Large image sensor package
EP4762782A1Pending Publication Date: 2026-06-24SPHERE ENTERTAINMENT GROUP LLC
Patent Information
- Authority / Receiving Office
- EP · EP
- Patent Type
- Applications
- Current Assignee / Owner
- SPHERE ENTERTAINMENT GROUP LLC
- Filing Date
- 2023-09-22
- Publication Date
- 2026-06-24
AI Technical Summary
Technical Problem
Large format camera systems face challenges in accommodating differing thermal expansion rates of adjacent components in image sensor packages, which can lead to cracking and compromise signal integrity.
Method used
The image sensor package is designed to mechanically decouple components using gaskets and thermally conductive materials, allowing for differential thermal expansion while preserving signal integrity. Electronic components are strategically placed closer to the image sensor to improve signal transmission and minimize pad contamination.
Benefits of technology
This configuration effectively manages thermal expansion, reduces the risk of component cracking, and enhances signal transmission and integrity in large format camera systems.
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Smart Images
Figure US2023074922_27032025_PF_FP_ABST
Abstract
Disclosed herein is an image sensor package including a printed circuit board, an image sensor electrically coupled to the printed circuit board, a sealing configuration coupled to a front face of the printed circuit board via a first gasket, and a base coupled to a back face of the printed circuit board via a second gasket. Electronic components embedded on the back face of the printed circuit board align with and connect to mating pads surrounding the image sensor on the front face of the printed circuit board. Wire bonds electrically connect the image sensor to the mating pads and the electronic components. The sealing configuration includes a cover attached to a frame surrounding the image sensor. A gap separates the image sensor from abutting the surrounding printed circuit board, which is coupled to the image sensor via the base.
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