Method and apparatus for supporting multi-hop sidelink relay
By modifying the SRAP layer to support 'last', 'intermediate', and 'first' Relay UEs with additional UE IDs and next-hop information, the patent addresses the limitations of existing sidelink relaying technologies, enabling efficient multi-hop data transmission in complex relay networks.
Patent Information
- Authority / Receiving Office
- GB · GB
- Patent Type
- Applications
- Current Assignee / Owner
- SAMSUNG ELECTRONICS CO LTD
- Filing Date
- 2025-09-10
- Publication Date
- 2026-06-24
AI Technical Summary
The existing 3GPP specifications for sidelink relaying do not adequately address multi-hop scenarios, lacking detailed changes to the SRAP layer to support extended connectivity and efficient data transmission in complex relay networks.
Implement modifications to the SRAP layer to support multi-hop scenarios by introducing explicit configurations for 'last', 'intermediate', and 'first' Relay UEs, including additional UE ID fields and next-hop information, and adapting SRAP operations to handle end-to-end bearers and hop-by-hop functions.
Enables efficient multi-hop sidelink relaying by ensuring proper data routing and identification across multiple relay nodes, enhancing network connectivity and reducing operational complexity.
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