end effector 211 so that the at least one center deterministic features 401A-410C is positioned for end effector reference point 211C determination, the at least one sensor 310, 310A, 310B scans or otherwise senses the array of sides SI -S3 (such as of each simple polygon SP) of a respective center deterministic feature 401 A-410C. The geometry of the center deterministic features 401 A-410C is such that the profile of the center deterministic features 401A-410C determines the location of the end effector reference point 211C (e.g., each center deterministic features 401A-410C has a predetermined spatial relationship with the end effector reference point 211C such that localization of a respective center deterministic feature 401A-410C is determinative of end effector reference point 211C).

[0076] With reference to Fig. 9A, the center deterministic feature 410 (which is substantially similar’ to the center deterministic features 410A, 410B) includes at least two simple polygons, each having a respective array of sides S 1-S3 (one side of which may be common between adjacent simple polygons). In the example illustrated in Fig. 9A, the center deterministic feature 410 provides for five data points A, B, C, D, E (which instead of data points, may be data linear segments AS, BS, CS, DS, ES, FS, GS, HS, IS (as illustrated in Fig. 10A) that are resolved by the at least one sensor 310, 310A, 310B); however, the center deterministic feature 410 may provideas few as three data points / data linear segments or more than five data points / data linear segments with a single sensor 310 and a single center deterministic feature 410 (see Figs. 9A and 10A), or with multiple sensors 310A, 310B and multiple center deterministic features 410A, 10B (see Fig. 10B). Fig. 9B illustrates the center deterministic feature 410 of Fig. 9A as scanned by the sensor 310.

[0077] Referring also to Figs. 11A-11C, the controller 110, employing lengths obtained between the data points or points on data line segments, is configured to determine an absolute rotation of the end effector 211 relative to, for example, the motion 499 along a linear extension path of the end effector 211 to a substrate holding location. As an example, Ro is a length between two points (e.g., such as points A and E although any two points may be employed) without rotation of the end effector 211 relative to the motion 499 (see Fig. 11A). The length Ro may be obtained by the controller 110 from a table, calibration data, or in any other suitable manner. R is a length between the same two points (here points A and E) with rotation (see Figs. 11B and 11C). The absolute rotation 0 of the end effector 211 may be determined by:

[0078] 0 = arccos(Ro / R) [eq. 5]

[0079] The controller 110 is configured to determine a direction of the rotation 0i by comparison of two distances obtained from at least three of the points A-E. A distance AB between points A,B is compared with a distance CD between points C,D (although any distances may be compared such as distance AB between points A, B and distance BC between points B, C). If the distance AB is greater than the distance CD then the rotation of the end effector 211 relative to the motion is in the clockwise direction. If the distance CD is greater than the distance AB then the rotation of the end effector 211 relative to the motion is in the counterclockwise direction.

[0080] Referring also to Figs. 11D-11F the controller, employing two data points (or points along the data linear segments) such as points A and D, the absolute rotation 0, and known dimensions of the center deterministic feature 410, is configured to determine the X and Y location of the center deterministic feature relative to the sensor 310. Knowing the fixed predetermined spatial relationship between the sensor 310 and a respective substrate holding location (such as of a load lock or process module) and the predetermined spatial relationship between the center deterministic feature 410 and the end effector reference point 211C, the controller 110 isconfigured with any suitable algorithm to determine the X and Y location of the end effector reference point 211C relative to the respective substrate holding location. For example, referring to Fig. HF, the controller 110 includes any suitable algorithms to solve (in any suitable manner) the following equation set for AX, AY to resolve the X and Y location of the center deterministic feature relative to the sensor 310 (and hence the location of the end effector reference point 211C relative to the respective substrate holding location given the known spatial relationships between the sensor and the substrate holding location and between the center deterministic feature and the end effector reference point).

[0082] Xintercept= ( [cos p -tanS(“^+j6)] + AY) ■ tan( + / ?) — AX [eq. 7]

[0083] where is the absolute rotation angle, 0i is the angle illustrated in Fig. 1 IF, and Ci is the original Y intercept as determined from calibration data (the calibration data provides a position in X and Y of the center deterministic feature 410 relative to the sensor 310 with the end effector aligned along the linear axis of the motion 499 and moving past the sensor 310) of the sensor 310 and the known dimensions of the center deterministic feature 410.

[0084] To reduce any noise that may be present in the sensor signals effecting the position determinations of the end effector 211 relative to the substrate holding station, the number of data points or data linear segments may be increased. The absolute rotation 0, the rotation direction, and the X and Y location of the end effector reference point 211C may be determined using multiple different sets of points. For example, to reduce noise in the absolute rotation solution, the absolute rotation 0 may be determined, as described above, for each of the data point sets A and C, A and E, A and G, A and I, C and E, C and G, C and I, E and G, E and G, G and I, B and D, D and F, and F and H. The resulting absolute rotation solutions for each data point set may be combined using a least squares (or other suitable) algorithm to provide a combined absolute rotation solution having a higher accuracy than any one of the (uncombincd) absolute rotation solutions. Similarly, to reduce noise in the rotation direction solution, the rotation direction may be determined, as described above, by comparing any one line segment distance AB, CD, DF, GH with any other line segment distance AB, CD, DF, GH, where the further apart the line segments,the greater the difference in length between the segments being compared. The noise in the X and Y location solution may be reduced by determining the X and Y locations using each of the data points sets A and D, A and F, A and H, C and F, C and H, E and H, or any other combination of two of the points A, B, C, D, E, F, G, H, I. The respective X and Y location solutions for each of the data point sets may be combined using a least squares (or other suitable) algorithm to provide a combined X and Y location solution having a higher accuracy than any one of the (uncombined) X and Y location solutions.

[0085] Referring again to Figs. 5 A and 5B and also to Fig. 5C, the present disclosure may provide for sensing the position / orientation of the end effector 211 in at least three degrees of freedom or at least five degrees of freedom. For example, sensing one of the center deterministic features 410A, 410B with a respective one of the sensors 310A, 310B (while the two center deterministic features 410A, 410B and the two sensors 310A, 310B arc illustrated, the present disclosure may be effected with only one of the center deterministic features and the respective sensor) provides for locating the end effector 211 in three degrees of freedom, such as in the X and Y directions as well in rotation Rz (yaw) about the Z axis. The substrate handler may include another center deterministic feature 410C, such as on the wrist of the end effector 211, where the other center deterministic feature is oriented in a plane (e.g., the Z-Y plane) substantially orthogonal to a plane (e.g., the X-Y plane) in which by the center deterministic feature(s) 410A, 410B are oriented. Another sensor 310C (which is substantially similar to sensor 310) is disposed within the transport chamber 125A, 125B, 125C, 125D, 125E, 125F, 125G so as to sense or otherwise detect the center deterministic feature 410C for determining the position / orientation of the end effector in two more degrees of freedom Z, Rx (pitch). Referring also to Fig. 5D, and in a manner similar to that described herein with respect to Fig. 1 IF, the controller 110 is configured to determine, from sensor signals received from the sensor 310C detecting the center deterministic feature 410C, the absolute rotation PRX and the Z position of the center deterministic feature 410C (and thus of the end effector 211 given the known spatial relationship between the center deterministic feature 410C and the end effector reference point 211C). To obtain the position / orientation of the end effector 211 in a sixth degree of freedom Ry (roll), a center deterministic feature 410D may be disposed on the wrist opposite the center deterministic feature 410C in the Z-Y plane). Another sensor 310D (which is substantially similar to sensor 310) is disposed within the transport chamber 125A, 125B, 125C, 125D, 125E, 125F, 125G so as to sense or otherwise detect the centerdeterministic feature 410D for determining the position / orientation of the end effector in at least the Z direction (in a manner similar to that described above with respect to Fig. 1 IF. The rotation Ry of the end effector may be determined (in any suitable manner such as simple trigonometry) by the controller 110 by comparing the Z location solution obtained from detecting center deterministic feature 410C and the Z location solution obtained from detecting center deterministic feature 410D.

[0086] Referring to Figs. 5A-5C and 14, the determination of the end effector 211 in the at least three degrees of freedom may effect real time resolution of any position error of the drive motor encoders 200EN (see Figs. 2A and 2B). For example, the controller 110 includes, in its memory, kinematic properties of the substrate transport apparatus. These kinematic properties model the kinematics of the substrate handler and effect determinations of predicted positions of the substrate handler for any given move of the substrate handler. To resolve encoder errors in real time, the position of the end effector 211 is determined by the controller 110 based on sensing of the at least center deterministic feature 410, 410A, 410B, 410C, 410D (Fig. 14, Block 1400) in at least the three degrees of freedom (e.g., in at least the X and Y directions and in Yaw (Rz), or more degrees of freedom including one or more of the Z direction, in the roll direction (Ry) and in the pitch direction (Rx)) in the manner described herein. The controller 110 determines the position of the end effector 211 (e.g., referred to herein as the encoder determined position) based on signals from the motor encoders 200EN (Fig. 14, Block 1410). The controller may compare the encoder determined position of the substrate handler to the kinematic predicted position of the substrate handler (Fig. 14, Block 1420) and determine based on the comparison any encoder error that may exist (Fig. 14, Block 1430). The controller 110 is configured to employ the real time position of the end effector 211 as determined from sensing the at least one center deterministic feature 410, 410A, 410B, 410C, 410D to correct the encoder error (Fig. 14, Block 1440), where correction of the encoder error includes one or more of resetting, updating, or otherwise calibrating or recalibrating the encoder position(s). The encoder error correction may be performed by the controller 110 at any suitable time intervals, such as each time the at least one center deterministic feature passes the at least one sensor 310, 310A, 310B, 310C, 310D, once every predetermined number of hours of operation of the substrate transport apparatus, a predetermined number of times a day, etc. The controller 110 is configured to, based on sensing of the at least one center deterministic feature 410, 410A, 410B, 410C, 410D, determine the thermal cxpansion / contractionamounts of each substrate handler link of the substrate transport apparatus for effecting on the fly substrate centering in a manner substantially similar to that described in United States patent number 10,134,623 issued on November 20, 2018, the disclosure of which is incorporated herein by reference in its entirety.

[0087] Referring to Fig. 12, the at least one center deterministic feature 410A, 410B are disposed on the end effector 211 so as to remain within the scan range of the respective sensor 310A, 310B as the substrate S is positioned at the substrate holding location (e.g., within a process module 130 or load lock 102 or other suitable substrate holding location). The center deterministic features 410C, 410D may be disposed on the end effector 211 so as to remain within the scan range of the respective sensor 310C, 310D as the substrate S is positioned at the substrate holding location (e.g., within a process module 130 or load lock 102 or other suitable substrate holding location). The at least one sensor 310A, 310B provides real time position feedback to the controller 110 with respect to the spatial position of the end effector 211 relative to the substrate holding location, regardless of any thermal effects on the links of the substrate handler and without employing position information obtained from the motor encoders 200EN of the drive section 200 or kinematic substrate handler motion calculations. The controller 110 may continuously determine the position / orientation of the end effector based on the signal received from the at least one sensor 310A, 310B sensing the respective center deterministic feature 410A, 410B in the manners described above, noting again that the at least one sensor 310A, 310B has a fixed predetermined spatial relationship with the substrate holding location and that the at least one center deterministic feature 410A, 410B has a predetermined spatial relationship with the end effector reference point 211C. With the substrate S eccentricity or offset known with respect to the end effector reference point 211C, the controller 110 commands movement of the drive section 200 motors so that, based on position feedback obtained from the at least one sensor 310A, 310B (one or more of sensor 310C, 310D may also be employed), the center of the substrate S is placed substantially coincident with a center of the substrate holding location.

[0088] Referring to Fig. 13, at least one additional sensor 310E, 310F may be provided in the transport chamber 125A, 125B, 125C, 125D, 125E, 125F, 125G. The at least one additional sensor 310E, 310F are spaced from the at least one sensor 310A, 310B so that the substrate S and the at least one center deterministic feature 410A, 410B arc sensed simultaneously by the at least onesensor 310A, 310B and the at least one additional sensor 310E, 310F. Substrate center determination and end effector position / orientation may be simultaneously determined by the controller in the manners described herein.

[0089] Referring to Figs. 1A-3, 5A-5C, 9A-11F, and 15, an exemplary substrate processing method will be described. In accordance with the method the substrate processing apparatus 100A, 100B, 100C, 100D, 100E, 100F, 100G is provided (Fig. 15, Block 1500). The linear image array sensor (e.g., at least one of sensors 310, 310A, 310B, 310C, 310D, 310E) connected to the frame, senses an edge of the substrate S held on the end effector 211 on the fly, with the substrate transport apparatus in motion (Fig. 15, Block 1510). With the resolution of a point set, determination of the predetermined center (also re I erred to herein as the end effector reference point 211C) of the substrate holding station on the end effector 211 is effected (Fig. 15, Block 1520), where the at least one simple polygon SP, SP1-SP4) is disposed so that the at least sensor 310, 310A, 310B, 310C, 310D crossing the simple polygon SP, SP1-SP4 resolves, on the fly, the simple polygon SP, SP1-SP4 in combination with at least one further side or edge S1-S3 of the substrate transport apparatus different from the simple polygon SP, SP1-SP4 into the point set A-E of more than three substantially collinear points A-E.

[0090] Referring to Figs. 1A-3, 5A-5C, 9A-11F, and 16, another exemplary substrate processing method will be described. In accordance with the method the substrate processing apparatus 100A, 100B, 100C, 100D, 100E, 100F, 100G is provided (Fig. 16, Block 1600). The linear image array sensor (e.g., at least one of sensors 310, 310A, 310B, 310C, 310D, 310E) connected to the frame, senses an edge of the substrate S held on the end effector 211 on the fly, with the substrate transport apparatus in motion (Fig. 16, Block 1610). With more than one substantially aligned linear segments AS, BS, CS, DS, ES, FS, GS, HS, IS (as illustrated in Fig. 10A), determination of the predetermined center (also referred to herein as the end effector reference point 211C) of the substrate holding station on the end effector 211 is effected (Fig. 16, Block 1620), where the array of sides SI -S3 are disposed with at least two angled sides SI, S2, orientated at a predetermined angle 0 with respect to each other, and at least another side S3 (or sides S1-S3 of a different simple polygon) orientated at a different angle 9, 0i, 02 relative to at least one side S 1 , S2 of the two angled sides, so that the at least one sensor 310, 310A, 310B, 310C, 310D crossing the at least two angled sides SI, S2 in combination with the at least one other side S3 (or sides S1-S3 of a different simplepolygon) resolves on the fly, the crossed sides to the more than one substantially aligned linear segments AS, BS, CS, DS, ES, FS, GS, HS, IS.

[0091] Referring to Figs. 1A-13 and 17, an exemplary substrate processing method will be described. In accordance with the method, calibration data for the metrology system 300 is generated (Fig. 17, Block 1700). The calibration data may include, but is not limited to, calibration shapes / edge profiles of the substrate S, known spatial relationships between the at least one sensor 310, 310A, 310B, 310B, 310D and a substrate holding location (e.g., of a load lock 102, process module 130, aligner, etc.), known spatial relationships between the at least one center deterministic feature 410, 410A, 410B, 410C, 410D and the end effector reference point 211C, known dimensions of the at least one center deterministic feature 410, 410A, 410B, 410C, 410D, or any other suitable calibration data.

[0092] The controller 110 commands the drive section 200 so that the substrate transport apparatus is operated to move the end effector 211 towards a substrate holding location (e.g., process module, load lock, aligner, etc.) past at least one sensor 310, 310A, 310B, 310C, 310D (Fig. 17, Block 1705) corresponding with the substrate holding location. Where the end effector is holding a substrate S, the at least one sensor 310, 310A, 310B, 310C, 310D senses the substrate S with the end effector in motion (Fig. 17, Block 1710). The controller 110 may determine the substrate center SC with the end effector 211 in motion (Fig. 17, Block 1715) in the manner described herein. The controller 110 may also determine occurrence of substrate slippage relative to the end effector 211 with the end effector 211 in motion (Fig. 17, Block 1720) in the manner described herein.

[0093] With movement of the end effector towards the substrate holding location, the at least one sensor 310, 310A, 310B, 310C, 310D senses the temperature determining flag 377 with the end effector in motion (Fig. 17, Block 1725). Based on the sensor data obtained from sensing the temperature determining flag 377, the controller 110 determines (in the manners described herein), with the end effector 211 in motion, a temperature of one or more of the at least one center deterministic feature 410, 410A, 410B, 410C, 410D and the end effector 211 (Fig. 17, Block 1730).

[0094] With continuous movement of the end effector 211 towards the substrate holding location, the at least one sensor 310, 310A, 310B, 310C, 310D senses the center deterministic feature 410,410A, 410B, 410C, 410D (Fig. 17, Block 1735). With the end effector still in motion, the controller 110 determines (as described herein), based on sensor data obtained from sensing the at least one center deterministic feature 410, 410A, 410B, 410C, 410D, the end effector reference point 211C (Fig. 17, Block 1740). Where the end effector 211 is holding a substrate S, the spatial positions of both the substrate center SC and the end effector reference point 211C known, the controller 110 determines (as described herein) the offset between the substrate center SC and the end effector reference point 211C. Given the known spatial relationship between the at least one sensor 310, 310A, 310B, 310C, 310D and the substrate holding location (e.g., of the load lock, process modules, aligner, etc. corresponding to the sensor) and the locations of the substrate center SC (in the case a substrate is held on the end effector) and end effector reference point 211C are determined with respect to the coordinates of the at least one sensor 310, 310A, 310B, 310C, 310D, the controller adjusts the spatial position of the end effector 21 1 so as to align the center of the substrate SC with the substrate holding location (in the case of a substrate being held on the end effector) or so as to align the end effector reference point 211C with the substrate holding location (in the case a substrate is not held on the end effector), while providing real time position feedback of the end effector position (and hence the substrate position) (Fig. 17, Block 1755) as described herein. With the real time position feedback provided by sensing the at least one center deterministic feature 410, 410A, 410B, 410C, 410D, the controller 110 continues, in the case a substrate S is held on the end effector 211, to move the end effector 211 to as to place the substrate S with the substrate center SC substantially aligned / coincident with the substrate holding location (Fig. 17, Block 1760). In the case a substrate S is not held on the end effector, and with the real time position feedback, the controller 110 continues to move the end effector 211 to substantially align the end effector reference point 211C with the substrate holding location for picking a substrate S from the substrate holding location (Fig. 17, Block 1765).

[0095] The following features of the present disclosure are provided and may be employed individually, in any combination with each other, and / or in any combination with the features described above.

[0096] A substrate processing apparatus includes: a frame; a substrate transport apparatus connected to the frame and having an end effector with a substrate holding station having a predetermined center, the end effector being configured to hold a substrate at the substrate holdingstation and transport the substrate within the substrate processing apparatus; a linear image array sensor connected to the frame and being configured to effect on the fly, with the substrate transport apparatus in motion, sensing of an edge of the substrate held on the end effector; and at least one simple polygon defining a center deterministic feature integral to the substrate transport apparatus and disposed so that the linear image array sensor crossing the simple polygon resolves, on the fly, the simple polygon in combination with at least one further side or edge of the apparatus different from the simple polygon into a point set of more than three substantially collinear points, the resolution of the point set effecting determination of the predetermined center of the substrate holding station on the end effector.

[0097] The at least one further side or edge is of a different simple polygon disposed in a predetermined relation on the apparatus to the simple polygon.

[0098] The simple polygon and the at least one further side or edge form a substantially saw tooth shape on the substrate transport apparatus.

[0099] The substrate transport apparatus has a substrate handler from which the end effector depends, and wherein the point set of more than three substantially collinear points effect, in real time, pose determination of the end effector in at least three degrees of freedom substantially decoupled from substrate handler position data.

[0100] The at least three degrees of freedom include lateral and longitudinal offsets of the predetermined center from a predetermined location of the predetermined center, and include a yaw angle of the end effector from a predetermined end effector pose.

[0101] The at least three degrees of freedom include an offset of the end effector in a direction normal to a substrate transport plane and a pitch angle of the end effector from the predetermined end effector pose.

[0102] The linear image array sensor sensing the edge of the substrate resolves a substrate edge profile determinative of a substrate center, the substrate edge profile and the substrate center being resolved on the fly.

[0103] Determination of the substrate center and determination of the center of the substrate holding station are effected in a common pass of the end effector relative to the linear image array sensor, so that substrate eccentricity is determined and automatic substrate centering is effected in real time substantially decoupled from substrate handler position data.

[0104] The linear image array sensor sensing the edge of the substrate resolves a substrate edge profile determinative of at least one of a substrate center and a substrate slip condition relative to the end effector, the substrate edge profile, the at least one of the substrate center, and the substrate slip condition being resolved on the fly.

[0105] The lineai’ image array sensor comprises linear sensor segments substantially aligned with each other.

[0106] The substrate transport apparatus includes a temperature determination flag that effects a determination of a temperature of one or more of the end effector and the at least one simple polygon.

[0107] The determination of the predetermined center of the substrate holding station on the end effector effects, on the fly, at least updating position information of one or more encoders of a drive section of the substrate transport apparatus.

[0108] A substrate processing apparatus includes: a frame; a substrate transport apparatus connected to the frame and having an end effector with a substrate holding station having a predetermined center, the end effector being configured to hold a substrate at the substrate holding station and transport the substrate within the substrate processing apparatus; a lineai’ image array sensor connected to the frame and being configured to effect on the fly, with the substrate transport apparatus in motion, sensing of an edge of the substrate held on the end effector; and an array of sides defining a center deterministic feature integral to the substrate transport apparatus and disposed with at least two angled sides, orientated at a predetermined angle with respect to each other, and at least another side orientated at a different angle relative to at least one side of the two angled sides, so that the linear image array sensor crossing the at least two angled sides in combination with the at least one other side resolves on the fly, the crossed sides to more than onesubstantially aligned linear segments that effect determination of the predetermined center of the substrate holding station on the end effector.

[0109] At least two sides from the at least one other side and at least one of the at least two angled sides are sides of a common simple polygon.

[0110] The at least two sides and the at least another other side form a substantially saw tooth shape on the substrate transport apparatus.

[0111] The substrate transport apparatus has a substrate handler from which the end effector depends, and wherein the substantially aligned linear segments effect, in real time, pose determination of the end effector in at least three degrees of freedom substantially decoupled from substrate handler position data.

[0112] The at least three degrees of freedom include lateral and longitudinal offsets of the predetermined center from a predetermined location of the predetermined center, and include a yaw angle of the end effector from a predetermined end effector pose.

[0113] The at least three degrees of freedom include an offset of the end effector in a direction normal to a substrate transport plane and pitch angle of the end effector from the predetermined end effector pose.

[0114] The linear image array sensor sensing the edge of the substrate resolves a substrate edge profile determinative of substrate center, the substrate edge profile and the substrate center being resolved on the fly.

[0115] Determination of the substrate center and determination of the center of the substrate holding station are effected in a common pass of the end effector relative to the linear image array sensor, so that substrate eccentricity is determined and automatic substrate centering is effected in real time substantially decoupled from substrate handler position data.

[0116] The linear image array sensor sensing the edge of the substrate resolves a substrate edge profile determinative of at least one of a substrate center and a substrate slip condition relative to the end effector, the substrate edge profile, the at least one of the substrate center, and the substrate slip condition being resolved on the fly.

[0117] The linear image array sensor comprises linear sensor segments substantially aligned with each other.

[0118] The substrate transport apparatus includes a temperature determination flag that effects a determination of a temperature of one or more of the end effector and the at least one simple polygon.

[0119] The determination of the predetermined center of the substrate holding station on the end effector effects, on the fly, at least updating position information of one or more encoders of a drive section of the substrate transport apparatus.

[0120] A substrate processing method includes: providing a substrate processing apparatus having: a frame, a substrate transport apparatus connected to the frame and having an end effector with a substrate holding station having a predetermined center, the end effector being configured to hold a substrate at the substrate holding station and transport the substrate within the substrate processing apparatus, and

[0121] at least one simple polygon defining a center deterministic feature integral to the substrate transport apparatus; sensing, with a linear image array sensor connected to the frame, of an edge of the substrate held on the end effector on the fly, with the substrate transport apparatus in motion; and effecting, with the resolution of a point set, determination of the predetermined center of the substrate holding station on the end effector, where the at least one simple polygon is disposed so that the linear image array sensor crossing the simple polygon resolves, on the fly, the simple polygon in combination with at least one further side or edge of the substrate transport apparatus different from the simple polygon into the point set of more than three substantially collinear points.

[0122] The at least one further side or edge is of a different simple polygon disposed in a predetermined relation on the apparatus to the simple polygon.

[0123] The simple polygon and the at least one further side or edge form a substantially saw tooth shape on the substrate transport apparatus.

[0124] The substrate transport apparatus has a substrate handler from which the end effector depends, the method further comprising effecting, with the point set of more than three substantially collinear points, in real time, pose determination of the end effector in at least three degrees of freedom substantially decoupled from substrate handler position data.

[0125] The at least three degrees of freedom include lateral and longitudinal offsets of the predetermined center from a predetermined location of the predetermined center, and include a yaw angle of the end effector from a predetermined end effector pose.

[0126] The at least three degreed of freedom include an offset of the end effector in a direction normal to a substrate transport plane and a pitch angle of the end effector from the predetermined end effector pose.

[0127] The linear image array sensor sensing the edge of the substrate resolves a substrate edge profile determinative of a substrate center, the substrate edge profile and the substrate center being resolved on the fly.

[0128] Determination of the substrate center and determination of the center of the substrate holding station are effected in a common pass of the end effector relative to the linear image array sensor, so that substrate eccentricity is determined and automatic substrate centering is effected in real time substantially decoupled from substrate handler position data.

[0129] The linear image array sensor sensing the edge of the substrate resolves a substrate edge profile determinative of at least one of a substrate center and a substrate slip condition relative to the end effector, the substrate edge profile, the at least one of the substrate center, and the substrate slip condition being resolved on the fly.

[0130] The linear image array sensor comprises linear sensor segments substantially aligned with each other.

[0131] The method comprises, determining, with a temperature determination flag of the substrate transport apparatus, a determination of a temperature of one or more of the end effector and the at least one simple polygon.

[0132] The method comprises, at least updating, on the fly, position information of one or more encoders of a drive section of the substrate transport apparatus based on the determination of the predetermined center of the substrate holding station on the end effector.

[0133] A substrate processing method includes: providing a substrate processing apparatus having: a frame, a substrate transport apparatus connected to the frame and having an end effector with a substrate holding station having a predetermined center, the end effector being configured to hold a substrate at the substrate holding station and transport the substrate within the substrate processing apparatus, and an array of sides defining a center deterministic feature integral to the substrate transport apparatus; sensing, with a linear image array sensor connected to the frame, of an edge of the substrate held on the end effector on the fly, with the substrate transport apparatus in motion; and effecting, with more than one substantially aligned linear segments, determination of the predetermined center of the substrate holding station on the end effector, where the array of sides are disposed with at least two angled sides, orientated at a predetermined angle with respect to each other, and at least another side orientated at a different angle relative to at least one side of the two angled sides, so that the linear image array sensor crossing the at least two angled sides in combination with the at least one other side resolves on the fly, the crossed sides to the more than one substantially aligned linear segments.

[0134] At least two sides from the at least one other side and at least one of the at least two angled sides are sides of a common simple polygon.

[0135] The at least two sides and the at least another other side form a substantially saw tooth shape on the substrate transport apparatus.

[0136] The substrate transport apparatus has a substrate handler from which the end effector depends, the method further comprising effecting, with the substantially aligned linear segments, in real time, pose determination of the end effector in at least three degrees of freedom substantially decoupled from substrate handler position data.

[0137] The at least three degrees of freedom include lateral and longitudinal offsets of the predetermined center from a predetermined location of the predetermined center, and include a yaw angle of the end effector from a predetermined end effector pose.

[0138] The at least three degrees of freedom include an offset of the end effector in a direction normal to a substrate transport plane and pitch angle of the end effector from the predetermined end effector pose.

[0139] The linear image array sensor sensing the edge of the substrate resolves a substrate edge profile determinative of substrate center, the substrate edge profile and the substrate center being resolved on the fly.

[0140] Determination of the substrate center and determination of the center of the substrate holding station are effected in a common pass of the end effector relative to the linear image array sensor, so that substrate eccentricity is determined and automatic substrate centering is effected in real time substantially decoupled from substrate handler position data.

[0141] The linear image array sensor sensing the edge of the substrate resolves a substrate edge profile determinative of at least one of a substrate center and a substrate slip condition relative to the end effector, the substrate edge profile, the at least one of the substrate center, and the substrate slip condition being resolved on the fly.

[0142] The linear image array sensor comprises linear sensor segments substantially aligned with each other.

[0143] The method includes, determining, with a temperature determination flag of the substrate transport apparatus, a determination of a temperature of one or more of the end effector and the at least one simple polygon.

[0144] The method includes, at least updating, on the fly, position information of one or more encoders of a drive section of the substrate transport apparatus based on the determination of the predetermined center of the substrate holding station on the end effector.

[0145] It should be understood that the foregoing description is only illustrative of the present disclosure. Various alternatives and modifications can be devised by those skilled in the art without departing from the present disclosure. Accordingly, the present disclosure is intended to embrace all such alternatives, modifications and variances that fall within the scope of any claims appended hereto. Further, the mere fact that different features are recited in mutually differentdependent or independent claims does not indicate that a combination of these features cannot be advantageously used, such a combination remaining within the scope of the present disclosure.

[0146] What is claimed is:

Claims

CLAIMS1. A substrate processing apparatus comprising: a frame; a substrate transport apparatus connected to the frame and having an end effector with a substrate holding station having a predetermined center, the end effector being configured to hold a substrate at the substrate holding station and transport the substrate within the substrate processing apparatus; a linear image array sensor connected to the frame and being configured to effect on the fly, with the substrate transport apparatus in motion, sensing of an edge of the substrate held on the end effector; and at least one simple polygon defining a center deterministic feature integral to the substrate transport apparatus and disposed so that the linear image array sensor crossing the simple polygon resolves, on the fly, the simple polygon in combination with at least one further side or edge of the apparatus different from the simple polygon into a point set of more than three substantially collinear points, the resolution of the point set effecting determination of the predetermined center of the substrate holding station on the end effector.

2. The substrate processing apparatus of claim 1, wherein the at least one further side or edge is of a different simple polygon disposed in a predetermined relation on the apparatus to the simple polygon.

3. The substrate processing apparatus of claim 1, wherein the simple polygon and the at least one further side or edge form a substantially saw tooth shape on the substrate transport apparatus.

4. The substrate processing apparatus of claim 1, wherein the substrate transport apparatus has a substrate handler from which the end effector depends, and wherein the point set of more than three substantially collinear points effect, in real time, pose determination of the end effector in at least three degrees of freedom substantially decoupled from substrate handler position data.

5. The substrate processing apparatus of claim 1, wherein the linear image array sensor sensing the edge of the substrate resolves a substrate edge profile determinative of a substrate center, the substrate edge profile and the substrate center being resolved on the fly.

6. The substrate processing apparatus of claim 1, wherein the linear image array sensor comprises linear sensor segments substantially aligned with each other.

7. The substrate processing apparatus of claim 1, wherein the substrate transport apparatus includes a temperature determination flag that effects a determination of a temperature of one or more of the end effector and the at least one simple polygon.

8. The substrate processing apparatus of claim 1, wherein the determination of the predetermined center of the substrate holding station on the end effector effects, on the fly, at least updating position information of one or more encoders of a drive section of the substrate transport apparatus.

9. A substrate processing apparatus comprising: a frame; a substrate transport apparatus connected to the frame and having an end effector with a substrate holding station having a predetermined center, the end effector being configured to hold a substrate at the substrate holding station and transport the substrate within the substrate processing apparatus; a linear image array sensor connected to the frame and being configured to effect on the fly, with the substrate transport apparatus in motion, sensing of an edge of the substrate held on the end effector; and an array of sides defining a center deterministic feature integral to the substrate transport apparatus and disposed with at least two angled sides, orientated at a predetermined angle with respect to each other, and at least another side orientated at a different angle relative to at least one side of the two angled sides, so that the linear image array sensor crossing the at least two angled sides in combination with the at least one other side resolves on the fly, the crossed sides to more than onesubstantially aligned linear segments that effect determination of the predetermined center of the substrate holding station on the end effector.

10. The substrate processing apparatus of claim 9, wherein at least two sides from the at least one other side and at least one of the at least two angled sides are sides of a common simple polygon.

11. The substrate processing apparatus of claim 9, wherein the at least two sides and the at least another other side form a substantially saw tooth shape on the substrate transport apparatus.

12. The substrate processing apparatus of claim 9, wherein the substrate transport apparatus has a substrate handler from which the end effector depends, and wherein the substantially aligned linear segments effect, in real time, pose determination of the end effector in at least three degrees of freedom substantially decoupled from substrate handler position data.

13. The substrate processing apparatus of claim 9, wherein the linear image array sensor sensing the edge of the substrate resolves a substrate edge profile determinative of substrate center, the substrate edge profile and the substrate center being resolved on the fly.

14. The substrate processing apparatus of claim 9, wherein the linear image array sensor comprises linear sensor segments substantially aligned with each other.

15. The substrate processing apparatus of claim 9, wherein the substrate transport apparatus includes a temperature determination flag that effects a determination of a temperature of one or more of the end effector and the at least one simple polygon.

16. The substrate processing apparatus of claim 9, wherein the determination of the predetermined center of the substrate holding station on the end effector effects, on the fly, at least updating position information of one or more encoders of a drive section of the substrate transport apparatus.

17. A substrate processing method comprising: providing a substrate processing apparatus having:a frame, a substrate transport apparatus connected to the frame and having an end effector with a substrate holding station having a predetermined center, the end effector being configured to hold a substrate at the substrate holding station and transport the substrate within the substrate processing apparatus, and at least one simple polygon defining a center deterministic feature integral to the substrate transport apparatus; sensing, with a linear image array sensor connected to the frame, of an edge of the substrate held on the end effector on the fly, with the substrate transport apparatus in motion; and effecting, with the resolution of a point set, determination of the predetermined center of the substrate holding station on the end effector, where the at least one simple polygon is disposed so that the linear image array sensor crossing the simple polygon resolves, on the fly, the simple polygon in combination with at least one further side or edge of the substrate transport apparatus different from the simple polygon into the point set of more than three substantially collinear points.

18. The method of claim 17, wherein the substrate transport apparatus has a substrate handler from which the end effector depends, the method further comprising effecting, with the point set of more than three substantially collinear points, in real time, pose determination of the end effector in at least three degrees of freedom substantially decoupled from substrate handler position data.

19. The method of claim 17, further comprising, determining, with a temperature determination flag of the substrate transport apparatus, a determination of a temperature of one or more of the end effector and the at least one simple polygon.

20. The method of claim 17, further comprising, at least updating, on the fly, position information of one or more encoders of a drive section of the substrate transport apparatus based on the determination of the predetermined center of the substrate holding station on the end effector.

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