Phased array antenna assembly

Abstract

A phased array antenna assembly comprises a plurality of stacked phased array antenna layers. Each layer includes a first antenna layer mounted on a second antenna layer, with an integrated circuit having at least one channel mounted between them. The assembly also includes at least one hollow radiating element formed in the phased array antenna layer when the first antenna layer is stacked on the second antenna layer. Each respective channel of the integrated circuit is connected to a respective hollow radiating element.

Description

Field

[0001] The technology relates to the field of telecommunications, specifically focusing on antenna systems. It is particularly relevant to the design and construction of phased array antennas, which are used in various applications such as radar systems, satellite communications, and wireless networking.Background

[0002] Phased array antennas, which have the ability to electronically steer their beam, are a critical component in many communication systems. These antennas consist of an array of radiating elements connected to a number of phase shifters. By controlling the phase of the signal at each element, the beam direction can be changed electronically, eliminating the need for mechanical movement. However, the practical implementation of such systems is challenging, particularly as the frequency increases.

[0003] One of the main challenges in implementing phased array antennas is the need to control the phase of individual radiating elements, which requires the use of several phase shifters. These phase shifters are typically implemented as integrated circuits (ICs) that must be efficiently connected to the radiating elements. As the frequency of operation increases, the wavelength of the signal decreases, necessitating smaller spacing between radiating elements to avoid grating lobes. This requirement for phase shifters to fit within a specific space becomes more stringent as frequency increases, due to the shorter wavelength.

[0004] In addition to the size constraints for phase shifters, the numerous interconnects between phase shifters and radiating elements introduce ohmic losses and reflections, which degrade antenna performance and efficiency. Each interconnect point can cause signal degradation due to resistance and impedance mismatches, which reduce the overall performance and efficiency of the phased array antenna. This is particularly problematic in high-frequency applications where signal integrity is crucial. Furthermore, the use of dielectric materials in the substrate and interconnects introduces additional losses. Dielectric materials can absorb part of the signal energy, converting it into heat, which reduces the efficiency of the phased array antenna. This loss is more pronounced at higher frequencies, where the dielectric properties of materials have a stronger impact on the signal propagation.

[0005] Existing phased array implementations require the use of PCBs or other substrate-based technologies in order to integrate the phase shifters. This means that the phase shifter ICs are packaged, surface mounted on a PCB or similar, and connected to an array of radiating elements. The radiating elements can be integrated within the same PCB, or in a different technology, meaning that the PCB must include a launcher into the radiating elements. This approach introduces additional interconnects, which further deteriorate the antenna performance and reduce the efficiency.

[0006] In summary, the main problems associated with the prior art in phased array antennas include size constraints for phase shifters, interconnect losses, and dielectric material losses. These problems limit the performance, efficiency, and operating frequency range of phased array antennas, posing significant challenges for their practical implementation.Summary

[0007] According to a first aspect of the disclosure, a phased array antenna assembly comprises a plurality of phased array antenna layers stacked together. Each phased array antenna layer comprises a first antenna layer mounted on a second antenna layer, and an integrated circuit having at least one channel is mounted therebetween. At least one hollow radiating element is formed in the phased array antenna layer when the first antenna layer is stacked on the second antenna layer. Each respective channel of the integrated circuit is connected to a respective hollow radiating element. This configuration allows for efficient signal transmission and reception, providing improved performance in beamforming and signal integrity.

[0008] Optionally in some examples, the phased array antenna assembly comprises at least one transmission element formed in the phased array antenna layer when the first antenna layer is stacked on the second antenna layer. The at least one transmission element is connected between the respective channel and the respective hollow radiating element. This arrangement facilitates the efficient transfer of signals between the integrated circuit and the hollow radiating element, enhancing the overall performance of the antenna assembly.

[0009] Optionally, the hollow radiating element is gas filled e.g. air filled, or comprises a vacuum or partial vacuum.

[0010] Optionally in some examples, the first antenna layer comprises a first layer transmission portion and the second antenna layer comprises a second layer transmission portion. The transmission element is formed when the first layer transmission portion is stacked together with the second layer transmission portion. This design ensures precise alignment and integration of the transmission element, contributing to the effective operation of the phased array antenna.

[0011] Optionally in some examples, the first layer transmission portion comprises a ridge portion that defines at least one ridge of a waveguide. The ridge portion guides and shapes the electromagnetic waves within the waveguide, optimizing the signal transmission and reception capabilities of the antenna assembly.

[0012] Optionally in some examples, the transmission element comprises an air-filled transverse electromagnetic mode (TEM) or non-TEM line, a stripline, coplanar waveguide, coaxial line, rectangular waveguide, square waveguide, folded waveguide, or ridged waveguide. These various transmission lines configurations provide flexibility in design and can be selected based on the specific requirements of the application, ensuring optimal performance across different frequency ranges.

[0013] Optionally in some examples, the first antenna layer comprises a first layer radiating portion and the second antenna layer comprises a second layer radiating portion. The hollow radiating element is formed when the first layer radiating portion is stacked together with the second layer radiating portion. This configuration ensures that the hollow radiating elements are precisely aligned and integrated, enhancing the efficiency and effectiveness of the phased array antenna.

[0014] Optionally in some examples, the first antenna layer comprises at least a first cavity recess and the second antenna layer comprises at least a second cavity recess, which define at least one integrated circuit cavity arranged to house at least one integrated circuit. This design provides protection for the integrated circuit and facilitates its integration with the transmission element, ensuring reliable operation and longevity of the antenna assembly.

[0015] Optionally in some examples, the first antenna layer comprises a transition arranged to connect between the at least one hollow radiating element and the terminals of the integrated circuit. This transition ensures a direct and efficient connection, minimizing interconnect losses and maintaining signal integrity, which is for high-frequency applications.

[0016] Optionally in some examples, the transition is a suspended beam. This design minimizes dielectric losses by surrounding the transition with air, which has a much lower dielectric constant than typical substrate materials. This reduction in dielectric loss contributes to improved antenna efficiency, especially at higher frequencies.

[0017] Optionally in some examples, the transition is galvanic. A galvanic transition, such as a direct metal-to-metal connection between the terminals and the transmission element, ensures minimal resistance and therefore reduced ohmic losses. This type of connection is beneficial for maintaining high performance in phased array antennas.

[0018] Optionally in some examples, the transition is non-galvanic. A non-galvanic transition, such as capacitive coupling between the terminals and the transmission element, minimizes direct current flow while allowing high-frequency signal transfer. This reduces conductive losses and provides an alternative method for signal transmission in the antenna assembly.

[0019] Optionally in some examples, the hollow radiating element transmits and receives electromagnetic signals in a transmission direction parallel with an antenna layer plane of the phased array antenna layer. This orientation ensures that the hollow radiating elements are aligned for optimal signal transmission and reception, enhancing the overall performance of the phased array antenna.

[0020] Optionally in some examples, each of the first antenna layer and the second antenna layer is made from a metallized dielectric material or a metallic material. The choice of material provides structural support and conductivity for efficient signal transmission, contributing to the durability and performance of the antenna assembly.

[0021] According to a second aspect of the disclosure, a stackable phased array antenna layer for a phased array antenna assembly comprises a first antenna layer mounted on a second antenna layer, and an integrated circuit having at least one channel mounted therebetween. A plurality of hollow radiating elements are formed in the phased array antenna layer when the first antenna layer is stacked on the second antenna layer. Each respective channel of the integrated circuit is connected to a respective hollow radiating element. This configuration allows for modular construction of the phased array antenna assembly, enabling scalability and flexibility in design.

[0022] According to a third aspect of the disclosure, a method of manufacturing a phased array antenna assembly comprises aligning a plurality of stackable phased array antenna layers and connecting a plurality of phased array antenna layers to form a phased array antenna assembly. This method ensures precise alignment and secure connection of the antenna layers, resulting in a robust and high-performance phased array antenna assembly.Brief Description of the Drawings

[0023] Examples are described in more detail below with reference to the appended drawings. Figure 1 is a phased array antenna assembly with multiple phased array antenna layers according to some examples. Figure 2 is an exploded view of a phased array antenna assembly with a plurality phased array antenna layers according to some examples. Figure 3 is an exploded view of a stackable phased array antenna layer according to some examples. Detailed Description

[0024] The detailed description set forth below provides information and examples of the disclosed technology with sufficient detail to enable those skilled in the art to practice the disclosure.

[0025] Figure 1 illustrates a phased array antenna assembly 100 with multiple phased array antenna layers 102 stacked together. This phased array antenna assembly 100 is designed to electronically steer the beam in two dimensions .

[0026] The phased array antenna assembly 100 is constructed by stacking multiple phased array antenna layers 102. Each phased array antenna layer 102 contributes to beam steering in one dimension, and the combined layers enable two-dimensional beam steering. This modular design allows for flexibility in antenna configuration and performance.

[0027] The phased array antenna assembly 100 includes the phased array antenna layer 102 as a component. The phased array antenna layer 102 steers the beam electronically in one dimension and serves as a building block for a 2D array.

[0028] The term "1D" is a reference to how the phased array antenna layer 102 extends in a direction parallel to the antenna layer plane 116. Each phased array antenna layer 102 will have a different antenna layer plane 116, although each antenna layer plane 116 is parallel.

[0029] It routes and redistributes signals between the hollow radiating element 114 and an integrated circuit 108 (IC), radiating and receiving signals from free space. The phased array antenna layer 102 has an antenna layer plane 116, which defines the plane parallel to which the phased array antenna layer 102 extends. The phased array antenna layer 102 may carry one or several polarizations and each phased array antenna layer 102 may be connected to at least one integrated circuit 108. The phased array antenna layer 102 may radiate and receive signals from free space.

[0030] The phased array antenna layer 102 may be made of a metallized material, which provides structural support and conductivity for signal transmission. The choice of metallized material may depend on the operating frequency, cost, and manufacturing processes. In the example where the phased array antenna layer 102 comprises a metallised material, in some examples this is a metal coating applied to a structural matrix such as silicon. In some examples, the phased array antenna layer 102 is made from a metallized dielectric material in which case the dielectric material is only structural and does not have an electrical function in the phased array antenna layer 102. That is, the metal coating of the metallize material is arranged to transmit signals and the material to which the metal coating is applied is not configured to transmit signals. e.g. in other words only the metal coating is configured to transmit signals. The first antenna layer 104, second antenna layer 106, and package layer 110 may also be made from this material. Examples of metallized materials include silicon, glass, quartz, and polymers. The phased array antenna layer 102 may also be made of a metallic material to provide conductivity for efficient signal transmission. The choice of metallic material may depend on the operating frequency, cost, and manufacturing processes. The first antenna layer 104, second antenna layer 106, and package layer 110 may also be made from this material. Examples of metallic materials include copper, gold, steel, and aluminum. The phased array antenna layer 102 includes a first antenna layer 104, a second antenna layer 106, an integrated circuit 108, and hollow radiating element 114. In some configurations, the phased array antenna layer 102 may also include an integrated circuit cavity 132, a package layer 110, and passive element 140.

[0031] Whilst, the phased array antenna assembly 100 as shown in Figure 1 comprises a vertical stack of a plurality of phased array antenna layers 102, in other examples, the phased array antenna assemblies 100 can also include a plurality of phased array antenna layers 102 which are aligned side by side as well as as plurality of stacked phased array antenna layer 102.

[0032] The phased array antenna layer 102 may include a package layer 110. The package layer 110 is connected to the topmost phased array antenna layer 102 in the phased array antenna assembly 100 and protects the assembly. In this way there may be a single package layer 110 for the phased array antenna assembly 100. The arrangement as shown in Figure 3 shows a package layer 110, with only a single phased array antenna layer 102.

[0033] The phased array antenna layer 102 includes a hollow radiating element 114. The hollow radiating element 114 transmits and receives electromagnetic signals in the transmission direction 146, parallel to the antenna layer plane 116 of the phased array antenna layer 102. At least one hollow radiating element 114 is formed in the phased array antenna layer 102 when the first antenna layer 104 is stacked on the second antenna layer 106. In some configurations, a plurality of hollow radiating elements 114 may be arranged in the phased array antenna layer 102 in a 1xN array. The hollow radiating element 114 is connected to the transmission element 112. A plurality of hollow radiating elements 114 may be arranged in a 1xN array with a spacing of approximately half a wavelength. For example, there can be a 1x4 array of hollow radiating element 114 as shown in Figure 3. However, there can be any number of hollow radiating elements 114, e.g. a 1x 3, 1x5, 1x6, 1x7, 1x8 etc array.

[0034] The hollow radiating element 114 may have a transmission direction 146, which defines the direction of signal transmission and reception. The hollow radiating element 114 is a metallic structure, preferably made of copper or aluminum, formed when a first antenna layer 104 and a second antenna layer 106 are stacked. Alternatively, the hollow radiating element 114 can be made from a metallised material or other similar material as discussed above with respect to the phased array antenna layer 102. The hollow radiating element 114 can be, for instance, a waveguide aperture, a patch antenna, a slotline antenna, a dipole antenna, or any other known hollow radiating element 114. When a first antenna layer 104 is stacked together with a second antenna layer 106, the hollow radiating elements 114 are aligned to create the phased array antenna layer 102, . The hollow radiating element 114 may include a transmission element 112.

[0035] In some examples the hollow radiating element 114 is the transmission element 112. That is the transmission element 112 as discussed hereinafter may provide the functionality of the hollow radiating element 114. Alternatively, the transmission element 112 as discussed below can be in addition to the hollow radiating element 114. In other words, the transmission element 112 can be the same as the hollow radiating element 114 or the transmission element 112 and the hollow radiating element 114 can be separate features.

[0036] The radiating hollow radiating element 114 comprises an elongate cavity 136. That is the elongate cavity 136 extends along the longitudinal axis of the hollow radiating element 114. This means that the hollow radiating element 114 comprises a void and in some examples the hollow radiating element 114 is air filled e.g. an air filled waveguide 134. This means that signal is not transmitted in the hollow radiating element 114 via a dielectric material. The signals transmitted in the hollow radiating elements 114 do not interact with any dielectric mateirals or have minimal interaction with dielectric materials. This is in contrast to known antenna arrays which use one or more PCBs. Accordingly, the hollow radiating element 114 does not comprises any PCBs and this means that the hollow radiating element 114 does not suffer from associated dielectric losses due to PCB. Furthermore, the arrangement as discussed in reference to the accompanying drawings is configured to transmit signals at high frequencies.

[0037] Whilst the hollow radiating element 114 in some examples is air filled because the elongate cavity 136 is filled with air, in other examples, the hollow radiating element 114 and the waveguide cavity 136 is gas filled, comprises a vacuum or comprises a partial vacuum.

[0038] The phased array antenna layer 102 may include passive element 140. The passive elements 140 are positioned around the edge of the phased array antenna layer 102 to provide a uniform electromagnetic (EM) environment for each hollow radiating element 114. This means that the hollow radiating element 114 on the edge of the phased array antenna assembly 100 experiences similar EM properties to other hollow radiating element 114 closer to the middle of the phased array antenna assembly 100.

[0039] At least one passive element 140 is formed in the phased array antenna layer 102 when the first antenna layer 104 is stacked on the second antenna layer 106. For example, there may be one passive element 140 or a plurality of passive elements 140 in the phased array antenna layer 102. As shown in Figure 3 there are two passive elements 140 at each end of the array of plurality of hollow radiating elements 114. In some examples there can also be no passive elements 140.

[0040] Figure 2 provides an exploded view of the phased array antenna assembly 100, illustrating the arrangement of multiple phased array antenna layers 102 and the integrated circuit 108. This exploded view clarifies the stacking mechanism and the positioning of the integrated circuit 108 within the phased array antenna assembly 100. Figure 2 demonstrates how the phased array antenna layers 102 are stacked together to form the phased array antenna assemblies 100, with the integrated circuits 108 placed the phased array antenna layers 102 as discussed hereinafter.

[0041] This arrangement contributes to the overall compactness and efficiency of the phased array antenna assembly 100. The exploded view also highlights the modularity of the design, emphasizing the ability to customize the antenna's performance by adding or removing one or more phased array antenna layers 102. This modularity allows for flexibility in achieving desired antenna specifications. By separating the plurality of phased array antenna layers 102, Figure 2 also provides a clearer visualization of the individual components within each layer, such as the first antenna layer 104, the second antenna layer 106, and the hollow radiating element 114. This detailed view aids in understanding the construction and functionality of each layer and its contribution to the overall performance of the phased array antenna assembly 100.

[0042] The integrated circuit 108 controls the amplitude and phase of signals for each hollow radiating element 114, generating the required phase and gain control for beamsteering. The integrated circuit 108 is configured to minimise losses and maintains signal integrity through a direct transition 124 to the terminals. The integrated circuit 108 may be mounted between the first antenna layer 104 and the second antenna layer 106. This mounting may involve a single integrated circuit 108 or several integrated circuits 108. The arrangement as shown in Figures 1 to 3 only shows a single integrated circuit 108 in each phased array antenna layer 102.

[0043] However, each phased array antenna layer 102 can comprise a plurality of integrated circuits 108. In some examples, each phased array antenna layer 102 can comprise a plurality of integrated circuit cavities 132. Alternatively the phased array antenna assembly 100 comprises a plurality of discrete phased array antenna layers 102 aligned side by side and a further plurality of stacked phased array antenna layer 102, then there can be a plurality of integrated circuits 108 aligned in the same antenna layer plane 116.

[0044] In some instances, the total thickness of the 1D antenna is less than the element pitch (between half and one wavelength), and the integrated circuit 108 generates the required phase for beamsteering. The integrated circuit 108 comprises an array of phase shifters, each connected to a corresponding hollow radiating element 114. The integrated circuit 108 may also incorporate variable gain amplifiers for amplitude control, further improving beamforming precision. For example, at least one beamforming integrated circuit 108 with any number of channels may be configured to be connected to a plurality of hollow radiating elements 114 in the phased array antenna layer 102.

[0045] In some examples, the integrated circuit 108 can have the same number of channels as the array of hollow radiating element 114. For example if the array of hollow radiating element 114 is 1xN, then the integrated circuit 108 can have a corresponding array of a plurality of channels e.g. 1xN.

[0046] Each integrated circuit 108 includes a plurality of channels and may include a respective number of terminals. Each channel may provide independent phase control and optionally gain control for a single hollow radiating element 114, controlling beam direction and shape. The channels are located within the integrated circuit 108. The channel outputs may be rerouted to a smaller pitch array, decoupling the pitch of the radiating elements from the pitch of the channels in the IC. There are a plurality of channels, each connected to a respective transmission element 112 and hollow radiating element 114. The phased array antenna layer 102 minimises losses by using one single transition between the integrated circuit 108 and the hollow radiating element 114. The signal transitions directly from the terminals on the integrated circuit 108 to the hollow waveguide structure in the package. This is in contrast to other architectures where the integrated circuit 108 may be packaged separately and then the package is mounted on a PCB and then the PCB is connected to the antenna frontend. The terminals may have galvanic contact. The terminals may be metal pads, arranged on the surface of the IC die. In some examples the transition 124 comprises one or more probes. The probes directly contact these pads, establishing a low-resistance galvanic connection to the transmission element 112 and hollow radiating element 114, thus reducing interconnect losses.

[0047] Figure 3 provides an exploded view of a stackable phased array antenna layer 102, detailing its internal components and their arrangement. This view clarifies the construction of each layer and how these layers contribute to the functionality of the overall phased array antenna assembly 100.

[0048] Whilst a single phased array antenna layer 102 is shown in Figure 3, the phased array antenna assembly 100 can comprise any number of phased array antenna layers 102. For example, the phased array antenna assemblies 100 can comprise a phased array antenna assembly 100 of 1 xM where M is the number of phased array antenna layers 102. There can be any number of phased array antenna layers 102 in the phased array antenna assembly 100 e.g. 2, 3, 4, 5, 6, 7, 8 etc.

[0049] The exploded view separates the first antenna layer 104 from the second antenna layer 106, revealing the integrated circuit 108 positioned between them. This arrangement highlights the phased array antenna layer 102 role in housing and integrating the active circuitry with the antenna elements. The figure also showcases components within each phased array antenna layer 102, including the first layer transmission portion 118, the second layer transmission portion 126, the first layer radiating portion 120, the second layer radiating portion 128, the first cavity recess 122, and the second cavity recess 130. These components work together to form the transmission element 112, hollow radiating element 114, and the cavity for the integrated circuit 108, illustrating the function of the phased array antenna layer 102 in signal transmission and radiation.

[0050] By presenting the phased array antenna layer 102 in an exploded configuration, Figure 3 allows for a clearer understanding of how the individual components are assembled and interconnected. This detailed view aids in comprehending the construction of the phased array antenna layer 102 and its contribution to the overall performance of the phased array antenna assembly 100. Furthermore, the exploded view emphasizes the modularity of the design, as each phased array antenna layer 102 can be considered a self-contained unit. This modularity allows for flexibility in antenna design and manufacturing, as layers can be added or removed to adjust the antenna's performance characteristics.

[0051] The phased array antenna layer 102 may include a first antenna layer 104. The first antenna layer 104 may be mounted on the second antenna layer 106. The first antenna layer 104 may include a first layer transmission portion 118, a first layer radiating portion 120, a first layer passive portion 142, a first cavity recess 122, and a transition 124. The first antenna layer 104 can be connected to the second antenna layer 106 in any suitable way e.g. bonded etc as discussed below.

[0052] The first antenna layer 104 may include a first layer transmission portion 118. The first layer transmission portion 118 forms the transmission element 112 when stacked together with the second layer transmission portion 126. The first layer transmission portion 118 may define part of a waveguide cavity 136 and may include a ridge portion 138. Accordingly, the first antenna layer 104 and the second antenna layers 106 define the waveguide cavity 136 which is air filled when the first antenna layer 104 is stacked together with the second antenna layer 106. In this way, the hollow radiating element 114 is air filled. As mentioned above, the waveguide cavity 136 can comprise a vacuum, a partial vacuum or is filled with another gas.

[0053] The first antenna layer 104 may include a first layer radiating portion 120. The first layer radiating portion 120 forms the hollow radiating element 114 when stacked together with the second layer radiating portion 128. As mentioned above, in some examples the hollow radiating element 114 is a transmission element 112 in which case the first layer transmission portion(s) 118 and the first layer radiating portion(s) 120 are the same. Similarly in this case the second layer transmission portion(s) 126 and the second layer radiating portions 128 are the same.

[0054] The first antenna layer 104 may have a first cavity recess 122. The first cavity recess 122 is arranged to house the integrated circuit 108. The first cavity recess 122 provides protection for the integrated circuit 108 and facilitates integration with the transmission element 112. The first cavity recess(es) 122 and second cavity recess 130 define the integrated circuit cavities 132 when the first antenna layer 104 is stacked on the second antenna layer 106. Whilst Figure 3 only shows a single integrated circuit cavity 132, there can be a plurality of integrated circuit cavities 132 within the phased array antenna layer 102. In this case there will be a corresponding plurality of first cavity recesses 122 and a plurality of second cavity recesses 130 which form a plurality of integrated circuit cavities 132 when the first antenna layer 104 is mounted on the second cavity recess 130.

[0055] The first antenna layer 104 may include a transition 124. The transition 124 connects the transmission element 112 and the terminals in the integrated circuit 108. The transition 124 minimises interconnect losses and maintains signal integrity, especially at high frequencies. The transition 124 picks up the signal from the integrated circuit 108 via a galvanic contact and excites the required mode in the transmission element 112. The transition 124 may be configured to provide a direct connection to the terminals. The transition 124 may be galvanic, providing wideband performance. For instance, the transitions 124 may be a direct metal-to-metal connection between the terminal(s) and the transmission element(s) 112, such as a soldered connection, a bonded connection, or a spring-loaded contact, ensuring minimal resistance and therefore reduced ohmic losses. Alternatively, the transition 124 may be non-galvanic. For example, the transition 124 may be a capacitive coupling between the terminals and the transmission element 112, implemented using closely spaced metal pads separated by a thin dielectric layer, minimizing direct current flow while allowing high-frequency signal transfer, thus blocking unwanted DC signals in applications where this may be required .

[0056] In some examples, the transition 124 may be a suspended beam connected between the terminals and the transmission element 112, surrounded by air. Being surrounded by air minimizes dielectric losses and enables better impedance matching. The transition 124 may include a probe. The probe makes a galvanic connection to the integrated circuit 108 terminals and excites the required mode in the transmission element 112. The probe may be within the package layer 110. The probe is a physical contact point and part of the transition 124 structure. The probes may be formed from conductive metal, such as gold-plated silicon, glass , or plastic (or any other material previously discussed), and fabricated integrally with the package layers 110 using a photolithographic process, with a tapered tip for precise contact with the terminals, extending into the package cavity to make contact with the terminals, creating a low-loss galvanic connection and reduce interconnect losses. For example, the probe may be a plurality of probes built within the package.

[0057] Whilst reference is made to a single transition 124 there is a separate transition 124 for each respective channel and transmission element 112 and hollow radiating element 114.

[0058] The first layer transmission portion 118 may include a ridge portion 138. The ridge portion 138 defines the ridge of the waveguide 134, guiding and shaping the electromagnetic waves within the waveguide 134.

[0059] The first antenna layer 104 may include a first layer passive portion 142. The first layer passive portion 142 forms the passive element 140 when stacked together with the second layer passive portion 144.

[0060] The phased array antenna layer 102 may include a second antenna layer 106. The second antenna layer 106 may include a second layer transmission portion 126, a second layer radiating portion 128, a second layer passive portion 144, and a second cavity recess 130.

[0061] The second antenna layer 106 may include a second layer transmission portion 126. The second layer transmission portion 126 forms the transmission element 112 when stacked together with the first layer transmission portion 118.

[0062] The second antenna layer 106 may include a second layer radiating portion 128. The second layer radiating portion 128 forms the hollow radiating element 114 when stacked together with the first layer radiating portion 120.

[0063] The second antenna layer 106 may include a second cavity recess 130. The second cavity recess 130 is arranged to house the integrated circuit 108 when the first antenna layer 104 is stacked on the second antenna layer 106. The second cavity recess 130 provides protection for the integrated circuit 108 and facilitates integration with the transmission element 112.

[0064] The second antenna layer 106 may include a second layer passive portion 144. The second layer passive portion 144 forms the passive element 140 when stacked together with the first layer passive portion 142.

[0065] The hollow radiating element 114 may include a transmission element 112. At least one transmission element 112 is formed in the phased array antenna layer 102 when the first antenna layer 104 is stacked on the second antenna layer 106. A plurality of transmission elements 112 may be arranged in the phased array antenna layer 102, each connected to a respective hollow radiating element 114. The transmission element 112 may be connected between the integrated circuit 108 and the hollow radiating element 114.

[0066] The transmission element 112 in some examples, consists of a section of transmission line, such as a microstrip line, slot line, waveguide, ridged waveguide, folded waveguide, or coplanar waveguide, formed within the package layer 110 . The dimensions of the transmission lines are chosen to match the impedance of the hollow radiating element 114 and IC, minimizing reflections and maximizing power transfer. By integrating the transmission element 112 within the phased array antenna layer 102, the need for external connectors or additional transitions is eliminated, reducing interconnect losses.

[0067] Alternatively, the transmission element 112 may include a transmission line and a waveguide 134. The transmission line transmits signals between the hollow radiating element 114 and the integrated circuit 108. The transmission line is connected between the transition 124 and the hollow radiating element 114. The transmission line can carry one or several polarizations. The transmission line improves antenna efficiency, especially at higher frequencies.

[0068] For instance, the transmission line may be an air-filled Transverse Electromagnetic Mode (TEM) Line. An air-filled TEM Line minimizes dielectric losses. Examples of air-filled TEM lines include stripline, coplanar waveguide, slot-lines, and coaxial lines. These transmission lines are patterned directly on either the first antenna layer 104 and / or the second antenna layer 106 which can minimise the length and number of interconnects and thus reducing interconnect losses. The choice of air-filled TEM lines (stripline, coplanar, coaxial) or hollow metallic waveguides should be justified based on operating frequency and desired performance characteristics.

[0069] As discussed above, the transmission element 112 may include a waveguide 134 in some examples. In this case, the waveguide 134 forms the waveguide 134 cavities and ridges and guides electromagnetic waves. For instance, the waveguide 134 may be a hollow metallic waveguide, suitable for millimeter-wave and terahertz applications. Examples of hollow metallic waveguides include rectangular, square, folded, and ridged waveguides. The waveguide 134 may include a waveguide cavity 136. In this case the first antenna layer 104 defines part of the structure of the waveguide 134 and the second antenna layer 106 defines part of the structure of the waveguide 134. Accordingly, when the first antenna layer 104 is stacked on the second antenna layers 106, the waveguide(s) 134 (or a plurality of waveguides 134) are formed. In some other examples, the waveguide may be only implemented in a single phased array antenna layer 102.

[0070] The waveguide 134 may include a waveguide cavity 136.

[0071] As mentioned above, the phased array antenna layer 102 may include an integrated circuit cavity 132. The integrated circuit cavity 132 is configured to receive the integrated circuit 108. The integrated circuit cavity 132 is formed in the phased array antenna layer 102 when the first antenna layer 104 is stacked on the second antenna layer 106. There can be at least one integrated circuit cavity 132 or a plurality of integrated circuits 108 cavities. The integrated circuit cavity 132 is defined by the first cavity recess 122 and the second cavity recess 130.

[0072] This section focuses on additional features that enhance the performance and functionality of the phased array antenna assembly 100. These features contribute to the overall efficiency, reliability, and adaptability of the antenna assembly.

[0073] One feature is the creation of waveguide structures within the phased array antenna layer 102. These structures guide and shape the electromagnetic waves, ensuring efficient signal transmission and reception. The waveguide structures are precisely patterned during the fabrication process, contributing to the antenna's performance and operating bandwidth.

[0074] In some configurations, patterning different layers of phased array antenna layer 102 may involve creating features for waveguide structure.

[0075] The fabrication of phased array antenna layer 102 involves a series of precise manufacturing steps. These steps ensure the accurate formation of antenna components, such as the hollow radiating element 114, transmission line, and integrated circuit 108 cavities. The fabrication process may achieve the desired performance characteristics of the phased array antenna assembly 100.

[0076] The fabrication process begins with patterning the antenna layers. This involves creating the precise shapes and features required for the operation of the phased array antenna assembly 100, including the waveguide 134 structures, hollow radiating element 114, and transmission line. Following patterning, surface treatments may be applied to enhance conductivity, bonding strength, and overall reliability. Finally, metallization may be performed to create conductive surfaces for efficient signal transmission.

[0077] Patterning is a step in the fabrication of phased array antenna layer 102 which involves creating precise features and shapes on the antenna layers, defining the waveguide structures, hollow radiating element 114, and transmission line. Accurate patterning may achieve the desired performance of the phased array antenna assembly 100.

[0078] Various techniques can be used for patterning, including photolithography, CNC milling, injection molding, laser etching, plasma etching, and wet etching. The choice of technique depends on the specific requirements of the antenna design and the materials used. Photolithography is commonly used for high-precision patterning, while CNC milling and laser etching offer greater flexibility for complex shapes. Plasma etching and wet etching are used for removing material selectively, creating the desired features on the antenna layers.

[0079] Surface treatments may be applied to a plurality of phased array antenna layers 102 to enhance their properties and improve the overall performance and reliability of the phased array antenna assembly 100. These treatments can improve conductivity, bonding strength, and resistance to environmental factors.

[0080] Several surface treatment methods can be employed, including physical vapor deposition (PVD) methods like sputtering and evaporation, chemical vapor deposition (CVD) methods like PECVD and ALD, plating methods like electroplating and electroless plating, plasma treatments, chemical treatments, and mechanical treatments. The choice of surface treatment depends on the specific requirements of the antenna and the materials used.

[0081] Metallization is the process of depositing a thin layer of metal onto the plurality of phased array antenna layers 102. This creates conductive surfaces for efficient signal transmission and reception. The metallization process is arranged to provide the proper functioning of the phased array antenna assembly 100 and it is required when the phased array antenna layers 102 are manufactured out of non-conductive or semiconductor materials.

[0082] Various metallization techniques can be used, including sputtering, evaporation, and plating. The choice of technique depends on the specific requirements of the antenna design and the materials used. Sputtering and evaporation are PVD methods that offer high precision and uniformity. Plating methods, such as electroplating and electroless plating, are cost-effective options for creating thicker metal layers.

[0083] The assembly of phased array antenna layer 102 involves stacking and bonding individual layers to form the complete phased array antenna assembly 100. This process requires precise alignment and connection of the phased array antenna layer 102 to ensure structural integrity and electrical connectivity. The integrated circuits 108 are mounted within designated cavities, and transitions 124 are established to connect the hollow radiating element 114 to the integrated circuit 108.

[0084] The assembly process begins with stacking and bonding the individual phased array antenna layer 102. Precise alignment ensures proper antenna performance of the phased array antenna assembly 100. Adhesive bonding or thermocompression bonding techniques may be used to join the layers. Next, the integrated circuits 108 are mounted within the designated integrated circuit cavity 132. Finally, transitions 124 are established to connect the hollow radiating element 114 to the integrated circuit 108, ensuring efficient signal flow.

[0085] The stacking and bonding process as described allows for precisely aligning and bonding the first antenna layer 104 and second antenna layer 106. This creates a unified structure that houses the integrated circuit 108 and forms the transmission element 112, hollow radiating element 114, and integrated circuit cavity 132. The bonding ensures structural integrity and establishes electrical connections between the layers within and between the phased array antenna layer 102.

[0086] Thermocompression bonding or adhesive bonding are two exemplary methods used for this process, although any suitable bonding process can be used. Thermocompression bonding uses heat and pressure to fuse the layers together, while adhesive bonding employs a specialized adhesive. The choice of method depends on the materials used and the desired performance characteristics.

[0087] The integrated circuit 108 is mounted within the integrated circuit cavity / integrated circuit cavities 132 formed between the first antenna layer 104 and second antenna layer 106. This cavity protects the integrated circuit 108 and ensures its proper integration with the other antenna components. The mounting process involves precisely positioning the integrated circuit 108 within the cavity and securing it using appropriate methods, such as adhesive bonding or soldering. This ensures stable electrical connections and protects the integrated circuit 108 from mechanical stress and environmental factors.

[0088] The transition 124 connects the integrated circuit 108 to the transmission element 112. It ensures efficient signal transfer between the integrated circuit 108 and the hollow radiating element 114. The transition 124 can be galvanic, involving a direct metal-to-metal connection, or non-galvanic, using capacitive coupling. The choice of transition 124 type depends on the specific design requirements and desired performance characteristics. A well-designed transition 124 minimizes signal loss and maintains signal integrity, contributing to the antenna's overall efficiency.

[0089] The packaging process protects the assembled phased array antenna assembly 100 and ensures its long-term reliability. This involves enclosing the antenna assembly in a protective package that shields it from environmental factors and mechanical stress. The packaging also provides a means for electrical connections to external systems.

[0090] After the phased array antenna layers 102 are assembled, the entire phased array antenna assembly 100 is packaged. This involves aligning and connecting the layers to form the final phased array antenna assembly 100. The packaging process ensures structural integrity and electrical connectivity between the layers. Various bonding techniques, such as thermocompression bonding or adhesive bonding, may be employed to connect the layers securely. The package also provides protection for the phased array antenna assembly 100, shielding it from environmental factors and mechanical stress.

[0091] The phased array antenna assembly 100 is formed by stacking multiple phased array antenna layers 102. Each layer contributes to the antenna's beamforming capabilities, and the stacked configuration enables two-dimensional beam steering. The stacking process involves carefully aligning and connecting the layers to ensure structural integrity and electrical continuity. This modular design allows for flexibility in antenna configuration and performance, enabling customization for specific applications.

[0092] Precise alignment of the phased array antenna layer 102 allows for the proper functioning of the phased array antenna assembly 100. Misalignment can lead to performance degradation and reduced efficiency. Alignment involves ensuring the correct positioning and orientation of each layer relative to the others.

[0093] Connecting the phased array antenna layer 102 involves establishing both structural and electrical connections between the layers. Structural connections ensure the mechanical integrity of the assembly, while electrical connections enable signal flow between the layers. Various bonding techniques, such as thermocompression bonding, adhesive bonding, clamping, ultrasonic bonding, thermosonic bonding, or friction bonding, can be used to achieve these connections. The choice of technique depends on the materials used and the specific design requirements.

[0094] Item 1. A phased array antenna assembly 100 comprising: a plurality of phased array antenna layers 102 stacked together, each phased array antenna layer 102 comprising: a first antenna layer 104 mounted on a second antenna layer 106; and an integrated circuit 108 having at least one channel is mounted therebetween; and at least one hollow radiating element 114 formed in the phased array antenna layer 102 when the first antenna layer 104 is stacked on the second antenna layer 106; wherein each respective channel of the integrated circuit 108 is connected to a respective hollow radiating element 114.

[0095] Item 2. A phased array antenna assembly 100 according to example 1 wherein the at least one hollow radiating element 114 comprises at least one transmission element 112 which are formed in the phased array antenna layer 102 when the first antenna layer 104 is stacked on the second antenna layer 106 and the at least one transmission element 112 is connected between the respective channel and the respective hollow radiating element 114.

[0096] Item 3. The phased array antenna assembly 100 according to example 2, wherein the first antenna layer 104 includes a first layer transmission portion 118 and the second antenna layer 106 includes a second layer transmission portion 126, wherein the transmission element 112 is formed when the first layer transmission portion 118 is stacked together with the second layer transmission portion 126.

[0097] Item 4. The phased array antenna assembly 100 according to example 3, wherein the first layer transmission portion 118 includes a ridge portion 138 that defines at least one ridge of a waveguide 134.

[0098] Item 5. The phased array antenna assembly 100 according to any of examples 2 to 4, wherein the transmission element 112 includes: an air-filled transverse electromagnetic mode (TEM) or non-TEM line; a stripline; coplanar waveguide; a coaxial line; a rectangular waveguide, a square waveguide, a folded waveguide, or a ridged waveguide.

[0099] Item 6. The phased array antenna assembly 100 according to any of examples 1 to 4, wherein the first antenna layer 104 includes a first layer radiating portion 120 and the second antenna layer 106 includes a second layer radiating portion 128, wherein the hollow radiating element 114 is formed when the first layer radiating portion 120 is stacked together with the second layer radiating portion 128.

[0100] Item 7. The phased array antenna assembly 100 according to any of examples 1 to 6, wherein the first antenna layer 104 includes at least a first cavity recess 122 and the second antenna layer 106 includes at least a second cavity recess 130, which define at least one integrated circuit cavity 132 which is arranged to house at least one integrated circuit 108.

[0101] Item 8. The phased array antenna assembly 100 according to examples 1 to 7, wherein the first antenna layer 104 includes a transition 124 arranged to connect between the at least one hollow radiating element 114 and a terminals of the integrated circuit 108.

[0102] Item 9. The phased array antenna assembly 100 according to example 8, wherein the transition 124 is a suspended beam.

[0103] Item 10. The phased array antenna assembly 100 according to any of examples 8 to 9, wherein the transition 124 is galvanic.

[0104] Item 11. The phased array antenna assembly 100 according to example 8 to 9, wherein the transition 124 is non-galvanic.

[0105] Item 12. The phased array antenna assembly 100 according to any of examples 1 to 11, wherein the hollow radiating element 114 transmits and receives electromagnetic signals in a transmission direction 146 parallel with an antenna layer plane 116 of the phased array antenna layer 102.

[0106] Item 13. The phased array antenna assembly 100 according to any of examples 1 to 12, wherein each of the first antenna layer 104 and the second antenna layer 106 is made from a metallized dielectric material or a metallic material.

[0107] Item 14. The phased array antenna assembly 100according to any of examples 1 to 13 wherein the first antenna layer 104 includes a first layer passive portion 142 and the second antenna layer 106 includes a second layer passive portion 144, wherein at last one passive element 140 is formed when the first layer passive portion 142 is stacked together with the second layer passive portion 144.

[0108] Item 15. The phased array antenna assembly 100 according to any preceding example wherein the integrated circuit 108 is a beamforming integrated circuit 108.

[0109] Item 16. The phased array antenna assembly 100 according to example 15 wherein the integrated circuit 108 is a plurality of integrated circuits 108 in each phased array antenna layer 102.

[0110] Item 17. The phased array antenna assembly 100 according to any preceding example wherein the phased array antenna layer 102 comprises 1 x N hollow radiating elements 114.

[0111] Item 18. The phased array antenna assembly 100 according to example 17 wherein the integrated circuit 108 comprises 1 X N channels.

[0112] Item 19. The phased array antenna assembly 100 according to any of the preceding examples wherein the phased array antenna assembly 100 comprises 1 x M phased array antenna layer(s) 102.

[0113] Item 20. The phased array antenna assembly 100 according to any of the preceding examples wherein each phased array antenna layer 102 comprises a plurality of phased array antenna layers 102 in the same antenna layer plane 116.

[0114] Item 21. The phased array antenna assembly 100 wherein a plurality of stacked phased array antenna layers 102 are connected together via thermocompression bonding, adhesive bonding, ultrasonic bonding, thermosonic bonding, or friction bonding.

[0115] Item 22. A stackable phased array antenna layer 102 for a phased array antenna assembly 100 comprising: a first antenna layer 104 mounted on a second antenna layer 106; and an integrated circuit 108 having at least one channel mounted therebetween; and a plurality of hollow radiating elements 114 formed in the phased array antenna layer 102 when the first antenna layer 104 is stacked on the second antenna layer 106; wherein each respective channel of the integrated circuit 108 is connected to a respective hollow radiating element 114.

[0116] Item 23. A method of manufacturing a phased array antenna assembly 100 according to any of example 1 to example 13 comprising: aligning a plurality of stackable phased array antenna layers 102; connecting a plurality of phased array antenna layers 102 to form a phased array antenna assembly 100.

[0117] The terminology used herein is for the purpose of describing particular aspects only and is not intended to be limiting of the disclosure. As used herein, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items. It will be further understood that the terms "comprises," "comprising," "includes," and / or "including" when used herein specify the presence of stated features, integers, actions, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, integers, actions, steps, operations, elements, components, and / or groups thereof.

[0118] It will be understood that, although the terms first, second, etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, a first element could be termed a second element, and, similarly, a second element could be termed a first element without departing from the scope of the present disclosure.

[0119] Relative terms such as "below" or "above" or "upper" or "lower" or "horizontal" or "vertical" may be used herein to describe a relationship of one element to another element as illustrated in the Figures. It will be understood that these terms and those discussed above are intended to encompass different orientations of the device in addition to the orientation depicted in the Figures. It will be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element, or intervening elements may be present. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there are no intervening elements present.

[0120] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure belongs. It will be further understood that terms used herein should be interpreted as having a meaning consistent with their meaning in the context of this specification and the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0121] It is to be understood that the present disclosure is not limited to the aspects described above and illustrated in the drawings; rather, the skilled person will recognize that many changes and modifications may be made within the scope of the present disclosure and appended claims. In the drawings and specification, there have been disclosed aspects for purposes of illustration only and not for purposes of limitation, the scope of the disclosure being set forth in the following claims.

Claims

1. A phased array antenna assembly (100) comprising: a plurality of phased array antenna layers (102) stacked together, each phased array antenna layer (102) comprising: a first antenna layer (104) mounted on a second antenna layer (106); and an integrated circuit (108) having at least one channel is mounted therebetween; and at least one hollow radiating element (114) is formed in the phased array antenna layer (102) when the first antenna layer (104) is stacked on the second antenna layer (106); wherein each respective channel of the integrated circuit (108) is connected to a respective hollow radiating element (114).

2. A phased array antenna assembly (100) according to claim 1 wherein the at least one hollow radiating element (114) comprises at least one transmission element (112) which are formed in the phased array antenna layer (102) when the first antenna layer (104) is stacked on the second antenna layer (106) and the at least one transmission element (112) is connected between the respective channel and the respective hollow radiating element (114).

3. The phased array antenna assembly (100) according to claim 2, wherein the first antenna layer (104) includes a first layer transmission portion (118) and the second antenna layer (106) includes a second layer transmission portion (126), wherein the transmission element (112) is formed when the first layer transmission portion (118) is stacked together with the second layer transmission portion (126).

4. The phased array antenna assembly (100) according to claim 3, wherein the first layer transmission portion (118) includes a ridge portion (138) that defines at least one ridge of a waveguide (134).

5. The phased array antenna assembly (100) according to any of claims 2 to 4, wherein the transmission element (112) includes: an air-filled transverse electromagnetic mode (TEM) or non-TEM line; a stripline; coplanar waveguide; a coaxial line; a rectangular waveguide, a square waveguide, a folded waveguide, or a ridged waveguide.

6. The phased array antenna assembly (100) according to any of claims 1 to 4, wherein the first antenna layer (104) includes a first layer radiating portion (120) and the second antenna layer (106) includes a second layer radiating portion (128), wherein the hollow radiating element (114) is formed when the first layer radiating portion (120) is stacked together with the second layer radiating portion (128).

7. The phased array antenna assembly (100) according to any of claims 1 to 6, wherein the first antenna layer (104) includes at least a first cavity recess (122) and the second antenna layer (106) includes at least a second cavity recess (130), which define at least one integrated circuit cavity (132) which is arranged to house at least one integrated circuit (108).

8. The phased array antenna assembly (100) according to claims 1 to 7, wherein the first antenna layer (104) includes a transition (124) arranged to connect between the at least one hollow radiating element (114) and a terminals of the integrated circuit (108).

9. The phased array antenna assembly (100) according to claim 8, wherein the transition (124) is a suspended beam.

10. The phased array antenna assembly (100) according to any of claims 8 to 9, wherein the transition (124) is galvanic.

11. The phased array antenna assembly (100) according to claim 8 to 9, wherein the transition (124) is non-galvanic.

12. The phased array antenna assembly (100) according to any of claims 1 to 11, wherein the hollow radiating element (114) transmits and receives electromagnetic signals in a transmission direction (146) parallel with an antenna layer plane (116) of the phased array antenna layer (102).

13. The phased array antenna assembly (100) according to any of claims 1 to 12, wherein each of the first antenna layer (104) and the second antenna layer (106) is made from a metallized dielectric material or a metallic material.

14. A stackable phased array antenna layer (102) for a phased array antenna assembly (100) comprising: a first antenna layer (104) mounted on a second antenna layer (106); and an integrated circuit (108) having at least one channel mounted therebetween; and a plurality of hollow radiating elements (114) formed in the phased array antenna layer (102) when the first antenna layer (104) is stacked on the second antenna layer (106); wherein each respective channel of the integrated circuit (108) is connected to a respective hollow radiating element (114).

15. A method of manufacturing a phased array antenna assembly (100) according to any of claim 1 to claim 13 comprising: aligning a plurality of stackable phased array antenna layers (102); connecting a plurality of phased array antenna layers (102) to form a phased array antenna assembly (100).

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