Sugar-contaning binder composition for wood material boards, in particular wood particle boards, in the form of a one-component system

Abstract

The present invention relates to a binder composition for wood material boards, as in the form of a one-component system, the binder composition comprising a) at least one sugar, and b) at least one mixture composed of at least one compound of general formula (I) R1 aSiX1 (4-a) (I), wherein X1 is alkoxy, aryloxy, acyloxy, and R1 is an organic moiety selected from the group comprising alkyl, aryl, cycloalkyl, which can be interrupted by -O- or -NH-, and wherein R1 comprises at least one functional group Q1, which is selected from a group containing an acryl group, an acryloxy group, an amino group, an aminoalkylamino group, a methacryl group, a methacryloxy group, a cyano group, an isocyano group, an epoxide group, and an alkenyl group, and a is 0, 1, 2, 3, in particular 0 or 1, at least one compound of general formula (II) R2 bSiX2 (4-b) (II), wherein X2 is alkoxy, aryloxy, acyloxy, R2 is a non-hydrolyzable organic moiety R2 selected from the group comprising alkyl and aryl, and b is 1, 2, 3, or 4, preferably 1 or 2.

Description

[0001] Sugar-containing binder composition for wood-based panels, especially particle boards, as a one-component system

[0002] The present invention relates to a sugar-containing binder system for wood-based panels, and to a wood-based panel containing this sugar-containing binder system.

[0003] Description

[0004] Adhesives and binders are a crucial component in the industrial production of a wide variety of products, including the manufacture of wood-based panels. In this process, wood chippings are bonded with the binder and then compressed into shaped bodies, such as panels, under pressure and temperature. The type and quantity of binder used is significantly influenced by the size and quality of the wood fibers and / or wood chips used.

[0005] Wood-based materials (HWS) have been manufactured for decades using binders based on thermosets. Of these thermosets, urea-formaldehyde glues are the most important in terms of quantity. Other glues also used in wood-based materials are melamine-urea-formaldehyde and phenol-formaldehyde glues. These binders essentially contain two components. One component is formaldehyde, the other component is a petroleum-based chemical (e.g. phenol) or from the ammonia chemistry (e.g. melamine or urea). In recent years, however, toxicological studies have shown that formaldehyde is to be classified as carcinogenic. This naturally also affects products such as wood-based materials, which emit small amounts of formaldehyde during use due to the use of the aforementioned glue.

[0006] There are also glues based on isocyanates (PMDI = polymeric diphenylmethane diisocyanate). All of these glues are produced from petrochemical precursors.

[0007] Developments at the EU level indicate that, in addition to the requirements regarding the circular economy, there is also increasing emphasis on the use of renewable raw materials for product manufacturing. This poses problems for the glues mentioned above and, consequently, the HWS produced from them. On the one hand, recycling HWS produced with thermosetting binders is difficult because some of the glues used are highly hydrolysis-resistant, and, of course, the use of petrochemical precursors should be avoided.

[0008] In addition, the requirements regarding the emission of ingredients, especially formaldehyde, are currently becoming more stringent, which does not necessarily encourage the use of HWS with formaldehyde-containing glues.

[0009] One possible solution is to use glues based on renewable raw materials. Possible precursors include mono- or disaccharides, starch, proteins, and lignin, to name just a few.

[0010] For example, the binder composition described in EP 2930195 A1 is based on a mono- and / or disaccharide, an amide, and an aldehyde, particularly formaldehyde. Although the formaldehyde content could be reduced, a complete elimination of formaldehyde is not possible with this system.

[0011] EP351 1353 A1 discloses a binder composition comprising a mono- and / or disaccharide, an amide, and a dialdehyde. A stable precursor is first prepared from the saccharide and urea as an amide. The dialdehyde is added to this precursor shortly before use as a binder.

[0012] EP 3995538 A1 and EP 4129597 A1 describe two-component binder systems for wood-based panels based on sugar or sugar alcohols and isocyanate and, if necessary, polyvinyl alcohol.

[0013] EP 2576661 A1 describes a two-component system consisting of a plant flour and a polyisocyanate-based prepolymer or latex. Another system based on lignin, alkali, and epichlorohydrin is disclosed in WO 2022003614. This system is used for the production of plywood.

[0014] The systems described each contain a hardener or crosslinker, which makes the system technically usable. The hardeners or crosslinkers are usually based on "petroleum chemicals", so the approach of developing a binder system based solely on renewable raw materials is not fulfilled. In addition, the hardeners or crosslinkers sometimes have to be added in considerable quantities. Another aspect is that these binders are not suitable for the production of the various wood-based materials, but only for one or a few HWS. However, a binder system should enable the production of "all" wood-based materials. Adhesive systems with plant-based components are also known. CN 106398614 describes a process for producing a spray adhesive for application to the surface of a wooden article.The adhesive composition described here is based on epoxy resins, MQ silicone resin (M: MesSiO; Q: SiO4), organic solvents (such as acetone, cyclohexane), EDTA, various plant components such as Echinacea, Magnolia officinalis, Pineilia Chrysanthemum and many others, tea, almond milk, ash, boron carbide, brown sugar and many other components.

[0015] In the context of these changes in the market due to legal requirements, the question always arises as to whether the use of renewable raw materials could lead to food shortages. The question also needs to be answered as to whether the precursors for the production of glues are available in sufficient quantities year-round.

[0016] In addition, potential glues based on renewable raw materials could pose a challenge for existing press lines, especially with regard to dosing, as some can only be applied in powder form. This is not the case for the glues currently in use. Another aspect is that glues based on renewable raw materials do not achieve the technological values ​​required for the various products.

[0017] The object of the present invention is to develop a binder system which does not have the problems described above, i.e. it is available in sufficient quantities, is available as a liquid glue, can be processed on existing equipment and achieves similar technological values ​​to conventional glues. In addition, the glue should be produced from a raw material that is not relevant for nutrition. The glue should be non-toxic and the formulation should not contain any organic solvents. Furthermore, the glue should be able to be produced with as little energy as possible. It should also be possible to produce it in a concentration range that is comparable to the urea-formaldehyde glues used today (50 - 60 wt%).

[0018] This object is achieved according to the invention by a binder system having the features of claim 1, a wood-based panel having the features of claim 15. Accordingly, a binder system for wood-based panels is provided, which is present and usable as a one-component system. This binder system comprises or can be prepared from: a) At least one sugar; and b) At least one mixture of at least one compound of the general formula (I)

[0019] R 1 aSiX 1 (4 -a) (I), where

[0020] - X 1 Alkoxy, aryloxy, acyloxy, and

[0021] - R 1 an organic radical is selected from the group comprising alkyl, aryl, cycloalkyl, which may be interrupted by -O- or -NH-, and

[0022] - where R 1has at least one functional group Qi selected from a group containing an acrylic, acryloxy, amino, aminoalkylamino, methacrylic, methacryloxy, cyano, isocyano, epoxy and alkenyl group, and

[0023] - a = 0, 1, 2, 3, in particular 0 or 1, and

[0024] - at least one compound of general formula (II)

[0025] R 2 bSiX 2 (4.b) (II), where

[0026] - X 2 alkoxy, aryloxy, acyloxy,

[0027] - R 2 a non-hydrolyzable organic residue R 2 is selected from the group comprising alkyl and aryl, and

[0028] - b = 1, 2, 3, or 4, preferably 1 or 2,

[0029] Accordingly, a binder system is provided, which essentially consists of a reaction product of sugar and silane. The sugar component is available worldwide in large quantities year-round and is already used for a variety of industrial applications. For this application, it is not necessary to use sugar suitable for food production or direct consumption. Raw sugar can also be used. The large available quantities also ensure that there is no competition with food applications.

[0030] The present composition comprises a crosslinking component, the compound of general formula (I), and a hydrophobic component, the compound of general formula (II). The crosslinking, hydrophilic component of formula (I) enables, on the one hand, in particular via the free -OH groups and functional groups (present or formed by hydrolysis of, for example, alkoxy groups), the compound to bind to the wood particles and the sugar components, and, on the other hand, the formation of crosslinks. The hydrophobic component of formula (II) - formed, for example, from the alkyl groups of the radical R 2 - forms a water-repellent barrier.

[0031] The present binder composition can be used not only for surface bonding, but also for bonding wood particles such as chips, strands, or fibers. Accordingly, the present binder composition is preferably used as a binder for lignocellulose-containing boards, in particular for wood fiberboards, particleboards, gypsum fiberboards, or cement fiberboards. The present binder composition can also be used as an adhesive for plywood, glued laminated timber, or laminated veneer lumber (LVL) production.

[0032] Thickeners can be used to adjust viscosity if necessary. These can be various flours (wheat or rye flour, guar gum, locust bean gum, etc.).

[0033] A particularly advantageous feature is that the glue is a single-component system. This prevents pre-curing of the glue during plant downtimes. Cleaning of production lines is also significantly more cost-effective, as there is no need to remove hardened glue residue from plant components (e.g., mixers, etc.).

[0034] One-component system is much easier to handle than a

[0035] Multi-component system in which the individual components must be mixed.

[0036] The present aqueous binder system preferably contains no other components in relevant quantities other than the sugar, silanes, and optionally inorganic particles and a thickener. It is free of aldehydes, in particular formaldehyde, isocyanates, synthetic polymers such as epoxy-, latex-, or polyisocyanate-based polymers, synthetic polyols, mineral or natural oils, hardeners (e.g., alkanolamine salts of acids), wetting agents (surfactants or mixtures thereof), defoamers, release agents, and / or other synthetic components. Furthermore, no other plant or animal substances or inorganic substances such as metal ions or carbides are added.

[0037] The present binder system therefore has a number of advantages over known binders: the raw material is available in any quantity, no formaldehyde emissions, no complex process adjustments, no toxicity of the additional component, one-component system.

[0038] In one embodiment of the present binder system, mono- and / or disaccharides are used as sugars. Mono- and disaccharides can be used in their reducing or non-reducing form.

[0039] Reducing mono- or disaccharides are saccharides that contain at least one aldehyde group in the linear state. Non-reducing saccharides, on the other hand, do not contain any free aldehyde groups. An example of a non-reducing disaccharide is sucrose, in which the two monosaccharides glucose and fructose are linked in acetal form via an α,β-1,2-glycosidic bond under neutral and basic conditions. However, under acidic conditions, sucrose can be cleaved into the reducing monosaccharides glucose and fructose.

[0040] In a preferred embodiment, the disaccharide sucrose is used, for example, in the form of cane sugar or granulated sugar.

[0041] In another embodiment, pentoses and hexoses can be used as monosaccharides. Pentoses and hexoses are in particular selected from the group containing arabinose, ribose, xylose, glucose (dextrose), mannose, galactose and fructose. The monosaccharides mentioned can be used in both their D- and L-form. The use of glucose is particularly preferred. It is also generally conceivable to use sugar alcohols selected from a group containing tetrahydric, pentahydric, and hexahydric alcohols (also known as reduced sugars or alditols). The tetrahydric alcohols used can be threitol, erythritol, and pentaerythritol; the pentahydric alcohols used can be arabitol, adonitol, and xylitol; and the hexahydric alcohols used can be sorbitol, mannitol, dulcitol, and dipentaerythritol. The use of sorbitol (or sorbitol) has proven particularly advantageous.

[0042] Polyols or polyalcoholic compounds based on sugars may also be used. The use of synthetic polyols such as glycols, such as ethylene glycol, propylene glycol, diethylene glycol, triethylene glycol, polyethylene glycol, polypropylene glycol, and polybutylene glycol, is therefore not permitted.

[0043] As stated, the present binder system comprises, in addition to the sugar component, silane compounds of the general formula (I) and (II).

[0044] In one embodiment, the binder system comprises at least two, preferably at least three silane compounds of the general formula (I) and at least one compound of the general formula (II).

[0045] The rest X 1 is advantageously selected from a group containing C 1-6 alkoxy, in particular methoxy, ethoxy, n-propoxy and butoxy, C 1-6 aryloxy, in particular phenoxy, C 2-7 acyloxy, in particular acetoxy or propionoxy, and the radical X 2is advantageously selected from a group containing C1-6-alkoxy, in particular methoxy, ethoxy, n-propoxy and butoxy, C1-w aryloxy, in particular phenoxy, C2-7-acyloxy, in particular acetoxy or propionoxy,

[0046] The organic residue R 1 is preferably selected from a group comprising C1-C50-alkyl, in particular C1-C25-alkyl, particularly preferably C1-C10-alkyl and C5-C5-cycloalkyl. In one embodiment, the organic R 1 selected from the group containing methyl, ethyl, n-propyl, isopropyl, n-butyl, s-butyl, t-butyl, pentyl, hexyl, cyclohexyl, preferably methyl, ethyl, propyl.

[0047] In one embodiment of the present binder composition, the at least one functional group Q 1selected from a group containing amino, aminoalkylamino, methacrylic, methacryloxy, epoxy, and alkenyl groups, preferably amino, aminoalkylamino, epoxy, and alkenyl groups, particularly preferably amino, aminoalkylamino (e.g., aminoethylamino), and alkenyl groups. An alkenyl group is understood here to mean a group with a double bond. The functional group Q 1 can therefore advantageously have a residue with a double bond or an epoxy group, which can be activated and polymerized by means of UV radiation.

[0048] In a preferred embodiment of the present binder composition, at least one compound of general formula (I) corresponds to the formula R 1 Six 1 3 with R 1 with C1 -C10 alkyl having a functional group Q 1 selected from amino, aminoalkylamino (e.g. aminoethylamino), methacryloxy, epoxide and alkenyl groups and with X 1Alkoxy, especially methoxy, ethoxy, n-propoxy or i-propoxy.

[0049] In one variant, R1 can be methyl, ethyl or propyl substituted with a functional group Q1 , in particular substituted with an amino, aminoalkylamino or alkenyl group.

[0050] In one variant, the alkenyl group is present as a vinyl group. In this case, the vinyl group is directly bonded to the silicon atom, so that R1 as an alkyl group can preferably be omitted.

[0051] In a variant of the present composition, compounds of the general formula (I) according to R 1 Six 1 3, with a functional group Q 1be selected from methacryloxypropyltrimethoxysilane (MPTS), silanes with an epoxy functionalization such as glycidyloxypropyltriethoxysilane, or silanes with an amino functionalization such as 2-aminoethyl-3-aminopropyltriethoxysilane or silanes with a vinyl functionalization such as vinyltrimethoxysilane.

[0052] As described, the residue R 1 at least one functional group Q 1 In addition, the remainder R 1 also substituted with other residues

[0053] The term “substituted” refers to the substitution of one or more atoms, usually H atoms, by one or more of the following substituents, preferably by one or two of the following substituents: halogen, hydroxy, protected hydroxy, oxo, protected oxo, C5-C12-cycloalkyl, bicyclic alkyl, phenyl, naphthyl, amino, protected amino, monosubstituted amino, protected monosubstituted amino, disubstituted amino, guanidino, protected guanidino, a heterocyclic ring, a substituted heterocyclic ring, such as pyrrolidinyl, imidazolyl, indolyl, C1-C12-alkoxy, C1-C12-acyl, C1-C12-acyloxy, acryloyloxy, nitro, carboxy, protected carboxy, carbamoyl, cyano, methylsulfonylamino, thiol, C1-C12-alkylthio and C1-C12- -Alkylsulfonyl. The substituted alkyl, aryl, and alkenyl groups can be substituted once or twice, preferably with the same or different substituents.

[0054] The term "aryl," as used herein, refers to aromatic hydrocarbons, for example, phenyl, benzyl, naphthyl, or anthryl. Substituted aryl groups are aryl groups that are substituted, as defined above, with one or more substituents as defined above.

[0055] The term “cycloalkyl” includes the groups cyclopropyl, cyclobutyl, cyclopentyl, cyclohexyl and cycloheptyl.

[0056] In a further variant of the present binder composition, the compound of general formula (I) corresponds to the formula SiX 1 4, where the remainder X 1 Alkoxy, especially methoxy, ethoxy, n-propoxy, or i-propoxy. Tetramethoxysilane and tetraethoxysilane are particularly preferred crosslinkers.

[0057] In a further embodiment of the present composition, the non-hydrolyzable organic radical R 2the compound according to formula (II) selected from a group comprising Ci-Cis-alkyl, in particular Ci-C alkyl, and Ce-C aryl. These may be unsubstituted or substituted with another hydrophobic group

[0058] It is preferred if the non-hydrolyzable organic radical R 2 is selected from the group consisting of methyl, ethyl, n-propyl, isopropyl, n-butyl, s-butyl, t-butyl, pentyl, hexyl, heptyl, octyl, nonyl, cyclohexyl, phenyl, and naphthyl. Methyl, ethyl, propyl, octyl, or phenyl radicals are particularly preferred.

[0059] The term “non-hydrolyzable organic residue” in the context of the present invention is understood to mean an organic residue which, in the presence of water, does not lead to the formation of an OH group or NH2 group linked to the Si atom

[0060] The compound of formula (II) may in particular comprise: R 2 Six 2 3 with R 2as a C1-C10 alkyl group, preferably methyl, ethyl, propyl, pentyl, hexyl, heptyl, octyl, or as a C6-C10 aryl group, preferably phenyl and with X 2 as alkoxy, in particular methoxy, ethoxy, n-propoxy, or i-propoxy, such as methyltriethoxysilane, octyltriethoxysilane, or phenyltriethoxysilane. In one variant of the present composition, one compound of general formula (I) and one compound of general formula (II) are used.

[0061] As already mentioned, a further variant of the present binder composition may also contain at least two, preferably at least three, compounds of general formula (I) and at least one compound of general formula (I). Any combination is conceivable here.

[0062] The following combinations of silane compounds can be used in the present binder composition:

[0063] - at least one SiX1 4, where the remainder X 1 Alkoxy, especially methoxy, ethoxy, n-propoxy or i-propoxy, and at least one R 2 Six 2 3 with R 2 as a C1 -C10 alkyl group, preferably methyl, ethyl, propyl, pentyl, hexyl, heptyl, octyl, and with X 2 as alkoxy, in particular methoxy, ethoxy, n-propoxy or i-propoxy, or

[0064] - at least one SiX 1 4, where the remainder X 1 Alkoxy, especially methoxy, ethoxy, n-propoxy or i-propoxy, at least one R 1 Six 1 3 with R 1 with C1 -C8 alkyl having a functional group Q 1 selected from amino, aminoalkylamino, epoxide and alkenyl groups and with X 1 Alkoxy, in particular methoxy, ethoxy, n-propoxy or i-propoxy, and at least one R 2 Six 2 3 with R 2 as a C1 -C10 alkyl group, preferably methyl, ethyl, propyl, pentyl, hexyl, heptyl, octyl, and with X 2as alkoxy, in particular methoxy, ethoxy, n-propoxy or i-propoxy, or

[0065] - at least one SiX 1 4, where the remainder X 1 Alkoxy, especially methoxy, ethoxy, n-propoxy or i-propoxy, and at least two (different) R 1 Six 1 3 with R 1 with C1 -C8 alkyl having a functional group Q 1 selected from amino, aminoalkylamino, epoxide and alkenyl groups and with X 1 Alkoxy, in particular methoxy, ethoxy, n-propoxy or i-propoxy, and at least one R 2 Six 2 3 with R 2 as a C1 -C10 alkyl group, preferably methyl, ethyl, propyl, pentyl, hexyl, heptyl, octyl, and with X 2 as alkoxy, in particular methoxy, ethoxy, n-propoxy or i-propoxy.

[0066] In particularly preferred embodiments, the binder system contains:

[0067] - tetraethoxysilane and vinyltriethoxysilane as compounds of formula (I) and methyltriethoxysilane as compound of formula (II), or - tetraethoxysilane, vinyltriethoxysilane and 2-aminoethyl-3-aminopropyltriethoxysilane as compounds of formula (I) and methyltriethoxysilane as compound of formula (II),

[0068] In a further embodiment, the compound of general formula (I) is contained in the composition in a molar amount between 0.05 - 0.2 mol, preferably 0.06 - 0.15 mol, particularly preferably 0.08-0.12 mol and the compound of general formula (II) is contained in a molar amount between 0.05 and 0.2 mol, preferably between 0.1 and 0.18 mol, particularly preferably between 0.12 and 0.16 mol.

[0069] The range of the molar amount specified for the compound of the general compound (I) can refer to one compound or to the sum of two compounds or three compounds of the general formula (I).

[0070] Thus, in the variant of the composition of tetraethoxysilane and vinyltriethoxysilane as compounds of formula (I) and methyltriethoxysilane as compound of formula (II), 0.04 mol of tetraethoxysilane, 0.02 mol of vinyltriethoxysilane and 0.16 mol of methyltriethoxysilane may be contained.

[0071] In the other variant of the composition of tetraethoxysilane, vinyltriethoxysilane and 2-aminoethyl-3-aminopropyltriethoxysilane as compounds of formula (I) and methyltriethoxysilane as compounds of formula (II), 0.035 mol of tetraethoxysilane, 0.019 mol of vinyltriethoxysilane and 0.022-aminoethyl-3-aminopropyltriethoxysilane and 0.16 mol of methyltriethoxysilane may be contained.

[0072] The ratio of the silane compound of formula (I) to the silane compound of formula (II) is preferably between 1:0.5 and 2:1, particularly preferably between 1:0.75 and 1.5:1, most preferably between 1:1 and 1.2:1.

[0073] The binder system is preferably in the form of an aqueous suspension. However, residues of organic solvents, particularly alcohols (such as ethanol), may also be present in the binder system. The solvent content is primarily determined by the use of the silanes. The alcohol content can, for example, be < 1%.

[0074] In a further embodiment, the present binder composition can contain inorganic particles, in particular SiO2, Al2O3, ZrO2, and TiO2 particles. The particles preferably used here have a size between 2 and 400 nm, preferably between 2 and 100 nm, and particularly preferably between 2 and 50 nm. The addition of the inorganic particles increases the solids content of the composition, thereby improving the application behavior of the composition. The addition of inorganic particles also prevents shrinkage and cracking. The inorganic particles can be used in an amount range of 0.1 to 25 wt.%, preferably 5 to 20 wt.%, based on the solids content of the silane material (sol-gel material). In a preferred variant, nanoscale SiO2 particles are added as an aqueous, basic suspension.

[0075] The present binder composition can have the following combinations:

[0076] - at least one SiX 1 4, where the remainder X 1 Alkoxy, especially methoxy, ethoxy, n-propoxy or i-propoxy, and at least one R 2 Six 2 3 with R 2 as a C1 -C10 alkyl group, preferably methyl, ethyl, propyl, pentyl, hexyl, heptyl, octyl, and with X 2 as alkoxy, in particular methoxy, ethoxy, n-propoxy or i-propoxy, and SiO2 particles, or

[0077] - at least one SiX 1 4, where the remainder X 1 Alkoxy, especially methoxy, ethoxy, n-propoxy or i-propoxy, at least one R 1 Six 1 3 with R 1 with C1 -C8 alkyl having a functional group Q 1 selected from amino, aminoalkylamino, epoxide and alkenyl groups and with X 1 Alkoxy, in particular methoxy, ethoxy, n-propoxy or i-propoxy, and at least one R 2 Six2 3 with R 2 as a C1 -C10 alkyl group, preferably methyl, ethyl, propyl, pentyl, hexyl, heptyl, octyl, and with X 2 as alkoxy, in particular methoxy, ethoxy, n-propoxy or i-propoxy, and SiO2 particles, or

[0078] - at least one SiX 1 4, where the remainder X 1 Alkoxy, especially methoxy, ethoxy, n-propoxy or i-propoxy, and at least two (different) R 1 Six 1 3 with R 1 with C1 -C8 alkyl having a functional group Q 1 selected from amino, aminoalkylamino, epoxide and alkenyl groups and with X 1 Alkoxy, in particular methoxy, ethoxy, n-propoxy or i-propoxy, and at least one R 2 Six 2 3 with R 2 as a C1 -C10 alkyl group, preferably methyl, ethyl, propyl, pentyl, hexyl, heptyl, octyl, and with X 2 as alkoxy, in particular methoxy, ethoxy, n-propoxy or i-propoxy, and SiO2 particles.

[0079] In particularly preferred embodiments, the binder system contains:

[0080] - Tetraethoxysilane and vinyltriethoxysilane as compounds of formula (I) and methyltriethoxysilane as compound of formula (II), and SiO2 particles, or - Tetraethoxysilane, vinyltriethoxysilane and 2-aminoethyl-3-aminopropyltriethoxysilane as compounds of formula (I) and methyltriethoxysilane as compound of formula (II), and SiO2 particles.

[0081] Sugar and silanes are mixed, the amount of sugar based on the total amount of binder composition being between 40 and 60 g, preferably 45 to 55 g, e.g. 50 g, and the amount of silanes (as a mixture in the form of a suspension) based on the total amount of binder composition being between 30 and 50 g, preferably 35 and 45 g, e.g. 40 g.

[0082] The mass ratio between sugar and silanes is between 0.5:1 and 1:1, preferably 0.8:1.

[0083] The present binder composition can have the following combinations:

[0084] - at least one SiX 1 4, where the remainder X 1 Alkoxy, especially methoxy, ethoxy, n-propoxy or i-propoxy, and at least one R 2 Six 2 3 with R 2 as a C1 -C10 alkyl group, preferably methyl, ethyl, propyl, pentyl, hexyl, heptyl, octyl, and with X 2 as alkoxy, in particular methoxy, ethoxy, n-propoxy or i-propoxy, and optionally SiO2 particles, and at least one sugar, or

[0085] - at least one SiX 1 4, where the remainder X 1 Alkoxy, especially methoxy, ethoxy, n-propoxy or i-propoxy, at least one R 1 Six 1 3 with R 1 with C1 -C8 alkyl having a functional group Q 1 selected from amino, aminoalkylamino, epoxide and alkenyl groups and with X 1Alkoxy, in particular methoxy, ethoxy, n-propoxy or i-propoxy, and at least one R 2 Six 2 3 with R 2 as a C1 -C10 alkyl group, preferably methyl, ethyl, propyl, pentyl, hexyl, heptyl, octyl, and with X 2 as alkoxy, in particular methoxy, ethoxy, n-propoxy or i-propoxy, and optionally SiO2 particles, and at least one sugar, or

[0086] - at least one SiX 1 4, where the remainder X 1 Alkoxy, especially methoxy, ethoxy, n-propoxy or i-propoxy, and at least two (different) R 1 Six 1 3 with R 1 with C1 -C8 alkyl having a functional group Q 1 selected from amino, aminoalkylamino, epoxide and alkenyl groups and with X 1 Alkoxy, in particular methoxy, ethoxy, n-propoxy or i-propoxy, and at least one R 2 Six 2 3 with R 2as a C1 -C10 alkyl group, preferably methyl, ethyl, propyl, pentyl, hexyl, heptyl, octyl, and with X 2 as alkoxy, especially methoxy, ethoxy, n-propoxy or i-propoxy, and optionally SiO2 particles and at least one sugar. In particularly preferred embodiments, the binder system contains:

[0087] - Tetraethoxysilane and vinyltriethoxysilane as compounds of formula (I) and methyltriethoxysilane as compound of formula (II), and optionally SiO2 particles, and at least one sugar, or

[0088] - Tetraethoxysilane, vinyltriethoxysilane and 2-aminoethyl-3-aminopropyltriethoxysilane as compounds of formula (I) and methyltriethoxysilane as compound of formula (II), and optionally SiO2 particles and at least one sugar.

[0089] As already mentioned above, it is also possible and, under certain conditions (e.g., when the binder composition is very thin), desirable to add at least one thickener to the binder composition. The addition of a thickener is advantageous for adjusting the viscosity of the binder composition to prevent the binder from penetrating the wood fibers or wood fiberboard due to excessive thinness or insufficient viscosity. Suitable thickeners for viscosity adjustment include natural or synthetic thickeners.

[0090] Organic thickeners include starch, gelatin, casein, and even flours such as wheat flour, rye flour, guar gum, and locust bean gum. When using conventional flours, it is also possible to use biologically contaminated flours, as the subsequent processing of the wood materials and the high temperatures during the manufacturing process of the wood-based panels destroy biological contamination, for example, in the form of harmful microorganisms.

[0091] Modified natural substances such as hydroxyethylcellulose, carboxymethylcellulose, hydroxypropylmethylcellulose, hydroxypropylcellulose, or ethylhydroxyethylcellulose can be used as additional thickeners. Synthetic thickeners such as polyvinyl alcohols, polyacrylic acid, polymethacrylic acid, polyacrylamides, polyvinylpyrrolidones, and polyethylene glycols can also be used.

[0092] The thickener may be added in an amount of 5 to 30 wt%, preferably 10 to 15 wt%, depending on the desired viscosity of the binder composition. The binder composition used herein can be prepared in a process comprising the following steps:

[0093] - Providing at least one compound, preferably two compounds of general formula (I) and at least one compound of general formula (II);

[0094] - adding at least one catalyst, in particular an acid, to the mixture of at least one compound, preferably two compounds of formula (I) and at least one compound of formula (II);

[0095] - optional addition of at least a dispersion of inorganic particles;

[0096] - Separation of the aqueous phase of the reaction mixture from at least one compound, preferably two compounds of formula (I) and at least one compound of formula (II),

[0097] - optionally adding at least one further, third compound of the general formula (I),

[0098] - Addition of at least one sugar to the separated aqueous reaction mixture of at least one compound, preferably two compounds of formula (I) and at least one compound of formula (II).

[0099] Inorganic and / or organic acids suitable as catalysts are selected from a group consisting of phosphoric acid, acetic acid, p-toluenesulfonic acid, hydrochloric acid, formic acid, or sulfuric acid. Ammonium salts such as ammonium sulfate, which react as weak acids, are also suitable. p-toluenesulfonic acid is particularly preferred.

[0100] To subsequently neutralize the reaction mixture, a basic compound, such as ammonia, is preferably added. This leads to a separation of the aqueous phase containing the binder component from the alcoholic phase (ethanolic phase). The aqueous phase can then be easily separated from the alcoholic phase.

[0101] In the case that inorganic particles are mixed into the binder composition, the inorganic particles are preferably used in an amount between 0.1 to 15 wt%, preferably 0.5 to 10 wt%, particularly preferably between 1 to 5 wt% with respect to the total amount of the binder.

[0102] The inorganic particles, especially SiO2 particles, are added as a basic suspension. This simultaneously serves to change the pH of the reaction mixture and separate the alcoholic phase from the aqueous silane suspension. The sugar is added to the aqueous silane suspension.

[0103] The binder composition can be sprayed onto the wood particles as an aqueous mixture. This can be done, for example, in a mixer, a coil, or a blow line.

[0104] The present binder composition is used in an amount between 10 and 20 wt%, preferably between 12 and 15 wt% based on the total amount of wood particles.

[0105] After the binding agent composition has been applied to the wood particles, the glued wood particles are placed or scattered on a conveyor belt and then pressed into a wood-based panel in a multi-level or continuous press.

[0106] The pressing can be carried out at a pressing temperature between 150 and 250°C, preferably 180°C and 220°C, and a pressing time between 30 and 240 seconds, preferably 100 and 210 seconds, in particular 150 and 180 seconds.

[0107] The wood-based panels produced by the present process thus have a binder composition consisting of at least one sugar and a silane mixture (as defined above).

[0108] The wood particles used in the present process are preferably wood chips or wood strands.

[0109] With the present method, wood-based panels can therefore preferably be provided in the form of a particle board or an OSB (oriented strand board).

[0110] Chipboards form the basis of many everyday objects, such as furniture or coverings for walls, floors or ceilings.

[0111] To produce particleboard, wood chips are first produced from suitable wood. It is also possible to produce wood shavings without using wood chips. The wood chips or wood can be cleaned of impurities before further use, for example, through dry or wet cleaning. The wood chips are then machined in a chipper.

[0112] The wood chips produced by the machining process typically have a length between 1.5 mm and 20 mm and a thickness between 0.05 mm and 1 mm.

[0113] In a further step, after the machining process, the wood chips are exposed to or brought into contact with the existing binder system as described above, whereby the bringing into contact of the wood chips with the binder can be carried out in different ways.

[0114] Wood chips are preferably brought into contact with the binder in a mixing device, e.g. trough mixer or drum mixer (coil).

[0115] After gluing, the wood chips are applied to a conveyor belt by wind and / or litter spreading. The wood chips arranged on the conveyor belt are then compressed under the pressing conditions described above.

[0116] Oriented strand boards (OSB) are wood-based panels made from long strands of wood. Originally a waste product of the veneer and plywood industries, OSB is increasingly being used in timber and prefabricated house construction because it is lightweight yet meets the structural requirements of building boards. OSB is used as building boards, as wall and roof paneling, and even in flooring.

[0117] OSB is manufactured in a multi-stage process, beginning with the strands of debarked roundwood, preferably softwood, being peeled lengthwise by rotating knives. In the subsequent drying process, the strands' natural moisture content is reduced at high temperatures.

[0118] The wood strands produced in this way can have a length between 50 and 200 mm, preferably 70 to 180 mm, particularly preferably 90 to 150 mm; a width between 5 and 50 mm, preferably 10 to 30 mm, particularly preferably 15 to 20 mm; and a thickness between 0.1 and 2 mm, preferably between 0.3 and 1.5 mm, particularly preferably between 0.4 and 1 mm. In one embodiment, the wood strands have, for example, a length between 150 and 200 mm, a width between 15 and 20 mm, a thickness between 0.5 and 1 mm, and a moisture content of max. 50%.

[0119] After the strands have dried, they are introduced into a gluing device (coil) in which the existing binder system is applied to the chips.

[0120] After gluing, the glued strands are spread in spreading devices alternately lengthwise and crosswise to the production direction, so that the strands are arranged crosswise in at least three layers (lower cover layer - middle layer - upper cover layer). The spreading direction of the lower and upper cover layers is the same, but differs from the spreading direction of the middle layer. The strands used in the cover layer and middle layer also differ from one another. For example, the strands used in the cover layers are flat, while those used in the middle layer are less flat and even chip-shaped. Typically, two material strands are used in the production of OSB boards: one with flat strands for the later cover layers and one with "chips" for the middle layer. Accordingly, the strands in the middle layer can be of lower quality, since the flexural strength is essentially generated by the cover layers.Therefore, fines produced during machining can also be used in the middle layer of OSB.

[0121] Following the scattering of the strands, they are continuously pressed under high pressure and high temperature of e.g. 200 to 250°C.

[0122] The wood-based panels, in particular particle boards, produced using the present binder composition have a transverse tensile strength of greater than 0.2 N / mm 2 , preferably greater than 0.25 N / mm 2 , particularly preferably greater than 0.3 N / mm 2 , more preferably greater than 0.4 N / mm 2 The transverse tensile strength can be in a range between 0.2 and 0.9 N / mm 2 , preferably between 0.3 and 0.8 N / mm 2 , particularly preferably between 0.4 and 0.7 N / mm 2 lay.

[0123] In one embodiment, a wood chipboard with the present binder system in an amount of 12 wt% based on the amount of wood chips has a transverse tensile strength in a range between 0.2 and 0.55 N / mm 2 , preferably between 0.25 and 0.5 N / mm 2 , particularly preferably between 0.3 and 0.5 N / mm 2 In a further embodiment, a wood particle board with the present binder system in an amount of 15 wt% based on the amount of wood chips has a transverse tensile strength in a range between 0.3 and 0.9 N / mm 2 , preferably between 0.35 and 0.8 N / mm 2 , particularly preferably between 0.35 and 0.7 N / mm 2 on.

[0124] The particleboards produced with this binder composition meet the requirements of EN 312.

[0125] There is a strong dependence between pressing time and transverse tensile strength: the longer the pressing time, the higher the transverse tensile strength.

[0126] The invention is explained in more detail below using several exemplary embodiments.

[0127] Embodiment 1: Preparation of a first embodiment of the binder composition (ino@sil Y50)

[0128] Initially, 28.33 g of methyltriethoxysilane, 8.077 g of tetraethoxysilane, and 3.27 g of vinyltriethoxysilane are added. 0.32 g of 37% sulfuric acid and 9.76 g of demineralized water are added simultaneously. The mixture is stirred for 80 minutes to hydrolyze and condense. The mixture warms to approximately 45 °C and is cooled to room temperature after the reaction time. Subsequently, 37.92 g of a basic nanoscale SiO2 suspension (Levasil 300 / 30) are added. The pH change leads to phase separation, so that after a waiting time of approximately 60 minutes, the alcoholic phase can be separated from the now aqueous silane suspension using a separating funnel.

[0129] This aqueous suspension is then heated to 50 °C, and the granulated sugar (based on beet sugar or cane sugar) is added while stirring. In this example, "Y50," 50 g of sugar was dissolved in 40 g of silane suspension. The temperature is maintained at 50 °C and stirring is continued for a further 120 minutes.

[0130] Embodiment 2: Preparation of a second embodiment of the binder composition (ino@sil Y50-HS)

[0131] Initially, 27.88 g of methyltriethoxysilane, 7.472 g of tetraethoxysilane, and 2.89 g of vinyltriethoxysilane are added. 0.29 g of 37% sulfuric acid and 9.32 g of demineralized water are added simultaneously. The mixture is stirred for 80 minutes to hydrolyze and condense. The mixture warms to approximately 45 °C and is cooled to room temperature after the reaction time. Subsequently, 36.39 g of a basic nanoscale SiO2 suspension (Levasil 300 / 30) are added. The pH change leads to phase separation, so that after a waiting time of approximately 60 minutes, the alcoholic phase can be separated from the now aqueous silane suspension using a separating funnel.

[0132] Next, 3.75 g of 2-aminoethyl-3-aminopropyltriethoxysilane is added to 50 g of this suspension and stirred for 45 minutes at 30 °C. The amine-functionalized silane leads to further cross-linking via the amine groups, which is more pronounced than the formation of the Si-O-Si condensation, even at "lower" temperatures.

[0133] This aqueous suspension is then heated to 50 °C, and the granulated sugar (based on beet sugar or cane sugar) is added while stirring. In this example, "Y50-HS," 50 g of sugar was dissolved in 40 g of silane suspension. The temperature is maintained at 50 °C and stirring is continued for a further 120 minutes.

[0134] Example 3: Production of wood-based material

[0135] 6 kg of middle layer chips were placed in a mixer. 2.4 kg of sugar silane glue Y 50-HS from Inomat (15% based on chips) were added via nozzles. After dosing was complete, mixing continued for approximately 14 minutes. To produce 15 mm particle boards, 900 g and 1.04 kg of glued chips were taken and scattered into a frame (300 x 300 mm). The particle board was then transferred to a press and pressed using the pressing parameters listed below. The boards were then removed from the press, and after cooling, their transverse tensile strength and swelling were determined.

[0136] As can be seen from the table, there is a strong correlation between the pressing time and the transverse tensile strength. The values ​​for P2 boards according to DIN EN 312 are achieved by all boards with a gluing content of 15 wt%. For the variants with a

[0137] With a gluing of 12 wt%, the standard value is achieved at pressing times above 300 see.

Claims

Claims 1. Binder composition for wood-based panels, in particular particle boards, as a one-component system comprising a) at least one sugar; and b) at least one mixture of at least one compound of the general formula (I) R 1 aSiX 1 (4 -a) (I), where - X 1 Alkoxy, aryloxy, acyloxy, and - R 1 an organic radical is selected from the group comprising alkyl, aryl, cycloalkyl, which may be interrupted by -O- or -NH-, and - where R 1 has at least one functional group Qi selected from a group containing an acrylic, acryloxy, amino, aminoalkylamino, methacrylic, methacryloxy, cyano, isocyano, epoxy and alkenyl group, and - a = 0, 1, 2, 3, in particular 0 or 1, - at least one compound of general formula (II) R 2 bSiX 2(4.b) (II), where - X 2 alkoxy, aryloxy, acyloxy, - R 2 a non-hydrolyzable organic residue R 2 is selected from the group comprising alkyl and aryl, and - b = 1, 2, 3, or 4, preferably 1 or 2.

2. Binder composition according to claim 1, characterized in that it is free from formaldehyde, synthetic polyols and / or plastics.

3. Binder composition according to one of the preceding claims, characterized in that the at least one sugar is a mono- or disaccharide, preferably sucrose.

4. Binder composition according to one of the preceding claims, characterized in that at least two, preferably at least three silane compounds of the general formula (I) and at least one compound of the general formula (II) are contained.

5. Binder composition according to one of the preceding claims, characterized in that X 1 and X 2 are selected from a group containing C1-6-alkoxy, in particular methoxy, ethoxy, n-propoxy and butoxy, C1-aryloxy, in particular phenoxy, C2-7-acyloxy, in particular acetoxy or propionoxy.

6. Binder composition according to one of the preceding claims, characterized in that R 1 is selected from a group comprising C1-C50-alkyl, in particular C1-C25-alkyl, C1-C6-alkyl, and C5-C5-cycloalkyl.

7. Binder composition according to one of the preceding claims, characterized in that the at least one functional group Q 1 is selected from a group containing amino, aminoalkylamino, cyano, isocyano, epoxide and alkenyl groups, preferably amino, aminoalkylamino, epoxide and alkenyl groups, particularly preferably amino, aminoalkylamino and alkenyl groups.

8. Binder composition according to one of the preceding claims, characterized in that at least one compound of the general formula (I) of the formula R 1 Six 1 3 with R 1 with C1-C10 alkyl having a functional group Q 1 selected from amino, aminoalkylamino, cyano, isocyano, epoxide and alkenyl groups and with X 1 Alkoxy, in particular methoxy, ethoxy, n-propoxy or i-propoxy.

9. Binder composition according to one of the preceding claims, characterized in that at least one compound of the general formula (I) of the formula SiX 1 4, especially with X 1 Alkoxy, in particular methoxy, ethoxy, n-propoxy or i-propoxy.

10. Binder composition according to one of the preceding claims, characterized in that the non-hydrolyzable organic R 2is selected from a group comprising Ci-Cis-alkyl, in particular Ci-C alkyl, and Ce-C aryl, preferably methyl, ethyl, n-propyl, isopropyl, n-butyl, s-butyl, t-butyl, pentyl, hexyl, heptyl, octyl, nonyl, cyclohexyl, phenyl and naphthyl.

11. Binder composition according to one of the preceding claims, characterized in that at least one compound of formula (II) of formula R 2 Six 2 3 with R 2 as a C1-C10 alkyl group, preferably methyl, ethyl, propyl, pentyl, hexyl, heptyl, octyl, or as a C6-C10 aryl group, preferably phenyl and with X 2 as alkoxy, in particular methoxy, ethoxy, n-propoxy or i-propoxy.

12. Binder composition according to one of the preceding claims, characterized in that inorganic particles, in particular SiO2, Al2O3, ZrO2, TiO2 particles, may be included.

13. Binder composition according to one of the preceding claims, characterized by at least one thickener.

14. Wood-based panel comprising at least one binder system according to one of the preceding claims.

15. Wood-based panel according to claim 14, characterized in that it is a wood chipboard with a transverse tensile strength of greater than 0.2 N / mm 2 , preferably greater than 0.25 N / mm 2 , particularly preferably greater than 0.3 N / mm 2 , more preferably greater than 0.4 N / mm 2 is.

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