Microcircuit board

Abstract

The invention relates to a microcircuit board comprising a stack of layers in the following order: - a first protective layer; - a first core layer; - a support layer suitable for supporting a microcircuit and / or a microcircuit antenna; - a second core layer; - a second protective layer; wherein each of the first and second core layers and the inlay layer comprise: - between 40% and 60%, preferably between 40% and 55%, by weight of polylactic acid (PLA); - between 35% and 55%, preferably between 35% and 50%, by weight of poly(butyl succinate) (PBS); - between 2% and 10% of mineral fillers based on calcium carbonate, on hydrated alkali and / or alkaline earth silicates, and / or on hydrated alkali and / or alkaline earth aluminosilicates.

Description

[0001] Description

[0002] Title of the invention: Microcircuit card

[0003] Technical field

[0004] The present invention relates to a microcircuit card and its manufacturing method.

[0005] Technical background

[0006] Microcircuit cards, also commonly referred to as "chip cards" or "smart cards," are used for many applications. Examples include bank cards, telephone cards, loyalty cards, contactless access control cards, and contactless unlocking cards such as road vehicle unlocking cards.

[0007] Microcircuit cards generally consist of an assembly of a plurality of layers of thermoplastic and / or metal material between which an integrated microcircuit is incorporated. The integrated microcircuit comprises a random access or volatile memory, a rewritable non-volatile memory, a microprocessor and possibly a secure element. The secure element itself comprises a microprocessor, a volatile memory and a rewritable non-volatile memory which contains computer program instructions executable by said microprocessor.

[0008] US 4,105,156 A [DETHLOFF JUERGEN] 08.08.1978 describes, for example, a microcircuit card in which the integrated microcircuit is arranged between the constituent layers of a layer assembly and is connected to a connector which is flush with the surface of the card. The connector allows, via a suitable card reader, the microcircuit to be electrically powered and data to be exchanged. The integrated microcircuit comprises a microprocessor, a non-volatile memory in which a microprocessor control program is stored, non-rewritable non-volatile memory units in which authentication information - such as the PIN code -, identification information - such as the cardholder's name -, a bank account number, and information relating to the use of the card - such as the validity period or the maximum number of incorrect attempts for entering the PIN code are securely stored.

[0009] The thermoplastic and / or metallic layers are commonly assembled by a lamination process in which they are welded together, possibly using intermediate adhesive layers. Microcircuit cards consist of one or more layers called "core layers", sandwiched between two layers called "protective layers". Intermediate layers of different structures and / or functions may also be sandwiched between the core layers and / or between the core layers and the protective layers. For example, it is common to insert a support or inlay layer between two core layers. The surfaces of the different layers may be provided with printed symbols, marks and / or decorations, often visible through transparency.

[0010] The layer assembly usually includes a notch or cavity into which the integrated microcircuit is inserted for incorporation into the card. The support layer generally serves as a support for the microcircuit, especially when it is in the form of a repeater, or "transponder" in English. An antenna connected to the microcircuit can also be inserted between the layers.

[0011] DE 2 838 795 A1 [HOECHST AG] 20.03.1980 describes, for example, a card consisting of two or three core layers of matt polyamide (PA) or polyvinyl chloride (PVC), welded together, and sandwiched between two transparent protective layers. The outer surface, i.e. the surface facing the external environment, of one of the core layers is provided with symbols, marks and / or decorations forming information, such as the name of the cardholder, or a logo. This information can be deciphered from the outside by transparency through the protective layers. One of the core layers has a security mark on its surface.

[0012] DE 2 856 833 A1 [HOECHST AG] 17.07.1980 describes a similar card in which a perforated mechanically reinforcing layer of paper, polyester or fabric is sandwiched between two core layers. The perforated mechanically reinforcing layer is permeable to the fusible material of both core layers.

[0013] DE 19 629 335 A1 [GOLDEN RECORDS ASS INTERNATION [DE]] 22.01.1998 describes a card consisting of a core layer of polyvinyl chloride (PVC), polycarbonate (PC) or acrylonitrile butadiene styrene (ABS) on both surfaces of which is deposited an iron-chromium alloy layer with a thickness of 0.02 pm to 0.3 pm. This assembly is itself intercalated between two layers of noble metals, such as gold, platinum, palladium, silver or titanium with a thickness of 0.2 pm to 0.3 pm, then between two transparent protective layers.

[0014] WO 2005 / 004048 A1 [SAGEM DEFENSE SECURITE [FR]] 13.01.2005 describes a card comprising an assembly consisting of a core layer of polyethylene terephthalate (PET), two printed layers of polyvinyl chloride (PVC) arranged on either side of the core layer, and two protective layers of polyethylene terephthalate (PET). The card comprises connection zones, produced by welding, whose function is to secure the first two layers of the card starting from the outside.

[0015] WO 2006 / 022695 A1 [OBERTHUR CARD SYST SA [FR]] 02.03.2006 describes a microcircuit card consisting of an assembly of a plurality of layers providing aesthetic and / or functional characteristics. The assembly comprises a support layer sandwiched between two core layers, then between two protective layers. The support layer may consist of a polymer substrate made of polyethylene terephthalate (PET), polycarbonate (PC), polyvinyl chloride (PVC), sandwiched between two flexible polymer layers made of polyester (PE), polyester glycol (PET-G) or polyvinyl chloride (PVC). On one of the surfaces of the substrate is deposited a layer based on metal - for example aluminum or tin -, or based on oxide, nitride, oxynitride, oxyboride or metal carbide.

[0016] For environmental and ecological reasons, it is now common practice to replace conventional, non-biodegradable, non-recyclable, and / or petrochemical industry materials, which make up certain layers of current cards, with eco-materials, in particular with polylactic acid-based resins.

[0017] WO 2008 / 129833A1 [MITSUBISHI PLASTICS INC [JP]] 30.10.2008 describes a microcircuit card comprising one or more core layers based on polylactic acid resin and protective layers based on aromatic polyester resin and / or polycarbonate. Between the core layers is interposed a support layer, called "inlay" or "inlet" in English, serving as a support for a microcircuit. It can be made of polyethylene terephthalate (PET), polycarbonate (PC), polyvinyl chloride (PVC) or polylactic acid (PLA). The different layers are assembled together in an adhesive manner with a resin based on Poly(butyl succinate) (PBS).

[0018] JP 2009169577 A [TORAY INDUSTRIES] 30.07.2009 describes a film suitable for use as a component layer of a microcircuit card. The film comprises 95 to 80% by weight of polylactic acid (PLA) and 5% to 20% by weight of an aliphatic polyester, such as poly(butyl succinate) (PBS) or poly(butyl succinate-co-adipate) (PBSA). The addition of aliphatic polyester increases the mechanical strength of the polylactic acid.

[0019] WO 2013 / 100278 A1 [OSEUNG ES CO LTD [KR]] 04.07.2013 describes a microcircuit board comprising a core layer used as a support for a microcircuit, two protective layers arranged on either side of the core layer, and two printed layers. The three types of layers are made of a material comprising 60% to 80% by weight of polylactic acid (PLA) and between 10% and 30% by weight of poly(butyl succinate) (PBS). The poly(butyl succinate) (PBS) acts as a mechanical reinforcement for the polylactic acid (PLA) by increasing its mechanical strength. DE 10 2019 121 912 A1 [NOVO ORGAN ISATIONSMITTEL GMBH [DE]] 18.02.2021 describes a card comprising a repeater, "transponder" in English, disposed between two core layers. The core layers are made of a material comprising 16.7% to 50% by weight of polylactic acid (PLA) and 50% to 83.3% by weight of poly(butyl succinate) (PBS).The material may further comprise lignin, starch or cellulose, in particular between 2% and 5% by weight of lignin.

[0020] CN 216659 203 U [DONGGUAN COTIAN SMART CARD SCIENCE AND TECH LIMITED COMPANY] 03.06.2022 discloses a card comprising a core layer and a protective layer. The core layer may be polyhydroxyalkanoate (PHA), poly(3-alkyl butyrate), ethylene methylene polycarbonate, poly(butyl succinate) (PBS), polycaprolactone (PCL), poly(terephthalate-co-butyl adipate), polyethylene glycol (PEG) or acrylate. The protective layer is based on a mixture of polylactic acid (PLA) and poly(butyl succinate) (PBS).

[0021] CN 115 257 097 A [FANLITE INTELLIGENT TECH SUZHOU CO LTD] 01.11.2022 describes a board comprising a microcircuit sandwiched between two core layers based on a mixture of polyethylene (PE), polylactic acid and poly(butyl succinate) (PBS). The core layers are covered with a printing layer comprising 10% to 15% by weight of polylactic acid (PLA) and 4% to 8% by weight of poly(butyl succinate) (PBS).

[0022] Summary of the invention

[0023] Technical problem

[0024] To be used in the various applications for which they are intended, microcircuit cards must meet certain requirements in terms of mechanical resistance to bending and delamination. These requirements are generally not met for microcircuit cards in which the conventional materials of some of their core and / or protective layers are replaced by resins essentially composed of polylactic acid. This is one of the reasons why these cards continue to incorporate, as mechanical reinforcements, layers based on conventional materials, i.e. non-biodegradable, non-recyclable, and / or derived from the petrochemical industry.

[0025] Blends of polylactic acid (PLA) and poly(butyl succinate) (PBS) used in certain core and / or protective layers of current cards improve their mechanical performance.

[0026] However, these boards still fail to meet chemical and thermal durability requirements. They generally require retaining core and / or protective layers made of conventional materials to provide them with all the mechanical, thermal and chemical properties necessary for their use in the market.

[0027] There is therefore a need for a microcircuit card whose constituent layers, in particular the core and support layers, are entirely made of eco-materials, and meet the requirements in terms of mechanical performance and chemical and thermal durability. Ideally, such a card allows the use of biodegradable, recyclable, and / or non-petrochemical industry materials, or conventional materials from recycling channels, for all of its layers, in particular the protective and decorative layers.

[0028] Technical solution

[0029] According to a first aspect of the invention, there is provided a microcircuit card comprising a stack of layers in the following order: a first protective layer; a first core layer;

[0030] - a support layer adapted to support a microcircuit and / or a microcircuit antenna; a second core layer; a second protective layer; wherein each of the first and second core layers and the support layer comprises:

[0031] - between 40% and 60%, preferably between 40% and 55%, by weight of polylactic acid (PLA); - between 35% and 55%, preferably between 35% and 50%, by weight of poly(butyl succinate) (PBS);

[0032] - between 2% and 10% of mineral fillers based on calcium carbonate, hydrated alkali metal silicates and / or hydrated alkaline earth metals, and / or hydrated alkali metal aluminosilicates and / or hydrated alkaline earth metals.

[0033] Advantageous embodiments are described below.

[0034] According to a second aspect of the invention, there is provided a method of manufacturing a microcircuit card according to a first aspect of the invention.

[0035] According to a third aspect of the invention, there is provided a use of a microcircuit card as a single interface or dual interface microcircuit card.

[0036] Brief description of the drawings

[0037] Figure 1 is a schematic perspective representation of a first example of a microcircuit card.

[0038] Figure 2 is a schematic representation of a section along plane A of the map in Figure 1.

[0039] Figure 3 is a schematic representation of a second example microcircuit card.

[0040] Figure 4 is a schematic representation of a section along plane B of the map in Figure 2.

[0041] Detailed description of the embodiments

[0042] Referring to Figure 1 and Figure 2, a microcircuit board 1000 generally comprises a microcircuit 1001 and a stack 1002 of layers between which the microcircuit 1001 is interposed. The stack 1002 of layers comprises a first protective layer 1002a, a first core layer 1002b, a support layer 1003c, a second core layer 1002d and a second protective layer 1002e.

[0043] The thickness of the layers of the stack 1002 is generally between 30 pm and 350 pm. In particular, the thickness of the support layer 1002c is between 240 pm and 310 pm, the thickness of the first and second core layers is between 200 pm and 230 pm and the thickness of the first and second protective layers is between 50 pm and 80 pm.

[0044] In Figure 1, the support layer 1002c is adapted to support an antenna 1003. The microcircuit 1001 is supported by the first core layer 1002b and is connected to a connector 1004 flush with the surface of the first protection layer 1002a. The card 1000 can interact with or without contact with a card reading device (not shown). In Figure 2, the microcircuit 1001 and the antenna 1003 are supported by the support layer 1002c. The card 1000 is devoid of a connector and can interact only without contact with a microcircuit card reading device.

[0045] According to a first aspect of the invention, there is provided a microcircuit card 1000 comprising a stack 1002 of layers in the following order: a first protection layer 1002a; a first core layer 1002b;

[0046] - a support layer 1002c adapted to support a microcircuit 1001 and / or a microcircuit antenna 1003; a second core layer 1002d; a second protection layer 1002e; wherein each of the first and second core layers 1002b, 1002d and the support layer 1002c comprise:

[0047] - between 40% and 60%, preferably between 40% and 55%, by weight of polylactic acid (PLA);

[0048] - between 35% and 55%, preferably between 35% and 50%, by weight of poly(butyl succinate) (PBS);

[0049] - between 2% and 10% of mineral fillers based on calcium carbonate, hydrated alkali metal silicates and / or hydrated alkaline earth metals, and / or hydrated alkali metal aluminosilicates and / or hydrated alkaline earth metals.

[0050] Surprisingly, a synergy was found between, on the one hand, the constituents of the layers in the indicated proportions, and, on the other hand, the core layers 1002b, 1002d and the support layer 1002c comprising its constituents in said proportions. This synergy gives a card according to the first aspect of the invention the mechanical performance and chemical and thermal durability required for all common applications of microcircuit cards, in particular as bank cards, telephone cards, commercial loyalty cards, contactless access control cards or even contactless unlocking cards such as those used for unlocking road vehicles.

[0051] A direct advantage is that a card according to the first aspect of the invention makes it possible to dispense with any use, for the constitution of the other layers, of conventional materials as mechanical, thermal and chemical reinforcements. Thus, it is possible to use, for these other layers, only biodegradable, recyclable materials, and / or materials not derived from the petrochemical industry, or even conventional materials from recycling channels.

[0052] In the context of the present invention, polylactic acid (PLA) is understood to mean the thermoplastic aliphatic homopolymer resulting mainly from the polymerization of the monomer (C3H4O2)x, as well as its derivatives.

[0053] In the context of the present invention, poly(butyl succinate) (PBS) is understood to mean the thermoplastic aliphatic polyester derived mainly from the polymerization of the monomer (CsHi2O4)n as well as its derivatives.

[0054] In this respect, in an advantageous embodiment, the first protective layer 1002a is based on polylactic acid (PLA), recycled polyvinyl chloride (PVC), or a mixture of polylactic acid (PLA) and poly(butyl succinate) (PBS), and the second protective layer 1002e is based on polylactic acid (PLA), recycled polyvinyl chloride (PVC), or a mixture of polylactic acid (PLA) and poly(butyl succinate) (PBS).

[0055] In a preferred embodiment, each of the first and second core layers 1002b, 1002d and the support layer 1002c comprise 35% to 45% by weight of poly(butyl succinate) (PBS). It is found that when one or more of the core layers 1002b, 1002d and the support layer 1002c has an amount of PBS in this particular range, the mechanical and chemical and thermal durability performance was most optimal.

[0056] In embodiments, the mineral fillers are hydrated alkali metal and / or alkaline earth metal silicates, in particular phylosillicates chosen from talc, smectite and / or kaolinite. In a particularly preferred embodiment, the mineral fillers are based on talc.

[0057] In embodiments, the size of the mineral fillers is less than 200 pm, preferably less than or equal to 160 pm. By size of the fillers is meant the average size, in particular the D50 of the particle size distribution of said fillers. It has been found that a mineral particle size beyond 200 pm can be detrimental to the mechanical strength of the card as well as to the implementation of the layers during its manufacture, in particular during lamination of the layers.

[0058] In embodiments, one or more layers among first and second core layers 1002b, 1002c and support layer 1002c further comprise between 1% and 10% of organic fillers based on cellulose and / or hemicellulose. The size of the organic fillers is generally less than or equal to 200 pm, preferably between 50 pm and 150 pm. In preferred embodiments, the organic fillers are compounds derived from agricultural and / or recycling sectors. In preferred embodiments, the organic fillers based on cellulose and / or hemicellulose are chosen from hemp and cork.

[0059] In advantageous embodiments, the sum of the proportions of mineral fillers and organic fillers is between 4% and 10% by weight. It has been found that a quantity of mineral and organic fillers beyond 10% can be detrimental to the mechanical strength of the card as well as to the implementation of the layers during its manufacture, in particular during lamination of the layers. Furthermore, beyond 10%, there does not appear to be any significant gain in terms of the mechanical performance of the card.

[0060] A card according to the first aspect of the invention is not limited to the layers of the stack described above. In embodiments, the stack 1002 may comprise one or more adhesive and / or decorative layers arranged between the core layers and the protective layers. The thickness of this type of layer is generally between 1 μm and 3 μm.

[0061] In embodiments, the core layers 1002b, 1002d and the support layer 1002c may further comprise colorants as well as adjuvants and additives such as plasticizers and anti-ultraviolet additives. The anti-ultraviolet additives are particularly advantageous for the durability of the colored pigments when said layers contain them and / or the card according to the invention further comprises in its stack 1002 of layers colored decorative layers.

[0062] In particularly advantageous and preferred embodiments, the surfaces of one or more core layers 1002b, 1002d and / or protective layers 1002a, 1002e are provided with free radicals and / or an adhesive layer based on polyvinyl chloride, silicone, acrylic resin and / or polyvinyl acetate. In particular, the adhesive layer may be formed from a polyester substrate and an acrylic resin.

[0063] The addition of adhesive layers, and preferably the formation of free radicals on the surface of one or more core layers 1002b, 1002d and / or protective layers 1002a, 1002e make it possible to advantageously improve the adhesion between the layers.

[0064] The thicknesses of the adhesive layers are adapted, on the one hand, to the nature of said adhesive layers and, on the other hand, to the nature and thickness of the core layers 1002b, 1002d and / or the protective layers 1002a, 1002e.

[0065] Examples of methods for forming free radicals are atmospheric pressure plasma, corona plasma or flame plasma treatment methods. The power and duration of the treatments depend on the nature and thickness of the core layers 1002b, 1002d and / or the protective layers 1002a, 1002e.

[0066] According to a second aspect of the invention, there is provided a method of manufacturing a microcircuit card 1000 according to the first aspect. The method comprises:

[0067] (a) providing: a first protective layer 1002a; a first core layer 1002b;

[0068] - a support layer 1002c adapted to support a microcircuit and / or a microcircuit antenna; a second core layer 1002d; a second protection layer 1002e; wherein each of the first and second core layers 1002b, 1002d and the support layer 1002c comprise:

[0069] - between 40% and 60%, preferably between 40% and 55%, by weight of polylactic acid (PLA);

[0070] - between 35% and 55%, preferably between 35% and 50%, by weight of poly(butyl succinate) (PBS);

[0071] - between 2% and 10% of mineral fillers based on calcium carbonate, hydrated alkali metal silicates and / or hydrated alkaline earth metals, and / or hydrated alkali metal aluminosilicates and / or hydrated alkaline earth metals

[0072] (b) the formation of free radicals on the surfaces of one or more core and / or protective layers;

[0073] (c) rolling of the layers.

[0074] All the embodiments of a microcircuit card according to the first aspect of the invention described previously are applicable to the method according to the second aspect of the invention.

[0075] In advantageous embodiments, the free radicals are formed by an atmospheric pressure plasma, corona plasma or flame plasma treatment method. In alternative or complementary embodiments, the method further comprises, before step (c), a step of applying an adhesive layer formed from a polyester substrate and an acrylic resin between the core layers and the protective layers. According to a third aspect of the invention, a card according to the first aspect of the invention can be advantageously used as a single-interface or dual-interface microcircuit card. By single-interface card is meant a microcircuit card operating only contactless or only with contact with a microcircuit card reading device.A dual interface card is a microcircuit card that operates both contact and contactless with a microcircuit card reading device.

[0076] Example

[0077] An example of a microcircuit card according to the invention is described in Table 1. The composition A of the protective and core layers is described in Table 2. The contents are expressed in weight percentages.

[0078] Table 1 Table 2

[0079] In the present example, the first and second protective layers 100a, 1002d are made of recycled polyvinyl chloride (PVC). The support layer 1002c and the two core layers 1002b, 1002d are made of a mixture of 50% polylactic acid (PLA), 45% poly(butyl succinate) (PB S) and 5% mineral fillers based on calcium carbonate from pulverized oyster shells. The average size of the fillers is 50 μm.

[0080] The card further comprises, between the core layers 1002b, 1002d and the protective layers 1002a, 1002e, an adhesive layer based on polyvinyl chloride, silicone, acrylic resin or polyvinyl acetate, with a thickness of between 1 pm and 3 pm.

[0081] The bending strength and tear strength of the card according to the example were evaluated according to sections 5.3 and 5.8 of ISO 10373-1- Identification cards — Test methods, 2006. The card is still functional after 4000 bending cycles. The tear strength between the core layers and the protective layers is greater than 10.5 Nm. The interface between the core layers and the carrier layer showed no signs of tearing according to the test of the said standard.

[0082] The card's resistance to temperature and humidity has been evaluated according to section 5.7 of ISO 24789-2 - Identification cards - Card service life - Part 2: Methods of evaluation, 2011. The card is still functional after 7 days of exposure. The card's resistance to point pressure has been evaluated according to the Mastercard® Card Quality Management program protocol version 2.19, 2020. It is measured at 80N.

[0083] References

[0084] Patent Literature

[0085] US 4 105 156 A [DETHLOFF JUERGEN] 08.08.1978.

[0086] DE 2 838 795 A1 [HOECHST AG] 20.03.1980.

[0087] DE 2 856 833 A1 [HOECHST AG] 17.07.1980.

[0088] OF 19 629 335 A1 [GOLDEN RECORDS ASS INTERNATION [DE]] 22.01.1998.

[0089] WO 2005 / 004048 A1 [SAGEM DEFENSE SECURITY [FR]] 13.01.2005.

[0090] WO 2006 / 022695 A1 [OBERTHUR CARD SYST SA [FR]] 02.03.2006.

[0091] WO 2008 / 129833A1 [MITSUBISHI PLASTICS INC [JP]] 30.10.2008.

[0092] JP 2009169577 A [TORAY INDUSTRIES] 7 / 30 / 2009

[0093] WO 2013 / 100278 A1 [OSEUNG ES CO LTD [KR]] 04.07.2013

[0094] OF 10 2019 121 912 A1 [NEW ORGANIZATIONSMITTEL GMBH [OF]] 18.02.2021.

[0095] CN 216659 203 U [DONGGUAN COTIAN SMART CARD SCIENCE AND TECH LIMITED COMPANY] 03.06.2022.

[0096] CN 115 257 097 A [FANLITE INTELLIGENT TECH SUZHOU CO LTD] 01.11.2022.

[0097] Littérature non-brevet

[0098] ISO 10373-1 - Identification cards — Test methods, 2006.

[0099] ISO 24789-2 - Identification cards - Card service life -Part 2: Methods of evaluation, 2011.

[0100] Mastercard®, COM Requirements, version 2.19, 2020.

Claims

Claims 1. Microcircuit card (1000) comprising a stack 1002 of layers in the following order: - a first protective layer (1002a); - a first layer (1002b) of core; - a support layer (1002c) adapted to support a microcircuit (1001) and / or a microcircuit antenna (1003); - a second layer (1002d) of core; - a second protective layer (1002e); wherein each of the first and second core layers (1002b, 1002d) and the support layer (1002c) comprise: - between 40% and 60%, preferably between 40% and 55%, by weight of polylactic acid (PLA); - between 35% and 55%, preferably between 35% and 50%, by weight of poly(butyl succinate) (PBS); - between 2% and 10% of mineral fillers based on calcium carbonate, hydrated alkali metal silicates and / or hydrated alkaline earth metals, and / or hydrated alkali metal aluminosilicates and / or hydrated alkaline earth metals.

2. The microcircuit card (1000) of claim 1, wherein each of the first and second core layers (1002b, 1002d) and the support layer comprises 35% to 45% by weight of poly(butyl succinate) (PBS).

3. Microcircuit card (1000) according to any one of claims 1 to 2, such that the first protective layer (1002a) is based on polylactic acid (PLA), recycled polyvinyl chloride (PVC), or a mixture of polylactic acid (PLA) and poly(butyl succinate) (PBS), and the second protective layer (1002e) is based on polylactic acid (PLA), recycled polyvinyl chloride (PVC), or a mixture of polylactic acid (PLA) and poly(butyl succinate) (PBS).

4. Microcircuit card (1000) according to any one of claims 1 to 3, such that the hydrated alkali metal and / or alkaline earth metal silicates are phylosillicates chosen from talc, smectite and / or kaolinite.

5. Microcircuit card (1000) according to any one of claims 1 to 4, such that the size of the mineral charges is less than 200 pm, preferably less than or equal to 160 pm.

6. A microcircuit card (1000) according to any one of claims 1 to 5, such that one or more of the first and second core layers (1002b, 1002d) and the support layer (1002c) further comprise between 1% and 10% of organic fillers based on cellulose and / or hemicellulose.

7. Microcircuit card (1000) according to claim 6, such that the size of the organic charges is less than or equal to 200 pm, preferably between 50 pm and 150 pm.

8. Microcircuit card (1000) according to any one of claims 6 to 7, such that the organic fillers based on cellulose and / or hemicellulose are chosen from hemp and cork.

9. Microcircuit card (1000) according to any one of claims 5 to 8, such that the sum of the proportions of mineral fillers and organic fillers is between 4% and 10% by weight.

10. Microcircuit card (1000) according to any one of claims 1 to 9, such that the stack comprises one or more adhesive and / or decorative layers arranged between the core layers and the protective layers.

11. Microcircuit card (1000) according to any one of claims 1 to 10, such that the surfaces of one or more core layers (1002b, 1002d) and / or protective layers (1002a, 1002e) are provided with free radicals and / or an adhesive layer based on polyvinyl chloride, silicone, acrylic resin and / or polyvinyl acetate.

12. Method for manufacturing a microcircuit card (1000), the method comprises: (a) the supply of: - a first protective layer (1002a); - a first layer (1002b) of core; - a support layer (1002c) adapted to support a microcircuit and / or a microcircuit antenna; - a second layer (1002d) of core; - a second layer (1002 e ) protection; wherein each of the first and second core layers (1002b, 1002d) and the support layer (1002c) comprise: - between 40% and 60%, preferably between 40% and 55%, by weight of polylactic acid (PLA); - between 35% and 55%, preferably between 35% and 50%, by weight of poly(butyl succinate) (PBS); - between 2% and 10% of mineral fillers based on calcium carbonate, hydrated alkali metal silicates and / or hydrated alkaline earth metals, and / or hydrated alkali metal aluminosilicates and / or hydrated alkaline earth metals (b) the formation of free radicals on the surfaces of one or more core and / or protective layers; (c) rolling of the layers.

13. A manufacturing method according to claim 12, such that the free radicals are formed by an atmospheric pressure plasma, corona plasma or flame plasma treatment method.

14. Manufacturing method according to any one of claims 12 to 13, such that it further comprises, before step (c), a step of applying an adhesive layer formed from a polyester substrate and an acrylic resin between the core layers and the protective layers.

15. Use of a microcircuit card (1000) according to any one of claims 1 to 11 as a single interface or dual interface card.

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