Radiation detection sensor, radiation imaging device, radiation imaging system, and method for manufacturing radiation detection sensor

Abstract

To provide a technique advantageous for achieving, in a sensor substrate, a light receiving area and a light blocking area in a pixel area with a simpler structure.SOLUTION: A sensor substrate includes: a substrate that comprises a pixel area in which a plurality of pixels are arranged on a first principal surface, a scintillator that is arranged on the first principal surface or a second principal surface; and a light blocking member that is arranged on the principal surface on which the scintillator is arranged. The pixel area includes: a first area in which, of the plurality of pixels, pixels generating signals corresponding to pixels of a radiation image are arranged; and a second area in which, of the plurality of pixels, pixels generating signals for correcting signals output from the first area are arranged. In orthogonal projection on the first principal surface, the scintillator is arranged to overlap the first area and not to overlap the second area. The light blocking member covers the scintillator, and in orthogonal projection on the first principal surface, is arranged to overlap the second area. A portion of the light blocking member overlapping the second area is joined to the principal surface on which the scintillator is arranged.SELECTED DRAWING: Figure 5

Description

[Technical Field]

[0001] The present invention relates to a sensor substrate, a radiation imaging device, a radiation imaging system, and a method for manufacturing a sensor substrate. [Background technology]

[0002] Radiation imaging devices with multiple pixels for detecting radiation have been put to practical use in medical image diagnosis and non-destructive testing. On a sensor substrate used in a radiation imaging device, differences in the environment, such as temperature, depending on the location of each pixel can cause an offset in the output of each pixel. Patent Document 1 discloses a method for performing offset correction of a signal output from a light receiving section using a signal output from an optical black (OB) pixel section covered with a metal light-shielding layer. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Japanese Patent Application Publication No. 6-302798 Summary of the Invention [Problem to be solved by the invention]

[0004] Patent Document 1 discloses a solid-state imaging device, but does not disclose a sensor substrate using a scintillator for acquiring a radiation image.

[0005] An object of the present invention is to provide a technique that is advantageous for realizing a light-receiving region and a light-shielding region in a pixel region in a sensor substrate with a simpler structure. [Means for solving the problem]

[0006] In view of the above-described problems, a sensor substrate according to an embodiment of the present invention includes a substrate having a pixel region in which a plurality of pixels are arranged on a first principal surface of the sensor substrate, a scintillator arranged on the first principal surface or the second principal surface of the sensor substrate, and a light-shielding member arranged on the principal surface of the sensor substrate on which the scintillator is arranged, wherein the pixel region includes a first region in which pixels of the plurality of pixels are arranged that generate signals corresponding to each pixel of a radiographic image, and a second region in which pixels of the plurality of pixels are arranged that generate signals for correcting signals output from the first region, the scintillator is arranged so as to overlap the first region but not the second region in orthogonal projection onto the first principal surface, the light-shielding member covers the scintillator and is arranged so as to overlap the second region in orthogonal projection onto the first principal surface, and a portion of the light-shielding member that overlaps the second region is bonded to the principal surface of the sensor substrate on which the scintillator is arranged. [Effects of the Invention]

[0007] According to the present invention, it is possible to provide a technique that is advantageous for realizing a light receiving region and a light blocking region in a pixel region in a sensor substrate with a simpler structure. [Brief explanation of the drawings]

[0008] [Figure 1] FIG. 1 is a diagram showing an example of the configuration of a radiation imaging system using a radiation imaging apparatus including a sensor substrate according to an embodiment of the present invention. [Figure 2] 2A to 2C are diagrams showing an example of an imaging method in the radiation imaging system of FIG. 1; [Figure 3] FIG. 2 is a diagram showing an example of the configuration of the radiation imaging apparatus of FIG. 1. [Figure 4] FIG. 4 is a diagram showing an example of a circuit configuration of the sensor substrate of FIG. 3. [Figure 5] FIG. 4 is a diagram showing an example of the configuration of the sensor substrate of FIG. 3. [Figure 6] FIG. 4 is a diagram showing an example of the configuration of the sensor substrate of FIG. 3. [Figure 7] FIG. 4 is a diagram showing an example of the configuration of the sensor substrate of FIG. 3. [Figure 8] FIG. 4 is a diagram showing an example of the configuration of the sensor substrate of FIG. 3. [Figure 9] FIG. 4 is a diagram showing an example of the configuration of the sensor substrate of FIG. 3. [Figure 10] FIG. 4 is a diagram showing an example of the configuration of the sensor substrate of FIG. 3. [Figure 11] FIG. 4 is a diagram showing an example of the configuration of the sensor substrate of FIG. 3. [Figure 12] FIG. 4 is a diagram showing an example of the configuration of the sensor substrate of FIG. 3. [Figure 13] FIG. 4 is a diagram showing an example of the configuration of the sensor substrate of FIG. 3. DETAILED DESCRIPTION OF THE INVENTION

[0009] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the invention claimed. Although multiple features are described in the embodiments, not all of these multiple features are necessarily essential to the invention, and multiple features may be combined arbitrarily. Furthermore, in the accompanying drawings, the same reference numerals are used to designate the same or similar components, and redundant explanations will be omitted.

[0010] Furthermore, radiation in the present invention may include α-rays, β-rays, γ-rays, etc., which are beams produced by particles (including photons) emitted by radioactive decay, as well as beams having the same or greater energy, such as X-rays, particle beams, and cosmic rays.

[0011] A sensor substrate, a radiation imaging device including the sensor substrate, and a radiation imaging system using the radiation imaging device according to an embodiment of the present disclosure will be described with reference to Figures 1 to 13. Figure 1 is a diagram showing an example of the configuration of a radiation imaging system 100 using a radiation imaging device 102 including a sensor substrate 300 of this embodiment. The sensor substrate 300 will be described in detail with reference to Figure 3 onwards.

[0012] The radiation imaging system 100 of this embodiment may include a system control device 112, a radiation imaging device 102, a radiation source 113, a stage 114, a support device 103, a two-axis orthogonal robot arm 115, an arm control device 104, an image acquisition device 105, a stage control device 106, and a radiation source control device 107. The system control device 112 controls the entire radiation imaging system 100. The system control device 112 may include a calculation unit 108, a storage unit 109, an input unit 110, and an output unit 111. The calculation unit 108 may include a processor such as a CPU. The processor of the calculation unit 108 executes a program stored in the storage unit 109, such as a RAM or ROM, thereby performing the operation of the radiation imaging system 100. The calculation unit 108 may be formed of a dedicated circuit such as an ASIC (application-specific integrated circuit). The input unit 110 and the output unit 111 may be user interfaces. The input unit 110 may include a keyboard, a touch panel, or the like for the user to input imaging conditions for capturing a radiation image. The output unit 111 may include a display or the like for displaying a radiation image obtained by the radiation imaging device 102. The display may also serve as the above-mentioned touch panel.

[0013] The radiation source 113 is arranged to irradiate the radiation imaging device 102 (sensor board 300) with radiation. The radiation source control device 107 controls the irradiation of radiation from the radiation source 113 in accordance with a signal transferred from the system control device 112.

[0014] The subject 101 is placed on the stage 114. In this embodiment, the radiation imaging system 100 is configured to be able to change the relative positional relationship between the radiation source 113, the subject 101, and the radiation imaging device 102. The stage control device 106 controls the position of the stage 114 in accordance with a signal transferred from the system control device 112. Similarly, the arm control device 104 controls the position of the radiation imaging device 102 attached to the support device 103 by controlling the robot arm 115 in accordance with a signal transferred from the system control device 112.

[0015] The image acquisition device 105 transfers data such as imaging conditions to the radiation imaging device 102 in accordance with a signal transferred from the system control device 112. The image acquisition device 105 also acquires data of a captured radiation image from the radiation imaging device 102 and transfers the data to the system control device 112. The image acquisition device 105 may perform image processing or the like on the radiation image data.

[0016] 2 is a diagram illustrating an example of capturing a radiographic image while changing the relative positional relationship between the radiation source 113, the subject 101, and the radiation imaging device 102. In one aspect, the positional relationship between the radiation source 113, the subject 101, and the radiation imaging device 102 is defined as, for example, a radiation focal position 220 determined by the position of the radiation source 113, the subject 101, and a position 250 at which the radiation imaging device 102 is located. In this case, radiation emitted from the radiation source 113 is output from the radiation focal position 220, passes through the subject 101, and is detected by the radiation imaging device 102 located at position 250. In another aspect, when the radiation source 113 is located at a position defined as the radiation focal position 221, radiation emitted from the radiation source 113 passes through the subject 101 and is detected by the radiation imaging device 102 located at position 251. In this way, the radiation imaging system 100 can perform imaging while changing the positional relationship between the radiation source 113, the subject 101, and the radiation imaging device 102. With this configuration, the radiation imaging system 100 of this embodiment can obtain a reconstructed image of a tomographic image of the subject 101. However, this is not limiting, and imaging may be performed without changing the relative positional relationship between the radiation source 113, the subject 101, and the radiation imaging device 102.

[0017] FIG. 3 shows an example configuration of the radiation imaging device 102. The radiation imaging device 102 includes a sensor substrate 300, a readout circuit 301, a drive circuit 302, a power supply unit 303, a control circuit 304, and a memory 305. The power supply unit 303 supplies power to each component within the radiation imaging device 102. The control circuit 304 controls the operation of the sensor substrate 300 by controlling each component arranged in the radiation imaging device 102, such as the readout circuit 301 and the drive circuit 302. The control circuit 304 may include a processor such as a CPU. For example, the processor of the control circuit 304 may execute a program stored in a memory 305 configured using RAM, ROM, etc. in accordance with a signal transferred from the system control device 112, thereby operating the radiation imaging device 102. The control circuit 304 may be configured as a dedicated circuit such as an ASIC.

[0018] The sensor substrate 300 is driven by a drive circuit 302 in accordance with a signal from a control circuit 304. The incident radiation is converted into a charge signal by the sensor substrate 300, and is read out by a readout circuit 301 in accordance with a signal from the control circuit 304. The readout charge signal is subjected to processing such as correction by the control circuit 304, and may be temporarily stored in a memory 305 or transferred to the image acquisition device 105.

[0019] 4 is a diagram showing an example of the circuit configuration of the sensor substrate 300. The sensor substrate 300 may be fabricated on an insulating substrate such as a glass substrate using a manufacturing process similar to the manufacturing process for liquid crystal panels. Alternatively, for example, the sensor substrate 300 may be fabricated on a semiconductor substrate such as a silicon substrate using a manufacturing process similar to the manufacturing process for image sensors. The sensor substrate 300 may be fabricated on any substrate as long as it is possible to arrange a plurality of pixels 400 (pixel regions 500) for detecting radiation as described below.

[0020] The sensor substrate 300 has a pixel region 500 in which a plurality of pixels 400 are arranged in a matrix. The pixel region 500 includes a region 502 in which pixels of the plurality of pixels 400 that generate signals corresponding to each pixel of a radiographic image are arranged, and a region 503 in which pixels of the plurality of pixels 400 that generate signals for correcting signals output from the region 502 are arranged. The region 502 may also be referred to as an effective pixel region, etc. The region 503 may also be referred to as an optical black (OB) pixel region, etc. The pixel 400 includes a switching element 401 and a photoelectric conversion element 402. A thin film transistor (TFT) or the like is used for the switching element 401. A photodiode or the like is used for the photoelectric conversion element 402. The pixels 400 arranged in the region 502 and the pixels 400 arranged in the region 503 may have the same structure.

[0021] The sensor substrate 300 of this embodiment will be further described with reference to FIGS. 5(a) and 5(b). FIG. 5(a) is a top view of the sensor substrate 300, and FIG. 5(b) is a cross-sectional view taken along line A-A' in FIG. 5(a). The sensor substrate 300 includes a substrate 501 having a pixel region 500 in which a plurality of pixels 400 are arranged on one of two main surfaces, a main surface 551, and a scintillator 504 arranged on the main surface 551 or the main surface 552 of the two main surfaces. In this embodiment, the scintillator 504 is arranged on the main surface 551 of the two main surfaces. Furthermore, the sensor substrate 300 includes a light-shielding member 505 arranged on the main surface on which the scintillator 504 is arranged (in this embodiment, the main surface 551).

[0022] In orthogonal projection onto the main surface 551, the scintillator 504 is arranged so as to overlap with a region 502 in which pixels that generate signals corresponding to each pixel of a radiographic image are arranged, but not so as to overlap with a region 503 in which pixels that generate signals for correcting signals output from the region 502 are arranged. The light-shielding member 505 covers the scintillator 504 and is arranged so as to overlap with the region 503 in orthogonal projection onto the main surface 551. In this case, the portion of the light-shielding member 505 that overlaps with the region 503 is bonded to the main surface 551 on which the scintillator 504 is arranged.

[0023] In this embodiment, the scintillator 504 is disposed so as to cover the region 502 of the main surface 551. In addition, in this embodiment, the light-shielding member 505 is configured using an aluminum sheet for moisture-proof protection of the scintillator 504. That is, the region 503 is light-shielded by the aluminum sheet functioning as the light-shielding member 505, and the light-shielding member 505 serves both as a moisture-proof protective layer for the scintillator 504 and as a light-shielding layer for the region 503. In this case, for example, as shown in FIG. 5( b), the light-shielding member 505 may be bonded to the main surface 551 of the substrate 501 via a bonding member 510, such as an adhesive, provided on the aluminum sheet. The bonding member 510 is not limited to an adhesive, and, for example, an adhesive, a double-sided tape, or the like may be used as the bonding member 510.

[0024] The scintillator 504 converts radiation into light (e.g., visible light) that can be converted into an electrical signal by the photoelectric conversion element 402 of the pixel 400. The pixels 400 arranged in the region 502 detect the light converted by the scintillator 504 and convert it into an electrical signal. The scintillator 504 is arranged in the region 502, but not in the region 503. In other words, it can be said that the position of the region 502 in the pixel region 500 is determined by the arrangement of the scintillator 504. The region 503 is a region of the pixel region 500 that is covered by the light-shielding member 505 without the scintillator 504 interposed therebetween. For example, the scintillator 504 is formed on the main surface 551 of the substrate 501 using a hard mask or the like. Next, an aluminum sheet is attached as the light-shielding member 505 via a bonding member 510 so as to cover the entire pixel region 500. By these steps, the light-incident region 502 and the light-shielded region 503 in the pixel region 500 can be realized with a simpler structure without using a photolithography process.

[0025] Consider a case where the positions of the regions 502 and 503 need to be changed after the pixel region 500 has been designed (fabricated). In this case, for example, if the number of rows and columns of the pixels 400 included in the region 502 before the position change is the same as the number of rows and columns of the pixels 400 included in the region 502 after the position change, the positions of the regions 502 and 503 can be changed by changing the position at which the scintillator 504 is formed, without changing the design of the pixel region 500. Changing the position of the scintillator 504 can be achieved relatively easily, for example, by adjusting the position of a hard mask when forming the scintillator 504. Furthermore, even when the size of the region 502 (the number of pixels 400 to be arranged) is changed, a hard mask can be easily fabricated in terms of cost and time compared to a photomask used in a photolithography process. This allows the positions of the regions 502 and 503 within the pixel region 500 to be freely determined even after the design of the pixel region 500 has been completed. That is, compared to a case where a photolithography process or the like is used to form the light blocking member 505 and a photomask must be remade when the design is changed, the degree of freedom in designing the pixel region 500 of the sensor substrate 300 is greatly improved.

[0026] In the present embodiment, an example has been shown in which an aluminum sheet, which also functions as a moisture-proof protective layer for the scintillator 504, is used as the light-shielding member 505 covering the region 503. Therefore, in orthogonal projection onto the main surface 551, the portion of the light-shielding member 505 overlapping the region 503 and the portion overlapping the scintillator 504 are connected. However, this is not limited to this. The light-shielding member 505 may be provided in the region 503 separately from the moisture-proof protective layer for the scintillator 504. In this case, too, the light-shielding region 503 can be realized by, for example, attaching an aluminum sheet or the like to the main surface 551 of the substrate 501 so as to overlap the region 503 using a joining member 510 such as a pressure-sensitive adhesive, adhesive, or double-sided tape. Furthermore, the light-shielding member 505 is not limited to a material containing aluminum, such as an aluminum sheet. The light-shielding member 505 may be made of a metal sheet other than aluminum, or, for example, a black resin sheet or the like may be used as the light-shielding member 505. Furthermore, the light-shielding member 505 is not limited to being bonded to the main surface 551 of the substrate 501 via the bonding member 510. For example, the light-shielding member 505 using black resin or metal paste may be bonded to the main surface 551 of the substrate 501 by applying black resin or metal paste to cover the region 503.

[0027] Furthermore, when the substrate 501 is a transparent substrate using a glass substrate, a plastic substrate, or the like, the scintillator 504 may be disposed on the main surface 552 of the substrate 501, rather than on the main surface 551. In this case, the light-shielding member 505 may be disposed on the main surface 552. Furthermore, for example, the light-shielding member 505 may be disposed on each of the main surfaces 551 and 552. Furthermore, the scintillator 504 may be disposed on both the main surfaces 551 and 552 so as to cover each of the main surfaces 551 and 552. In this case, the light-shielding member 505 may also be disposed on each of the main surfaces 551 and 552.

[0028] Next, a modified example of the sensor substrate 300 shown in FIG. 5(b) will be described with reference to FIG. 6. The sensor substrate 300 shown in FIG. 6 has a shielding member 506 for shielding radiation arranged so as to overlap at least a portion of the region 503 in orthogonal projection onto the main surface 551 of the substrate 501. As shown in FIG. 6, the shielding member 506 may be arranged on the main surface 551 so as to cover the light-shielding member 505. In the radiation imaging system 100 shown in FIG. 1, the shielding member 506 is arranged between the radiation source 113 and the substrate 501. Therefore, depending on the configuration of the radiation imaging system 100, the shielding member 506 may be arranged on the main surface 552 of the substrate 501. Alternatively, for example, the shielding member 506 may be arranged on both the main surface 551 and the main surface 552 of the substrate 501. The shielding member 506 may be formed using a material having a larger specific gravity than the light-shielding member 505. As described above, the light-shielding member 505 may contain aluminum or the like. On the other hand, the shielding member 506 may contain, for example, at least one of lead and tungsten. By providing the shielding member 506, radiation is prevented from entering the region 503, thereby suppressing deterioration of the pixels 400 arranged in the region 503 due to the incidence of radiation and stabilizing output. Because the shielding member 506 has the effect of suppressing the incidence of radiation, the shielding member 506 may be arranged so as not to overlap the region 502 in which the pixels 400 that generate signals corresponding to each pixel of the radiographic image are arranged, when orthogonally projected onto the main surface 551 of the substrate 501.

[0029] In this embodiment, as shown in FIG. 6 , a lead member is disposed as the shielding member 506 so as to overlap the region 503. The shielding member 506 made of lead or the like is joined to the light-shielding member 505 using a joining member such as double-sided tape. The shielding member 506 may be larger than the region 503 as shown in FIG. 7 . This prevents radiation from obliquely entering the region 503 of the sensor substrate 300. Furthermore, as shown in FIG. 8 , the shielding member 506 may be disposed so as not to overlap the region 502 when viewed from the direction of radiation incidence. In other words, in the radiation imaging system 100, the shielding member 506 may be disposed so as not to overlap a virtual line connecting the radiation source 113 and the region 502. For example, as described above, the radiation imaging system 100 may be configured so that the relative positional relationship between the radiation source 113, the subject 101, and the radiation imaging device 102 is changeable. In this case, there is a possibility that the radiation may be obliquely incident on the main surface 551 of the substrate 501. For this reason, for example, as shown in Fig. 8, the side wall of the shielding member 506 on the side of the region 502 may be chamfered. This makes it possible to prevent the component of the radiation irradiated from the radiation source 113 that is incident on the region 502 from being blocked (kicked away) by the shielding member 506.

[0030] The pixels 400 arranged in the pixel region 500 are not limited to the pixels arranged in the region 502 that generate signals corresponding to each pixel of the radiographic image and the pixels arranged in the region 503 that generate signals for correcting the signals output from the region 502. The plurality of pixels 400 may include pixels that are not used in generating a radiographic image. For example, as shown in Figures 9 and 10, a region 507 in which pixels of the plurality of pixels 400 that are not used in generating a radiographic image are arranged may be further arranged between the regions 502 and 503 in the pixel region 500. The region 507 may be referred to as a dummy pixel region, and the pixels 400 arranged in the region 507 among the plurality of pixels 400 may be referred to as dummy pixels, etc.

[0031] 9 , in the orthogonal projection onto the main surface 551 of the substrate 501, the scintillator 504 is arranged so as not to overlap the region 507. By providing the region 507, stray light from the scintillator 504 to the region 503 can be reduced, and the signals output from the pixels 400 in the region 503 can be stabilized. The pixels 400 arranged in the regions 502 and 503 out of the multiple pixels 400 may have the same structure as the pixels 400 arranged in the region 507 out of the multiple pixels 400. Also, as shown in FIG. 9 , the scintillator 504 is arranged on the main surface 551 of the substrate 501, and the light-shielding member 505 is arranged so as to overlap the region 507 in addition to the scintillator 504 and the region 503 in the orthogonal projection onto the main surface 551. In this case, in orthogonal projection onto main surface 551 of substrate 501, a portion of light-shielding member 505 overlapping region 503, a portion of light-shielding member 505 overlapping region 507, and a portion of light-shielding member 505 overlapping scintillator 504 may be connected to each other. Light-shielding member 505 may be integrally formed from an aluminum sheet or the like, as shown in Fig. 9. In this case, the portion of light-shielding member 505 overlapping region 507 may be bonded to main surface 551 of substrate 501 on which scintillator 504 is disposed, via bonding member 510 such as an adhesive, similar to the portion of light-shielding member 505 overlapping region 503.

[0032] 11, the shielding member 506 described above with reference to FIGS. 6 to 8 may be arranged to cover the region 507. In other words, the shielding member 506 may be arranged to overlap at least a part of the region 503 and the region 507 in orthogonal projection onto the main surface 551 of the substrate 501. This makes it possible to further suppress the radiation from being obliquely incident on the region 503.

[0033] FIG. 12 shows a modified example of the sensor substrate 300 shown in FIG. 11 . As shown in FIG. 12 , the pixel region 500 may further include a region 508 between the region 502 and the region 507, in which pixels 400 that are not used in generating a radiographic image are arranged. In this case, the scintillator 504 is arranged to overlap the region 508 in an orthogonal projection onto the main surface 551 of the substrate 501. As shown in FIG. 12 , a portion 504a of the scintillator 504, which has an uneven film thickness and is formed by a vapor deposition process using a hard mask, may be arranged to overlap so-called dummy pixels 400 that are not used in generating a radiographic image. In other words, the scintillator 504 includes a portion 504a whose film thickness continuously changes in the portion overlapping the region 508. The film thickness of the portion 504a of the scintillator 504 whose film thickness continuously changes becomes thinner with increasing distance from the region 502. The area overlapping with the uneven thickness portion 504a of the scintillator 504 is not used for forming a radiographic image. This makes the film thickness of the scintillator 504 arranged to cover the area 502 uniform, thereby suppressing differences in signal value output due to differences in the amount of captured radiation.

[0034] 12 shows a sensor substrate 300 in which regions 507 and 508 are arranged, in which pixels 400 that are not used in generating a radiographic image are arranged. However, this is not limiting, and for example, region 507 may not be arranged. In other words, the region of the pixel region 500 in which pixels 400 that are not used in generating a radiographic image are arranged may be only region 508 covered by the scintillator 504. Furthermore, while FIG. 12 shows a configuration in which a shielding member 506 is arranged, the shielding member 506 does not have to be arranged. In this way, the above-described embodiments may be used in combination as appropriate.

[0035] 6 to 8, 11, and 12, the shielding member 506 is not limited to being joined to the substrate 501 via the light-shielding member 505 or the like. For example, as shown in Fig. 13, the shielding member 506 may be joined to the inner wall of the housing 509 of the radiation imaging device 102 via a joining member such as double-sided tape or adhesive. The light-shielding member 505 may be disposed at an appropriate position depending on the positional relationship between the radiation source 113 and the radiation imaging device 102 (sensor substrate 300) in the radiation imaging system 100.

[0036] The invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Accordingly, the following claims are appended to apprise the public of the scope of the invention. [Explanation of symbols]

[0037] 101: substrate, 300: sensor substrate, 500: pixel region, 502, 503, 507, 508: regions, 504: scintillator, 505: light-shielding member, 551, 552: main surfaces

Claims

1. A radiation detection sensor for acquiring a radiation image, comprising: a sensor substrate having a pixel region in which a plurality of pixels are arranged in a matrix; a scintillator that converts radiation into light, the scintillator covering a first region of the pixel region and not covering a second region of the pixel region; a light shielding member that shields light and covers the second region of the pixel region; A radiation detection sensor comprising:

2. A radiation detection sensor as described in claim 1, characterized in that the light-shielding member is bonded to the first main surface of the sensor substrate.

3. The radiation detection sensor described in Claim 2, characterized in that the light-shielding member has a first part joined to the first main surface and a second part covering the scintillator, and the first part and the second part are connected integrally.

4. the pixel region further includes a third region between the first region and the second region in which pixels of the plurality of pixels that are not used for generating the radiographic image are disposed, 4. The radiation detection sensor according to claim 2, wherein the scintillator is disposed so as not to overlap the third region in an orthogonal projection onto the first principal surface.

5. the pixel region further includes a third region between the first region and the second region in which pixels of the plurality of pixels that are not used for generating the radiographic image are disposed, In an orthogonal projection onto the first principal surface, the scintillator is disposed so as not to overlap the third region. In an orthogonal projection onto the first main surface, the light blocking member is disposed so as to overlap the third region, 4. The radiation detection sensor according to claim 3, wherein in an orthogonal projection onto the first principal surface, a portion of the light-shielding member that overlaps the second region, a portion of the light-shielding member that overlaps the third region, and a portion of the light-shielding member that overlaps the scintillator are connected to each other.

6. The radiation detection sensor according to claim 5 , wherein a portion of the light blocking member that overlaps the third region is bonded to the first main surface.

7. the pixel region further includes a fourth region between the first region and the third region in which pixels of the plurality of pixels that are not used for generating the radiographic image are disposed, 7. The radiation detection sensor according to claim 4, wherein the scintillator is disposed so as to overlap the fourth region in an orthogonal projection onto the first principal surface.

8. The radiation detection sensor according to claim 7 , wherein the scintillator includes a portion where the film thickness changes continuously in a portion overlapping the fourth region.

9. 9. The radiation detection sensor according to claim 8, wherein the portion of the scintillator whose thickness changes continuously has a thickness that decreases with increasing distance from the first region.

10. Further comprising a shielding member for shielding radiation, The radiation detection sensor according to claim 2 , wherein the shielding member is disposed so as to overlap at least a portion of the second region in an orthogonal projection onto the first main surface.

11. Further comprising a shielding member for shielding radiation, 10. The radiation detection sensor according to claim 4, wherein the shielding member is arranged so as to overlap at least a portion of the second region and the third region in an orthogonal projection onto the first principal surface.

12. The radiation detection sensor according to claim 10 , wherein the shielding member is disposed so as not to overlap the first region in an orthogonal projection onto the first main surface.

13. 13. The radiation detection sensor according to claim 10, wherein the shielding member contains a material having a specific gravity greater than that of the light-shielding member.

14. the light blocking member includes aluminum, The radiation detection sensor according to claim 13 , wherein the shielding member contains at least one of lead and tungsten.

15. A radiation detection sensor according to any one of claims 1 to 14; A control circuit for controlling an operation of the radiation detection sensor; A radiation imaging apparatus comprising:

16. The radiation imaging apparatus according to claim 15 , a radiation source for irradiating the radiation imaging device with radiation; A radiation imaging system comprising:

17. A radiation detection sensor according to any one of claims 10 to 14; A control circuit for controlling an operation of the radiation detection sensor; a radiation source that irradiates the radiation detection sensor with radiation, 2. A radiation imaging system, comprising: a shielding member disposed so as not to overlap a virtual line connecting the radiation source and the first region;

18. A method for manufacturing a radiation detection sensor for acquiring a radiation image, comprising: A sensor substrate having a pixel region in which a plurality of pixels are arranged in a matrix, forming a scintillator for converting radiation into light, the scintillator covering a first region of the pixel area and not covering a second region of the pixel area; a step of disposing a light blocking member that blocks light and covers the second region of the pixel region; The manufacturing method according to claim 1,

19. The method of claim 18, wherein the scintillator is formed using a hard mask.

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