Liquid discharge head and liquid discharge device

Abstract

To provide a technique that can suppress the occurrence of shift of an arrangement position of a discharging substrate even if a passage member is thermally expanded.SOLUTION: A module provided with a substrate for discharging liquid and a passage that is fluid-coupled to the substrate is inserted and fitted into a frame body supporting a supporting member supporting the substrate so that the frame body and the passage oppose to each other through a space in a direction crossing an inserting direction. When inserted and fitted into the frame body, the module is contacted with the frame body in the inserting direction and is supported thereon.SELECTED DRAWING: Figure 10

Description

Technical Field

[0001] The present invention relates to, for example, a liquid ejection head that can be widely applied as a recording head capable of ejecting ink by an inkjet method, and a liquid ejection device including the liquid ejection head.

Background Art

[0002] Patent Document 1 discloses a technique for constructing a recording head that ejects ink by an inkjet method by joining a discharge module including a discharge substrate having a discharge port for discharging ink and a pressure generation chamber communicating with the discharge port, and a flow path member for supplying ink to the discharge substrate.

Prior Art Documents

Patent Documents

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the recording head according to the technique disclosed in Patent Document 1, in order to form a high-definition image, it is necessary to arrange the discharge substrate with high precision. However, in such a recording head, the discharge module and the flow path member are integrally formed using an adhesive. Therefore, for example, when ink is adjusted to a high temperature and ejected, the flow path member becomes hot due to the temperature of the ink and thermally expands, and there is a risk that the position of the discharge substrate arranged with high precision may shift.

[0005] The present invention has been made in view of the above problems, and an object thereof is to provide a technique capable of suppressing the occurrence of displacement of the arrangement position of the discharge substrate even when the flow path member for supplying ink to the discharge substrate thermally expands.

Means for Solving the Problems

[0006] To achieve the above objective, one embodiment of the liquid discharge head according to the present invention comprises a module having a substrate capable of discharging liquid by driving a discharge energy generating element and a flow channel fluidly connected to the substrate, a support member for supporting the substrate, and a frame for supporting the module and the support member, wherein the frame supports the inserted module and supports the support member on the insertion surface of the module, and when the module is inserted into the frame, the frame and the flow channel face each other across a space in a direction intersecting the insertion direction of the module, and are supported in contact with each other in the insertion direction. [Effects of the Invention]

[0007] According to the present invention, even if the flow channel member that supplies ink to the ejection substrate undergoes thermal expansion, it becomes possible to suppress the occurrence of displacement of the ejection substrate's position. [Brief explanation of the drawing]

[0008] [Figure 1] Schematic diagram of the recording device [Figure 2] Oblique view of the recording head [Figure 3] Perspective view of the substrate and flow path section. [Figure 4] Disassembly diagram of the recording head [Figure 5] Perspective view of the discharge module [Figure 6] Disassembly diagram of the discharge module [Figure 7] Sectional view of line VII-VII in Figure 5(a) [Figure 8] Enlarged view of the area within frame VIII in Figure 7 [Figure 9] View from arrow IX in Figure 2(a) [Figure 10] Cross-sectional view of line XX in Figure 9 [Figure 11] Figure 10: Cross-sectional view along line XI-XI [Figure 12] Perspective view of the recording head in different embodiments [Figure 13] Figure 12 shows a perspective view of the circuit board and flow path section of the recording head. [Figure 14] Exploded view of the recording head of FIG. 12 [Figure 15] View XV of FIG. 12(a) as seen from the arrow direction [Figure 16] Cross-sectional view taken along line XVI-XVI of FIG. 15 [Figure 17] Cross-sectional view taken along line XVII-XVII of FIG. 15

Embodiments for Carrying Out the Invention

[0009] Hereinafter, an example of an embodiment of a liquid ejection head and a liquid ejection device will be described in detail with reference to the accompanying drawings. Note that the following embodiments do not limit the present invention, and not all combinations of the features described in this embodiment are essential for the solution means of the present invention. Also, the positions, shapes, etc. of the components described in the embodiments are merely examples, and are not intended to limit the scope of this invention only thereto.

[0010] (First Embodiment) First, the liquid ejection head according to the first embodiment will be described with reference to FIGS. 1 to 11. In this embodiment, as the liquid ejection head, an inkjet recording head (hereinafter simply referred to as "recording head") capable of recording on an object by ejecting ink by driving a piezo element will be described as an example. Note that the ejection energy generating element is not limited to a piezo element, and an electrothermal conversion element (heater element) may be used. In this case, the ink will be ejected by the bubbles generated by the heater element. Also, the liquid ejection method is not limited to the above-described method, and various known methods can be used.

[0011] <Recording Device> FIG. 1 is a schematic configuration diagram of a recording apparatus including a recording head which is a liquid ejection head according to the present embodiment. The recording apparatus 10 shown in FIG. 1 is a recording apparatus that performs recording on a recording medium P by ejecting ink by an inkjet method from the recording head. Note that the liquid ejected from the recording head is not limited to ink, and may be a processing liquid that performs predetermined processing on the ink ejected onto the recording medium P.

[0012] The recording apparatus 10 includes a conveyance unit 12 that conveys the recording medium P in the +Y direction, and a recording unit 14 that ejects and records ink on the recording medium P conveyed by the conveyance unit 12. The conveyance unit 12 includes a belt 20 stretched endlessly around two rollers 16 and 18. The roller 16 is a drive roller driven by the drive of a drive motor, and the roller 18 is a driven roller that rotates by the transmission of the driving force of the roller 16 via the belt 20.

[0013] The recording unit 14 includes a recording head 22 provided such that the surface for ejecting ink faces the recording medium P conveyed by the conveyance unit 12. In the present embodiment, the recording unit 14 includes recording heads 22 that eject inks of different colors from each other. Specifically, it includes a recording head 22C that ejects cyan (C) ink, a recording head 22M that ejects magenta (M) ink, a recording head 22Y that ejects yellow (Y) ink, and a recording head 22K that ejects black (K) ink. In the recording apparatus 10, the recording heads 22 are arranged in the order of the recording head 22C, the recording head 22M, the recording head 22Y, and the recording head 22K along the +Y direction.

[0014] Each recording head 22 has multiple ejection ports for ejecting ink arranged in the X direction, which intersects (orthogonal in this embodiment) with the Y direction. The length in the X direction of the row of ejection ports formed by the arrangement of multiple ejection ports in the recording head 22 corresponds to the length in the width direction (X direction) of the maximum recording medium P that can be recorded by the recording device 10. Each recording head 22 is connected to an ink tank (not shown) that stores the corresponding ink, and the ink circulates between the ink tank and the recording head 22. Since various known techniques can be used for the configuration of circulating ink between the ink tank and the recording head 22, a detailed explanation thereof is omitted.

[0015] In this embodiment, the ink is circulated between the ink tank and the recording head 22, but the invention is not limited to this configuration. For example, instead of circulating the ink, two tanks may be provided on either side of the recording head, and ink may be circulated from one tank to the other to keep the ink flowing within the recording head 22. In the recording device 10, when the recording start position on the recording medium P is located below the recording head 22C, the control unit (not shown) that controls the recording device 10 ejects ink C. After that, the recording medium P is transported, and ink is ejected from the recording heads 22M, 22Y, and 22K in the same manner to perform recording on the recording medium P. In other words, in this embodiment, the recording device 10 performs recording on the recording medium in a single transport of the recording medium in the +Y direction. The configuration of the recording device 10 is not limited to the full-line type configuration described above, but may also be a serial scan type configuration or a flatbed type configuration.

[0016] <Recording head configuration> Next, the configuration of the recording head mounted on the recording device 10 will be described. Figure 2 is a perspective view of the recording head, where (a) is a view from the downstream side in the +Z direction and (b) is a view from the upstream side in the +Z direction. Figure 3 is a perspective view of the substrate and flow path sections housed inside the recording head of Figure 2, where (a) is the substrate section and (b) is the flow path section. Figure 4 is an exploded view of the recording head.

[0017] The recording head 22 includes a substrate section 202 containing a recording element substrate 200 capable of ejecting ink, and a flow path section 204 having a flow path formed for supplying and recovering ink to and from the recording element substrate 200 (see Figures 3(a) and 3(b)). In this embodiment, the case in which the recording head 22 has one recording element substrate 200 will be described. The recording head 22 is housed in a cover member 206 with the substrate section 202 and the flow path section 204 connected and supported by a support member 205 (hereinafter also referred to as the "frame"). At this time, a flow path connection section 324 (described later) for connecting to an external flow path protrudes from the upper side of the recording head 22 (see Figure 2(a)). Also, on the lower surface of the recording head 22, the recording element substrate 200 is exposed and supported by a recording element substrate support member 406 (described later) (see Figure 2(b)).

[0018] The substrate section 202 comprises a recording element substrate 200, a drive circuit board 304, a flexible wiring board 306, and an electrical wiring board 308. The recording element substrate 200 is electrically connected to a control unit (not shown) that controls the entire recording device via the drive circuit board 304, the flexible wiring board 306, and the electrical wiring board 308. The recording element substrate 200 corresponds to the ejection substrate described in the background art section. In other words, the recording element substrate 200 comprises an ejection port and a pressure generation chamber communicating with the ejection port. In the pressure generation chamber, pressure is generated by driving the recording element (ejection energy generation element), and ink is ejected from the ejection port by this pressure. Various known elements such as electrothermal conversion elements and piezoelectric elements can be used as recording elements.

[0019] The electrical wiring board 308 is equipped with electrical connection terminals 310. The electrical wiring board 308 is also connected to the flexible wiring board 306 via electrical connection parts 311 provided on the flexible wiring board 306. Two sides of the cover member 206 parallel to the XZ plane have openings 206a at their top. When the substrate portion 202 and the flow channel portion 204 are housed inside the cover member 206, the electrical connection terminals 310 are exposed to the outside through the openings 206a (see Figures 2(a) and 2(b)). Wiring connected to the control unit of the recording device 10 is connected to the electrical connection terminals 310. As a result, the ejection drive signal output from the control unit and the power required for ejection are input from the electrical connection terminals 310 and supplied to the recording element board 200 via the electrical wiring board 308, the flexible wiring board 306, and the drive circuit board 304.

[0020] By consolidating the wiring using the electrical circuits on the electrical wiring board 308, the number of terminals on the electrical connection terminals 310 can be reduced compared to the number of terminals on the recording element board 200. This reduces the number of electrical connections that need to be removed when replacing the recording head 22 in the recording device 10. In addition, a portion of the recording element board 200 and the flexible wiring board 306 is supported by the recording element board support member 406. The recording element board support member 406 is supported by the support member 205 when the board portion 202 and the flow path portion 204 are housed inside the cover member 206, and forms the lower surface of the recording head 22. The recording element board support member 406 supports the recording element board 200 so that it is exposed from the bottom surface of the recording head 22.

[0021] The flow channel section 204 comprises a first flow channel member 312, a second flow channel member 314, and a third flow channel member 316. The first flow channel member 312 is connected to the second flow channel member 314 in such a way that fluid can flow through the flow channel formed inside it; in other words, it is fluidly connected. The second flow channel member 314 is fluidly connected to the third flow channel member 316. When the substrate section 202 and the flow channel section 204 are connected, the first flow channel member 312 is fluidly connected to the recording element substrate 200.

[0022] Furthermore, the flow path section 204 includes a fourth flow path member 318, a fifth flow path member 320, and a liquid supply unit 322. The third flow path member 316 and the fourth flow path member 318 are connected via a flow path, and the fourth flow path member 318 and the fifth flow path member 320 are fluidly connected. The fifth flow path member 320 is connected to the liquid supply unit 322 via a connection part 321 (see Figure 4).

[0023] The liquid supply unit 322 is provided with a flow path connection section 324 on its upper surface. Inside the liquid supply unit 322, a filter (not shown) for removing foreign matter from the flowing ink is provided, communicating with each opening of the flow path connection section 324. The flow path connection section 324 is connected to the ink supply system of the recording device 10. Specifically, the ink supply system is connected to one of the two flow path connection sections 324 on the liquid supply unit 322 so that ink is supplied into the liquid supply unit 322, and to the other so that ink is recovered from the liquid supply unit 322.

[0024] As described above, the flow path of the flow path section 204 is fluidly connected to the flow path of the recording element substrate 200. Therefore, in this embodiment, the ink circulates in the ink flow path system, which includes the flow path of the recording device 10 and the flow path of the recording head 22. The liquid supplied to the liquid supply unit 322 is supplied to the recording element substrate 200 through the fifth flow path member 320, the fourth flow path member 318, the third flow path member 316, the second flow path member 314, and the first flow path member 312. The ink supplied to the recording element substrate 200 but not ejected is then recovered from the recording element substrate 200 and returned to the liquid supply unit 322 through the first flow path member 312, the second flow path member 314, the third flow path member 316, the fourth flow path member 318, and the fifth flow path member 320.

[0025] In the recording head 22, an electrical wiring board support portion 402 is provided so as to surround the outer circumference of the liquid supply unit 322. When connecting the substrate portion 202 and the flow channel portion 204, the electrical wiring board 308 is supported by the electrical wiring board support portion 402. In this embodiment, a discharge module 404 is formed by a part of the substrate portion 202 and a part of the flow channel portion 204 (see Figure 4). The configuration of the substrate portion 202 constituting the discharge module 404 includes a flexible wiring board 306, a drive circuit board 304, and a recording element board 200. The configuration of the flow channel portion 204 constituting the discharge module 404 includes a first flow channel member 312, a second flow channel member 314, and a third flow channel member 316.

[0026] <Discharge Module Configuration> Next, the configuration of the discharge module 404 will be described in detail. Figure 5 is a perspective view of the discharge module, where (a) is a view from the downstream side in the +Z direction and (b) is a view from the upstream side in the +Z direction. Figure 6 is an exploded view of the discharge module. Figure 7 is a cross-sectional view taken along line VII-VII in Figure 5(a). Figure 8 is an enlarged view of the area within frame VIII in Figure 7.

[0027] The ejection module 404 is supported by a recording element substrate 200 and a flexible wiring board 306, which are bonded to a recording element substrate support member 406 (see Figure 6). The flexible wiring board 306 is provided with electrodes for grounding the drive circuit board 304, and the drive circuit board 304 is fixed with conductive adhesive. In the recording element substrate support member 406, the recording element substrate 200 and the drive circuit board 304 are electrically connected by bonding wires 802, and the drive circuit board 304 and the flexible wiring board 306 are electrically connected by bonding wires 804 (see Figure 8).

[0028] To suppress the temperature rise caused by heat generated during operation of the drive circuit board 304, the drive circuit board 304 is connected to the first flow channel member 312 via a heat dissipation member 602 (see Figure 6). In the discharge module 404, a refrigerant flow channel 806 is formed directly above the drive circuit board 304 by the first flow channel member 312 and the second flow channel member 314. Refrigerant flows through this refrigerant flow channel 806. Therefore, the heat generated in the drive circuit board 304 is dissipated to the first flow channel member 312 via the heat dissipation member 602. The heat released to the first flow channel member 312 is then absorbed by the refrigerant in the refrigerant flow channel 806. For this reason, it is preferable that the first flow channel member 312 be made of a material with high thermal conductivity, such as alumina.

[0029] In the ejection module 404, a liquid flow channel section 702 is formed by a first flow channel member 312, a second flow channel member 314, and a third flow channel member 316 (see Figure 7). The liquid flow channel section 702 includes a liquid flow channel section 702a for storing ink to be supplied to the recording element substrate 200, and a liquid flow channel section 702b for storing ink recovered from the recording element substrate 200. Ink is supplied to the liquid flow channel section 702a from the liquid supply unit 322 via a fourth flow channel member 318 and a fifth flow channel member 320. The ink stored in the liquid flow channel section 702b is recovered by the liquid supply unit 322 via the fourth flow channel member 318 and the fifth flow channel member 320.

[0030] In the ejection module 404, the first channel member 312, the second channel member 314, and the third channel member 316, which constitute the ink flow path, have lengths approximately the same in the Y direction. Also, the second channel member 314 and the third channel member 316 have lengths approximately the same in the X direction. The first channel member 312 is formed to be longer in the X direction than the second channel member 314 and the third channel member 316 (see Figure 10). The second channel member 314 is bonded to the first channel member 312 at approximately the center position in the X direction. Therefore, when the first channel member 312 and the second channel member 314 are bonded, predetermined regions are formed at both ends of the first channel member 312 in the X direction (a predetermined direction) where the second channel member 314 is not bonded. In the first channel member 312, a protrusion 502 is formed projecting in the Z direction in this predetermined region formed at both ends in the X direction. Furthermore, the protrusion 502 extends in the Y direction at a position where it does not come into contact with the second flow channel member 314 when the second flow channel member 314 is bonded to the first flow channel member 312. In addition, the protrusion 502 is formed in predetermined regions formed at both ends of the first flow channel member 312 in the X direction, for example, without coming into contact with the second flow channel member 314 bonded to the first flow channel member 312.

[0031] <Discharge module connection status> Next, the connection of the ejection module 404 in the recording head 22 will be described. In the recording head 22, the substrate portion 202 and the flow path portion 204 are connected and housed in a cover member 206, and at this time, the ejection module 404 is supported by a support member 205. The cover member 206 is bonded to the support member 205, for example, with an adhesive. Figure 9 is a view taken along arrow IX in Figure 2(a). Figure 10 is a cross-sectional view taken along line XX in Figure 9. Figure 11 is a cross-sectional view taken along line XI-XI in Figure 9.

[0032] In the discharge module 404, the flexible wiring board 306 is bent and supported by the support member 205 on the side parallel to the XZ plane of the first flow channel member 312, the second flow channel member 314, and the third flow channel member 316 (see Figures 4 and 5(a)).

[0033] The support member 205 that supports the discharge module 404 has an opening 205a that penetrates in the Z direction (see Figure 4). The opening 205a consists of an upper opening 205a-1 located downstream in the +Z direction and a lower opening 205a-2 located upstream in the +Z direction (see Figures 10 and 11). The upper opening 205a-1 and the lower opening 205a-2 are substantially rectangular in shape. The opening area of ​​the lower opening 205a-2 is designed to be larger than the opening area of ​​the upper opening 205a-1. More specifically, the opening area of ​​the upper opening 205a-1 is designed to be larger than the second flow channel member 314 and smaller than the first flow channel member 312. Also, the lower opening 205a-2 is designed to be larger than the first flow channel member 312 and smaller than the recording element substrate support member 406.

[0034] Therefore, at the opening 205a, the inner wall is bent at the boundary between the upper opening 205a-1 and the lower opening 205a-2, forming a wall surface 1102 extending in the X direction (see Figure 11) and a wall surface 1002 extending in the Y direction and substantially parallel to the XY plane (see Figure 10). In other words, the wall surface 1102 is formed at both ends of the opening 205a in the Y direction, and the wall surface 1002 is formed at both ends of the opening 205a in the X direction. The wall surface 1002 has a predetermined length in the X direction and is sized to adhere to the protrusions 502 formed at both ends of the first flow path member 312 in the X direction when the discharge module 404 is supported by the support member 205.

[0035] The discharge module 404 is inserted into the opening 205a of the support member 205 formed in this manner from the upstream side in the +Z direction. When the discharge module 404 is inserted into the opening 205a, the second flow channel member 314 and the third flow channel member 316 pass through the lower opening 205a-2 and are inserted into the upper opening 205a-1. On the other hand, the first flow channel member 312 is inserted into the lower opening 205a-2, but the protrusion 502 and the wall surface 1002 come into contact, preventing it from being inserted into the upper opening 205a-1.

[0036] Then, the discharge module 404 and the support member 205 are aligned so that the second flow path member 314 does not come into contact with the inner wall of the upper opening 205a-1, and the first flow path member 312 does not come into contact with the inner wall of the lower opening 205a-2. At this time, the first flow path member 312 and the second flow path member 314 and the support member 205 are positioned opposite each other with a space in between. Specifically, a space is formed between the second flow path member 314 and the upper opening 205a-1, so that the second flow path member 314 and the upper opening 205a-1 are opposite each other. Also, a space is formed between the first flow path member 312 and the lower opening 205a-2, so that the first flow path member 312 and the lower opening 205a-2 are opposite each other. Note that the openings 205a, the first flow path member 312, and the second flow path member 314 are designed so that these spaces are large enough to accommodate the thermal expansion of the first flow path member 312 and the second flow path member 314. In other words, even if thermal expansion occurs in the first flow channel member 312 and the second flow channel member 314, these flow channel members are designed so that they do not come into contact with the lower opening 205a-2 and the upper opening 205a-1, or even if they do come into contact, they do not deform the support member 205.

[0037] Furthermore, when the discharge module 404 and the support member 205 are aligned, only the protrusion 502 and the wall surface 1002 are in contact. By bonding these members together with adhesive, the discharge module 404 is fixed and supported by the support member 205. Thus, in this embodiment, in the insertion direction of the discharge module 404, the discharge module 404 is supported by the support member 205 with the protrusion 502 of the first flow channel member 312 and the wall surface 1002 of the support member 205 in contact. In this embodiment, the protrusion 502 functions as a contact portion that abuts against the support member 205. Also, the wall surface 1002 is the portion of the support member 205 that abuts against the protrusion 502 of the first flow channel member 312.

[0038] Furthermore, when the ejection module 404 and the support member 205 are aligned, the recording element substrate support member 406 is supported on the insertion surface of the support member 205 for the ejection module 404, that is, on the bottom surface 205b. In other words, in this embodiment, the ejection module 404 is supported by the support member 205 by inserting it into the support member 205. At this time, the +Z direction is the insertion direction in which the ejection module 404 is inserted into the support member 205.

[0039] Thus, the discharge module 404, supported by the support member 205, is fluidly connected to the fourth flow channel member 318 via a sealing member 1004 and the like. Furthermore, the fifth flow channel member 320, the liquid supply unit 322 and the like are fluidly connected to the fourth flow channel member 318, and the recording head 22 is assembled by attaching the electrical wiring board support part 402 and the like.

[0040] As described above, in this embodiment, the discharge module 404 is supported by being inserted into the support member 205. At this time, the first flow channel member 312 and the second flow channel member 314 are positioned opposite the support member 205 with a space between them in a direction intersecting the insertion direction of the discharge module 404. This space is made large enough to accommodate the thermal expansion of the first flow channel member 312 and the second flow channel member 314. The first flow channel member 312 is supported by contacting the wall surface 1002 of the support member 205 in the insertion direction.

[0041] As a result, even if the first flow channel member 312 and the second flow channel member 314 expand due to thermal expansion caused by the temperature of the ink used, the heat generated when the drive circuit board 304 is operating, or the heat generated when a large current flows through the flexible wiring board 306, the support member 205 will be less likely to deform. Specifically, spaces capable of accommodating the thermal expansion of the flow channel members are formed between the first flow channel member 312 and the lower opening 205a-2, and between the second flow channel member 314 and the upper opening 205a-1. Therefore, even if thermal expansion occurs in the first and second flow channel members, the flow channel members will be less likely to press against the opening 205a, and the support member 205 will be less likely to deform.

[0042] Furthermore, by suppressing the deformation of the support member 205, the deformation of the recording element substrate support member 406, which is supported on the bottom surface 205b of the support member 205, is suppressed. As a result, displacement of the position of the recording element substrate 200 supported by the recording element substrate support member 406 is suppressed.

[0043] (Second Embodiment) Next, the liquid discharge head according to the second embodiment will be described with reference to Figures 12 to 17. In the following description, the same or equivalent components as those in the liquid discharge head according to the first embodiment will be used, and detailed explanations will be omitted.

[0044] In the second embodiment, the recording head 22 is configured to have four recording element substrates 200 capable of ejecting ink arranged in a staggered pattern, which is different from the first embodiment.

[0045] <Recording head configuration> The recording head used as a liquid discharge head in this embodiment will now be described. Figure 12 is a perspective view of the recording head in this embodiment, where (a) is a view from the downstream side in the +Z direction and (b) is a view from the upstream side in the +Z direction. Figure 13 is a perspective view of the recording section and flow path section housed inside the recording head of Figure 12, where (a) is the substrate section and (b) is the flow path section. Figure 14 is an exploded view of the recording head.

[0046] The recording head 22 includes a substrate section 1202 containing a recording element substrate 200 capable of ejecting ink, and a flow path section 1204 having a flow path formed therein for supplying and recovering ink to and from the recording element substrate 200 (see Figures 13(a) and 13(b)). In this embodiment, the recording head 22 has four recording element substrates 200, which are arranged in a staggered pattern. The recording head 22 is housed in a cover member 1206 with the substrate section 1202 and the flow path section 1204 connected and supported by a support member 1205. At this time, a flow path connection section 324 for connecting to an external flow path is exposed on the upper side of the recording head 22 (see Figure 12(a)). Also, on the lower surface of the recording head 22, the recording element substrate 200 is exposed and supported by a recording element substrate support member 406 (see Figure 12(b)).

[0047] The substrate section 1202 comprises four substrate groups 1300, each including a recording element substrate 200, a drive circuit substrate 304, and a flexible wiring substrate 306. Each of these four substrate groups 1300 is connected to an electrical wiring substrate 1308. The recording element substrate 200 is electrically connected to a control unit that controls the entire recording device 10 via the drive circuit substrate 304, the flexible wiring substrate 306, and the electrical wiring substrate 1308.

[0048] One electrical wiring board 1308 is provided for each of the two board groups 1300. Therefore, the board section 1202 is equipped with two electrical wiring boards 1308. The electrical wiring boards 1308 are connected to the board groups 1300 via the electrical connection parts 311 of the flexible wiring boards 306 in the two board groups 1300 which are arranged adjacent to each other in the X direction. Each electrical wiring board 1308 is equipped with an electrical connection terminal 1310 corresponding to each of the board groups 1300 to which it is connected. Therefore, the electrical wiring board 1308 is equipped with two electrical connection terminals 1310. Specifically, in the electrical wiring board 1308, an electrical connection terminal 1310a corresponding to one of the board groups 1300 is provided in the Y direction, and an electrical connection terminal 1310b corresponding to the other board group 1300 is provided in the +Z direction.

[0049] Two sides of the cover member 1206 parallel to the XZ plane have openings 1206a at their upper ends. Additionally, two openings 1206b are provided on the upper surface of the cover member 1206. When the substrate portion 1202 and the flow channel portion 1204 are housed within the cover member 1206, the electrical connection terminal 1310a is exposed to the outside through opening 1206a, and the electrical connection terminal 1310b is ejected to the outside through opening 1206b (see Figures 12(a) and 12(b)). Wiring connected to the control unit of the recording device 10 is connected to the electrical connection terminal 1310. As a result, the ejection drive signal and the power required for ejection output from the control unit are input through the electrical connection terminal 1310 and supplied to the recording element substrate 200 of each substrate group 1300.

[0050] By consolidating the wiring using the electrical circuits on the electrical wiring board 1308, the number of terminals on the electrical connection terminals 1310 can be reduced compared to the number of terminals on the recording element board 200. This reduces the number of electrical connections that need to be removed when replacing the recording head 22 in the recording device 10. In addition, in the board group 1300, the recording element board 200 and a portion of the flexible wiring board 306 are supported by the recording element board support member 406. The recording element board support member 406 is supported by the support member 1205 when the board portion 1202 and the flow path portion 1204 are housed inside the cover member 1206, and is located on the underside of the recording head 22. The recording element board support member 406 supports the recording element board 200 so that it is exposed from the bottom surface of the recording head 22.

[0051] The flow channel section 1204 comprises four flow channel groups 1350, each consisting of a first flow channel member 312, a second flow channel member 314, and a third flow channel member 316, which are fluidly connected. Each flow channel group 1350 is connected to a substrate group 1300, and the recording element substrate 200 and the first flow channel member 312 are fluidly connected. The flow channel section 1204 also comprises two sets of fourth flow channel members 1318 and fifth flow channel members 1320. The fourth flow channel member 1318 and the fifth flow channel member 1320 are fluidly connected to each other and are connected to two adjacent flow channel groups 1350 in the X direction. Therefore, the fourth flow channel member 1318 and the fifth flow channel member 1320 form a flow channel for supplying ink to the two flow channel groups 1350 and a flow channel for recovering ink from the flow channel groups 1350. The fourth flow channel member 1318 is connected to the third flow channel member 316 in the corresponding flow channel group 1350 via a sealing member 1452 (see Figure 14).

[0052] The flow path section 1204 is located adjacent to the fourth flow path member 1318, and the sixth flow path member 1352 and the seventh flow path member 1354 are fluidly connected to the second fifth flow path member 1320, which is fluidly connected to the fourth flow path member 1318. Specifically, the sixth flow path member 1352 is fluidly connected to the second fifth flow path member 1320 via a sealing member 1454, and the seventh flow path member 1354 is fluidly connected to the sixth flow path member 1352.

[0053] The flow path section 1204 includes a liquid supply unit 1322. The liquid supply unit 1322 is fluidly connected to the seventh flow path member 1354. The liquid supply unit 1322 has two flow path connection sections 324 on its upper surface. Inside the liquid supply unit 1322, a filter (not shown) for removing foreign matter from the flowing ink is provided so as to communicate with each opening of the flow path connection section 324. The flow path connection section 324 is connected to the ink supply system of the recording device 10. Specifically, the flow path connection section 324 provided on the liquid supply unit 1322 includes a flow path connection section 324a for supplying ink into the liquid supply unit 1322 and a flow path connection section 324b for recovering ink from the liquid supply unit 1322. One of the two flow path connection sections 324 provided on the liquid supply unit 1322 supplies and recovers ink with two flow path groups 1350 located upstream in the +Y direction. Furthermore, the other of the two flow path connection sections 324 supplies and recovers ink with two flow path groups 1350 located downstream in the +Y direction.

[0054] As described above, the flow path of the flow path section 1204 is fluidly connected to the flow paths of the four recording element substrates 200. Therefore, in this embodiment, the ink circulates in the ink flow path system, which includes the flow paths of the recording device 10 and the flow paths of the recording head 22. The ink supplied to the liquid supply unit 1322 flows through the seventh flow path member 1354, the sixth flow path member 1352, the fifth flow path member 1320, and the fourth flow path member 1318 to the flow path group 1350, and is supplied to the recording element substrates 200 via the flow path group 1350. The ink supplied to the recording element substrates 200 is then recovered from the recording element substrates 200 through the flow path group 1350, the fourth flow path member 1318, the fifth flow path member 1320, the sixth flow path member 1352, and the seventh flow path member 1354 to the liquid supply unit 1322.

[0055] In the recording head 22, an electrical wiring board support portion 1402 is provided so as to surround the outer circumference of the liquid supply unit 1322. When connecting the substrate portion 1202 and the flow channel portion 1204, the electrical wiring board 1308 is supported by the electrical wiring board support portion 1402. In this embodiment, the discharge module 1404 is formed by the substrate group 1300 and the flow channel group 1350 (see Figure 14). In other words, the recording head 22 is equipped with four discharge modules 1404. Note that the configuration of the discharge module 1404 is the same as the discharge module 404 described in the first embodiment above, so a detailed explanation is omitted in this embodiment.

[0056] <Discharge module connection status> Next, the connection of the ejection module 1404 in the recording head 22 will be described. In the recording head 22, the substrate portion 1202 and the flow path portion 1204 are connected and housed in the cover member 1206, and at this time, the ejection module 1404 is supported by the support member 1205. The cover member 1206 is bonded to the support member 1205, for example, with an adhesive. Figure 15 is a view taken along arrow XV in Figure 12(a), and Figure 16 is a cross-sectional view taken along line XVI-XVI in Figure 15. Figure 17 is a cross-sectional view taken along line XVII-XVII in Figure 15.

[0057] In the discharge module 1404, the flexible wiring board 306 is bent and supported by the support member 1205 on the sides of the first flow channel member 312, the second flow channel member 314, and the third flow channel member 316 that are parallel to the XZ plane (see Figure 14). The support member 1205 that supports the four discharge modules 1404 has four openings 205a that penetrate in the Z direction (see Figure 14). The configuration of the openings 205a has been described in the first embodiment above, so a detailed explanation is omitted here.

[0058] When supporting the discharge module 1404 with the support member 1205, the discharge module 1404 is inserted into each opening 205a of the support member 1205 from the upstream side in the +Z direction. When the discharge module 1404 is inserted into the opening 205a, the second flow channel member 314 and the third flow channel member 316 pass through the lower opening 205a-2 and are inserted into the upper opening 205a-1. On the other hand, the first flow channel member 312 is inserted into the lower opening 205a-2, but the protrusion 502 and the wall surface 1002 come into contact, preventing it from being inserted into the upper opening 205a-1.

[0059] Then, the discharge modules 1404 and support members 1205 are aligned so that the second flow channel member 314 does not come into contact with the inner wall of the upper opening 205a-1, and the first flow channel member 312 does not come into contact with the inner wall of the lower opening 205a-2. At this time, the first flow channel member 312 and the second flow channel member 314 and the support member 205 are positioned opposite each other with a space in between. Specifically, a space is formed between the second flow channel member 314 and the upper opening 205a-1, so that the second flow channel member 314 and the upper opening 205a-1 are positioned opposite each other. Also, a space is formed between the first flow channel member 312 and the lower opening 205a-2, so that the first flow channel member 312 and the lower opening 205a-2 are positioned opposite each other. Furthermore, the opening 205a, the first flow channel member 312, and the second flow channel member 314 are designed so that these spaces are large enough to accommodate the thermal expansion of the first flow channel member 312 and the second flow channel member 314. In other words, even if thermal expansion occurs in the first flow channel member 312 and the second flow channel member 314, each component is designed so that these flow channel members do not come into contact with the lower opening 205a-2 and the upper opening 205a-1, or if they do come into contact, they do not deform the support member 1205.

[0060] Furthermore, when each discharge module 1404 and the support member 1205 are aligned, the protrusion 502 and the wall surface 1002 come into contact. By bonding these members together with adhesive, each discharge module 1404 is fixed and supported by the support member 1205. Thus, in this embodiment, in the insertion direction of each discharge module 404, the discharge module 404 is supported by the support member 1205 with the protrusion 502 of the first flow channel member 312 in contact with the wall surface 1002 of the support member 1205. Moreover, when each discharge module 1404 and the support member 1205 are aligned, the recording element substrate support member 406 is supported on the bottom surface 1205b of the support member 1205.

[0061] Thus, the discharge module 1404, supported by the support member 1205, is fluidly connected to the fourth flow path member 318 via the seal member 1452. Furthermore, the fifth flow path member 320 is fluidly connected to the fourth flow path member 318, and the sixth flow path member 1352 is fluidly connected via the seal member 1454. On top of that, the seventh flow path member 1354, the liquid supply unit 1322, and the like are fluidly connected. The recording head 22 is then assembled by attaching the electrical wiring board support part 402 and the like.

[0062] As described above, in this embodiment, the four discharge modules 1404 are inserted into and supported by the support member 1205. At this time, the first flow channel member 312 and the second flow channel member 314 are positioned opposite the support member 1205 with a space between them in a direction intersecting the insertion direction of the discharge modules 1404. This space is made large enough to accommodate the thermal expansion of the first flow channel member 312 and the second flow channel member 314. The first flow channel member 312 is supported by contacting the wall surface 1002 of the support member 1205 in the insertion direction. As a result, the recording device 10 according to this embodiment also produces the same effects as in the first embodiment.

[0063] (Other embodiments) The above-described embodiments may be modified as shown in (1) to (5) below.

[0064] (1) Although not specifically described in the above embodiment, it is preferable to use an adhesive that does not easily conduct heat, that is, an adhesive with low thermal conductivity, for bonding the protrusion 502 and the wall surface 1002. This suppresses the transfer of heat from the first flow channel member 312 to the support member 205 via the protrusion 502, and prevents deformation of the support member 205 due to thermal expansion caused by the heat transferred to the support member 205. Furthermore, the adhesive used to bond the protrusion 502 and the wall surface 1002 may have a lower thermal conductivity than the first flow channel member 312.

[0065] Furthermore, it is preferable that the support member 205 be made of a material with low thermal conductivity and low coefficient of thermal expansion. This reduces deformation of the support member 205 due to thermal expansion, even if it is transmitted to the support member 205 via the protrusions 502 and the adhesive.

[0066] (2) Although not specifically described in the above embodiments, the protrusions 502 may be made of a material capable of absorbing the thermal expansion that occurs in the first flow channel member 312, for example, an elastic material. Alternatively, an adhesive capable of absorbing the displacement of the protrusions 502 due to the thermal expansion of the first flow channel member 312, for example, an adhesive with elasticity or stretchability, may be used to bond the protrusions 502 to the wall surface 1002. Furthermore, in the above embodiments, the protrusions 502 are formed so as not to come into contact with the second flow channel member 314 bonded to the first flow channel member 312 in predetermined regions formed at both ends of the first flow channel member 312 in the X direction, but the embodiments are not limited to this. In other words, the protrusions 502 may be formed to come into contact with the second flow channel member 314 bonded to the first flow channel member 312 in predetermined regions. In this case, it is preferable that the protrusions 502 be made of a material with low thermal conductivity and low coefficient of linear expansion.

[0067] (3) In the above embodiment, protrusions 502 are provided at both ends of the first flow channel member 312 in the X direction, and the first flow channel member 312 is supported by the wall surfaces 1002 of the support members 205 and 1205 via the protrusions 502, but the embodiment is not limited to this. That is, both ends of the first flow channel member 312 in the X direction may be directly supported by the wall surfaces 1002. Alternatively, contact portions may be formed at both ends of the first flow channel member 312 in the X direction so as to be flat with the surface of the first flow channel member 312 that connects to the second flow channel member 314 without creating a step. In this case, the contact portions may be formed from an elastic material as described in (2) above, or from a material with low thermal conductivity and coefficient of linear expansion as described in (3) above.

[0068] (4) In the above embodiment, since thermal expansion in the X direction, which is the longitudinal direction of the recording element substrate 200, is of particular concern, the first flow channel member 312 is made larger in the X direction than the second flow channel member 314, and is made approximately the same size in the Y direction, but is not limited to this. For example, if thermal expansion in the Y direction is also of concern as thermal expansion in the X direction, the first flow channel member 312 is made larger in both the X and Y directions than the second flow channel member 314. In addition, protrusions 502 are provided at both ends in the X direction and both ends in the Y direction formed on the first flow channel member 312 to which the second flow channel member 314 is connected, and the wall surface 1102 of the opening 205a is formed as a plane with width in the Y direction. When aligning the discharge module 404 with the support member 205, the protrusions 502 and wall surface 1002 facing each other in the X direction are brought into contact and bonded, and the protrusions 502 facing each other in the Y direction are brought into contact and bonded with the wall surface 1102.

[0069] (5) The above embodiments and the various forms shown in (1) to (4) above may be combined as appropriate. [Explanation of symbols]

[0070] 22 recording heads 200 recording element substrate 205, 1205 Support members 312 First flow channel member 314 Second flow channel member 404 Discharge Module 406 Recording element substrate support member 1002 Wall surface

Claims

1. a module including a substrate capable of ejecting liquid by driving an ejection energy generating element and a flow path member fluidly connected to the substrate; A support member for supporting the substrate; a frame supporting the module and the support member, The frame body is Supporting the inserted module and supporting the support member on an insertion surface of the module; an opening penetrating the module in an insertion direction, the opening area on an upstream side of the insertion direction being larger than the opening area on a downstream side of the insertion direction; The liquid ejection head is characterized in that, when the module is inserted into the frame body, the frame body and the flow path member face each other across a space in a direction intersecting the insertion direction of the module, and are supported in abutment in the insertion direction.

2. the flow path member is configured by a plurality of members connected in the insertion direction, 2. The liquid ejection head according to claim 1, wherein the contact portion of the flow path member that contacts the frame is formed on a member located upstream in the insertion direction.

3. a module including a substrate capable of ejecting liquid by driving an ejection energy generating element and a flow path member that is connected to the substrate; A support member for supporting the substrate; a frame supporting the module and the support member, the frame supports the inserted module and supports the support member on an insertion surface of the module; When the module is inserted into the frame body, the frame body and the flow path member face each other across a space in a direction intersecting an insertion direction of the module, and are supported in contact with each other in the insertion direction, the flow path member is composed of a plurality of members connected in the insertion direction, The liquid ejection head according to claim 1, wherein the contact portion of the flow path member that contacts the frame is formed on a member located upstream in the insertion direction.

4. The liquid ejection head according to claim 2 , wherein a portion of said frame that comes into contact with said flow path member is formed substantially parallel to said support member that is supported by said frame.

5. the flow path member includes a first flow path member fluidly connected to the substrate and a second flow path member fluidly connected to the first flow path member, The first flow path member is The second flow path member is formed to be longer in a predetermined direction intersecting the insertion direction than the second flow path member, The liquid ejection head according to claim 2 , wherein the contact portion is provided in regions formed at both ends in the predetermined direction when connected to the second flow path member.

6. The liquid ejection head according to claim 2 , wherein the adhesive that bonds the contact portion and the frame is an adhesive that does not easily transmit heat.

7. The liquid ejection head according to claim 2 , wherein an adhesive for bonding the contact portion and the frame has a thermal conductivity lower than that of the flow path member.

8. The liquid ejection head according to claim 2 , wherein the contact portion is made of an elastic material.

9. The liquid ejection head according to claim 2 , wherein the adhesive that bonds the contact portion and the frame has elasticity.

10. The liquid ejection head according to claim 2 , wherein the contact portion is made of a material having a low thermal conductivity and a low linear expansion coefficient.

11. The liquid ejection head according to claim 2 , wherein the contact portion is a convex portion that protrudes in the insertion direction.

12. The liquid ejection head according to claim 1 , wherein the module includes a flexible wiring board that transmits power and signals to the board.

13. The liquid ejection head according to claim 12 , wherein the flexible wiring board includes a drive circuit board for supplying drive signals to the ejection energy generating elements.

14. The liquid ejection head according to claim 12 or 13, wherein the module is supported by the frame with the flexible wiring board bent toward a side surface of the flow path member in a predetermined direction intersecting the insertion direction and parallel to the insertion direction.

15. The liquid ejection head according to claim 1 , wherein the frame is made of a material having a low thermal conductivity and a low linear expansion coefficient.

16. The liquid ejection head according to claim 1 , wherein the ejection energy generating element is a piezoelectric element.

17. The liquid ejection head according to claim 1 , comprising a plurality of the modules.

18. A liquid ejection apparatus that ejects liquid using the liquid ejection head according to claim 1 .

Images