Vibration element and crystal wafer

Abstract

To provide a vibration element and a crystal wafer, capable of maintaining an excellent vibration characteristic.SOLUTION: A vibration element comprises: an AT cut quartz substrate that is along a X shaft and a Z' shaft of a quartz crystal, has a first surface 11 and a second surface 12 having a rear relation, and a side surface connecting the first surface 11 and the second surface 12; a first vibration electrode 21 that is arranged to the first surface 11; a first leading electrode 23 that is arranged to the first surface 11 and is connected to the first vibration electrode 21; a second vibration electrode that is arranged to the second surface 12; and a second leading electrode 24 that is arranged to the second surface 12, and is connected to the second vibration electrode. The side surface contains: a first side surface 13 that is positioned on one side in a direction of the X shaft; and a second side surface 14 and a third side surface 15 that are crossed to the first side surface 13. At least one of the first leading electrode 23 and the second leading electrode 24 is arranged so as to be extended to the first side surface 13. At least one of the second side surface 14 and the third side surface 15 includes a broken-out section.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a vibration element and a quartz crystal wafer. [Background technology]

[0002] Patent Document 1 discloses that a wafer in which a plurality of vibrating bars are connected to a support frame via breakaway portions is cut to separate the plurality of vibrating bars. The wafer includes an excitation electrode and an extraction electrode connected to the excitation electrode. The extraction electrode is routed via the side surface on which the breakaway portions are formed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2016-152476 A Summary of the Invention [Problem to be solved by the invention]

[0004] However, in the technology described in Patent Document 1, since the extraction electrode and the broken portion are on the same side, there is a risk that the routed portion of the extraction electrode may peel off when the vibrating piece is singulated. Furthermore, if the broken portion is in the direction in which the vibrating piece slides and vibrates, there is a problem that burrs or the like formed by cutting may affect the vibration characteristics. [Means for solving the problem]

[0005] The vibration element is aligned along the X-axis and Z'-axis of a quartz crystal and comprises an AT-cut quartz substrate having a first surface and a second surface which are in a front-back relationship, and a side surface connecting the first surface and the second surface, a first excitation electrode arranged on the first surface, a first extraction electrode arranged on the first surface and connected to the first excitation electrode, a second excitation electrode arranged on the second surface, and a second extraction electrode arranged on the second surface and connected to the second excitation electrode, the side surfaces including a first side surface located on one side in the direction of the X-axis, and a second side surface and a third side surface which intersect with the first side surface, at least one of the first extraction electrode and the second extraction electrode being arranged to extend onto the first side surface, and at least one of the second side surface and the third side surface having a fracture surface.

[0006] The quartz crystal wafer is provided with an AT-cut quartz crystal substrate having a first surface and a second surface that are in a front-back relationship along the X-axis and Z'-axis of a quartz crystal, and a side surface connecting the first surface and the second surface, a plurality of vibration elements each having a first excitation electrode arranged on the first surface, a first extraction electrode arranged on the first surface and connected to the first excitation electrode, a second excitation electrode arranged on the second surface, and a second extraction electrode arranged on the second surface and connected to the second excitation electrode, a support frame, and a plurality of holding parts connecting the vibration elements and the support frame, the side surfaces of the vibration elements including a first side surface located on one side in the direction of the X-axis, and a second side surface and a third side surface intersecting the first side surface, at least one of the first extraction electrode and the second extraction electrode being arranged to extend to the first side surface, and the holding part being arranged on at least one side of the second side surface and the third side surface. [Brief description of the drawings]

[0007] [Figure 1] FIG. 2 is a plan view showing the configuration of a quartz-crystal wafer having vibration elements. [Diagram 2] FIG. 2 is an enlarged plan view of part A of the quartz crystal wafer shown in FIG. [Diagram 3] FIG. 2 is a plan view showing the configuration of a vibration element. [Figure 4] FIG. 2 is a perspective view showing a configuration of a vibration element. [Diagram 5] 5A to 5C are plan views showing a part of a manufacturing method of the vibration element. [Figure 6] 5A to 5C are perspective views showing a part of a manufacturing method of the vibration element. [Figure 7] 5A to 5C are perspective views showing a part of a manufacturing method of the vibration element. [Figure 8] FIG. 13 is a plan view showing the configuration of a modified crystal wafer. [Figure 9] 9 is an enlarged plan view of part B of the modified crystal wafer shown in FIG. 8. [Figure 10] FIG. 13 is a perspective view showing a configuration of a vibration element according to a modified example. [Figure 11] FIG. 13 is a perspective view showing a configuration of a vibration element according to a modified example. [Figure 12] FIG. 13 is a perspective view showing a configuration of a vibration element according to a modified example. [Figure 13] FIG. 13 is a perspective view showing a configuration of a vibration element according to a modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] In the following figures, the three mutually orthogonal axes are referred to as the X-axis, Y-axis, and Z-axis. The direction along the X-axis is referred to as the "X-direction", the direction along the Y-axis as the "Y-direction", and the direction along the Z-axis as the "Z-direction", with the arrow direction being the + direction and the direction opposite to the + direction being the - direction. Note that the +Y direction is sometimes referred to as "up" or "upward" and the -Y direction as "down" or "downward", and the views from the +Y and -Y directions are also referred to as planar or planar. In addition, the surface on the + side of the Y direction will be described as the top surface, and the opposite surface on the - side of the Y direction will be described as the bottom surface.

[0009] First, the structure of a quartz-crystal wafer 1000 having a plurality of vibration elements 100 will be described with reference to FIGS.

[0010] 1 and 2, the quartz-crystal wafer 1000 shows a state in which a plurality of vibration elements 100 are connected to a quartz-crystal substrate, in other words, a state before the vibration elements 100 are separated into individual pieces. As shown in Fig. 2, the quartz-crystal wafer 1000 includes vibration elements 100 each having a support portion 40 and a vibration portion 50 aligned in the X direction, and a holder 60 connected to ends 14a, 15a of the support portion 40 in the Z direction.

[0011] The quartz crystal wafer 1000 has a plurality of vibration elements 100 aligned along the X direction, and a plurality of vibration elements 100 aligned along the Z direction. A holder 60 is connected to ends 14a, 15a of each of the vibration elements 100. Adjacent holders 60 in the Z direction are connected by a connecting portion 61. Adjacent holders 60 in the X direction are connected to a support frame 62.

[0012] A part of the first extraction electrode 23 and a part of the second extraction electrode 24 are disposed on the upper surface of the connecting portion 61. This allows, for example, electrical testing to be performed without directly contacting the extraction electrodes 23, 24 with terminals, thereby preventing damage to the extraction electrodes 23, 24. This also improves the strength of the holding portion 60, allowing the quartz crystal wafer 1000 to be handled stably. Furthermore, the quartz crystal wafer 1000 can be manufactured stably up until the process of singulating.

[0013] Next, the configuration of the vibration element 100 will be described with reference to FIGS.

[0014] As shown in Fig. 3 and Fig. 4, the vibration element 100 includes a vibration piece 10. The vibration piece 10 is, for example, an AT-cut quartz crystal substrate. The vibration piece 10 has a first surface 11 and a second surface 12, which are opposite surfaces, and side surfaces 13, 14, and 15 connecting the first surface 11 and the second surface 12. A first excitation electrode 21 is disposed on the first surface 11. A second excitation electrode 22 is disposed on the second surface 12 so as to overlap the first excitation electrode 21 in a plan view.

[0015] Further, a first extraction electrode 23 electrically connected to the first excitation electrode 21 is disposed on the first surface 11. A second extraction electrode 24 electrically connected to the second excitation electrode 22 is disposed on the second surface 12. The vibration element 100 and the support frame 62 are connected via a plurality of holding portions 60 as described above.

[0016] The side surfaces 13, 14, 15 of the vibration element 100 include a first side surface 13 located on one side in the X-axis direction, in other words, the first side surface 13 which is one of the side surfaces along the Z-axis direction, and a second side surface 14 and a third side surface 15 which intersect with the first side surface 13. In this embodiment, both the first extraction electrode 23 and the second extraction electrode 24 are arranged to extend on the first side surface 13. Also, the holding portion 60 is arranged on both the second side surface 14 and the third side surface 15 (see FIGS. 1 and 2).

[0017] The vibrating piece 10 is made of various piezoelectric materials including a quartz crystal piece. The vibrating piece 10 is an AT-cut quartz crystal piece. In this embodiment, the vibrating piece 10 is an AT-cut quartz crystal piece having a quadrangular planar shape, specifically a rectangular planar shape. Therefore, the + directions of the X-axis, Y-axis, and Z-axis in the figure correspond to the + directions of the X-axis, Y'-axis, and Z'-axis of the crystal axes of the quartz crystal, respectively. In other words, the first surface 11 and the second surface 12 of the vibrating piece 10 are formed along the X-axis and Z'-axis of the quartz crystal. However, this is not necessarily limited to this, and at least one of the axes may correspond to the - direction.

[0018] The vibrator element 10 has a vibrating section 50, a supporting section 40 arranged at a distance from the vibrating section 50, and connection wirings 21a and 22a that connect the vibrating section 50 and the supporting section 40 together.

[0019] The first excitation electrode 21 is electrically connected to the first extraction electrode 23 via a connection wiring 21a. The second excitation electrode 22 is electrically connected to the second extraction electrode 24 via a connection wiring 22a. Specifically, the first extraction electrode 23 is provided on the support portion 40 and is electrically connected to the first excitation electrode 21. The second extraction electrode 24 is provided on the support portion 40 and is electrically connected to the second excitation electrode 22.

[0020] 3 and 4, the end 14a of the second side surface 14 of the vibration element 100 is provided with a fractured portion 60a formed, for example, when the vibration element 100 is singulated from the quartz crystal wafer 1000. In other words, the end 14a becomes a fractured surface when singulated. In addition, the end 15a of the third side surface 15 of the vibration element 100 is provided with a fractured portion 60b formed, for example, when the vibration element 100 is singulated from the quartz crystal wafer 1000. In other words, the end 15a becomes a fractured surface when singulated.

[0021] In this way, the first extraction electrode 23 and the second extraction electrode 24 extend to the first side surface 13, and the fracture surfaces are present on the second side surface 14 and the third side surface 15 that intersect with the first side surface 13. Therefore, since the extended portions of the extraction electrodes 23, 24 and the fracture surfaces are on different planes, when the vibration element 100 is broken from the quartz-crystal wafer 1000, for example, it is possible to prevent the first extraction electrode 23 and the second extraction electrode 24 from being affected by the break (such as burrs or peeling off). Therefore, good vibration characteristics can be maintained.

[0022] Next, a method for manufacturing the vibration element 100 will be described with reference to FIGS.

[0023] 5 and 6, a quartz-crystal wafer 1000 is prepared having multiple vibration elements 100. As described above, the quartz-crystal wafer 1000 includes vibration elements 100 having support portions 40 and vibration portions 50 aligned along the X direction, and holders 60 connected to Z-direction ends 14a, 15a of the support portions 40. The quartz-crystal wafer 1000 has multiple vibration elements 100 aligned in the X and Z directions.

[0024] 5, the crystal wafer 1000 is hollowed out to the shape of the vibration element 100 by, for example, photolithography and etching techniques. The crystal wafer 1000 is also provided with connecting portions 61 that connect multiple holding portions 60 in the Z direction.

[0025] 5, at least the support parts 40 and the holders 60 of the quartz-crystal wafer 1000 are fixed to the film 202 via the adhesive 201. Specifically, the film 202 is fixed to the area of ​​the second surface 12 that overlaps with the support parts 40 via the adhesive 201. Examples of the adhesive 201 include rubber-based, acrylic-based, urethane-based, and silicone-based adhesives. Examples of the film 202 include a plastic film.

[0026] 5 and 7, the crystal wafer 1000 is singulated into a plurality of vibration elements 100 at the same time. Specifically, the crystal wafer 1000, specifically the film 202, is stretched along the Z direction. As a result, as shown in FIG. 7, the connection between the vibration elements 100 and the holder 60 is pulled and broken. This separates the connection, and the plurality of vibration elements 100 are singulated at the same time (this is called the expand method). Also, as shown in FIG. 5, by configuring the support frame 62 only from the portion along the X direction, the film 202 can be easily stretched and efficiently singulated.

[0027] 2, it is preferable that the width of the holding portion 60 along the direction intersecting with the first side surface 13 is narrowest at a width W1 of the portion connected to the vibration element 100. Specifically, the width W1 of the connection portion of the holding portion 60 is narrower than the remaining width W2 so that cracks are likely to occur at the connection portions between the ends 14a, 15a and the holding portion 60 when the film 202 is pulled in the Z direction. This makes the connection portions more likely to break, which makes it easier to separate the vibration elements 100.

[0028] In addition, the adhesive 201 that is bonded to the support portion 40 and the holding portion 60 may be attached only to the portions that come into contact with the support portion 40 and the holding portion 60, or may be attached to the entire surface of the film 202.

[0029] As described above, the vibration element 100 of this embodiment is aligned along the X-axis and Z'-axis of the quartz crystal, and includes an AT-cut quartz substrate having a first surface 11 and a second surface 12 that are in a front-back relationship, and side surfaces connecting the first surface 11 and the second surface 12, a first excitation electrode 21 arranged on the first surface 11, a first extraction electrode 23 arranged on the first surface 11 and connected to the first excitation electrode 21, a second excitation electrode 22 arranged on the second surface 12, and a second extraction electrode 24 arranged on the second surface 12 and connected to the second excitation electrode 22. The side surfaces include a first side surface 13 located on one side in the direction of the X-axis of the quartz crystal, and a second side surface 14 and a third side surface 15 that intersect with the first side surface 13, and at least one of the first extraction electrode 23 and the second extraction electrode 24 is arranged to extend to the first side surface 13, and at least one of the second side surface 14 and the third side surface 15 has a fracture surface.

[0030] According to this configuration, the first extraction electrode 23 and the second extraction electrode 24 extend to the first side surface 13, and the fracture surfaces are on the second side surface 14 and the third side surface 15 that intersect with the first side surface 13, so that the extended portions of the extraction electrodes 23, 24 and the fracture surfaces are on different surfaces, and therefore, for example, when the vibration element 100 is broken, it is possible to suppress the first extraction electrode 23 and the second extraction electrode 24 from being affected by the break (burrs, peeling, etc.), and therefore it is possible to maintain good vibration characteristics.

[0031] In the vibration element 100 of this embodiment, the second side surface 14 and the third side surface 15 preferably have fracture surfaces. With this configuration, the second side surface 14 and the third side surface 15 both have fracture surfaces, and the fracture surfaces are on a surface different from the first side surface 13. Therefore, for example, when the vibration element 100 is fractured, it is possible to suppress the first extraction electrode 23 and the second extraction electrode 24 from being affected by the fracture.

[0032] Moreover, in the vibration element 100 of this embodiment, it is preferable that the first extraction electrode 23 and the second extraction electrode 24 extend to the first side surface 13, and the second side surface 14 and the third side surface 15 have fracture surfaces. With this configuration, even if both the first extraction electrode 23 and the second extraction electrode 24 extend to the first side surface 13 and both the second side surface 14 and the third side surface 15 have fracture surfaces, the extended portions of the extraction electrodes 23, 24 and the fracture surfaces are on different sides, so that the first extraction electrode 23 and the second extraction electrode 24 can be prevented from being affected by the fracture.

[0033] The quartz crystal wafer 1000 of this embodiment is an AT-cut quartz crystal substrate that is aligned with the X-axis and Z'-axis of the quartz crystal and has a first surface 11 and a second surface 12 that are in a front-back relationship, and a side surface connecting the first surface 11 and the second surface 12, a first excitation electrode 21 arranged on the first surface 11, a first extraction electrode 23 arranged on the first surface 11 and connected to the first excitation electrode 21, a second excitation electrode 22 arranged on the second surface 12, and a second extraction electrode 24 arranged on the second surface 12 and connected to the second excitation electrode 22. The vibration element 100 comprises a vibration element 100, a support frame 62, and a plurality of holding portions 60 connecting the vibration element 100 and the support frame 62, the side surfaces of the vibration element 100 include a first side surface 13 located on one side in the direction of the X-axis of the quartz crystal, and a second side surface 14 and a third side surface 15 intersecting the first side surface 13, at least one of the first extraction electrode 23 and the second extraction electrode 24 is arranged extending on the first side surface 13, and the holding portions 60 are arranged on at least one side of the second side surface 14 and the third side surface 15.

[0034] According to this configuration, even if the first extraction electrode 23 and the second extraction electrode 24 extend to the first side surface 13 and the holding portion 60 is disposed on the second side surface 14 or the third side surface 15 that intersects with the first side surface 13, the extended portions of the extraction electrodes 23, 24 and the holding portion 60 are on different sides, so that when the holding portion 60 is broken to cut the vibration elements 100 from the quartz-crystal wafer 1000 and separate them, for example, it is possible to suppress the first extraction electrode 23 and the second extraction electrode 24 from being affected by the breakage (burrs, peeling, etc.). Therefore, it is possible to maintain good vibration characteristics.

[0035] In addition, in the quartz crystal wafer 1000 of this embodiment, the holding parts 60 are preferably arranged on the second side surface 14 side and the third side surface 15 side of the vibration element 100. With this configuration, the holding parts 60 are arranged on both the second side surface 14 and the third side surface 15. In other words, by arranging the vibration elements 100 on both sides of one holding part 60, it becomes possible to arrange a plurality of vibration elements 100 along a direction intersecting with the X-axis direction of the quartz crystal. As a result, by stretching the quartz crystal wafer 1000 in a direction intersecting with the X-axis direction, the plurality of vibration elements 100 can be easily singulated, making it possible to singulate by the expanding method.

[0036] In the quartz crystal wafer 1000 of this embodiment, the first extraction electrode 23 and the second extraction electrode 24 preferably extend to the first side surface 13, and the holding portion 60 is preferably disposed on the second side surface 14 side and the third side surface 15 side. With this configuration, the holding portions 60 are disposed on both the second side surface 14 and the third side surface 15. In other words, by disposing the vibration elements 100 on both sides of one holding portion 60, it becomes possible to dispose a plurality of vibration elements 100 along a direction intersecting with the X-axis direction of the quartz crystal. As a result, by stretching the quartz crystal wafer 1000 in a direction intersecting with the X-axis direction, the plurality of vibration elements 100 can be easily diced into individual pieces, making it possible to diced by the expanding method.

[0037] In the quartz-crystal wafer 1000 of this embodiment, the width of the retaining portion 60 in the direction intersecting with the first side surface 13 is preferably narrowest at the portion connected to the vibration element 100 (width W1 in FIG. 2). With this configuration, the portion of the retaining portion 60 connected to the vibration element 100 is the narrowest, so that the connected portion is more likely to break, making it easier to separate the vibration elements 100.

[0038] Modifications of the above embodiment will now be described.

[0039] As described above, the fracture surface is not limited to being present on both the second side surface 14 and the third side surface 15, and may be present on either one of them, as shown in Figs. 8 to 10.

[0040] 8 and 9, in the modified crystal wafer 1000A, two holders 60 are connected to the second side surface 14 of the vibration element 100A. The vibration element 100A is connected to a support frame 62 in a so-called cantilevered state. A first extraction electrode 23 and a second extraction electrode 24 are arranged to extend from the support frame 62 on the second side surface 14 side.

[0041] When the vibration elements 100A are separated from the quartz-crystal wafer 1000A, a fracture surface is formed at the end 14a of the second side surface 14. As shown in Fig. 9 and Fig. 10, fractures 60c, 60d may occur at the end 14a of the vibration elements 100A. Furthermore, the present invention is not limited to a fracture surface being formed only on the second side surface 14, and a fracture surface may be formed only on the third side surface 15.

[0042] Furthermore, as described above, the first side 13 of the vibration element 100A is not limited to being formed parallel to the Y axis, in other words, perpendicular to the first surface 11, but may be formed in a triangular shape, as in the vibration element 100B shown in Figure 11.

[0043] Specifically, the first side surface 13 of the vibration element 100B has a first inclined surface 13a connected to the first surface 11 and a second inclined surface 13b connected to the second surface 12. A first extraction electrode 23 and a second extraction electrode 24 are arranged to extend on the first inclined surface 13a and the second inclined surface 13b. The fracture surfaces are the second side surface 14 and the third side surface 15, similar to the above embodiment.

[0044] Even in such a configuration, since the extended portions of the extraction electrodes 23 and 24 and the fracture surface are on different planes, when the vibration element 100B is fractured, the first extraction electrode 23 and the second extraction electrode 24 can be prevented from being affected by the fracture (such as burrs and peeling), and good vibration characteristics can be maintained.

[0045] As described above, both the first extraction electrode 23 and the second extraction electrode 24 are not limited to extending onto the first side surface 13, and either one of them may extend onto the first side surface 13 as shown in Fig. 12. In the vibration element 100C shown in Fig. 12, only the second extraction electrode 24 extends onto the first side surface 13. Note that the first side surface 13 shown in Fig. 12 has inclined surfaces 13a and 13b similar to the vibration element 100B of the modified example, but the same applies to the case where the first side surface is parallel to the Y-axis as in the embodiment described above.

[0046] Also, as shown in FIG. 13, in a variation of the cantilever type vibration element 100D, the first side surface 13 may have a triangular first inclined surface 13a and a second inclined surface 13b.

[0047] Moreover, it is preferable that the thickness of the holding portion 60 in the Y-axis direction is thinnest at the portion connected to the support portion 40, in other words, at the portion connected to the ends 14a, 15a of the vibration element 100. According to this method, since the portion of the holding portion 60 connected to the support portion 40 is thin, when the film 202 is stretched, the vibration element 100 can be easily separated from the thin portion.

[0048] In this manner, in the modified quartz crystal wafer 1000, it is preferable that the thickness of the portion of the holding portion 60 that intersects with the first surface 11 and the second surface 12 is thinnest at the portion connected to the vibration element 100. With this configuration, since the portion of the holding portion 60 connected to the vibration element 100 is thin, the vibration element 100 can be easily separated into individual pieces from the thin portion.

[0049] In addition, it is preferable that a recessed groove or a through hole is formed in the portion of the holding part 60 connected to the support part 40. According to this method, since a recessed groove or a through hole is formed in the portion of the holding part 60 connected to the support part 40, it is possible to weaken the strength, and when the film 202 is stretched, it becomes easy to break from the portion with the weak strength, and the vibration element 100 can be easily divided into individual pieces.

[0050] In this manner, in the modified crystal wafer 1000, the portion of the holding portion 60 connected to the vibration element 100 preferably has a groove or a through hole. With this configuration, the portion of the holding portion 60 connected to the vibration element 100 has a groove or a through hole, so that it is possible to weaken the strength, and the vibration element 100 can be easily separated into individual pieces. [Explanation of symbols]

[0051] 10...vibrating piece, 11...first surface, 12...second surface, 13...first side, 13a...first inclined surface, 13b...second inclined surface, 14...second side, 14a...end, 15...third side, 15a...end, 21...first excitation electrode, 21a...connecting wiring, 22...second excitation electrode, 22a...connecting wiring, 23...first extraction electrode, 24...second extraction electrode, 40...supporting portion, 50...vibrating portion, 60...holding portion, 60a, 60b, 60c...breaking portion, 61...connecting portion, 62...supporting frame, 100, 100A, 100B, 100C, 100D...vibrating element, 201...adhesive, 202...film, 1000...quartz wafer.

Claims

1. A first surface and a second surface that are aligned along the X-axis and Z'-axis of the quartz crystal and are opposite surfaces, and an AT-cut quartz crystal substrate having a side surface connecting the first surface and the second surface; a first excitation electrode disposed on the first surface; a first extraction electrode disposed on the first surface and connected to the first excitation electrode; a second excitation electrode disposed on the second surface; a second extraction electrode disposed on the second surface and connected to the second excitation electrode; Equipped with The side surfaces include a first side surface located on one side in the direction of the X-axis and a second side surface located opposite the first side surface. a second side surface and a third side surface that intersect each other, At least one of the first extraction electrode and the second extraction electrode extends to the first side surface. It is arranged, A vibration element, wherein at least one of the second side surface and the third side surface has a fracture surface.

2. The vibration element according to claim 1 , The vibration element, wherein the second side surface and the third side surface have the fractured surface.

3. The vibration element according to claim 1 , the first extraction electrode and the second extraction electrode extend to the first side surface, The second side surface and the third side surface have the fractured surface.

4. A first surface and a second surface that are aligned along the X-axis and Z'-axis of the quartz crystal and are opposite surfaces, and an AT-cut quartz crystal substrate having a side surface connecting a first surface and the second surface; a first excitation electrode disposed on the first surface and connected to the first excitation electrode; an output electrode, a second excitation electrode disposed on the second surface, and a second excitation electrode disposed on the second surface a plurality of vibration elements each including a second extraction electrode connected to the vibration electrode; A support frame; a plurality of holding portions that connect the vibration element and the support frame; Equipped with The side surfaces of the vibration element include a first side surface located on one side in the X-axis direction and a front side surface. a second side surface and a third side surface intersecting the first side surface, At least one of the first extraction electrode and the second extraction electrode extends to the first side surface. It is arranged, The holding portion is disposed on at least one of the second side surface and the third side surface. Quartz crystal wafer.

5. 5. The quartz crystal wafer according to claim 4, The holding portion is disposed on the second side surface side and the third side surface side of the vibration element. A quartz crystal wafer.

6. 5. The quartz crystal wafer according to claim 4, the first extraction electrode and the second extraction electrode extend to the first side surface, The holding portion is disposed on the second side surface side and the third side surface side of the quartz crystal wafer.

7. 7. The quartz crystal wafer according to claim 4, wherein: The width of the holding portion along a direction intersecting the first side surface is The thinnest part of the quartz crystal wafer.

8. 7. The quartz crystal wafer according to claim 4, wherein: The thickness of the holding portion along a direction intersecting the first surface and the second surface is The quartz crystal wafer has the thinnest part where it is connected to the moving elements.

9. 7. The quartz crystal wafer according to claim 4, wherein: The portion of the holding portion connected to the vibration element has a groove or a through hole. 。

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