Parallel flow heatsink

Abstract

A fluid cooled parallel heatsink including a fluid inlet and outlet and a cooling chamber bound by a lid and a tub. A fluid cooled parallel heatsink further included an intermediate component and a plurality of finds located within the cooling chamber, wherein the intermediate member at least partially separates the cooling chamber into an inlet chamber, a fin chamber wherein the plurality of fins are located, and an outlet chamber. The tub may include an inlet cavity and an outlet cavity, wherein the cavities are shaped so as to generate a uniform flow rate across the plurality of fins.

Description

TSLA.818WO / P2735-1NWO PATENT PARALLEL FLOW HEATSINK CROSS-REFERENCE TO RELATED APPLICATIONS

[0001] This application claims the benefit of U.S. Provisional Application No. 63 / 533,870, filed August 21, 2023, the entire disclosure of which is hereby incorporated by reference in its entirety. TECHNICAL FIELD

[0002] This disclosure relates to a heatsink used to dissipate heat from components. Specifically, this disclosure relates to a parallel flow heatsink used to cool semiconductor components. BACKGROUND

[0003] In the context of heatsinks there is a need to better dissipate heat, and specifically to more uniformly dissipate heat from multiple semiconductor components. A traditional fluid cooled heatsink may be referred to as a series heatsink, wherein fluid flows in a uniform direction within the heatsink such that some semiconductor components will see heated fluid from other upstream semiconductor components. However, traditional heatsinks fail to provide uniform flow or uniform cooling, and as a result have led to system inefficiencies and cost increase. SUMMARY

[0004] The devices, systems, and methods disclosed herein have several features, no single one of which is solely responsible for its desirable attributes. Without limiting the scope as expressed by the claims that follow, its more prominent features will now be discussed briefly. After considering this discussion, and particularly after reading the section entitled “Detailed Description” one will understand how the features of one or more embodiments of the system and methods provide several advantages over traditional systems and methods.

[0005] In some aspects, the techniques described herein relate to a fluid cooled parallel heatsink including: an inlet; an outlet; a lid including a plurality of component mounting locations; a tub connected to the lid, wherein the tub and lid structurally form a cooling chamber; an intermediate member located within the cooling chamber; and a plurality of fins located within the cooling chamber, wherein the intermediate member at least partially separates the cooling chamber into an inlet chamber, a fin chamber wherein the plurality of fins are located, and an outlet chamber; and wherein a fluid flow path flows from the inlet, into the inlet chamber, into the fin chamber, into the outlet chamber, and out the outlet.

[0006] In some aspects, the techniques described herein relate to a fluid cooled parallel heatsink, wherein the plurality of fins are located in between the lid and the intermediate member.

[0007] In some aspects, the techniques described herein relate to a fluid cooled parallel heatsink, wherein the tub includes an interior wall, and wherein the interior wall at least partially defines an inlet cavity and an outlet cavity, wherein the inlet cavity forms at least part of the inlet chamber; and wherein the outlet cavity forms at least part of the outlet chamber.

[0008] In some aspects, the techniques described herein relate to a fluid cooled parallel heatsink, wherein the inlet cavity reduces in volume along a length of the fluid cooled parallel heatsink.

[0009] In some aspects, the techniques described herein relate to a fluid cooled parallel heatsink, wherein the inlet cavity reduces in width along a length of the fluid cooled parallel heatsink.

[0010] In some aspects, the techniques described herein relate to a fluid cooled parallel heatsink, wherein the inlet cavity and the outlet cavity are shaped to create a uniform flow rate across the plurality of fins.

[0011] In some aspects, the techniques described herein relate to a heatsink including: a lid and a tub structurally forming at least in part a cooling chamber; an intermediate member located within the cooling chamber to partially define an inlet chamber, a fin chamber, and an outlet chamber within the cooling chamber; and a plurality of fins disposed within the fin chamber and in contact with the lid, wherein the inlet chamber, the fin chamber, and the outlet chamber are sized and shaped to allow a fluid flowing through the heatsink to uniformly dissipate heat from the plurality of fins.

[0012] In some aspects, the techniques described herein relate to a heatsink, wherein the tub includes a plurality of tub columns located within the cooling chamber, and wherein the plurality of tub columns are configured to guide a flow of the fluid.

[0013] In some aspects, the techniques described herein relate to a heatsink, wherein the lid includes a lid connecting feature and the tub includes a tub connecting feature, wherein the lid connecting feature has a concave shape and the tub connecting feature has a convex shape, and wherein the lid connecting feature and the tub connecting feature are configured to connect the lid and the tub.

[0014] In some aspects, the techniques described herein relate to a heatsink, wherein a first fin of the plurality of fins includes a plurality of dimples configured to connect the first fin to a second fin of the plurality of fins.

[0015] In some aspects, the techniques described herein relate to a heatsink including: a lid; a tub, wherein the lid and the tub structurally form at least in part a cooling chamber; an intermediate member located within the cooling chamber; and a plurality of fins located between the intermediate member and the lid, wherein the plurality of fins are configured to dissipate heat from the lid into a fluid when the fluid flows across the plurality of fins.

[0016] In some aspects, the techniques described herein relate to a heatsink, wherein the lid includes a plurality of mounting locations, wherein the heat is from the plurality of mounting locations, and wherein the heat is dissipated uniformly among the plurality of mounting locations.

[0017] In some aspects, the techniques described herein relate to a heatsink, wherein each of the plurality of mounting locations accommodates a semiconductor device that generates the heat.

[0018] In some aspects, the techniques described herein relate to a heatsink, wherein the tub includes a plurality of tub columns located within the cooling chamber, and wherein the plurality of tub columns are configured to guide a flow of the fluid.

[0019] In some aspects, the techniques described herein relate to a heatsink, wherein the lid includes a lid connecting feature and the tub includes a tub connecting feature, wherein the lid connecting feature has a concave shape and the tub connecting feature has aconvex shape, and wherein the lid connecting feature and the tub connecting feature are configured to connect the lid and the tub.

[0020] In some aspects, the techniques described herein relate to a heatsink, further including a tub-lid braze filler, wherein at least a portion of the tub-lid braze filler is located between the lid connecting feature and the tub connecting feature.

[0021] In some aspects, the techniques described herein relate to a heatsink, wherein a first fin of the plurality of fins includes a plurality of dimples configured to connect the first fin to a second fin of the plurality of fins.

[0022] In some aspects, the techniques described herein relate to a heatsink, wherein the first fin includes a first edge and a second edge, wherein the first edge and the second edge are connected to the intermediate member.

[0023] In some aspects, the techniques described herein relate to a heatsink, wherein the lid, the tub, and the intermediate member at least partially define an inlet chamber, a fin chamber, and an outlet chamber within the cooling chamber, and wherein the plurality of fins are disposed within the fin chamber.

[0024] In some aspects, the techniques described herein relate to a heatsink, further including an inlet and an outlet, wherein the inlet is configured to allow the fluid flowing into the inlet chamber toward the fin chamber and the outlet chamber, and wherein the outlet is configured to allow the fluid flowing out the outlet chamber. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] These and other features, aspects and advantages of the present disclosure are described herein with reference to drawings of preferred embodiments, which are intended to illustrate, and not to limit, the present disclosure.

[0026] FIG. 1 is an exploded perspective view of a parallel heatsink according to an embodiment of the present disclosure.

[0027] FIG.2 is a cross sectional view of the parallel heatsink.

[0028] FIG.3 is a perspective view of a tub of the parallel heatsink.

[0029] FIG.4 is a view of a lid and a plurality of fins of the parallel heatsink.

[0030] FIG. 5 is a view similar to Figure 4 except an intermediate member is disposed over the plurality of fins.

[0031] FIG.6 is an exploded perspective view of the parallel heatsink.

[0032] FIG.7A is a view of the top surface of the lid.

[0033] FIG.7B is a view of the bottom surface of the lid.

[0034] FIG.8A is a view of the top surface of the tub.

[0035] FIG.8B is a view of the bottom surface of the tub.

[0036] FIG. 9A is a detailed view of exemplary components of the parallel heatsink.

[0037] FIG. 9B is a detailed view of exemplary components of the parallel heatsink.

[0038] FIG.10A is a view of the tub-lid braze filler.

[0039] FIG.10B is a cross sectional view of the tub-lid braze filler.

[0040] FIG.11 is a perspective view of the intermediate member.

[0041] FIG.12A is a view of an individual fin piece of the plurality of fins.

[0042] FIG.12B is another view of the individual fin piece of the plurality of fins.

[0043] FIG.12C is an end view of the individual fin piece of the plurality of fins.

[0044] FIG.13A is a view of exemplary components of the parallel heatsink.

[0045] FIG.13B is another view of exemplary components of the parallel heatsink.

[0046] FIG.14A is a view of a traditional heatsink fin.

[0047] FIG.14B is a view of a traditional heatsink fin.

[0048] FIG.15A is a cross section view along the length of the parallel heat sink.

[0049] FIG.15B is an alternative embodiment of the cross-sectional view along the length of the parallel heat sink seen in FIG.15A.

[0050] FIG. 15C is an embodiment of a cross-sectional view of the parallel heatsink.

[0051] FIG. 16A is a top view of semiconductors arranged in two rows on the lid of the parallel heatsink.

[0052] FIG. 16B is a chart demonstrating the uniform heat dissipation across the semiconductors mounted on the parallel heatsink.

[0053] FIG. 16C is a chart demonstrating the non-uniform heat dissipation across the semiconductors mounted on a traditional heatsink.

[0054] FIG.17A is a thermal perspective view of a traditional heatsink design.

[0055] FIG. 17B is a thermal perspective view of another traditional heatsink design.

[0056] FIG. 17C is a thermal perspective view of another traditional heatsink design.

[0057] FIG. 17D is a thermal perspective view of another traditional heatsink design.

[0058] FIG.18 is a thermal view of one embodiment of a parallel heatsink. DETAILED DESCRIPTION

[0059] Generally described, one or more aspects of the present disclosure relate to a heatsink. Specifically, the present disclosure relates to a fluid cooled heatsink configured to cool semiconductor devices associated with an electric vehicle. The heatsink structure and method disclosed herein have general applicability in many products and industries including automotive; boating; aerospace; and robotics. For ease of description, the heatsink and method will be discussed in the context of vehicles, specifically cooling semiconductors within a vehicle. However, the structure of the semiconductor disclosed herein are not limited to vehicles and have applicability in many industries.

[0060] The heatsink disclosed herein is a parallel flow heatsink with a two-layer structure. In certain embodiments, the parallel heatsink includes a lid, a tub, and an intermediate member. The lid can be connected to the tub to form a cooling cavity. The intermediate member is situated inside the cooling cavity and splits the cooling cavity into an inlet cavity and an outlet cavity. It should be understood that the inlet cavity and the outlet cavity are hydraulically connected, and that the intermediate member does not fully separate the inlet cavity from the outlet cavity. As fluid flows into the parallel flow heatsink it enters the inlet cavity. The inlet cavity is configured to provide uniform flow distribution through each of the smaller fin channels it supplies, these may be referred to as microchannels. These smaller fin channels then flow into and are collected by the outlet cavity. Specifically, the outlet cavity can be adjacent to the lid and tub, and the inlet cavity can be adjacent to the tub only.

[0061] FIG. 1 is an exploded view of an embodiment of a parallel heatsink 100, which may also be referred to as a fluid cooled parallel heatsink. The parallel heatsink 100includes at least one inlet 102 and at least one outlet 104. In certain embodiments, the heatsink 100 is reversible in that the at least one inlet 102 can be plumbed as the outlet and the at least one outlet 104 can be plumbed as the inlet.

[0062] In certain embodiments, the parallel heatsink 100 comprises a lid 200, a tub 300, an intermediate member 400, and a plurality of fins 500. In certain embodiments, the lid 200 is connected to the tub 300 to form a sealed cooling chamber 110. In certain embodiments, the intermediate member 400 is located within the cooling chamber 110 between the lid 200 and the tub 300. In certain embodiments, the intermediate member 400 can be parallel or relatively parallel to the lid 200 and / or the tub 300. In certain embodiments, the plurality of fins 500 are located between the intermediate member 400 and the lid 200. The plurality of fins 500 pull heat from the lid 200 and dissipate the heat into the fluid as the fluid flows across the plurality of fins 500. In certain embodiments, the lid 200, the plurality of fins 500, the intermediate member 400, and the tub 300 are all connected. For example, the lid 200, the plurality of fins 500, the intermediate member 400, and the tub 300 can be connected so as to dissipate heat from the lid 200 through the heatsink 100. In certain embodiments, the lid 200, the plurality of fins 500, the intermediate member 400, and the tub 300 may be connected via brazing, welding, or may be formed as one via additive manufacturing.

[0063] The parallel heatsink 100 is designed to withstand the forces of sintering. Sintering is a process that requires a structure to withstand significant compression and heat. In the present embodiment the parallel heatsink 100 is designed to have semiconductors mounted on the lid 200 at a plurality of mounting locations 210 via sintering. Sintering produces a superior thermal connection between a component and the parallel heatsink 100. Further, this thermal connection is more durable. Traditional methods of connection, such as using a grease or paste in combination with screws fail to produce the same results and further have lifetime issues. In addition, traditional structures are not able to withstand the heat and strength demands of sintering.

[0064] FIG. 2 is a cutaway view of the parallel heatsink 100 from FIG. 1. FIG. 2 demonstrates flow in the X and Y direction as indicated by arrows 10. It should be understood that fluid also flows in the Z direction. In certain embodiments, the intermediate member 400 separates the cooling chamber 110 into what can be characterized as three sub cavities, an inlet chamber 120, which may also be referred to as a first cavity, a fin chamber 130, which may bereferred to as a second cavity, and an outlet chamber 140, which may also be referred to as a third cavity. In certain embodiments, the fluid enters the parallel heatsink 100 via the inlet 102 and is configured to flow from the inlet chamber 120, through an intermediate pass-through 125 into the fin chamber 130, into the outlet chamber 140, and out the outlet 104. It should be understood that the inlet chamber 120, the fin chamber 130, and the outlet chamber 140 are not fully separate chambers. The chambers are hydraulically connected such that fluid can flow between them.

[0065] FIG. 3 is a view of the tub 300 of the parallel heatsink 100. FIG. 3 demonstrates flow in the Z direction as indicated by arrows 20. In certain embodiments, the tub 300 can include a plurality of tub columns 304 (Figure 8A). The plurality of tub columns 304 may be configured to guide the flow of fluid within the inlet chamber 120 or may serve a purely structural purpose, specifically to withstand the forces of sintering. The plurality of tub columns 304 may be numbered or sized to accommodate the sinter load requirements associated with sintering the semiconductors onto the lid 200. Further, the plurality of tub columns 304 may be elliptical in shape so as to produce as little pressure drop as possible in the manifolds. The tub 300 can include an inlet cavity 320 and an outlet cavity 340, where the inlet cavity 320 at least partially defines the inlet chamber 120, and the outlet cavity 340 at least partially defines the outlet chamber 140. The inlet cavity 320 can be separated from the outlet cavity 340 by an interior wall 302. The interior wall 302 may further define at least a portion of the inlet cavity 320 and the outlet cavity 340. The inlet cavity 320 can be configured to create a uniform flow rate through the intermediate pass-through 125 (shown in FIG.2) and across the plurality of fins 500 in the fin chamber 130. The inlet cavity 320 can create a uniform flow rate across the plurality of fins 500.

[0066] The inlet cavity 320 can be shaped so as to reduce in volume or width along the length of the parallel heatsink 100. The length of the parallel heatsink 100 may also be referred to as the Z axis. The reduction in volume along the length of the inlet cavity 320 creates an overall reduction in volume of the inlet chamber 120 along the length of the parallel heatsink 100. The reduction in volume allows for a more uniform pressure within the inlet chamber 120. As such the flow rate out of inlet chamber 120 through the intermediate pass- through 125 and across the plurality of fins 500 within the fin chamber 130 is uniform along the length of the parallel heatsink 100. In addition, the increase in volume along the length ofthe outlet chamber 140, driven by the shape of the outlet cavity 340, creates a uniform pressure along the length of the outlet chamber 140. This uniform pressure also creates a uniform flow across the plurality of fins 500 as there is no pressure building back. In certain embodiments, the unique shape of the inlet cavity 320 and the outlet cavity 340 create an optimal uniform flow. It should be understood that a variety of shapes and or interior wall configurations may be used to reduce the volume of the inlet chamber 120 along the length or increase the volume of the outlet chamber 140 along the length. Further, this system may be used in reverse, where the shape would allow for similarly effective heat dissipation. In certain embodiments, the parallel heatsink 100 creates a lower loss in overall pressure compared to traditional heatsink designs.

[0067] FIG. 4 is a view of some components of the parallel heatsink 100. FIG. 4 demonstrates flow in the X direction across the plurality of fins 500 as indicated by arrows 30. The plurality of fins 500 are connected to the lid 200, which is located below the plurality of fins 500 in FIG.4. The tub 300, not shown in FIG.4, would be connected to the visible side of the plurality of fins 500, forcing the fluid to pass through the plurality of fins 500. As the fluid exits the plurality of fins 500 it enters the outlet cavity 340, which at least partially defines the outlet chamber 140.

[0068] FIG. 5 is a view of the components of FIG. 4, with the addition of the intermediate member 400. The intermediate member 400 is connected to the plurality of fins 500 on a fin side 402. Although not shown, the intermediate member 400 is connected to the tub 300 on a tub side 404. FIG. 5 demonstrates flow in the Z direction as indicated by arrow 40. However, it should be understood that the flow may be in other directions such as Y. The fluid exits the fin chamber 130 and enters the outlet chamber 140. Once the fluid is in the outlet chamber 140, the fluid flows out the outlet 104.

[0069] FIG. 6 is an exploded view of an embodiment of a parallel heatsink 100. The parallel heatsink 100 can comprise a lid 200, a tub 300, an intermediate member 400, and a plurality of fins 500. The parallel heatsink 100 may further comprise an inlet port 112 and an outlet port 114. The parallel heatsink may also comprise a first threaded boss 150 and a second threaded boss 152. The components of the parallel heatsink 100 may be connected via brazing, as such the parallel heatsink 100 may comprise brazing components 600. The brazingcomponents 600 can include a tub-lid braze filler 610, a fin-lid braze filler 620, boss braze rings 630, and fitting braze rings 640.

[0070] FIG.7A is a view of an embodiment of the lid 200. In certain embodiments, the lid 200 includes a plurality of mounting locations 210 on a top surface 202 of the lid 200. The plurality of mounting locations 210 are configured for a semiconductor or another components to be mounted to them. The parallel heatsink 100 is configured to dissipate heat from the components.

[0071] FIG. 7B is a view of an embodiment of the lid 200 shown in FIG. 7A. A bottom surface 204 of the lid 200 includes an exterior wall 206. The exterior wall 206 is configured to be connected to an exterior tub wall 306 (shown in FIG. 8A). In certain embodiments, the top surface of the exterior wall 206 includes a lid connecting feature 208. The lid connecting feature 208 is configured to connect the lid 200 to the tub 300, and more specifically the exterior tub wall 306 to the exterior wall 206. In certain embodiments, the lid connecting feature 208 may be a groove or wedge. In certain embodiments, the bottom surface 204 of the lid 200 further includes a fin cavity 230. The fin cavity 230 at least partially defines the fin chamber 130.

[0072] FIG.8A is a view of an embodiment of the tub 300. In certain embodiments, the tub 300 includes the plurality of tub columns 304, the interior wall 302, and the exterior tub wall 306. The tub columns 304 are located on an interior side 308 of the tub 300. The top surface of the tub columns 304 and the top surface of the interior wall 302 are configured to connect to the intermediate member 400. In certain embodiments, they may be connected to the intermediate member 400 via brazing or some other connection type.

[0073] The tub 300 may further include the inlet 102 and the outlet 104. The top surface of the exterior tub wall 306 may further comprise a tub connecting feature 314 (shown in FIG. 9A). The tub connecting feature 314 can be configured to connect the lid 200 to the tub 300, and more specifically the exterior tub wall 306 to the exterior wall 206, and even more specifically the lid connecting feature 208 to the tub connecting feature 314. The tub connecting feature 314 may be a groove or wedge, with the lid connecting feature 208 comprising the opposite.

[0074] FIG.8B is a view of an embodiment of the tub 300 shown in FIG.8A. The tub 300 may comprise a plurality of standoffs 310 located on the exterior side 312 of the tub 300.

[0075] FIG.9A is a detailed view of components of the parallel heatsink 100. The parallel heatsink 100 may comprise a single tub-lid braze filler 610 or a plurality of tub-lid braze fillers 610 as shown in FIG.9A. The lid 200 includes a lid connecting feature 208. In the illustrated embodiment, the lid connecting feature 208 has a concave shape. During the brazing process the tub-lid braze filler 610 melts and forms a pool of material in the lid connecting feature 208. The exterior tub wall 306 of the tub 300 is then inserted into the pool of material, forming a sealed connection. This type of connection may be referred to as a lake brazed connection 800. Lake brazing allows for a strong seal with an ability to accommodate a large tolerance. In certain embodiments, the lake brazed connection 800 can form a seal so long as the tip of the convex shaped exterior tub wall 306 is in contact with the pool of material. As such the range of tolerance this system is able to accommodate is determined by the depth of the concave lid connecting feature 208. FIG. 9B shows the lake brazed connection 800 in the context of the parallel heatsink 100.

[0076] FIG. 10A is an embodiment of the tub-lid braze filler 610. In certain embodiments, the tub-lid braze filler 610 can be shaped to match the geometry of the exterior wall 206 and the exterior tub wall 306. FIG. 10B further shows a cross section of the tub-lid braze filler 610 seen in FIG. 10A. The cross section of the tub-lid braze filler 610 may be shaped so as to fit within the concave portion of the lid connecting feature 208. Further the cross section of the tub-lid braze filler 610 may include a tub holding feature 612. In certain embodiments, the tub holding feature 612 may be a concave feature configured to receive the convex portion of the tub connecting feature 314. The tub holding feature 612 may help to hold, guide, or place the tub 300 during manufacturing, specifically during the brazing process.

[0077] FIG. 11 is an embodiment of the intermediate member 400. In certain embodiments, the intermediate member 400 may be a plate. In certain embodiments, the intermediate member 400 includes a central slot 410. In certain embodiments, the central slot 410 is configured to match that of the interior wall 302, wherein the center slot 410 can form a portion of the outlet chamber 140. The intermediate member 400 may be sized to withstand the forces of sintering. Specifically, the thickness of the intermediate member 400 may bebased on the minimum thickness which is able to distribute the compressive force of sintering between the brazing components 600 and the tub 300, or the plurality of tub columns 304.

[0078] FIGS. 12A, 12B, and 12C illustrate an embodiment of an individual fin piece 510 of the plurality of fins 500. In the present embodiment the individual fin piece 510 includes two fins, however it should be understood that an individual fin piece 510 may contain a single fin or more than two fins. In certain embodiments, these fin pieces can be between .4mm and .6mm, or between .3mm and .7mm, or between .2mm and 1mm. In certain embodiments, the individual fin piece 510 can include a plurality of dimples 520. The plurality of dimples 520 may be produced via half shear stamping. The height of the dimples may determine, or set, the gap between fins. The dimples 520 may be connected, in contact with, or brazed to, an adjacent fin. The connection of the dimples 520 to an adjacent fin piece 510 may serve to strengthen the plurality of fins 500 and the overall parallel heatsink structure. This connection of the plurality of dimples 520 to the individual fin piece 510 may also be considered laterally bracing. Specifically, the dimples 520 may serve to increase the compressive strength of the plurality of fins 500 and or the parallel heatsink 100 when under the load of sintering. The plurality of dimples 520 can also allow for a more efficient transfer of heat from the plurality of fins 500 to the fluid. FIG. 13A and 13B illustrates an additional embodiment of the parallel heatsink 100, and the mounting location of the plurality of fins 500.

[0079] It should further be understood that in certain embodiments the plurality of fins 500 are made up of individual fin pieces 510. Each of these individual fin pieces comprises a first edge 530 and a second edge 540, as seen in FIG. 12C. By having individual fin pieces 510 with edges 530, 540, the plurality of fins 500 are able to handle a higher compressive load, and can thus support sintering of the semiconductors onto the parallel heatsink 100. In certain embodiments, each fin piece 510 creates a butt joint with the intermediate member 400 and the lid 200. As such, either the first edge 530 or the second edge 540 is connected to the intermediate member 400, with the other edge 530, 540 being connected to the intermediate member 400. The first edge 530 and the second edge 540 are sintered to their respective connections. This butt joint connection, in combination with the connection of the plurality of dimples 520 to the adjacent fins 510, creates an incredibly strong structure that is able to withstand the forces associates with the sintering of semiconductors onto the lid 200. FIG.14A and 14B show traditional fin structures used in series heatsinks or parallel heatsinks. It shouldbe understood that structures such as this are unable to withstand the forces of sintering, as the fins would buckle under load.

[0080] FIG. 15A and 15B illustrates cross-sectional views along the Z axis of the parallel heatsink 100. In certain embodiments, the lid 200 is connected to the plurality of fins 500 via brazing. In certain embodiments, the plurality of fins 500 are connected to the intermediate member 400 via brazing. In certain embodiments, the intermediate member 400 is connected to the tub 300 via brazing. The lid 200, the plurality of fins 500, the intermediate member 400, and the tub 300 may all connect to each other via brazing and together may form a compression stack. In certain embodiments, this plurality of components forms a compression stack during manufacturing. In certain embodiments, it should further be understood that the connection between the exterior wall 206 of the lid 200 and the exterior tub wall 306 of the tub 300 is not a part of the compression stack. FIG. 15C shows the central components 160, which may comprise the plurality of fins 500, the intermediate member 400, and / or the plurality of tub columns 304. The lake brazed connection 800 demonstrated in FIGS. 9A and 9B can be used to absorb tolerance and allow for higher compression, and thus better connection between the components and interfaces within the cooling chamber 110. As seen in FIG. 15C, the lake brazed connection 800 between the lid 200 and the tub 300 may form a sealed connection so long as the tub connecting feature 314 extends into the lid connecting feature 208. As such the connection 800 may be able to form a seal with a tolerance of up to 1mm in stack height, or .8mm, or .6mm depending on the embodiment. Although a different type of connection is shown in FIGS.15A and 15B, it should be understood that the lake brazed connection discussed and shown in FIG.15C may be used.

[0081] FIG. 16A is a top view of the semiconductors mounted to the parallel heatsink 100. As shown in FIG.16A, each of an area BL1, an area BL2, an area BL3, an area BL4, an area BH1, an area BH2, an area BH3, an area BH4, an area CL1, an area CL2, an area CL3, an area CL4, an area CH1, an area CH2, an area CH3, an area CH4, an area AL1, an area AL2, an area AL3, an area AL4, an area AH1, an area AH2, an area AH3, and an area AH4 may correspond to one of the plurality of mounting locations 210 on the lid 200. In some embodiments, each of the mounting locations shown in FIG. 16A may accommodate a semiconductor device (e.g., a semiconductor power switch). FIG.16B is a chart demonstrating the uniform heat dissipation across the semiconductors mounted on the parallel heatsink 100.The temperature distribution shown in FIG. 16B is uniform across all of the semiconductor locations. This uniform heat dissipation is in contrast to traditional fluid cooled heatsink design, which is shown in FIG.16C. FIG.16C shows that semiconductors located towards the end of traditional heatsinks run significantly hotter than those towards the beginning of the flow. FIGS. 17A, 17B, 17C, and 17D illustrate embodiments of the thermal properties of traditional fluid cooled heatsinks, like that shown in FIG.16C. As seen in the figures, there is a significant temperature gradient across the traditional heat sinks. As such, performance and efficiency of the system, in this case a vehicle, may be affected. Since the semiconductors or other components can not be evenly cooled, the overall system can be restricted. If the system is not restricted, semiconductors or other components may be more likely to fail when employing traditional heatsinks. FIG. 18 is a thermal view of the currently disclosed parallel heatsink 100. The uniform heat dissipation allows for improvements in performance and efficiency. This may come directly in the form of the semiconductors or could be gained through a reduction in flow rate of the system, and thus provide energy savings.

[0082] The foregoing disclosure is not intended to limit the present disclosure to the precise forms or particular fields of use disclosed. As such, it is contemplated that various alternate embodiments and / or modifications to the present disclosure, whether explicitly described or implied herein, are possible in light of the disclosure. Having thus described embodiments of the present disclosure, a person of ordinary skill in the art will recognize that changes may be made in form and detail without departing from the scope of the present disclosure. Thus, the present disclosure is limited only by the claims.

[0083] In the foregoing specification, the disclosure has been described with reference to specific embodiments. However, as one skilled in the art will appreciate, various embodiments disclosed herein can be modified or otherwise implemented in various other ways without departing from the spirit and scope of the disclosure. Accordingly, this description is to be considered as illustrative and is for the purpose of teaching those skilled in the art the manner of making and using various embodiments of the disclosed parallel heatsink. It is to be understood that the forms of disclosure herein shown and described are to be taken as representative embodiments. Equivalent elements, materials, processes or steps may be substituted for those representatively illustrated and described herein. Moreover, certain features of the disclosure may be utilized independently of the use of other features, all aswould be apparent to one skilled in the art after having the benefit of this description of the disclosure. Expressions such as "including", "comprising", "incorporating", "consisting of", "have", "is" used to describe and claim the present disclosure are intended to be construed in a non-exclusive manner, namely allowing for items, components or elements not explicitly described also to be present. Reference to the singular is also to be construed to relate to the plural.

[0084] Further, various embodiments disclosed herein are to be taken in the illustrative and explanatory sense, and should in no way be construed as limiting of the present disclosure. All joinder references (e.g., attached, affixed, coupled, connected, and the like) are only used to aid the reader's understanding of the present disclosure, and may not create limitations, particularly as to the position, orientation, or use of the systems and / or methods disclosed herein. Therefore, joinder references, if any, are to be construed broadly. Moreover, such joinder references do not necessarily infer that two elements are directly connected to each other. Additionally, all numerical terms, such as, but not limited to, "first", "second", "third", "primary", "secondary", "main" or any other ordinary and / or numerical terms, should also be taken only as identifiers, to assist the reader's understanding of the various elements, embodiments, variations and / or modifications of the present disclosure, and may not create any limitations, particularly as to the order, or preference, of any element, embodiment, variation and / or modification relative to, or over, another element, embodiment, variation and / or modification.

[0085] It will also be appreciated that one or more of the elements depicted in the drawings / figures can also be implemented in a more separated or integrated manner, or even removed or rendered as inoperable in certain cases, as is useful in accordance with a particular application.

Claims

WHAT IS CLAIMED IS:

1. A fluid cooled parallel heatsink comprising: an inlet; an outlet; a lid comprising a plurality of component mounting locations; a tub connected to the lid, wherein the tub and the lid structurally form a cooling chamber; an intermediate member located within the cooling chamber; and a plurality of fins located within the cooling chamber, wherein the intermediate member at least partially separates the cooling chamber into an inlet chamber, a fin chamber wherein the plurality of fins are located, and an outlet chamber; and wherein a fluid flow path flows from the inlet, into the inlet chamber, into the fin chamber, into the outlet chamber, and out the outlet.

2. The fluid cooled parallel heatsink of claim 1, wherein the plurality of fins are located in between the lid and the intermediate member.

3. The fluid cooled parallel heatsink of claim 1, wherein the tub comprises an interior wall, and wherein the interior wall at least partially defines an inlet cavity and an outlet cavity, wherein the inlet cavity forms at least part of the inlet chamber; and wherein the outlet cavity forms at least part of the outlet chamber.

4. The fluid cooled parallel heatsink of claim 3, wherein the inlet cavity reduces in volume along a length of the fluid cooled parallel heatsink.

5. The fluid cooled parallel heatsink of claim 3, wherein the inlet cavity reduces in width along a length of the fluid cooled parallel heatsink.

6. The fluid cooled parallel heatsink of claim 3, wherein the inlet cavity and the outlet cavity are shaped to create a uniform flow rate across the plurality of fins.

7. A heatsink comprising: a lid and a tub structurally forming at least in part a cooling chamber;an intermediate member located within the cooling chamber to partially define an inlet chamber, a fin chamber, and an outlet chamber within the cooling chamber; and a plurality of fins disposed within the fin chamber and in contact with the lid, wherein the inlet chamber, the fin chamber, and the outlet chamber are sized and shaped to allow a flow of fluid through the heatsink to uniformly dissipate heat from the plurality of fins.

8. The heatsink of claim 7, further comprising a plurality of tub columns located within the cooling chamber, and wherein the plurality of tub columns are configured to structurally support a load from sintering.

9. The heatsink of claim 7, wherein the lid comprises a first connecting feature and the tub comprises a second connecting feature, wherein the first connecting feature has a first curved shape and the second connecting feature has a second curved shape different than the first curved shape, and wherein the first connecting feature and the second connecting feature are configured to connect the lid and the tub during assembly.

10. The heatsink of claim 7, wherein a first fin of the plurality of fins comprises a plurality of dimples configured to connect the first fin to a second fin of the plurality of fins.

11. A heatsink comprising: a lid; a tub, wherein the lid and the tub structurally form at least in part a cooling chamber; an intermediate member located within the cooling chamber; and a plurality of fins located between the intermediate member and the lid, wherein the plurality of fins are configured to dissipate heat from the lid into a fluid when the fluid flows across the plurality of fins.

12. The heatsink of claim 11, wherein the lid comprises a plurality of mounting locations, wherein the heat is from the plurality of mounting locations, and wherein the heat is dissipated uniformly among the plurality of mounting locations.

13. The heatsink of claim 12, wherein each of the plurality of mounting locations accommodates a semiconductor device that generates the heat.

14. The heatsink of claim 11, wherein the tub comprises a plurality of columns located within the cooling chamber, and wherein the plurality of columns are configured to structurally support a load from sintering.

15. The heatsink of claim 11, wherein the lid comprises a first connecting feature and the tub comprises a second connecting feature, wherein the first connecting feature has a first curved shape and the second connecting feature has a second curved shape different than the first curved shape, and wherein the first connecting feature and the second connecting feature are configured to connect the lid and the tub during assembly.

16. The heatsink of claim 15, further comprising a braze filler, wherein at least a portion of the braze filler is located between the first connecting feature and the second connecting feature.

17. The heatsink of claim 11, wherein a first fin of the plurality of fins comprises a plurality of dimples configured to connect the first fin to a second fin of the plurality of fins.

18. The heatsink of claim 17, wherein the first fin comprises a first edge and a second edge, and wherein the first edge and the second edge are connected to the intermediate member.

19. The heatsink of claim 11, wherein the lid, the tub, and the intermediate member at least partially define an inlet chamber, a fin chamber, and an outlet chamber within the cooling chamber, and wherein the plurality of fins are disposed within the fin chamber.

20. The heatsink of claim 19, further comprising an inlet and an outlet, wherein the inlet is configured to allow the fluid flowing into the inlet chamber to flow toward the fin chamber and the outlet chamber, and wherein the outlet is configured to allow the fluid to flow out the outlet chamber.

Images