Printed circuit board, associated electronic device and manufacturing process

Abstract

Printed circuit board, associated electronic device and manufacturing process. This printed circuit board (12) comprises several layers (15, 15') laminated one on top of the other and has a top face (14A). The board includes a via (20), which is formed through the board (12) and which includes a first metal barrel (21). The via (20) includes a second metal barrel (22), which is arranged in a first internal volume (V21) of the first barrel and is bonded to the first barrel by means of a first polymer resin (32). A top end (26A) of the second barrel is closer to the top face than a top end (24A) of the first barrel, the first barrel being suitable for connection to a first conductive element having a first electrical potential, while the second barrel is suitable for connection to a second conductive element having a second electrical potential, different from the first electrical potential. Figure for the abbreviation: Figure 3c)