Board additives for heat transfer and methods of manufacture

Abstract

Boards, additives, methods for manufacturing, and / or the like are provided. In some embodiments, a board may include a facer; a densified layer; a core, wherein the facer is disposed above the densified layer, and wherein the densified layer is disposed above the core; and one or more additives disposed within one or more of the densified layer or the core, wherein the one or more additives are configured to control heat transfer and / or thermal mitigation between the board and one or more applied materials. In some embodiments, the one or more additives may include Kaolin Clay disposed within the core. In some embodiments, the one or more applied materials are asphalt.

Description

BOARD ADDITIVES FOR HEAT TRANSFER AND METHODS OF MANUFACTURECROSS-REFERENCE TO RELATED APPLICATIONS

[0001] . The present disclosure claims priority to and the benefit of U.S. Provisional Patent Application Serial No. 63 / 529,382, filed July 28, 2023; the contents of which as are hereby incorporated by reference herein in their entirety.TECHNICAL FIELD

[0002] . The present disclosure relates generally to cover board manufacturing. In particular, it relates to introducing additives during board manufacturing to mitigate heat impact between manufactured cover board and hot surfaces / materials (e.g., asphalt).BACKGROUND

[0003] . Certain applied materials (e.g., melted coatings) for board materials (e.g., gypsum cover board) may be “hot” materials (e.g., hot asphalt) that cause high amounts of heat transfer from the applied materials to the board material. This heat transfer may negatively affect the integrity of the board materials. For example, this heat transfer may interact with water or moisture within the board and cause a release of that water vapor, leading to frothing and / or blistering on the surface or face of the board. In particular, when the board materials are gypsum panels, they may have relatively high-water absorption rates, even with hydrophobic coated glass mat as facers, leading to increased frothing and / or blistering.

[0004] . Through applied effort, ingenuity, and innovation, Applicant has solved problems relating to hot applied materials of board materials by developing solutions embodied in the present disclosure, which are described in detail below.SUMMARY

[0005] . In general, embodiments of the present disclosure provide boards, additives, methods for manufacturing, and / or the like.

[0006] . In accordance with various embodiments, there is provided a board including: a facer; a densified layer; a core, wherein the facer is disposed above the densified layer, and wherein the densified layer is disposed above the core; and one or more additives disposed within one or moreof the densified layer or the core, wherein the one or more additives are configured to control heat transfer between the board and one or more applied materials.

[0007] . In some embodiments, the one or more additives are configured to dissipate heat transferred from the one or more applied materials to the board.

[0008] . In some embodiments, the one or more additives are configured to absorb heat transferred from the one or more applied materials to the board.

[0009] . In some embodiments, the one or more applied materials include one or more types of asphalt.

[0010] . In some embodiments, the one or more additives include Kaolin Clay disposed within the core.

[0011] . In some embodiments, the one or more additives include solid insulators that are one or more of wax, clay, and polymeric beads.

[0012] . In some embodiments, the solid insulators include inorganic materials that are one or more of silica, quartz, aluminum silicates, and zeolites.

[0013] . In some embodiments, the solid insulators include organic material or emulsions that are one or more of PET, SBS, acrylates, wax, and latex.

[0014] . In some embodiments, the one or more emulsions are closed cell insulators.

[0015] . In some embodiments, the one or more additives are one or more open cell materials including clay or foam.

[0016] . In some embodiments, the one or more additives is a water-resistant additive.

[0017] . In some embodiments, the board further includes glass mat and one or more voids disposed beneath the glass mat and configured to act as heat sinks.

[0018] . In some embodiments, the board further includes a thermal energy absorbing product disposed above the core and configured to control heat transfer between the board and the one or more applied materials.

[0019] . In some embodiments, the one or more additives of the board include one or more of the Kaolin Clay, the wax, the clay, the polymeric beads, the silica, the quartz, the aluminum silicates, the zeolites, the PET, the SBS, the acrylates, the wax emulsions, the latex, the closed cell insulators, the clay, the foam, and the water-resistant additive.

[0020] . In some embodiments, the one or more additives are distributed in one or more locations on the board.

[0021] . According to various embodiments, there is provided a method for manufacturing a board, the method including forming, via a mixer, a slurry material comprising calcium sulfate hemihydrate and water; incorporating one or more additives into the slurry material to form a modified slurry; and setting the modified slurry such that the modified slurry hardens and is configured to be dimensioned.

[0022] . In some embodiments, the method further includes creating one or more voids within the slurry material such that the modified slurry material comprises the one or more voids.

[0023] . In some embodiments, the one or more additives are Kaolin Clay.

[0024] . In some embodiments, the one or more additives are solid insulators selected from one or more of wax, clay, and polymeric beads.

[0025] . In some embodiments, the solid insulators are inorganic materials selected from one or more of clay, silica, quartz, aluminum silicates, and zeolites.

[0026] . In some embodiments, the solid insulators are organic material or liquid emulsions selected from one or more of PET, SBS, acrylates, wax emulsions, and latex.

[0027] . In some embodiments, the one or more additives include closed cell insulators.

[0028] . The method of claim 16, wherein the one or more additives comprise open cell materials comprising clay or foam.

[0029] . The method of claims 17-23, wherein the one or more additives of the board comprises one or more of the Kaolin Clay, the wax, the wax emulsions, the clay, the polymeric beads, the silica, the quartz, the aluminum silicates, the zeolites, the closed cell insulators, the clay, and the foam.

[0030] . The method of claim 24, wherein the one or more additives are distributed in one or more locations on the board.

[0031] . The above summary is provided merely for purposes of summarizing some example embodiments to provide a basic understanding of some embodiments of the disclosure. Accordingly, it will be appreciated that the above-described embodiments are merely examples. It will be appreciated that the scope of the disclosure encompasses many potential embodiments in addition to those here summarized, some of which will be further described below.BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWING(S)

[0032] . Having thus described the disclosure in general terms, reference will now be made to the accompanying drawings, which are not necessarily drawn to scale.

[0033] . FIG. 1A is a representative view of incorporating additives into board material in accordance with various embodiments of the present disclosure.

[0034] . FIG. IB is a representative view of incorporating additives into board material in accordance with various embodiments of the present disclosure.

[0035] . FIG. 1C is a representative view of incorporating additives into board material in accordance with various embodiments of the present disclosure.

[0036] . FIG. 2A is a side, cross-sectional view of a board with additives in accordance with various embodiments of the present disclosure.

[0037] . FIG. 2B is a side, cross-sectional view of a control board in accordance with various embodiments of the present disclosure.

[0038] . FIG. 2C is a side, cross-sectional view of a board with additives in accordance with various embodiments of the present disclosure.

[0039] . FIG. 3A is a side, cross-sectional view of a control board in accordance with various embodiments of the present disclosure.

[0040] . FIG. 3B is a side, cross-sectional view of a board with additives in accordance with various embodiments of the present disclosure.

[0041] . FIG. 3C is a side, cross-sectional view of a board with additives in accordance with various embodiments of the present disclosure.

[0042] . FIG. 4 is a flow chart of an example flow chart in accordance with various embodiments of the present disclosure.DETAILED DESCRIPTION OF SOME EXAMPLE EMBODIMENTS

[0043] . Various embodiments of the present disclosure now will be described more fully hereinafter with reference to the accompanying drawings, in which some, but not all embodiments of the disclosure are shown. Indeed, this disclosure may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will satisfy applicable legal requirements. The term “or” (also designated as “ / ”) is used herein in both the alternative and conjunctive sense, unless otherwiseindicated. The terms “illustrative” and “exemplary” are used to be examples with no indication of quality level. Like numbers may refer to like elements throughout. The phrases “in one embodiment,” “according to one embodiment,” and / or the like generally mean that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure and may be included in more than one embodiment of the present disclosure (importantly, such phrases do not necessarily may refer to the same embodiment).Example Board Additives

[0044] . FIG. 1A shows a representative view of incorporating an example additive 100 into board material 102, according to various embodiment. In some embodiments, the board materials 102 may interact with a hot applied material 103 (e.g., asphalt). In some embodiments, the board material 102 may be part of the board core or the densified layer on top of the board core, as will be described later in this disclosure. In some embodiments, the additive 100 may be incorporated into the board material 102 to, among other things, control heat transfer and / or thermal mitigation between the hot applied material 103 and the board material 102.

[0045] . In some embodiments, the additive 100 may be added to one or more layers of the board during manufacturing. In some embodiments, the board material 102 may be used to form a gypsum board or similar coverboard material for use in roofing applications. In some embodiments, the board formed by the board material 102 may receive a hot-applied coating 103 (e.g., a melted coating, such as asphalt). It will be understood that the curved arrows that appear throughout the several drawings are intended to denote a direction of heat transfer; that is, heat is being transferred in the direction of the curved arrows. For example, in FIG. 1A, heat is being transferred from the hot applied material 103 to the board material 102.

[0046] . According to various embodiments, different types of additive 100 may be used during manufacturing. The selection of a particular additive 100 may depend on a variety of factors, including (but not limited to) board application (e.g., coverboard for roofs), conditions at the locations where board will be installed (e.g., temperature, moisture, atmospheric pressure), available materials, and / or cost. Throughout this disclosure, “additive 100” will be understood to refer generally to an example additive that may be added to board material, with specific additives denoted according to the figures that show views of example additives 100A, 100B, etc.

[0047] . In some embodiments, it may be preferable to use an organic material (e.g., wax) as an additive 100, while in some embodiments it may be preferable to use inorganic material (e.g., Kaolin Clay) as an additive 100. In some embodiments, the additive 100 may be a liquid, solid powder, an intentional void created within the board material 102, and / or thermal energy absorbing product (e.g., scrim). In some embodiments, the additive 100 may reduce / mitigate heat transfer between a hot applied material 103 and the board material 102. For example, the additive 100 may reduce frothing and / or blistering when the hot applied material 103 is applied to the board material 102.

[0048] . Shown in at least FIG. IB, as at least one example of an additive 100, is a representative view of the additive 100A incorporated into board material 102, according to various embodiments. As shown in at least FIG. IB by the arrows, the additive 100A may aid in reducing heat contact between board material 102 and various hot applied materials (e.g., asphalt). In some embodiments, the additive 100A may be Kaolin clay. In some embodiments, the additive 100A may be micron and nanopores, which may allow the heat transfer as indicated by the arrows in FIG. IB; that is, as indicated by the arrows, some heat is reflected or dissipated as a heat sink to one or more surrounding materials.

[0049] . Shown in at least FIG. 1 C, as at least one example of an additive 100, is a representative view of the additive 100B incorporated into board material 102, according to various embodiments. In some embodiments, the additive 100B is configured to absorb heat (as opposed to the reflection / reduction from 100 A) as indicated by the arrows and thereby absorbing the heat from a hot applied material (e.g., asphalt). In some embodiments, the additive 100B may be a wax emulsion. In some embodiments, the additive 100B may be voids created within the board material 102.

[0050] . FIG. 2A is a side, cross-sectional view of an example board 200. In some embodiments, the example board 200 may have multiple layers, as previously alluded to, including a facer 202, a densified layer 204, and a core 206. In some embodiments, the facer 202 may be a glass mat. In some embodiments, the facer 202 may be a fiber mat or other mat (e.g., a coated mat) placed on the densified layer 204. In some embodiments, the densified layer 204 may be a densified layer to which an example additive 100 has been added. In some embodiments, the densified layer 204 may be a slate coat. In some embodiments, the core 206 may be a gypsum core, when the board 200 is a gypsum board. In some embodiments, the core 206 may be a foamed core. In someembodiments, the additives may be added to the core 206 of the example board 200. An example of a densified layer 204 without additives can be seen in at least FIG. 2B as a control board, and an example of a densified layer 204 with additives added can be seen in at least FIG. 2C.

[0051] . In some embodiments, the additive 100 may be a solid insulator, including various types of waxes, clay, and latex. In some embodiments, when the additive 100 is a solid insulator, it may be composed of one or more of clay, silica, quartz, aluminum silicates, and / or zeolites. In some embodiments, the additive 100 may be a solid powder, such as Kaolin Clay. In some embodiments, when the additive 100 is a solid powder, it may be added to the core 206.

[0052] . In some embodiments, the additive 100 may be a liquid additive, including acrylates, latex, and / or PVB. In some embodiments, when the additive 100 is a liquid additive, it may be added to the densified layer 204 of the board 200.

[0053] . In some embodiments, the additive 100 may be a liquid additive some embodiments, when the additive 100 is a solid insulator additive, it may include organic material, including PET, SBS, acrylates, and / or latex.

[0054] . In some embodiments, the additive 100 may be a closed cell insulator. In some embodiments, the closed cell insulator may include creating intentional voids to act as heat sinks within the board material 102. In some embodiments, intentional voids can be achieved by adding scrim or by reducing the amount of material used in the board.

[0055] . In some embodiments, the additive 100 may be a phase change material (PCM), which may be used to reduce frothing (e.g., bubbling) of hot materials when applied to the board (e.g., asphalt). In some embodiments, the phase change material may be a wax emulsion, such as Koncryl 120, high MP waxes, and / or paraffin with no additive.

[0056] . Like FIGS. 2B and 2C, FIGS. 3 A-3C show, according to various embodiments, control boards as well as example boards with additives added to one or more layers.

[0057] . Referring now to FIGS. 3A-3C, side, cross-sectional views of an example board 300 are shown, according to various embodiments. The example board 300 may include a facer, densified layer, and core, similarly to the example board 200, shown in FIGS. 2A-2C. As previously mentioned, FIG. 3A shows a control board 300 without additives added to any of its layers. In FIG. 3B, 15 Ibs / msf wax have been added to the densified layer of the example board 300. In FIG. 3C, 30 Ibs / msf wax have been added to the densified layer. As can be seen in FIGS.3B and 3C, the amount of “frothing” by the applied material 103 has been significantly reduced by the addition of wax as an additive 100.

[0058] . In some embodiments, the addition of an additive 100 to the board material 102 may not impair various structural qualities of the boards 200, 300, and, in some embodiments, an additive 100 may improve various structural qualities of the boards 200, 300. For example, in some embodiments, the addition of wax, in addition to reducing frothing, may also reduce water absorption, improve moisture resistance, and improve nail pull resistance.Example Methods of Incorporating Additives for Boards

[0059] . FIG. 4 shows a method 400 of manufacturing a board. In some embodiments, the method 400 may be utilized to manufacture the example boards 200, 300 using one or more additives 100, as previously described. In some embodiments, the method 400 may be utilized to manufacture boards other than those previously described in this disclosure.

[0060] . In some embodiments, the method 400 may include a step 402 of forming, via a mixer, a slurry material comprising calcium sulfate hemihydrate and water. In some embodiments, the method 400 may include a step 404 of incorporating one or more additives into the slurry material to form a modified slurry. In some embodiments, the method 400 may include a step 406 of setting the modified slurry such that the modified slurry is hardened and is configured to be dimensioned (i.e., the manufactured board may then be cut for application). In some embodiments, the method 400 may include a step of creating one or more voids within the slurry material such that the modified slurry material comprises the one or more voids.

[0061] . Many modifications and other embodiments of the disclosure set forth herein will come to mind to one skilled in the art to which this disclosure pertains having the benefit of the teachings presented in the foregoing descriptions and the associated drawings. Therefore, it is to be understood that the disclosure is not to be limited to the specific embodiments disclosed and that modifications and other embodiments are intended to be included within the scope of the appended claims. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.

Claims

CLAIMS1. A board comprising: a core; a densified layer disposed above the core; and a facer disposed above the densified layer, wherein: one or more additives are disposed within one or more of the densified layer or the core, and the one or more additives influence heat transfer between the board and one or more applied materials.

2. The board of claim 1 , wherein the one or more additives are configured to dissipate heat transferred from the one or more applied materials to the board.

3. The board of claim 1, wherein the one or more additives are configured to absorb heat transferred from the one or more applied materials to the board.

4. The board of claim 1, wherein the one or more applied materials comprise one or more types of asphalt.

5. The board of claim 1, wherein the one or more additives comprises Kaolin Clay disposed within the core.

6. The board of claim 1, wherein the one or more additives comprises solid insulators that are one or more of wax, clay, and polymeric beads.

7. The board of claim 6, wherein the solid insulators comprise inorganic materials that are one or more of silica, quartz, aluminum silicates, and zeolites.

8. The board of claim 6, wherein the solid insulators comprise organic material or emulsions that are one or more of PET, SBS, acrylates, wax emulsions, and latex.

9. The board of claim 1, wherein the one or more additives comprise closed cell insulators.

10. The board of claim 1 , wherein the one or more additives comprise one or more open cell materials comprising clay or foam.

11. The board of claim 1, wherein the one or more additives is a water-resistant additive.

12. The board of claim 1 , further comprising glass mat and one or more voids disposed beneath the glass mat and configured to act as heat sinks.

13. The board of claim 1, further comprising a thermal energy absorbing product disposed above the core and configured to control heat transfer between the board and the one or more applied materials.

14. The board of claims 5-13, wherein the one or more additives of the board comprises one or more of the Kaolin Clay, the wax emulsions, the clay, the polymeric beads, the silica, the quartz, the aluminum silicates, the zeolites, the PET, the SBS, the acrylates, the waxes, the latex, the closed cell insulators, the clay, the foam, and the water-resistant additive.

15. The board of claim 14, wherein the one or more additives are distributed in one or more locations on the board.

16. A method for manufacturing a board, the method comprising: forming, via a mixer, a slurry material comprising calcium sulfate hemihydrate and water; incorporating one or more additives into the slurry material to form a modified slurry; andsetting the modified slurry such that the modified slurry hardens and is configured to be dimensioned.

17. The method of claim 16, further comprising creating one or more voids within the slurry material such that the modified slurry material comprises the one or more voids.

18. The method of claim 16, wherein the one or more additives comprise Kaolin Clay.

19. The method of claim 16, wherein the one or more additives comprise solid insulators selected from one or more of wax, clay, and polymeric beads.

20. The method of claim 19, wherein the solid insulators comprise inorganic materials selected from one or more of clay, silica, quartz, aluminum silicates, and zeolites.

21. The method of claim 20, wherein the solid insulators comprise organic material or liquid emulsions selected from one or more of PET, SBS, acrylates, wax emulsions, and latex.

22. The method of claim 16, wherein the one or more additives comprise closed cell insulators.

23. The method of claim 16, wherein the one or more additives comprise open cell materials comprising clay or foam.

24. The method of claims 17-23, wherein the one or more additives of the board comprises one or more of the Kaolin Clay, the wax emulsions, the clay, the polymeric beads, the silica, the quartz, the aluminum silicates, the zeolites, the closed cell insulators, the clay, and the foam.

25. The method of claim 24, wherein the one or more additives are distributed in one or more locations on the board.

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