Radiation-induced charge dispersion path

Abstract

An antenna is described. The antenna may include a planar radiating element associated with an operating wavelength. The antenna may include an antenna ground plane. The antenna may include a plurality of redistribution layers. The antenna may include a first radio frequency (RF) path that couples an RF signal from at least one of the plurality of redistribution layers with the planar radiating element. The antenna may include a dispersion path that directly couples the planar radiating element to the antenna ground plane to disperse radiation induced charge accumulated on the planar radiating element to the antenna ground plane, where the dispersion path has an RF impedance at the operating wavelength that is substantially greater than respective RF impedances of the planar radiating element and the first RF path.

Description

RADIATION-INDUCED CHARGE DISPERSION PATHBACKGROUND

[0001] The following relates generally to communications, including radiation-induced charge dispersion paths.

[0002] Communications devices may communicate with one another using wired connections, wireless (e.g., radio frequency (RF)) connections, or both. Wireless communications between devices may be performed using a wireless spectrum that has been designated for a service provider, wireless technology, or both. In some examples, the amount of information that can be communicated via a wireless communications network is based on an amount of wireless spectrum designated to the service provider, and an amount of frequency reuse within the region in which service is provided.

[0003] Antenna systems are critical components of communication links between satellites and ground stations or user terminals. Antenna systems in space operate in a different environment compared to terrestrial systems. One of the main and significant challenges in this environment is the exposure to space radiation. Systems operating in the space environment are exposed to high levels of radiation, which arises from the sun and cosmic rays. Because antenna systems are generally open to the space environment for communication of wireless signals, they may experience a higher level of radiation than other satellite components that can be shielded. Radiation can cause buildup of charge on antenna systems, ultimately leading to failure of electronics coupled with the antenna systems.SUMMARY

[0004] The described techniques relate to improved methods, systems, devices, and apparatuses that support radiation-induced charge dispersion path. For example, the described techniques provide for an antenna that may include a planar radiating element associated with an operating wavelength. The antenna may include an antenna ground plane and signal paths incorporated in redistribution layers. The antenna may include a first radio frequency (RF) path that couples an RF signal from at least one of the redistribution layers with the planar radiating element. The antenna may include a dispersion path that directly couples the planar radiating element to the antenna ground plane to disperse radiation induced charge accumulated on the planar radiating element to the antenna ground plane, where the dispersion path has an RF impedance at the operating wavelength that is substantially greaterthan (e.g., by at least an order of magnitude) respective RF impedances of the planar radiating element and the first RF path.

[0005] The described techniques also relate to a method of manufacturing an antenna. The method may include forming one or more planar antenna elements associated with an operating wavelength. The method may include forming, through the substrate, one or more conductive vias, where the one or more conductive vias form at least a portion of one or more radio frequency (RF) paths for the one or more planar antenna elements. The method may include forming a plurality of redistribution layers, where the plurality of redistribution layers are separated from each other by passivation layers and where a first redistribution layer of the plurality of redistribution layers includes a ground plane for the one or more planar antenna elements. Forming the one or more planar antenna elements, the one or more conductive vias, the plurality of redistribution layers, or a combination thereof, may include forming a dispersion path that directly couples a first planar antenna element of the one or more planar antenna elements to the ground plane. The dispersion path may have an RF impedance at the operating wavelength that is substantially greater than respective RF impedances of the one or more planar antenna elements and the one or more RF paths.BRIEF DESCRIPTION OF THE DRAWINGS

[0006] FIG. 1 shows an example of an antenna that supports radiation-induced charge dispersion paths in accordance with examples as disclosed herein.

[0007] FIG. 2 shows an example of an antenna that supports radiation-induced charge dispersion paths in accordance with examples as disclosed herein.

[0008] FIG. 3 shows an example of an antenna that supports radiation-induced charge dispersion paths in accordance with examples as disclosed herein.

[0009] FIG. 4 shows an example of an antenna that supports radiation-induced charge dispersion paths in accordance with examples as disclosed herein.

[0010] FIG. 5 shows an example of an antenna that supports radiation-induced charge dispersion paths in accordance with examples as disclosed herein.

[0011] FIG. 6 shows a flowchart illustrating methods that support radiation-induced charge dispersion path in accordance with examples as disclosed herein.DETAILED DESCRIPTION

[0012] Antennas are used in a variety of devices and in a variety of scenarios. For example, antennas may be employed on satellites or in other scenarios in which an antenna may be exposed to harsh environments such as the space environment. In some cases, such antennas may be subject to accumulation of charge on the antenna, such as radiation- induced charges. If such charges build up to a sufficient level, the charge may be capable of damaging electronics associated with the antenna.

[0013] The techniques herein describe the use of a dispersion path that couples an antenna element to a ground of the device to allow the charges that may be accumulated on the antenna element to be dispersed and avoid affecting sensitive electronics. The dispersion path is designed to not only allow the continuous or regular discharge of such accumulated radiation-induced charges (or other types of accumulated charges), but also to not substantially affect the radio frequency (RF) operation of the antenna, as this dispersion path may be of an impedance that may be substantially higher (e.g., an order of magnitude or more) than an impedance of other elements of a device, including the antenna element, one or more redistribution layers employed in association with the antenna, RF signal paths, or the like. As a result, the dispersion path effectively appears to be an open circuit to RF signals but provides a path for charges induced by radiation to disperse away from the antenna elements.

[0014] In some cases, the antenna may be manufactured on a substrate such as fused silica or quartz, for example having planar antenna elements formed on the substrate. A dispersion path for an antenna element may be coupled with a dedicated grounding via through the substrate that connects to a ground plane (e.g., an antenna or RF ground plane or a direct current (DC) ground plane associated with other portions of the antenna).Additionally, or alternatively, the dispersion path may be a portion of a redistribution layer that is formed on the substrate (e.g., on an opposite side of the substrate from the antenna elements), and may couple the antenna element to the ground plane through a substrate via that couples the antenna element to one or more redistribution layers for connection to other portions of the antenna system. Additionally, or alternatively, multiple dispersion paths may be daisy-chained between multiple antenna elements, and one of the multiple dispersion paths may be coupled with a ground (e.g., a chassis or housing ground, a ground plane (e.g., an RF ground), a DC ground, one or more other grounds, or any combination thereof).

[0015] Aspects of the disclosure are initially described in the context of satellite communication systems. Aspects of the disclosure are then described with reference to a wireless communications system, example communication resources, and example antennas. Aspects of the disclosure are further illustrated by and described with reference to a flowchart that relates to a manufacturing method for an antenna that includes a radiation-induced charge dispersion path.

[0016] FIG. 1 shows an example of an antenna 100 that supports radiation-induced charge dispersion paths in accordance with examples as disclosed herein.

[0017] In devices operating in space-based environments, charge accumulation can occur on any floating (e.g., ungrounded) metal. If a piece of metal is ungrounded, then charge may build up and may eventually discharge, which can damage or destroy electronics of the device. For example, if left unmitigated, an antenna element may be floating metal that is directly exposed to space. In this condition, surface charges build up and will ultimately discharge when the breakdown voltage of the substrate or other components is reached. In some cases, such a discharge may have a direct path to integrated circuits and other sensitive electronics, damaging them and ceasing their operation.

[0018] In some approaches, floating metal antennas may be covered with an RF transparent germanium coated tape to bleed off such charges. However, there are physical challenges with applying tape to the elements and grounding the tape. Further, for multilayer antennas, where the patches are not directly exposed but still floating, tape cannot be applied to bleed the charges.

[0019] Thus, the techniques described herein involve adding a dispersion path 145 coupled with the floating metal antenna elements (e.g., the antenna element 140) to create a DC short to ground to prevent charge build up with minimal impact to RF performance. In some examples, the dispersion path 145 may include a dispersion element 147 that may be formed on the substrate 110. Dispersion path 145 may also include other elements such as ground via 155. Dispersion element 147 may be a ground trace (e.g., very thin conductive trace, such as thinner than the antenna element 140). In some examples, the length of the dispersion path 145 can be adjusted such that it minimizes the impact to the RF performance, and may have an effective transmission line length of (e.g., be approximately equal in effective length to) a quarter wavelength of the operating frequency. By including the dispersion path 145, the antenna 100 may disperse the radiation-induced charge that builds upon the antenna element 140 via the dispersion path 145 before any substantial charge may be held on the antenna element 140. For example, the dispersion path 145 may aid in constantly or regularly discharging any built up charges before such charges accumulate enough to rapidly discharge and damage electronics.

[0020] It should be noted that the use of the dispersion path 145 described here is different from electrostatic discharge (ESD) protection approaches. In ESD scenarios, charges may suddenly discharge between surfaces or elements, causing damage to electronics or circuitry. ESD protection approaches include a path that conducts such sudden, high-current discharges. However, here, radiation-induced charges are constantly dispersed along the dispersion path 145 of the antenna, avoiding the problem of charge build up before it can occur, resulting in regular, low-current discharge through the dispersion path 145. In fact, such currents associated with the dispersion path 145 are to be on the order of nanoamps, as there is little opportunity for charge to build up in the first place.

[0021] The antenna 100 may include an antenna element 140. The antenna element 140 may transmit or receive signaling from one or more other devices in conjunction with other elements of the antenna 100 as well as additional electronics or circuitry.

[0022] The antenna 100 may include a substrate 110. The substrate 110 may be a fused silica glass, quartz, or other substrate on which one or more antenna elements 140 may be disposed. The antenna element 140 may make connections to one or more redistribution layers through one or more vias, such as the substrate via 135. The redistribution layers may make connections between different portions of the antenna 100 as well as facilitate routing and placement to connect to electronics or circuitry that aid in the operation of the antenna 100. The antenna 100 may further includes one or more passivation layers 1 15, which may alternate with the redistribution layers to aid in isolating the redistribution layers from one another and from other portions of the antenna 100. In some examples, one or more portions of the passivation layers 115 may be removed or modified to allow for vias or other pathways for signals to pass through the passivation layers 115. For example, at an area corresponding with the substrate via 135, one or more portions of one or more of the one or more passivation layers 115 may be removed to allow one or more of the redistribution layers to contact and pass signals between them.

[0023] The antenna 100 may include one or more redistribution layers (e.g., redistribution layers) such as the first redistribution layer 120, the second redistribution layer 125, and thethird redistribution layer 130. One or more of the first redistribution layer 120, the second redistribution layer 125, and the third redistribution layer 130 may be redistribution layers. Further, in some examples, the first redistribution layer 120 may be a ground plane, a ground layer, or other ground reference. In some examples, the first redistribution layer 120 may be an RF ground for the antenna element 140, may include one or more other RF components or circuitry, or any combination thereof. In some examples, the RF path 165 may be a path that couples (e.g., directly or indirectly) the antenna element 140 and one or more of the redistribution layers (e.g., the first redistribution layer 120, the second redistribution layer 125, the third redistribution layer 130, or any combination thereof). In some examples, the RF path 165 may include or be routed through the substrate via 135 and in other examples, the RF path 165 may include an RF coupling (e.g., a capacitive coupling) between the antenna element 140 and another portion of the antenna (e.g., one or more of the redistribution layers, a dedicated element for capacitive coupling with the antenna element 140 which may be coupled with one or more redistribution layers, or any combination thereof).

[0024] The antenna 100 may include one or more pads, such as the pad 150. The pad 150 may provide a point for other circuitry, electronics, or paths to connect to the antenna 100 to aid in the operation of the antenna. In some examples, such pads 150 may connect to one or more redistribution layers, vias, or other elements of the antenna 100 to connect signals to support operation of the antenna 100.

[0025] The antenna 100 may include the dispersion element 147. The dispersion element 147 may provide at least a portion of the dispersion path 145 for the radiation-induced charges to dissipate or disperse from the antenna element 140 to the first redistribution layer 120, which acts as an RF ground for the antenna. In some examples, the dispersion path 145 may extend through the ground via 155 to couple the antenna element 140 to the first redistribution layer 120. For example, as shown in FIG. 1, the dispersion path 145 may pass through the dispersion element 147, which may be a first portion that is on the same side of the substrate 1 10 (e.g., in a same plane as the antenna element 140) and may include or pass through a second portion at least partially located within or as part of the ground via 155. In some examples, the dispersion element 147, the dispersion path 145, or both may be of an impedance that is substantially greater than (e.g., by an order of magnitude or more) an impedance of the second redistribution layer 125, the third redistribution layer 130, the antenna element 140, the RF path 165, or any combination thereof. For example, given an impedance of a redistribution layer or the antenna element 140 of approximately 50 ohms, animpedance of the dispersion path 145 may be on the order of 500 ohms, 1000 ohms, 5000 ohms, or greater. In some examples, such an impedance may be achieved by the dispersion path 145 being of a length 170 (e.g., effective transmission line length of the dispersion path 145, such as the effective length) that is approximately one -quarter of a wavelength associated with an operating frequency of the antenna element 140. In some cases, the dispersion element 147 may be a same material as the antenna element 140, and may, for example, be deposited on the substrate 110 in a same process step as the antenna element 140. Additionally, or alternatively, the dispersion element 147 may include a resistive material (e.g., polysilicon) that contributes to the desired impedance of the dispersion path 145 (e.g., an impedance that is substantially greater than an impedance the second redistribution layer 125, the third redistribution layer 130, the antenna element 140, the RF path 165, or any combination thereof). Where the dispersion path 145 includes a resistive material, it may have a length that is different from one-quarter of a wavelength of the operating frequency. For example, the resistance of the dispersion path 145 may be determined by the resistive material (e.g., of dispersion element 147) and the dimensions (e.g., length, width, thickness) of the resistive material. The resistive material may be deposited on the substrate 110 in a different process step than is used for the antenna element 140. In some cases, the resistive material may include one or more segments.

[0026] In some examples, the dispersion element 147 may be very narrow, such as 12 microns wide. Additionally, or alternatively, the dispersion element 147 may be less than 15 microns wide or another width. In some examples, the thickness of the dispersion element 147 may be less than 5 microns, such as 2 microns thick, or another thickness. In some examples, the physical dimensions of the dispersion element 147 may contribute to the impedance characteristics of the dispersion path 145.

[0027] As depicted in FIG. 1, the dispersion element 147 may be located on a same side of the substrate 110 as the antenna element 140 and may couple the antenna element 140 to the ground via 155, which may be coupled with the first redistribution layer 120 on the other side of the substrate 110 (e.g., opposite the side of the substrate 110 on which the antenna element 140 is located). As described herein, the dispersion path 145 may be of a length that is approximately (e.g., within a threshold difference of) a quarter wavelength of an operating wavelength of the antenna element 140.

[0028] Thus, charges that may build up on the antenna element 140 may be dispersed through the dispersion path 145, through the ground via 155, and to the first redistribution layer 120 (e.g., the RF ground).

[0029] FIG. 2 shows an example of an antenna 200 that supports radiation-induced charge dispersion paths in accordance with examples as disclosed herein. The antenna 200 may include a substrate 210, one or more passivation layers 215, a first redistribution layer 220, a second redistribution layer 225, a third redistribution layer 230, a substrate via 235, an antenna element 240, a dispersion path 245, and a pad 250, possibly among other elements (or multiple instances of those elements shown), which may be examples of similarly-named elements described in other figures. Similarly, the RF path 265 may be a path through which RF signals may travel between the antenna element 240 and one or more other portions of the antenna, including the redistribution layers, which may include the first redistribution layer 220, the second redistribution layer 225, the third redistribution layer 230, or any combination thereof. As such, the discussion of such similar elements in relation to other figures also applies to the elements depicted in FIG. 2.

[0030] The antenna 200 includes a configuration in which the dispersion path 245 includes a dispersion element 247 that is located in or is part of the second redistribution layer 225 on the side of the substrate 210 that is opposite the side where the antenna element 240 is located. The dispersion element 247 may couple the substrate via 235 to the first redistribution layer 220, thereby grounding the antenna element 240 through the substrate via 235 and the dispersion element 247 to the first redistribution layer 220, which may act as an RF ground, allowing charges on the antenna element 240 to be discharged along the dispersion path 245. As described herein at least with reference to FIG. 1, the dispersion path 245 may be of a length (e.g., an effective transmission line length of the dispersion element 247) that is approximately one-quarter of a wavelength associated with an operating frequency of the antenna element 240. Additionally, or alternatively, as described herein at least with reference to FIG. 1 , the dispersion element 247 may include resistive material, and may have a length that is different from one -quarter of a wavelength of the operating frequency.

[0031] FIG. 3 shows an example of an antenna 300 that supports radiation-induced charge dispersion paths in accordance with examples as disclosed herein. The antenna 300 may include a substrate 310, one or more passivation layers 315, a first redistribution layer 320, a second redistribution layer 325, a third redistribution layer 330, a substrate via 335, anantenna element 340, a dispersion path 345, and a pad 350, possibly among other elements, which may be examples of similarly-named elements described in other figures. Similarly, the RF path 365 may be a path through which RF signals may travel between the antenna element 340 and one or more other portions of the antenna, including the redistribution layers, which may include the first redistribution layer 320, the second redistribution layer 325, the third redistribution layer 330, or any combination thereof. As such, the discussion of such similar elements in relation to other figures also applies to the elements depicted in FIG. 3.

[0032] The antenna 300 includes a configuration in which the dispersion path 345 includes a dispersion element 347 that is located in the third redistribution layer 330, on the side of the substrate 310 that is opposite the side where the antenna element 340 is located. The dispersion element 347 may be implemented in multiple redistribution layers (e.g., second redistribution layer 325, third redistribution layer 330), and may couple the substrate via 335 to the first redistribution layer 320 which may act as an RF ground. The dispersion path 345 may thereby provide a DC path to ground for the antenna element 340 through the substrate via 335, allowing charges on the antenna element 340 to be dispersed along the dispersion path 345 to ground. In some examples, the arrangement described herein (e.g., involving the use of a portion of a redistribution layer to serve as the dispersion element 347 and grounding the dispersion element 347 through connections through one or more intermediate redistribution layers) Such arrangements may employ any portion of any redistribution layer as a portion of the dispersion path 345 and may connect to the antenna element 340 through the substrate via 335 through any quantity of intermediate redistribution layers and may further connect to the first redistribution layer 320 through any quantity of intermediate redistribution layers. As described herein at least with reference to FIG. 1, the dispersion path 345 may be of a length (e.g., an effective transmission line length of the dispersion path 345 including dispersion element 347) that is approximately one-quarter of a wavelength associated with an operating frequency of the antenna element 340. Additionally, or alternatively, as described herein at least with reference to FIG. 1, the dispersion path 345 may include resistive material (e.g., for dispersion element 347), and may have a length that is different from one-quarter of a wavelength of the operating frequency.

[0033] FIG. 4 shows an example of an antenna 400 that supports radiation-induced charge dispersion paths in accordance with examples as disclosed herein. The antenna 400 may include a substrate 410, one or more passivation layers 415, a first redistribution layer 420, a second redistribution layer 425, a third redistribution layer 430, a substrate via 435, anantenna element 440, a dispersion path 445, and a pad 450, possibly among other elements (or multiple instances of those elements shown), which may be examples of similarly-named elements described in other figures. Similarly, the RF path 465 may be a path through which RF signals may travel between the antenna element 440 and one or more other portions of the antenna, including the redistribution layers, which may include the first redistribution layer 420, the second redistribution layer 425, the third redistribution layer 430, or any combination thereof. As such, the discussion of such similar elements in relation to other figures also applies to the elements depicted in FIG. 4.

[0034] The antenna 400 may also include the DC ground plane 460, which may serve as a ground plane for one or more DC-based portions of the antenna 400 or a device with which the antenna 400 interacts. As depicted, in some examples, the antenna element 440 may be coupled with the dispersion path 445, which in turn may be coupled with the ground via 455. Such an arrangement is similar to the arrangement described in relation to FIG. 3. However, here, the ground via 455 may be coupled with the DC ground plane 460, instead of the first redistribution layer 420 (e.g., the RF ground plane). However, this still allows charges that may be induced on the antenna element 440 to be dispersed via the dispersion path 445 without substantially affecting RF operations. As described herein at least with reference to FIG. 1 , the dispersion path 445 may include a dispersion element 447 and may be of a length 470 (e.g., an effective transmission line length of the dispersion path 445 including dispersion element 447) that is approximately one-quarter of a wavelength associated with an operating frequency of the antenna element 440. Additionally, or alternatively, as described herein at least with reference to FIG. 1, the dispersion path 445 may include resistive material (e.g., of dispersion element 447), and may have a length that is different from one-quarter of a wavelength of the operating frequency.

[0035] FIG. 5 shows an example of an antenna 500 that supports radiation-induced charge dispersion paths in accordance with examples as disclosed herein. The antenna 500 may include a substrate 510, one or more passivation layers 515, a first redistribution layer 520, a second redistribution layer 525, a third redistribution layer 530, multiple substrate vias 535, multiple antenna elements 540, one or more dispersion paths 545, and multiple pads 550, possibly among other elements (or multiple instances of those elements shown), which may be examples of similarly-named elements described in other figures. Similarly, the RF paths 565 may be paths through which RF signals may travel between an antenna element 540 and one or more other portions of the antenna, including the redistribution layers, which mayinclude the first redistribution layer 520, the second redistribution layer 525, the third redistribution layer 530, or any combination thereof. As such, the discussion of such similar elements in relation to other figures also applies to the elements depicted in FIG. 5.

[0036] The antenna 500 may include multiple antenna elements 540. As it may be desirable to ground each of these antenna elements 540, multiple iterations of other techniques or arrangements described herein may be employed. However, other alternatives are also possible. For example, as depicted in the antenna 500, the multiple antenna elements 540 may be “daisy-chained” with multiple dispersion paths 545 between them. In this way, the dispersion paths 545 may provide a path for induced charges at multiple antenna elements 540 to have a connection to ground and to be dispersed from the multiple antenna elements 540..

[0037] In some examples, one or more of the multiple dispersion paths 545 may include dispersion elements 547 that may be coupled with the first redistribution layer 520 which may act as an RF ground. Additionally, or alternatively, one or more of the multiple dispersion paths 545 may be coupled with a DC ground plane (e.g., similar to the arrangement of the antenna 400). Additionally, or alternatively, one or more of the multiple dispersion paths 545 may be coupled with another ground source, such as the housing 555 through the coupling 560, as depicted in the antenna 500. In some examples, the dispersion path 545 that is most directly grounded may be located at an edge of the substrate 510 (e.g., to facilitate connecting to the housing 555 or other ground). The coupling between the dispersion paths 545 or antenna elements 540 and the RF or DC ground may occur at a regular interval of antenna elements, such as every tenth, twentieth, or fiftieth antenna element 540.

[0038] As described herein at least with reference to FIG. 1 , the dispersion path 545 may be of a length (e.g., an effective transmission line length of the dispersion path 545 including dispersion element 547) that is approximately one-quarter of a wavelength associated with an operating frequency of the antenna element 540. Additionally, or alternatively, as described herein at least with reference to FIG. 1 , the dispersion path 545 may include resistive material (e.g., of dispersion element 547), and may have a length that is different from one-quarter of a wavelength of the operating frequency.

[0039] FIG. 6 shows a flowchart illustrating a method 600 that supports radiation- induced charge dispersion paths in accordance with examples as disclosed herein. In some examples, an apparatus or system may execute a set of instructions to control the functionalelements to perform the described functions. Additionally, or alternatively, the apparatus or system may perform aspects of the described functions using special-purpose hardware.

[0040] At 605, the method may include forming, on a first side of a substrate, one or more planar antenna elements associated with an operating wavelength. The operations of 605 may be performed in accordance with examples as disclosed herein.

[0041] At 610, the method may include forming, through the substrate, one or more conductive vias, wherein the one or more conductive vias form at least a portion of one or more radio frequency (RF) paths for the one or more planar antenna elements. The operations of 610 may be performed in accordance with examples as disclosed herein.

[0042] At 615, the method may include forming, on a second side of the substrate opposite the first side, a plurality of redistribution layers, wherein the plurality of redistribution layers are separated from each other by passivation layers, and wherein a first redistribution layer of the plurality of redistribution layers comprises a ground plane for the one or more planar antenna elements. The operations of 615 may be performed in accordance with examples as disclosed herein.

[0043] In some examples, forming the one or more planar antenna elements, the one or more conductive vias, the plurality of redistribution layers, or a combination thereof, comprises forming a dispersion path that directly couples a first planar antenna element of the one or more planar antenna elements to the ground plane, and wherein the dispersion path has an RF impedance at the operating wavelength that is substantially greater than respective RF impedances of the one or more planar antenna elements and the one or more RF paths.

[0044] In some examples of the method described herein, the dispersion path may have an effective transmission line length that may be one quarter of the operating wavelength.

[0045] In some examples of the method described herein, the dispersion path may include a resistive material. In some examples, the resistive material may be formed on a same side of the substrate as the antenna element, or may be formed on one or more layers of the plurality of redistribution layers.

[0046] In some examples of the method described herein, the one or more planar antenna elements may be formed from a first conductive material and the dispersion path may be at least partially formed from the first conductive material on the first side of the substrate and may be coupled with the ground plane through one of the one or more conductive vias. Forexample, the one or more planar antenna elements and the dispersion path may be formed in a same processing (e.g., deposition) step.

[0047] In some examples of the method described herein, the dispersion path may be at least partially formed in a second redistribution layer of the plurality of redistribution layers.

[0048] In some examples of the method described herein, the dispersion path may be coupled with the ground plane via a third redistribution layer, of the plurality of redistribution layers.

[0049] In some examples of the method described herein, forming each of the plurality of redistribution layers may include operations, features, means, or instructions for depositing a conductive material via a chemical vapor deposition process, applying a photoresist material to the conductive material, applying a photoresist mask to the photoresist material to protect first portions of the photoresist material, exposing unprotected second portions of the photoresist material, and etching portions of the conductive material corresponding to the unprotected second portions of the photoresist material.

[0050] In some examples of the method described herein, forming each of the passivation layers may include operations, features, means, or instructions for depositing a dielectric material, applying a photoresist material to the dielectric material, applying a photoresist mask to the photoresist material to protect first portions of the photoresist material, exposing unprotected second portions of the photoresist material, and removing portions of the dielectric material corresponding to the unprotected second portions of the photoresist material. In some examples of the method described herein, the unprotected second portions of the photoresist material correspond with locations of one or more vias through the dielectric material.

[0051] It should be noted that these methods describe examples of implementations, and that the operations and the steps may be rearranged or otherwise modified such that other implementations are possible. In some examples, aspects from two or more of the methods may be combined. For example, aspects of each of the methods may include steps or aspects of the other methods, or other steps or techniques described herein.

[0052] Information and signals described herein may be represented using any of a variety of different technologies and techniques. For example, data, instructions, commands, information, signals, bits, symbols, and chips that may be referenced throughout thedescription may be represented by voltages, currents, electromagnetic waves, magnetic fields or particles, optical fields or particles, or any combination thereof.

[0053] The various illustrative blocks and modules described in connection with the disclosure herein may be implemented or performed with a general purpose processor, a DSP, an ASIC, an FPGA, or other programmable logic device, discrete gate or transistor logic, discrete hardware components, or any combination thereof designed to perform the functions described herein. A general purpose processor may be a microprocessor, but in the alternative, the processor may be any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices (e.g., a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors in conjunction with a DSP core, or any other such configuration).

[0054] The functions described herein may be implemented in hardware, software executed by a processor, firmware, or any combination thereof. If implemented in software executed by a processor, the functions may be stored on or transmitted over as one or more instructions or code on a computer readable medium. Other examples and implementations are within the scope of the disclosure and appended claims. For example, due to the nature of software, functions described herein can be implemented using software executed by a processor, hardware, firmware, hardwiring, or combinations of any of these. Features implementing functions may also be physically located at various positions, including being distributed such that portions of functions are implemented at different physical locations.

[0055] Computer readable media includes both non transitory computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another. A non-transitory storage medium may be any available medium that can be accessed by a general purpose or special purpose computer. By way of example, and not limitation, non-transitory computer readable media may include RAM, ROM, electrically erasable programmable read-only memory (EEPROM), flash memory, compact disk read-only memory (CDROM) or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other non-transitory medium that can be used to carry or store desired program code means in the form of instructions or data structures and that can be accessed by a general purpose or special purpose computer, or a general purpose or special purpose processor. Also, any connection is properly termed a computer readable medium. For example, if the software is transmitted from a website, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair, digitalsubscriber line (DSL), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of medium. Disk and disc, as used herein, include CD, laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu ray disc where disks usually reproduce data magnetically, while discs reproduce data optically with lasers. Combinations of the above are also included within the scope of computer readable media.

[0056] As used herein, including in the claims, “or” as used in a list of items (e.g., a list of items prefaced by a phrase such as “at least one of’ or “one or more of’) indicates an inclusive list such that, for example, a list of at least one of A, B, or C means A or B or C or AB or AC or BC or ABC (i.e., A and B and C). Also, as used herein, the phrase “based on” shall not be construed as a reference to a closed set of conditions. For example, an exemplary step that is described as “based on condition A” may be based on both a condition A and a condition B without departing from the scope of the present disclosure. In other words, as used herein, the phrase “based on” shall be construed in the same manner as the phrase “based at least in part on.”

[0057] In the appended figures, similar components or features may have the same reference label. Further, various components of the same type may be distinguished by following the reference label by a dash and a second label that distinguishes among the similar components. If just the first reference label is used in the specification, the description is applicable to any one of the similar components having the same first reference label irrespective of the second reference label, or other subsequent reference label.

[0058] The description set forth herein, in connection with the appended drawings, describes example configurations and does not represent all the examples that may be implemented or that are within the scope of the claims. The term “exemplary” used herein means “serving as an example, instance, or illustration,” and not “preferred” or “advantageous over other examples.” The detailed description includes specific details for the purpose of providing an understanding of the described techniques. These techniques, however, may be practiced without these specific details. In some instances, well known structures and devices are shown in block diagram form in order to avoid obscuring the concepts of the described examples.

[0059] The description herein is provided to enable a person skilled in the art to make or use the disclosure. Various modifications to the disclosure will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other variations without departing from the scope of the disclosure. Thus, the disclosure is not limited to the examples and designs described herein but is to be accorded the broadest scope consistent with the principles and novel features disclosed herein.

Claims

CLAIMSWhat is claimed is:

1. An antenna, comprising: a planar radiating element (140) disposed on a first side of a substrate(110), the planar radiating element (140) associated with an operating wavelength; an antenna ground plane (120) disposed on a second side of the substrate (110) opposite the first side of the substrate (110); a plurality of redistribution layers (125, 130) disposed on the second side of the substrate (110); a first radio frequency (RF) path (165) that couples an RF signal from at least one of the plurality of redistribution layers (125, 130) with the planar radiating element (140); and a dispersion path (145) that directly couples the planar radiating element (140) to the antenna ground plane (120) to disperse radiation induced charge accumulated on the planar radiating element (140) to the antenna ground plane (120), wherein the dispersion path (145) has an RF impedance at the operating wavelength that is substantially greater than respective RF impedances of the planar radiating element (140) and the first RF path (165).

2. The antenna of claim 1, wherein: the dispersion path (145) has an effective transmission line length (0170) that is one quarter of the operating wavelength of the antenna.

3. The antenna of any one of claims 1 through 2, wherein: the dispersion path (145) comprises a resistive material.

4. The antenna of any one of claims 1 through 3, wherein: the dispersion path (145) is disposed on the first side of the substrate(110) in a same plane as the planar radiating element (140) and is coupled to the antenna ground plane (120) through a via (155) that is disposed in the substrate (110).

5. The antenna of any one of claims 1 through 4, wherein: the first RF path (165) includes a first via (135).

6. The antenna of claim 5, wherein: the dispersion path (245) is comprised in a first redistribution layer (225) of the plurality of redistribution layers; and the dispersion path (245) is coupled to the antenna ground plane (220) and the first via (235).

7. The antenna of any of claims 1 through 6, wherein: the dispersion path (345) is comprised in a second redistribution layer (330) of the plurality of redistribution layers (325, 330), wherein the dispersion path (345) is coupled to the first RF path (365) and is further coupled to the antenna ground plane (320) through an intermediate path comprised in a first redistribution layer (325) of the plurality of redistribution layers (325, 330).

8. The antenna of any one of claims 1 through 7, wherein: the planar radiating element (140) is a patch radiating element.

9. The antenna of any one of claims 1 through 8, wherein: a width of the dispersion path (145) is less than 15 microns.

10. The antenna of any one of claims 1 through 9, wherein: the antenna ground plane (120) is coupled to a direct current (DC) ground plane.

11. The antenna of any one of claims 1 through 10, further comprising: a plurality of planar radiating elements comprising the planar radiating element (540), the plurality of planar radiating elements coupled with respective redistribution layers (525, 530) of the plurality of redistribution layers through respective vias (535); and a plurality of dispersion paths comprising the dispersion path (545), wherein the plurality of planar radiating elements (540) are coupled to the antenna ground plane (520) via respective dispersion paths (545) of the plurality of dispersion paths.

12. The antenna of any one of claims 1 through 11, further comprising: a plurality of planar radiating elements comprising the planar radiating element (540); and a plurality of dispersion paths (545), wherein respective planar radiating elements (540) of the plurality of planar radiating elements are coupled with other planar radiating elements (540) of the plurality of planar radiating elements via respective dispersion paths (545) of the plurality of dispersion paths.

13. A method for manufacturing an antenna, comprising: forming, on a first side of a substrate (110), one or more planar antenna elements (140) associated with an operating wavelength; forming, through the substrate (110), one or more conductive vias (135), wherein the one or more conductive vias (135) form at least a portion of one or more radio frequency (RF) paths (165) for the one or more planar antenna elements (140); and forming, on a second side of the substrate (110) opposite the first side, a plurality of redistribution layers (120, 125, 130), wherein the plurality of redistribution layers are separated from each other by passivation layers (115), and wherein a first redistribution layer (120) of the plurality of redistribution layers (120, 125, 130) comprises a ground plane for the one or more planar antenna elements (140), wherein forming the one or more planar antenna elements (140), the one or more conductive vias (135, 155), the plurality of redistribution layers (120, 125, 130), or a combination thereof, comprises forming a dispersion path (145) that directly couples a first planar antenna element (140) of the one or more planar antenna elements to the ground plane (120), and wherein the dispersion path (145) has an RF impedance at the operating wavelength that is substantially greater than respective RF impedances of the one or more planar antenna elements (140) and the one or more RF paths ( 165).

14. The method of claim 13, wherein the dispersion path has an effective transmission line length (170) that is one quarter of the operating wavelength.

15. The method of any one of claims 13 and 14, wherein the dispersion path (145) comprises a resistive material.

16. The antenna of any one of claims 13 through 15, wherein: the one or more planar antenna elements (140) are formed from a first conductive material, and the dispersion path (145) is at least partially formed from the first conductive material the first side of the substrate (110) and is coupled to the ground plane (120) through one of the one or more conductive vias (135, 155).

17. The antenna of any one of claims 13 through 16, wherein the dispersion path (145) is at least partially formed in a second redistribution layer (125) of the plurality of redistribution layers (120, 125, 130).

18. The antenna of claim 17, wherein the dispersion path (145) is coupled to the ground plane via a third redistribution layer (130), of the plurality of redistribution layers (120, 125, 130).

19. The method of any one of claims 13 through 18, wherein forming each of the plurality of redistribution layers (120, 125, 130) comprises: depositing a conductive material via a chemical vapor deposition process; applying a photoresist material to the conductive material; applying a photoresist mask to the photoresist material to protect first portions of the photoresist material; exposing unprotected second portions of the photoresist material; and etching portions of the conductive material corresponding to the unprotected second portions of the photoresist material.

20. The method of any one of claims 13 through 19, wherein forming each of the passivation layers (115) comprises: depositing a dielectric material; applying a photoresist material to the dielectric material; applying a photoresist mask to the photoresist material to protect first portions of the photoresist material; exposing unprotected second portions of the photoresist material; and removing portions of the dielectric material corresponding to the unprotected second portions of the photoresist material.

21. The method of claim 20, wherein the unprotected second portions of the photoresist material correspond with locations of one or more vias (135, 155) through the dielectric material.

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