Isothermal heat dissipation apparatus, manufacturing and design methods thereof, storage medium and electronic device

Abstract

The present invention relates to the technical field of temperature equalizing heat dissipation, and in particular to a temperature equalizing heat dissipation apparatus and a manufacturing method and

Description

CROSS-REFERENCE TO RELATED APPLICATIONS The present application claims the priority of the Chinese patent application CN202410663196.6 filed on May 27, 2024 and entitled “isothermal heat dissipation apparatus, manufacturing and design methods thereof, storage medium and electronic device”, the entirety of which is incorporated herein by reference. Field of the invention The present invention relates to the technical field of isothermal and heat dissipation, and in particular, to an isothermal and heat dissipation apparatus, manufacturing and design methods thereof, a storage medium and an electronic device. Background of the invention Core components used in a power electronic converter are insulated gate bipolar transistors (IGBTs). A high-power trend based on high output performance, a trend of a high level of integration of multiple functions or multiple components, and a trend of miniaturization for weight and cost reductions are hot development directions of converters. The resulting technical problems in heat dissipation of non-uniformity, high heat flux intensity, and integration of multiple components also bring severe challenges to related thermal management work. A conventional heat dissipation apparatus has poor isothermal performance, resulting in a Buckets effect in the application process of the converter. For large-scale industrial applications, performance, reliability and cost are all important considerations. There is a technical problem in the art of how to develop an isothermal and heat dissipation product that is easy to manufacture, low in cost, high in reliability and high in performance. Summary of the invention The present invention provides an isothermal and heat dissipation apparatus, manufacturing and design methods thereof, a storage medium and an electronic device, which solves the technical problem of how to develop an isothermal and heat dissipation product that is easy to manufacture, low in cost, high in reliability and high in performance. In a first aspect, the present invention provides an isothermal and heat dissipation apparatus. The isothermal and heat dissipation apparatus includes a heat dissipation substrate. An upper surface and a lower surface of the heat dissipation substrate are a heat source surface and a heat dissipation surface, respectively, and the heat dissipation substrate is drilled to form phase change cavities inside, where the phase change cavities are parallel to the heat source surface and the heat dissipation surface. In some embodiments, the phase change cavities include rows of phase change cavities distributed in a row direction of heat sources and columns of phase change cavities distributed in a column direction of the heat sources. The rows of phase change cavities and the columns of phase change cavities are connected to and in communication with each other. In some embodiments, the heat source surface of the isothermal and heat dissipation apparatus is provided with a plurality of heat source regions. Each heat source region covers at least one phase change cavity connecting region and is provided with a heat conduction material layer. In a second aspect, the present invention provides a manufacturing method of the isothermal and heat dissipation apparatus. The manufacturing method includes: drilling the heat dissipation substrate to obtain the phase change holes; filling the phase change holes with a phase change working medium; and sealing two sides of each phase change hole to obtain a sealed phase change cavity. In a third aspect, the present invention provides a design method of the isothermal and heat dissipation apparatus. The method includes the following steps: arranging all the heat sources on the heat dissipation substrate; detecting a maximum temperature rise of each heat source, and calculating an average value of the maximum temperature rises of all the heat sources to obtain an average temperature rise; determining a difference value between the maximum temperature rise of each heat source and the average temperature rise to obtain a temperature rise difference value of each heat source; determining whether the temperature rise difference value of each heat source is greater than a preset uniform temperature target value; and if the temperature rise difference value of at least one heat source is greater than the preset uniform temperature target value, determining, based on a ratio of a heat generation power of each heat source to a heat transfer area, a number and position of phase change cavities of the heat dissipation substrate to be disposed. In some embodiments, determining, based on the ratio of the heat generation power of each heat source to the heat transfer area, the number and position of the phase change cavities to be disposed of the heat dissipation substrate includes: obtaining a reference heat generation power and a reference heat transfer area; using a ratio of the reference heat generation power to the reference heat transfer area as a reference ratio; based on the reference ratio and a ratio of a sum of heat generation powers of each row / column of heat sources to a sum of heat transfer areas of the row / column of heat sources, obtaining a number ratio sequence of the rows / columns of phase change cavities; according to a proportion of a maximum number of the phase change cavities corresponding to the heat sources to a maximum value among the number ratio sequence of the rows / columns of phase change cavities, amplifying numerical values in the number ratio sequence of the rows / columns of phase change cavities and obtaining a number of phase change cavities to be disposed in each row / column; and distributing the phase change cavities to be disposed in each row / column at equal distances, where the maximum number of the phase change cavities corresponding to the heat sources is a ratio of a size of the heat sources to a thickness of corresponding positions of the heat dissipation substrate. In some embodiments, the method further includes the following steps: determining whether the temperature rise difference value of each heat source on the heat dissipation substrate provided with the phase change cavities is greater than the preset uniform temperature target value; and if the temperature rise difference value of the at least one heat source is greater than the preset uniform temperature target value, adjusting the preset uniform temperature target value, and re-determining, based on an adjusted preset uniform temperature target value, the number and position of the phase change cavities to be disposed of the heat dissipation substrate until the temperature rise difference values of all the heat sources are less than or equal to the preset uniform temperature target value. In a fourth aspect, the present invention provides a design method of the isothermal and heat dissipation apparatus. The method includes: arranging all the heat sources on the heat dissipation substrate; detecting a maximum temperature rise of each heat source, and calculating an average value of the maximum temperature rises of all the heat sources to obtain an average temperature rise; obtaining a heat generation power and a heat transfer area of each heat source and a thermal conductivity and a thickness of each heat conduction material; according to the heat generation power and the heat transfer area of each heat source and the thermal conductivity and the thickness of each heat conduction material, determining a maximum contact temperature rise generated by contact between each heat source and the heat dissipation substrate by using a contact temperature rise calculation formula, where the thickness of the heat conduction material between each heat source and the heat dissipation substrate is the same; determining a difference value between a sum of the maximum temperature rise of each heat source and the maximum contact temperature rise and the average temperature rise to obtain a contact temperature rise difference value of each heat source; and if the contact temperature rise difference value of at least one heat source is greater than the preset uniform temperature target value, performing matching with a heat conduction material with a corresponding thermal conductivity meeting a uniform temperature reverse calculation target requirement until the contact temperature rise difference values of all the heat sources are less than or equal to the preset uniform temperature target value. In some embodiments, the contact temperature rise calculation formula includes: ATnm_ch — Qnm b / (^KnmAnni^ where △Tnmj* represents a maximum contact temperature rise of contact between a heat source corresponding to a position in an nth row and an mth column and the heat dissipation apparatus; knm represents a thermal conductivity of a heat conduction material at a point of contact between the heat source corresponding to the position in the nth row and the mth column and the heat dissipation apparatus; and b represents a thickness of the heat conduction material. In a fifth aspect, the present invention provides a computer-readable storage medium having a computer program stored thereon, where the computer program, when executed by a processor, implements the method according to any one of the above aspects. In a sixth aspect, the present invention provides an electronic device, including a processor and a memory, where the memory has a computer program stored thereon, and the processor, when executing the computer program, implements the method according to any one of the above aspects. The present invention provides an isothermal and heat dissipation apparatus, manufacturing and design methods thereof, a storage medium and an electronic device. The isothermal and heat dissipation apparatus includes a heat dissipation substrate, where an upper surface and a lower surface of the heat dissipation substrate are a heat source surface and a heat dissipation surface, respectively, and the heat dissipation substrate is drilled to form phase change cavities inside, the phase change cavities being parallel to the heat source surface and the heat dissipation surface. The technical solutions of the present invention provide an isothermal and heat dissipation product that is easy to manufacture, low in cost, high in reliability and high in performance. Brief Description of the Drawings The present invention will be described in more detail below based on embodiments and in conjunction with accompanying drawings. FIG. 1 is a schematic diagram of a three-dimensional structure of an isothermal and heat dissipation apparatus provided by an embodiment of the present application; FIG. 2 is a front view of the isothermal and heat dissipation apparatus provided by the embodiment of the present application; FIG. 3 is a left view of the isothermal and heat dissipation apparatus provided by the embodiment of the present application; FIG. 4 is a top view of the isothermal and heat dissipation apparatus provided by the embodiment of the present application; FIG. 5 is a schematic diagram of a manufacturing process of isothermal and heat dissipation apparatus provided by an embodiment of the present application; and FIG. 6 is a schematic flowchart of a design method of the isothermal and heat dissipation apparatus provided by an embodiment of the present application. In the accompanying drawings, the same components use the same reference numerals, and the accompanying drawings are not drawn to actual scale. Detailed Description of the Embodiments In order to make a person skilled in the art better understand solutions of the present invention, and adequately understand and accordingly implement an implementation process of how to solve technical problems and achieve corresponding technical effects by virtue of a technical means in the present invention, the technical solutions in embodiments of the present invention will be described clearly and completely below in conjunction with accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are merely some but not all of the embodiments of the present invention. The embodiments of the present invention as well as various features in the embodiments may be combined with each other under the premise of no conflict, and the technical solutions formed shall all fall within the protection scope of the present invention. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention. It is to be noted that terms such as “first”, “second”, etc. in the description and claims of the present invention and the above accompanying drawings are used to distinguish between similar objects and are not necessarily used to describe a particular order or sequence. It should be understood that data used in such a way are interchangeable where appropriate, such that the embodiments of the present invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, terms “comprise”, “have” or any variations thereof are intended to cover a non-exclusive inclusion. For example, a process, method, system, product or device including a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or that are inherent to the process, method, product or device. It is to be noted that steps illustrated in a flowchart among the accompanying drawings may be executed, for example, in a computer system with a set of computer-executable instructions. Moreover, although a logical order is illustrated in the flowchart, in some cases, the steps illustrated or described may be executed in an order different from that illustrated herein. Core components used in a power electronic converter are insulated gate bipolar transistors (IGBTs). A high-power trend based on high output performance, a trend of a high level of integration of multiple functions or multiple components, and a trend of miniaturization for weight and cost reductions are hot development directions of converters. The resulting technical problems in heat dissipation of non-uniformity, high heat flux intensity, and integration of multiple components also bring severe challenges to related thermal management work. A conventional heat dissipation apparatus has poor isothermal performance, resulting in a Buckets effect in the application process of a converter. For large-scale industrial applications, performance, reliability and cost are all important considerations. There is a technical problem in the art of how to develop an isothermal and heat dissipation product that is easy to manufacture, low in cost, high in reliability and high in performance. The technical solutions of the present application will be illustrated below with reference to specific embodiments. Embodiment 1 FIG. 1 is a schematic structural diagram of an isothermal and heat dissipation apparatus provided by an embodiment of the present application, FIG. 2 is a front view of the isothermal and heat dissipation apparatus provided by the embodiment of the present application, FIG. 3 is a left view of the isothermal and heat dissipation apparatus provided by the embodiment of the present application, and FIG. 4 is a top view of the isothermal and heat dissipation apparatus provided by the embodiment of the present application. As shown in FIG. 1 to FIG. 4, provided in the technical solution of this embodiment is an isothermal and heat dissipation apparatus. The isothermal and heat dissipation apparatus includes a heat dissipation substrate. An upper surface and a lower surface of the heat dissipation substrate are a heat source surface and a heat dissipation surface, respectively, and the heat dissipation substrate is drilled to form phase change cavities inside, where the phase change cavities are parallel to the heat source surface and the heat dissipation surface. The technical problem solved by the technical solution of this embodiment is how to achieve efficient thermal management and temperature uniformity in a power electronic device having a high power density and integrating multiple heat sources. By drilling the heat dissipation substrate to form the phase change cavities, the phase change cavities and the heat dissipation substrate are integrated, thereby reducing thermal resistance. The phase change cavities may be filled with a phase change material, which is conducive to maintaining the temperature stability around the heat sources. The use of the phase change material enhances the thermal energy storage capacity of the substrate, which has a significant effect on dealing with instantaneous high heat fluxes or heat pulses. The design of the phase change cavities, the heat source surface and the heat dissipation surface being parallel to each other means that heat can be quickly and uniformly transferred from the heat source surface to the heat dissipation surface through the phase change material. By drilling the heat dissipation substrate to form the phase change cavities and ensuring a parallel structure of the phase change cavities, the heat source surface and the heat source surface, the technical solution of this embodiment not only enhances the heat storage and release capacities of a heat dissipation system, but also significantly improves the isothermal performance of the heat dissipation apparatus by optimizing heat flux distribution, thereby effectively dealing with thermal management challenges faced by electronic devices having a high power density, thus improving the working stability and reliability of the system. Embodiment 2 On the basis of the above embodiment, the phase change cavities include rows of phase change cavities distributed in a row direction of heat sources and columns of phase change cavities distributed in a column direction of the heat sources. The rows of phase change cavities and the columns of phase change cavities are connected to and in communication with each other. The technical problem solved by the technical solution of this embodiment is further optimizing the distribution and transfer efficiency of heat inside the heat dissipation substrate. Especially, in the face of a complex heat source layout and a non-uniform heat flux density, the temperature university of heat dissipation is enhanced through a more refined design of the phase change cavities to ensure a better temperature consistency of all heat source parts, thereby improving the overall heat dissipation performance and the stability of the system. In this embodiment, the rows of phase change cavities and the columns of phase change cavities with an included angle of, for example, 90 degrees are introduced. The phase change cavities can not only store and release heat to balance temperature fluctuations generated by the heat sources through the property of the phase change material, but also further improve the heat dissipation efficiency through a unique layout form. By connecting the rows of phase change cavities to the columns of phase change cavities, heat can flow and be distributed more smoothly between the phase change cavities. A preset angle may also be other angles, for example, 30 degrees to ensure more uniform transfer of heat in different directions. Compared with heat transfer only on a one-dimensional plane, the design forms a more stereo heat exchange channel through the connection between the phase change cavities and angle setting, thereby achieving two-dimensional thermal management. As such, not only is the flexibility of the heat dissipation system is enhanced, but also the heat dissipation system can adapt to a wider range of heat source layouts. The technical solution of this embodiment optimizes a heat flux path through the innovative structural design of the phase change cavities, especially by connecting the raws of phase change cavities to the columns of phase change cavities at a specific angle, and enhances the uniform heat distribution capacity of the heat dissipation substrate in a two-dimensional space, thereby effectively solving the problem of temperature uniformity of heat dissipation in complex thermal management scenarios, thus improving the comprehensive performance of the heat dissipation apparatus. Embodiment 3 On the basis of the above embodiment, the heat source surface of the isothermal and heat dissipation apparatus is provided with a plurality of heat source regions. Each heat source region covers at least one phase change cavity connecting region and is provided with a heat conduction material layer. The technical problem solved by the technical solution of this embodiment is how to efficiently, quickly and uniformly transfer heat generated by the heat resources to the phase change cavities to ensure the heat dissipation efficiency and reduce temperature gradients within the heat source regions. By disposing the plurality of heat source regions on the heat source surface, each of which corresponds to at least one phase change cavity connecting region, such a design can more accurately distribute the phase change cavities according to specific heat generation properties and positions of the different heat sources. It is ensured that each heat source can receive effective and targeted heat dissipation services, thereby avoiding waste or non-uniform distribution of heat dissipation resources. By disposing the heat conduction material layer in each heat source region, the heat transfer efficiency is improved. The technical solution of this embodiment achieves quick conduction and uniform distribution of the heat by accurately defining the heat source regions on the heat source surface and laying the heat conduction material layers combined with an efficient thermal energy management mechanism of the phase change cavities, thereby effectively solving the technical problems of non-uniform heat dissipation and local overheating in devices having a high power density, thus improving the performance and reliability of the whole isothermal and heat dissipation apparatus. Embodiment 4 FIG. 5 is a schematic flowchart of a manufacturing method of an isothermal and heat dissipation apparatus provided by an embodiment of the present application. As shown in FIG. 5, provided in the technical solution of this embodiment is a manufacturing method of the isothermal and heat dissipation apparatus according to any one of the above embodiments. The manufacturing method includes: drilling the heat dissipation substrate to obtain phase change holes; filling the phase change holes with a phase change working medium; and sealing two sides of each phase change hole to obtain a sealed phase change cavity. The technical problem solved by the technical solution of this embodiment is how to manufacture a heat dissipation apparatus with efficient isothermal and heat dissipation functions, especially how to integrate the phase change cavities with high heat transfer performance in the heat dissipation substrate to improve the thermal energy management capacity and temperature uniformity and also to ensure sealing and stable filling of a phase change material to prevent leakage and maintain long-term use performance. First, the heat dissipation substrate is accurately drilled to form the phase change holes, thereby forming the phase change cavities with the high heat transfer performance. The phase change holes are filled with the pre-selected phase change working medium, e.g., the phase change material. Finally, the two sides of each phase change hole are sealed through processes such as welding to form a sealed phase change cavity. To sum up, the technical solution not only achieves integration of the phase change cavities, but also ensures stable filling and the sealing performance of the phase change material, thereby manufacturing the heat dissipation apparatus with the efficient isothermal and heat dissipation functions. Embodiment 5 FIG. 6 is a schematic diagram of a design process of an isothermal and heat dissipation method provided by an embodiment of the present application. As shown in FIG. 6, provided in the technical solution of this embodiment is a design method of the isothermal and heat dissipation apparatus. The isothermal and heat dissipation apparatus includes the heat dissipation substrate. The method includes the following steps: arranging all the heat sources on the heat dissipation substrate; detecting a maximum temperature rise of each heat source, and calculating an average value of the maximum temperature rises of all the heat sources to obtain an average temperature rise; determining a difference value between the maximum temperature rise of each heat source and the average temperature rise to obtain a temperature rise difference value of each heat source; determining whether the temperature rise difference value of each heat source is greater than a preset uniform temperature target value; and if the temperature rise difference value of at least one heat source is greater than the preset uniform temperature target value, determining, based on a ratio of a heat generation power of each heat source to a heat transfer area, a number and position of phase change cavities of the heat dissipation substrate to be disposed. The technical problems solved by the technical solution of this embodiment are the problems of non-uniform heat dissipation and temperature difference caused by a non-uniform heat flux density in a heat dissipation apparatus for a converter, especially for a system integrating multiple heat source components (e.g., IGBTs). The components generate different degrees of heat during operation, and if the heat is not uniformly distributed on a heat dissipation substrate, it may cause certain regions to be overheated, thereby affecting the reliability and life of the components, or even leading to system failures. In the technical solution of this embodiment, first, all the heat sources are arranged on the heat dissipation substrate, and the maximum temperature rise of each heat source in a working state is recorded through detection. The maximum temperature rise is a basis for understanding the heat generation property and heat dissipation requirement of the heat source. By calculating the average value of the maximum temperature rises of all the heat sources, a representative average temperature rise level is obtained. Next, the difference value between the maximum temperature rise of each heat source and the average temperature rise is calculated to identify which heat sources deviate more from the average value in terms of heat dissipation, i.e., have a larger temperature rise difference. The preset uniform temperature target value is set as a standard for measuring the uniformity of heat dissipation. If the temperature rise difference value of any heat source is found to exceed the target value, it indicates heat dissipation conditions of the heat sources do not meet an ideal uniformity requirement. The technical solution of this embodiment further uses the ratio of the heat generation power of each heat source to the heat transfer area to guide an optimized layout of the phase change cavities in the heat dissipation substrate. Therefore, in regions with a high heat flux density (i.e., where the heat source power is large and the heat transfer area is relatively small), the design of the phase change cavities will be increased or optimized to more effectively absorb and transfer heat and reduce the phenomenon of local overheating. The phase change material can be used to store and release heat. When the temperature of the heat sources rises, the phase change material absorbs heat and undergoes phase change to help maintain a stable temperature, and when the temperature drops, the phase change material releases heat, thereby achieving a good temperature uniformity. The technical solution of this embodiment effectively improves the isothermal performance of the heat dissipation system through an accurate temperature rise analysis of the heat sources, identification of differentiated demands, and targeted layout optimization of the phase change cavities, thereby ensuring that the heat source components can work in a more stable temperature environment, thus improving the reliability and efficiency of the whole system. Embodiment 6 On the basis of the above embodiment, determining, based on the ratio of the heat generation power of each heat source to the heat transfer area, the number and position of the phase change cavities to be disposed of the heat dissipation substrate includes: obtaining a reference heat generation power and a reference heat transfer area; using a ratio of the reference heat generation power to the reference heat transfer area as a reference ratio; based on the reference ratio and a ratio of a sum of heat generation powers of each row / column of heat sources to a sum of heat transfer areas of the row / column of heat sources, obtaining a number ratio sequence of the rows / columns of phase change cavities (which, in some implementations, may be obtained directly based on the ratio of the sum of the heat generation powers of each row / column of heat sources to the sum of the heat transfer areas of the row / column of heat sources without obtaining the reference ratio); according to a proportion of a maximum number of the phase change cavities corresponding to the heat sources to a maximum value among the number ratio sequence of the rows / columns of phase change cavities, amplifying numerical values in the number ratio sequence of the rows / columns of phase change cavities and obtaining a number of phase change cavities to be disposed in each row / column; and distributing the phase change cavities to be disposed in each row / column at equal distances, where the maximum number of the phase change cavities corresponding to the heat sources is a ratio of a size of the heat sources to a thickness of corresponding positions of the heat dissipation substrate. The technical problem solved by the technical solution of this embodiment is how to accurately lay out the phase change cavities on the heat dissipation substrate to optimize the heat dissipation effect, so as to ensure that the temperature of the heat source components (e.g., IGBTs) are more uniform and thus to improve the efficiency and reliability of the whole heat dissipation system. First, the reference heat generation power and the reference heat transfer area are obtained, and the ratio of the reference heat generation power to the reference heat transfer area is calculated as the reference ratio. This step provides a reference standard for subsequent comparison and adjustment. Next, according to a total heat generation power and a total heat transfer area of each row / column of heat sources, the ratio of the total heat generation power to the total heat transfer area of each row / column of heat sources is calculated and is compared with the reference ratio. In this way, the number ratio sequence of the rows / columns of phase change cavities can be obtained, which reflects the relative intensity of the demand for the phase change cavities in different regions. In this embodiment, a theoretical maximum accommodation capacity is calculated according to the actual size of the heat sources and the thickness of the positions of the heat dissipation substrate. By combining this limiting condition with the previously obtained number ratio sequence of the rows / columns of phase change cavities, and through the operation of amplifying according to the proportion, it is ensured that the finally designed number of the phase change cavities not only meets the heat dissipation demand of the heat sources, but also does not exceed the limitation of a physical structure. Through the above steps, the finally obtained number of the phase change cavities in each row / column can better adapt to the actual heat generation situation of the heat sources. Especially for heat sources with a high power density or a limited size, more heat dissipation resources can be provided, such that a more reasonable layout of the phase change cavities is formed on the heat dissipation substrate to achieve effective dispersion and transfer of heat and improve the overall heat dissipation performance. Embodiment 7 On the basis of the above embodiment, the method further includes the following steps: determining whether the temperature rise difference value of each heat source on the heat dissipation substrate provided with the phase change cavities is greater than the preset uniform temperature target value; and if the temperature rise difference value of the at least one heat source is greater than the preset uniform temperature target value, adjusting the preset uniform temperature target value, and re-determining, based on an adjusted preset uniform temperature target value, the number and position of the phase change cavities to be disposed of the heat dissipation substrate until the temperature rise difference values of all the heat sources are less than or equal to the preset uniform temperature target value. The technical solution of this embodiment dynamically adjusts the position distribution of the phase change cavities through the process of iterative optimization until the temperature rise difference values of all the heat sources meet a preset uniformity requirement. First, the maximum temperature rise of each heat source on the heat dissipation substrate under an existing layout of the phase change cavities is detected, and the average value of the maximum temperature rises is calculated as the reference average temperature rise level. The difference value between the maximum temperature rise of each heat source and the average temperature rise, i.e., the temperature rise difference value, is determined. The temperature rise difference value of each heat source and the preset uniform temperature target value are compared to determine whether all the heat sources meet a uniform heat dissipation standard. If the temperature rise difference value of at least one heat source exceeds the preset value, it indicates that the current layout of the phase change cavities cannot achieve an ideal effect of temperature uniformity. In this case, the position distribution of the phase change cavities is adjusted again based on the ratio of the heat generation power to the heat transfer area, so as to improve the heat dissipation efficiency. This process will be repeated until the temperature rise difference values of all the heat sources are controlled within the preset uniform temperature value. Through methods of dynamic feedback and progressive optimization, the technical solution of this embodiment can ensure that when facing heat sources with different heat flux densities and layouts, the heat dissipation apparatus can provide balanced and efficient heat dissipation performance, thereby avoiding performance reduction or system failures caused by local overheating, and finally achieving stable and reliable operation of the whole heat dissipation system. Embodiment 8 Provided in the technical solution of this embodiment is a design method of the isothermal and heat dissipation apparatus. The method includes: arranging all the heat sources on the heat dissipation substrate; detecting a maximum temperature rise of each heat source, and calculating an average value of the maximum temperature rises of all the heat sources to obtain an average temperature rise; obtaining a heat generation power and a heat transfer area of each heat source and a thermal conductivity and a thickness of each heat conduction material; according to the heat generation power and the heat transfer area of each heat source and the thermal conductivity and the thickness of each heat conduction material, determining a maximum contact temperature rise generated by contact between each heat source and the heat dissipation substrate by using a contact temperature rise calculation formula, where the thickness of the heat conduction material between each heat source and the heat dissipation substrate is the same; determining a difference value between a sum of the maximum temperature rise of each heat source and the maximum contact temperature rise and the average temperature rise to obtain a contact temperature rise difference value of each heat source; and if the contact temperature rise difference value of at least one heat source is greater than the preset uniform temperature target value, adjusting the thickness or the thermal conductivity of the heat conduction material, for example, performing matching with a heat conduction material with a corresponding thermal conductivity meeting a uniform temperature reverse calculation target requirement, until the contact temperature rise difference values of all the heat sources are less than or equal to the preset uniform temperature target value. The contact temperature rise calculation formula includes: eh — Qnmb K^KnmAnm) where ATnm ch represents a maximum contact temperature rise of contact between a heat source corresponding to a position in an nth row and an mth column and the heat dissipation apparatus; Xlim represents a thermal conductivity of a heat conduction material at a point of contact between the heat source corresponding to the position in the nth row and the mth column and the heat dissipation apparatus; and b represents a thickness of the heat conduction material. The technical problem solved by the technical solution of this embodiment is how to achieve the temperature uniformity of all the heat sources in the design of the heat dissipation apparatus. First, all the heat sources are arranged on the heat dissipation substrate, detailed heat property data of each heat source, including the heat generation power, the thermal conductivity of the heat conduction material, the initial thickness of the heat conduction material and the heat transfer area, is obtained. By using the basic principle of heat conduction, the maximum contact temperature rise of contact between each heat source and the heat dissipation apparatus is calculated through the contact temperature rise calculation formula. This calculation process takes into account factors such as the heat generation intensity of the heat source, and the heat conduction efficiency and geometric dimensions of the heat conduction material to evaluate the heat dissipation situation of the heat source. By comparing the difference value between the maximum contact temperature rise of each heat source and the initial average temperature rise, whether the preset uniform temperature target value is met is determined. If a temperature rise deviation of a heat source exceeds an allowed range, it indicates that heat dissipation is not uniform. In this case, a heat conduction material corresponding to the heat source is adjusted to accurately match with an appropriate thermal conductivity to change thermal resistance, so as to adjust and control the heat dissipation performance thereof. The objective of adjustment is to control temperature rise deviations of all the heat sources within the preset uniform temperature target value, so as to achieve uniform heat dissipation throughout the system. Through such progressive optimization, it is ensured that regardless of how the power of the heat source changes, an overall temperature balance can be achieved by adjusting thermal resistance of a heat dissipation path, thereby improving the stability and efficiency of the heat dissipation system. The technical solution of this embodiment can be subjected to customized design according to properties of different heat sources to optimize the structure of the heat dissipation apparatus, thereby ensuring that good heat dissipation performance and temperature consistency between the heat sources can be maintained even under a complex heat flux condition, thus improving the reliability and service life of the whole system. Embodiment 9 Provided in the technical solution of this embodiment is a computer-readable storage medium having a computer program stored thereon, where the computer program, when executed by a processor, implements the method according to any one of the above embodiments. The above storage medium may be a flash memory, a hard disk, a multimedia card, a card type memory (e.g., a SD or DX memory, etc.), a random access memory (RAM), a static random access memory (SRAM), a read-only memory (ROM), an electrically erasable programmable read-only memory (EEPROM), a programmable read-only memory (PROM), a magnetic memory, a magnetic disk, an optical disk, a server, an APP store, etc. For other details, reference is made to the foregoing embodiments, and the details are not repeated in this embodiment. Embodiment 10 Provided in the technical solution of this embodiment is an electronic device, including a processor and a memory, where the memory has a computer program stored thereon, and the processor, when executing the computer program, implements the method according to any one of the above embodiments. The processor may be an Application Specific Integrated Circuit (ASIC), a Digital Signal Processor (DSP), a Digital Signal Processing Device (DSPD), a Programmable Logic Device (PLD), a Field Programmable Gate Array (FPGA), a controller, a microcontroller, a microprocessor, or other electronic elements and is used to perform the foregoing methods. The memory may be implemented by any type of volatile or non-volatile storage device or a combination thereof, for example, a Static Random Access Memory (SRAM), an Electrically Erasable Programmable Read-Only Memory (EEPROM), an Erasable Programmable Read-Only Memory (EPROM), a Programmable Read-Only Memory (PROM), a Read-Only Memory (ROM), a magnetic memory, a flash memory, a magnetic disk, or an optical disk. For other details, reference is made to the foregoing embodiments, and the details are not repeated in this embodiment. Embodiment 11 On the basis of the above embodiment, provided in this embodiment is an application example. The present invention belongs to the technical field of thermal management of converters. A design method for isothermal may be applied to fields of strings, industries, rail traffic, etc. Core components used in a power electronic converter are Insulated Gate Bipolar Transitors (IGBTs). With the continuous advancement of current technologies, the IGBTs have developed rapidly and undergone rapid iterative upgrades. The application fields of the IGBTs, such as a rapidly developing industrial field of rail traffic and dual-carbon industrial fields such as wind energy, solar energy, and energy storage, also undergo medium-high speed response and iterative updates for the application of power electronic components. A high-power trend based on high output performance, a trend of a high level of integration of multiple functions or multiple components, and a trend of miniaturization for weight and cost reductions are hot development directions of converters. The resulting technical problems in heat dissipation of non-uniformity, high heat flux intensity, and integration of multiple components also bring severe challenges to related thermal management work. The above heat dissipation challenges, when applied to an existing conventional heat dissipation apparatus, mainly manifest as poor isothermal performance, which may directly lead to a Buckets effect in the application process of a converter. For the above technical problems, a researcher has conducted a series of explorations and studies on the application of a heat dissipation technology from multiple directions. The main idea is to use an isothermal heat dissipation technology. Common methods are as follows. The first method is to optimize the structure of the heat dissipation apparatus according to heat generation characteristics of an object to be subjected to heat dissipation. Heat transfer is enhanced in places with a high heat flux density, and heat transfer is weakened in places with a low heat flux density, thereby creating a trade-off, thus achieving the purpose of improving the isothermal performance. The second method is to, on the basis of the original conventional heat dissipation apparatus, use uniform-temperature heat conduction units with characteristics such as a super heat conduction property and a high isothermal property, e.g., vapor chambers, and uniform-temperature heat pipes. The uniform-temperature heat pipes are inlaid into the surface of a substrate of the heat dissipation apparatus through machining, such that the whole plane of the substrate has a higher heat conduction property under the action of the uniform-temperature heat pipes, thereby enhancing heat transfer and improving the temperature uniformity. The third method is to design the heat dissipation apparatus into an integrated uniform-temperature phase change unit, such that the whole heat dissipation apparatus has a higher heat conduction property under the action of uniform-temperature phase change, and not only the plane of the substrate but also heat dissipation apparatus fins on the substrate have a higher heat conduction property, thereby achieving the effect of improving the temperature uniformity. In the above methods, the first method has a lowest implementation cost and a relatively low process threshold, but has a very limited effect of improving the temperature uniformity. The second method has a relatively low implementation cost and a good effect of improving the temperature uniformity, but has high requirements for the reliability of isothermal units such as heat pipes and the reliability of a process of inlaying the heat pipes into the heat dissipation apparatus, and there may be risks of reliability, such as thermal resistance being affected by a failure of the heat pipes due to leakage, or the deformation of the heat pipes due to the inlaying process. The third method is technically mature but has a high technical threshold, and has the best effect of temperature uniformity but is high in cost. For large-scale industrial applications, performance, reliability and cost are all important considerations. As can be seen, there is an urgent need in the art to develop an isothermal and heat dissipation product that is easy to manufacture, low in cost, high in reliability and high in performance. For the heat dissipation apparatus industrially applied to the power electronic converter in a large scale, there is an urgent need to develop and design an isothermal and heat dissipation product that is easy to manufacture, low in cost, high in reliability and high in performance. For heat dissipation conditions of a heat physical field having a non-uniform heat flux density and integrating multiple heat source components, in order to solve a Buckets effect caused by heat generation components with a high temperature having a reduced operation reliability or even failing first due to poor isothermal performance, the present application designs an isothermal and heat dissipation apparatus for a converter, and introduces a design method of the isothermal and heat dissipation apparatus. The present application mainly forms cavities with a heat pipe effect inside the substrate of the traditional heat dissipation apparatus through a process of deep hole drilling. On the one hand, the substrate is equivalent to a heat pipe shell. The substrate in the present application is integrated with the heat pipes, which, compared with a manner of inlaying the heat pipes into the substrate of the heat dissipation apparatus in the related art, reduces a layer of contact thermal resistance; on the other hand, the solution of the present application achieves longitudinal and transversal communication inside and can achieve uniform-temperature heat transfer in X and Y directions by relying on the high isothermal property of the heat pipe effect, which further enhances the heat transfer effect of the heat dissipation apparatus and greatly increases the heat transfer coefficient, thereby effectively reducing thermal resistance of a heat conduction item in heat transfer resistance and effectively improving the heat dissipation capacity. Moreover, the present application can perform flexible drilling design according to an actual application layout, which is simple in manufacture, low in threshold, significantly improves the isothermal performance and has good economy. Furthermore, taking into account that due to a difference in power density, a phase-change isothermal enhancing effect is limited, and the larger the difference in power density is, the poorer the temperature consistency is bound to be, however, the present invention starts from the contact thermal resistance, a uniform-temperature compensation design based on difference distribution of heat-conducting silicone grease is added to further balance the temperature uniformity of contact surfaces of all the heat sources, and by combining both, the purpose of meeting a high requirement for the isothermal performance of the converter is achieved. The manner of inlaying the heat pipes into the substrate of the heat dissipation apparatus in the related art has a relatively large layer of contact thermal resistance. However, longitudinally and transversally communicating phase change cavities are formed in the substrate in the present application through drilling by a deep hole drill or other manners, and the structure is integrally designed, which avoids the risks, such as the heat dissipation reliability of the elements of the object to be subjected to heat dissipation being affected by the deformation of the heat pipes caused by the heat stress due to alternate cooling and heating during long-term use of the process of inlaying the heat pipes into the substrate. Related heat pipe technologies can only achieve one-dimensional supper heat conduction. However, the present application designs a design method for distribution of deep drilled holes based on uniform temperature reverse calculation. High isothermal uniform-temperature heat transfer can be achieved in the X and Y directions by relying on a phase change effect inside cavities, which further enhances the heat transfer effect of the heat dissipation apparatus and greatly increases the heat transfer coefficient. The method can effectively improve the heat diffusion effect, thereby improving the isothermal performance of the heat dissipation apparatus. At a high heat flux density, the contact thermal resistance also has space for uniform-temperature optimization. In this regard, the present application designs a uniform-temperature compensation design method based on difference distribution of heat-conducting silicone grease. By using various contact sectional materials with a thermal conductivity, the temperature distribution of surfaces of all the heat sources coming into contact with the heat dissipation apparatus is further balanced, thereby improving the temperature uniformity. The technical problem to be solved by the present invention is to provide a design method of a heat dissipation apparatus capable of effectively improving the isothermal performance and enhancing the heat dissipation performance for heat dissipation conditions of a heat physical field having a non-uniform heat flux density and integrating multiple heat source components and, based on the method, design an isothermal and heat dissipation apparatus capable of efficiently dissipating heat. The present invention designs an isothermal and heat dissipation apparatus. By using the process of deep hole drilling, longitudinally and transversally communicating cavities are formed in the substrate of the traditional heat dissipation apparatus. The cavities are filled with a phase change working medium and are vacuumized and sealed to have a high heat-conducting and high isothermal heat transfer effect equivalent to the heat pipes. And a design method for distribution of deep drilled holes based on uniform temperature reverse calculation is designed, thereby achieving the purposes of optimizing temperature distribution of a table top of the heat dissipation apparatus, improving the isothermal performance and improving the heat dissipation performance. Taking into account that the isothermal enhancing effect of the design method for uniform-temperature distribution of the deep drilled holes based on uniform temperature reverse calculation has a certain limit, the uniform-temperature compensation design based on the difference distribution of the heat-conducting silicone grease is further added, thereby optimizing contact thermal resistance and achieving further uniform temperature enhancing of the heat dissipation apparatus. In addition, if design is conducted only by relying on the design method for distribution of the deep drilled holes based on uniform temperature reverse calculation, the higher the required effect of temperature uniformity is, the more complex machining is bound to be, and higher the cost is. By adding the compensation design of the heat-conducting silicone grease, the isothermal cost of the deep holes can be reduced, thereby achieving good isothermal and heat dissipation effects at a relatively low cost. On the one hand, the substrate is drilled by the deep hole drill to form the longitudinally and transversally communicating phase change cavities, and the structure is integrated, which, compared with the manner of inlaying the heat pipes into the substrate of the heat dissipation apparatus in the prior art, reduces a layer of contact thermal resistance. Moreover, the cavities serve as internal structures of the substrate, which avoids possible heat transfer deterioration risks, such as the risk of heat dissipation reliability of the elements of the object to be subjected to heat dissipation being affected by the deformation of the heat pipes caused by the heat stress due to alternate cooling and heating during long-term use of the process of inlaying the heat pipes into the substrate. On the other hand, an ordinary heat dissipation apparatus is subjected to deep hole drilling machining to form the longitudinally and transversally communicating cavities, the high isothermal uniform-temperature heat transfer in the X and Y directions can be achieved by relying on the phase change effect inside the cavities, which further enhances the heat transfer effect of the heat dissipation apparatus and greatly increases the heat transfer coefficient, thereby effectively reducing the thermal resistance of the heat conduction item in the heat transfer thermal resistance and effectively improving the heat dissipation capacity. Moreover, a drilling machining process is flexible, an implementation manner is simple, and according to the distribution position of the object to be subjected to heat dissipation and the distribution difference of the heat flux density in actual applications, with the purpose of achieving the optimal isothermal performance of the heat dissipation apparatus, the diameter and spacing of the drilled holes obtained through deep hole drilling construction can be flexibly set, thereby achieving the purpose of optimal isothermal performance at a relatively low cost. The deep hole drilling machining process is a flexibly optimized machining manner in an initial design stage. The present invention of design is not limited to this machining process, and other similar machining processes capable of achieving the same effect all fall within the protection scope of this patent, such as moldmaking and casting. Furthermore, taking into account that due to the difference in power density, the phase-change isothermal enhancing effect is limited, and the larger the difference in power density is, the poorer the temperature consistency is bound to be. The present invention starts from the contact thermal resistance, that is, after phase-change isothermal and heat dissipation bodies are optimized and shaped, the whole table top for the heat dissipation bodies still has a certain temperature difference due to the difference in power density of different components, and by using various contact sectional materials with a thermal conductivity, the temperature uniformity of the surfaces of all the heat sources coming into contact with the heat dissipation apparatus is further balanced. The object to be subjected to heat dissipation is illustrated by taking a certain rail traffic converter module as an example. The heat dissipation apparatus is illustrated by taking a certain forced air cooling heat dissipation manner as an example. Other cases where the same design method is used to achieve the same isothermal and heat dissipation effect are still applicable. IGBTs of the converter module as the object to be subjected to heat dissipation are mounted on the surface of the substrate and are fastened through the torque of bolts. There is certainly a certain air gap therebetween. Since air has a very small thermal conductivity, there is a need to coat heat-conducting silicone grease with a certain thermal conductivity, or a heat-conducting sectional material such as graphene and a bottom sheet between a substrate for IGBT components and a substrate for heat dissipation bodies of the heat dissipation apparatus, which is conducive to reducing contact thermal resistance and improving the heat dissipation performance. The converter module as the object to be subjected to heat dissipation integrates the plurality of IGBTs with different sizes and different power density levels. On the substrate for the heat dissipation bodies of the heat dissipation apparatus, a plurality of longitudinally and transversally staggered cavities with a specific size are machined through a deep hole drilling process. The cavities are used to be filled with a certain amount of phase change working medium and are welded and sealed to be equivalent to high isothermal uniform-temperature phase change heat dissipation bodies having an ultra-high thermal conductivity in the X and Y directions. A specific implementation of an isothermal and heat dissipation apparatus for a converter is shown in FIG. 1 to FIG. 4. The main structure of the isothermal and heat dissipation apparatus for the converter in the present invention includes a substrate 1 for the heat dissipation bodies, fins 2 for the heat dissipation bodies, phase change cavities 3, heat sources 4 and contact interface material layers 5. The substrate 1 for the heat dissipation bodies and the fins 2 for the heat dissipation bodies are main bodies of the heat dissipater apparatus. In the technical solution of this embodiment, the substrate 1 for the heat dissipation bodies and the fins 2 for the heat dissipation bodies are machined from aluminum ingots of a specific size subjected to moldmaking and casting through a shovel tooth process, or are manufactured through profile moldmaking or by welding a roll-bond evaporator and conventional fins to the substrate, etc. The phase change cavities 3 may be machined through the deep hole drilling process. The longitudinally and transversally staggered phase change cavities with a certain diameter are obtained on the whole substrate for the heat dissipation bodies. The phase change cavities are filled with a preset amount of phase change working medium. In order to enhance the anti-gravity capacity of heat dissipation and phase-change isothermal, a layer of liquid absorbing cores may further be sintered inside each cavity, and then the cavities are vacuumized and sealed through welding, such that equivalent heat pipes having an ultra-high heat conduction property in an X / Y direction are formed inside the heat dissipation bodies to perform isothermal on the plurality of heat sources. The heat sources 4 include IGBTs or experimental heat generation simulating heat sources. The contact interface material layers 5 each may be filled with an interface material such as heat-conducting silicone grease, a heat-conducting pad, or graphene, such that the IGBTs are in intimate contact with the substrate for the heat dissipation bodies after being mounted on the substrate for the heat dissipation bodies through bolts, thereby reducing thermal resistance generated by air gaps. In this case, as shown in the front view of FIG. 2, the heat dissipation fins 2 for the heat dissipation bodies are assumed to have an optimal combination of fin height, fin thickness and spacing for the heat dissipation efficiency, which remains unchanged throughout the design process. As shown in the top view of FIG. 4, dashed lines indicate the cavities drilled inside. The cavities are in communication with each other in a longitudinally and transversally staggered manner to achieve extensive coverage of the phase change working medium in the X / Y direction within the whole substrate for the heat dissipation bodies. The design method for distribution of the deep drilled holes based on uniform temperature reverse calculation: For heat dissipation of the converter module having a plurality of rows of components with a non-uniform heat flow density, on the one hand, since in the process of convective heat exchange air exchanges heat with the rows of IGBTs in an air inlet direction, the heat will be continuously accumulated, and air heats up, which may cause a temperature difference between the first row of IGBT components and the last row of IGBT components to reach, for example, 10 K or even higher, and the higher the power density of the IGBTs is, the larger the temperature difference is. On the other hand, differences between heat dissipation conditions of the power components may also generate a certain temperature difference. Both are main causes of the poor isothermal performance of the whole heat dissipation apparatus. In order to effectively eliminate the phenomenon of non-uniform heat dissipation of the object subjected to heat dissipation, the distribution of the IGBTs shown in FIG. 4 is as expressed in Expression 1-1, where: Qnm=knm*Anm*ATnm 1-1 △Tnm represents a maximum temperature rise of an IGBT corresponding to a position in an nth row and an mth column, measured in units of K; Qnm represents a heat generation power of the IGBT corresponding to the position in the nth row and the mth column, measured in units of W; knm represents a heat transfer coefficient of the IGBT corresponding to the position of a maximum temperature point in the nth row and the mth column, measured in units of W / (m2-K), and knm is a variable simplified from multiple parameters and is related to multiple factors such as a thermal conductivity corresponding to a material influence of the heat dissipation apparatus and a convective heat transfer coefficient corresponding to a heat dissipation structure; and Anm represents a relative heat transfer area of the IGBT corresponding to the position in the nth row and the mth column, measured in units of m2. Assuming that a sum of powers of components in the first row is Qhi and a sum of contact heat transfer areas is Ahi, a sum of powers of components in the nth row is Qhn, a sum of contact heat transfer areas is Aim, there being m components in each row. Correspondingly, assuming that a sum of powers in the first column is Qzi and a sum of contact heat transfer areas is Azi, a sum of powers of the mth column is Qzm, and a sum of contact heat transfer areas is Azm, there being n components in each column. For an ordinary profile or a shovel-tooth heat dissipater, Anm may be regarded as an area of the size of a surface of the IGBT substrate coming into contact with the heat dissipation apparatus. For the heat dissipation apparatus having the phase-change isothermal cavities inside, since the internal deep drilled holes are equivalent to the heat pipe effect, the heat of the heat sources, i.e., IGBTs of the converter module may be diffused to a larger heat transfer surface, and a heat transfer coefficient may be balanced after phase-change isothermal. The objective of the solution is to improve the isothermal performance of the heat dissipation apparatus, that is, to ensure the consistency of temperature distribution of each IGBT. Heat exchange is enhanced according to the Expression 1-1. The relative heat transfer coefficient of each heat source may be uniformly enhanced by increasing the heat transfer area, thereby achieving the purpose of enhancing the overall heat transfer efficiency. When the temperature rise of a certain IGBT is large, the number of the transverse and longitudinal drilled holes is increased to increase the heat transfer area. Moreover, taking into account the influence of position distribution, fewer holes need to be drilled below IGBTs close to the position of an air inlet, and more holes need to be drilled below IGBTs away from the position of the air inlet, thereby ensuring that there are more phase change cavities extending and covering IGBTs at positions with poor heat dissipation conditions, such that heat is diffused to a larger heat transfer surface for enhanced transfer to reduce the temperature rise, thereby achieving the purpose of improving the isothermal of the whole heat dissipation apparatus. According to the above principle, specific implementation steps are as follows. Step one, according to actual application power conditions of the IGBTs of the converter module and overall structural size conditions allowed by the heat dissipation design, optimal matching structural features for the size of the fins for the heat dissipation bodies are determined through optimizing according to design experience and remain unchanged. Step two, as shown in FIG. 4, according to the actual power distribution of the IGBTs during operation, an original solution of conventional heat dissipation bodies without drilled holes is initially adopted. Step three, temperature distribution of the IGBTs is obtained through a simulation or testing method, and the maximum temperature rise ATnm of each IGBT is obtained through statistics. An average value is calculated after summing to obtain an initial average temperature rise ATnmavgof all the IGBTs. Step four, according to project requirements, a uniform temperature target value x is determined. In this embodiment, x=3 K. The x value shall not be set too small. If the x value is too small, the phase-change isothermal effect will be easy to achieve initially but increasingly difficult later on, leading to overly high requirements, which requires corresponding adjustments to the uniform-temperature phase-change working medium, cavity design, etc. As a result, research and development investments are greatly increased while returns are progressively diminished, resulting in a high implementation cost that is not conducive to productization of engineering applications. Moreover, ideal superconducting isothermal conditions cannot be achieved in the practical engineerings. If the x value is too large, a uniform-temperature application target, e.g., more than 5 K, cannot be met, where taking into account positive and negative fluctuations, an amplitude reaches 10 K. That is, taking into account a Buckets effect of the heat dissipation design, the temperature rise margin for the heat dissipater design is reduced by 10K, which is not conducive to lean design. Therefore, in this embodiment, x is assumed to be 3 K. Step five, a uniform temperature reference value is defined. One or more IGBTs meeting -x <ATnm - ATnm avg< x are found through sourcing. That is, the power Qnm of the IGBT and the contact heat transfer area Anm corresponding to ATnm meeting the uniform temperature target may serve as references. When multiple IGBTs meet the condition, ATnm__a, Amn^a and Qnm_a closest to ATnm avg are selected as references. According to Expression 1-2, they may be transformed into ATnm=Qnm / (Anm*knm). Step six, for the distribution design of deep drilled holes of IGBTs in each row, a ratio of ratios of the sums of powers to the sums of contact areas of the rows of IGBTs, i.e., Qhi / Ahi: Qh2 / Ah2: ...: Qhn / Ahn is calculated first. Assuming there are four rows, the ratio is 0.5: 1: 1: 1.35. Calculating is performed according to the area of the IGBT and the thickness of the drilled substrate, assuming that at most five rows of holes may be drilled below each IGBT at equal distances, and based on ratio rounding off and equivalent calculation, the distribution of four rows of drilled holes may be determined as 1:2: 2: 3, that is, one hole in the first row, second holes in the second row, second holes in the third row, and three holes in the fourth row. In fact, the ratio of the above four rows is a ratio of non-integers, i.e., 1: 2: 2: 2.7. The number of holes must be rounded to the nearest whole number, i.e., using a rounding-off method. Then, corresponding conversions are performed according to a ratio of sectional areas of the holes or sections in other shapes. Taking circular holes as an example, diameters of the circular holes in the first / second / third rows at a ratio of integers are the same. If conditions allowed, the diameter is assumed to be 10 mm, then the sectional area is converted based on the proportion, and the diameter of the circular holes in the fourth row is 9 mm. Moreover, the drilled holes below each IGBT are distributed at equal distances according to the size of the IGBT. For example, the minimum IGBT in the third row has a longitudinal length of 120 mm, and then the equal distance between three holes is 30 mm. Step seven, for the distribution design of deep drilled holes of IGBTs in each column, similarly, a ratio of ratios of the sums of powers to the sums of contact areas of the columns of IGBTs, i.e., Qsi / Asi: QS2 / AS2: ...: Qsm / Asm is calculated. Assuming there are five columns, the ratio is 1.33: 2: 1: 1: 0.67. Calculating is performed according to the area of the IGBT and the thickness of the drilled substrate, assuming that at most six columns of holes may be drilled below each IGBT at equal distances, and based on ratio rounding off and equivalent calculation, the distribution of five columns of drilled holes may be determined as 4: 6: 3: 3: 2, that is, four holes in the first column, six holes in the second column, third holes in the third column, three hole in the fourth column, and two holes in the fifth column. In fact, the ratio of the above five columns is a ratio of non-integers, i.e., 3.6: 6: 3: 3: 2.4. The number of holes must be rounded to the nearest whole number. Then, corresponding conversions are performed according to a ratio of sectional areas of the holes or sections in other shapes. Taking circular holes as an example, diameters of the circular holes in the second / third / fourth column at a ratio of integers are the same. If conditions allowed, the diameter is assumed to be 8 mm, then the diameter of the circular holes in the first column is 9 mm, and the diameter of the circular holes in the fifth column is 12 mm. Moreover, the drilled holes below each IGBT are distributed at equal distances according to the size of the IGBT. For example, the minimum IGBT in the third column has a longitudinal length of 120 mm, and then the equal distance between three holes is 30 mm. Step eight, the adjustment solution for the number and distribution of the deep drilled holes are re-established according to step five, step six and step seven, and then step three to step four are performed. If any ATnm meets the uniform temperature target condition of -x <ATnm - ATm avg <x, a distribution solution of the deep drilled holes meeting the condition is output; otherwise, a cycle of step five to step six to step seven is continued until the determination requirement of step four is met, thus obtaining the distribution solution of the deep drilled holes meeting the requirement. Further, taking into account that the isothermal efficiency of the uniform-temperature distribution of the deep drilled holes has a certain limit, to achieve an excellent temperature uniformity, the higher the implementation difficulty is, the higher the cost is. Moreover, a determined uniform-temperature distribution solution exhibits a linear deterioration in uniformity as losses increase. In this design, a uniform-temperature compensation design method based on difference distribution of heat-conducting silicone grease is added to perform uniform-temperature compensation. According to a one-dimensional heat-conducting heat network model, the heat-conducting silicone grease can effectively avoid the problem of large thermal resistance caused by air gaps when the IGBTs come into contact with the substrate of the heat dissipation apparatus. As shown in a contact temperature rise calculation formula 1-2, ATnm ch represents a maximum contact temperature rise of contact between an IGBT corresponding to a position in an nth row and an mth column and the heat dissipation apparatus; Am represents a thermal conductivity of heat-conducting silicone grease at a point of contact between the IGBT corresponding to the position in the nth row and the mth column and the heat dissipation apparatus, in units of K / Wm; and b represents a thickness of the heat-conducting silicone grease, in units of m. Assuming that the heat-conducting silicone grease is uniformly applied through a tooling by default, the thickness is consistent and is a constant. ATnm_ch— Qnmb । 2 In the process of testing or simulation, grooves are formed in heat generation blocks to arrange temperature measuring probes, or heat contact surfaces of the heat sources are simulated to design temperature probes, thereby equivalently obtaining a maximum temperature rise ATnm c of the surface of the heat-conducting silicone grease on the heat dissipation apparatus coming contact with each heat source relative to the environment, which is used as a final index for evaluating the isothermal performance of the whole heat dissipation apparatus. ATnm c ATnnA ATnm ch 1-3 The uniform-temperature compensation design method based on difference distribution of the heat-conducting silicone grease: Step one, a uniform temperature target x of the heat dissipation apparatus is determined according to the design method for distribution of the deep drilled holes based on uniform temperature reverse calculation. Assuming x=3 K, taking into account the range of positive and negative fluctuations, after the heat-conducting silicone grease is removed from the heat dissipation apparatus, the surface temperature difference at measuring points is 6 K. Step two, ATum avg finally determined according to the design method for distribution of the deep drilled holes based on uniform temperature reverse calculation is used as a reference, and currently commonly used heat-conducting silicone grease of 1 K / Wm is selected for it. At the same time, according to 1-2 and 1-3, the thermal conductivity of the heat-conducting silicone grease is calculated reversely using the consistency of ATnm c of all the IGBT components as the criterion. Calculation example: according to the above method, assuming ATnmavg=50 K, the corresponding average loss of the IGBT is Qnm_avg=1000 W, the corresponding contact area of the component IS Anm avg 0.1*0.1 m2 and b=0.0001 m, the corresponding contact temperature rise of the heat-conducting silicone grease is △Tnm ch avg=1000*0.0001 / (0.1*0.l*l)=10K. In addition, assuming ATn=47 K, the corresponding average loss of the IGBT is Qi2=1500 W, the corresponding contact area of the component is Ai2=0.1*0.2 m2 and b=0.0001 m, the corresponding contact temperature rise of the heat-conducting silicone grease is △Ti2 ch=ATnm_avg+ATnm_ch_avg-ATi2=50+l 0-47=13 K, the corresponding thermal conductivity of the heat-conducting silicone grease coated below an IGBT corresponding to a position in the first row and the second column is Xi2=13*0.1*0.2 / (1500*0.0001)=1.73 K / Wm, in this case, the corresponding temperature rise of a measuring point of the lower surface of the IGBT corresponding to the position in the first row and the second column of the heat dissipation apparatus relative to the environment temperature is AT12 c=ATnm c avg=60 K. The target effect of achieving the isothermal performance of the whole heat dissipation apparatus is achieved by adjusting the distribution of the heat-conducting silicone grease. In addition to air-cooling heat dissipation manner, the design solution of deep hole drilling phase-change isothermal and heat dissipation of the present invention are also applicable to other water-cooling and composite heat dissipation apparatuses. The design method of the present invention is also applicable to other locomotives, EMUs and industrial converters. In the present invention, machining manners of the drilled cavities in the design method for distribution of the deep drilled holes based on uniform temperature reverse calculation include, but are not limited to, a manner of deep hole drilling, which is only one of the implementations based on the design method for uniform-temperature distribution, further include other feasible processes such as machining with a slotting machine after distribution design, and then overall welding. The substrate is drilled to form the longitudinally and transversally communicating phase change cavities, and the structure is integrated, which, compared with the manner of inlaying the heat pipes into the substrate of the heat dissipation apparatus in the prior art, reduces a layer of contact thermal resistance, and is thus conducive to enhancing the heat transfer performance. The drilled cavities, as internal structures of the substrate of the heat dissipation apparatus, have a higher reliability, which can avoid the risks of reliability of the heat dissipation apparatus such as contact thermal resistance of elements of the object to be subjected to heat dissipation being affected by the deformation of the heat pipes during use of the process of inlaying the heat pipes into the substrate caused by a heat stress due to long-term alternate cooling and heating. The longitudinally and transversally communicating cavities can achieve high isothermal uniform-temperature heat transfer in the X and Y directions by relying on phase change of the internal working medium. Compared with conventional heat pipes that only enhance the high heat conduction property in a single axial direction, the isothermal effect of enhancement on a two-dimensional plane in both X and Y directions is better. Based on a deep hole drilling process, the longitudinally and transversally communicating cavities are machined in the ordinary heat dissipation apparatus. The deep hole drilling process is simple, low in cost and high in operability. According to the distribution positions of the components of the object to be subjected to heat dissipation and the distribution difference of the heat flux density, with the purpose of achieving the optimal isothermal performance of the heat dissipation apparatus, the diameter and spacing of the drilled holes obtained through deep hole drilling construction can be flexibly set, thereby achieving the purpose of optimal isothermal performance at a relatively low cost and achieving good economy. After the holes are drilled in the substrate, the substrate, compared with the original ordinary heat dissipation apparatus, can have an improved heat dissipation effect and accordingly a reduced weight. The design provides the design method for distribution of the deep drilled holes based on uniform temperature reverse calculation to implement an optimization solution of the diameter and spacing of the drilled holes, and on this basis, the uniform-temperature compensation design method based on difference distribution of the heat-conducting silicone grease is added to achieve a better isothermal effect of the heat dissipation apparatus. In the embodiments provided in the present invention, it should be understood that the disclosed apparatus and method may also be implemented in other manners. The apparatus embodiments described above are merely illustrative. For example, the flowcharts and block diagrams in the accompanying drawings show system architectures, functions and operations possibly implemented by the devices, methods and computer program products according to the plurality of embodiments of the present invention. In this regard, each block in the flowcharts or block diagrams may represent a module, a portion of a program, or a portion of code, which includes one or more executable instructions used for implementing specified logical functions. It should also be noted that in some alternative implementations, the functions shown in the blocks may also be executed in an order different from those illustrated in the accompanying drawings. For example, two consecutive blocks may actually be executed substantially in parallel, and they may sometimes be executed in a reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or the flowcharts, and a combination of blocks in the block diagrams and / or the flowcharts can be implemented by special purpose hardware-based systems that execute specified functions or acts, or combinations of special purpose hardware and computer instructions. It is to be noted that in the present invention, terms “include”, “comprise” or any other variants thereof are intended to cover non-exclusive inclusions, so that a process, method, object, or device including a series of elements not only includes those elements but also includes other elements which are not clearly listed or further includes elements intrinsic to the process, method, object, or device. In the absence of more restrictions, an element defined by “include a ...” does not exclude the presence of additional identical elements in the process, method, object, or device that includes the element. Although the implementations disclosed in the present invention are described above, the above contents are implementations adopted merely for the purpose of facilitating understanding of the present invention and are not intended to limit the present invention. Any person skilled in the technical field to which the present invention belongs may make any modification or change in the form and details of implementation without departing from the spirit and scope of the present invention, but the scope of patent protection of the present invention shall still be subjected to the scope defined by the appended claims.

Claims

1. An isothermal and heat dissipation apparatus, wherein the isothermal and heat dissipation apparatus comprises a heat dissipation substrate, wherein an upper surface and a lower surface of the heat dissipation substrate are a heat source surface and a heat dissipation surface, respectively, and the heat dissipation substrate is drilled to form phase change cavities inside, the phase change cavities being parallel to the heat source surface and the heat dissipation surface.

2. The isothermal and heat dissipation apparatus according to claim 1, wherein the phase change cavities comprise rows of phase change cavities distributed in a row direction of heat sources and columns of phase change cavities distributed in a column direction of the heat sources, the rows of phase change cavities and the columns of phase change cavities being connected to and in communication with each other.

3. The isothermal and heat dissipation apparatus according to claim 2, wherein the heat source surface of the isothermal and heat dissipation apparatus is provided with a plurality of heat source regions, each heat source region covering at least one phase change cavity connecting region and being provided with a heat conduction material layer.

4. A manufacturing method of the isothermal and heat dissipation apparatus according to any one of claims 1 to 3, wherein the manufacturing method comprises the following steps:drilling the heat dissipation substrate to obtain phase change holes;filling the phase change holes with a phase change working medium; andsealing two sides of each phase change hole to obtain a sealed phase change cavity.

5. A design method of the isothermal and heat dissipation apparatus according to any one of claims 1 to 3, wherein the method comprises the following steps:arranging all the heat sources on the heat dissipation substrate;detecting a maximum temperature rise of each heat source, and calculating an average value of the maximum temperature rises of all the heat sources to obtain an average temperature rise;determining a difference value between the maximum temperature rise of each heat source and the average temperature rise to obtain a temperature rise difference value of each heat source;determining whether the temperature rise difference value of each heat source is greater than a preset uniform temperature target value; andin a case that the temperature rise difference value of at least one heat source is greater than the preset uniform temperature target value, determining, based on a ratio of a heat generation power of each heat source to a heat transfer area, a number and position of phase change cavities of the heat dissipation substrate to be disposed.

6. The design method of the isothermal and heat dissipation apparatus according to claim 5, wherein determining, based on the ratio of the heat generation power of each heat source to the heat transfer area, the number and position of the phase change cavities to be disposed of the heat dissipation substrate comprises the following steps:based on a ratio of a sum of heat generation powers of each row / column of heat sources to a sum of heat transfer areas of the row / column of heat sources, obtaining a number ratio sequence of the rows / columns of phase change cavities;according to a proportion of a maximum number of the phase change cavities corresponding to the heat sources to a maximum value among the number ratio sequence of the rows / columns of phase change cavities, amplifying numerical values in the number ratio sequence of the rows / columns of phase change cavities and obtaining a number of phase change cavities to be disposed in each row / column; anddistributing the phase change cavities to be disposed in each row / column at equal distances,wherein the maximum number of the phase change cavities corresponding to the heat sources is a ratio of a size of the heat sources to a thickness of corresponding positions of the heat dissipation substrate.

7. The design method of the isothermal and heat dissipation apparatus according to claim 6, wherein the method further comprises the following steps:determining whether the temperature rise difference value of each heat source on the heat dissipation substrate provided with the phase change cavities is greater than the preset uniform temperature target value; andin a case that the temperature rise difference value of the at least one heat source is greater than the preset uniform temperature target value, adjusting the presetuniform temperature target value, and re-determining, based on an adjusted preset uniform temperature target value, the number and position of the phase change cavities to be disposed of the heat dissipation substrate until the temperature rise difference values of all the heat sources are less than or equal to the preset uniform temperature target value.

8. A design method of the isothermal and heat dissipation apparatus according to any one of claims 1 to 3, wherein the method comprises the following steps:arranging all the heat sources on the heat dissipation substrate;detecting a maximum temperature rise of each heat source, and calculating an average value of the maximum temperature rises of all the heat sources to obtain an average temperature rise;obtaining a heat generation power and a heat transfer area of each heat source and a thermal conductivity and a thickness of each heat conduction material;according to the heat generation power and the heat transfer area of each heat source and the thermal conductivity and the thickness of each heat conduction material, determining a maximum contact temperature rise generated by contact between each heat source and the heat dissipation substrate by using a contact temperature rise calculation formula, wherein the thickness of the heat conduction material between each heat source and the heat dissipation substrate is a same;determining a difference value between a sum of the maximum temperature rise of each heat source and the maximum contact temperature rise and the average temperature rise to obtain a contact temperature rise difference value of each heat source; andin a case that the contact temperature rise difference value of at least one heat source is greater than the preset uniform temperature target value, adjusting the corresponding heat conduction material until the contact temperature rise difference values of all the heat sources are less than or equal to the preset uniform temperature target value.

9. The design method of the isothermal and heat dissipation apparatus according to claim 8, wherein the contact temperature rise calculation formula comprises:ATnn,_ch — Qnm b / (^nmAwherein △Tum ch represents a maximum contact temperature rise of contact between a heat source corresponding to a position in an nth row and an mth columnand the heat dissipation apparatus; Xnm represents a thermal conductivity of a heat conduction material at a point of contact between the heat source in the nth row and the mth column and the heat dissipation apparatus; and b represents a thickness of the heat conduction material.5 10. A computer-readable storage medium having a computer program storedthereon, wherein the computer program, when executed by a processor, implements the method according to any one of claims 4 to 9.

11. An electronic device, comprising a processor and a memory, wherein the memory has a computer program stored thereon, and the processor, when executing 10 the computer program, implements the method according to any one of claims 4 to 9.

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