Module for chip-enabled document and corresponding chip-enabled document.
The smart card module with a selectively deposited electrical insulation layer addresses short-circuiting and adhesion issues, ensuring reliable electrical connections and improved integration with card bodies.
FR3170667A1Pending Publication Date: 2026-06-26SMART PACKAGING SOLUTIONS SPS
Patent Information
- Authority / Receiving Office
- FR · FR
- Patent Type
- Applications
- Current Assignee / Owner
- SMART PACKAGING SOLUTIONS SPS
- Filing Date
- 2024-12-19
- Publication Date
- 2026-06-26
Smart Images
Figure 00000000_0000_ABST
Abstract
A chip-enabled document module (100) comprising: - A set of at least one chip, - a first face, and - a second face, opposite the first, comprising: • a set of internal connection pads (111); and • a set of electrical tracks (160) that form a predetermined pattern, each internal connection pad (111) being electrically connected to at least one respective electrical track (160). It is essentially characterized in that it further comprises: a layer of electrical insulation (120) selectively deposited on the second face. Abstract figure: Fig. 3
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