Imaging device

Abstract

To provide an imaging device with which it is possible to efficiently cool an imaging element without obstructing the movement of the imaging element by a vibration-proof mechanism, and without increasing the size of the imaging device.SOLUTION: An imaging device 1, provided with an imaging element substrate 102 on which an imaging element 101 is mounted, a control circuit board 16 that controls the entire device, and a vibration-proof mechanism that moves the imaging element substrate 102 in an XY plane that is perpendicular to the optical axis, further includes a cooling fan 17 and a first duct 13 that are arranged behind the control circuit board 16 in the optical axis direction, and a second duct 14 that is branched from the first duct 13. The spaces in the first and second ducts 13, 14 are spatially separated from the imaging element substrate 102 and the control circuit board 16, and part of the second duct 14 is located at a position where it overlaps the imaging element substrate 102 when seen from the top face of the imaging device 1 and located at a position where it does not come into contact with the imaging element substrate 102 moved closest by the vibration-proof mechanism.SELECTED DRAWING: Figure 2A

Description

[Technical Field]

[0001] The present invention relates to an imaging device, and more particularly to an imaging device having an internal cooling structure. [Background technology]

[0002] Image capture devices are becoming increasingly capable of higher image quality, with higher resolution and frame rates for recorded images. These image capture devices impose a greater signal processing load and consume more power, generating significant heat in signal processing sections such as the image sensor and data recording section. Because the performance of electronic components within an image capture device deteriorates at high temperatures, the device must be equipped with a cooling structure to maintain the performance of the signal processing section even when heated. For example, Patent Documents 1 and 2 disclose heat dissipation means for forced air cooling of the image sensor.

[0003] In recent years, imaging devices have been proposed that include an anti-vibration mechanism that moves the imaging element within a predetermined range to absorb external vibrations and prevent blurring of images. Conventionally, cooling of such anti-vibration mechanisms has been achieved by transferring heat from the heat-generating section to a highly thermally conductive member and dissipating it. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Patent Application Publication No. 2019-8052 [Patent Document 2] Japanese Patent Application Laid-Open No. 2009-71516 Summary of the Invention [Problem to be solved by the invention]

[0005] However, the heat dissipation means in Patent Document 1 is a heat dissipation duct that is placed behind the optical axis of the image sensor, and the heat from the image sensor is transferred to this heat dissipation duct and cooled by forced air cooling, which results in the problem of the image sensor becoming larger in size in the optical axis direction.

[0006] Furthermore, the heat dissipation means in Patent Document 2 is a heat dissipation duct connected to a cooling device attached to the outside of the main body, and the imaging element is cooled by forced air cooling with this cooling device. This poses a problem in that the imaging device as a whole becomes larger by the size of the cooling device attached to the outside of the main body. Furthermore, Patent Document 2 is configured so that air directly hits the imaging element, so no consideration is given to dustproofing or drip-proofing.

[0007] On the other hand, when a heat dissipation duct is arranged in this way so as not to increase the size of the imaging device, the movement of the imaging element due to the vibration isolation mechanism may be hindered.

[0008] Therefore, an object of the present invention is to provide an imaging device that can efficiently cool an imaging element without interfering with the movement of the imaging element due to an anti-vibration mechanism and without increasing the size of the imaging device. [Means for solving the problem]

[0009] In order to solve the above problem, the imaging device of the present invention is an imaging device comprising an imaging element board on which an imaging element that photoelectrically converts light from a lens is mounted, a control circuit board that controls the entire device, and an anti-vibration mechanism that moves the imaging element board in a plane perpendicular to the optical axis of the light from the lens, and further comprising a cooling fan and a first duct arranged behind the control circuit board in the direction of the optical axis of the light from the lens, and a second duct branching from the first duct for dissipating heat from the imaging element board, the internal spaces of the first and second ducts being spatially separated from the imaging element board and the control circuit board, and at least a portion of the second duct being arranged in a position that overlaps with the imaging element board when the imaging device is viewed from above, and is arranged in a position that does not come into contact with the imaging element board, which is brought as close as possible by the anti-vibration mechanism. [Effects of the Invention]

[0010] According to the present invention, the image sensor can be cooled efficiently without interfering with the movement of the image sensor due to the vibration isolation mechanism and without increasing the size of the imaging device. [Brief explanation of the drawings]

[0011] [Figure 1A] 1 is a front perspective view of an imaging device according to an embodiment of the present invention. [Figure 1B] FIG. 2 is a rear perspective view of the imaging device. [Figure 2A] FIG. 2 is a front perspective view showing the internal components of the imaging device. [Figure 2B] FIG. 2 is a rear perspective view showing the internal components of the imaging device. [Figure 3] FIG. 2 is an exploded perspective view showing the internal components of the imaging device 1. [Figure 4] FIG. 4 is an exploded perspective view showing the structure of the imaging unit in FIG. 3. [Figure 5A] FIG. [Figure 5B] 5B is a cross-sectional view taken along the line AA in FIG. 5A. [Figure 6A] FIG. [Figure 6B] FIG. 6B is a cross-sectional view of FIG. 6A. [Figure 6C] 6B is a cross-sectional view taken along CC in FIG. 6A. [Figure 7A] FIG. 2 is a front view of an example of internal components of the imaging device. [Figure 7B] 1 is an example of a top view of the internal components of an imaging device. [Figure 8A] FIG. 10 is another example of a front view of the internal components of the imaging device. [Figure 8B] FIG. 10 is another example of a perspective view of internal components according to a modification of the imaging device. DETAILED DESCRIPTION OF THE INVENTION

[0012] An imaging device 1 of the present invention will now be described with reference to the accompanying drawings.

[0013] <Explanation of Components of Imaging Device 1> First, the general configuration of the imaging device 1 will be described with reference to FIGS. 1A and 1B.

[0014] To simplify the following explanation, the XYZ coordinate system is defined below. The Z axis is the direction of the imaging optical axis of the imaging device 1, and the direction toward the subject being photographed is considered positive. On a plane perpendicular to the Z axis, the width direction of the imaging device 1 is the X axis, and the right side as viewed from the subject side when facing the imaging device 1 is considered positive. The vertical direction of the imaging device 1 is the Y axis, and the direction toward the sky is considered positive.

[0015] FIG. 1A is a front perspective view of the imaging device 1, and FIG. 1B is a rear perspective view of the imaging device 1. FIG.

[0016] As shown in FIGS. 1A and 1B, the imaging device 1 comprises an imaging device body 2 and a lens 3.

[0017] 3 and 4 etc., and an image sensor 101 that photoelectrically converts light from the lens 3, as well as a power supply unit, a recording unit that records images, and various operation units, the main functions of an image capturing device are included in the image capturing device 1. As shown in Fig. 1A, the image capturing device 1 is provided with a lens 3 attached to the subject side (+Z direction), which can be changed according to the shooting conditions.

[0018] 1A, the imaging device body 2 is equipped with an exhaust port 4 on the right side (+X direction) as viewed from the subject side, for discharging hot air inside the imaging device body 2 to the outside by a forced air-cooling mechanism using a cooling fan 17, which will be described later. Also, an accessory shoe 5 (external device mounting portion) to which an external accessory (external device) can be attached is arranged on the top surface (+Y direction) of the imaging device body 2.

[0019] 1B, the imaging device body 2 is equipped with an air intake 6 on the left side (-X direction) when viewed from the subject side, for drawing cool outside air into the body using a forced air-cooling mechanism that uses a cooling fan, which will be described later. The air intake 6 is provided on the side surface that is stepped from the grip portion 7 that holds the imaging device body 2, and is located in a position that is unlikely to be covered even when the user holds the imaging device 1. In addition, a panel 8 is located on the back side (-Z direction) of the imaging device body 2, and is rotatable relative to the imaging device body 2 by a rotation hinge 9.

[0020] <Outline of Internal Components of Imaging Device 1> Next, the internal components of the imaging device 1 will be outlined with reference to FIGS. 2A, 2B, and 3. FIG.

[0021] Fig. 2A is a front perspective view showing the internal components of the imaging device 1, and Fig. 2B is a rear perspective view showing the internal components of the imaging device 1. Fig. 3 is an exploded perspective view showing the internal components of the imaging device 1.

[0022] 2A, 2B, and 3, imaging device 1 includes therein imaging element unit 10, vibration isolation fixing unit 11, front side metal plate 12, first duct 13, second duct 14, third duct 15, control circuit board 16, and cooling fan 17. Furthermore, imaging device 1 includes therein heat transfer member 18, accessory shoe 5, and electrical connection member 20 (FIG. 3). Note that in this embodiment, only the components relevant to the present invention are described, and descriptions of other components are omitted.

[0023] 3, the imaging element unit 10, the vibration-isolating fixing unit 11, the front metal plate 12, and the electrical connection members 20 constitute the imaging unit 100. The imaging element unit 10 is movably held by the vibration-isolating fixing unit 11 and the front metal plate 12, and has a vibration-isolating mechanism for the imaging element unit 10.

[0024] 3, the control circuit board 16, the first duct 13, the second duct 14, the third duct 15, the cooling fan 17, the heat transfer member 18, and the accessory shoe 5 constitute a main unit 150. The imaging unit 100 and the main unit 150 are electrically connected by an electrical connection member 20. The control circuit board 16, which controls the functions of the imaging device 1, is thermally connected to the first duct 13. The cooling fan 17 is a so-called centrifugal fan, and is configured to suck in air from the surface direction and expel it in the centrifugal (lateral) direction. Here, although the air flow will be described in detail later, the imaging device 1 is configured so that the cooling fan 17 takes in air through the aforementioned air intake 6, passes it through the interior of the imaging device main body 2, and expels it from the exhaust vent 4 to dissipate heat.

[0025] <Explanation of the image stabilization function of the imaging unit 100> The structure of the imaging unit 100 having an anti-shake function will be described with reference to FIG.

[0026] FIG. 4 is an exploded perspective view showing the structure of the imaging unit 100. As shown in FIG.

[0027] As shown in FIG. 4, in the imaging unit 100, the imaging element unit 10 is composed of an imaging element 101, an imaging element substrate 102, an imaging movable flexible cable 103, a first coil 104X, a second coil 104Y, and an imaging element holding member 105.

[0028] In the imaging unit 100, the vibration-proof fixed unit 11 is made up of a rear fixed plate 120, a first permanent magnet 121X, a second permanent magnet 121Y, a first rear metal plate 122X, and a second rear metal plate 122Y.

[0029] The imaging element 101 is mounted on an imaging element substrate 102, and the imaging element substrate 102 is fixed to the imaging element holding member 105 by adhesive or the like, thereby being held by the imaging element holding member 105. The imaging movable flexible cable 103 is fixed to the imaging element holding member 105 by double-sided tape, screws, or the like. The first coil 104X and the second coil 104Y are arranged to fit within the opening of the imaging element holding member 105, and are covered by the imaging movable flexible cable 103.

[0030] The first permanent magnet 121X and the second permanent magnet 121Y are arranged to fit into the openings of the rear-side fixing plate 120 and are held in place by engaging with each other. The first rear-side metal plate 122X and the second rear-side metal plate 122Y are fixed to the rear-side fixing plate 120 with screws so as to cover the first permanent magnet 121X and the second permanent magnet 121Y, respectively. The first duct 13 (FIG. 3) is fixed to the rear-side fixing plate 120 with screws.

[0031] The imaging element unit 10 is held by being sandwiched between the vibration-proof fixing unit 11 and the front side metal plate 12 shown in Figure 3. A plurality of ball members (not shown) are interposed between the imaging element unit 10 and the rear side fixing plate 120 of the vibration-proof fixing unit 11.

[0032] The first coil 104X and first permanent magnet 121X are disposed opposite each other in the optical axis direction, and their outer surfaces are covered by the front metal sheet 12 and the first rear metal sheet 122X, respectively. Hereinafter, the voice coil motor (VCM)-based moving force generating unit of the first coil 104X and the first permanent magnet 121X will be referred to as the first moving mechanism 130X (vibration isolation mechanism). When a current flows through the first coil 104X via the imaging moving flex 103, a force that moves the image sensor unit 10 in the X direction (Yaw direction) is generated in the first moving mechanism 130X, thereby controlling the position of the image sensor unit 10. Similarly, the second coil 104Y and the second permanent magnet 121Y are disposed opposite each other in the optical axis direction, and their outer surfaces are covered by the front metal sheet 12 and the second rear metal sheet 122Y, respectively. Hereinafter, the VCM-type moving force generating unit of the second coil 104Y and the second permanent magnet 121Y will be referred to as the second moving mechanism 130Y (vibration isolation mechanism). When current flows through the second coil 104Y via the imaging moving flex 103, a force that moves the image sensor unit 10 in the Y direction (pitch) or the rotation direction (roll direction) is generated in the second moving mechanism 130Y depending on the direction of the current. This allows the position of the image sensor unit 10 to be controlled. Specifically, when an external force is applied to the imaging device 1, the control circuit board 16 first detects the amount of shake in a plane perpendicular to the optical axis (X direction, Y direction, roll direction) caused by the external force using a sensor (not shown). Next, the control circuit board 16 moves the image sensor unit 10 using the first moving mechanism 130X and the second moving mechanism 130Y so as to cancel out the amount of shake. This allows camera shake occurring in the imaging device 1 to be corrected.

[0033] <Explanation of heat dissipation structure of imaging device 1> The heat dissipation structure of the imaging device 1 will be described with reference to FIGS. 5A, 5B, 6A, 6B, and 6C.

[0034] FIG. 5A is a bottom view of the imaging device 1, and FIG. 5B is a cross-sectional view taken along line AA in FIG. 5A.

[0035] 6A is a rear view of the imaging device 1, FIG. 6B is a cross-sectional view taken along line BB in FIG. 6A, and FIG. 6C is a cross-sectional view taken along line CC in FIG. 6A.

[0036] 6B , heat generated by control circuit board 16 is transferred to first duct 13, which is made of a highly thermally conductive metal such as aluminum, via a thermally conductive member (not shown). Cooled outside air taken in by cooling fan 17 enters the interior of image capture device 1 through intake port 6 and flows into first duct 13, where it exchanges heat with first duct 13, which has become hot due to the heat generated by control circuit board 16. The hot air is then taken in by cooling fan 17, passes through third duct 15, and is discharged to the outside through exhaust port 4.

[0037] As shown in FIG. 6C , heat generated by the imaging element board 102 of the imaging element unit 10 inside the imaging unit 100 is transferred to the second duct 14, which is made of a metal such as aluminum, which has high thermal conductivity. The method of transferring heat from the imaging element board 102 to the second duct 14 will be described in detail below. As shown in FIGS. 5B and 6C , cooled outside air taken in by the cooling fan 17 enters the interior of the imaging device 1 through the air intake 6 and passes through the first duct 13. It then branches into the second duct 14, where it exchanges heat with the second duct 14, which has become hot due to the heat generated by the imaging element board 102. The hot air then passes through the first duct 13 again, is taken in by the cooling fan 17, passes through the third duct 15, and is discharged to the outside from the exhaust port 4.

[0038] With the above-described configuration, the forced air cooling mechanism using the cooling fan 17 can dissipate heat generated by the image sensor board 102 and the control circuit board 16, which are the main heat sources of the image pickup device main body 2, to the outside of the image pickup device 1.

[0039] As described above, the air flow path of the forced air-cooling structure passes through the first duct 13, the second duct 14, the third duct 15, and the cooling fan 17. Therefore, within the imaging device body 2, the space that serves as the air flow path of the forced air-cooling structure is spatially separated from the space where other components such as the imaging unit 100 and the control circuit board 16 are located. In other words, the outside air taken into the imaging device body 2 by the forced air-cooling structure does not directly come into contact with electrical components related to imaging, such as the imaging unit 100 and the control circuit board 16. Therefore, even if water droplets or dust enter the interior of the imaging device body 2 through the exhaust port 4 or the intake port 6, these electrical components can be protected from dust and water.

[0040] <Explanation of Heat Transfer Structure to Second Duct 14> The heat transfer structure to the second duct 14 will be described with reference to FIGS. 7A and 7B.

[0041] FIG. 7A is an example of a front view of the internal components of the imaging device 1. FIG.

[0042] FIG. 7B is an example of a top view of the internal components of the imaging device 1. As shown in FIG.

[0043] 7B , the second duct 14 branching off from the first duct 13 passes above (+Y side) the control circuit board 16 and passes around the accessory shoe 5 in front of (+Z side) the accessory shoe 5 in a direction perpendicular to the optical axis (X direction). At this time, the second duct 14 is positioned so as to overlap with the imaging unit 100 when the imaging device 1 is viewed from above (+Y side). Thereafter, the second duct 14 passes above (+Y side) the control circuit board 16 again and is connected to the first duct 13. In this configuration, the second duct 14 is positioned above the imaging unit 100, which prevents the imaging device body 2 from becoming larger in the optical axis direction due to the addition of a structure for dissipating heat from the image sensor unit 10.

[0044] Furthermore, the second duct 14 is arranged at a position where it does not come into contact with the imaging unit 100 when it comes as close as possible due to the vibration isolation mechanism. In other words, the second duct 14 is arranged at a position where the movement of the imaging unit 100 is not hindered by the vibration isolation mechanism.

[0045] Heat generated by the imaging element substrate 102 of the imaging element unit 10 is transferred to the imaging element holding member 105 to which the imaging element substrate 102 is fixed. The imaging element holding member 105 is preferably made of a metal with high thermal conductivity, such as aluminum. The upper surface (+Y side) of the imaging element holding member 105 and the lower surface (-Y side) of the second duct 14 are thermally connected by a heat transfer member 18, as shown in FIG. 7A. Here, the heat transfer member 18 is a thin, soft sheet-like member with high thermal conductivity, such as a graphite sheet.

[0046] The heat transfer member 18 has a curved shape (a shape with at least two or more normal vectors) in a plane perpendicular to the optical axis (XY plane). For example, it has a roughly C-shape as shown in FIG. 7A. Furthermore, the length of the heat transfer member 18 in the plane perpendicular to the optical axis (XY plane) is longer than the maximum movement amount of the vibration isolation mechanism of the image pickup element unit 10. Therefore, the heat transfer member 18 can transfer heat to the second duct 14 without interfering with the movement of the vibration isolation mechanism of the image pickup element unit 10.

[0047] It is desirable that the temperature distribution of the image sensor 101 be as uniform as possible to minimize its impact on image quality. Therefore, as shown in Figure 7A, multiple heat transfer members 18 are arranged and connected at equal intervals between the second duct 14 and the image sensor holding member 105. This ensures multiple heat transfer paths from the image sensor substrate 102 to the second duct 14, making it possible to uniform the temperature distribution of the image sensor 101.

[0048] Next, a case where the heat transfer member of the imaging device 1 is not the heat transfer member 18 but a heat transfer member 200 having another form will be described with reference to FIGS. 8A and 8B.

[0049] FIG. 8A is another example of a front view of the internal components of the imaging device 1, and FIG. 8B is another example of a perspective view of the internal components of the imaging device 1.

[0050] In the example shown in FIGS. 8A and 8B, the image sensor holding member 105 and the second duct 14 are thermally connected by a heat transfer member 200. Here, the heat transfer member 200 is a thin, soft sheet-like member with high thermal conductivity, such as a graphite sheet. One end of the heat transfer member 200 is attached to the second duct 14, and the other end is attached to the image sensor holding member 105. The heat transfer member 200 is connected in the shape of a spiral around a single axis, with axis 201 parallel to a direction (X direction: second direction) perpendicular to both the optical axis and the Y direction. The spiral is formed by rotating 360 degrees from a starting point 203 to an end point 204, moving in the X positive direction around axis 201.

[0051] The spiral shape of the heat transfer member 200 has a distance 205 between adjacent arcs that is longer than the maximum amount of movement in the X direction of the vibration isolation mechanism of the image sensor unit 10. Therefore, even when the image sensor unit 10 moves in the X direction due to the vibration isolation mechanism, the distance 205 between the arcs extends. Therefore, the heat transfer member 200 can transfer heat without interfering with the movement in the X direction of the image sensor unit 10 due to the vibration isolation mechanism.

[0052] Furthermore, when the image sensor unit 10 moves in the Y direction due to its vibration isolation mechanism, for example, when it moves away from the image sensor holding member 105, the arc of the spiral becomes smaller, and conversely, when it moves closer to the image sensor holding member 105, the arc of the spiral becomes larger. In other words, the heat transfer member 200 disperses and absorbs changes in its length in the Y direction by changing the size of the arc of the spiral. Therefore, the heat transfer member 200 can transfer heat without interfering with the movement of the image sensor unit 10 in the Y direction due to its vibration isolation mechanism.

[0053] If a graphite sheet is used for the heat transfer member 200, the heat conduction effect will be significantly reduced when it is bent. However, if the heat transfer member 200 has the spiral shape described above, the excess length of the heat transfer member 200 required for movement by the vibration isolation mechanism of the image sensor unit 10 can be dispersed and absorbed by changing the arc diameter and arc spacing. This prevents bending of the heat transfer member 200 and does not impede the heat conduction effect of the graphite sheet. Furthermore, when unfolded and unassembled, the heat transfer member 200 has a strip-like, approximately rectangular shape (not shown). This allows for efficient cutting of the sheet material without waste, resulting in low-cost production.

[0054] With the configuration described above, the heat generated by the imaging element substrate 102 of the imaging element unit 10 can be efficiently transferred to the second duct 14 without increasing the size of the imaging device body 2 in the optical axis direction.

[0055] Although the present invention has been described in detail above based on preferred embodiments thereof, the present invention is not limited to these specific embodiments, and various forms within the scope of the gist of the present invention are also included in the present invention. Parts of the above-described embodiments may be combined as appropriate.

[0056] The disclosure of this embodiment includes the following configuration, method, and program. (Configuration 1) An imaging device comprising an imaging element board on which an imaging element that photoelectrically converts light from a lens is mounted, a control circuit board that controls the entire device, and an anti-vibration mechanism that moves the imaging element board in a plane perpendicular to the optical axis of the light from the lens, further comprising a cooling fan and a first duct arranged behind the control circuit board in the direction of the optical axis of the light from the lens, and a second duct branching off from the first duct for dissipating heat from the imaging element board, wherein the internal spaces of the first and second ducts are spatially separated from the imaging element board and the control circuit board, and at least a portion of the second duct is arranged in a position that overlaps with the imaging element board when the imaging device is viewed from above, and is arranged in a position that does not come into contact with the imaging element board when it is as close as possible due to the anti-vibration mechanism. (Configuration 2) An imaging device according to Configuration 1, characterized in that an external device mounting portion to which an external device can be attached is arranged on the upper surface of the imaging device, and at least a portion of the flow path inside the second duct passes in front of the optical axis of the external device mounting portion. (Configuration 3) The imaging device described in Configuration 1 or 2 further comprises an imaging element holding member that holds the imaging element substrate, and a heat transfer member that connects the imaging element holding member and the second duct, wherein the heat transfer member has a shape that has at least two normal vectors on a plane perpendicular to the optical axis. (Configuration 4) The imaging device according to Configuration 3, wherein a plurality of the heat transfer members are disposed at equal intervals between the imaging element holding member and the second duct. (Configuration 5) The imaging device described in any one of configurations 1 to 4, further comprising an imaging element holding member that holds the imaging element substrate, and a heat transfer member that connects the imaging element holding member and the second duct, wherein the heat transfer member has a spiral shape around one axis. (Configuration 6) The imaging device according to configuration 5, wherein the spiral shape has an axis parallel to the width direction of the imaging device. (Configuration 7) The imaging device according to configuration 6, wherein the interval between adjacent arcs of the spiral shape is longer than the maximum amount of movement of the imaging element substrate in the width direction by the vibration isolation mechanism. (Configuration 8) The imaging device described in Configuration 6 or 7, characterized in that when the imaging element substrate is moved in the vertical direction of the imaging device by the vibration isolation mechanism, the heat transfer member changes the size of the arc of the spiral. (Configuration 9) The imaging device according to any one of configurations 6 to 8, wherein the heat transfer member has a strip-like, approximately rectangular shape in an unassembled, unfolded state. (Configuration 10) The imaging device according to any one of configurations 6 to 9, wherein the heat transfer member is a graphite sheet. [Explanation of symbols]

[0057] 1. Imaging device 2. Imaging device body 3 Lenses 4 exhaust port 5 Accessory shoe 6 Air intake 7 Grip 8 Panels 9 Rotating Hinge 10. Image sensor unit 11 Anti-vibration fixing unit 12 Front side metal plate 13 First Duct 14 Second Duct 15 Third Duct 16 Control circuit board 17 Cooling fan 18 Heat transfer material 20 Electrical connection parts 100 Imaging unit 101 Image sensor 102 Image sensor board 103 Imaging moving flex 104X First Coil 104Y Second coil 105 Image sensor holding member 120 Rear side fixing plate 121X First permanent magnet 121Y Second permanent magnet 122X 1st rear side sheet metal 122Y Second rear side metal plate 130X First moving mechanism 130Y Second moving mechanism 150 Main Unit 200 Heat transfer member 201 axes 203 Starting Point 204 End 205 Arc Spacing

Claims

1. An imaging element substrate on which an imaging element that photoelectrically converts light from a lens is mounted; A control circuit board that controls the entire device; an anti-vibration mechanism that moves the image sensor substrate in a plane perpendicular to the optical axis of the lens; a cooling fan and a duct provided for dissipating heat from the imaging element substrate, An imaging device characterized in that the internal space of the duct is spatially separated from the imaging element substrate, and at least a portion of the duct is positioned so as to overlap with the imaging element substrate when the imaging device is viewed from above.

2. The imaging device as described in claim 1, characterized in that an external device mounting portion to which an external device can be attached is arranged on the upper surface of the imaging device.

3. The imaging device as described in claim 1, further comprising an imaging element holding member that holds the imaging element substrate, and at least one heat transfer member that connects between the imaging element holding member and the duct.

4. The imaging device as described in Claim 3, characterized in that the at least one heat transfer member is arranged at equal intervals between the imaging element holding member and the duct.

5. Further comprising an imaging element holding member that holds the imaging element substrate, and a heat transfer member that connects the imaging element holding member and the duct, 2. The imaging device according to claim 1, wherein the heat transfer member is in the shape of a spiral around one axis.

6. The imaging device described in Claim 5, characterized in that the one axis is parallel to the width direction of the imaging device.

7. The imaging device described in Claim 6, characterized in that the distance between adjacent arcs of the spiral shape is longer than the maximum amount of movement in the width direction by the vibration-proof mechanism of the imaging element substrate.

8. The imaging device described in Claim 6, characterized in that when the imaging element substrate moves in the vertical direction of the imaging device by the vibration-proof mechanism, the heat transfer member changes the size of the arc of the spiral.

9. The imaging device as described in claim 6, characterized in that the heat transfer member has a band-like, approximately rectangular shape when deployed in an unassembled state.

10. The imaging device according to claim 3, characterized in that a graphite sheet is used as the heat transfer member.

11. 1. An imaging device comprising: an imaging element board on which an imaging element that photoelectrically converts light from a lens is mounted; a control circuit board that controls the entire device; and an anti-vibration mechanism that moves the imaging element board in a plane perpendicular to an optical axis of the light from the lens, a cooling fan and a first duct arranged on the rear side of the control circuit board in the optical axis direction of light from the lens; a second duct branched from the first duct for dissipating heat from the imaging element substrate, an internal space of the first duct and an internal space of the second duct are spatially separated from the imaging element board and the control circuit board; an imaging device characterized in that at least a portion of the second duct is positioned so as to overlap with the imaging element board when the imaging device is viewed from above, and is positioned so as not to come into contact with the imaging element board when the imaging device is brought as close as possible by the vibration isolation mechanism.

12. an external device mounting portion to which an external device can be attached is disposed on an upper surface of the imaging device; 12. The imaging device according to claim 11, wherein at least a part of a flow path inside the second duct passes in front of the optical axis of the external device mounting portion.

13. an imaging element holding member for holding the imaging element substrate; a heat transfer member connecting the image pickup element holding member and the second duct, 12. The imaging device according to claim 11, wherein the heat transfer member has a shape having at least two normal vectors on a plane perpendicular to the optical axis.

14. 14. The imaging apparatus according to claim 13, wherein a plurality of the heat transfer members are disposed at equal intervals between the imaging element holding member and the second duct.

15. an imaging element holding member for holding the imaging element substrate; a heat transfer member connecting the image pickup element holding member and the second duct, 12. The imaging device according to claim 11, wherein the heat transfer member is in the shape of a spiral around one axis.

16. 16. The imaging device according to claim 15, wherein the spiral shape has an axis parallel to a width direction of the imaging device.

17. 17. The imaging device according to claim 16, wherein a distance between adjacent arcs of the spiral shape is longer than a maximum amount of movement of the imaging element substrate in the width direction by the vibration isolation mechanism.

18. 17. The imaging device according to claim 16, wherein the heat transfer member changes a size of the arc of the spiral when the imaging element substrate is moved in the vertical direction of the imaging device by the vibration isolation mechanism.

19. The imaging device according to claim 16, wherein the heat transfer member has a substantially rectangular strip shape in a deployed non-assembled state.

20. 14. The imaging device according to claim 13, wherein the heat transfer member is a graphite sheet.

Images