Boards for an underfloor heating system

Abstract

A method of manufacturing underfloor heating boards comprises determining room information of a room in a building (e.g. dimensions, layout, heat requirement) and determining a pipe layout 100 of one or more underfloor heating pipes 105 for the room based at least in part on the determined room information. The method further comprises determining a board layout 150 of underfloor heating boards 152 based on the determined pipe layout and determining a plurality of underfloor heating board designs based upon the board layout. A plurality of pipe layouts may be determined, with a user selecting a preferred layout for use in determining the board layout. The underfloor heating boards comprise channels 155 for the heating pipes. The plurality of board designs may be manufactured by a computer numerical control (CNC) machine, e.g. a CNC milling machine, to provide a tailor made (bespoke) underfloor heating system for the room. The method may include use of machine learning to determine the plurality of board designs. A computer program is also claimed.

Description

TECHNOLOGICAL FIELD Examples of the disclosure relate to boards for an underfloor heating system. Some relate to the design and manufacture of boards comprising channels for heating and colling pipes to be used in an underfloor heating and cooling system. BACKGROUND Underfloor heating and cooling is a form of central heating and cooling that achieves indoor climate control for thermal comfort. This can be achieved by the use of pipes embedded in a floor or wall, where the pipes contain a heated or cooled liquid, such as water. Underfloor heating and cooling is sometimes referred to as radiant heating and cooling, however heat transfer is achieved by conduction, radiation and convection. Underfloor heating and cooling can be particularly suited for heat pump systems due to the lower maximum water temperatures outputted by heat pump systems. In some instance pipes are clipped to a surface, screed is then pored over the pipes and it is left to cure to form the room’s floor. This can lead to a very slow installation process. Additionally screed cannot be used for walls or for certain types of floors. In some instances boards, such as floor boards or wall panels, are used which contain channels for the pipes of the underfloor heating and cooling. Board of the same design are used by tessellating the board across the desired area. These boards allow only a limited number of layout of pipes to be used, which potentially leads to less efficient heating and cooling. BRIEF SUMMARY According to various, but not necessarily all, examples there is provided a method for manufacturing underfloor heating boards. The method comprises: determining room information of a room of a building; determining a pipe layout of underfloor heating pipes for the room, based at least in part on the determined room information; determining a board layout of underfloor heating boards for the room, based at least in parton the pipe layout, where the underfloor heating boards comprise channels for the underfloor heating pipes; and determining a plurality of underfloor heating board designs based at least in part on the board layout. The pipe layout may comprise a layout of pipes for an underfloor heating system. The board layout may comprise a layout of boards and channels within the boards. The channels may be for the pipes. The pipe layout may comprise one or more flow circuits for an underfloor heating system. The pipes may be heating and / or cooling pipes for a liquid, and the underfloor heating system may comprise a heat pump for heating or cooling the liquid. The room information may comprise at least one of: room layout, dimensions of the room, insulation of the room, wall information, furniture information, floor information, heat requirement information, and window information. Determining the room information of a room of a building may comprise receiving at least part of the room information from a database, receiving at least part of the room information from user input, determining at least part of the room information from a floor plan, determining at least part of the room information using a laser distance measurer, and / or determining at least part of the room information using computer vision. Determining a pipe layout may be further based on at least one of, pipe spacing, pipe type, pipe diameter, pipe material, heat requirement information, heater output, liquid temperature, desired separation from walls, and desired separation from furniture. Determining a pipe layout may comprise determining at least one of, pipe spacing, pipe type, pipe diameter, pipe material, heat requirement information, heater output, liquid temperature, desired separation from walls, and desired separation from furniture. Determining a pipe layout may comprise determining that some regions of the pipe layout are to have a different pipe spacing, pipe type, pipe diameter, and / or pipe material than others. Determining a pipe layout may comprise determining a pipe layout with a pipe spacing of less than 150 mm. Determining a pipe layout may comprise determining a pipe layout in which the turning radius of the pipes is greater than a threshold. The threshold may be based at least in part on a pipe type, pipe material and / or pipe diameter. Determining a pipe layout may comprise determining areas where the pipes are not allowed to go. Determining a pipe layout may comprise determining a pipe layout which provides a heat level above a threshold. The room may be divided into regions and determining a pipe layout may comprise determining a pipe layout which provides each region of the room with a heat level above a threshold. Determining a pipe layout may comprises determining the exit and entry points for a pipe circuit. Determining a board layout may comprise determining a board layout in which the edges of the boards only cross the pipes when the edges are substantially perpendicular to the pipes. Determining a board layout may comprise determining a board layout in which, outside of places where the edges cross the pipes, the edges of the boards have a separation of at least 10 mm from pipes. Determining a board layout may comprise determining a board layout in which over 50% of the edges of the boards are substantially parallel to the closest pipe. Determining a board layout may comprise aligning the longest edge of more than 50% of the boards with the longest wall of the room. Determining a pipe layout, determining a board layout and / or determining a plurality of underfloor heating board designs may comprise the use of machine learning. The method may further comprise: initiating manufacture of a plurality of underfloor heating boards based at least in part on the plurality of underfloor heating board designs. Initiating manufacture of a plurality of underfloor heating boards may comprise sending the plurality of underfloor heating board designs to a CNC machine. Initiating manufacture of a plurality of underfloor heating boards may comprise using computer numerical control (CNC) to cut, machine and / or mill the plurality of underfloor heating boards, based at least in part on the plurality of underfloor heating board designs. The method may further comprise: determining a plurality of pipe layouts of underfloor heating pipes for the room, based at least in part on the determined room information; presenting the plurality of pipe layouts to a user; receiving user input selecting a pipe layout of the plurality of pipe layouts; and determining the board layout of underfloor heating boards for the room, based at least in part on the selected pipe layout. According to various, but not necessarily all, examples there is provided computer program instructions for causing an apparatus to perform at least the following or for performing at least the following: determining room information of a room of a building; determining a pipe layout of underfloor heating pipes for the room, based at least in part on the determined room information; determining a board layout of underfloor heating boards for the room, based at least in part on the pipe layout, where the underfloor heating boards comprise channels for the underfloor heating pipes; and determining a plurality of underfloor heating board designs based at least in part on the board layout. According to various, but not necessarily all, embodiments there is provided an apparatus comprising at least one processor; and at least one memory including computer program code; the at least one memory storing instructions that, when executed by the at least one processor, cause the apparatus to perform at least a part of one or more methods described herein. According to various, but not necessarily all, embodiments there is provided an apparatus comprising means for performing at least part of one or more methods described herein. The description of a function and / or action should additionally be considered to also disclose any means suitable for performing that function and / or action. Functions and / or actions described herein can be performed in any suitable way using any suitable method. According to various, but not necessarily all, embodiments there is provided examples as claimed in the appended claims. While the above examples of the disclosure and optional features are described separately, it is to be understood that their provision in all possible combinations and permutations is contained within the disclosure. It is to be understood that various examples of the disclosure can comprise any or all the features described in respect of other examples of the disclosure, and vice versa. Also, it is to be appreciated that any one or more or all the features, in any combination, may be implemented by / comprised in / performable by an apparatus, a method, and / or computer program instructions as desired, and as appropriate. The description of a function should additionally be considered to also disclose any means suitable for performing that function. BRIEF DESCRIPTION Some examples will now be described with reference to the accompanying drawings in which: Fig. 1 shows a first example of a pipe layout and a first example of a board layout for an underfloor heating system; Fig. 2 shows a second example of a pipe layout and a second example of a board layout for an underfloor heating system; Fig. 3 shows an example of a room; Fig. 4 shows examples of board designs; Fig. 5 shows a first example of a method; Fig. 6 shows a second example of a method; Fig. 7 shows an example of a controller; and Fig. 8 shows an example of a delivery mechanism. The figures are not necessarily to scale. Certain features and views of the figures can be shown schematically or exaggerated in scale in the interest of clarity and conciseness. For example, the dimensions of some elements in the figures can be exaggerated relative to other elements to aid explication. Similar reference numerals are used in the figures to designate similar features. For clarity, all reference numerals are not necessarily displayed in all figures. DETAILED DESCRIPTION Fig. 1 shows a first example of a pipe layout 100 and a first example of a board layout 150 for an underfloor heating system, according to embodiments of the disclosure. Fig. 2 shows a second example of a pipe layout 200 and a second example of a board layout 250 for an underfloor heating system, according to embodiments of the disclosure. For each figure, the pipe layout 100, 200 and board layout 150, 250 are for pipes 105 and boards I panels 152 for a room. The pipe layout 100, 200 may be considered to be overlaid on the board layout 150, 250. The board layout 150, 250 may be considered to comprise the pipe layout 100, 200. Fig. 3 shows an example of a room 50 according to embodiments of the disclosure. On the floor of the room 50 are a plurality of boards 152 which together produce a board layout 350. The boards 152 comprise channels 155 which define a pipe layout 300, however pipes 105 are not currently present within the channels 155. In some examples the board layout 150, 250, 350 and the pipe layout 100, 200, 300 may be for multiple rooms 50, such as a series of rooms 50 of a building. The underfloor heating system may a heating system, a cooling system or a heating and cooling system. Despite the name, an underfloor heating system may be for a floor, a wall and / or a roof. A floor may be the ground. The underfloor heating system may be considered to be a building fabric based heating and / or cooling system, where building fabric includes floors, walls or roofs. As such the term underfloor heating system may be replaced throughout the specification by the above term. The underfloor heating system supplies a liquid to the pipes 105. The liquid may comprise water and may also comprise an antifreeze additive such as propylene glycol. As such the underfloor heating system may be a hydronic system. The liquid can be considered to be a heat transfer fluid. The underfloor heating system comprises a heater and / or cooler for heating or cooling the liquid. In some examples underfloor heating system comprises a heat pump for heating or cooling the liquid. The liquid travels in a closed-loop between the heater / cooler and the pipes 105. The pipes 105 are heating and / or cooling pipes 105 for the liquid. When used for heating, heat from liquid within the pipes 105 escapes into the room 50, thus heating the room 50. When used for cooling, heat from the room 50 is captured by the liquid within the pipes 105, thus cooling the room 50. The underfloor heating system may comprise the pipes 105. The pipes 105 may any suitable type and may be comprised of any suitable material, for example a plastic, such as polyethylene, a metal, such as steel, or a rubber such as a synthetic rubber. The pipes 105 may be any suitable diameter, such as 25 mm. The pipes 105 may be considered to be multiple pipes 105 or multiple sections 105 of a single pipe. The boards 152 may be considered to be underfloor heating boards 152. In some examples the boards 152 are insulating boards 152. The boards 152 may be comprised of an engineered wood such as chip board, plywood, or medium-density fibreboard. In some examples, the boards 152 comprise another type of wood or polystyrene. The boards 152 are substantially flat. A board 152 may be defined by its edges 154. Ina board layout 150, 250, 350, boards 152 are adjacent to neighbouring boards 152 and edges 154 may be between neighbouring boards 152. The boards 152 comprise channels 155 for pipes 105. The channels 155 are for holding / suspending pipe 105. In some examples a channel 155 is for a single pipe 105 and the channel 155 has a width slightly larger than the diameter of the pipe 105. As can be seen in Figs 1 and 2, in some examples not all boards 152 comprise channels 155. This could be useful for boards 152 in a kitchen on which kitchen appliances such a refrigerator may be placed. In some examples, at least some of the boards 152 comprise multiple channels 155 and so can host multiple pipes 105 or sections of pipe 105. In some examples the boards 152 may comprise multiple layers. A board 152 may comprise one or more layer which covers the channel 155. In such examples the top layer may comprise channel markings which indicate the location of channels 155 and pipes 105 underneath the top layer. The channel markings may be printed. The top layer may comprise plywood. The pipe layout 100, 200, 300 comprises the layout of pipes 105, including the location and orientation of pipes 105. The pipe layout 100, 200, 300 comprises the pathways of pipes 105. The pipe layout 100, 200, 300 may also comprise other details of the pipes 105 such as pipe spacing, pipe type, pipe diameter and / or pipe material. Pipe spacing is the distance between a pipe 105 and neighbouring pipes 105. The pipe layout 100, 200, 300 comprises a layout of pipes 105 for an underfloor heating system. The pipe layout 100, 200, 300 comprises one or more flow circuits for an underfloor heating system. In some examples, a pipe layout 100, 200, 300 comprises multiple flow circuits. In some examples, the multiple flow circuits are for different rooms 50 or for different areas / regions of a room 50. The pipe layouts 100, 200, 300 of Figs 1,2 and 3 comprise a counterflow spiral pattern of pipes 105. In other examples different patterns may be used such as serpentine or double serpentine. In the examples of Figs 1 and 2, the pipe layout 100, 200 comprises the entry point 110 and exit point 112 where the pipes 105 will connect to a heater and / or cooler. In the illustrated examples, the pipe layout 100, 200, 300 comprises a central ornament 108, after which the liquid is closer to the exit point 112 than the entry point 110. The board layout 150, 250, 350 comprises a layout of boards 152 and channels 155 within the boards 152. The board layout 150, 250, 350 may be considered to comprise a layout of the edges 154 of boards 152 and a layout of channels 155 within the boards 152. Fig. 4 shows examples of board designs 160 according to embodiments of the disclosure. A plurality of underfloor heating board designs 160 are determined based at least in part on the board layout 150, 250, 350. The illustrated underfloor heating board designs 160 comprise channels 155 for pipes 105 from the pipe layout 100, 200, 300 and are defined by edges 154 from the board layout 150, 250, 350. The board designs 160 are designs for individual boards 152. The individual board designs 160 may form part of a larger sheet of board designs 160. In the illustrated example, the middle board design 160 shows a cut line 162. Boards 152 produced from the board designs 160 are bespoke to a room. Fig. 5 shows a first example of a method 500 according to embodiments of the disclosure. The method 500 is a method 500 for manufacturing underfloor heating boards 152. The method 500 may be computer implemented. At block 502, the method 500 comprises: determining room information of a room 50 of a building. In some but not necessarily all examples, the room information comprises at least one of: room 50 layout, dimensions of the room 50, insulation of the room 50, wall information, furniture information, floor information, heat requirement information, and window information. The window information may comprise information about window position, window size, and / or window type. In some examples, determining the room information of a room 50 comprises receiving at least part of the room information such as receiving at least part of the room information from a database and / or receiving at least part of the room information from user input. In some examples, determining the room information comprises determining at least part of the room information from a floor plan or other image, determining at least part of the room information using a laser distance measurer and / or determining at least part of the room information using computer vision. At least part of the room information may be determined from a photograph and / or a video of the room 50. At block 504, the method 500 comprises: determining a pipe layout 100, 200, 300 of underfloor heating pipes 105 for the room 50, based at least in part on the determined room information. Determining a pipe layout 100, 200, 300 may be creating a pipe layout 100, 200, 300. In some but not necessarily all examples, determining a pipe layout 100, 200, 300 is further based on at least one of, pipe spacing, pipe type, pipe diameter, pipe material, heat requirement information, heater output, liquid temperature (such as the maximum temperature of the heater), desired separation from walls, and desired separation from furniture. This additional information may be received, such as from a database or from user input. In some examples, determining a pipe layout 100, 200, 300 comprises determining at least one of, pipe spacing, pipe type, pipe diameter, pipe material, heat requirement information, heater output, liquid temperature, desired separation from walls, and desired separation from furniture. In some examples this additional information is determined and then it is used in determining a pipe layout 100, 200, 300. In some examples, determining a pipe layout 100, 200, 300 comprises determining a pipe layout 100, 200, 300 with a pipe spacing of less than 150 mm, such as less than 120 mm, less than 100 mm, or less than 80 mm. The bespoke design and machining of boards 152 permits closer spacing of pipes 105, which can lead to more efficient heating and cooling, as well as more uniform heating and cooling for a room 50. In some examples, determining a pipe layout 100, 200, 300 comprises determining a pipe layout 100,200, 300 in which theturning / bending radius of the pipes 105 is greater than a threshold. The threshold may be based at least in part on the pipe type, pipe material and / or pipe diameter. For example, the radius of turning / bending of the pipes 105 may be greater than 1 cm, such as greater than 2 cm, or greater than 3 cm. This avoid damage to the pipe 105. In some examples, determining a pipe layout 100,200, 300 comprises determining the friction of at least one pipe 105. This can be based at least in part on the pipe type, material and / or diameter. In some examples, determining a pipe layout 100, 200, 300 comprises determining the total length of the pipes 105, and / or the total length of pipes 105 within a flow circuit. In some examples, determining a pipe layout 100, 200, 300 comprises determining areas where the pipes 105 are not allowed to go, such as where there is furniture, kitchen islands, or where the floor is unsuitable. In some examples, determining a pipe layout 100, 200, 300 comprises determining the exit and entry points 112, 110 for a pipe flow circuit. In some examples, a pipe layout 100, 200, 300 comprises multiple flow circuits and determining a pipe layout 100, 200, 300 comprises dividing a room 50 into single circuit areas I regions. In some examples, determining a pipe layout 100, 200, 300 comprises determining a heat output. This may be the total heat output for a room 50 or flow circuit. Alternatively with may be the heat out per area of the room 50 or per length of pipe 105. Determining a pipe layout 100, 200, 300 may comprise determining a pipe layout 100, 200, 300 which provides a heat level above a threshold. In some examples, determining a pipe layout 100, 200, 300 comprises determining regions of a room 50 and corresponding regions of a pipe layout 100, 200, 300. This can involve dividing the room 50 into regions. For example, dividing a room 50 into 2 to 16 regions. Determining a pipe layout 100, 200, 300 may comprise determining that some regions of the pipe layout 100, 200, 300 are to have a different pipe spacing, pipe type, pipe diameter, and / or pipe material than others. For example it may be determined that pipe spacing should be larger nearer to the entry point 110 where the liquid will be warmer, and that pipe spacing should be smaller nearer to the exit point 112 where the liquid is cooler. In some examples, it may be determined that pipe spacing should be smaller near to windows or walls with poor insulation in order to compensate for the higher heat loss. These can lead to a more uniform heat distribution in the room 50. In some examples determining a pipe layout 100, 200, 300 comprises determining a pipe layout 100, 200, 300 which provides each region of the room 50 with a heat level above a threshold. In some examples determining a pipe layout 100, 200, 300 comprises determining a pipe layout 100,200, 300 which minimises the length of pipe 105 whilst meeting certain criteria. For example, determining a pipe layout 100, 200, 300 which minimises the length of pipe 105 whilst providing a heat level above a threshold and / or providing each region of the room 50 with a heat level above a threshold. In some examples determining a pipe layout 100,200, 300 comprises specifying pipes 105 based on where the pipes 105 are turning. At block 506, the method 500 comprises: determining a board layout 150, 250, 350 of underfloor heating boards 152 for the room 50, based at least in part on the pipe layout 100, 200, 300, where the underfloor heating boards 152 comprise channels 155 for the underfloor heating pipes 105. Determining a board layout 150, 250, 350 may be creating a board layout 150, 250, 350. In some but not necessarily all examples, determining a board layout 150, 250, 350 comprises determining a board layout 150, 250, 350 in which the edges 154 of the boards 152 will only cross the pipes 105 / channels 155 when the edges 154 are substantially perpendicular to the pipes 105 / channels 155. In some examples, determining a board layout 150, 250, 350 comprises determining a board layout 150, 250, 350 in which, outside of places where the edges 154 cross the pipes 105, the edges 154 of the boards 152 have a separation of at least 5 mm from pipes 105, such as least 10 mm, at least 20 mm or at least 30 mm. This helps to ensure that pipes 105 have sufficient support and insulation. In some examples, determining a board layout 150, 250, 350 comprises determining a board layout 150, 250, 350 in which, over 50% of the edges 154 of the boards 152 are substantially parallel to the closest pipe 105 / channel 155. In some examples, determining a board layout 150, 250, 350 comprises aligning the longest edge 154 of more than 50% of the boards 152 with the longest wall of the room 50. This may comprise determining the longest edge 154 for the boards 152 and determining the longest wall of the room 50. Determining a board layout 150, 250, 350 may comprise placing a first board 152 in the board layout 150, 250, 350 and iteratively placing subsequent boards 152 until the board layout 150,250, 350 covers the entire room 50 or the desired portion of the room 50. For example the first board 152 may be placed in a corner and subsequent boards 152 may be placed in a raster pattern, in rows, starting with the longest side of the room 50. For a subsequent row of boards 152, their short edges 154 may be may be offset from the short edges 154 of the previous row, such as being off set by 50% of the size of the long edge 154. In some examples, boards 152 are substantially rectangular. Rectangular includes square. In some examples more than 80% of boards 152 are substantially rectangular; for example substantially all of the boards 152 may be substantially rectangular. In other examples boards 152 may be different shapes. In rooms 50 with non-parrel walls some boards 152 may be rectangular whilst other boards 152 may be other forms of quadrilaterals and / or may be triangular. Determining a board layout 150,250, 350 may comprise determining a board layout 150, 250, 350 where the lateral dimensions of boards 152 are within a certain range. In some examples, determining a board layout 150,250, 350 comprises placing boards 152 such that their long edges 154 are substantially aligned with neighbouring boards 152 and their short edges 154 are offset from neighbouring boards 152. For a board 152 the short edge 154 ay be perpendicular to long edge 154. At block 508, the method 500 comprises: determining a plurality of underfloor heating board designs 160 based at least in part on the board layout 150, 250, 350. Determining a plurality of underfloor heating board designs 160 may be creating a plurality of underfloor heating board designs 160. In some examples determining a pipe layout 100, 200, 300, determining a board layout 150, 250, 350 and / or determining a plurality of underfloor heating board designs 160 comprises the use of machine learning. The method 500 may optionally comprise, at block 510, initiating manufacture of a plurality of underfloor heating boards 152 based at least in part on the plurality of underfloor heating board designs 160. Initiating manufacture of a plurality of underfloor heating boards 152 can be performed automatically without any need for human input. In some examples, initiating manufacture of a plurality of underfloor heating boards 152 comprises sending the plurality of underfloor heating board designs 160 to a CNC machine. In some examples, initiating manufacture of a plurality of underfloor heating boards 152 comprises using computer numerical control (CNC) to cut, machine and / or mill the plurality of underfloor heating boards 154, based at least in part on the plurality of underfloor heating board designs 160. For example, initiating manufacture of a plurality of underfloor heating boards 152 may comprise cutting the boards 154 to have the designed edges 154 and creating channels 155 within the boards 152. In some examples, initiating manufacture of a plurality of underfloor heating boards 152 comprises the use of 3D printing to produce the plurality of underfloor heating board 152, based at least in part on the plurality of underfloor heating board designs 160. In some but not necessarily all examples the method 500 further comprises installing the plurality of underfloor heating boards 152 in the room 50. The method 500 outputs scale models which, when manufactured, could feasibly fit pipes 105 into the channels 155 without damaging the pipes 105 and without adaptations needing to be made to the channels 155 in order to fit the pipes 105 in. Embodiments of the disclosure provide bespoke pipe layouts 100, 200, 300 and board layouts 150, 250, 350 for a room 50. This provides a number of advantages. The pipe layouts 100, 200, 300 are optimized for the room 50, leading to more efficient heating and cooling and more uniform heating and cooling. The method 500 allows for smaller pipe spacing which increases the efficiency of heating and cooling and is particular useful for heat pumps. Another benefit is speed and ease of installation as screed does not have to be set, and boards 152 do not have to be cut or adjusted not site. Fig. 6 shows a second example of a method 600 according to embodiments of the disclosure. The method 600 is a method 600 for manufacturing underfloor heating boards 152. The method 600 may be computer implemented. It will be apparent that methods 500 and 600 share a number of steps, are similar and may be combined. At block 502, the method 600 comprises determining room information of a room 50 of a building. At block 604, the method 600 comprises determining a plurality of pipe layouts 100, 200, 300 of underfloor heating pipes 105 for the room 50, based at least in part on the received room information. Block 604 of method 600 is similar to block 504 of method 500. In some examples the plurality of pipe layouts 100, 200, 300 have different pipe spacings; pipe type, pipe diameter, pipe material, pipe lengths and / or pipe patterns. For example, a plurality of pipe layouts 100, 200, 300 may be created for all 10 mm pipe spacings possibilities between 150 to 30 mm. At block 612, the method 600 comprises presenting the plurality of pipe layouts 100, 200, 300 to a user. At block 614 , the method 600 comprises receiving user input selecting a pipe layout 100, 200, 300 of the plurality of pipe layouts 100, 200, 300. The user can choose between the different pipe layouts 100, 200, 300 to decide what is best for the room 50. In some examples the plurality of pipe layouts 100, 200, 300 are presented to a user via a website or application. In some examples the user input is received via the website or application. At block 506, the method 600 comprises determining a board layout 150, 250, 350 of underfloor heating boards 152 for the room 600, based at least in part on the selected pipe layout 100,200, 300, where the underfloor heating boards 152 comprise channels 155 for the underfloor heating pipes 105. At block 508, the method 600 comprises determining a plurality of underfloor heating board designs 160 based at least in part on the board layout 150, 250, 350. The method 600 may optionally comprise, at block 510, initiating manufacture of a plurality of underfloor heating boards 152 based at least in part on the plurality of underfloor heating board designs 160. In some examples, an example method for determining a pipe layout 100, 200, 300 is as follows: 1. Room 50 shape and size are defined, such as using a scalable vector graphic. 2. Pipe spacing centres, pipe bend radius, margin or distance to wall are specified. 3. The system offsets all lines defining the perimeter of the shape by wall distance. This new line is referred to as the 'restriction line'. 4. Entry (flow) and exit (return) points are defined at the restriction line. The initial direction may be set as right clockwise 5. The system measures the width and length between restriction lines (restrictionjeft - restriction_right; restriction_bottom - restriction_top). If all distances are bigger than K * pipe radius: a pair of arcs are placed at the restriction line opposite the entry / exit points and in a clockwise direction. The flow arc leading edge is placed at the restriction line and the return arc is offset in relation to the flow arc by the value specified as pipe spacing centres. 6. Connect the flow arc with the flow entry point. Connect the return arc with the return exit point (flow return line). 7. Set new entry and exit points at the end points of the new arcs. 8. Change the direction by 90° clockwise. 9. Update the restriction line by offsetting pipe_dist from the newly built flow return line. 10. Repeat steps 5-9. 11. If distances measured in step 5 are less than K * radius: run the 'central ornament' 108. 12. Central ornament 108 code closes pipe 105 ends. An example central ornament procedure is as follows: 1. Pipe drawing algorithm stops when the space limit reaches a specified value. 2. Then control points for the Bezier curve are determined based on where there is the most space. 3. A cubic Bezier curve (similar to the letter s) is drawn. 4. Pipes are joined. An example central ornament quality control method is as follows: 1. Check segments are constructed representing a simplified circle. 2. Points are found to divide the Bezier curve into small segments. 3. If there is no intersection between the small segments between the points and the segments, then the minimum radius requirement is met. 4. It is checked the bend radius does not violate the minimum threshold. In some examples, a further example method for determining a pipe layout 100, 200, 300 is as follows: 1. Entry / exit points specified. Start point is defined as position 0 in relation to X and Y. 2. Construct several possible rays that can originate from this point 0 (for example, at 90 degrees possible bending of the pipe might be 90, 45, 0, -45, -90 degrees). 3. Select only those rays that can be drawn and exclude rays that are not possible, for example, outside the restriction line (now we have a list of possible rays). 4. Sort the available angles in relation to the direction / angle of the restriction line. Prioritising the angles / direction that closely match that of the restriction line. 5. Choose the ray with the smallest angle. This step favors the creation of lines following the restriction line / room shape. 6. Construct a line segment based on this ray and the boundary it leads to. 7. The end of this segment becomes the new starting point (step 1). 8. Repeat the steps until there is not enough space for the Bezier curve (the algorithm has reached Central Ornament). 9. In some examples, if an incorrect segment is chosen, the algorithm returns to the previous starting point. Fig 7 illustrates an example of a controller 700 suitable for use in an apparatus. Implementation of a controller 700 may be as controller circuitry. The controller 700 may be implemented in hardware alone, have certain aspects in software including firmware alone or can be a combination of hardware and software (including firmware). As illustrated in Fig 7 the controller 700 may be implemented using instructions that enable hardware functionality, for example, by using executable instructions 706 in a general-purpose or special-purpose processor 702 that may be stored on a machine readable storage medium (disk, memory etc.) to be executed by such a processor 702. The processor 702 is configured to read from and write to the memory 704. The processor 702 may also comprise an output interface via which data and / or commands are output by the processor 702 and an input interface via which data and / or commands are input to the processor 702. The memory 704 stores instructions, program, or code 706 that controls the operation of the apparatus when loaded into the processor 702. The computer program instructions, program or code am 706, provide the logic and routines that enables the apparatus to perform the methods illustrated in the accompanying FIGs. The processor 702 by reading the memory 704 is configured to load and execute the instructions, program, or code 706. The apparatus comprises: at least one processor 702; and at least one memory 704 storing instructions that, when executed by the at least one processor 702, cause the apparatus at least to: determine room information of a room 50 of a building; determine a pipe layout 100, 200, 300 of underfloor heating pipes 105 for the room 50, based at least in part on the determined room information; determine a board layout 150, 250, 350 of underfloor heating boards 152 for the room 50, based at least in part on the pipe layout 100, 200, 300, where the underfloor heating boards 152 comprise channels 155 for the underfloor heating pipes 105; and determine a plurality of underfloor heating board designs 160 based at least in part on the board layout 150, 250, 350. As illustrated in Fig 8, the instructions, program, or code 706 may arrive at the apparatus via any suitable delivery mechanism 708. The delivery mechanism 708 may be, for example, a machine readable medium, a computer-readable medium, a non- transitory computer-readable storage medium, a computer program product, a memory device, a record medium such as a Compact Disc Read-Only Memory (CD-ROM) or a Digital Versatile Disc (DVD) or a solid-state memory, an article of manufacture that comprises or tangibly embodies the computer program 706. The delivery mechanism may be a signal configured to reliably transfer the computer program 706. The apparatus may propagate or transmit the computer program 706 as a computer data signal. Computer program instructions for causing an apparatus to perform at least the following or for performing at least the following: determining room information of a room 50 of a building; determining a pipe layout 100, 200, 300 of underfloor heating pipes 105 for the room 50, based at least in part on the determined room information; determining a board layout 150, 250, 350 of underfloor heating boards 152 for the room 50, based at least in part on the pipe layout 100, 200, 300, where the underfloor heating boards 152 comprise channels 155 for the underfloor heating pipes 105; and determining a plurality of underfloor heating board designs 160 based at least in part on the board layout 150, 250, 350. The computer program instructions may be comprised in a computer program, a non-transitory computer readable medium, a computer program product, a machine readable medium. In some but not necessarily all examples, the computer program instructions may be distributed over more than one computer program. Although the memory 704 is illustrated as a single component / circuitry it may be implemented as one or more separate components / circuitry some or all of which may be integrated / removable and / or may provide permanent / semi-permanent / dynamic / cached storage. Although the processor 702 is illustrated as a single component / circuitry it may be implemented as one or more separate components / circuitry some or all of which may be integrated / removable. The processor 702 may be a single core or multi-core processor. References to ‘computer-readable storage medium’, ‘computer program product’, ‘tangibly embodied computer program’ etc. ora ‘controller’, ‘computer’, ‘processor’ etc. should be understood to encompass not only computers having different architectures such as single / multi- processor architectures and sequential (Von Neumann) / parallel architectures but also specialized circuits such as field-programmable gate arrays (FPGA), application specific circuits (ASIC), signal processing devices and other processing circuitry. References to computer program, instructions, code etc. should be understood to encompass software for a programmable processor or firmware such as, for example, the programmable content of a hardware device whether instructions for a processor, or configuration settings for a fixed-function device, gate array or programmable logic device etc. The blocks illustrated in the accompanying Figs may represent steps in a method and / or sections of code in the computer program 706. The illustration of a particular order to the blocks does not necessarily imply that there is a required or preferred order for the blocks and the order and arrangement of the block may be varied. Furthermore, it may be possible for some blocks to be omitted. Where a structural feature has been described, it may be replaced by means for performing one or more of the functions of the structural feature whether that function or those functions are explicitly or implicitly described. The systems, apparatus, methods, and computer programs may use machine learning which can include statistical learning. Machine learning is a field of computer science that gives computers the ability to learn without being explicitly programmed. The computer learns from experience E with respect to some class of tasks T and performance measure P if its performance at tasks in T, as measured by P, improves with experience E. The computer can often learn from prior training data to make predictions on future data. Machine learning includes wholly or partially supervised learning and wholly or partially unsupervised learning. It may enable discrete outputs (for example classification, clustering) and continuous outputs (for example regression). Machine learning may for example be implemented using different approaches such as cost function minimization, artificial neural networks, support vector machines and Bayesian networks for example. Cost function minimization may, for example, be used in linear and polynomial regression and K-means clustering. Artificial neural networks, for example with one or more hidden layers, model complex relationship between input vectors and output vectors. Support vector machines may be used for supervised learning. A Bayesian network is a directed acyclic graph that represents the conditional independence of a number of random variables. The methods 500, 600 may assign the execution of data-intensive training of a machine-learning algorithm to clients and preparatory steps to a server to take advantage of a server-client architecture. The training data and the training of the reduced machine learning model is technical in that there is distributed training across multiple clients and the training data at each client is secured and remains private. The apparatus can be provided in an electronic device, for example, a mobile terminal, according to an example of the present disclosure. It should be understood, however, that a mobile terminal is merely illustrative of an electronic device that would benefit from examples of implementations of the present disclosure. The term ‘comprise’ is used in this document with an inclusive not an exclusive meaning. That is any reference to X comprising Y indicates that X may comprise only one Y or may comprise more than one Y. If it is intended to use ‘comprise’ with an exclusive meaning then it will be made clear in the context by referring to ‘comprising only one...’ or by using ‘consisting.’ In this description, the wording ‘connect’, ‘couple’ and ‘communication’ and their derivatives mean operationally connected / coupled / in communication. It should be appreciated that any number or combination of intervening components can exist (including no intervening components), i.e., to provide direct or indirect connection / coupling / communication. Any such intervening components can include hardware and / or software components. As used herein, the term "determine / determining" (and grammatical variants thereof) can include, not least: calculating, computing, processing, deriving, measuring, investigating, identifying, looking up (for example, looking up in a table, a database, or another data structure), ascertaining and the like. Also, "determining" can include receiving (for example, receiving information), accessing (for example, accessing data in a memory), obtaining and the like. Also, "determine / determining" can include resolving, selecting, choosing, establishing, and the like. In this description, reference has been made to various examples. The description of features or functions in relation to an example indicates that those features or functions are present in that example. The use of the term ‘example’ or ‘for example’ or ‘can’ or ‘may’ in the text denotes, whether explicitly stated or not, that such features or functions are present in at least the described example, whether described as an example or not, and that they can be, but are not necessarily, present in some of or all other examples. Thus ‘example’, ‘for example’, ‘can’, or ‘may’ refers to a particular instance in a class of examples. A property of the instance can be a property of only that instance or a property of the class or a property of a sub-class of the class that includes some but not all the instances in the class. It is therefore implicitly disclosed that a feature described with reference to one example but not with reference to another example, can where possible be used in that other example as part of a working combination but does not necessarily have to be used in that other example. Although examples have been described in the preceding paragraphs with reference to various examples, it should be appreciated that modifications to the examples given can be made without departing from the scope of the claims. Features described in the preceding description may be used in combinations other than the combinations explicitly described above. Although functions have been described with reference to certain features, those functions may be performable by other features whether described or not. The description of a feature, such as an apparatus or a component of an apparatus, configured to perform a function, or for performing a function, should additionally be considered to also disclose a method of performing that function. For example, description of an apparatus configured to perform one or more actions, or for performing one or more actions, should additionally be considered to disclose a method of performing those one or more actions with or without the apparatus. Although features have been described with reference to certain examples, those features may also be present in other examples whether described or not. The term ‘a’, ‘an’ or ‘the’ is used in this document with an inclusive not an exclusive meaning. That is any reference to X comprising a / an / the Y indicates that X may comprise only one Y or may comprise more than one Y unless the context clearly indicates the contrary. If it is intended to use ‘a’, ‘an’ or ‘the’ with an exclusive meaning then it will be made clear in the context. In some circumstances the use of ‘at least one’ or ‘one or more’ may be used to emphasis an inclusive meaning but the absence of these terms should not be taken to infer any exclusive meaning. The presence of a feature (or combination of features) in a claim is a reference to that feature or (combination of features) itself and to features that achieve substantially the same technical effect (equivalent features). The equivalent features include, for example, features that are variants and achieve substantially the same result in substantially the same way. The equivalent features include, for example, features that perform substantially the same function, in substantially the same way to achieve substantially the same result. In this description, reference has been made to various examples using adjectives or adjectival phrases to describe characteristics of the examples. Such a description of a characteristic in relation to an example indicates that the characteristic is present in some examples exactly as described and is present in other examples substantially as described. The above description describes some examples of the present disclosure however those of ordinary skill in the art will be aware of possible alternative structures and method features which offer equivalent functionality to the specific examples of such structures and features described herein above and which for the sake of brevity and clarity have been omitted from the above description. Nonetheless, the above description should be read as implicitly including reference to such alternative structures and method features which provide equivalent functionality unless such alternative structures or method features are explicitly excluded in the above description of the examples of the present disclosure. 5 Whilst endeavoring in the foregoing specification to draw attention to those features believed to be of importance the Applicant may seek protection via the claims in respect of any patentable feature or combination of features hereinbefore referred to and / or shown in the drawings whether or not emphasis has been placed thereon. 10 l / we claim:

Claims

1. A method for manufacturing underfloor heating boards, the method comprising:determining room information of a room of a building;determining a pipe layout of underfloor heating pipes for the room, based at least in part on the determined room information;determining a board layout of underfloor heating boards for the room, based at least in part on the pipe layout, where the underfloor heating boards comprise channels for the underfloor heating pipes; anddetermining a plurality of underfloor heating board designs based at least in part on the board layout.

2. The method of claim 1, wherein the pipe layout comprises a layout of pipes for an underfloor heating system, and wherein the board layout comprises a layout of boards and channels within the boards, the channels being for the pipes.

3. The method of claim 1 or 2, wherein the pipe layout comprises one or more flow circuits for an underfloor heating system, wherein the pipes are heating and / or cooling pipes for a liquid, and wherein the underfloor heating system comprises a heat pump for heating or cooling the liquid.

4. The method of claim 1, 2 or 3, wherein the room information comprises at least one of: room layout, dimensions of the room, insulation of the room, wall information, furniture information, floor information, heat requirement information, and window information.

5. The method of any of the preceding claims, wherein determining the room information of a room of a building, comprises receiving at least part of the room information from a database, receiving at least part of the room information from user input, determining at least part of the room information from a floor plan, determining at least part of the room information using a laser distance measurer, and / or determining at least part of the room information using computer vision.

6. The method of any of the preceding claims, wherein determining a pipe layout is further based on at least one of, pipe spacing, pipe type, pipe diameter, pipe material, heat requirement information, heater output, liquid temperature, desired separation from walls, and desired separation from furniture.

7. The method of any of the preceding claims, wherein determining a pipe layout comprises determining at least one of, pipe spacing, pipe type, pipe diameter, pipe material, heat requirement information, heater output, liquid temperature, desired separation from walls, and desired separation from furniture.

8. The method of any of the preceding claims, wherein determining a pipe layout comprises determining that some regions of the pipe layout are to have a different pipe spacing, pipe type, pipe diameter, and / or pipe material than others.

9. The method of any of the preceding claims, wherein determining a pipe layout comprises determining a pipe layout with a pipe spacing of less than 150 mm.

10. The method of any of the preceding claims, wherein determining a pipe layout comprises determining a pipe layout in which the turning radius of the pipes is greater than a threshold.

11. The method of claim 10, wherein the threshold is based at least in part on a pipe type, pipe material and / or pipe diameter.

12. The method of any of the preceding claims, wherein determining a pipe layout comprises determining areas where the pipes are not allowed to go.

13. The method of any of the preceding claims, wherein determining a pipe layout comprises determining a pipe layout which provides a heat level above a threshold.

14. The method of claim 13, wherein the room is divided into regions and wherein determining a pipe layout comprises determining a pipe layout which provides each region of the room with a heat level above a threshold.

15. The method of any of the preceding claims, wherein determining a pipe layout comprises determining the exit and entry points for a pipe circuit.

16. The method of any of the preceding claims, wherein determining a board layout comprises determining a board layout in which the edges of the boards only cross the pipes when the edges are substantially perpendicular to the pipes.

17. The method of any of the preceding claims, wherein determining a board layout comprises determining a board layout in which, outside of places where the edges cross the pipes, the edges of the boards have a separation of at least 10 mm from pipes.

18. The method of any of the preceding claims, wherein determining a board layout comprises determining a board layout in which over 50% of the edges of the boards are substantially parallel to the closest pipe.

19. The method of any of the preceding claims, wherein determining a board layout comprises aligning the longest edge of more than 50% of the boards with the longest wall of the room.

20. The method of any of the preceding claims, wherein determining a pipe layout, determining a board layout and / or determining a plurality of underfloor heating board designs comprises the use of machine learning.

21. The method of any of the preceding claims, further comprising: initiating manufacture of a plurality of underfloor heating boards based at least in part on the plurality of underfloor heating board designs.

22. The method of claim 21, wherein initiating manufacture of a plurality of underfloor heating boards comprises sending the plurality of underfloor heating board designs to a CNC machine.

23. The method of claim 21 or 22, wherein initiating manufacture of a plurality of underfloor heating boards comprises using computer numerical control (CNC) to cut, machine and / or mill the plurality of underfloor heating boards, based at least in part on the plurality of underfloor heating board designs.

24. The method of any of the preceding claims, wherein the method further comprises:determining a plurality of pipe layouts of underfloor heating pipes for the room, based at least in part on the determined room information;presenting the plurality of pipe layouts to a user;receiving user input selecting a pipe layout of the plurality of pipe layouts; and determining the board layout of underfloor heating boards for the room, based at least in part on the selected pipe layout.

25. Computer program instructions for causing an apparatus to perform at least the following or for performing at least the following:determining room information of a room of a building;determining a pipe layout of underfloor heating pipes for the room, based at least in part on the determined room information;determining a board layout of underfloor heating boards for the room, based at least in part on the pipe layout, where the underfloor heating boards comprise channels for the underfloor heating pipes; anddetermining a plurality of underfloor heating board designs based at least in part on the board layout.

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