Method for manufacturing a smart card.
The method of winding and folding copper wire into coils with precise cavity machining addresses the challenge of establishing reliable electrical connections between smart card modules, ensuring effective power and data transfer.
Patent Information
- Authority / Receiving Office
- FR · FR
- Patent Type
- Patents
- Current Assignee / Owner
- SMART PACKAGING SOLUTIONS SPS
- Filing Date
- 2024-06-20
- Publication Date
- 2026-06-26
AI Technical Summary
Existing smart card manufacturing methods face challenges in establishing reliable electrical connections between multiple modules, particularly when a contact plate of the first module needs to be in electrical contact with two contact plates of the second module, due to the use of discontinuous copper wires.
A method involving the use of a sheathed copper wire that is locally wound and folded into coils to form contact pads, with specific cavities machined to expose and connect contact plates, ensuring electrical contact between modules, including wider and less deep cavities to maintain connections.
Ensures reliable electrical connections between modules, meeting modern technical constraints by maintaining connections despite machining, allowing proper power supply and data transfer between modules.
Smart Images
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Abstract
Description
Title of the invention: Method for manufacturing a smart card.
[0001] The present invention relates to the field of manufacturing smart cards, hereinafter referred to as "card" for brevity.
[0002] In principle, a smart card includes a chip, or module, which is integrated into a card body.
[0003] To meet current needs, particularly security needs, we have seen more and more cards appearing recently comprising two modules, for example a first module which is a secure element for banking transactions and a second module which is a biometric sensor.
[0004] This example is not limiting, and the present invention relates to any application other than banking and any module other than biometric. However, for the sake of brevity, this will be the only example described below.
[0005] Each module comprises a plurality of respective contact plates, independent, i.e. electrically isolated from each other.
[0006] For the proper functioning of the card, it is necessary to establish an electrical connection between the first module and the second module, that is to say between a contact plate of the first module and a contact plate of the second module, by means of a copper wire, typically of several tens of pm of equivalent diameter, and for example between 80pm and 120 pm.
[0007] In this context, those skilled in the art are familiar with the prior art document WO2023209056, which describes machining a card holder in two regions, each region being machined according to two respective profiles (width and depth). Thus, machining to a first depth exposes the copper wire, and machining to a second, deeper depth cuts the copper wire.
[0008] In this document WO2023209056, in a conventional manner, each contact pad of the second module, which is biometric, is in electrical contact with one and only one respective contact pad of the first module. Conversely, for the first module: one contact pad of the first module is in electrical contact with another contact pad of the same first module, the copper wire between these two contact pads following a pattern constituting a communication antenna, typically in the so-called ID-1 format, which allows the first module to be electrically powered when the card is placed within the field of view of a contactless reader.
[0009] In this document WO2023209056, it is also noted that the copper wire is discontinuous, that is to say that the card actually comprises a plurality of copper wires, which poses manufacturing problems.
[0010] The present invention aims to improve this state of the art.
[0011] In particular, as described later, the present invention makes it possible to to address a recent problem in which a contact plate of the first module must be in electrical contact with two contact plates of the second module.
[0012] More specifically, according to a first of its objects, the invention relates to a method for manufacturing a smart card (100) comprising a communication antenna (110) and intended to receive at least a first module and a second module electrically connected to the first module, each module comprising a set of contact pads whose position is known, the method comprising steps consisting of: - Place a sheathed copper wire (120) on a support (130), the copper wire (120) being locally wound on itself to form the communication antenna (110), and locally folded on itself into coils to form a set of contact pads in a first region (RI) intended to receive the first module, and in a second region (R2) intended to receive the second module, the contact pads of the first region (RI), respectively of the second region (R2), being intended to be in electrical contact with the contact plates of the first module, respectively of the second module.
[0013] It is essentially characterized in that it further comprises: - Machine a second cavity (P2) in the first region (RI), respectively a cavity (P2) in the second region (R2), so as to locally cut the copper wire (120) for at least one contact pad of said cavity; - to machine a first cavity (PI) in the first region (RI), respectively a first cavity (PI) in the second region (R2), so as to locally abrade the sheath of the copper wire (120) for at least one contact pad of said first cavity (PI) and locally expose the copper wire (120) of all or part of said contact pad, allowing electrical contact with a corresponding contact plate of the first module, respectively of the second module; the first cavity (PI) being wider and less deep than the second cavity (P2);
[0015] prior to machining the first cavity (PI) or the second cavity (P2), for at least one of the first region (RI) or the second region (R2), it further comprises: - for at least one first contact pad (8) of said region (R2, RI), electrically connect said first contact pad (8) directly to: • a second contact pad (9) in the same region (R2, RI) via the copper wire (120) which passes only through the outside of the first cavity (PI), and • a first contact pad (7) of the other region (RI, R2) by the copper wire (120) which passes only through the outside of the first cavity (PI), • so that after machining the second cavity (P2) in said region (R2, RI), the first contact pad (8) and the second contact pad (9) of said region (R2, RI) can then be equipotential with said first contact pad (7) of the other region (RI, R2).
[0016] It can be provided that prior to machining the first cavity (PI) or the second cavity (P2), said second contact pad (9) of the second region (R2) is electrically connected to a third contact pad (10) of the second region (R2) by the copper wire (120) which passes through the inside of the second cavity (P2), so as to be cut during the machining of the second cavity (P2); said third contact pad (10) of the second region (R2) being able to be electrically connected to a second contact pad (11) of the first region (RI) by the copper wire (120) which passes through the outside of the second cavity (P2).
[0017]
[0018] It can be foreseen that for at least one of the first region (RI) and the second region (R2), the copper wire (120) is locally folded back on itself in coils to form a set of contact pads (1-11, 31-34, 41) such that each contact pad is intended to be in electrical contact with a corresponding respective contact plate of the first module or the second module.
[0019] According to another of its objects, the invention also relates to a method for manufacturing a smart card (100) comprising a communication antenna (110) and intended to receive at least a first module and a second module electrically connected to the first module, comprising steps consisting of: - Place a sheathed copper wire (120) onto a support (130), the copper wire (120) being locally wound around itself to form the communication antenna (110), and locally folded back on itself into coils to form a set of contact pads in a first region (RI) intended for to receive the first module, and in a second region (R2) intended to receive the second module, each contact pad of the first region (RI), respectively of the second region (R2), being intended to be in electrical contact with a corresponding contact pad of the first module, respectively of the second module, whose position is known.
[0020] It is essentially characterized in that it further comprises: - Machine a second cavity (P2) in the first region (RI), respectively a second cavity (P2) in the second region (R2), so as to locally cut the copper wire (120) for at least one contact pad of said cavity; - to machine a first cavity (PI) in the first region (RI), respectively a first cavity (PI) in the second region (R2), so as to locally abrade the sheath of at least one contact pad of said cavity (PI) and locally expose the copper wire (120) of all or part of said contact pad, allowing electrical contact with a corresponding contact plate of the first module, respectively of the second module; the first cavity (PI) being wider and less deep than the second cavity (P2); - in which, prior to machining the first cavity (PI) or the second cavity (P2), the coils of at least one first contact pad of the first region (RI), respectively of the second region (R2), are inscribed in a predetermined shape which covers the position of at least two corresponding contact pads of the first module, respectively of the second module, so that at least said contact pad is intended to be in electrical contact with two adjacent corresponding contact pads of the first module or the second module.
[0021]
[0022] It can be foreseen that said serpentines will fit into a polygonal shape.
[0023]
[0024] It can be foreseen that said serpentines will fit into a shape which locally follows the shape of the periphery of the first cavity (PI) or of the second cavity (P2).
[0025]
[0026] It can be foreseen that said coils are in an L, C or U shape, so that at least said contact pad is intended to be in electrical contact with at least two corresponding adjacent contact plates of the first module or the second module.
[0027]
[0028] Preferably, the sheathed copper wire (120) is single and continuous.
[0029]
[0030] According to another of its objects, the invention relates to a smart card (100) comprising: - A support (130); - a communication antenna (110) placed on the support (130); - at least one first module and a second module electrically connected to the first module; - a copper wire (120); - in which the copper wire (120) is locally wound upon itself to form the communication antenna (110), and locally folded upon itself into coils to form a set of contact pads in a first region (RI) receiving the first module, and in a second region (R2) receiving the second module, each contact pad of the first region (RI), respectively of the second region (R2), being in electrical contact with a corresponding contact plate of the first module, respectively of the second module, whose position is known.
[0031] It is essentially characterized in that it further comprises: - a second cavity (P2) in the region (RI), respectively a second cavity (P2) in the second region (R2); - a first cavity (PI) in the first region (RI), respectively a first cavity (PI) in the second region (R2), in which, for all or part of the contact pads, the sheath of at least one contact pad of said cavity is locally abraded and the copper wire (120) locally exposed, allowing electrical contact with a corresponding contact plate of the first module, respectively of the second module; the first cavity (PI) being wider and less deep than the second cavity (P2); - in which, for at least one of the first region (RI) or the second region (R2): - at least one first contact pad (8) of said region (R2, RI) is electrically connected directly to: - a second contact pad (9) in the same region (R2, RI) via the copper wire (120) which passes only through the outside of the first cavity (PI), and - a first contact pad (7) of the other region (RI, R2) by the copper wire (120) which passes only through the outside of the first cavity (PI), - so that after machining of the second cavity (P2) in said region (R2, RI), the first contact pad (8) and the second contact pad (9) of said region (R2, RI) are at equipotential with said first contact point (7) of the other region (RI, R2).
[0032]
[0033] According to another of its objects, the invention relates to a smart card (100) comprising: - A support (130); - a communication antenna (110) placed on the support (130); - at least one first module and a second module electrically connected to the first module; - a copper wire (120); - in which the copper wire (120) is locally wound upon itself to form the communication antenna (110), and locally folded upon itself into coils to form a set of contact pads in a first region (RI) receiving the first module, and in a second region (R2) receiving the second module, each contact pad of the first region (RI), respectively of the second region (R2), being in electrical contact with a corresponding contact plate of the first module, respectively of the second module, the position of which is known;
[0034] It is essentially characterized in that it further comprises: - a second cavity (P2) in the first region (RI), respectively a second cavity (P2) in the second region (R2); - a first cavity (PI) in the first region (RI), respectively a first cavity (PI) in the second region (R2), in which, for all or part of the contact pads, the sheath of at least one contact pad of said cavity is locally abraded and the copper wire (120) locally exposed, allowing electrical contact with a corresponding contact plate of the first module, respectively of the second module; the first cavity (PI) being wider and less deep than the second cavity (P2); - in which the coils of at least one first contact pad of the region (RI), respectively (R2), are inscribed in a shape which covers the position of at least two corresponding contact pads of the first module, respectively of the second module, so that at least one contact pad is intended to be in electrical contact with two adjacent corresponding contact pads of the first module or the second module.
[0035] Other features and advantages of the present invention will become more apparent from the following description given by way of illustrative and non-limiting example and made with reference to the accompanying figures.
[0036] [Fig. 1] illustrates an embodiment of a smart card according to the invention, before machining,
[0037] [Fig. 2] illustrates the smart card of [Fig. 1], after machining of the second cavity in the second region.
[0038] [Fig.3A] illustrates another embodiment of contact pads for a smart card according to the invention,
[0039] [Fig.3B] illustrates [Fig.3A] on which the positions of the contact plates of the corresponding module are superimposed,
[0040] [Fig.3C] illustrates [Fig.3B] after machining of the second cavity,
[0041] [Fig.4] illustrates another embodiment of contact pads on a smart card according to the invention and the contact plates of the corresponding module,
[0042] [Fig. 5A] illustrates in cross-section an embodiment of a smart card according to the invention,
[0043] [Fig.5B] illustrates the machining of a PI cavity in the smart card of [Fig.5A],
[0044] [Fig.5C] illustrates the machining of a cavity P2 in the smart card of [Fig.5B]. Detailed description
[0045] The notions of "first" and "second", attributed to the regions, modules, sides, cavities, etc. according to the invention, are interchangeable, contrary to the prior art document WO2023209056.
[0046] However, for the sake of clarity and conciseness of the present description, in a non-limiting example, the first region RI is defined as relating to a first module, for example a secure element, and the second region R2 as relating to a second module, for example a biometric sensor.
[0047] We therefore hear indistinctly “first cavity PI” and “cavity PI”, as well as “second cavity P2” and “cavity P2”.
[0048] In a known manner, a card includes a support 130. The support 130 can be plastic-based but also bio-based, for example wood-based, or cellulosic or synthetic paper-based, in particular Teslin (registered trademark).
[0049] The card includes a sheathed copper wire 120 which is placed on the support 130. A winding of this copper wire 120 allows to form a communication antenna 110 on the support 130.
[0050] The copper wire 120 is also locally folded back on itself into coils to form a set of contact pads.
[0051] The map also includes at least a first module (not shown), located in a first region RI, and a second module (not shown), located in a second region R2 of the map.
[0052] The second module is electrically connected to the first module by means of copper wire 120, via contact pads. Indeed, each module comprises a plurality of contact pads.
[0053] In the literature, a contact pad of a module may also be called a contact stud. However, for the sake of readability in this description, the term "pad" is associated with a module, and the term "stud" is associated with the card support 130.
[0054] A contact plate of a module is electrically connected (either directly galvanically or via a conductive adhesive) to a contact pad. Thus, an electric current can pass from a contact plate of one module to a contact plate of the other module via two corresponding contact pads, the two contact pads being connected to each other by the copper wire 120.
[0055] The position of the first region RI and the second region R2 on the support 130 is known. It is represented by dotted lines in particular on [Fig.1] and on [Fig.2].
[0056] Similarly, the position of the contact plates of each module is known.
[0057] Regardless of the position of the first region RI and the second region R2, the position of the contact pads is therefore known.
[0058] It is therefore a matter, for a card manufacturer, of positioning the contact pads in such a way as to ensure the electrical operation of the modules, and therefore the operation of the card.
[0059] For this purpose, it is planned to machine the first region RI, and the second region R2 of the card, in order to be able to insert the first and second modules respectively.
[0060] As illustrated in [Fig. 5B], the card body is machined to create a first cavity PI in the RL region. And as illustrated in [Fig. 5C], the card body is machined to create a second cavity P2 in the RL region.
[0061] By convention, the suffix "_R1" is assigned to the first region RI and the suffix "_R2" to the second region R2.
[0062] The first cavity P1_R1 for the first RI region is wider and less deep than the second cavity P2_R1 for the first RL region
[0063] The same can be done for the second region R2.
[0064] Machining the first cavity PI allows the copper wire 120 to be locally exposed for all or part of the contact pads. In this case, the sheath of said contact pad is locally abraded, as illustrated in [Fig. 5B], which subsequently allows electrical contact with a corresponding contact plate of the first module.
[0065] In [Fig. 5A], a contact pad 8 of the second region R2 is shown, in which the copper wire 120 is folded back on itself 4 times in a serpentine fashion. As illustrated in [Fig. 5B], machining the first cavity PI allows the copper wire 120 to be locally exposed, in this case on 2 folds of the copper wire 120.
[0066] Machining the second cavity P2 allows, for all or part of the contact pads, to locally cut the copper wire 120.
[0067] As illustrated in [Fig. 5C], machining the second cavity P2 allows the copper wire 120 to be cut on serpentine folds. In [Fig. 5C], compared to [Fig. 5B], the cutting of a fold of the copper wire 120 is shown.
[0068] The second cavity P2 can be machined after the machining of the first cavity PL
[0069] It should be noted, however, that the machining order can be reversed: one can start by machining the second cavity P2 and then machine the first cavity PL
[0070] As explained below, the present invention makes it possible to ensure that at least two contact plates of a module of a cavity are at equipotentiality, which makes it possible to meet very recent technical constraints.
[0071] To this end, the present invention proposes several embodiments, which aim to deposit the copper wire 120 according to a clever design, whether in the way the contact pads are connected to each other, as well as in the local folds of the copper wire 120 on itself in serpentines to form a set of contact pads.
[0072] Preferably, regardless of the embodiment, the 120 copper wire is a single, continuous wire. This configuration has the advantage of not requiring repositioning of the board when depositing the 120 copper wire, but increases design constraints compared to solutions that include multiple copper wires.
[0073] Indeed, we have seen that machining the second cavity P2 allows, for all or part of the contact pads, to locally cut the copper wire 120. With a single copper wire 120, it is therefore necessary to define a clever design which allows, despite the machining and the local cutting of the copper wire 120, to ensure the correct power supply to the corresponding module.
[0074] A first embodiment of a map according to the invention in top view is illustrated in [Fig.1] and [Fig.2].
[0075] In this first embodiment, the design with the copper wire 120 essentially focuses on the electrical connections between contact pads, that is to say on how the contact pads of the same region are connected to each other, and in particular two by two, as well as how a contact pad of one region is connected to another contact pad of another region.
[0076] To electrically connect two contact pads in the same region: - if the copper wire 120 passes through the area in which the second cavity P2 will be machined, then the copper wire 120 will be cut during the machining of the second cavity P2; - If the 120 copper wire passes outside the area where the second cavity P2 will be machined, then the 120 copper wire will not be cut during the machining of the second cavity P2. In this case: • if the copper wire 120 passes through the area in which the first cavity PI will be machined, then the copper wire 120 will be abraded during the machining of the first cavity PI, as illustrated in Figure 5B; and • if the 120 copper wire passes outside the area in which the first PI cavity will be machined, then the 120 copper wire will remain intact during the machining of the first PI cavity.
[0077] To electrically connect a contact pad in one region to a contact pad in another region, the copper wire 120 must pass outside the area in which the first cavity PI will be machined and a fortiori outside the area in which the second cavity P2 will be machined.
[0078] For example, [Fig.1] illustrates a first region comprising six contact pads: pads 1, 2, 3, 6, 7 and 11; and a second region comprising five contact pads 4, 5, 8, 9 and 10.
[0079] The number of plots per region and their position is purely illustrative and may vary.
[0080] In [Fig. 1], the plot 1 of the first region includes one end of the copper wire 120. It is connected to plot 2 of the first region, in this case by the periphery of the card, in a winding on itself, comprising in this illustrative example three turns, to form a communication antenna 110.
[0081] Pitch 2 of the first region RI is directly connected to pitch 3 of the first region by the second cavity P2_R1. This short-circuit electrical connection will be broken during the machining of the second cavity P2_R1, so that pitch 2 and pitch 3 will no longer be short-circuited during the machining of the second cavity P2_R1.
[0082] The pin 3 of the first region RI is connected to the pin 4 of the second region R2 by the outside of the first cavity P1_R1 of the first region RI and by the outside of the first cavity P1_R2 of the second region R2. Thus, machining the first cavity and the second cavity in either region leaves this wire intact, allowing subsequent data or energy transfer between these two regions, and therefore between the two modules.
[0083] The pad 4 of the second region R2 is directly connected to the pad 5 by the second cavity P2_R2. This short-circuit electrical connection will be broken during the machining of the second cavity, so the pad 4 and the pad 5 will no longer be short-circuited during the machining of the second cavity P2_R2 of the second region R2.
[0084] Plot 5 of the second region R2 is connected to plot 6 of the first region RI via the outside of the first cavity P1_R2 of the second region R2 and via the outside of the first cavity P1_R1 of the first region RI. Thus machining the first cavity and the second cavity in both regions leaves this wire intact, allowing subsequent data or energy transfer between these two regions, therefore between the two modules.
[0085] The pin 6 of the first region is directly connected to the pin 7 of the first RI region by the second cavity P2_R1 of the first RI region. This short-circuit electrical connection will be broken during the machining of the second cavity, so that the pin 6 and the pin 7 will no longer be short-circuited during the machining of the second cavity P2_R1 of the first RI region.
[0086] Pin 7 of the first region RI is connected to pin 8 of the second region R2 via the outside of the first cavity P1_R1 of the first region RI and via the outside of the first cavity P1_R2 of the second region R2. Thus, machining the first cavity and the second cavity in either region leaves this wire intact, allowing subsequent data or energy transfer between these two regions, and therefore between the two modules.
[0087] The pad 8 of the second region R2 is connected to the pad 9 of the second region R2 by the outside of the first cavity P1_R2 of the second region R2. Thus, machining the first cavity and the second cavity in this region leaves this wire intact, allowing these two contact pads 8 and 9 to be at the same potential.
[0088] In contrast, pin 9 of the second region R2 is directly connected to pin 10 of the second region R2 through the inside of the second cavity P2_R2 of the second region R2. This short-circuit electrical connection will be broken during the machining of the second cavity P2_R2. Thus, pin 9 and pin 10 will no longer be short-circuited during the machining of the second cavity P2_R2 of the second region R2.
[0089] Finally, the pin 10 of the second region R2 is connected to the pin 11 of the first region RI by the outside of the first cavity P1_R2 of the second region R2 and by the outside of the first cavity P1_R1 of the first region RL Thus the machining of the first cavity and the second cavity in both regions leaves this wire intact, allowing a further transfer of data or energy between these two regions, therefore between the two modules.
[0090] The result of machining the second cavity P2 of the second region R2 of the map in [Fig.1] is illustrated in [Fig.2].
[0091] Machining the second cavity P2 allows the electrical connections to be cut when the copper wire 120 passes through this cavity.
[0092] In this [Fig. 2], pin 9 remains connected to pin 8 but is no longer connected to pin 10. Pin 10 is now connected only to pin 11 of the first RL region. Similarly, pin 4 of the second R2 region is now connected only to pin 3 of the first RI region, and pin 5 of the second R2 region is now connected only to pin 6 of the first RL region.
[0093] Thus in this example, the pads 8 and 9 of the second region are, after machining of the cavities, at the equipotential with the pad 3 of the first region, after inset in this case.
[0094] Thanks to the present invention, the choice of the design of the electrical connections between contact pads in the same region makes it possible to determine whether two contact pads will remain electrically connected after machining of the second cavity P2 or not:
[0095] - if the copper wire 120 passes through the position of the second cavity P2 to connect electrically, two contact pads, especially in the same region, will be severed by machining the second cavity P2.
[0096] - if the copper wire 120 passes out of the position of the second cavity P2, and in Specifically, the first cavity P1 is machined externally to electrically connect two contact pads, so machining the second cavity P2 will not break this connection. Thanks to this configuration, these two pads can be at equipotential once the module is inserted.
[0097] A first variant of a second embodiment of a map according to the invention is partially illustrated in top view in [Fig.3A] and [Fig.3B], in which the central cross is only a graphic locating symbol, and [Fig.3C].
[0098] In [Fig.3A], four contact pads of the second region are shown, before machining of the second cavity.
[0099] In [Fig.3B], the position of the contact plates of the second corresponding module is shown in dotted lines relative to [Fig.3A].
[0100] On [Fig.3C], the second region of [Fig.3B] is shown after machining of the second cavity P2_R2, with the position of the contact plates of the corresponding second module shown in dotted lines.
[0101] It is clear that thanks to the shape of the coils of the contact pad 32, the contact plates PC1_M2 and PC5_M2 are at equipotentiality with the contact pad 32.
[0102] For this purpose, the coil is locally inscribed in a predetermined shape which covers the position of at least two corresponding contact plates of the module.
[0103] For example the predetermined shape is a polygon, and in this case a trapezoid.
[0104] Thus, the contact pad corresponding to the shape of said coil, here the contact pad 32, can be in electrical contact with at least two corresponding contact plates, in this case adjacent, of the module, here the contact plates PC1_M2 and PC5_M2.
[0105] As with the first embodiment, one can directly connect a contact pad to another contact pad by passing the copper wire 120 through the area in which the second cavity P2 will be machined, then the copper wire 120 will be cut during the machining of the second cavity.
[0106] In [Fig.3B], the contact pads 31 and 32 are directly connected by the area in which the second cavity P2 will be machined, and likewise for the contact pads 32 and 34, and this connection is cut by the machining of the second cavity P2, as illustrated in [Fig.3C].
[0107] A second variant of the second embodiment is illustrated in [Fig.4], in which a second region is partially represented with a single illustrated contact pad 41 and the contact pads PC1_M2, PC2_M2, PC3_M2, PC4_M2, PC5_M2 of a corresponding second module.
[0108] In this variant, the coils of at least one contact pad, in this case contact pad 41, are inscribed in a shape which locally follows the shape of the periphery of the cavity, in this case cavity P2_R2.
[0109] In [Fig.4], an L-shaped form has been illustrated, so the contact plates PC1_M2 and PC5_M2, which are adjacent, are at equipotentiality.
[0110] It is also possible to provide in C or in U, so as to electrically connect a plurality of contact plates, in this case adjacent two by two.
[0111] Of course, the first and second embodiments can be combined.
[0112] Nomenclature
[0113] 1, 2, 3, 6, 7, 11: contact points of a first region
[0114] 4, 5, 8, 9, 10: contact points of a second region
[0115] 31, 32, 33, 34: contact points of a second region
[0116] 41: contact plot of a second region
[0117] 100 smart card 100
[0118] 110 antenna 110
[0119] 120 copper wire 120
[0120] 130 support 130
[0121] RI first region
[0122] R2 second region
[0123] PI first cavity
[0124] P2 second cavity
[0125] P1_R1 first cavity of the first region
[0126] P2_R1 second cavity of the first region
[0127] P1_R2 first cavity of the second region
[0128] P2_R2 second cavity of the second region
[0129] PC1_M2, PC2_M2, PC3_M2, PC4_M2, PC5_M2 location of the pads contact of a module
Claims
1. Demands A method for manufacturing a smart card (100) comprising a communication antenna (110) and intended to receive at least one first module and a second module electrically connected to the first module, each module comprising a set of contact pads whose position is known, the method comprising steps consisting of: - Place a sheathed copper wire (120) on a support (130), the copper wire (120) being locally wound on itself to form the communication antenna (110), and locally folded on itself into coils to form a set of contact pads in a first region (RI) intended to receive the first module, and in a second region (R2) intended to receive the second module, the contact pads of the first region (RI), respectively of the second region (R2), being intended to be in electrical contact with the contact plates of the first module, respectively of the second module; Characterized by the fact that it further comprises: - Machine a second cavity (P2) in the first region (RI), respectively a cavity (P2) in the second region (R2), so as to locally cut the copper wire (120) for at least one contact pad of said cavity; - to machine a first cavity (PI) in the first region (RI), respectively a first cavity (PI) in the second region (R2), so as to locally abrade the sheath of the copper wire (120) for at least one contact pad of said first cavity (PI) and locally expose the copper wire (120) of all or part of said contact pad, allowing electrical contact with a corresponding contact plate of the first module, respectively of the second module; the first cavity (PI) being wider and less deep than the second cavity (P2); And Prior to machining the first cavity (PI) or the second cavity (P2), for at least one of the first region (RI) or the second region (R2), it further comprises: - for at least one first contact pad (8) of said region (R2, RI), electrically connecting said first contact pad (8) directly to: • a second contact pad (9) of the same region (R2, RI) by the copper wire (120) which passes only through the outside of the first cavity (PI), and • a first contact pad (7) of the other region (RI, R2) by the copper wire (120) which passes only through the outside of the first cavity (PI), • so that after machining the second cavity (P2) in said region (R2, RI), the first contact pad (8) and the second contact pad (9) of said region (R2, RI) can then be equipotential with said first contact pad (7) from the other region (RI, R2).
2. A method according to claim 1, wherein, prior to machining the first cavity (PI) or the second cavity (P2), said second contact pad (9) of the second region (R2) is electrically connected to a third contact pad (10) of the second region (R2) by the copper wire (120) which passes through the inside of the second cavity (P2), so as to be cut during the machining of the second cavity (P2); said third contact pad (10) of the second region (R2) being able to be electrically connected to a second contact pad (11) of the first region (RI) by the copper wire (120) which passes through the outside of the second cavity (P2).
3. A method according to claim 1 or 2, wherein for at least one of the first region (RI) and the second region (R2), the copper wire (120) is locally folded back on itself into coils to form a set of contact pads (1-11, 31-34, 41) such that each contact pad is intended to be in electrical contact with a corresponding respective contact pad of the first module or the second module.
4. A method for manufacturing a smart card (100) comprising a communication antenna (110) and intended to receive at least one first module and a second module electrically connected to the first module, comprising steps consisting of: - Place a sheathed copper wire (120) on a support (130), the copper wire (120) being locally wound on itself to form the communication antenna (110), and locally folded on itself into coils to form a set of contact pads in a first region (RI) intended to receive the first module, and in a second region (R2) intended to receive the second module, each contact pad of the first region (RI), respectively of the second region (R2), being intended to be in electrical contact with a corresponding contact plate of the first module, respectively of the second module, whose position is known; Characterized by the fact that it further comprises: - Machine a second cavity (P2) in the first region (RI), respectively a second cavity (P2) in the second region (R2), so as to locally cut the copper wire (120) for at least one contact pad of said cavity; - to machine a first cavity (PI) in the first region (RI), respectively a first cavity (PI) in the second region (R2), so as to locally abrade the sheath of at least one contact pad of said cavity (PI) and locally expose the copper wire (120) of all or part of said contact pad, allowing electrical contact with a corresponding contact plate of the first module, respectively of the second module; the first cavity (PI) being wider and less deep than the second cavity (P2); in which, prior to machining the first cavity (PI) or the second cavity (P2), the coils of at least one first contact pad of the first region (RI), respectively of the second region (R2), are inscribed in a predetermined shape which covers the
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9. position of at least two corresponding contact pads of the first module, respectively of the second module, such that at least said contact pad is intended to be in electrical contact with two adjacent corresponding contact pads of the first or second module. A method according to claim 4, wherein said coils are inscribed in a polygonal shape. A method according to claim 4, wherein said coils are formed in a shape that locally conforms to the shape of the periphery of the first cavity (PI) or the second cavity (P2). A method according to claim 6, wherein said coils are formed in an L, C, or U shape, such that at least said contact pad is intended to be in electrical contact with at least two corresponding adjacent contact pads of the first or second module. A method according to any one of the preceding claims, wherein the sheathed copper wire (120) is unique and continuous. Smart card (100) including: - A support (130); - a communication antenna (110) placed on the support (130); - at least one first module and a second module electrically connected to the first module; - a copper wire (120); - in which the copper wire (120) is locally wound upon itself to form the communication antenna (110), and locally folded upon itself into coils to form a set of contact pads in a first region (RI) receiving the first module, and in a second region (R2) receiving the second module, each contact pad of the first region (RI), respectively of the second region (R2), being in electrical contact with a corresponding contact plate of the first module, respectively of the second module, the position of which is known; Characterized by the fact that it further comprises:
10. - a second cavity (P2) in the first region (RI), respectively a second cavity (P2) in the second region (R2); - a first cavity (PI) in the first region (RI), respectively a first cavity (PI) in the second region (R2), in which, for all or part of the contact pads, the sheath of at least one contact pad of said cavity is locally abraded and the copper wire (120) locally exposed, allowing electrical contact with a corresponding contact plate of the first module, respectively of the second module; the first cavity (PI) being wider and less deep than the second cavity (P2); - in which, for at least one of the first region (RI) and the second region (R2): - at least one first contact pad (8) of said region (R2, RI) is electrically connected directly to: - a second contact pad (9) in the same region (R2, RI) via the copper wire (120) which passes only through the outside of the first cavity (PI), and - a first contact pad (7) of the other region (RI, R2) by the copper wire (120) which passes only through the outside of the first cavity (PI), - so that after machining of the second cavity (P2) in said region (R2, RI), the first contact pad (8) and the second contact pad (9) of said region (R2, RI) are at equipotentiality with said first contact pad (7) of the other region (RI, R2). Smart card (100) including: - A support (130); - a communication antenna (110) placed on the support (130); - at least one first module and a second module electrically connected to the first module; - a copper wire (120); - in which the copper wire (120) is locally wound upon itself to form the antenna (110) of communication, and locally folded back on itself in serpentines to form a set of contact pads in a first region (RI) receiving the first module, and in a second region (R2) receiving the second module, each contact pad of the first region (RI), respectively of the second region (R2), being in electrical contact with a corresponding contact plate of the first module, respectively of the second module, whose position is known; Characterized by the fact that it further comprises: - a second cavity (P2) in the first region (RI), respectively a second cavity (P2) in the second region (R2); - a first cavity (PI) in the first region (RI), respectively a first cavity (PI) in the second region (R2), in which, for all or part of the contact pads, the sheath of at least one contact pad of said cavity is locally abraded and the copper wire (120) locally exposed, allowing electrical contact with a corresponding contact plate of the first module, respectively of the second module; the first cavity (PI) being wider and less deep than the second cavity (P2); in which, the coils of at least one first contact pad of the region (RI), respectively (R2), fit into a shape which covers the position of at least two corresponding contact pads of the first module, respectively of the second module, so that at least one contact pad is intended to be in electrical contact with two adjacent corresponding contact pads of the first or second module.