Negative photosensitive polymer, polymer solution, negative photosensitive resin composition, cured film, and semiconductor device

JP2024022630A5Pending Publication Date: 2025-04-14SUMITOMO BAKELITE CO LTD
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Patent Information

Application Number
JP2023203906
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2022-02-10
Filing Date
2023-12-01
Publication Date
2025-04-14

AI Technical Summary

Technical Problem

Conventional negative photosensitive polymers experience a decrease in mechanical strength due to hydrolysis and require improved solubility in common solvents used in varnishes.

Method used

A negative photosensitive polymer with a specific structural unit containing an imide ring and a group at both ends, where the average positive charge of the carbonyl carbons is 0.095 or less, ensuring excellent solubility in organic solvents and resistance to hydrolysis, without incorporating fluorine atoms.

Benefits of technology

The polymer maintains excellent mechanical strength and solubility, suppressing hydrolysis and reducing mechanical strength degradation, while allowing for effective use in semiconductor devices.

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Patent Text Reader

Abstract

To provide a negative photosensitive polymer that has excellent solubility in organic solvents and can form cured products such as films which inhibit hydrolysis and reduction in mechanical strength such as elongation.SOLUTION: A negative photosensitive polymer is solvent-soluble, comprises a structural unit comprising an imide ring, and comprises a group represented by general formula (t) on at least one of both termini. The average value of a positive charge (δ+) of two carbonyl carbon atoms of the imide ring, as calculated by a charge equilibration method, is 0.095 or less.SELECTED DRAWING: None
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