Liquid discharge substrate, liquid discharge head, and liquid discharge device

Abstract

To suppress lowering of a quality of an image formed by discharge of a liquid.SOLUTION: A liquid discharge substrate 100 is assembled on a liquid discharge head 1, and has: a plurality of discharge ports 206 for discharging a liquid; a plurality of individual supply paths 205 which correspond to each of the plurality of discharge ports 206 and supply the liquid to each of the plurality of discharge ports 206; a common channel 204 for supplying the liquid to each of the plurality of individual supply paths 205; and a projection 401 which is formed on a wall surface forming the common channel 204 between a first individual supply port that is a joint part between the first individual supply path 205 for supplying the liquid to a first discharge port 206 and the common channel 204, and a second individual supply port that is a joint part between a second individual supply path 205 for supplying the liquid to a second discharge port 206 adjacent to the first discharge port 206 and the common channel 204.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present disclosure relates to a structure of a liquid ejection substrate that is assembled to a liquid ejection head. [Background technology]

[0002] Among liquid ejection heads used for image formation by an inkjet method, there are those that supply liquid from a common flow path to individual supply paths that supply liquid to energy generating elements that generate energy for ejecting the liquid. Patent Document 1 discloses a liquid ejection head that has energy generating elements that generate energy for ejecting the liquid, ejection ports that eject the liquid, individual supply paths that supply liquid to the energy generating elements, and a common flow path that supplies liquid to the individual supply paths. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2013-173351 A Summary of the Invention [Problem to be solved by the invention]

[0004] When the entrance of an individual supply path (hereinafter referred to as an "individual supply port"), i.e., the junction between the common flow path and the individual supply path, is blocked by air bubbles, the supply of liquid from the common flow path to the individual supply path is cut off, causing the liquid ejection head to fail to eject. Inside the liquid ejection head, air bubbles that have entered through the ejection port, air bubbles generated by gas dissolved in the liquid, or air bubbles generated when bubbling is used as ejection energy are present and adhere to the walls of the flow path. When air bubbles that remain in the individual supply port grow large and simultaneously block multiple adjacent individual supply ports, non-ejection occurs at the multiple adjacent ejection ports, causing a significant decrease in the quality of images, etc. formed by ejecting liquid. [Means for solving the problem]

[0005] A liquid ejection substrate according to the present disclosure is a liquid ejection substrate assembled to a liquid ejection head, and has a plurality of ejection ports for ejecting liquid, a plurality of individual supply paths corresponding to each of the plurality of ejection ports, the plurality of individual supply paths supplying the liquid to each of the plurality of ejection ports, a common flow path supplying the liquid to each of the plurality of individual supply paths, a first individual supply port which is a junction between a first individual supply path which supplies the liquid to a first ejection port and the common flow path, and a convex portion formed on a wall surface which forms the common flow path between a second individual supply port which is a junction between the common flow path and a second individual supply path which supplies the liquid to a second ejection port adjacent to the first ejection port. Effect of the Invention

[0006] According to the liquid ejection substrate according to the present disclosure, it is possible to suppress deterioration in the quality of images and the like formed by ejecting liquid. [Brief description of the drawings]

[0007] [Figure 1] 1 is a perspective view showing an example of the appearance of a liquid ejection head according to the present disclosure. [Diagram 2] FIG. 1 is a diagram showing an example of the structure of a general liquid ejection substrate according to the related art. [Diagram 3] 1A to 1C are diagrams illustrating an example of the behavior of air bubbles on a typical liquid ejection substrate. [Figure 4] 1A and 1B are diagrams illustrating an example of a structure of a liquid ejection substrate according to the present disclosure. [Diagram 5] 1A to 1C are diagrams illustrating an example of the behavior of air bubbles on a liquid ejection substrate according to the present disclosure. [Figure 6] 1A and 1B are diagrams illustrating an example of a liquid flow on a general liquid ejection substrate. [Figure 7] 5A to 5C are diagrams illustrating an example of a shape of a protrusion according to the present disclosure. [Figure 8] 5A to 5C are diagrams illustrating an example of a manufacturing process for the liquid ejection substrate according to the first embodiment. [Figure 9] 5A to 5C are diagrams illustrating an example of a manufacturing process for the liquid ejection substrate according to the first embodiment. [Figure 10] 5A to 5C are diagrams illustrating an example of a manufacturing process for the liquid ejection substrate according to the first embodiment. [Figure 11] 5A to 5C are diagrams illustrating an example of a manufacturing process for the liquid ejection substrate according to the first embodiment. [Figure 12] 10A to 10C are diagrams illustrating an example of a manufacturing process for a liquid ejection substrate according to a second embodiment. [Figure 13] 10A to 10C are diagrams illustrating an example of a manufacturing process for a liquid ejection substrate according to a second embodiment. [Figure 14] 10A to 10C are diagrams illustrating an example of a manufacturing process for a liquid ejection substrate according to a second embodiment. [Figure 15] 10A to 10C are diagrams illustrating an example of a manufacturing process for a liquid ejection substrate according to a second embodiment. [Figure 16] 11A to 11C are diagrams illustrating an example of a manufacturing process for a liquid ejection substrate according to a third embodiment. [Figure 17] 11A to 11C are diagrams illustrating an example of a manufacturing process for a liquid ejection substrate according to a third embodiment. [Figure 18] 11A to 11C are diagrams illustrating an example of a manufacturing process for a liquid ejection substrate according to a third embodiment. [Figure 19] 11A to 11C are diagrams illustrating an example of a manufacturing process for a liquid ejection substrate according to a third embodiment. [Figure 20] 11A to 11C are diagrams illustrating an example of a manufacturing process for a liquid ejection substrate according to a third embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. Note that the following embodiments do not limit the scope of the present disclosure. Although multiple features are described in the following embodiments, not all of these multiple features are necessarily essential, and multiple features may be combined in any manner. Furthermore, in the accompanying drawings, the same reference numerals are used for the same or similar configurations, and duplicated descriptions are omitted.

[0009] [Embodiment 1] FIG. 1 is a perspective view showing an example of the appearance of a liquid ejection head 1 according to the first embodiment. Specifically, FIG. 1(a) is a perspective view showing the exterior of a liquid ejection head 1 on which only one liquid ejection substrate 100 is mounted. Also, FIG. 1(b) is a perspective view showing the exterior of a liquid ejection head 1, which is called a line head, on which a plurality of liquid ejection substrates 100 are mounted. Note that FIG. 1(b) shows the liquid ejection head 1 on which five liquid ejection substrates 100 are mounted as an example, but the number of liquid ejection substrates 100 is not limited to five, and may be four or less, or six or more. For example, the liquid ejection head 1 is mounted in a liquid ejection device such as a printer not shown in FIG. 1, and the liquid ejection device forms an image or the like on a recording medium such as paper by ejecting liquid such as ink from the liquid ejection head 1.

[0010] Prior to the description of the liquid ejection head 1, a general liquid ejection head (hereinafter referred to as a "general head") will be described as a comparative example in which the configuration of this embodiment is not applied, with reference to Figs. 2 and 3. The structure of the general head will be described with reference to Fig. 2. Fig. 2 is a diagram showing an example of the structure of the general head. Specifically, Fig. 2(a) is a perspective view showing a liquid ejection substrate (hereinafter referred to as a "general substrate") 200 assembled to the general head, and is a perspective view showing a cut-out portion of the general substrate 200. Fig. 2(b) is a cross-sectional view showing the general substrate 200, and is a cross-sectional view of the AA' cross section shown in Fig. 2(a) as viewed from the direction of the arrow 220. The common flow path 204 is a flow path that supplies liquid to the individual supply path 205. The common flow path 204 is formed by a wall portion 201 and a substrate 202. The wall portion 201 and the substrate 202 may be integral. The wall portion 201 and the substrate 202 are formed of a material such as silicon.

[0011] The individual supply path 205 is a flow path that communicates with the common flow path 204 and the ejection port 206 and supplies the liquid supplied from the common flow path 204 to the ejection port 206. The energy generating element 203 is a member that generates energy for ejecting liquid from the ejection port 206, and is fixed to the substrate 202 on the side opposite the ejection port 206 on the substrate 202 side. Electrical wiring (not shown in Fig. 2) is drawn out from the general head. This electrical wiring transmits a signal for ejecting liquid from a desired ejection port 206 in the general substrate 200 based on a signal from the liquid ejection device when the general head is mounted on a liquid ejection device such as a printer.

[0012] Some general heads have two flow paths connected to one ejection port 206, such as the general substrate 200 shown as an example in FIG. 2(c). One of the two flow paths is an individual supply path 205 that supplies the liquid supplied from the common flow path 204 to the ejection port 206, and the other is a flow path (hereinafter referred to as an "individual recovery path") 207 for returning a part of the liquid supplied from the individual supply path 205 to the common flow path 204. By having the individual supply path 205 and the individual recovery path 207, circulation of the liquid is possible, and by circulating the liquid, even if the liquid has a high viscosity, the liquid can be ejected from the ejection port 206. Hereinafter, the structure for circulating the liquid by the individual supply path 205 and the individual recovery path 207 is referred to as a circulation structure.

[0013] The behavior of the air bubble 309 generated in the general substrate 200 will be described with reference to FIG. 3. FIG. 3 is a diagram for explaining an example of the behavior of the air bubble 309 generated in the general substrate 200. FIG. 3(a) is a diagram showing an initial state of the air bubble 309 in the general substrate 200. As shown as an example in FIG. 3(a), in the initial state, the minute air bubble 309 is attached to the wall surface of the common flow path 204 or the individual supply path 205. FIG. 3(b) is a diagram showing a state of the air bubble 309 in the general substrate 200 after a predetermined period has elapsed from the state of FIG. 3(a). As shown as an example in FIG. 3(b), the air bubble 309 gradually grows larger by being deposited on the wall surface of the common flow path 204 or the individual supply path 205, or by integrating a plurality of air bubbles.

[0014] FIG. 3(c) is a diagram showing the state of the air bubble 309 in the general substrate 200 after a predetermined period of time has elapsed from the state of FIG. 3(b). As shown as an example in FIG. 3(c), the air bubble 309 grows to a size that covers the inlets of the individual supply paths 205 (hereinafter referred to as "individual supply ports"), i.e., the junctions between the common flow path 204 and the individual supply paths 205, by repeating further deposition or integration from the state of FIG. 3(b). FIG. 3(d) is a diagram showing the state of the air bubble 309 in the general substrate 200 after a predetermined period of time has elapsed from the state of FIG. 3(c). As a result of the air bubble 309 growing to a size that covers the multiple individual supply ports, the air bubble 309 may block the multiple individual supply ports, as shown as an example in FIG. 3(d).

[0015] FIG. 3(e) is a diagram showing the state of the air bubble 309 in the general substrate 200 when the air bubble 309 is mixed into the common flow path 204 from outside the common flow path 204. FIG. 3(f) is a diagram showing the state of the air bubble 309 in the general substrate 200 after a predetermined period has elapsed since the state of FIG. 3(e). When a large air bubble 309 is mixed into the common flow path 204 from outside the common flow path 204, as shown as an example in FIG. 3(e), the air bubble 309 may block a plurality of individual supply ports, as shown as an example in FIG. 3(f). When the individual supply port is blocked by the air bubble 309, liquid is not supplied to the discharge port 206 communicating with the individual supply path 205 corresponding to the individual supply port, and thus non-discharge occurs at the discharge port 206. Therefore, when air bubbles 309 block a plurality of individual supply ports as shown in FIG. 3(d) or (f) as an example, non-discharge occurs in a plurality of adjacent discharge ports 206 that communicate with these individual supply ports. As a result, in the case shown in FIG. 3(d) or (f) as an example, the quality of an image formed on a recording medium by discharging liquid is degraded. Generally, when a single discharge port fails to discharge, the failure is compensated for by using an adjacent discharge port. However, when adjacent discharge ports fail to discharge, it is difficult to compensate for the failure, and as a result, the quality of an image is degraded.

[0016] The structure of the liquid ejection head 1 will be described with reference to FIG. 4. FIG. 4 is a diagram showing an example of the structure of the liquid ejection head 1 according to the first embodiment. Specifically, FIG. 4(a) is a perspective view showing the liquid ejection substrate 100 assembled to the liquid ejection head 1, and is a perspective view showing a cut-out portion of the liquid ejection substrate 100. FIG. 4(b) is a cross-sectional view showing the liquid ejection substrate 100, and is a cross-sectional view of the AA' cross-section shown in FIG. 4(a) as seen from the direction of the arrow 420. FIG. 4(c) is a cross-sectional view showing the liquid ejection substrate 100, and is a cross-sectional view of the BB' cross-section shown in FIG. 4(a) as seen from the direction of the arrow 421. Hereinafter, in the configuration of the liquid ejection substrate 100, the same components as those of the general substrate 200 are denoted by the same reference numerals, and description thereof will be omitted.

[0017] The liquid ejection substrate 100 is obtained by adding a convex portion 401 to the general substrate 200, as compared with the general substrate 200. The convex portion 401 is a structure formed on the substrate 202 between the first individual supply port and the second individual supply port so as to protrude from the wall surface forming the common flow path 204 towards the common flow path 204. Here, the first individual supply port and the second individual supply port are the inlets of the individual supply paths 205 in which the ejection ports 206 communicating with each other are adjacent to each other.

[0018] The liquid ejection substrate 100 may include an individual recovery path 207 and a circulation structure made up of the individual supply path 205 and the individual recovery path 207, as shown in Fig. 4(d) as an example. When the liquid ejection substrate 100 includes a circulation structure, the liquid ejection substrate 100 has an outlet of the individual recovery path 207 (hereinafter referred to as an "individual recovery port") between the inlet of the first individual supply path 205-1 and the inlet of the second individual supply path 205-2, as shown in Fig. 4(d). Here, the individual recovery port is a junction between the common flow path 204 and the individual recovery path 207.

[0019] In the liquid ejection substrate 100 shown in FIG. 4(d), a convex portion 401-1 is formed on the wall surface of the substrate 202 between the inlet of the first individual supply path 205-1 and the individual recovery port, which forms the common flow path 204. Similarly, a convex portion 401-2 is formed on the wall surface of the substrate 202 between the inlet of the second individual supply path 205-2 and the individual recovery port, which forms the common flow path 204. However, the liquid ejection substrate 100 shown in FIG. 4(d) is merely an example, and is not limited thereto. For example, the convex portion 401 may be formed on at least one of the substrate 202 between the inlet of the first individual supply path 205-1 and the individual recovery port, and the substrate 202 between the inlet of the second individual supply path 205-2 and the individual recovery port.

[0020] The behavior of the air bubble 509 generated on the liquid ejection substrate 100 will be described with reference to FIG. 5. FIG. 5 is a diagram for explaining an example of the behavior of the air bubble 509 generated on the liquid ejection substrate 100 assembled to the liquid ejection head 1 according to the first embodiment. FIG. 5(a) is a diagram showing the initial state of the air bubble 309 on the liquid ejection substrate 100. As shown as an example in FIG. 5(a), in the initial state, a minute air bubble 509 is attached to the wall surface of the common flow path 204, the individual supply path 205, the convex portion 401, or the like. FIG. 5(b) is a diagram showing the state of the air bubble 509 on the liquid ejection substrate 100 after a predetermined period has elapsed from the state of FIG. 5(a). As shown as an example in FIG. 5(b), the air bubble 509 gradually grows larger by being deposited on the wall surface of the common flow path 204, the individual supply path 205, the convex portion 401, or the like, or by a plurality of air bubbles being integrated together.

[0021] FIG. 5(c) is a diagram showing the state of the air bubble 509 in the liquid ejection substrate 100 after a predetermined period of time has elapsed from the state of FIG. 5(b). As shown as an example in FIG. 5(c), the air bubble 509 grows to a size large enough to block the inlet (individual supply port) of the individual supply path 205 by repeating further deposition or integration from the state of FIG. 5(b). FIG. 5(d) is a diagram showing the state of the air bubble 509 in the liquid ejection substrate 100 after a predetermined period of time has elapsed from the state of FIG. 5(c). As a result of the air bubble 509 growing to a size that covers the individual supply port, the air bubble 509 may block one individual supply port, as shown as an example in FIG. 5(d). However, the presence of the convex portion 401 makes it possible to prevent one air bubble 509 from blocking multiple individual supply ports as in FIG. 3(d).

[0022] FIG. 5(e) is a diagram showing the state of the air bubble 509 in the liquid ejection substrate 100 when the air bubble 509 is mixed into the common flow path 204 from outside the common flow path 204. FIG. 5(f) is a diagram showing the state of the air bubble 509 in the liquid ejection substrate 100 after a predetermined period has elapsed since the state of FIG. 5(e). As shown as an example in FIG. 5(e), when a large air bubble 509 is mixed into the common flow path 204 from outside the common flow path 204, the presence of the convex portion 401 can prevent the air bubble 509 from blocking the individual supply port, as shown as an example in FIG. 5(f). Therefore, as shown as an example in FIG. 5(d) or (f), the air bubble 509 does not block multiple individual supply ports at the same time, and therefore it is possible to prevent the occurrence of non-ejection in multiple ejection ports 206 adjacent to each other. As a result, it is possible to prevent the quality of an image formed on a recording medium by ejecting liquid from being reduced.

[0023] The height of the convex portion 401 is preferably L / 2 or more with respect to the pitch L between the individual supply ports. By making the height of the convex portion 401 L / 2 or more, it is possible to effectively prevent air bubbles from blocking the individual supply ports. In addition, it is preferable that the height of the convex portion 401 does not exceed the length H of the common flow channel 204 in a direction perpendicular to the substrate 202 (the direction of the arrow 510 shown in FIG. 5(f)). By making the height of the convex portion 401 not exceed the length H, it is possible to prevent an increase in flow resistance in the common flow channel 204, and as a result, it is possible to maintain the refillability, which is a basic performance of liquid ejection. In addition, it is preferable that the width of the convex portion 401 is M / 2 or less with respect to the width M of the common flow channel 204 in a direction horizontal to the substrate 202. By making the width of the convex portion 401 M / 2 or less, it is possible to prevent an increase in flow resistance in the common flow channel 204, and as a result, it is possible to maintain the refillability, which is a basic performance of liquid ejection.

[0024] In addition, the position or shape of the convex portion 401 is preferably determined based on the material of the convex portion 401, the viscosity of the liquid, or the flow rate of the common flow path. FIG. 6 is a diagram showing an example of the flow of liquid in the general substrate 200 assembled to the general head. For example, the speed of supply of the liquid to the individual supply path 205 may be slow when the viscosity of the liquid is high or the flow rate of the liquid in the common flow path 204 is slow. In such a case, as shown as an example in FIG. 6, the liquid is most likely to stagnate in the center vicinity 601 between the individual supply ports in the common flow path 204. Therefore, it is preferable to arrange the convex portion 401 in the center between two adjacent individual supply ports, or to fill the center vicinity 601. By arranging the convex portion 401 in such a position, it is possible to suppress an increase in flow resistance.

[0025] 7(a) is a diagram showing the shape of the convex portion 401 according to the first embodiment, and is a diagram showing an example of a shape different from the shape of the convex portion 401 shown in FIG. 4. The convex portion 401 may have a shape that narrows with increasing distance from the substrate 202, as shown in FIG. 7(a) as an example. The convex portion 401 having such a shape can be easily molded from a resin material such as a photosensitive resin. By configuring the shape of the convex portion 401 so that the width narrows with increasing distance from the substrate 202, stagnation of the liquid in the common flow path near the center between the individual supply ports can be further suppressed even when the speed of supplying the liquid to the individual supply path 205 is slow.

[0026] Also, for example, when the viscosity of the liquid is low, or when the flow rate of the liquid in the supply flow path is high due to the circulation structure of the individual supply path 205 and the individual recovery path 207 shown in FIG. 4(d), it is desirable to reduce the volume of the convex portion 401. In such a case, the increase in the flow resistance in the common flow path can be suppressed by reducing the volume of the convex portion 401. FIG. 7(b) is a diagram showing the shape of the convex portion 401 according to the first embodiment, and is a diagram showing an example of a shape different from the shape of the convex portion 401 shown in FIG. 4 and FIG. 7(a). Specifically, the convex portion 401 shown in FIG. 7(b) has a smaller volume than the convex portion 401 shown in FIG. 4 and FIG. 7(a). As shown as an example in FIG. 7(b), by making the convex portion 401 into a corrugated shape, the surface area can be increased even if the volume of the convex portion 401 is reduced. As a result, the adhesion of the air bubbles 509 to the convex portion 401 is improved, and the adhesion of the air bubbles 509 to the substrate 202 near the individual supply port can be reduced.

[0027] The convex portion 401 having such a shape can be easily made of a resin material such as silicone resin or a metal material. By making the convex portion 401 out of such a material, the strength of the convex portion 401 can be increased while maintaining the performance of the convex portion 401, compared to the convex portion 401 of the same volume made of other materials. In addition, when the convex portion 401 is made of silicone resin, the adhesion of air bubbles 509 to the convex portion 401 can be suppressed compared to other resin materials, so that the growth of the air bubbles 509 can be suppressed. Note that, although FIG. 7(b) shows the convex portion 401 having a corrugated shape as an example, the corrugated shape is merely an example, and the shape is not limited to the corrugated shape as long as it can increase the surface area of ​​the convex portion 401 compared to the flat plate-shaped convex portion 401.

[0028] 8 to 20, a method for manufacturing the liquid ejection substrate 100 according to the first embodiment will be described below. In the manufacturing method described below, the convex portion 401 is formed by patterning, and therefore the shape of the convex portion 401 can be formed into any shape. In the following description, the wall portion 201 and the substrate 202 are assumed to be formed from a silicon material.

[0029] <Example 1: When the protrusion 401 is made of silicon material> A manufacturing method of the liquid ejection substrate 100 according to the first embodiment will be described with reference to Figs. 8 to 11. The convex portion 401 in the liquid ejection substrate 100 according to the first embodiment is made of a silicon material, similar to the wall portion 201 and the substrate 202. Figs. 8 to 11 are diagrams showing an example of each state of the liquid ejection substrate 100 according to the first embodiment (hereinafter simply referred to as "liquid ejection substrate 100"). Figs. 8(a) and (b) show state 1 in the manufacturing process of the liquid ejection substrate 100, and Figs. 8(c) and (d), Figs. 8(e) and (f), and Figs. 8(g) and (h) show states 2, 3, and 4, respectively, in the manufacturing process of the liquid ejection substrate 100.

[0030] 9(a) and (b), 9(c) and (d), and 9(e) and (f) respectively show states 5, 6, and 7 in the manufacturing process of the liquid ejection substrate 100. Similarly, FIGS. 10(a) and (b), 10(c) and (d), and 10(e) and (f) respectively show states 8, 9, and 10 in the manufacturing process of the liquid ejection substrate 100. Similarly, FIGS. 11(a) and (b), 11(c) and (d), and 11(e) and (f) respectively show states 11, 12, and 13 in the manufacturing process of the liquid ejection substrate 100.

[0031] 8(a), (c), (e), and (g) each show an AA' cross section shown in FIG. 4 of each state in the manufacturing process of the liquid ejection substrate 100. Similarly, FIGS. 9(a), (c), and (e), FIGS. 10(a), (c), and (e), and FIGS. 11(a), (c), and (e), each show an AA' cross section shown in FIG. 4 of each state in the manufacturing process of the liquid ejection substrate 100. Also, FIGS. 8(b), (d), (f), and (h) each show a BB' cross section shown in FIG. 4 of each state in the manufacturing process of the liquid ejection substrate 100. Similarly, FIGS. 9(b), (d), and (f), FIGS. 10(b), (d), and (f), and FIGS. 11(b), (d), and (f), each show a BB' cross section shown in FIG. 4 of each state in the manufacturing process of the liquid ejection substrate 100.

[0032] First, as shown in state 1 in FIG. 8(a) and (b) as an example, a protective film 802 is attached to the surface (hereinafter referred to as the "first surface") of a silicon member 801 on which the energy generating element 203 is arranged. Note that, before the protective film 802 is attached, a circuit for driving and controlling the energy generating element 203 by an external signal is arranged in advance on the member 801. The member 801 will eventually become a part of the wall 201, the substrate 202, and the protruding portion 401. Next, as shown in state 2 in FIG. 8(c) and (d) as an example, a photoresist is applied to the surface (hereinafter referred to as the "second surface") on the back side of the first surface of the member 801, and the photoresist 803 is formed by patterning the photoresist. Next, as shown in state 3 in FIG. 8(e) and (f) as an example, the member 801 is etched to form the wall 201 and the protruding portion 401. Furthermore, the photoresist 803 is removed after etching the member 801. Note that state 3 is a state in which the photoresist 803 has been removed.

[0033] As shown in state 4 in Fig. 8(g) and (h) as an example, a photoresist is applied to one surface of a member 804 made of a silicon material, which is separate from the member 801, and the photoresist is patterned to form a photoresist 805. Next, as shown in state 5 in Fig. 9(a) and (b) as an example, the member 804 is etched to form a part of the wall portion 201. Note that the processing step of the member 804 in states 4 and 5 may be performed before the processing step of the member 801 in states 1 to 3, or may be performed in parallel with the processing step of the member 801 in states 1 to 3.

[0034] Next, as shown in state 6 in Figs. 9(c) and (d) as an example, the photoresist 805 is removed, and an adhesive is applied to a surface parallel to the first surface of at least one of the wall portion 201 shown in Fig. 8(f) and the wall portion 201 shown in Fig. 9(b). Furthermore, the member 801 and the member 804 are bonded together, and the adhesive is cured. State 7 shown in Figs. 9(e) and (f) as an example is a state in which the member 801 and the member 804 are bonded together, and the applied adhesive is cured. Note that "parallel" here is not limited to strictly parallel, but also includes approximately parallel. In the following description, "parallel" will be explained assuming that it also includes approximately parallel.

[0035] Next, as shown in state 8 in FIGS. 10(a) and (b), the portion of the member 804 other than the wall portion 201 is polished and removed to open the common flow path 204, thereby forming the common flow path 204. Next, as shown in state 9 in FIGS. 10(c) and (d), the protective film 802 attached to the first surface of the member 801, i.e., the surface of the substrate 202 on which the convex portion 401 is not formed, is peeled off, and photoresist is applied to this surface. Furthermore, the applied photoresist is patterned to form the photoresist 1001 as shown in state 9. Next, as shown in state 10 in FIGS. 10(e) and (f), the substrate 202 is etched to form the individual supply paths 205. Next, as shown in state 11 as an example in Figures 11(a) and (b), the photoresist 1001 is removed, and a dry film 1101 is attached as a flow path material to the first surface of the member 801, i.e., the surface of the substrate 202 on which the convex portion 401 is not formed.

[0036] Next, as shown in state 12 in FIG. 11(c) and (d), a latent image is applied to the dry film 1101 to form a portion 1102, and then a dry film 1103 is laminated on the dry film 1101 as an orifice plate material. Next, as shown in state 13 in FIG. 11(e) and (f), an ejection port 206 is formed by patterning. Furthermore, unnecessary portions of the dry film 1101 and the dry film 1103 are developed, and the flow path material and the orifice plate material are completely cured to form the liquid ejection substrate 100. Finally, the liquid ejection substrate 100 is cut out and assembled to the liquid ejection head 1 to complete the liquid ejection head 1. When a liquid ejection test was performed using the liquid ejection head 1 having the convex portion 401 made of a silicon material in this way, no event occurred in which adjacent ejection ports 206 failed to eject.

[0037] <Example 2: When the protrusion 401 is made of a resin material> A manufacturing method of the liquid ejection substrate 100 according to the second embodiment will be described with reference to Figs. 12 to 15. The convex portion 401 in the liquid ejection substrate 100 according to the second embodiment is formed of a resin material. Figs. 12 to 15 are diagrams showing an example of each state of the liquid ejection substrate 100 according to the second embodiment (hereinafter simply referred to as "liquid ejection substrate 100") during the manufacturing process. Figs. 12(a) and (b) show state 1 during the manufacturing process of the liquid ejection substrate 100, while Figs. 12(c) and (d), Figs. 12(e) and (f), and Figs. 12(g) and (h) show states 2, 3, and 4, respectively, during the manufacturing process of the liquid ejection substrate 100.

[0038] 13(a) and (b), 13(c) and (d), and 13(e) and (f) respectively show states 5, 6, and 7 in the manufacturing process of the liquid ejection substrate 100. Similarly, Figures 14(a) and (b), 14(c) and (d), and 14(e) and (f) respectively show states 8, 9, and 10 in the manufacturing process of the liquid ejection substrate 100. Similarly, Figures 15(a) and (b), 15(c) and (d), and 15(e) and (f) respectively show states 11, 12, and 13 in the manufacturing process of the liquid ejection substrate 100.

[0039] 12(a), (c), (e), and (g) each show an AA' cross section shown in FIG. 4 of each state in the manufacturing process of the liquid ejection substrate 100. Similarly, FIGS. 13(a), (c), and (e), FIGS. 14(a), (c), and (e), and FIGS. 15(a), (c), and (e), each show an AA' cross section shown in FIG. 4 of each state in the manufacturing process of the liquid ejection substrate 100. Also, FIGS. 12(b), (d), (f), and (h) each show a BB' cross section shown in FIG. 4 of each state in the manufacturing process of the liquid ejection substrate 100. Similarly, FIGS. 13(b), (d), and (f), FIGS. 14(b), (d), and (f), and FIGS. 15(b), (d), and (f), each show a BB' cross section shown in FIG. 4 of each state in the manufacturing process of the liquid ejection substrate 100.

[0040] First, as shown in state 1 as an example in FIGS. 12(a) and (b), a protective film 802 is attached to the surface (first surface) of a silicon member 801 on which the energy generating element 203 is arranged. Note that, before the protective film 802 is attached, a circuit for driving and controlling the energy generating element 203 by an external signal is arranged in the member 801. State 1 as an example shown in FIGS. 12(a) and (b) is the same as state 1 as an example shown in FIGS. 8(a) and (b). Next, as shown in state 2 as an example in FIGS. 12(c) and (d), the member 801 is polished and thinned from the surface (second surface) on the back side of the first surface of the member 801, and a part of the wall portion 201 and the substrate 202 are formed.

[0041] Next, as shown in state 3 in Fig. 12(e) and (f) as an example, resin material 1201 that will be the structural material of protrusion 401 is applied to a surface parallel to the first surface of the polished portion of member 801. For example, resin material 1201 is applied so that the thickness of resin material 1201 is L / 2 or more. After resin material 1201 is cured, as shown in state 4 in Fig. 12(g) and (h) as an example, protrusion 401 made of resin is formed by patterning applied resin material 1201.

[0042] Next, as shown in state 5 in FIGS. 13(a) and (b) as an example, a photoresist is applied to one surface of a member 804 made of a silicon material, which is different from the member 801, and the photoresist is patterned to form a photoresist 805. Furthermore, the member 804 is etched to form a part of the wall portion 201 as shown in state 5. Note that state 5 shown in FIGS. 13(a) and (b) as an example is the same state as state 5 shown in FIGS. 9(a) and (b) as an example. Note that the processing step of the member 804 in state 5 may be performed before the processing step of the member 801 and the forming step of the convex portion 401 in states 1 to 4, or may be performed in parallel with the processing step of the member 801 and the forming step of the convex portion 401 in states 1 to 4.

[0043] Next, as shown in state 6 in Figures 13(c) and (d) as an example, the photoresist 805 is removed, and an adhesive is applied to a surface parallel to the first surface of at least one of the wall portion 201 shown in Figure 12(h) and the wall portion 201 shown in Figure 13(b). Furthermore, the members 801 and 804 are bonded together, and the adhesive is cured. State 7 in Figures 13(e) and (f) as an example is a state in which the members 801 and 804 are bonded together, and the applied adhesive is cured.

[0044] Next, as shown in state 8 in FIGS. 14(a) and (b) as an example, the portion of the member 804 other than the wall portion 201 is polished and removed to open the common flow path 204, thereby forming the common flow path 204. Next, as shown in state 9 in FIGS. 14(c) and (d) as an example, the protective film 802 attached to the first surface of the member 801, i.e., the surface of the substrate 202 on which the convex portion 401 is not formed, is peeled off, and photoresist is applied to this surface. Furthermore, the applied photoresist is patterned to form the photoresist 1001 as shown in state 9. Next, as shown in state 10 in FIGS. 14(e) and (f) as an example, the substrate 202 is etched to form the individual supply paths 205. Next, as shown in state 11 as an example in Figures 15(a) and (b), the photoresist 1001 is removed, and a dry film 1101 is attached as a flow path material to the first surface of the member 801, i.e., the surface of the substrate 202 on which the convex portion 401 is not formed.

[0045] Next, as shown in state 12 in FIG. 15(c) and (d), a latent image is applied to the dry film 1101 to form a portion 1102, and then a dry film 1103 is laminated on the dry film 1101 as an orifice plate material. Next, as shown in state 13 in FIG. 15(e) and (f), an ejection port 206 is formed by patterning. Furthermore, unnecessary portions of the dry film 1101 and the dry film 1103 are developed, and the flow path material and the orifice plate material are completely cured to form the liquid ejection substrate 100. Finally, the liquid ejection substrate 100 is cut out and assembled to the liquid ejection head 1 to complete the liquid ejection head 1. When a liquid ejection test was performed using the liquid ejection head 1 having the convex portion 401 made of a resin material in this way, no event occurred in which adjacent ejection ports 206 failed to eject.

[0046] <Example 3: When the protrusion 401 is made of a metal material> A manufacturing method of the liquid ejection substrate 100 according to the third embodiment will be described with reference to Figs. 16 to 20. The convex portion 401 in the liquid ejection substrate 100 according to the first embodiment is formed of a metal material. Figs. 16 to 20 are diagrams showing an example of each state of the liquid ejection substrate 100 according to the third embodiment (hereinafter simply referred to as "liquid ejection substrate 100") during the manufacturing process. Figs. 16(a) and (b) show state 1 during the manufacturing process of the liquid ejection substrate 100, while Figs. 16(c) and (d), Figs. 16(e) and (f), and Figs. 16(g) and (h) show states 2, 3, and 4, respectively, during the manufacturing process of the liquid ejection substrate 100.

[0047] 17(a) and (b), 17(c) and (d), 17(e) and (f), and 17(g) and (h) respectively show states 5, 6, 7, and 8 in the manufacturing process of the liquid ejection substrate 100. Similarly, Figures 18(a) and (b), 18(c) and (d), and 18(e) and (f) respectively show states 9, 10, and 11 in the manufacturing process of the liquid ejection substrate 100. Similarly, Figures 19(a) and (b), 19(c) and (d), and 19(e) and (f) respectively show states 12, 13, and 14 in the manufacturing process of the liquid ejection substrate 100. Similarly, FIGS. 20(a) and (b), (c) and (d), and (e) and (f) show states 15, 16, and 17, respectively, in the manufacturing process of the liquid ejection substrate 100.

[0048] 16(a), (c), (e), and (g), and 17(a), (c), (e), and (g), respectively, show the AA' cross section shown in FIG. 4 of each state in the manufacturing process of the liquid ejection substrate 100. Similarly, FIG. 18(a), (c), and (e), FIG. 19(a), (c), and (e), and FIG. 20(a), (c), and (e), respectively, show the AA' cross section shown in FIG. 4 of each state in the manufacturing process of the liquid ejection substrate 100. Furthermore, FIG. 16(b), (d), (f), and (h), and FIG. 17(b), (d), (f), and (h), respectively, show the BB' cross section shown in FIG. 4 of each state in the manufacturing process of the liquid ejection substrate 100. Similarly, Figures 18(b), (d), and (f), Figures 19(b), (d), and (f), and Figures 20(b), (d), and (f), each show a BB' cross section shown in Figure 4 at each state during the manufacturing process of the liquid ejection substrate 100.

[0049] First, as shown in state 1 in Fig. 16(a) and (b) as an example, a protective film 802 is attached to the surface (first surface) of a silicon material member 801 on which the energy generating element 203 is arranged. Note that, before the protective film 802 is attached, a circuit for driving and controlling the energy generating element 203 by an external signal is arranged in advance on the member 801. State 1 shown in Fig. 16(a) and (b) as an example is the same state as state 1 shown in Fig. 8(a) and (b) or Fig. 12(a) and (b) as an example. Next, as shown in state 2 in Fig. 16(c) and (d) as an example, the member 801 is polished and thinned from the surface (second surface) on the back side of the first surface of the member 801, and a part of the wall portion 201 and the substrate 202 are formed. It should be noted that the state 2 shown as an example in FIGS. 16(c) and (d) is the same as the state 2 shown as an example in FIGS. 12(c) and (d).

[0050] Next, as shown in state 3 in FIG. 16(e) and (f) as an example, a metal 1601 such as copper that will be a part of the structural material of the protrusion 401 is evaporated on a surface parallel to the first surface of the polished portion of the member 801. After the metal 1601 is hardened, as shown in state 4 in FIG. 16(g) and (h) as an example, a seed layer 1602 of electroless nickel plating is patterned on the metal 1601. Next, as shown in state 5 in FIG. 17(a) and (b) as an example, the metal 1601 is patterned, and the seed layer 1602 is removed after patterning. Next, as shown in state 6 in FIG. 17(c) and (d) as an example, a photoresist is applied to the surface of the substrate 202 on which the metal 1601 is evaporated. Furthermore, the applied photoresist is patterned to form a photoresist 1701 as shown in state 6.

[0051] Next, as shown in state 7 in Fig. 17(e) and (f), at least the surface of substrate 202 on which photoresist 1701 has been formed is immersed in a metal liquid such as an electroless nickel liquid to form film 1702 of the metal liquid with metal 1601 as a nucleus. In this way, metal 1601 and film 1702 of the metal liquid form protruding portion 401 of the metal material. Next, as shown in state 8 in Fig. 17(g) and (h), photoresist 1701 is peeled off.

[0052] Next, as shown in state 9 in Figs. 18(a) and (b) as an example, a photoresist is applied to one surface of a member 804 made of silicon material, which is different from the member 801, and the photoresist is patterned to form a photoresist 805. Furthermore, the member 804 is etched to form a part of the wall portion 201 as shown in state 5. Note that state 9 shown in Figs. 18(a) and (b) as an example is the same state as state 5 shown in Figs. 9(a) and (b) or Figs. 13(a) and (b) as an example. Note that the processing step of the member 804 in state 9 may be performed before the processing step of the member 801 and the forming step of the convex portion 401 in states 1 to 8, or may be performed in parallel with the processing step of the member 801 and the forming step of the convex portion 401 in states 1 to 8.

[0053] Next, as shown in state 10 in Figs. 18(c) and (d) as an example, the photoresist 805 is removed, and an adhesive is applied to a surface parallel to the first surface of at least one of the wall portion 201 shown in Fig. 17(h) and the wall portion 201 shown in Fig. 18(b). Furthermore, the member 801 and the member 804 are bonded together, and the adhesive is cured. As shown in state 11 in Figs. 18(e) and (f) as an example, the member 801 and the member 804 are bonded together, and the applied adhesive is cured. Next, as shown in state 12 in Figs. 19(a) and (b) as an example, the portion of the member 804 other than the wall portion 201 is polished and removed, and the common flow path 204 is opened, and the common flow path 204 is formed. 19(c) and (d), the protective film 802 attached to the first surface of the member 801, i.e., the surface of the substrate 202 on which the convex portion 401 is not formed, is peeled off, and a photoresist is applied to this surface. Furthermore, the applied photoresist is patterned to form a photoresist 1001 as shown in state 13.

[0054] Next, as shown in state 14 in Fig. 19(e) and (f) as an example, the substrate 202 is etched to form the individual supply paths 205. Next, as shown in state 15 in Fig. 20(a) and (b) as an example, the photoresist 1001 is removed, and a dry film 1101 is attached as a flow path material to the first surface of the member 801, that is, the surface of the substrate 202 on which the convex portion 401 is not formed. Next, as shown in state 16 in Fig. 20(c) and (d) as an example, the dry film 1101 is latent-imaged to form the portion 1102, and further, a dry film 1103 is attached as an orifice plate material by being superimposed on the dry film 1101.

[0055] Next, the ejection ports 206 are formed by patterning, as shown in state 17 in Figures 20(e) and (f) as an example. Furthermore, unnecessary portions of the dry films 1101 and 1103 are developed, and the flow path material and the orifice plate material are fully cured to form the liquid ejection substrate 100. Finally, the liquid ejection substrate 100 is cut out and assembled to the liquid ejection head 1, thereby completing the liquid ejection head 1. When a liquid ejection test was performed using the liquid ejection head 1 having the convex portion 401 made of a metal material in this way, no event occurred in which adjacent ejection ports 206 failed to eject.

[0056] In addition, in the present disclosure, any component of the embodiments may be modified or any component of the embodiments may be omitted within the scope of the disclosure.

[0057] [Configuration of this disclosure] <Configuration 1> A liquid ejection substrate to be assembled to a liquid ejection head, A plurality of discharge ports for discharging liquid; a plurality of individual supply paths corresponding to the plurality of ejection ports, the individual supply paths supplying the liquid to the plurality of ejection ports; a common flow path that supplies the liquid to each of the plurality of individual supply paths; a first individual supply port which is a junction between the common flow path and a first individual supply path which supplies the liquid to a first ejection port, and a second individual supply port which is a junction between the common flow path and a second individual supply path which supplies the liquid to a second ejection port adjacent to the first ejection port; and a convex portion formed on a wall surface which forms the common flow path between the first individual supply port and the common flow path; Having A liquid ejection substrate comprising:

[0058] <Configuration 2> an energy generating element corresponding to each of the plurality of ejection ports, the energy generating element being a member that generates energy for ejecting the liquid from the ejection port; Further possessing 2. The liquid ejection substrate according to claim 1,

[0059] <Configuration 3> the first individual supply port and the second individual supply port are adjacent to each other, the protrusion is formed on the wall surface that forms the common flow path between the first individual supply port and the second individual supply port that are adjacent to each other; 3. The liquid ejection substrate according to configuration 1 or 2,

[0060] <Configuration 4> an individual recovery path corresponding to each of the plurality of individual supply paths, the individual recovery path being for returning the liquid supplied to the individual supply paths to the common flow path; Further possessing 4. The liquid ejection substrate according to any one of configurations 1 to 3, characterized in that:

[0061] <Component 5> When an individual recovery port that is a joint between the common flow path and the individual recovery path is present between the first individual supply port and the second individual supply port, the convex portion is formed on at least one of the wall surface that forms the common flow path between the first individual supply port and the individual recovery port and the wall surface that forms the common flow path between the second individual supply port and the individual recovery port. 5. The liquid ejection substrate according to configuration 4,

[0062] <Component 6> When a distance between the first individual supply port and the second individual supply port located closest to the first individual supply port is defined as L, the protruding portion has a height equal to or greater than a value obtained by dividing L by 2. 6. The liquid ejection substrate according to any one of configurations 1 to 5,

[0063] <Component 7> The convex portion is formed of the same material as the substrate on which the individual supply paths are formed. 7. The liquid ejection substrate according to any one of configurations 1 to 6,

[0064] <Component 8> The convex portion is formed of a material different from that of the substrate on which the individual supply paths are formed. 7. The liquid ejection substrate according to any one of configurations 1 to 6,

[0065] <Component 9> The protrusion is made of a resin material. 9. The liquid ejection substrate according to any one of configurations 1 to 8,

[0066] <Component 10> The convex portion is made of a silicone resin. 10. The liquid ejection substrate according to configuration 9,

[0067] <Component 11> The protrusion is made of a metal material. 9. The liquid ejection substrate according to any one of configurations 1 to 8,

[0068] <Component 12> The convex portion has a shape in which its width becomes narrower as it moves away from the wall surface. 12. The liquid ejection substrate according to any one of configurations 1 to 11,

[0069] <Component 13> The convex portion has a wave shape. 12. The liquid ejection substrate according to any one of configurations 1 to 11,

[0070] <Component 14> A liquid ejection substrate according to any one of configurations 1 to 13, Having A liquid ejection head comprising:

[0071] <Component 15> A liquid ejection head according to configuration 14. Having A liquid ejection device comprising: [Explanation of symbols]

[0072] 1 Liquid ejection head 100 Liquid discharge board 204 Common Channel 205 Individual supply route 206 Discharge port 401 Convex

Claims

1. A liquid discharge substrate assembled to a liquid discharge head, comprising: a plurality of discharge ports for discharging a liquid; a plurality of individual supply paths corresponding to each of the plurality of discharge ports, the plurality of individual supply paths for supplying the liquid to each of the plurality of discharge ports; a common flow path for supplying the liquid to each of the plurality of individual supply paths; a first individual supply port which is a junction of a first individual supply path for supplying the liquid to a first discharge port and the common flow path, and a wall surface forming the common flow path between the first individual supply port and a second individual supply port which is a junction of a second individual supply path for supplying the liquid to a second discharge port adjacent to the first discharge port and the common flow path, and a convex portion formed on the wall surface; having; when the distance between the first individual supply port and a second individual supply port at the position closest to the first individual supply port is L, the convex portion has a height equal to or greater than a value obtained by dividing L by 2 A liquid discharge substrate characterized by the above.

2. An energy generating element corresponding to each of the plurality of discharge ports, the energy generating element being a member that generates energy for discharging the liquid from the discharge port, further comprising The liquid discharge substrate according to claim 1, characterized by the above.

3. The first individual supply port and the second individual supply port are adjacent to each other, The convex portion is formed on the wall surface forming the common flow path between the first individual supply port and the second individual supply port adjacent to each other The liquid discharge substrate according to claim 1, characterized by the above.

4. An individual recovery path corresponding to each of the plurality of individual supply paths, the individual recovery path for returning the liquid supplied to the individual supply path to the common flow path, further comprising The liquid discharge substrate according to claim 1, characterized by the above.

5. When there is an individual recovery port which is a junction of the common flow path and the individual recovery path between the first individual supply port and the second individual supply port, the convex portion is formed on at least one of the wall surface forming the common flow path between the first individual supply port and the individual recovery port and the wall surface forming the common flow path between the second individual supply port and the individual recovery port The liquid discharge substrate according to claim 4, characterized by the above.

6. The convex portion is formed of the same material as the substrate on which the individual supply path is formed The liquid discharge substrate according to claim 1, characterized by the above.

7. The convex portion is formed of a material different from the material of the substrate on which the individual supply paths are formed. The liquid discharge substrate according to claim 1, characterized in that.

8. The convex portion is formed of a resin material. The liquid discharge substrate according to claim 1, characterized in that.

9. The convex portion is formed of a silicone resin. The liquid discharge substrate according to claim 8, characterized in that.

10. The convex portion is formed of a metal material. The liquid discharge substrate according to claim 1, characterized in that.

11. The convex portion has a shape in which the width becomes narrower as it moves away from the wall surface. The liquid discharge substrate according to claim 1, characterized in that.

12. The convex portion has a corrugated shape. The liquid discharge substrate according to claim 1, characterized in that.

13. The liquid discharge substrate according to any one of claims 1 to 12. Having A liquid discharge head, characterized in that.

14. The liquid discharge head according to claim 13. Having A liquid discharge device, characterized in that.

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