Laminate-type electronic component

Abstract

To provide a laminate-type electronic component of which the capacity per unit volume is increased.SOLUTION: A laminate-type electronic component 1000 comprises: a main body 110 including dielectric layers 111 and first (second) internal electrodes 121(122), and having a first face and a second face opposed to each other in a first direction, a third face and a fourth face connected to the first and second faces and opposed to each other in a second direction, and a fifth face and a sixth face connected to the first to fourth faces and opposed to each other in a third direction; a first (second) external electrode 131 (132) including a first (second) connection part 131a (132a) disposed on the third face, a first (second) band part 131b (132b) from the first (second) connection part to part of the first face, and a third (fourth) band part 131c (132c) from the first (second) connection part to part of the second face; and an insulation layer 151 disposed on the first and second connection parts so as to cover the second face, and the third and fourth band parts. The insulation layer contains a zirconium-containing oxide.SELECTED DRAWING: Figure 3

Description

[Technical Field]

[0001] This invention relates to a stacked electronic component. [Background technology]

[0002] A multilayer ceramic capacitor (MLCC), a type of multilayer electronic component, is a chip-type capacitor that is mounted on the printed circuit boards of various electronic products such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones, and plays the role of charging or discharging electricity.

[0003] Such multilayer ceramic capacitors can be used as components in a variety of electronic devices due to their advantages of being small, yet guaranteeing high capacitance, and being easy to mount. As various electronic devices such as computers and mobile devices become smaller and more powerful, the demand for smaller and higher-capacitance multilayer ceramic capacitors is increasing.

[0004] Furthermore, in recent years, industry interest in automotive electronic components has increased, and multilayer ceramic capacitors are required to have high reliability characteristics for use in automobiles and infotainment systems.

[0005] To miniaturize and increase the capacitance of multilayer ceramic capacitors, it is necessary to form the internal electrodes and dielectric layers thinly and increase the number of layers. This requires minimizing the volume of parts that do not affect capacitance formation and increasing the effective volume fraction necessary to achieve the required capacitance.

[0006] Furthermore, in order to mount the maximum number of components within a limited circuit board area, it is necessary to minimize the mounting space.

[0007] Furthermore, as multilayer ceramic capacitors become smaller and their capacitance increases, the margin thickness decreases, making it easier for moisture or plating solution to penetrate from the outside, which can lead to reduced reliability. Therefore, there is a need for a method to protect multilayer ceramic capacitors from moisture or plating solution penetration from the outside. [Overview of the project] [Problems that the invention aims to solve]

[0008] One of the various objectives of the present invention is to provide a stacked electronic component with improved capacity per unit volume.

[0009] One of the various objectives of the present invention is to provide a multilayer electronic component with improved reliability.

[0010] One of the various objectives of the present invention is to provide a stacked electronic component that can minimize the mounting space.

[0011] However, the objectives of the present invention are not limited to those described above and can be more easily understood in the process of describing specific embodiments of the present invention. [Means for solving the problem]

[0012] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately with the dielectric layer in between, a body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, and a third band portion including a first connecting portion arranged on the third surface, a first band portion extending from the first connecting portion to a part of the first surface, and a third band portion extending from the first connecting portion to a part of the second surface. The device includes: 1 an external electrode; 2 an external electrode including a second connecting portion disposed on the fourth surface, a second band portion extending from the second connecting portion to a part of the first surface, and a fourth band portion extending from the second connecting portion to a part of the second surface; 3 an insulating layer disposed on the first and second connecting portions and covering the second surface, third and fourth band portions; 4 a first plating layer disposed on the first band portion; and 5 a second plating layer disposed on the second band portion, wherein the insulating layer may contain an oxide containing zirconium (Zr).

[0013] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes alternately arranged with the dielectric layer in between, and comprises a body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction; a first external electrode including a first connection portion arranged on the third surface and a first band portion extending from the first connection portion to a part of the first surface; a second external electrode including a second connection portion arranged on the fourth surface and a second band portion extending from the second connection portion to a part of the first surface; an insulating layer arranged on the second surface and extending over the first and second connection portions; a first plating layer arranged on the first band portion; and a second plating layer arranged on the second band portion, wherein the insulating layer may include an oxide containing zirconium (Zr).

[0014] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately with the dielectric layer in between, a body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, a first external electrode including a first connecting portion arranged on the third surface, a first band portion extending from the first connecting portion to a part of the first surface, a third band portion extending from the first connecting portion to a part of the second surface, and the fourth surface The device includes a second external electrode comprising a second connecting portion positioned on the first surface, a second band portion extending from the second connecting portion to a part of the first surface, and a fourth band portion extending from the second connecting portion to a part of the second surface; an insulating layer positioned on the first and second connecting portions and covering the second surface, third and fourth band portions; a first plating layer positioned on the first band portion; and a second plating layer positioned on the second band portion, wherein the insulating layer contains an oxide containing zirconium (Zr), and the insulating layer may substantially not contain yttrium (Y).

[0015] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes alternately arranged with the dielectric layer in between, and comprises a body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction; a first external electrode including a first connection portion arranged on the third surface and a first band portion extending from the first connection portion to a part of the first surface; a second external electrode including a second connection portion arranged on the fourth surface and a second band portion extending from the second connection portion to a part of the first surface; an insulating layer arranged on the second surface and extending over the first and second connection portions; a first plating layer arranged on the first band portion; and a second plating layer arranged on the second band portion, wherein the insulating layer includes an oxide containing zirconium (Zr), and the insulating layer may substantially not contain yttrium (Y).

[0016] A stacked electronic component according to one embodiment of the present invention includes a dielectric layer and first and second internal electrodes arranged alternately with the dielectric layer in between, a body including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, a first external electrode including a first connecting portion arranged on the third surface, a first band portion extending from the first connecting portion to a part of the first surface, and a first corner portion extending from the first connecting portion to the corner connecting the second and third surfaces, a second connecting portion arranged on the fourth surface, a second band portion extending from the second connecting portion to a part of the first surface, and extending from the second connecting portion to the corner connecting the second and fourth surfaces The device includes a second external electrode including a second corner portion, an insulating layer disposed on the first and second connection portions and positioned to cover the second surface, the first and second corner portions, a first plating layer disposed on the first band portion, and a second plating layer disposed on the second band portion, wherein when the average size in the second direction from the extension line of the third surface to the end of the first corner portion is B3, the average size in the second direction from the extension line of the fourth surface to the end of the second corner portion is B4, the average size in the second direction of the region separated from the third surface and the second internal electrode is G1, and the average size in the second direction of the region separated from the fourth surface and the first internal electrode is G2, the conditions B3≦G1 and B4≦G2 are satisfied, and the insulating layer may contain an oxide containing zirconium (Zr).

[0017] A multilayer electronic component according to an embodiment of the present invention includes a dielectric layer, first and second internal electrodes alternately arranged with the dielectric layer interposed therebetween, first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, a main body, a first external electrode including a first connection electrode disposed on the third surface and a first band electrode disposed on the first surface and connected to the first connection electrode, a second external electrode including a second connection electrode disposed on the fourth surface and a second band electrode disposed on the first surface and connected to the second connection electrode, a first insulating layer disposed on the first connection electrode, a second insulating layer disposed on the second connection electrode, a first plating layer disposed on the first band electrode, and a second plating layer disposed on the second band electrode. The first and second insulating layers can include an oxide containing zirconium (Zr).

Effects of the Invention

[0018] As one of various effects of the present invention, by disposing an insulating layer on the connection portion of the external electrode and a plating layer on the band portion of the external electrode, it is possible to improve the reliability while improving the capacitance per unit volume of the multilayer electronic component.

[0019] As one of various effects of the present invention, the mounting space of the multilayer electronic component can be minimized.

[0020] As one of various effects of the present invention, since the insulating layer contains an oxide containing zirconium (Zr), it is possible to improve the moisture resistance reliability and acid resistance to the plating solution, and suppress the generation and propagation of cracks.

[0021] However, the various and beneficial advantages and effects of the present invention are not limited to the above-described content, and can be more easily understood in the process of describing specific embodiments of the present invention.

Brief Description of the Drawings

[0022] [Figure 1]A perspective view of a multilayer electronic component according to an embodiment of the present invention is schematically illustrated. [Figure 2] A perspective view of the main body of the multilayer electronic component in FIG. 1 is schematically illustrated. [Figure 3] A cross-sectional view taken along line I-I' in FIG. 1. [Figure 4] An exploded perspective view schematically showing the main body in FIG. 2 disassembled. [Figure 5] A perspective view of a substrate on which the multilayer electronic component in FIG. 1 is mounted is schematically illustrated. [Figure 6] A perspective view of a multilayer electronic component according to an embodiment of the present invention is schematically illustrated. [Figure 7] A cross-sectional view taken along line II-II' in FIG. 6. [Figure 8] A perspective view of a multilayer electronic component according to an embodiment of the present invention is schematically illustrated. [Figure 9] A cross-sectional view taken along line III-III' in FIG. 8. [Figure 10] A perspective view of a multilayer electronic component according to an embodiment of the present invention is schematically illustrated. [Figure 11] A cross-sectional view taken along line IV-IV' in FIG. 10. [Figure 12] A perspective view of a multilayer electronic component according to an embodiment of the present invention is schematically illustrated. [Figure 13] A cross-sectional view taken along line V-V' in FIG. 12. [Figure 14] A perspective view of a multilayer electronic component according to an embodiment of the present invention is schematically illustrated. [Figure 15] A cross-sectional view taken along line VI-VI' in FIG. 14. [Figure 16] An illustration of a modified example of FIG. 14. [Figure 17] A perspective view of a multilayer electronic component according to an embodiment of the present invention is schematically illustrated. [Figure 18] A cross-sectional view taken along line VII-VII' in FIG. 17. [Figure 19]This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 20] This is a cross-sectional view along line VIII-VIII' in Figure 19. [Figure 21] This is a modified example of Figure 19. [Figure 22] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 23] This is a cross-sectional view along line IX-IX' in Figure 22. [Figure 24] This figure illustrates a modified version of Figure 22. [Figure 25] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 26] This is a cross-sectional view along line X-X' in Figure 25. [Figure 27] This figure illustrates a modified version of Figure 25. [Figure 28] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 29] This is a cross-sectional view along line XI-XI' in Figure 28. [Figure 30] This is a modified example of Figure 28. [Figure 31] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 32] This is a cross-sectional view along line XII-XII' in Figure 31. [Figure 33] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 34] This is a cross-sectional view along line XIII-XIII' in Figure 33. [Figure 35] This figure illustrates a modified version of Figure 33. [Figure 36] This is a schematic perspective view of a stacked electronic component according to one embodiment of the present invention. [Figure 37] This is a cross-sectional view along line XIV-XIV' in Figure 36. [Figure 38] This is a magnified view of the K1 region in Figure 36. [Modes for carrying out the invention]

[0023] Embodiments of the present invention will be described below with reference to specific embodiments and accompanying drawings. However, embodiments of the present invention can be modified into various other forms, and the scope of the present invention is not limited to the embodiments described below. Furthermore, embodiments of the present invention are provided to give a more complete explanation of the present invention to those who are ordinary in the art. Accordingly, the shapes and sizes of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for a clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0024] Furthermore, in order to clearly illustrate the present invention in the drawings, parts unrelated to the explanation have been omitted, and the size and thickness of each component shown in the drawings are arbitrarily shown for the convenience of explanation; therefore, the present invention is not necessarily limited to what is shown. Components with the same function within the scope of the same concept will be described using the same reference numerals. Moreover, throughout the specification, when a part "includes" a certain component, this does not mean that other components are excluded, but rather that other components may be further included, unless otherwise stated.

[0025] In the drawing, the first direction can be defined as the thickness T direction, the second direction as the length L direction, and the third direction as the width W direction.

[0026] Figure 1 schematically illustrates a perspective view of a stacked electronic component according to one embodiment of the present invention, Figure 2 schematically illustrates a perspective view of the main body of the stacked electronic component of Figure 1, Figure 3 is a cross-sectional view along line I-I' in Figure 1, Figure 4 is an exploded perspective view schematically showing the main body of Figure 2 disassembled, and Figure 5 schematically illustrates a perspective view of a substrate on which the stacked electronic component of Figure 1 is mounted.

[0027] The following describes a stacked electronic component 1000 according to one embodiment of the present invention, with reference to Figures 1 to 5.

[0028] A stacked electronic component 1000 according to one embodiment of the present invention includes a dielectric layer 111, first and second internal electrodes 121 and 122 arranged alternately with the dielectric layer in between, a body 110 including first and second surfaces 1 and 2 facing in the first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces and facing in the second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces and facing in the third direction, and a first external electrode including a first connection portion 131a arranged on the third surface, a first band portion 131b extending from the first connection portion to a part of the first surface, and a third band portion 131c extending from the first connection portion to a part of the second surface. The electrode includes a pole 131, a second external electrode 132 including a second connecting portion 132a disposed on the fourth surface, a second band portion 132b extending from the second connecting portion to a part of the first surface, and a fourth band portion 132c extending from the second connecting portion to a part of the second surface, an insulating layer 151 disposed on the first and second connecting portions and disposed to cover the second surface, third and fourth band portions 131c, 132c, a first plating layer 141 disposed on the first band portion 131b, and a second plating layer 142 disposed on the second band portion 132b, wherein the insulating layer 151 may contain an oxide containing zirconium (Zr).

[0029] The main body 110 has dielectric layers 111 and internal electrodes 121 and 122 stacked alternately.

[0030] There are no particular limitations on the specific shape of the main body 110, but as shown in the figure, the main body 110 can be a hexahedron or a similar shape. Due to the shrinkage of the ceramic powder contained in the main body 110 during the firing process, the main body 110 is not a perfectly straight hexahedron, but can be substantially hexahedron-shaped.

[0031] The main body 110 may have first and second surfaces 1 and 2 facing each other in a first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces 1 and 2 and facing each other in a second direction, and fifth and sixth surfaces 5 and 6 connected to the first and second surfaces 1 and 2 and connected to the third and fourth surfaces 3 and 4 and facing each other in a third direction.

[0032] In one embodiment, the main body 110 includes a first-to-third corner connecting the first and third surfaces, a first-to-fourth corner connecting the first and fourth surfaces, a second-to-third corner connecting the second and third surfaces, and a second-to-fourth corner connecting the second and fourth surfaces. The first-to-third corner and the second-to-third corner have a shape that contracts towards the first center of the main body as they approach the third surface, and the first-to-fourth corner and the second-to-fourth corner can have a shape that contracts towards the first center of the main body as they approach the fourth surface.

[0033] Due to the overlap of margin regions on the dielectric layer 111 where internal electrodes 121 and 122 are not placed, a step difference is generated due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface and the third to fifth surfaces and / or the second surface and the third to fifth surfaces may have a form that is contracted toward the first central side of the main body 110 when viewed with reference to the first or second surface. Alternatively, due to the contraction behavior during the sintering process of the main body, the corners connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, and 6 and / or the corners connecting the second surface 2 and the third to sixth surfaces 3, 4, 5, and 6 may have a form that is contracted toward the first central side of the main body 110 when viewed with reference to the first or second surface. Alternatively, in order to prevent chipping defects, the corners connecting each face of the main body 110 can be rounded by performing a separate process to round the corners connecting the first face to the third to sixth faces and / or the corners connecting the second face to the third to sixth faces.

[0034] The above-mentioned corners may include the 1st-3rd corner connecting the 1st and 3rd faces, the 1st-4th corner connecting the 1st and 4th faces, the 2nd-3rd corner connecting the 2nd and 3rd faces, and the 2nd-4th corner connecting the 2nd and 4th faces. Furthermore, the corners may include the 1st-5th corner connecting the 1st and 5th faces, the 1st-6th corner connecting the 1st and 6th faces, the 2nd-5th corner connecting the 2nd and 5th faces, and the 2nd-6th corner connecting the 2nd and 6th faces. The 1st to 6th faces of the main body 110 can generally be flat surfaces, and non-flat areas can be designated as corners. Hereinafter, the extension of each face may refer to a line extended from the flat portion of each face.

[0035] In this case, the regions of the external electrodes 131 and 132 located on the corners of the main body 110 can be designated as corner portions, the regions located on the third and fourth surfaces of the main body 110 can be designated as connecting portions, and the regions located on the first and second surfaces of the main body can be designated as band portions.

[0036] On the other hand, in order to suppress the step difference caused by the internal electrodes 121 and 122, if the internal electrodes after lamination are cut so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115, the portions connecting the first surface with the fifth and sixth surfaces and the portions connecting the second surface with the fifth and sixth surfaces do not necessarily have to be in a contracted form.

[0037] The multiple dielectric layers 111 forming the main body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be so integrated that they are difficult to confirm without using a scanning electron microscope (SEM).

[0038] According to an embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead composite perovskite-based material, a strontium titanate-based material, or the like can be used. The barium titanate-based material can include BaTiO3-based ceramic powder. Examples of the ceramic powder include BaTiO3, (Ba1 - x Ca x )TiO3 (0 < x < 1) in which Ca (calcium), Zr (zirconium), etc. are partially solid-solved in BaTiO3, Ba(Ti 1-y Ca y )O3 (0 < y < 1), (Ba 1-x Ca x )(Ti 1-y Zr y )O3 (0 < x < 1, 0 < y < 1), or Ba(Ti 1-y Zr y )O3 (0 < y < 1), etc. [[ID=二十一]] [[ID=二十二]]

[0039] [[ID=二十三]] [[ID=二十四]]In addition, various ceramic additives, organic solvents, binders, dispersants, etc. can be added to the raw material for forming the dielectric layer 111, such as powder of barium titanate (BaTiO3), according to the purpose of the present invention. [[ID=二十五]] [[ID=二十六]]

[0040] [[ID=二十七]] [[ID=二十八]]On the other hand, the average thickness td of the dielectric layer 111 does not need to be particularly limited. [[ID=二十九]] [[ID=三十]]

[0041] [[ID=三十一]] [[ID=三十二]]However, generally, when the dielectric layer is formed thin with a thickness less than 0.6 μm, especially when the thickness of the dielectric layer is 0.35 μm or less, there is a risk of reduced reliability. [[ID=三十三]] [[ID=三十四]]

[0042] [[ID=三十五]] [[ID=三十六]]According to an embodiment of the present invention, by disposing an insulating layer on the connection portion of the external electrode and disposing a plating layer on the band portion of the external electrode, it is possible to prevent moisture penetration from the outside, penetration of the plating solution, etc., and improve reliability. Therefore, even when the average thickness of the dielectric layer 111 is 0.35 μm or less, excellent reliability can be ensured. [[ID=三十七]] [[ID=三十八]]

[0043] [[ID=三十九]] Therefore, the reliability improvement effect according to the present invention can be more pronounced when the average thickness of the dielectric layer 111 is 0.35 μm or less.

[0044] The average thickness td of the dielectric layer 111 can refer to the average thickness of the dielectric layer 111 that is placed between the first and second internal electrodes 121 and 122.

[0045] The average thickness of the dielectric layer 111 can be measured by scanning an image of the LT cross-section of the main body 110 in the length and thickness direction with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the thickness of any dielectric layer can be measured at 30 equally spaced points along its length in the scanned image, and the average value can be calculated. These 30 equally spaced points can be specified by the capacitance forming section Ac. Furthermore, by extending this average value measurement to 10 dielectric layers, the average thickness of the dielectric layers can be further generalized.

[0046] The main body 110 may include a capacitance forming section Ac which is disposed inside the main body 110 and includes a first internal electrode 121 and a second internal electrode 122 which are arranged facing each other with a dielectric layer 111 in between to form a capacitance, and cover sections 112 and 113 which are formed on the upper and lower parts of the capacitance forming section Ac in the first direction.

[0047] Furthermore, the capacitance-forming portion Ac is a part that contributes to the formation of the capacitance of the capacitor, and can be formed by repeatedly stacking a plurality of first and second internal electrodes 121 and 122 with a dielectric layer 111 in between.

[0048] The cover portions 112 and 113 may include an upper cover portion 112 positioned above the volume forming portion Ac in the first direction and a lower cover portion 113 positioned below the volume forming portion Ac in the first direction.

[0049] The upper cover portion 112 and the lower cover portion 113 described above can be formed by stacking a single dielectric layer or two or more dielectric layers in the thickness direction on the upper and lower surfaces of the capacitance forming portion Ac, respectively, and can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0050] The upper cover portion 112 and the lower cover portion 113 described above do not include internal electrodes and may contain the same material as the dielectric layer 111.

[0051] In other words, the upper cover portion 112 and the lower cover portion 113 may include a ceramic material, for example, a barium titanate (BaTiO3) based ceramic material.

[0052] On the other hand, the average thickness of the cover portions 112 and 113 is not particularly limited. However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the average thickness tc of the cover portions 112 and 113 can be 15 μm or less. Furthermore, according to one embodiment of the present invention, by arranging the insulating layer on the connection portion of the external electrode and the plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture from the outside and the penetration of the plating solution, thereby improving reliability. Therefore, even if the average thickness tc of the cover portions 112 and 113 is 15 μm or less, excellent reliability can be ensured.

[0053] The average thickness tc of the cover portions 112 and 113 can represent the size in the first direction, and can be the average value of the size in the first direction of the cover portions 112 and 113 measured at five equally spaced points on the upper or lower part of the volume forming portion Ac.

[0054] Furthermore, margin portions 114 and 115 can be arranged on the side surface of the volume-forming portion Ac.

[0055] The margin portions 114 and 115 may include a first margin portion 114 located on the fifth surface 5 of the main body 110 and a second margin portion 115 located on the sixth surface 6. That is, the margin portions 114 and 115 can be located on both end surfaces in the width direction of the main body 110.

[0056] As shown in Figure 3, the margin portions 114 and 115 can refer to the regions between the ends of the first and second internal electrodes 121 and 122 and the interface surface of the main body 110 in a cross-section cut along the width-thickness (WT) direction of the main body 110.

[0057] The margins 114 and 115 can essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0058] The margin portions 114 and 115 can be formed by applying a conductive paste to the ceramic green sheet, except for the areas where the margin portions are formed, to create internal electrodes.

[0059] Furthermore, in order to suppress the step caused by the internal electrodes 121 and 122, after cutting the laminated internal electrodes so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, a single dielectric layer or two or more dielectric layers can be laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115.

[0060] On the other hand, the width of the margin portions 114 and 115 does not need to be particularly limited. However, in order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average width of the margin portions 114 and 115 can be 15 μm or less. Furthermore, according to one embodiment of the present invention, by arranging the insulating layer on the connection portion of the external electrode and the plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture from the outside and the penetration of the plating solution, thereby improving reliability. Therefore, even if the average width of the margin portions 114 and 115 is 15 μm or less, excellent reliability can be ensured.

[0061] The average width of the margin portions 114 and 115 can represent the average size of the margin portions 114 and 115 in the third direction, and can be the average value of the third-direction sizes of the margin portions 114 and 115 measured at five equally spaced points on the side surface of the volume-forming portion Ac.

[0062] The internal electrodes 121 and 122 are stacked alternately with the dielectric layer 111.

[0063] The internal electrodes 121 and 122 may include first and second internal electrodes 121 and 122. The first and second internal electrodes 121 and 122 are arranged alternately facing each other with the dielectric layer 111 constituting the main body 110 in between, and can be exposed on the third and fourth surfaces 3 and 4 of the main body 110, respectively.

[0064] Referring to Figure 3, the first internal electrode 121 can be exposed on the third surface 3, separated from the fourth surface 4, and the second internal electrode 122 can be exposed on the fourth surface 4, separated from the third surface 3. The first external electrode 131 can be placed on the third surface 3 of the main body and connected to the first internal electrode 121, and the second external electrode 132 can be placed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0065] In other words, the first internal electrode 121 is not connected to the second external electrode 132, but is connected to the first external electrode 131, and the second internal electrode 122 is not connected to the first external electrode 131, but is connected to the second external electrode 132. Therefore, the first internal electrode 121 can be formed at a certain distance apart on the fourth surface 4, and the second internal electrode 122 can be formed at a certain distance apart on the third surface 3.

[0066] In this configuration, the first and second internal electrodes 121 and 122 can be electrically isolated from each other by the dielectric layer 111 placed in between them.

[0067] The main body 110 can be formed by alternately stacking ceramic green sheets printed with the first internal electrode 121 and ceramic green sheets printed with the second internal electrode 122, and then firing them.

[0068] The materials used to form the internal electrodes 121 and 122 are not particularly limited, and any material with excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 may include one or more of the following: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0069] Furthermore, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes containing one or more of the following materials onto a ceramic green sheet: nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof. While screen printing or gravure printing can be used as the printing method for the conductive paste for internal electrodes, the present invention is not limited thereto.

[0070] On the other hand, the average thickness te of the internal electrodes 121 and 122 does not need to be particularly limited.

[0071] However, generally speaking, when the internal electrode is formed to a thickness of less than 0.6 μm, especially when the thickness of the internal electrode is 0.35 μm or less, there was a risk of reduced reliability.

[0072] According to one embodiment of the present invention, by placing an insulating layer on the connection portion of the external electrode and a plating layer on the band portion of the external electrode, it is possible to prevent the penetration of moisture from the outside and the penetration of the plating solution, thereby improving reliability. As a result, even if the average thickness of the internal electrodes 121 and 122 is 0.35 μm or less, excellent reliability can be ensured.

[0073] Therefore, when the thickness of the internal electrodes 121 and 122 is 0.35 μm or less on average, the effects of the present invention can be made more pronounced, and miniaturization and increased capacitance of the stacked electronic component can be achieved more easily.

[0074] The average thickness te of the internal electrodes 121 and 122 can be interpreted as the average thickness of the internal electrodes 121 and 122.

[0075] The average thickness of the internal electrodes 121 and 122 can be measured by scanning the LT cross-section of the main body 110 in the length and thickness directions with a scanning electron microscope (SEM) at 10,000x magnification. More specifically, the thickness of any internal electrode can be measured at 30 equally spaced points along the length of the scanned image, and the average value can be calculated. These 30 equally spaced points can be specified by the capacitance forming section Ac. Furthermore, by extending this average value measurement to 10 internal electrodes, the average thickness of the internal electrodes can be further generalized.

[0076] External electrodes 131 and 132 can be arranged on the third surface 3 and fourth surface 4 of the main body 110. The external electrodes 131 and 132 may include first and second external electrodes 131 and 132, respectively, which are arranged on the third and fourth surfaces 3 and 4 of the main body 110 and connected to first and second internal electrodes 121 and 122, respectively.

[0077] The external electrodes 131 and 132 may include a first external electrode 131 which includes a first connecting portion 131a located on the third surface and a first band portion 131b extending from the first connecting portion to a part of the first surface, and a second external electrode 132 which includes a second connecting portion 132a located on the fourth surface and a second band portion 132b extending from the second connecting portion to a part of the first surface. The first connecting portion 131a may be connected to the first internal electrode 121 on the third surface, and the second connecting portion 132a may be connected to the second internal electrode 122 on the fourth surface.

[0078] Furthermore, the first external electrode 131 may include a third band portion 131c extending from the first connection portion 131a to a part of the second surface, and the second external electrode 132 may include a fourth band portion 132c extending from the second connection portion 132a to a part of the second surface. In addition, the first external electrode 131 may include a first side band portion extending from the first connection portion 131a to a part of the fifth and sixth surfaces, and the second external electrode 132 may include a second side band portion extending from the second connection portion 132a to a part of the fifth and sixth surfaces.

[0079] However, the third band section, the fourth band section, the first side band section, and the second side band section are not essential components of the present invention. The first and second external electrodes 131 and 132 do not have to be placed on the second surface, nor do they have to be placed on the fifth and sixth surfaces. Since the first and second external electrodes 131 and 132 are not placed on the second surface, the first and second external electrodes 131 and 132 can be placed below the extension line of the second surface of the main body. In addition, the first and second connecting sections 131a and 132a can be placed at a distance from the fifth and sixth surfaces, and the first and second connecting sections 131a and 132a can be placed at a distance from the second surface. In addition, the first and second band sections 131b and 132b can be placed at a distance from the fifth and sixth surfaces.

[0080] On the other hand, when the first and second external electrodes 131 and 132 include the third and fourth band portions 131c and 132c, the diagram shows that an insulating layer is placed on the third and fourth band portions 131c and 132c. However, the diagram is not limited to this, and a plating layer can be placed on the third and fourth band portions 131c and 132c to improve ease of mounting. Furthermore, the first and second external electrodes 131 and 132 may include the third and fourth band portions 131c and 132c but not the side band portions. In this case, the first and second connecting portions 131a and 132a, and the first to fourth band portions 131a, 132b, 131c, and 132c may be separated from the fifth and sixth surfaces.

[0081] In this embodiment, a structure is described in which the stacked electronic component 1000 has two external electrodes 131 and 132. However, the number and shape of the external electrodes 131 and 132 can vary depending on the form of the internal electrodes 121 and 122 and other purposes.

[0082] On the other hand, the external electrodes 131 and 132 can be formed using any material that has electrical conductivity, such as metal, and the specific material can be determined by considering electrical properties, structural stability, etc. Furthermore, they can have a multilayer structure.

[0083] The external electrodes 131 and 132 can be firing electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin.

[0084] Furthermore, the external electrodes 131 and 132 may be formed in a manner in which a fired electrode and a resin-based electrode are sequentially formed on the main body. Also, the external electrodes 131 and 132 may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0085] The conductive metal included in the external electrodes 131 and 132 can be any material with excellent electrical conductivity and is not particularly limited. For example, the conductive metal can be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. Preferably, the external electrodes 131 and 132 can include one or more of Ni and Ni alloys, which can further improve connectivity with the internal electrodes 121 and 122 containing Ni.

[0086] The insulating layer 151 can be placed on the first and second connection portions 131a and 132a.

[0087] Since the first and second connection parts 131a and 132a are connected to the internal electrodes 121 and 122, they can become pathways for penetration of the plating solution during the plating process or for moisture penetration during actual use. In the present invention, since the insulating layer 151 is placed on the connection parts 131a and 132a, it is possible to prevent penetration of moisture from the outside or penetration of the plating solution.

[0088] The insulating layer 151 can be positioned in contact with the first and second plating layers 141 and 142. In this case, the insulating layer 151 can be in contact with the first and second plating layers 141 and 142 in a manner that partially covers their edges, or the first and second plating layers 141 and 142 can be in contact with the insulating layer 151 in a manner that partially covers their edges.

[0089] The insulating layer 151 can be placed on the first and second connection portions 131a and 132a and positioned to cover the second surface and the third and fourth band portions 131c and 132c. In this case, the insulating layer 151 can be positioned to cover the area on the second surface where the third and fourth band portions 131c and 132c are not located, and the third and fourth band portions 131c and 132c themselves. This allows the insulating layer 151 to cover the area where the ends of the third and fourth band portions 131c and 132c are in contact with the main body 110, thereby blocking the moisture penetration path and further improving moisture resistance reliability.

[0090] The insulating layer 151 is positioned on the second surface and can extend over the first and second connection portions 131a and 132a. Furthermore, if the external electrodes 131 and 132 are not positioned on the second surface, the insulating layer can be positioned to completely cover the second surface. On the other hand, the insulating layer 151 does not necessarily have to be positioned on the second surface; it may not be positioned on part or all of the second surface, and the insulating layer may be separated into two parts and positioned on the first and second connection portions 131a and 132a, respectively. If the insulating layer is not positioned on the entire second surface, it can be positioned below the extension line of the second surface. Also, even if the insulating layer is not positioned on the second surface, it can extend over the first and second connection portions 131a and 132a to form a single insulating layer on the fifth and sixth surfaces.

[0091] Furthermore, the insulating layer 151 can be positioned to cover the first and second side band portions, and parts of the fifth and sixth surfaces. In this case, parts of the fifth and sixth surfaces not covered by the insulating layer 151 can be exposed to the outside.

[0092] Furthermore, the insulating layer 151 can be arranged to cover the first and second side band portions, the fifth surface, and the sixth surface entirely. In this case, the fifth and sixth surfaces are not exposed to the outside, thus improving moisture resistance reliability. Also, the connection portions 131a and 132a are not directly exposed to the outside, thus improving the reliability of the laminated electronic component 1000. More specifically, the insulating layer can cover the first and second side band portions entirely, and the fifth and sixth surfaces can cover all areas except those where the first and second side band portions are formed.

[0093] The insulating layer 151 can prevent the formation of plating layers 141 and 142 on the external electrodes 131 and 132 on which the insulating layer 151 is placed, thereby improving sealing properties and minimizing the penetration of moisture, plating solutions, etc., from the outside.

[0094] The insulating layer 151 may contain an oxide containing zirconium (Zr).

[0095] Traditionally, glass-based materials have been commonly used for insulating layers. However, due to the characteristics of glass-based materials, significant aggregation occurs during sintering, making it difficult to form a uniform film. Furthermore, the heat required during the sintering process can generate stress within the device, potentially causing cracks or delamination. Additionally, when using insulating layers containing glass-based materials, the insulating layer containing the glass-based material is fired after the external electrodes. However, during the firing process of the insulating layer, metallic material from the external electrodes may diffuse into the internal electrodes, potentially causing radial cracks. Moreover, because glass-based materials generally have hard properties, they are susceptible to cracking even from minor impacts.

[0096] This invention aims to solve the problems associated with glass-based insulating layers by applying an oxide containing zirconium (Zr) instead of a glass-based insulating layer. The zirconium (Zr)-containing oxide not only possesses insulating properties but also exhibits superior impact resistance compared to glass-based materials.

[0097] Specifically, when forming the insulating layer 151 using an oxide containing zirconium (Zr), a more uniform and dense film can be formed than when using a glass series, effectively improving moisture resistance reliability.

[0098] Furthermore, when forming the insulating layer 151 using an oxide containing zirconium (Zr), hardness, strength, wear resistance, and moisture resistance can be effectively improved compared to when other inorganic materials are used, and corrosion resistance to acidic solutions such as plating solutions is also excellent.

[0099] The method for forming the insulating layer 151 is not particularly limited.

[0100] For example, after forming external electrodes 131 and 132 on the main body 100, an insulating layer 151 containing an oxide including zirconium (Zr) can be formed using atomic layer deposition (ALD). In other words, the insulating layer 151 can be formed by atomic layer deposition, which makes it easier to form a dense and uniform insulating layer 151 and also makes it easy to adjust the thickness of the insulating layer 151. Furthermore, atomic layer deposition can be performed in a temperature range of approximately 60°C to approximately 200°C, but is not limited to this range; any method that can form a uniform and dense insulating layer 151, such as sol-gel coating or powder coating, is acceptable.

[0101] The type of zirconium (Zr) oxide contained in the insulating layer 151 is not particularly limited, but for example, it can be zirconia (ZrO2).

[0102] Zirconia possesses high mechanical properties, is stable in chemically corrosive environments, and has high strength, high toughness, low thermal conductivity, and high fire resistance. In particular, these characteristics can be improved as the concentration of zirconia in the insulating layer 151 increases.

[0103] In one embodiment, the insulating layer 151 may have a ratio of 0.95 or more moles of zirconium (Zr) atoms to the total number of moles of the remaining elements excluding oxygen atoms. That is, the insulating layer 151 may consist of an oxide that substantially contains zirconium (Zr), excluding elements detected as impurities. In this case, the oxide containing zirconium (Zr) may be zirconia (ZrO2). This further enhances the effects of suppressing cracks due to thermal shrinkage, radiative cracks due to metal diffusion, improving moisture resistance reliability, and improving corrosion resistance to plating solutions.

[0104] On the other hand, zirconia undergoes a spontaneous phase transformation from monoclinic to tetragonal between 100°C and 400°C, which is a relatively low temperature range, and therefore may be somewhat unstable.

[0105] Therefore, if zirconia is present in the insulating layer 151 at a high concentration, the phase change of zirconia can cause grain boundary fracture and a rapid decrease in strength of the insulating layer 151. Since such problems can also occur due to the heat applied during the manufacturing of multilayer electronic components or the heat generated during operation, a method is needed to stabilize zirconia in a relatively unstable form and form an insulating layer 151 without deterioration of mechanical and chemical properties.

[0106] Mg oxide and Ca oxide can play a role in stabilizing tetragonal zirconia. According to one embodiment, by further including Mg, Ca, and one or more of their oxides in the insulating layer 151, it is possible to prevent the excellent mechanical and chemical properties of the zirconia contained in the insulating layer 151 from deteriorating due to heat applied during the manufacturing process of the multilayer electronic component or heat generated during operation.

[0107] On the other hand, there have been attempts to stabilize the zirconia contained in the insulating layer 151 by adding yttrium (Y) or an oxide containing yttrium (Y).

[0108] However, when yttrium (Y) or an oxide containing yttrium (Y) is added to zirconia, yttria-stabilized zirconia (YSZ) can be formed. Although such yttria-stabilized zirconia has excellent mechanical properties, it develops high ionic conductivity and is therefore unsuitable for use as an insulating layer in multilayer electronic components.

[0109] Therefore, according to one embodiment, the insulating layer 151 is substantially free of yttrium (Y), thereby preventing the formation of yttria-stabilized zirconia and maintaining excellent insulating properties.

[0110] On the other hand, the dielectric layer 111, cover portions 112 and 113, and margin portions 114 and 115 of the multilayer electronic component 1000 can be enriched with various ceramic additives, organic solvents, binders, dispersants, etc., in addition to barium titanate (BaTiO3), as described above. When yttrium (Y) or an oxide containing yttrium (Y) is used as an additive to increase the volume resistivity of the dielectric layer 111, the yttrium (Y) or oxide containing yttrium (Y) contained in the dielectric layer 111 reacts with an oxide containing zirconium (Zr) contained in the insulating layer 151 located outside the main body 110 to form yttria-stabilized zirconia at the interface between the main body 110 and the insulating layer 151.

[0111] This can lead to a problem where a portion of the insulating layer 151 becomes ionically conductive, making it difficult for it to perform its role as an insulating layer.

[0112] According to one embodiment, each of the dielectric layer 111, cover portions 112, 113, and margin portions 114, 115 substantially does not contain yttrium (Y), thereby fundamentally preventing zirconium (Zr) contained in the insulating layer 151 from reacting with yttrium (Y) that can be contained in each of the dielectric layer 111, cover portions 112, 113, and margin portions 114, 115 to become ionically conductive. As a result, the effects of suppressing the occurrence and propagation of radial cracks in the multilayer electronic component 1000, improving moisture resistance reliability, and improving corrosion resistance to plating solutions, etc., can be made more pronounced.

[0113] In this case, the composition of the insulating layer 151 can be calculated from images observed using SEM-EDS (Scanning Electron Microscope-Energy Dispersive X-ray Spectroscopy). Specifically, after polishing the multilayer electronic component to the center in the width direction (third direction) to expose the cross-section in the length direction and thickness direction (LT cross-section), the number of moles of each element contained in the insulating layer can be measured using EDS in the central region of the five equally spaced regions obtained by dividing the insulating layer in the thickness direction, and the number of moles of Zr atoms relative to the total number of moles of the remaining elements excluding oxygen atoms can be determined.

[0114] There is no particular need to limit the average thickness t2 of the insulating layer 151. However, if the average thickness t2 of the insulating layer 151 is 20 nm or less, there is a risk that the effect of suppressing cracks due to thermal shrinkage and radiation cracks due to metal diffusion may not be sufficiently ensured.

[0115] Therefore, in one embodiment, by making the average thickness t2 of the insulating layer 151 exceed 20 nm, it is possible to ensure the effect of suppressing cracks due to thermal shrinkage, radiation cracks due to metal diffusion, and the like.

[0116] If the average thickness t2 of the insulating layer 151 is less than 50 nm, there is a risk that sufficient moisture resistance reliability cannot be ensured.

[0117] Therefore, in one embodiment, moisture resistance reliability can be ensured by making the average thickness t2 of the insulating layer 151 50 nm or more.

[0118] If the average thickness t2 of the insulating layer 151 is 400 nm or less, there is a risk that sufficient corrosion resistance to the plating solution cannot be ensured when forming the plating layers 141 and 142 described later.

[0119] In one embodiment, by making the average thickness t2 of the insulating layer 151 exceed 400 nm, corrosion resistance to the plating solution can be ensured, and the reliability of the multilayer electronic component 1000 can be further improved.

[0120] There is no particular upper limit to the average thickness t2 of the insulating layer 151. However, if the average thickness t2 of the insulating layer 151 exceeds 1000 nm, processability will decrease, making it difficult to miniaturize the multilayer electronic component 1000.

[0121] Therefore, in one embodiment, the average thickness t2 of the insulating layer 151 can be greater than 20 nm and less than or equal to 1000 nm, preferably between 50 nm and 1000 nm, and more preferably between 400 nm and 1000 nm.

[0122] In this case, the average thickness t2 of the insulating layer 151 can be the average of the thickness values ​​of the insulating layer measured at the central point in the first direction of the first and second connection parts 131a and 132a, two points separated by 5 μm from the central point in the first direction, and two points separated by 10 μm.

[0123] In one embodiment, the insulating layer 151 is arranged in direct contact with the first and second external electrodes 131 and 132, and the first and second external electrodes 131 and 132 may include conductive metal and resin. As a result, the plating layers 141 and 142 may not be placed in areas on the outer surface of the first and second external electrodes 131 and 132 where the insulating layer 151 is arranged, thereby effectively suppressing corrosion of the external electrodes by the plating solution.

[0124] In this case, the first plating layer 141 can be positioned to cover the end of the insulating layer 151 that is placed on the first external electrode 131, and the second plating layer 142 can be positioned to cover the end of the insulating layer 151 that is placed on the second external electrode 132. By forming the insulating layer 151 first before forming the plating layers 141 and 142 on the external electrodes 131 and 132, the penetration of the plating solution during the plating layer formation process can be suppressed more reliably. By forming the insulating layer before the plating layer, the plating layers 141 and 142 can have a configuration that covers the end of the insulating layer 151.

[0125] The first and second plating layers 141 and 142 can be placed on the first and second band portions 131b and 132b, respectively. The plating layers 141 and 142 can improve mounting characteristics, and by placing the plating layers 141 and 142 on the band portions 131b and 132b, the mounting space can be minimized, and the penetration of the plating solution into the internal electrodes can be minimized, thereby improving reliability. One end of the first and second plating layers 141 and 142 can be in contact with the first surface, and the other end can be in contact with the insulating layer 151.

[0126] The types of plating layers 141 and 142 are not particularly limited and can be plating layers containing one or more of Cu, Ni, Sn, Ag, Au, Pd, and their alloys, and can consist of multiple layers.

[0127] To give a more specific example for the plating layers 141 and 142, the plating layers 141 and 142 can be Ni plating layers or Sn plating layers, and the Ni plating layer and the Sn plating layer can be formed sequentially on the first and second band portions 131b and 132b.

[0128] In one embodiment, the first and second plating layers 141 and 142 can be arranged to extend and partially cover the first and second connecting portions 131a and 132a, respectively. When the average size in the first direction from the first and second internal electrodes 121 and 122 to the internal electrode closest to the first surface 1 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the first and second plating layers 141 and 142 arranged on the first and second connecting portions 131a and 132a is H2, it is possible to satisfy H1 > H2. This makes it possible to suppress the penetration of the plating solution into the internal electrodes during the plating process and improve reliability.

[0129] H1 and H2 can be the average of values ​​measured in cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction. H1 can be the average of values ​​measured at the point where the internal electrode closest to the first surface 1 is connected to the external electrode in each cross-section, and H2 can be the average of values ​​measured with reference to the edge of the plating layer in contact with the external electrode, and the extension line of the first surface used as a reference when measuring H1 and H2 can be the same.

[0130] In one embodiment, the first plating layer 141 can be positioned to cover the end of the insulating layer 151 that is located on the first external electrode 131, and the second plating layer 142 can be positioned to cover the end of the insulating layer 151 that is located on the second external electrode 132. This strengthens the bonding force between the insulating layer 151 and the plating layers 141 and 142, thereby improving the reliability of the multilayer electronic component 1000.

[0131] In one embodiment, the insulating layer 151 can be positioned to cover the end of the first plating layer 141 that is located on the first external electrode 131, and the insulating layer 151 can be positioned to cover the end of the second plating layer 142 that is located on the second external electrode 132. This strengthens the bonding force between the insulating layer 151 and the plating layers 141 and 142, thereby improving the reliability of the multilayer electronic component 1000.

[0132] In one embodiment, when the average size of the main body 110 in the second direction is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, the conditions 0.2 ≤ B1 / L ≤ 0.4 and 0.2 ≤ B2 / L ≤ 0.4 can be satisfied.

[0133] If B1 / L and B2 / L are less than 0.2, it may be difficult to ensure sufficient adhesion strength. On the other hand, if B2 / L exceeds 0.4, there is a risk of leakage current occurring between the first band portion 131b and the second band portion 132b under high voltage current, and there is a risk that the first band portion 131b and the second band portion 132b may be electrically connected due to plating bleeding or the like during the plating process.

[0134] B1, B2, and L can be the average of values ​​measured at cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction.

[0135] Referring to Figure 5, which illustrates a mounting substrate 1100 on which a multilayer electronic component 1000 is mounted, the plating layers 141 and 142 of the multilayer electronic component 1000 can be joined to electrode pads 181 and 182 placed on the substrate 180 by solder 191 and 192.

[0136] On the other hand, when the internal electrodes 121 and 122 are stacked in a first direction, the stacked electronic component 1000 can be horizontally mounted on the substrate 180 so that the internal electrodes 121 and 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting; when the internal electrodes 121 and 122 are stacked in a third direction, the stacked electronic component can be vertically mounted on the substrate so that the internal electrodes 121 and 122 are perpendicular to the mounting surface.

[0137] There is no particular limit to the size of the stacked electronic component 1000.

[0138] However, in order to achieve both miniaturization and high capacitance simultaneously, the thickness of the dielectric layer and internal electrodes must be reduced and the number of layers increased. Therefore, in a stacked electronic component 1000 having a size of 1005 (length × width, 1.0 mm × 0.5 mm) or less, the improvement in reliability and capacitance per unit volume according to the present invention can be made more pronounced.

[0139] Therefore, considering manufacturing tolerances, external electrode size, etc., the reliability improvement effect according to the present invention can be more pronounced when the length of the stacked electronic component 1000 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the stacked electronic component 1000 can mean the maximum size of the stacked electronic component 1000 in the second direction, and the width of the stacked electronic component 1000 can mean the maximum size of the stacked electronic component 1000 in the third direction.

[0140] Figure 6 schematically illustrates a perspective view of a stacked electronic component 1001 according to one embodiment of the present invention, and Figure 7 is a cross-sectional view along line II-II' in Figure 6.

[0141] Referring to Figures 6 and 7, in one embodiment of the present invention, the stacked electronic component 1001 has the first and second plating layers 141-1 and 142-1 positioned below the extension line E1 of the first surface. This minimizes the height of the solder during mounting and minimizes the mounting space.

[0142] Furthermore, the insulating layer 151-1 can be extended to below the extension line of the first surface and arranged to be in contact with the first and second plating layers 141-1 and 142-1.

[0143] Figure 8 schematically illustrates a perspective view of a stacked electronic component 1002 according to one embodiment of the present invention, and Figure 9 is a cross-sectional view along line III-III' in Figure 8.

[0144] Referring to FIGS. 8 and 9, a stacked electronic component 1002 according to an embodiment of the present invention is disposed on the first surface 1 and may further include an additional insulating layer 161 disposed between the first band portion 131b and the second band portion 132b. Thereby, it is possible to prevent leakage current and the like that may occur between the first band portion 131b and the second band portion 132b under a high voltage current.

[0145] The type of the additional insulating layer 161 does not need to be particularly limited. For example, the additional insulating layer 161 can include an oxide containing zirconium (Zr), similar to the insulating layer 151. However, it is not necessary to limit the additional insulating layer 161 and the insulating layer 151 to the same material, and they may be formed of different materials. For example, it can include one or more selected from epoxy resin, acrylic resin, ethyl cellulose, etc., or can include glass.

[0146] FIG. 10 schematically shows a perspective view of a stacked electronic component 1003 according to an embodiment of the present invention, and FIG. 11 is a cross-sectional view taken along line IV-IV' of FIG. 10.

[0147] Referring to FIGS. 10 and 11, for a stacked electronic component 1003 according to an embodiment, when the first-direction average size from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the first-direction average size from the extension line of the first surface 1 to the ends of the plating layers 141-3 and 142-3 disposed on the first and second connection portions 131a and 132a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased to improve the fixing strength.

[0148] More preferably, when the first-direction average size of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is T / 2 or more, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0149] H1, H2, and T can be the average values of the values measured in the cross-section (L-T cross-section) obtained by cutting the main body 110 at five equally spaced points in the third direction in the first and second directions. H1 can be the average value of the values measured at the points where the internal electrodes closest to the first surface 1 in each cross-section are connected to the external electrodes. H2 can be the average value of the values measured based on the ends of the plating layers in contact with the external electrodes in each cross-section. The extension lines of the first surface serving as the reference during the measurement of H1 and H2 can be the same. Also, T can be the average value obtained by measuring the maximum size of the main body 110 in the first direction in each cross-section.

[0150] FIG. 12 schematically shows a perspective view of a multilayer electronic component 1004 according to an embodiment of the present invention, and FIG. 13 is a cross-sectional view taken along V-V' of FIG. 12.

[0151] Referring to FIGS. 12 and 13, in the multilayer electronic component 1004 according to an embodiment of the present invention, the average length B1 of the first band portion 131b-4 can be longer than the average length B3 of the third band portion 131c-4, and the average length of the second band portion 132b-4 can be longer than the average length B4 of the fourth band portion 132c-4. Thereby, the area in contact with solder during mounting can be increased to improve the fixing strength.

[0152] More specifically, when the average size in the second direction from the extension line of the third surface 3 to the end of the first band portion 131b-4 is B1, the average size in the second direction from the extension line of the fourth surface 4 to the end of the second band portion 132b-4 is B2, the average size in the second direction from the extension line of the third surface 3 to the end of the third band portion 131c-4 is B3, and the average size in the second direction from the extension line of the fourth surface 4 to the end of the fourth band portion 132c-4 is B4, B3 < B1 and B4 < B2 can be satisfied.

[0153] At this time, when the average size of the main body 110 in the second direction is L, 0.2 ≦ B1 / L ≦ 0.4 and 0.2 ≦ B2 / L ≦ 0.4 can be satisfied.

[0154] B1, B2, B3, B4, and L can be the average of values ​​measured at cross-sections (LT cross-sections) obtained by cutting the main body 110 in the first and second directions at five equally spaced points in the third direction.

[0155] Furthermore, the first external electrode 131-4 may include a first side band portion extending from the first connecting portion 131a-4 to a part of the fifth and sixth surfaces, and the second external electrode 132-4 may include a second side band portion extending from the second connecting portion 132a-4 to a part of the fifth and sixth surfaces. In this case, the second directional size of the first and second side band portions can gradually increase as they approach the first surface. That is, the first and second side band portions can be arranged in a tapered or trapezoidal shape.

[0156] Furthermore, when B3 is the average size in the second direction from the extension of the third surface to the end of the third band portion 131c-4, B4 is the average size in the second direction from the extension of the fourth surface to the end of the fourth band portion 132c-4, G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, then B3 ≤ G1 and B4 ≤ G2 can be satisfied. This makes it possible to minimize the volume occupied by the external electrodes and increase the capacity per unit volume of the stacked electronic component 1004.

[0157] The above G1 and G2 can be defined as follows: In a cross-section obtained by cutting the main body in the first and second directions at the center of the third direction, G1 is the average value of the second-direction size measured for any five second internal electrodes located in the center of the first direction, at a distance from the third surface; and G2 is the average value of the second-direction size measured for any five first internal electrodes located in the center of the first direction, at a distance from the fourth surface.

[0158] Furthermore, the method can be further generalized by determining G1 and G2 in cross-sections (LT cross-sections) obtained by cutting the main body 110 at five equally spaced points in the third direction in the first and second directions, and then averaging these values ​​to obtain G1 and G2.

[0159] However, there is no intention to limit the present invention to B3≦G1 and B4≦G2, and a case where B3≧G1 and B4≧G2 are satisfied can also be included as one embodiment of the present invention. Therefore, in one embodiment, when the average size in the second direction from the extension line of the third surface to the end of the third band portion is B3, the average size in the second direction from the extension line of the fourth surface to the end of the fourth band portion is B4, the average size in the second direction of the region separated from the third surface and the second internal electrode is G1, and the average size in the second direction of the region separated from the fourth surface and the first internal electrode is G2, then B3≧G1 and B4≧G2 can be satisfied.

[0160] In one embodiment, when the average size in the second direction from the extension line E3 of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, it is possible to satisfy B1≧G1 and B2≧G2. This makes it possible to improve the bonding strength of the multilayer electronic component 1004 to the substrate 180.

[0161] Figure 14 schematically illustrates a perspective view of a stacked electronic component 1005 according to one embodiment of the present invention, and Figure 15 is a cross-sectional view along line VI-VI' in Figure 14.

[0162] Referring to Figures 14 and 15, the first and second external electrodes 131-5 and 132-5 of the stacked electronic component 1005 according to one embodiment of the present invention may not be arranged on the second surface, but rather on the third, fourth, and first surfaces, forming an L-shape. That is, the first and second external electrodes 131-5 and 132-5 may be arranged below the extension of the second surface.

[0163] The first external electrode 131-5 may include a first connection portion 131a-5 located on the third surface 3 and a first band portion 131b-5 extending from the first connection portion 131a-5 to a part of the first surface 1, and the second external electrode 132-5 may include a second connection portion 132a-5 located on the fourth surface 4 and a second band portion 132b-5 extending from the second connection portion 132a-5 to a part of the first surface 1. On the second surface 2, the external electrodes 131-5 and 132-5 may not be located, and the insulating layer 151-5 may be arranged to cover the entire second surface 2. This minimizes the volume occupied by the external electrodes 131-5 and 132-5, thereby further improving the capacitance per unit volume of the multilayer electronic component 1005. However, the insulating layer 151-5 is not limited to covering the entire second surface 2. The insulating layer may not cover part or all of the second surface 2, but may be separated and cover the first and second connection portions 131a-5 and 132a-5, respectively.

[0164] Furthermore, reliability can be further improved by arranging the insulating layer 151-5 to cover a portion of the fifth and sixth surfaces. In this case, the portions of the fifth and sixth surfaces not covered by the insulating layer 151-5 can be exposed to the outside.

[0165] Furthermore, the insulating layer 151-5 can be positioned to cover the entire fifth and sixth surfaces. In this case, since the fifth and sixth surfaces are not exposed to the outside, moisture resistance reliability can be further improved.

[0166] A first plating layer 141-5 is placed on the first band portion 131b-5, and a second plating layer 142-5 is placed on the second band portion 132b-5. The first and second plating layers 141-5 and 142-5 can be extended to a portion of the first and second connecting portions 132a-5 and 132b-5.

[0167] In this case, the external electrodes 131-5 and 132-5 do not necessarily have to be placed on the fifth and sixth surfaces 5 and 6. That is, the external electrodes 131-5 and 132-5 can be arranged only on the third, fourth, and first surfaces.

[0168] Let the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 be H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the plating layers 141-5 and 142-5 disposed on the first and second connection portions 131a-5 and 132a-5 be H2. It is possible to satisfy H1 < H2. Thereby, the area in contact with solder during mounting can be increased to improve the fixing strength, and by increasing the area where the external electrodes 131-5 and 132-5 contact the plating layers 141-5 and 142-5, it is possible to suppress an increase in the ESR (Equivalent Series Resistance).

[0169] More preferably, when the average size in the first direction of the main body 110 is T, it is possible to satisfy H2 < T / 2. That is, it is possible to satisfy H1 < H2 < T / 2. This is because when H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0170] Also, the first and second plating layers 141-5 and 142-5 can be arranged to cover a part of the insulating layer 151-1 on the third and fourth surfaces. That is, the plating layers 141-5 and 142-5 can be arranged to cover the ends of the insulating layer 151-5 on the third and fourth surfaces. Thereby, the bonding strength between the insulating layer 151-5 and the plating layers 141-5 and 142-5 can be strengthened to improve the reliability of the multilayer electronic component 1005.

[0171] Also, the insulating layer 151-5 can be arranged to cover a part of the first and second plating layers 141-5 and 142-5 on the third and fourth surfaces. That is, the insulating layer 151-5 can be arranged to cover the ends of the plating layers 141-5 and 142-5 on the third and fourth surfaces. Thereby, the bonding strength between the insulating layer 151-5 and the plating layers 141-5 and 142-5 can be strengthened to improve the reliability of the multilayer electronic component 1005.

[0172] Figure 16 illustrates a modified example of Figure 14. Referring to Figure 16, in a modified example 1006 of the stacked electronic component 1005 according to one embodiment of the present invention, a first additional electrode layer 134 can be arranged between the first connection portion 131a-6 and the third surface, and a second additional electrode layer 135 can be arranged between the second connection portion 132a-6 and the fourth surface. The first additional electrode layer 134 can be arranged within a range that does not deviate from the third surface, and the second additional electrode layer 135 can be arranged within a range that does not deviate from the fourth surface. The first and second additional electrode layers 134 and 135 can improve the electrical connectivity between the internal electrodes 121 and 122 and the external electrodes 131-6 and 132-6, and because they have excellent coupling strength with the external electrodes 131-6 and 132-6, they can further improve the mechanical coupling strength of the external electrodes 131-6 and 132-6.

[0173] The first and second external electrodes 131-6 and 132-6 may have an L-shape in which the first and second external electrodes are not positioned on the second surface.

[0174] The first external electrode 131-6 may include a first connecting portion 131a-6 disposed on the first additional electrode layer 134 and a first band portion 131b-6 extending from the first connecting portion 131a-6 to a part of the first surface 1, and the second external electrode 132-6 may include a second connecting portion 132a-6 disposed on the second additional electrode layer 135 and a second band portion 132b-6 extending from the second connecting portion 132a-6 to a part of the first surface 1.

[0175] On the other hand, the first and second additional electrode layers 131-6 and 132-6 may be formed using any material that has electrical conductivity, such as metal, and the specific material can be determined by considering electrical properties, structural stability, etc. Furthermore, the first and second additional electrode layers 131-6 and 132-6 may be firing electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin. In addition, the first and second additional electrode layers 131-6 and 132-6 may be formed by transferring a sheet containing conductive metal onto the main body.

[0176] The conductive metals included in the first and second additional electrode layers 131-6 and 132-6 are not particularly limited and can be materials with excellent electrical conductivity. For example, the conductive metals can be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. Preferably, the first and second additional electrode layers 131-6 and 132-6 can include one or more of Ni and Ni alloys, thereby further improving connectivity with the internal electrodes 121 and 122 containing Ni.

[0177] Figure 17 schematically illustrates a perspective view of a stacked electronic component 1007 according to one embodiment of the present invention, and Figure 18 is a cross-sectional view along line VII-VII' in Figure 17.

[0178] Referring to Figures 17 and 18, the average thickness t1 of the first and second plating layers 141-6 and 142-6 of the multilayer electronic component 1007 according to one embodiment of the present invention can be thinner than the average thickness t2 of the insulating layer 151-6.

[0179] Although insulating layer 151-6 prevents the penetration of moisture or plating solution from the outside, its weak connectivity with plating layers 141-6 and 142-6 can cause delamination of layers 141-6 and 142-6. When the plating layers are delaminated, the adhesion strength to the substrate 180 may decrease. Here, delamination of plating layers 141-6 and 142-6 can mean that the plating layers are partially peeled off or physically separated from the external electrodes 131-5 and 132-5. Due to the weak connectivity between the plating layers and insulating layers, the gap at the interface between the insulating layer and the plating layer may widen, increasing the likelihood of foreign matter penetration and making the layer more vulnerable to external impacts, thus increasing the risk of delamination.

[0180] According to one embodiment of the present invention, the average thickness t1 of the plating layer can be made thinner than the average thickness t2 of the insulating layer, thereby reducing the contact area between the plating layer and the insulating layer. This suppresses the occurrence of delamination and improves the adhesion strength of the multilayer electronic component 1000 to the substrate 180.

[0181] The average thickness t1 of the first and second plating layers 141-6 and 142-6 can be the average of the thicknesses measured at five equally spaced points on the first and second connection portions 131a-5 and 132a-5 or the first and second band portions 131b-5 and 132b-5, and the average thickness t2 of the insulating layer 151-6 can be the average of the thicknesses measured at five equally spaced points on the first and second connection portions 131a-5 and 132a-5.

[0182] Figure 19 schematically illustrates a perspective view of a stacked electronic component 2000 according to one embodiment of the present invention, and Figure 20 is a cross-sectional view along line VIII-VIII' in Figure 19.

[0183] Hereinafter, a stacked electronic component 2000 according to one embodiment of the present invention will be described in detail with reference to Figures 19 and 20. However, any content that overlaps with the above description may be omitted to avoid redundant explanation.

[0184] A stacked electronic component 2000 according to one embodiment of the present invention includes a dielectric layer 111, first and second internal electrodes 121 and 122 arranged alternately with the dielectric layer in between, a body 110 including first and second surfaces 1 and 2 facing in the first direction, third and fourth surfaces 3 and 4 connected to the first and second surfaces and facing in the second direction, and fifth and sixth surfaces 5 and 6 connected to the first to fourth surfaces and facing in the third direction, and a first connecting electrode 231a arranged on the third surface and a first band electrode 231b arranged on the first surface and connected to the first connecting electrode. The device includes an external electrode 231, a second external electrode 232 including a second connecting electrode 232a disposed on the fourth surface and a second band electrode 232b disposed on the first surface and connected to the second connecting electrode, a first insulating layer 251 disposed on the first connecting electrode, a second insulating layer 252 disposed on the second connecting electrode, a first plating layer 241 disposed on the first band electrode, and a second plating layer 242 disposed on the second band electrode, wherein the first and second insulating layers 251 and 252 may contain an oxide containing zirconium (Zr).

[0185] The first connecting electrode 231a can be positioned on the third surface 3 and connected to the first internal electrode 121, and the second connecting electrode 231b can be positioned on the fourth surface 4 and connected to the second internal electrode 122. In addition, a first insulating layer 251 can be positioned on the first connecting electrode 231a', and a second insulating layer 252 can be positioned on the second connecting electrode 232a.

[0186] Conventionally, when forming external electrodes, the main method used was to use a paste containing conductive metal and dip the exposed surface of the main body's internal electrodes into the paste. However, external electrodes formed by the dipping method sometimes had a very thick thickness in the center in the thickness direction. Furthermore, even without the problem of thickness variation of external electrodes due to the dipping method, since the internal electrodes are exposed on the third and fourth surfaces of the main body, the external electrodes placed on the third and fourth surfaces were formed to have a thickness of a certain level or more in order to suppress the penetration of moisture and plating solution by the external electrodes.

[0187] In contrast, in the present invention, since insulating layers 251 and 252 are arranged on the connecting electrodes 231a and 232a, sufficient reliability can be ensured even if the thickness of the connecting electrodes 231a and 232a on the third and fourth surfaces where the internal electrodes are exposed is reduced.

[0188] The first and second connecting electrodes 231a and 232a can be configured to correspond to the third and fourth surfaces, respectively, and the surfaces extending from the first and second connecting electrodes 231a and 232a toward the main body 110 can have the same area as the third and fourth surfaces of the main body 110, respectively. The first and second connecting electrodes 231a and 232a can be positioned within a range that does not deviate from the third and fourth surfaces 3 and 4, respectively. The connecting electrodes 231a and 232a can be positioned so as not to extend to the first, second, fifth and sixth surfaces 1, 2, 5 and 6 of the main body 110. Specifically, in one embodiment, the first and second connecting electrodes 231a and 232a can be positioned spaced apart from the fifth and sixth surfaces. This makes it possible to increase the capacity per unit volume of the stacked electronic component 2000 by minimizing the volume occupied by the external electrodes while ensuring sufficient connectivity between the internal electrodes 121 and 122 and the external electrodes 231 and 232.

[0189] From this perspective, the first and second connecting electrodes 231a and 232a can be arranged at a distance from the second surface 2. That is, since the external electrodes 231 and 232 are not arranged on the second surface, the volume occupied by the external electrodes 231 and 232 can be further minimized, thereby further increasing the capacity per unit volume of the stacked electronic component 2000.

[0190] However, the connecting electrodes 231a and 232a may include corner portions that extend to the corners of the main body 110 and are positioned on the corners. That is, in one embodiment, the first connecting electrode includes a corner portion (not shown) that extends and is positioned on the first to third corners and the second to third corners, and the second connecting electrode may include a corner portion (not shown) that extends and is positioned on the first to fourth corners and the second to fourth corners.

[0191] Furthermore, the connecting electrodes 231a and 232a can have a more uniform and thinner thickness compared to external electrodes formed by the conventional dipping method.

[0192] The method for forming the connecting electrodes 231a and 232a is not particularly limited, but for example, they can be formed by transferring sheets containing a conductive metal, an organic substance such as a binder, to the third and fourth surfaces, but they are not limited to this, and they can also be formed by plating a conductive metal onto the third and fourth surfaces. In other words, the connecting electrodes 231a and 232a can be a fired layer or a plated layer of a fired conductive metal.

[0193] The thickness of the connecting electrodes 231a and 232a is not particularly limited, but can be, for example, 2 to 7 μm. Here, the thickness of the connecting electrodes 231a and 232a can refer to the maximum thickness, and can also refer to the second directional size of the connecting electrodes 231a and 232a.

[0194] In one embodiment, the first and second connecting electrodes 231a and 232a may contain the same metal and glass as the metal contained in the internal electrodes 121 and 122. By including the same metal as the metal contained in the internal electrodes 121 and 122, the electrical connectivity with the internal electrodes 121 and 122 can be improved, and by including glass in the first and second connecting electrodes 231a and 232a, the bonding strength with the main body 110 and / or insulating layers 251 and 252 can be improved. In this case, the same metal as the metal contained in the internal electrodes 121 and 122 may be Ni.

[0195] The first and second insulating layers 251 and 252 are respectively placed on the first and second connecting electrodes 231a and 232a, and can serve to prevent the formation of a plating layer on the first and second connecting electrodes 231a and 232a. In addition, the first and second insulating layers 251 and 252 can improve sealing characteristics and minimize the penetration of moisture, plating solution, etc., from the outside.

[0196] The first and second insulating layers 251 and 252 may contain an oxide containing zirconium (Zr).

[0197] This further improves moisture resistance reliability and suppresses cracks caused by thermal shrinkage and radial cracks caused by metal diffusion.

[0198] The first and second band electrodes 231b and 232b can be positioned on the first surface 1 of the main body 110. The first and second band electrodes 231b and 232b can be electrically connected to the first and second internal electrodes 121 and 122, respectively, by contacting the first and second connecting electrodes 231a and 232a.

[0199] External electrodes formed by conventional dipping methods are formed thickly on the third and fourth surfaces, and are partially extended onto the first, second, fifth, and sixth surfaces, which presents a problem in that it is difficult to secure a high effective volume ratio.

[0200] In contrast, according to one embodiment of the present invention, by arranging the first and second connecting electrodes 231a and 232a on the surface where the internal electrodes are exposed, and the first and second band electrodes 231b and 232b on the surface that is mounted on the substrate, a high effective volume ratio can be secured.

[0201] On the other hand, when the internal electrodes 121 and 122 are stacked in a first direction, the stacked electronic component 2000 can be horizontally mounted on the substrate so that the internal electrodes 121 and 122 are parallel to the mounting surface. However, the present invention is not limited to horizontal mounting; when the internal electrodes 121 and 122 are stacked in a third direction, the stacked electronic component can be vertically mounted on the substrate so that the internal electrodes 121 and 122 are perpendicular to the mounting surface.

[0202] The first and second band electrodes 231b and 232b may be formed using any material that has electrical conductivity, such as metal, and the specific material can be determined by considering electrical properties, structural stability, etc. For example, the first and second band electrodes 231 and 232b can be firing electrodes containing conductive metal and glass, and can be formed by applying a paste containing conductive metal and glass to the first surface of the main body, but are not limited to this, and can be a plated layer in which conductive metal is plated onto the first surface of the main body.

[0203] The conductive metals included in the first and second band electrodes 231b and 232b can be materials with excellent electrical conductivity and are not particularly limited. For example, the conductive metal can be one or more of nickel (Ni), copper (Cu), and their alloys, and may include the same metals as those included in the internal electrodes 121 and 122.

[0204] On the other hand, in order to ensure sealing characteristics and high strength, in one embodiment, the first external electrode 231 may further include a third band electrode (not shown) arranged on the second surface 2 and connected to the first connecting electrode 231a, and the second external electrode 232 may further include a fourth band electrode (not shown) arranged on the second surface 2 and connected to the second connecting electrode 232a.

[0205] In one embodiment, when B1 is the distance from the extension line E3 of the third surface to the end of the first band electrode 231b, B2 is the distance from the extension line E4 of the fourth surface to the end of the second band electrode 232b, B3 is the distance from the extension line of the third surface to the end of the third band electrode (not shown), B4 is the distance from the extension line of the fourth surface to the end of the fourth band electrode (not shown), G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, then B1≧G1, B3≦G1, B2≧G2, and B4≦G2 can be satisfied. This makes it possible to minimize the volume occupied by the external electrodes and increase the capacity per unit volume of the stacked electronic component 2000, as well as increase the contact area with the solder during mounting and improve the bonding strength.

[0206] However, there is no intention to limit the present invention to B1≧G1, B3≦G1, B2≧G2, and B4≦G2; rather, cases satisfying B1≧G1, B3≧G1, B2≧G2, and B4≧G2 can also be included as one embodiment of the present invention. Therefore, in one embodiment, when B1 is the distance from the extension line E3 of the third surface to the end of the first band electrode 231b, B2 is the distance from the extension line E4 of the fourth surface to the end of the second band electrode 232b, B3 is the distance from the extension line of the third surface to the end of the third band electrode (not shown), B4 is the distance from the extension line of the fourth surface to the end of the fourth band electrode (not shown), G1 is the average size in the second direction of the region separated from the third surface and the second internal electrode 122, and G2 is the average size in the second direction of the region separated from the fourth surface and the first internal electrode 121, then B1≧G1, B3≧G1, B2≧G2, and B4≧G2 can be satisfied.

[0207] The first and second plating layers 241 and 242 can be placed on the first and second band electrodes 231b and 232b. The first and second plating layers 241 and 242 play a role in improving the mounting characteristics. The types of the first and second plating layers 241 and 242 are not particularly limited and can be plating layers containing one or more of Ni, Sn, Pd, and their alloys, and can consist of multiple layers.

[0208] To give a more specific example of the first and second plating layers 241 and 242, the first and second plating layers 241 and 242 can be Ni plating layers or Sn plating layers, and the Ni plating layer and the Sn plating layer can be formed sequentially on the first and second band electrodes 231b and 232b.

[0209] In one embodiment, the first and second plating layers 241 and 242 can be arranged to extend and partially cover the first and second connecting electrodes 231a and 232a, respectively.

[0210] When H1 is the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122, and H2 is the average size in the first direction from the extension of the first surface 1 to the ends of the first and second plating layers 241 and 242 placed on the first and second connecting electrodes 231a and 232a, it is possible to satisfy H1 > H2. This makes it possible to suppress the penetration of the plating solution into the internal electrodes during the plating process and improve reliability.

[0211] In one embodiment, the first and second insulating layers 251 and 252 are arranged to be in direct contact with the first and second connecting electrodes 231a and 232a, respectively, and the first and second connecting electrodes 231a and 232a may include conductive metal and glass. As a result, the plating layers 241 and 242 may not be placed in areas on the outer surface of the first and second connecting electrodes 231a and 232a where the insulating layers 251 and 252 are arranged, thereby effectively suppressing external electrode erosion by the plating solution.

[0212] In one embodiment, the first and second insulating layers 251 and 252 are arranged to be in direct contact with the first and second connecting electrodes 231a and 232a, respectively, and the first and second connecting electrodes 231a and 232a may include conductive metal and resin. As a result, the plating layers 241 and 242 may not be placed in areas on the outer surface of the first and second connecting electrodes 231a and 232a where the insulating layers 251 and 252 are arranged, thereby effectively suppressing external electrode erosion by the plating solution.

[0213] In one embodiment, the first plating layer 241 can be positioned to cover the end of the first insulating layer 251 located on the first external electrode 231, and the second plating layer 242 can be positioned to cover the end of the second insulating layer 252 located on the second external electrode 232. This strengthens the bonding force between the insulating layers 251, 252 and the plating layers 241, 242, thereby improving the reliability of the multilayer electronic component 2000. Furthermore, by forming the first and second insulating layers 251, 252 before forming the plating layers 241, 242 on the external electrodes 231, 232, the penetration of the plating solution during the plating layer formation process can be more reliably suppressed. By forming the insulating layers before the plating layers, the plating layers 241, 242 can have a configuration that covers the ends of the insulating layers 251, 252.

[0214] In one embodiment, the first insulating layer 251 can be positioned to cover the end of the first plating layer 241 that is located on the first external electrode 231, and the second insulating layer 252 can be positioned to cover the end of the second plating layer 242 that is located on the second external electrode 232. This strengthens the bonding force between the insulating layer 251 and the plating layers 241 and 242, thereby improving the reliability of the multilayer electronic component 2000.

[0215] Figure 21 illustrates a modified example of Figure 19. Referring to Figure 21, in a modified example 2001 of the stacked electronic component 2000 according to one embodiment of the present invention, the first and second insulating layers 251-1 and 252-1 can be extended to the fifth and sixth surfaces 5 and 6 and connected to each other, thereby being connected as a single insulating layer 253-1. In this case, the connected first and second insulating layers 253-1 can be arranged to cover a portion of the fifth and sixth surfaces.

[0216] Figure 22 schematically illustrates a perspective view of a stacked electronic component 2002 according to one embodiment of the present invention, and Figure 23 is a cross-sectional view along line IX-IX' in Figure 22.

[0217] Referring to Figures 22 and 23, in the stacked electronic component 2002 according to one embodiment of the present invention, the first and second plating layers 241-2 and 242-2 can be positioned below the extension line of the first surface. This minimizes the height of the solder during mounting and minimizes the mounting space.

[0218] Furthermore, the first and second insulating layers 251-2 and 252-2 can be extended to below the extension line of the first surface and arranged in contact with the first and second plating layers 241-2 and 242-2.

[0219] Figure 24 illustrates a modified example of Figure 22. Referring to Figure 24, in a modified example 2003 of the stacked electronic component 2002 according to one embodiment of the present invention, the first and second insulating layers 251-3 and 252-3 can be extended to the fifth and sixth surfaces 5 and 6 and connected to each other, thereby being connected as a single insulating layer 253-3. In this case, the connected first and second insulating layers 253-3 can be arranged to cover the entirety of the fifth and sixth surfaces.

[0220] Figure 25 schematically illustrates a perspective view of a stacked electronic component 2004 according to one embodiment of the present invention, and Figure 26 is a cross-sectional view taken along line X-X' in Figure 25.

[0221] Referring to Figures 25 and 26, the stacked electronic component 2004 according to one embodiment of the present invention may further include an additional insulating layer 261 disposed on the first surface 1 and positioned between the first band electrode 231b and the second band electrode 232b. This makes it possible to prevent leakage currents and the like that may occur between the first band electrode 231b and the second band electrode 232b under high voltage current.

[0222] The type of additional insulating layer 261 is not particularly limited. For example, the additional insulating layer 261 may contain an oxide containing zirconium (Zr), similar to the first and second insulating layers 251-2 and 252-2. However, the additional insulating layer 261 and the first and second insulating layers 251-2 and 252-2 are not limited to the same material and may be formed from different materials. For example, it may contain one or more materials selected from epoxy resin, acrylic resin, ethyl cellulose, etc., or it may contain glass.

[0223] Figure 27 illustrates a modified example of Figure 25. Referring to Figure 27, in a modified example 2005 of the stacked electronic component 2004 according to one embodiment of the present invention, the first and second insulating layers 251-5 and 252-5 are extended to the fifth and sixth surfaces 5 and 6 and connected to each other, so that they can be connected as a single insulating layer 253-5.

[0224] Figure 28 schematically illustrates a perspective view of a stacked electronic component 2006 according to one embodiment of the present invention, and Figure 29 is a cross-sectional view along line XI-XI' in Figure 28.

[0225] Referring to FIGS. 28 and 29, a stacked electronic component 2006 according to an embodiment includes a first insulating layer 251-6 disposed on the first connection electrode 231a and a second insulating layer 252-6 disposed on the second connection electrode 232a. When the average size in the first direction from the first surface 1 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the ends of the first and second plating layers 241-6 and 242-6 disposed on the first and second connection electrodes 231a and 232a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with solder during mounting can be increased to improve the fixing strength.

[0226] More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is T / 2 or more, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0227] FIG. 30 illustrates a modified example of FIG. 28. Referring to FIG. 30, a modified example 2007 of the stacked electronic component 2006 according to an embodiment of the present invention can be connected as one insulating layer 253-7 by extending the first and second insulating layers 251-7 and 252-7 to the fifth and sixth surfaces 5 and 6 and connecting them to each other.

[0228] FIG. 31 schematically illustrates a perspective view of a stacked electronic component 2008 according to an embodiment of the present invention, and FIG. 32 is a cross-sectional view taken along XII-XII' of FIG. 31.

[0229] Referring to FIGS. 31 and 32, a stacked electronic component 2008 according to an embodiment of the present invention can be connected as one insulating layer 253-8 by extending the first and second insulating layers 251-8 and 252-8 to the second, fifth, and sixth surfaces 2, 5, and 6 and connecting them to each other. As shown in FIG. 33, the insulating layer 253-8 may be in a form that entirely covers the second surface, and the fifth and sixth surfaces may be in a form that covers only a part.

[0230] Figure 33 schematically illustrates a perspective view of a stacked electronic component 2009 according to one embodiment of the present invention, and Figure 34 is a cross-sectional view along line XIII-XIII' in Figure 33.

[0231] Referring to Figures 35 and 36, the average thickness t1 of the first and second plating layers 241-9 and 242-9 of the multilayer electronic component 2009 according to one embodiment of the present invention can be thinner than the average thickness t2 of the first and second insulating layers 251-9 and 252-9.

[0232] According to one embodiment of the present invention, the average thickness t1 of the first and second plating layers 241-9 and 242-9 can be made thinner than the average thickness t2 of the first and second insulating layers 251-9 and 252-9, thereby reducing the contact area between the plating layer and the insulating layer. This suppresses the occurrence of delamination and improves the adhesion strength of the multilayer electronic component 2009 to the substrate 180.

[0233] The average thickness t1 of the first and second plating layers 241-9 and 242-9 can be the average of the thicknesses measured at five equally spaced points on the first and second connecting electrodes 231a and 232a or the first and second band electrodes 231b and 232b, and the average thickness t2 of the insulating layers 251-9 and 252-9 can be the average of the thicknesses measured at five equally spaced points on the first and second connecting electrodes 231a and 232a.

[0234] Figure 35 illustrates a modified example of Figure 33. Referring to Figure 35, in a modified example 2010 of the stacked electronic component 2009 according to one embodiment of the present invention, the first and second insulating layers 251-10 and 252-10 are extended to the fifth and sixth surfaces 5 and 6 and connected to each other, so that they can be connected as a single insulating layer 253-10.

[0235] Figure 36 schematically illustrates a perspective view of a stacked electronic component 3000 according to one embodiment of the present invention, Figure 37 is a cross-sectional view along the line XIV-XIV' in Figure 36, and Figure 38 is an enlarged view of the K1 region in Figure 36.

[0236] Referring to Figures 36 to 38, a stacked electronic component 3000 according to one embodiment of the present invention includes a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged alternately with the dielectric layer in between, and comprises a body 110 including first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction, and a first connecting portion 331a disposed on the third surface of the body, a first band portion 331b extending from the first connecting portion to a part of the first surface, and a first corner portion 331c extending from the first connecting portion to the corner connecting the second and third surfaces of the body. The device includes a first external electrode 331, a second external electrode 332 including a second connecting portion 332a disposed on the fourth surface of the main body, a second band portion 332b extending from the second connecting portion to a part of the first surface, and a second corner portion 332c extending from the second connecting portion to a corner connecting the second and fourth surfaces of the main body, an insulating layer 351 disposed on the first and second connecting portions 331a, 332a and disposed to cover the second surface, the first and second corner portions, a first plating layer 341 disposed on the first band portion, and a second plating layer 342 disposed on the second band portion, wherein the first and second insulating layers may contain an oxide containing zirconium (Zr).

[0237] In one embodiment, when the average size in the second direction from the extension line of the third surface to the end of the first corner portion 331c is B3, the average size in the second direction from the extension line of the fourth surface to the end of the second corner portion 332c is B4, the average size in the second direction of the region separated from the third surface and the second internal electrode is G1, and the average size in the second direction of the region separated from the fourth surface and the first internal electrode is G2, then B31 and B42 can be satisfied. This makes it possible to minimize the volume occupied by the external electrodes 331 and 332 and increase the capacity per unit volume of the stacked electronic component 3000.

[0238] In this case, when the average size in the second direction from the extension line of the third surface to the end of the first band portion 331b is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion 332b is B2, then B1≧G1 and B3≧G2 can be satisfied. This makes it possible to increase the area in contact with the solder during mounting and improve the bonding strength.

[0239] A stacked electronic component 3000 according to one embodiment may include a body 110 that includes a dielectric layer 111 and first and second internal electrodes 121 and 122 arranged alternately with the dielectric layer in between, and includes first and second surfaces facing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and facing each other in a second direction, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other in a third direction. The body 110 of the stacked electronic component 3000 may have the same configuration as the body 110 of the stacked electronic component 1000, except that the end of the first or second surface of the body is contracted, as will be described later.

[0240] External electrodes 331 and 332 can be arranged on the third surface 3 and fourth surface 4 of the main body 110. The external electrodes 331 and 332 may include first and second external electrodes 331 and 332, respectively, which are arranged on the third and fourth surfaces 3 and 4 of the main body 110 and connected to first and second internal electrodes 121 and 122, respectively.

[0241] The external electrodes 331 and 332 may include a first external electrode 331 which includes a first connecting portion 331a located on the third surface, a first band portion 331b extending from the first connecting portion to a part of the first surface, and a first corner portion 331c extending from the first connecting portion to the corner connecting the second and third surfaces; and a second external electrode 132 which includes a second connecting portion 332a located on the fourth surface, a second band portion 332b extending from the second connecting portion to a part of the first surface, and a second corner portion 332c extending from the second connecting portion to the corner connecting the second and fourth surfaces. The first connecting portion 331a can be connected to the first internal electrode 121 on the third surface, and the second connecting portion 332a can be connected to the second internal electrode 122 on the fourth surface.

[0242] In one embodiment, the first and second connecting portions 331a and 332a can be arranged at a distance from the fifth and sixth surfaces. This minimizes the specific gravity occupied by the external electrodes 331 and 332, thereby further miniaturizing the stacked electronic component 3000.

[0243] Due to the overlap of margin regions on the dielectric layer 111 where internal electrodes 121 and 122 are not placed, a step difference is generated due to the thickness of the internal electrodes 121 and 122, and the corners connecting the first surface and the third to fifth surfaces and / or the second surface and the third to fifth surfaces may have a form that is contracted toward the first central side of the main body 110 when viewed with reference to the first or second surface. Alternatively, due to the contraction behavior during the sintering process of the main body, the corners connecting the first surface 1 and the third to sixth surfaces 3, 4, 5, and 6 and / or the corners connecting the second surface 2 and the third to sixth surfaces 3, 4, 5, and 6 may have a form that is contracted toward the first central side of the main body 110 when viewed with reference to the first or second surface. Alternatively, in order to prevent chipping defects, the corners connecting each face of the main body 110 can be rounded by performing a separate process to round the corners connecting the first face to the third to sixth faces and / or the corners connecting the second face to the third to sixth faces.

[0244] The above corners may include the 1st-3rd corner c1-3 connecting the 1st and 3rd faces, the 1st-4th corner c1-4 connecting the 1st and 4th faces, the 2nd-3rd corner c2-3 connecting the 2nd and 3rd faces, and the 2nd-4th corner c2-4 connecting the 2nd and 4th faces. Additionally, the corners may include the 1st-5th corner connecting the 1st and 5th faces, the 1st-6th corner connecting the 1st and 6th faces, the 2nd-5th corner connecting the 2nd and 5th faces, and the 2nd-6th corner connecting the 2nd and 6th faces. However, in order to suppress the step caused by the internal electrodes 121 and 122, if the internal electrodes after lamination are cut so that they are exposed on the fifth and sixth surfaces 5 and 6 of the main body, and then a single dielectric layer or two or more dielectric layers are laminated on both sides of the capacitance forming portion Ac in the third direction (width direction) to form margin portions 114 and 115, then the portions connecting the first surface with the fifth and sixth surfaces and the portions connecting the second surface with the fifth and sixth surfaces do not need to have a contracted form.

[0245] On the other hand, the first to sixth surfaces of the main body 110 can generally be flat, and non-flat areas can be designated as corners. In addition, the areas of the external electrodes 131 and 132 that are located on the corners can be designated as corner sections.

[0246] From this perspective, the first and second corner portions 331c and 332c can be positioned below the extension line E2 of the second surface, and the first and second corner portions 331c and 332c can be positioned at a distance from the second surface. That is, since the external electrodes 331 and 332 are not positioned on the second surface, the volume occupied by the external electrodes 331 and 332 can be further minimized, thereby further increasing the capacity per unit volume of the stacked electronic component 3000. In addition, the first corner portion 331c can be positioned on a part of the second-third corner C2-3 connecting the third surface and the second surface, and the second corner portion 332c can be positioned on a part of the second-fourth corner C2-4 connecting the fourth surface and the second surface.

[0247] The extension line E2 of the second face can be defined as follows:

[0248] In the length-thickness cross-section (LT cross-section) obtained by cutting the stacked electronic component 3000 in the center in the width direction, seven straight lines P0, P1, P2, P3, P4, P5, P6, and P7 are drawn in the thickness direction with equal spacing in the length direction from the third surface to the fourth surface. The line passing through the point where P2 intersects the second surface and the point where P4 intersects the second surface can be defined as the extension line E2 of the second surface.

[0249] On the other hand, the external electrodes 331 and 332 can be formed using any material that has electrical conductivity, such as metal, and the specific material can be determined by considering electrical properties, structural stability, etc. Furthermore, they can have a multilayer structure.

[0250] The external electrodes 331 and 332 can be firing electrodes containing conductive metal and glass, or resin-based electrodes containing conductive metal and resin.

[0251] Furthermore, the external electrodes 331 and 332 may be formed in a manner in which a fired electrode and a resin-based electrode are sequentially formed on the main body. Also, the external electrodes 331 and 332 may be formed by transferring a sheet containing a conductive metal onto the main body, or by transferring a sheet containing a conductive metal onto a fired electrode.

[0252] The conductive metal included in the external electrodes 331 and 332 can be any material with excellent electrical conductivity and is not particularly limited. For example, the conductive metal can be one or more of Cu, Ni, Pd, Ag, Sn, Cr, and their alloys. Preferably, the external electrodes 331 and 332 can include one or more of Ni and Ni alloys, which can further improve connectivity with the internal electrodes 121 and 122 containing Ni.

[0253] The insulating layer 351 can be placed on the first and second connection portions 331a and 332a.

[0254] Since the first and second connection parts 331a and 332a are connected to the internal electrodes 121 and 122, they can become pathways for penetration of the plating solution during the plating process or for moisture penetration during actual use. In the present invention, since an insulating layer 351 is placed on the connection parts 331a and 332a, it is possible to prevent penetration of moisture from the outside or penetration of the plating solution.

[0255] The insulating layer 351 can be positioned in contact with the first and second plating layers 341 and 342. In this case, the insulating layer 351 can be in contact with the first and second plating layers 341 and 342 in a manner that partially covers their edges, or the first and second plating layers 341 and 342 can be in contact with the insulating layer 351 in a manner that partially covers their edges.

[0256] The insulating layer 353 can be placed on the first and second connection portions 331a and 332a and positioned to cover the second surface and the first and second corner portions 331c and 332c. Furthermore, the insulating layer 351 can further improve moisture resistance by covering the areas where the ends of the first and second corner portions 331c and 332c and the main body 110 are in contact, thereby blocking moisture penetration paths.

[0257] The insulating layer 351 is positioned on the second surface and can extend to the first and second connection portions 331a and 332a. Furthermore, if the external electrodes 331 and 332 are not positioned on the second surface, the insulating layer can be positioned to completely cover the second surface. On the other hand, the insulating layer 351 does not necessarily have to be positioned on the second surface; it may not be positioned on part or all of the second surface, and the insulating layer may be separated into two parts, each positioned on the first and second connection portions 331a and 332a. However, even in this case, the insulating layer can be positioned to completely cover the first and second corner portions 331c and 332c. If the insulating layer is not positioned on the entire second surface, it can be positioned below the extension line of the second surface. Also, even if the insulating layer is not positioned on the second surface, it can extend over the first and second connection portions 331a and 332a to form a single insulating layer on the fifth and sixth surfaces.

[0258] In one embodiment, the insulating layer 351 can be arranged to cover a portion of the fifth and sixth surfaces to improve reliability. In this case, the portion of the fifth and sixth surfaces not covered by the insulating layer can be exposed to the outside.

[0259] Furthermore, the insulating layer 351 can be positioned to cover the entire fifth and sixth surfaces, in which case the fifth and sixth surfaces are not exposed to the outside, thereby further improving moisture resistance reliability.

[0260] The insulating layer 351 can prevent the formation of plating layers 341 and 342 on the external electrodes 331 and 332 on which the insulating layer 351 is placed, thereby improving sealing properties and minimizing the penetration of moisture, plating solutions, etc., from the outside. The components, composition, average thickness, and effects of the insulating layer 351 are the same as those of the insulating layers 151, 251, 252, and 253, which include the multilayer electronic components 1000 and 2000, or various embodiments thereof, so a detailed explanation of these is omitted.

[0261] The first and second plating layers 341 and 342 can be placed on the first and second band portions 331b and 332b, respectively. The plating layers 341 and 342 can improve mounting characteristics, and by placing the plating layers 341 and 342 on the band portions 331b and 332b, the mounting space can be minimized, and the penetration of the plating solution into the internal electrodes can be minimized, thereby improving reliability. One end of the first and second plating layers 341 and 342 can be in contact with the first surface, and the other end can be in contact with the insulating layer 351.

[0262] The types of plating layers 341 and 342 are not particularly limited and may be plating layers containing one or more of Cu, Ni, Sn, Ag, Au, Pd, and their alloys, and may consist of multiple layers.

[0263] More specific examples of the plating layers 341 and 342 can be that the plating layers 341 and 342 can be Ni plating layers or Sn plating layers, and can be in a form where Ni plating layers and Sn plating layers are sequentially formed on the first and second band portions 331b and 332b.

[0264] In one embodiment, the insulating layer 351 is arranged to be in direct contact with the first and second external electrodes 331 and 332, and the first and second external electrodes 331 and 332 can include a conductive metal and glass. Thereby, since the plating layers 341 and 342 may not be arranged in the region where the insulating layer 351 is arranged on the outer surfaces of the first and second external electrodes 331 and 332, erosion of the external electrodes by the plating solution can be effectively suppressed.

[0265] In one embodiment, the insulating layer 351 is arranged to be in direct contact with the first and second external electrodes 331 and 332, and the first and second external electrodes 331 and 332 can include a conductive metal and a resin. Thereby, since the plating layers 341 and 342 may not be arranged in the region where the insulating layer 351 is arranged on the outer surfaces of the first and second external electrodes 331 and 332, erosion of the external electrodes by the plating solution can be effectively suppressed.

[0266] In one embodiment, the first plating layer 341 can be arranged to cover an end portion arranged on the first external electrode 331 of the insulating layer 351, and the second plating layer 342 can be arranged to cover an end portion arranged on the second external electrode 332 of the insulating layer 351. Thereby, the bonding force between the insulating layer 351 and the plating layers 341 and 342 can be strengthened, and the reliability of the stacked electronic component 3000 can be improved. Also, by forming the insulating layer 351 first before forming the plating layers 341 and 342 on the external electrodes 331 and 332, penetration of the plating solution during the plating layer formation process can be more reliably suppressed. By forming the insulating layer before the plating layer, the plating layers 341 and 342 can have a form that covers the end portions of the insulating layer 351.

[0267] In one embodiment, the insulating layer 351 is arranged to cover an end portion disposed on the first external electrode 331 of the first plating layer 341, and the insulating layer 351 can be arranged to cover an end portion disposed on the second external electrode 332 of the second plating layer 342. Thereby, the bonding strength between the insulating layer 351 and the plating layers 341 and 342 can be enhanced, and the reliability of the stacked electronic component 3000 can be improved.

[0268] In one embodiment, the first and second plating layers 341 and 342 can be extended and arranged to partially cover the first and second connection portions 331a and 332a, respectively. When the average size in the first direction from the first and second plating layers 341 and 342 to the internal electrode closest to the first surface 1 among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface 1 to the end portions of the first and second plating layers 341 and 342 disposed on the first and second connection portions 331a and 332a is H2, H1 > H2 can be satisfied. Thereby, it is possible to suppress the penetration of the plating solution into the internal electrode during the plating process and improve the reliability.

[0269] In one embodiment, when the average size in the first direction from the first surface to the internal electrode closest to the first surface among the first and second internal electrodes 121 and 122 is H1, and the average size in the first direction from the extension line of the first surface to the end portions of the plating layers 341 and 342 disposed on the first and second connection portions 331a and 332a is H2, H1 < H2 can be satisfied. Thereby, the area in contact with the solder during mounting can be increased, and the fixing strength can be improved. More preferably, when the average size in the first direction of the main body 110 is T, H2 < T / 2 can be satisfied. That is, H1 < H2 < T / 2 can be satisfied. This is because when H2 is greater than or equal to T / 2, the effect of improving the moisture resistance reliability by the insulating layer may decrease.

[0270] In one embodiment, the first and second plating layers 341 and 342 can be positioned below the extension line of the first surface. This minimizes the height of the solder during mounting and reduces the mounting space. The insulating layer 351 can also be positioned so as to extend below the extension line of the first surface and be in contact with the first and second plating layers 341 and 342.

[0271] In one embodiment, when the average size of the main body in the second direction is L, the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, the conditions 0.2 ≤ B1 / L ≤ 0.4 and 0.2 ≤ B2 / L ≤ 0.4 can be satisfied.

[0272] If B1 / L and B2 / L are less than 0.2, it may be difficult to ensure sufficient adhesion strength. On the other hand, if B2 / L exceeds 0.4, there is a risk of leakage current occurring between the first band portion 331b and the second band portion 332b under high voltage current, and there is a risk that the first band portion 331b and the second band portion 332b may become electrically connected due to plating bleeding or the like during the plating process.

[0273] In one embodiment, an additional insulating layer may be further included, which is disposed on the first surface and positioned between the first band portion 331b and the second band portion 332b. This makes it possible to prevent leakage currents and the like that may occur between the first band electrode 331b and the second band electrode 332b under high voltage current.

[0274] The type of additional insulating layer is not particularly limited. For example, the additional insulating layer may contain an oxide containing zirconium (Zr), similar to the insulating layer 351. However, the additional insulating layer and the insulating layer 351 are not limited to the same material and may be formed from different materials. For example, they may contain one or more materials selected from epoxy resin, acrylic resin, ethyl cellulose, etc., or they may contain glass.

[0275] In one embodiment, when the average size in the second direction from the extension line of the third surface to the end of the first band portion is B1 and the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, B3 < B1 and B4 < B2 can be satisfied. The average length B1 of the first band portion 331b can be longer than the average length B3 of the first corner portion 331c, and the average length of the second band portion can be longer than the average length B4 of the second corner portion 332c. Thereby, the area in contact with solder during mounting can be increased to improve the fixing strength

[0276] More specifically, when the average size in the second direction from the extension line of the third surface 3 to the end of the first band portion 331b is B1, the average size in the second direction from the extension line of the fourth surface 4 to the end of the second band portion 332b is B2, the average size in the second direction from the extension line of the third surface 3 to the end of the first corner portion 331c is B3, and the average size in the second direction from the extension line of the fourth surface 4 to the end of the second corner portion 332c is B4, B3 < B1 and B4 < B2 can be satisfied.

[0277] In one embodiment, the average thicknesses of the first and second plating layers 341 and 342 may be thinner than the average thickness of the insulating layer 351.

[0278] Although the insulating layer 351 serves to prevent moisture penetration from the outside or penetration of the plating solution, since the connectivity with the plating layers is weak, it may cause delamination of the layers. When the plating layer is delaminated, the fixing strength with the substrate may decrease. Here, delamination of the plating layer can mean that the plating layer is partially peeled off or physically separated from the external electrodes 331 and 332. Since the connectivity between the plating layer and the insulating layer is weak, the gap at the interface between the insulating layer and the plating layer is likely to widen or foreign matter is likely to penetrate, making it vulnerable to external shocks and increasing the risk of delamination.

[0279] According to one embodiment of the present invention, the average thickness of the plating layer can be made thinner than the average thickness of the insulating layer, thereby reducing the contact area between the plating layer and the insulating layer. This suppresses the occurrence of delamination and improves the adhesion strength with the multilayer electronic component 3000.

[0280] There is no particular limit to the size of the 3000 multilayer electronic component.

[0281] However, in order to achieve both miniaturization and high capacitance simultaneously, the thickness of the dielectric layer and internal electrodes must be reduced and the number of layers increased. Therefore, in a stacked electronic component 3000 having a size of 1005 (length × width, 1.0 mm × 0.5 mm) or less, the improvement in reliability and capacitance per unit volume according to the present invention can be made more pronounced.

[0282] Therefore, considering manufacturing tolerances, external electrode size, etc., the reliability improvement effect according to the present invention can be more pronounced when the length of the stacked electronic component 3000 is 1.1 mm or less and the width is 0.55 mm or less. Here, the length of the stacked electronic component 3000 can mean the maximum size of the stacked electronic component 3000 in the second direction, and the width of the stacked electronic component 3000 can mean the maximum size of the stacked electronic component 3000 in the third direction.

[0283] The present invention is not limited by the embodiments described above or the accompanying drawings, but is limited by the claims provided herein. Therefore, within the scope of the technical idea of ​​the present invention as described in the claims, various forms of substitution, modification, and alteration are possible by persons with ordinary skill in the art, and these also fall within the scope of the present invention.

[0284] Note that the expression "one embodiment" used in the present invention does not mean the same embodiment, but is provided to emphasize and explain different unique features respectively. However, the above-presented one embodiment does not exclude being implemented in combination with the features of other embodiments. For example, even if a matter described in a specific one embodiment is not described in other embodiments, it can be understood as an explanation related to other embodiments as long as there is no explanation contrary to or conflicting with that matter in other embodiments.

[0285] The terms used in the present invention are merely used to explain one embodiment and are not intended to limit the present invention. At this time, the singular expression includes plural expressions unless clearly different expressions are used in the context.

Explanation of Signs

[0286] 1000, 2000, 3000 Multilayer Electronic Components 1100 Mounting Substrate 110 Body 111 Dielectric Layer 112, 113 Cover Portion 114, 115 Margin Portion 121, 122 Internal Electrodes 131, 231, 331 First External Electrodes 132, 232, 332 Second External Electrodes 134, 135 Additional Electrode Layers 141, 142, 241, 242, 341, 342 Plating Layers 151, 251, 252, 253, 351 Insulating Layers 161, 261 Additional Insulating Layers 180 Substrate 181, 182 Electrode Pads 191, 192 Solders

Claims

1. a main body including a dielectric layer and first internal electrodes and second internal electrodes alternately disposed with the dielectric layer sandwiched therebetween, the main body including a first surface and a second surface facing each other in a first direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other in the second direction, and a fifth surface and a sixth surface connected to the first surface and the fourth surface and facing each other in the third direction; a first external electrode including a first connection portion disposed on the third surface and a first band portion extending from the first connection portion to a portion of the first surface; a second external electrode including a second connection portion disposed on the fourth surface and a second band portion extending from the second connection portion to a portion of the first surface; a first insulating layer disposed on the first connection portion; a second insulating layer disposed on the second connection portion; a first plating layer disposed on the first band portion; a second plating layer disposed on the second band portion, The laminated electronic component, wherein the first insulating layer and the second insulating layer contain an oxide containing zirconium (Zr).

2. 2. The multilayer electronic component according to claim 1, wherein the average thickness of the first insulating layer and the second insulating layer is greater than 20 nm and is not greater than 1000 nm.

3. The laminated electronic component according to claim 1 , wherein the dielectric layer is substantially free of yttrium (Y).

4. The oxide containing zirconium (Zr) is ZrO ２ 2. The multilayer electronic component according to claim 1, wherein

5. 2. The laminated electronic component according to claim 1, wherein the first insulating layer and the second insulating layer are substantially free of yttrium (Y).

6. 2. The multilayer electronic component according to claim 1, wherein the number of moles of zirconium (Zr) element relative to the total number of moles of remaining elements excluding oxygen, among elements constituting the first insulating layer and the second insulating layer, is 0.95 or more.

7. 2. The multilayer electronic component according to claim 1, wherein the first insulating layer and the second insulating layer further contain at least one of magnesium (Mg), calcium (Ca), and oxides thereof.

8. H1 is an average size in a first direction from the first surface to the internal electrode arranged closest to the first surface among the first internal electrode and the second internal electrode; When an average size in a first direction from an extension line of the first surface to ends of the plating layers disposed on the first connection portion and the second connection portion is H2, The multilayer electronic component according to claim 1 , wherein H1>H2 is satisfied.

9. H1 is an average size in a first direction from the first surface to the internal electrode arranged closest to the first surface among the first internal electrode and the second internal electrode; When an average size in a first direction from an extension line of the first surface to ends of the plating layers disposed on the first connection portion and the second connection portion is H2, The multilayer electronic component according to claim 1 , wherein H1<H2 is satisfied.

10. When the average size of the body in the first direction is T, The multilayer electronic component according to claim 9, wherein H2<T / 2 is satisfied.

11. The multilayer electronic component according to claim 1 , wherein the first plating layer and the second plating layer are disposed below an extension of the first surface.

12. The average size of the body in the second direction is L; The average size in the second direction from the extension line of the third surface to the end of the first band portion is B1, When the average size in the second direction from the extension line of the fourth surface to the end of the second band portion is B2, 2. The multilayer electronic component according to claim 1, wherein 0.2≦B1 / L≦0.4 and 0.2≦B2 / L≦0.4 are satisfied.

13. 2. The laminated electronic component according to claim 1, further comprising an additional insulating layer disposed on the first surface and between the first band portion and the second band portion.

14. 2. The multilayer electronic component according to claim 1, wherein the dielectric layers have an average thickness of 0.35 [mu]m or less.

15. 2. The multilayer electronic component according to claim 1, wherein the average thickness of the first internal electrodes and the second internal electrodes is 0.35 [mu]m or less.

16. the main body includes a capacitance forming portion including first internal electrodes and second internal electrodes alternately arranged with the dielectric layer sandwiched therebetween, and a cover portion arranged on both end surfaces of the capacitance forming portion in a first direction, The multilayer electronic component according to claim 1 , wherein the average size of the cover in the first direction is 15 μm or less.

17. 2. The multilayer electronic component according to claim 1, wherein average thicknesses of the first plating layer and the second plating layer are thinner than average thicknesses of regions of the first insulating layer and the second insulating layer that are disposed on the first connecting portion and the second connecting portion.

18. the first plating layer is disposed so as to cover an end portion of the first insulating layer that is close to the first surface; The multilayer electronic component according to claim 1 , wherein the second plating layer is disposed so as to cover an end portion of the second insulating layer that is close to the first surface.

19. the first insulating layer is disposed so as to cover an end portion of the first plating layer that is disposed on the first external electrode; 2. The multilayer electronic component according to claim 1, wherein the second insulating layer is disposed so as to cover an end of the second plating layer that is disposed on the second external electrode.

20. the first external electrode includes a first side band portion extending from the first connection portion to a portion of the fifth surface and a portion of the sixth surface; the second external electrode includes a second side band portion extending from the second connection portion to a portion of the fifth surface and a portion of the sixth surface; The multilayer electronic component according to claim 1 , wherein the sizes of the first side band portion and the second side band portion in the second direction increase toward the first surface.

21. The multilayer electronic component according to claim 1 , wherein the first external electrode and the second external electrode are disposed apart from the fifth surface and the sixth surface.

22. The multilayer electronic component according to claim 1 , wherein the first external electrode and the second external electrode are disposed apart from the second surface.

23. The multilayer electronic component according to claim 1 , wherein the first insulating layer and the second insulating layer extend to the second surface and are connected to each other.

24. The multilayer electronic component according to claim 1 , wherein the first insulating layer and the second insulating layer extend to the fifth surface and the sixth surface and are connected to each other.

25. The multilayer electronic component according to claim 1 , wherein the insulating layer is not disposed on the second surface, the fifth surface, or the sixth surface.

26. the first external electrode includes a third band portion extending from the first connection portion to a portion of the second surface; The multilayer electronic component according to claim 1 , wherein the second external electrode includes a fourth band portion extending from the second connection portion to a portion of the second surface.

27. the main body includes a first-third corner connecting the first surface and the third surface, a first-fourth corner connecting the first surface and the fourth surface, a second-third corner connecting the second surface and the third surface, and a second-fourth corner connecting the second surface and the fourth surface; the first-third corner and the second-third corner have a shape that contracts toward the center of the first direction of the main body as they approach the third surface, the first-fourth corner and the second-fourth corner have a shape that contracts toward the center of the first direction of the main body as they approach the fourth surface, the first external electrode includes a first corner portion extending from the first connection portion onto the first-third corner and the second-third corner, 2. The multilayer electronic component according to claim 1, wherein the second external electrode includes a second corner portion extending from the second connection portion onto the first-fourth corner and the second-fourth corner.

28. The average size in the second direction from the extension line of the third surface to the end of the first corner portion is B3, and the average size in the second direction from the extension line of the fourth surface to the end of the second corner portion is B4. When the average size in the second direction of the region where the third surface and the second internal electrode are separated is G1 and the average size in the second direction of the region where the fourth surface and the first internal electrode are separated is G2, 28. The multilayer electronic component according to claim 27, wherein B3≦G1 and B4≦G2 are satisfied.

29. the first external electrode includes a first connecting electrode disposed on the third surface and a first band electrode disposed on the first surface and connected to the first connecting electrode; 2 . The multilayer electronic component according to claim 1 , wherein the second external electrodes include a second connecting electrode disposed on the fourth surface and a second band electrode disposed on the first surface and connected to the second connecting electrode.

30. The multilayer electronic component according to claim 29 , wherein the first connecting electrode and the second connecting electrode are disposed apart from the fifth surface and the sixth surface.

31. The multilayer electronic component according to claim 29 , wherein the first connecting electrode and the second connecting electrode are spaced apart from the second surface.

32. the first external electrode further includes a third band electrode disposed on the second surface and connected to the first connecting electrode; 30. The multilayer electronic component according to claim 29, wherein the second external electrode further comprises a fourth band electrode disposed on the second surface and connected to the second connecting electrode.

33. The multilayer electronic component of claim 29 , wherein the first connecting electrode and the second connecting electrode contain the same metal as the metal contained in the internal electrode.

34. 30. The multilayer electronic component according to claim 29, wherein the first band electrode and the second band electrode are firing electrodes including a conductive metal and a glass.

35. 30. The multilayer electronic component according to claim 29, wherein the first connecting electrode and the second connecting electrode are firing electrodes including a conductive metal and glass.

36. 30. The multilayer electronic component according to claim 29, wherein the first band electrode and the second band electrode are plated layers.

37. 30. The multilayer electronic component according to claim 29, wherein the first connecting electrode and the second connecting electrode are plated layers.

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