Vapor deposition mask and method for manufacturing organic light-emitting device

Abstract

To provide a technique to reduce breakage and distortion of a vapor deposition mask occurring when the vapor deposition mask and a substrate are peeled off from each other.SOLUTION: A vapor deposition mask of the present disclosure is provided with a plurality of pixel openings corresponding to a vapor deposition pattern vapor-deposited on a substrate. The plurality of pixel openings is arranged in a plane of the vapor deposition mask opposite to the substrate. In an area from the pixel openings, of the plurality of pixel openings, which are arranged in an outermost peripheral portion in the plane to an end of the vapor deposition mask, projections are formed which are made of material different from the vapor deposition mask.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The technique disclosed herein relates to a deposition mask for depositing a pixel opening pattern on a substrate, and a method for manufacturing an organic light-emitting element using the deposition mask. [Background technology]

[0002] Organic light-emitting devices have been attracting attention as light-emitting devices capable of emitting high-luminance light by low-voltage driving. Organic light-emitting devices are generally formed on a substrate with a multi-layer structure including an anode, a hole transport layer, a light-emitting layer, an electron transport layer, and a cathode. Methods for forming this multi-layer structure include a vacuum deposition method on a substrate using evaporation or sublimation, and a film formation method using inkjet or spin coating in which an organic material is dissolved in a solvent. Among these, a vacuum deposition method using a patterned mask is generally used for forming a multi-layer structure using a low-molecular-weight material. In the vacuum deposition method, in order to form a desired pattern on a substrate, a deposition mask having a desired pixel opening pattern is placed between the substrate and a heating unit for the deposition material, and a film is formed.

[0003] In recent years, there has been a demand for high-definition organic light-emitting devices. To achieve high-definition organic light-emitting devices, it is necessary to bring the substrate and the deposition mask very close to each other and reduce deposition blurring and deposition vignetting during deposition. Deposition blurring is when the deposition material is formed over a wide area beyond the desired deposition range. For this, the distance between the substrate and the deposition mask is important. Even if the substrate and the deposition mask can be placed in the expected positional relationship during deposition, deposition blurring is caused in the central part of the deposition mask, etc., because the crosspieces that define the pixel openings are deflected by the weight of the mask. In addition, deposition vignetting occurs when the deposition range is scraped off due to the influence of the thickness of the crosspieces and frame of the deposition mask. In order to reduce the influence of deposition blurring and deposition vignetting, it is necessary to make the crosspieces and frame thin. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2003-59671 A [Patent Document 2] JP 2006-233286 A [Patent Document 3] JP 2015-148002 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, when the substrate and the deposition mask are brought close to each other during deposition, the substrate and the deposition mask are adhered to each other due to interactions such as van der Waals forces. As a result, when the substrate and the deposition mask are peeled off after deposition, the crosspieces that define the pixel openings of the deposition mask are distorted, broken, or otherwise damaged, making it difficult to perform deposition processing on multiple substrates. Furthermore, this can cause damage to the substrate or foreign matter, resulting in a decrease in yield. However, in order to achieve high definition organic light-emitting elements, it is essential to bring the substrate and the deposition mask close to each other during deposition, and this was an issue that needed to be resolved.

[0006] Patent Document 1 proposes providing ribs and spacers around the pixel region of the substrate to prevent damage caused by the proximity of the substrate and deposition mask. According to Patent Document 1, it is possible to bring the substrate and deposition mask closer to a desired distance without bringing them closer than the height of the spacers. However, Patent Document 1 still causes bending of the deposition mask due to its own weight, so there is a possibility that the effect of the deposition blur described above cannot be suppressed.

[0007] In addition, in Patent Document 2, a magnetic film is provided on the deposition mask, so that the deposition mask of the substrate is prevented from being damaged. The deposition mask can be attracted by magnets provided on the facing surface and the surface opposite to the facing surface, thereby suppressing the effects of deposition blurring. However, the magnetic film is provided in the center of the deposition mask to pull up the portion where the deflection is large in order to suppress the phenomenon that the deposition mask deflects under its own weight. For this reason, in Patent Document 2, there is a possibility that the adhesion between the substrate and the deposition mask is not reduced.

[0008] In addition, in Patent Document 3, the deposition mask has a surface facing the substrate made of resin, and a part of the surface is roughened to reduce adhesion between the substrate and the deposition mask. However, since the deposition mask surface is roughened, there is a possibility that the adhesion between the deposition mask and the substrate in the part that is not roughened may not be reduced.

[0009] The technology disclosed herein has been made in consideration of the above, and has an object to provide a technology that reduces damage and distortion of a deposition mask that occurs when the deposition mask and the substrate are peeled off after deposition of a pixel opening pattern on the substrate. [Means for solving the problem]

[0010] In order to achieve the above object, the deposition mask according to the present disclosure comprises: In a deposition mask provided with a plurality of pixel openings corresponding to a deposition pattern to be deposited on a substrate, the plurality of pixel openings are arranged in a surface of the deposition mask facing the substrate, a convex portion made of a material different from that of the deposition mask is formed in a region from a pixel opening arranged in an outermost peripheral portion in the plane among the plurality of pixel openings to an end portion of the deposition mask; The deposition mask includes a deposition mask comprising:

[0011] In order to achieve the above object, a method for producing an organic light-emitting device according to the present disclosure includes the steps of: The present invention also includes a method for producing an organic light-emitting element, which comprises forming an organic compound layer constituting an organic light-emitting element using the deposition mask. In order to achieve the above object, the display device according to the present disclosure comprises: The present invention also includes a display device equipped with an organic light-emitting element having an organic compound layer formed using the deposition mask. In order to achieve the above object, an imaging device according to the present disclosure includes: The present invention also includes an imaging device equipped with an organic light-emitting element having an organic compound layer formed using the deposition mask. In order to achieve the above object, the electronic device according to the present disclosure comprises: The present invention also includes an electronic device equipped with an organic light-emitting element having an organic compound layer formed using the deposition mask. In order to achieve the above object, the lighting device according to the present disclosure comprises: The present invention also includes a lighting device equipped with an organic light-emitting element having an organic compound layer formed using the deposition mask. In order to achieve the above object, the moving body according to the present disclosure is The present invention also includes a mobile body equipped with an organic light-emitting element having an organic compound layer formed using the deposition mask. Effect of the Invention

[0012] According to the technology disclosed herein, by reducing the interaction between the substrate and the deposition mask, it is possible to reduce damage and distortion of the deposition mask that occurs when the deposition mask is peeled off from the substrate after depositing a pixel opening pattern on the substrate. [Brief description of the drawings]

[0013] [Figure 1] Schematic diagram of a deposition mask according to the present embodiment. [Diagram 2] 1A to 1C are diagrams illustrating a method for manufacturing a deposition mask according to the present embodiment. [Diagram 3] FIG. 2 is a top view of the deposition mask according to the embodiment; [Figure 4] 1A and 1B are a plan view and a cross-sectional view illustrating an example of a deposition mask having a convex portion according to an embodiment of the present invention. [Diagram 5] 1A and 1B are a plan view and a cross-sectional view showing another example of a deposition mask having a convex portion according to an embodiment of the present invention; [Figure 6] 1A and 1B are a plan view and a cross-sectional view showing still another example of a deposition mask having a convex portion according to an embodiment of the present invention. [Figure 7] 1A and 1B are a plan view and a cross-sectional view showing still another example of a deposition mask having a convex portion according to an embodiment of the present invention. [Figure 8] 1A and 1B are a plan view and a cross-sectional view showing still another example of a deposition mask having a convex portion according to an embodiment of the present invention. [Figure 9] FIG. 1 is a diagram showing an example of a display device having an organic light-emitting element according to an embodiment of the present invention; [Figure 10] FIG. 1 is a diagram showing an example of a display device having an organic light-emitting element according to an embodiment of the present invention; [Figure 11] FIG. 1 is a diagram showing an example of a display device and an electronic device having an organic light-emitting element according to an embodiment of the present invention; [Figure 12] FIG. 1 is a schematic diagram showing an example of a display device having an organic light-emitting element according to an embodiment of the present invention; [Figure 13] FIG. 1 is a diagram showing an example of a lighting device having an organic light-emitting element according to an embodiment of the present invention and a moving object; [Figure 14] FIG. 1 is a schematic diagram showing an example of glasses having an organic light-emitting element according to an embodiment of the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, an embodiment of the present disclosure will be described with reference to the drawings. Note that the present disclosure is not limited to the following embodiment, and can be modified as appropriate without departing from the gist of the present disclosure. In addition, in the drawings described below, parts having the same functions are given the same reference numerals, and their description may be omitted or simplified.

[0015] First Embodiment The deposition mask used in the first embodiment will be described. The deposition mask according to this embodiment is used for the purpose of forming a desired deposition pattern on a substrate by a vacuum deposition method. Examples of materials used include stainless steel, iron, copper, aluminum, silver, titanium, molybdenum, tungsten, invar, silicon, and resin, but are not particularly limited. Furthermore, the material may form a deposition mask alone, or a combination of multiple materials may be used.

[0016] As an example of a method for manufacturing a metal deposition mask, wet etching or the like can be used. As an example of a method for manufacturing a silicon deposition mask, a method for processing an SOI (Silicon on Insulator) wafer can be used. Note that the method for manufacturing the deposition mask in this embodiment is not limited to these manufacturing methods.

[0017] An example of a silicon deposition mask according to this embodiment is shown in FIG. 1. As shown in FIG. 1, the thick layer of the two Si layers in the SOI wafer is called the Si support layer 1A, and the thin layer is called the Si functional layer 1B. The surface side of the SOI wafer is the Si functional layer 1B. A silicon oxide layer 1C is sandwiched between the two Si layers 1A and 1B.

[0018] 2A to 2H, the method for producing the deposition mask will be described in more detail. (1) As shown in Fig. 2A, a first resist pattern 200 having holes for passing a deposition material and forming a deposition layer of a desired size is formed on a Si functional layer 1B on the surface of an SOI wafer by photolithography. (2) Next, as shown in Fig. 2B, the Si functional layer 1B on the SOI wafer surface is dry etched to form a first Si hole 202 to which the first resist pattern 200 is transferred. At this time, the silicon oxide layer 1C formed under the Si functional layer 1B functions as an etching stop layer. (3) Next, as shown in FIG. 2C, the first resist pattern 200 is etched by oxygen plasma ash. Remove it by cleaning. (4) Next, as shown in FIG. 2D, in order to protect the first Si hole 202 formed in the SOI wafer surface, a resist is applied to the SOI wafer surface to form a protective layer 204. (5) Next, as shown in Fig. 2E, a second resist pattern 206 having a size corresponding to the aggregate of the first Si holes 202 is formed on the Si support layer 1A on the back surface of the SOI wafer by photolithography. Here, the aggregate size of the first Si holes corresponds to, for example, the size of one display device chip. (6) Next, as shown in Fig. 2F, the Si support layer on the back surface of the SOI wafer is dry etched to form second Si holes 208 to which the second resist pattern is transferred. In this case, the silicon oxide layer 1C also functions as an etching stop layer. (7) Next, as shown in Fig. 2G, wet etching is performed using buffered hydrofluoric acid to etch the silicon oxide layer 1C. At this time, the size of the etched silicon oxide layer 1C becomes the size of the second Si hole formed on the back surface of the SOI wafer. (8) Next, as shown in FIG. 2H, the second resist pattern 206 is removed by an organic wet process, completing the deposition mask.

[0019] Next, the convex portion of the deposition mask according to the present embodiment will be described. The convex portion of the deposition mask according to the present embodiment is used for the purpose of reducing the contact area with the substrate in a set of the substrate and the deposition mask. In addition, since the convex portion is formed on the surface of the deposition mask facing the substrate, it is possible to make the contact area the minimum necessary so that the substrate and the deposition mask do not come into close contact with each other.

[0020] The material used for the convex portion is not particularly limited as long as it is different from the material of the deposition mask to which the convex portion is adhered, and is divided into, for example, magnetic materials and non-magnetic materials. When a magnetic material is used for the convex portion, it is preferably selected from cobalt Co, iron Fe, or nickel Ni, and substances containing them. Specifically, Ni-Fe-P, Co-Ni-P, etc. can be used to form the convex portion by electroless plating or the like. On the other hand, when a non-magnetic material is used for the convex portion, materials such as resin materials and release agents can be adopted. Examples of resin materials include polyimide-based and polyamide-based materials, but are not particularly limited to these materials. When a resin material is used to form the convex portion, the convex portion is formed on the mask using a dispenser, and the convex portion is obtained by thermally curing the mask in an oven. Examples of the release agent include fluorine-based, silicon-based, and wax-based materials, but are not limited to these materials. Particularly preferably, the release agent is selected from fluorine-based materials. When multiple convex portions are formed, the material used for each convex portion may be a single type of material selected from the above materials, or multiple types of materials may be selected.

[0021] For example, a region where a convex portion made of a magnetic material exists and a region where a convex portion made of a non-magnetic material exists may coexist on the deposition mask. Also, one convex portion may be formed by coating the convex portion made of the magnetic material with a release agent having a mold-releasing property.

[0022] Next, an example of the convex portion of the deposition mask according to the present embodiment will be described. The shape of the convex portion formed on the substrate-facing surface of the deposition mask is not limited to an ellipse or a triangle as shown in FIG. 4 to FIG. 8, but may be a semicircle, a polygon, a bell shape, or the like. However, the shape of the convex portion is not limited to these. The shape of the contact surface between the substrate and the deposition mask may be a shape that forms a point contact or a shape that forms a line contact. Also, the shape of the contact surface between the substrate and the deposition mask may be a shape that forms a surface contact as long as it is not greater than the width of the rail portion that separates each opening of the pixel opening. The shapes of the multiple convex portions formed on one deposition mask may be the same shape as each other, or may be different shapes from each other. The sizes of the multiple convex portions formed on one deposition mask may be the same as each other, or may be different from each other.

[0023] The details of the convex portion will be described with reference to the drawings. FIGS. 3A and 3B are schematic top views of a deposition mask 1 in this embodiment that adopts a general deposition mask shape. The deposition mask 1 has a plurality of pixel openings 2, and a convex portion is formed in a region 4 between a boundary 3 that defines the outermost periphery of the pixel openings 2 and an end of the deposition mask 1. Specific examples of the convex portion are shown in FIGS. 4 to 8. The convex portion is formed of a material different from the deposition mask 1 in which the convex portion is arranged. This makes it possible to provide functionality to the convex portion. In addition, as shown in FIGS. 3A and 3B, the width W of the region 4 does not need to be a constant width in one deposition mask 1.

[0024] As a specific example of the convex portion, if the material of the deposition mask 1 is a nonmagnetic material and the convex portion is formed of a magnetic material, it is possible to reduce the deflection of the deposition mask 1 due to its own weight by using a magnet. Also, if the material of the deposition mask 1 is a magnetic material, it is preferable that the convex portion is formed of a release agent. This makes it possible to simultaneously reduce the deflection of the deposition mask 1 when the deposition mask 1 is pulled up by the magnet and to easily peel the deposition mask 1 when the deposition mask 1 is peeled off from the substrate.

[0025] When peeling the deposition mask 1 from the substrate, a force is applied in a direction lifting the substrate upward, or in a direction vertically lowering the deposition mask 1, or in both directions. At that time, the entire region 4 of the deposition mask 1 or a part of the region starts to peel off from the substrate. Then, the crosspieces separating the pixel openings are peeled off from the substrate in order from the pixel openings 2 arranged in the outermost periphery close to the region 4 of the deposition mask 1 toward the pixel openings 2 arranged in the central part of the deposition mask 1. At this time, the part where the contact area between the substrate and the deposition mask is maximum is the region 4. By easily peeling off the region 4, it is possible to prevent the deposition mask 1 from being distorted or damaged.

[0026] 4 to 8 show examples of the arrangement of the convex portions 5 of the deposition mask 1 according to the present embodiment. However, the arrangement of the convex portions 5 formed on the deposition mask 1 is not limited to the arrangement shown in these figures. FIG. 4A and FIG. 4B show examples of the convex portions 5 formed on the deposition mask 1 shown in FIG. 3A, and FIG. 4C and FIG. 4D show examples of the convex portions 5 formed on the deposition mask 1 shown in FIG. 3B. FIG. 4A to FIG. 4D show a part of the deposition mask 1 in a top view and a cross section taken along line A-A', respectively. As shown in FIG. 4A to FIG. 4D, the shape of the convex portions 5 formed on the deposition mask 1 may be a protrusion shape as shown in FIG. 4A and FIG. 4C, a rectangular rod shape as seen from above as shown in FIG. 4B, or a broken line shape as seen from above as shown in FIG. 4D.

[0027] 5A and 5B show examples of the convex portions 5 formed on the deposition mask 1 shown in FIG. 3A, and FIG. 5C and 5D show examples of the convex portions 5 formed on the deposition mask 1 shown in FIG. 3B. FIGS. 5A to 5D show a part of the deposition mask 1 seen from above and a cross section taken along line A-A', respectively. As shown in FIGS. 5A to 5D, the convex portions 5 are preferably formed at least within a range of width W / 2 from the boundary 3 toward the end of the deposition mask 1 in the region 4 (the region inside the boundary 6 in the figure) as shown in FIGS. 5A to 5D. One of the parts of the deposition mask 1 that receives the most load when peeled off from the substrate is the crosspieces surrounding the pixel openings 2 arranged in the outermost periphery and the region 4. The convex portions 5 are formed in the region inside the boundary 6, which reduces the load on the deposition mask 1 when peeling off the deposition mask 1 from the substrate, and makes it possible to prevent the deposition mask 1 from bending or breaking.

[0028] FIG. 6A shows an example of a protrusion 5 formed on the deposition mask 1 shown in FIGS. 3A and 3B, and FIG. 6B shows an example of a protrusion 5 formed on the deposition mask 1 when pixel openings 2 of different shapes are arranged as a modified example of the deposition mask 1 shown in FIGS. 3A and 3B. FIGS. 6A and 6B respectively show a part of the deposition mask 1 seen from above and a cross section taken along line A-A'. As shown in FIGS. 6A and 6B, the protrusion 5 is formed on the crosspiece 7 of the deposition mask 1 at a position facing the corner of the pixel opening 2. This means that the protrusion 5 is formed at a position on the crosspiece 7 where a greater load is expected to be applied when the deposition mask 1 is peeled off from the substrate. This makes it easier to peel off the deposition mask 1 and prevents the deposition mask 1 from bending or being damaged.

[0029] 7A and 7B show examples of convex portions 5 formed on the crosspieces of the deposition mask 1 shown in FIG. 3A, and FIGS. 7C and 7D show examples of convex portions 5 formed on the crosspieces of the deposition mask 1 shown in FIG. 3B. FIGS. 7A to 7D show a part of the deposition mask 1 seen from above and a cross section taken along line A-A', respectively. As shown in FIGS. 7A to 7D, the convex portions 5 are preferably formed on the crosspieces 7 that define the pixel openings 2 arranged in the deposition mask 1. As shown in the figures, the convex portions 5 can be formed on the crosspieces 7 in any size and shape.

[0030] The thickness of the deposition mask 1 may be uniform or non-uniform. The thickness of the deposition mask 1 may differ in different parts. An example of the thickness of the deposition mask 1 will be described with reference to FIG. 8A and FIG. 8B. FIG. 8A is a top view showing a part of the deposition mask 1, and FIG. 8B is a cross-sectional view taken along line A-A' in FIG. 8A and a cross-sectional view taken along line B-B' in FIG. 8A. As shown in FIG. 8A, the deposition mask 1 has a frame portion 8 corresponding to a portion surrounding a boundary 3 that defines a region in which a pixel opening 2 is arranged, which is an end region of the deposition mask 1, and rib portions 9 and 10 that partition the pixel opening 2. As shown in FIG. 8A and FIG. 8B, in the top view of the deposition mask 1, the width of the rib portion 9 is greater than the width of the rib portion 10.

[0031] As shown in the figure, the thicknesses of frame 8, crosspiece 9, and crosspiece 10 are d1, d2, and d3, respectively. The relationship between these thicknesses is expressed by formula (1). d1 ≧ d2 ≧ d3 (1)

[0032] The frame 8 is a region that comes into contact with a supporting member such as a mask holder when supporting the deposition mask 1 in a deposition apparatus, and may have a thickness that can withstand the weight of the deposition mask 1. From the viewpoint of manufacturing the deposition mask 1, it is desirable that the frame 8 be the thickest part of the deposition mask 1. In addition, the crosspiece 10 that divides the pixel openings 2 is thin enough relative to the opening width of the pixel openings 2, so that vignetting due to the structure of the pixel openings 2 itself during deposition can be suppressed. On the other hand, the mechanical strength of the deposition mask 1 decreases as the pixel openings 2 become finer and the opening ratio of the entire deposition mask 1 increases. Therefore, the mechanical strength of the deposition mask 1 can be improved by forming the deposition mask 1 so as to partially have crosspieces 9 that are thicker than the crosspieces 10. As can be seen from the figure, the crosspieces 9 are portions in which pixel openings are formed at intervals greater than the intervals between the pixel openings that form the crosspieces 10. The crosspieces 9 are an example of a first crosspiece, and the crosspieces 10 are an example of a second crosspiece. Therefore, in order to suppress a decrease in mechanical strength due to miniaturization of the pixel openings 2 of the deposition mask 1, it is more preferable to provide a frame portion 8 and crosspiece portions 9 and 10 in the deposition mask 1 and set the thicknesses of each portion so as to satisfy the relationship of the above formula (1).

[0033] Furthermore, it is more preferable that the convex portions 5 are formed on the crosspiece portions 10. In the deposition mask 1 of the present embodiment, the material of the convex portions 5 provided on the crosspiece portions 10 that define the multiple pixel openings 2 is not particularly limited, but at least one of the convex portions 5 provided on the crosspiece portions 10 is preferably formed of a magnetic material. Also, while Fig. 8B shows a case where the deposition mask 1 is made of a single material, the thickness of each portion of the deposition mask 1 may be set as described above even when the deposition mask 1 is made of multiple materials.

[0034] [Structure of organic light-emitting element] Next, an organic light-emitting element manufactured using the deposition mask 1 in this embodiment will be described. In this embodiment, the organic light-emitting element is provided by forming an insulating layer, a first electrode, an organic compound layer, and a second electrode on a substrate. A protective layer, a color filter, a microlens, etc. may be provided on the cathode. When a color filter is provided, a planarizing layer is provided between the protective layer and the color filter. The planarizing layer may be made of an acrylic resin or the like. The same applies when a planarizing layer is provided between the color filter and the microlens.

[0035] [substrate] The material of the substrate constituting the organic light-emitting element may be at least one of quartz, glass, silicon, resin, and metal. In addition, a switching element such as a transistor and wiring may be provided on the substrate, and an insulating layer may be provided thereon. As the insulating layer, any material can be used as long as it can form a contact hole so that wiring can be formed between the first electrode and the insulating layer, and can ensure insulation from wiring that is not connected. For example, resin such as polyimide, silicon oxide, silicon nitride, etc. can be used.

[0036] [electrode] A pair of electrodes can be used for the organic light-emitting element. The pair of electrodes may be an anode and a cathode. When an electric field is applied in the direction in which the organic light-emitting element emits light, the electrode with a higher potential is the anode, and the other is the cathode. It can also be said that the electrode that supplies holes to the light-emitting layer is the anode, and the electrode that supplies electrons is the cathode.

[0037] The material constituting the anode should have as large a work function as possible. For example, a metal such as gold, platinum, silver, copper, nickel, palladium, cobalt, selenium, vanadium, or tungsten, or a mixture containing these metals, can be used for the anode. Alternatively, an alloy combining these metals, or a metal oxide such as tin oxide, zinc oxide, indium oxide, indium tin oxide (ITO), or indium zinc oxide can be used for the anode. Also, a conductive polymer such as polyaniline, polypyrrole, or polythiophene can be used for the anode.

[0038] Any of these electrode materials may be used alone, or two or more of these materials may be used in combination. The anode may be composed of a single layer or multiple layers.

[0039] When the electrode of the organic light-emitting element is configured as a reflective electrode, the electrode material can be, for example, chromium, aluminum, silver, titanium, tungsten, molybdenum, or an alloy or laminate thereof. The above materials can also function as a reflective film without serving as an electrode. When the electrode of the organic light-emitting element is configured as a transparent electrode, the electrode material can be, but is not limited to, an oxide transparent conductive layer such as indium tin oxide (ITO) or indium zinc oxide. The electrode can be formed by photolithography.

[0040] On the other hand, the material for the cathode should have a small work function. Examples of the material include alkali metals such as lithium, alkaline earth metals such as calcium, aluminum, titanium, manganese, silver, lead, chromium, and other metals or mixtures containing these metals. Alternatively, alloys combining these metals can be used. For example, magnesium-silver, aluminum-lithium, aluminum-magnesium, silver-copper, zinc-silver, and the like can be used. Metal oxides such as indium tin oxide (ITO) can also be used. These electrode materials may be used alone or in combination of two or more types. The cathode may have a single layer structure or a multi-layer structure. Among these, it is preferable to use silver, and it is even more preferable to use a silver alloy to reduce the aggregation of silver. As long as the aggregation of silver can be reduced, the ratio of the alloy is not important. For example, the ratio of silver to other metals may be 1:1, 3:1, and the like.

[0041] The cathode may be a top-emission element using an oxide conductive layer such as ITO, or a bottom-emission element using a reflective electrode such as aluminum (Al), and is not particularly limited. The method for forming the cathode is not particularly limited, but may be a direct current or an alternating current. It is more preferable to use a sputtering method or the like, since this provides good film coverage and makes it easier to reduce the resistance.

[0042] [Pixel isolation layer] The pixel separation layer of the organic light-emitting element is formed of a silicon nitride (SiN) film, a silicon oxynitride (SiON) film, or a silicon oxide (SiO) film formed by chemical vapor deposition (CVD). In order to increase the resistance in the in-plane direction of the organic compound layer, it is preferable that the thickness of the organic compound layer, particularly the hole transport layer, is thin on the sidewall of the pixel separation layer. Specifically, the thickness of the sidewall can be thinned by increasing the taper angle of the sidewall of the pixel separation layer or the thickness of the pixel separation layer to increase vignetting during deposition.

[0043] On the other hand, it is preferable to adjust the sidewall taper angle and film thickness of the pixel separation layer to such an extent that no voids are formed in the protective layer formed thereon. Since no voids are formed in the protective layer, the occurrence of defects in the protective layer can be reduced. Since the occurrence of defects in the protective layer is reduced, deterioration in reliability such as the occurrence of dark spots and poor conduction of the second electrode can be reduced.

[0044] According to this embodiment, even if the taper angle of the sidewall of the pixel separation layer is not steep, it is possible to effectively suppress charge leakage to adjacent pixels. As a result of the study by the inventors of the present application, it was found that the charge leakage can be sufficiently reduced if the taper angle is in the range of 60 degrees or more and 90 degrees or less. The thickness of the pixel separation layer is preferably 10 nm or more and 150 nm or less. In addition, the same effect can be obtained even if the pixel electrode is composed only of a pixel electrode without a pixel separation layer. However, in this case, it is preferable that the thickness of the pixel electrode is half or less than that of the organic layer, or the pixel electrode end is forward tapered with a taper angle of less than 60 degrees, because this reduces short circuits of the organic light-emitting element.

[0045] [Organic compound layer] The organic compound layer of the organic light-emitting element may be formed as a single layer or multiple layers. When multiple layers are included, they may be called hole injection layer, hole transport layer, electron blocking layer, light-emitting layer, hole blocking layer, electron transport layer, electron injection layer, etc., depending on their functions. The organic compound layer is mainly composed of organic compounds, but may also contain inorganic atoms and inorganic compounds. For example, it may contain copper, lithium, magnesium, aluminum, iridium, platinum, molybdenum, zinc, etc. The organic compound layer may be disposed between the first electrode and the second electrode, or may be disposed in contact with the first electrode and the second electrode.

[0046] [Protective layer] In the organic light-emitting device of this embodiment, a protective layer may be provided on the second electrode. For example, by bonding glass provided with a moisture absorbent on the second electrode, it is possible to reduce the intrusion of water and the like into the organic compound layer and reduce the occurrence of display defects. In another embodiment, a passivation film such as silicon nitride may be provided on the cathode to reduce the intrusion of water and the like into the organic compound layer. For example, after forming the cathode, the cathode may be transported to another chamber without breaking the vacuum, and a silicon nitride film having a thickness of 2 μm may be formed by the CVD method to serve as a protective layer. A protective layer may be provided using an atomic deposition method (ALD method) after the film formation by the CVD method. The material of the film formed by the ALD method is not limited, and may be silicon nitride, silicon oxide, aluminum oxide, or the like. Silicon nitride may be further formed by the CVD method on the film formed by the ALD method. The film formed by the ALD method may have a smaller thickness than the film formed by the CVD method. Specifically, it may be 50% or less, or even 10% or less.

[0047] [Color Filter] In the organic light-emitting element of this embodiment, a color filter may be provided on the protective layer. For example, a color filter taking into consideration the size of the organic light-emitting element is provided on a separate substrate, and the organic light-emitting element is The color filter may be patterned on the protective layer by using a photolithography technique, or the color filter may be formed on the protective layer by using a substrate on which elements are provided. The color filter may be made of a polymer.

[0048] [Planarization layer] In the organic light-emitting device of this embodiment, a planarization layer may be provided between the color filter and the protective layer. The planarization layer is provided for the purpose of reducing the unevenness of the layer below. In addition, when the purpose is not limited, the planarization layer may be called a resin layer. The planarization layer may be composed of an organic compound, and may be a low molecular weight or a high molecular weight, but is preferably a high molecular weight.

[0049] The planarization layer may be provided above and below the color filter, and may be made of the same or different materials.Specific examples of the materials include polyvinylcarbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenol resin, epoxy resin, silicone resin, and urea resin.

[0050] [Microlens] The organic light-emitting element may have an optical member such as a microlens on its light-emitting side. The microlens may be made of acrylic resin, epoxy resin, or the like. The microlens may be intended to increase the amount of light extracted from the organic light-emitting element and control the direction of the extracted light. The microlens may have a hemispherical shape. When the microlens has a hemispherical shape, among the tangents to the hemisphere, there is a tangent that is parallel to the insulating layer, and the tangent and the hemisphere are the vertices of the microlens. The vertex of the microlens can be determined in the same manner in any cross-sectional view. That is, among the tangents to the semicircle of the microlens in the cross-sectional view, there is a tangent that is parallel to the insulating layer, and the tangent and the semicircle are the vertices of the microlens.

[0051] It is also possible to define the midpoint of the microlens. In the cross section of the microlens, a line segment is imaginary from a point where an arc shape ends to a point where another arc shape ends, and the midpoint of the line segment can be called the midpoint of the microlens. The cross section for determining the vertex and midpoint may be a cross section perpendicular to the insulating layer.

[0052] The microlens has a first surface having a convex portion and a second surface opposite to the first surface. It is preferable that the second surface is disposed closer to the functional layer than the first surface. To adopt such a configuration, it is necessary to form a microlens on the light-emitting device. When the functional layer is an organic layer, it is preferable to avoid processes that result in high temperatures in the manufacturing process. In addition, when adopting a configuration in which the second surface is disposed closer to the functional layer than the first surface, it is preferable that the glass transition temperatures of all organic compounds constituting the organic layer are 100°C or higher, and more preferably 130°C or higher.

[0053] [Opposite substrate] The organic light-emitting element of this embodiment may have an opposing substrate on the planarization layer. The opposing substrate is called an opposing substrate because it is provided at a position corresponding to the aforementioned substrate. The constituent material of the opposing substrate may be the same as that of the aforementioned substrate. When the aforementioned substrate is the first substrate, the opposing substrate may be the second substrate.

[0054] [Organic layer] The organic compound layers (hole injection layer, hole transport layer, electron blocking layer, light emitting layer, hole blocking layer, electron transport layer, electron injection layer, etc.) constituting the organic light emitting device of this embodiment are formed by the method shown below.

[0055] The organic compound layer constituting the organic light-emitting element of the present embodiment can be formed by a vacuum deposition method, an ionization deposition method, or the like. Dry processes such as sputtering and plasma can be used. Also, instead of the dry process, a wet process can be used in which a layer is formed by dissolving the material in an appropriate solvent and applying a known coating method (e.g., spin coating, dipping, casting, LB method, inkjet method, etc.).

[0056] Here, when the layer is formed by a vacuum deposition method or a solution coating method, crystallization is unlikely to occur and the layer has excellent stability over time. When the layer is formed by a coating method, the layer can be formed by combining with a suitable binder resin.

[0057] Examples of binder resins include, but are not limited to, polyvinylcarbazole resin, polycarbonate resin, polyester resin, ABS resin, acrylic resin, polyimide resin, phenol resin, epoxy resin, silicone resin, urea resin, etc. Furthermore, these binder resins may be used alone as homopolymers or copolymers, or may be used in combination of two or more types. Furthermore, known additives such as plasticizers, antioxidants, and ultraviolet absorbers may be used in combination as necessary.

[0058] [Pixel circuit] The light-emitting device having the organic light-emitting element of this embodiment may have a pixel circuit connected to the organic light-emitting element. The pixel circuit may be an active matrix type that controls the emission of the first organic light-emitting element and the second organic light-emitting element independently. The active matrix type circuit may be voltage programming or current programming. The drive circuit has a pixel circuit for each pixel. The pixel circuit may have an organic light-emitting element, a transistor that controls the emission luminance of the organic light-emitting element, a transistor that controls the emission timing, a capacitance that holds the gate voltage of the transistor that controls the emission luminance, and a transistor for connecting to GND without passing through the light-emitting element.

[0059] The light emitting device has a display region and a peripheral region arranged around the display region. The display region has a pixel circuit, and the peripheral region has a display control circuit. The mobility of a transistor constituting the pixel circuit may be smaller than the mobility of a transistor constituting the display control circuit. The slope of the current-voltage characteristic of the transistor constituting the pixel circuit may be smaller than the slope of the current-voltage characteristic of the transistor constituting the display control circuit. The slope of the current-voltage characteristic can be measured by the so-called Vg-Ig characteristic. The transistor constituting the pixel circuit is a transistor connected to a light emitting element such as a first organic light emitting element.

[0060] [Pixels] The organic light-emitting element of this embodiment has a plurality of pixels. Each pixel has sub-pixels that emit different colors. The sub-pixels may have, for example, RGB emission colors. The pixel emits light in the region of the pixel aperture. This region is the same as the first region. The aperture diameter of the pixel aperture may be 15 μm or less, or 5 μm or more. More specifically, the aperture diameter of the pixel aperture may be 11 μm, 9.5 μm, 7.4 μm, 6.4 μm, etc. In addition, the interval between the sub-pixels may be 10 μm or less, or more specifically, 8 μm, 7.4 μm, 6.4 μm.

[0061] The pixels may have a known arrangement in plan view. For example, they may be a stripe arrangement, a delta arrangement, a pentile arrangement, or a Bayer arrangement. The shape of the subpixels in plan view may be any known shape. For example, they may be a rectangle, a quadrangle such as a diamond, or a hexagon. Of course, if the shape is not an exact figure but is close to a rectangle, it is included in the rectangle. The shape of the subpixels and the pixel arrangement may be used in combination.

[0062] [Applications of organic light-emitting devices] The organic light-emitting element according to the present embodiment can be used as a component of a display device or a lighting device. Other uses of the organic light-emitting element include an exposure light source for an electrophotographic image forming device, a backlight for a liquid crystal display device, and a light-emitting device having a white light source and a color filter.

[0063] The display device may be an image information processing device having an image input unit that inputs image information from an area CCD, a linear CCD, a memory card, etc., an information processing unit that processes the input information, and displays the input image on a display unit.

[0064] The display unit of the imaging device or inkjet printer may have a touch panel function. The driving method of the touch panel function may be an infrared type, a capacitance type, a resistive film type, or an electromagnetic induction type, and is not particularly limited. The display device may be used in the display unit of a multifunction printer.

[0065] Next, a display device including an organic light-emitting element according to this embodiment will be described with reference to the drawings. Figures 9A and 9B are schematic cross-sectional views showing an example of a display device having an organic light-emitting element and a transistor connected to the organic light-emitting element. The transistor is an example of an active element. The transistor may be a thin film transistor (TFT).

[0066] FIG. 9A is an example of a pixel that is a component of a display device having an organic light-emitting element according to this embodiment. The pixel has subpixels 30. The subpixels are divided into 30R, 30G, and 30B according to their light emission. The emitted light color may be distinguished by the wavelength emitted from the light-emitting layer, or the light emitted from the subpixels may be selectively transmitted or color-converted by a color filter or the like. Each subpixel has a reflective electrode 32 as a first electrode on an interlayer insulating layer 31, and an insulating layer 33 covering the edge of the reflective electrode 32. Furthermore, the subpixel has an organic compound layer 34 that covers the reflective electrode 32 and the insulating layer 33, a transparent electrode 35 as a second electrode, a protective layer 36, and color filters 37R, 37G, and 37B.

[0067] A transistor and a capacitor may be disposed below or inside the interlayer insulating layer 31. The transistor and the first electrode may be electrically connected via a contact hole (not shown) or the like.

[0068] The insulating layer 33 is also called a bank or a pixel separation film. It covers the end of the first electrode and is disposed so as to surround the first electrode. The portion where the insulating layer is not disposed contacts the organic compound layer 34 and becomes a light-emitting region. The organic compound layer 34 has a hole injection layer 341, a hole transport layer 342, a first light-emitting layer 343, a second light-emitting layer 344, and an electron transport layer 345.

[0069] The transparent electrode 35 may be a transparent electrode, a reflective electrode, or a semi-transparent electrode as the second electrode. The protective layer 36 reduces the penetration of moisture into the organic compound layer. The protective layer 36 is illustrated as one layer, but may be multiple layers. Each layer may have an inorganic compound layer and an organic compound layer. The color filters are divided into color filters 37R, 37G, and 37B according to their colors. The color filters may be formed on a planarizing film (not shown). Also, a resin protective layer (not shown) may be provided on the color filters. Also, the color filters may be formed on the protective layer 36. Alternatively, the color filters may be provided on an opposing substrate such as a glass substrate and then bonded.

[0070] 9B shows a display device 100 having an organic light-emitting element of this embodiment. The display device 100 has an organic light-emitting element 26 and a TFT 18 as an example of a transistor. A substrate 11 made of glass, silicon, or the like is provided with an insulating layer 12 on top of it. An active element 18 such as a TFT is disposed on the insulating layer, and a gate electrode 13, a gate insulating film 14, a semiconductor A layer 15 is disposed on the TFT 18. The TFT 18 is also configured with a semiconductor layer 15, a drain electrode 16, and a source electrode 17. An insulating film 19 is provided on the top of the TFT 18. An anode 21 constituting an organic light emitting element 26 and the source electrode 17 are connected via a contact hole 20 provided in the insulating film.

[0071] The electrical connection between the electrodes (anode, cathode) included in the organic light-emitting element 26 and the electrodes (source electrode, drain electrode) included in the TFT is not limited to the embodiment shown in Fig. 9B. In other words, it is sufficient that either the anode or the cathode is electrically connected to either the TFT source electrode or the drain electrode. TFT stands for thin film transistor.

[0072] 9B, the organic compound layer 22 is illustrated as one layer, but may be a multi-layer organic compound layer 22. A first protective layer 24 and a second protective layer 25 are provided on the cathode 23 to reduce deterioration of the organic light-emitting element.

[0073] Although the display device 100 in Fig. 9B uses transistors as switching elements, other switching elements may be used instead. The transistors used in the display device 100 in Fig. 9B are not limited to transistors using single crystal silicon wafers, and may be thin film transistors having an active layer on an insulating surface of a substrate. Examples of the active layer include non-single crystal silicon such as single crystal silicon, amorphous silicon, and microcrystalline silicon, and non-single crystal oxide semiconductors such as indium zinc oxide and indium gallium zinc oxide. Thin film transistors are also called TFT elements.

[0074] The transistors included in the display device 100 of Fig. 9B may be formed in a substrate such as a Si substrate. Here, "formed in a substrate" means that the substrate itself such as a Si substrate is processed to produce the transistors. In other words, having a transistor in a substrate may mean that the substrate and the transistor are integrally formed.

[0075] The organic light-emitting element according to this embodiment has its light emission brightness controlled by a TFT, which is an example of a switching element, and by providing the organic light-emitting element on a plurality of surfaces, an image can be displayed based on the respective light emission brightnesses. The switching element according to this embodiment is not limited to a TFT, and may be a transistor formed of low-temperature polysilicon, or an active matrix driver formed on a substrate such as a Si substrate. On the substrate may also be within the substrate. Whether to provide a transistor within the substrate or to use a TFT is selected according to the size of the display unit. For example, if the size is about 0.5 inches, it is preferable to provide the organic light-emitting element on a Si substrate.

[0076] Next, Fig. 10 shows a schematic diagram illustrating an example of a display device having an organic light-emitting element according to this embodiment. The display device 1000 may have a touch panel 1003, a display panel 1005, a frame 1006, a circuit board 1007, and a battery 1008 between an upper cover 1001 and a lower cover 1009. The touch panel 1003 and the display panel 1005 are connected to flexible printed circuits FPC1002 and 1004. A transistor is printed on the circuit board 1007. The battery 1008 may not be provided if the display device is not a portable device, and may be provided in a different position even if the display device is a portable device.

[0077] The display device 1000 may have a color filter having red, green, and blue colors. The color filters may be arranged in a delta arrangement of the red, green, and blue colors. The display device 1000 may be used in a display unit of a mobile terminal. In this case, the display device 1000 may have both a display function and an operation function. Examples of the mobile terminal include mobile phones such as smartphones, tablets, and head-mounted displays.

[0078] Moreover, the display device 1000 may be used as a display unit of an imaging device having an optical unit with a plurality of lenses and an imaging element that receives light that has passed through the optical unit. The imaging device may have a display unit that displays information acquired by the imaging element. Moreover, the display unit may be a display unit exposed to the outside of the imaging device, or a display unit disposed within a viewfinder. The imaging device may be a digital camera or a digital video camera.

[0079] Next, FIG. 11A shows a schematic diagram illustrating an example of an imaging device having an organic light-emitting element according to this embodiment. The imaging device 1100 may have a viewfinder 1101, a rear display 1102, an operation unit 1103, and a housing 1104. The viewfinder 1101 may have a display device according to this embodiment. In this case, the display device may display not only an image to be captured, but also environmental information, imaging instructions, and the like. The environmental information may include the intensity of external light, the direction of external light, the moving speed of the subject, the possibility that the subject will be blocked by an obstruction, and the like.

[0080] Since the timing suitable for imaging is short, it is better to display information as soon as possible. Therefore, it is suitable to configure a display device with a fast response speed using the organic light-emitting element of this embodiment. A display device using an organic light-emitting element can be used more preferably than a liquid crystal display device, which requires a high display speed.

[0081] The imaging device 1100 has an optical section (not shown). The optical section has a plurality of lenses, which form an image on an imaging element housed in a housing 1104. The focus of the plurality of lenses can be adjusted by adjusting their relative positions. This operation can also be performed automatically. The imaging device may be called a photoelectric conversion device. The photoelectric conversion device can include an imaging method that does not capture images sequentially, but detects the difference from the previous image, cuts out an image from an image that is always recorded, and the like.

[0082] FIG. 11B is a schematic diagram showing an example of an electronic device having an organic light-emitting element according to this embodiment. The electronic device 1200 has a display unit 1201, an operation unit 1202, and a housing 1203. The housing 1203 may have a circuit, a printed circuit board having the circuit, a battery, and a communication unit. The operation unit 1202 may be a button or a touch panel type reaction unit. The operation unit may be a biometric recognition unit that recognizes a fingerprint and performs unlocking or the like. An electronic device having a communication unit can also be called a communication device. The electronic device 1200 may further have a camera function by including a lens and an image sensor. An image captured by the camera function is displayed on the display unit. Examples of the electronic device include a smartphone and a notebook computer.

[0083] Next, FIG. 12A shows a schematic diagram illustrating an example of a display device having an organic light-emitting element according to this embodiment. FIG. 12A shows a display device 1300 such as a television monitor or a PC monitor. The display device 1300 has a frame 1301 and a display unit 1302. The organic light-emitting element according to this embodiment may be used in the display unit 1302. The display device 1300 also has a frame 1301 and a base 1303 that supports the display unit 1302. The base 1303 is not limited to the form shown in FIG. 12A. The lower side of the frame 1301 may also serve as the base. The frame 1301 and the display unit 1302 may be curved. The radius of curvature may be 5000 mm or more and 6000 mm or less.

[0084] FIG. 12B is a schematic diagram showing another example of a display device having an organic light-emitting element according to this embodiment. The display device 1310 in FIG. 12B is configured to be bendable, and is a so-called foldable display device. The display device 1310 has a first display unit 1311, a second display unit 1312, a housing 1313, and a bending point 1314. The first display unit 1311 and the second display unit 1312 may have the organic light-emitting element according to this embodiment. The first display unit 1311 and the second display unit 1312 may be a single display device with no joints. The first display unit 1311 and the second display unit 1312 may be a single display device with no joints. It can be divided at a bending point from the second display unit 1312. The first display unit 1311 and the second display unit 1312 may each display different images, or the first display unit and the second display unit may display one image together.

[0085] Next, FIG. 13A shows a schematic diagram illustrating an example of a lighting device having an organic light-emitting element according to this embodiment. The lighting device 1400 may have a housing 1401, a light source 1402, a circuit board 1403, an optical film 1404, and a light diffusion unit 1405. The light source has the organic light-emitting element according to this embodiment. The optical filter may be a filter that improves the color rendering of the light source. The light diffusion unit can effectively diffuse the light of the light source, such as for lighting up, and deliver the light to a wide range. The optical filter and the light diffusion unit may be provided on the light emission side of the lighting. If necessary, a cover may be provided on the outermost part.

[0086] The lighting device 1400 is, for example, a device that illuminates a room. The lighting device may emit white, neutral white, or any other color from blue to red. It may have a dimming circuit that dims the light. The lighting device 1400 may have an organic light-emitting element according to this embodiment and a power supply circuit connected thereto. The power supply circuit is a circuit that converts AC voltage to DC voltage. Moreover, white has a color temperature of 4200K, and neutral white has a color temperature of 5000K. Moreover, the lighting device 1400 may have a color filter. Moreover, the lighting device 1400 may have a heat dissipation unit. The heat dissipation unit dissipates heat inside the device to the outside of the device, and examples of the heat dissipation unit include metals with high specific heat and liquid silicon.

[0087] 13B is a schematic diagram of an automobile, which is an example of a moving body having an organic light-emitting element according to this embodiment. The automobile has a tail lamp, which is an example of a lamp. The automobile 1500 has a tail lamp 1501, and may be configured to turn on the tail lamp when braking or the like is performed.

[0088] A tail lamp 1501 has an organic light-emitting element according to this embodiment. The tail lamp may have a protective member for protecting the organic EL element. The protective member may be made of any material as long as it has a certain degree of strength and is transparent, but is preferably made of polycarbonate or the like. Polycarbonate may be mixed with a furandicarboxylic acid derivative, an acrylonitrile derivative, or the like.

[0089] The automobile 1500 may have a body 1503 and a window 1502 attached thereto. The window may be a transparent display as long as it is not a window for checking the front and rear of the automobile. The transparent display may have an organic light-emitting element according to this embodiment. In this case, the constituent materials of the electrodes and the like of the organic light-emitting element are made of transparent members.

[0090] Furthermore, the moving object having the organic light-emitting element according to the present embodiment may be a ship, an aircraft, a drone, or the like. The moving object may have a body and a lamp provided on the body. The lamp may emit light to indicate the position of the body. The lamp has the organic light-emitting element according to the present embodiment.

[0091] In addition, the display device having the organic light-emitting element of this embodiment can be applied to a system that can be attached as a wearable device such as smart glasses, HMD, smart contacts, etc. The image capturing and display device used in such an application example has an image capturing device capable of photoelectrically converting visible light, and a display device capable of emitting visible light.

[0092] 14A shows glasses 1600 (smart glasses) as an application example of a display device having an organic light-emitting element of this embodiment. An imaging device 1602 such as a CMOS sensor or SPAD is provided on the front side of a lens 1601 of the glasses 1600. In addition, a display device of each of the above-mentioned embodiments is provided on the back side of the lens 1601.

[0093] The glasses 1600 further include a control device 1603. The control device 1603 functions as a power source that supplies power to the image capture device 1602 and the display device according to each embodiment. The control device 1603 also controls the operations of the image capture device 1602 and the display device. The lens 1601 is formed with an optical system for focusing light on the image capture device 1602.

[0094] FIG. 14B shows glasses 1610 (smart glasses) according to another application example of the display device having the organic light-emitting element of this embodiment. The glasses 1610 have a control device 1612. The control device 1612 is equipped with an imaging device corresponding to the imaging device 1602 and a display device. An optical system for projecting light emitted by the display device in the control device 1612 is formed in the lens 1611, and an image is projected onto the lens 1611. The control device 1612 functions as a power source that supplies power to the imaging device and the display device, and controls the operation of the imaging device and the display device. The control device may have a line-of-sight detection unit that detects the line of sight of the wearer. Infrared light may be used to detect the line of sight. The infrared light emission unit emits infrared light to the eyeball of a user gazing at a displayed image. An imaging unit having a light receiving element detects the reflected light of the emitted infrared light from the eyeball, thereby obtaining an image of the eyeball. By having a reduction means for reducing light from the infrared light emission unit to the display unit in a planar view, deterioration of image quality is reduced.

[0095] The gaze of the user with respect to the displayed image is detected from an image of the eyeball obtained by capturing infrared light. Any known method can be applied to gaze detection using the image of the eyeball. As an example, a gaze detection method based on a Purkinje image formed by reflection of irradiated light on the cornea can be used. More specifically, the gaze detection process is performed based on the pupil-corneal reflex method. Using the pupil-corneal reflex method, a gaze vector that indicates the direction (rotation angle) of the eyeball is calculated based on the pupil image and the Purkinje image included in the captured image of the eyeball, thereby detecting the user's gaze.

[0096] A display device having an organic light-emitting element according to this embodiment may have an imaging device having a light-receiving element, and may control a display image of the display device based on information on the user's line of sight from the imaging device.

[0097] Specifically, the display device determines a first field of view area to which the user gazes and a second field of view area other than the first field of view area based on the line-of-sight information. The first field of view area and the second field of view area may be determined by a control device of the display device, or may be determined by an external control device and received by the display device. In the display area of ​​the display device, the display resolution of the first field of view area may be controlled to be higher than the display resolution of the second field of view area. In other words, the resolution of the second field of view area may be lower than that of the first field of view area.

[0098] The display area may have a first display area and a second display area different from the first display area, and the display device may select an area with a high priority from the first display area and the second display area based on line-of-sight information. The first field of view area and the second field of view area may be determined by a control device of the display device, or may be determined by an external control device and received by the display device. The display device may control the resolution of the area with a high priority to be higher than the resolution of areas other than the area with a high priority. In other words, the display device may lower the resolution of an area with a relatively low priority.

[0099] The display device may use AI (Artificial Intelligence) to determine the first field of view area or the area with high priority. The AI ​​may be a model configured to estimate the angle of the line of sight and the distance to an object at the end of the line of sight from an image of the eyeball, using an image of the eyeball and the direction in which the eyeball in the image was actually looking as teacher data. The AI ​​program may be included in the display device, the imaging device, or an external device. If the external device has the AI ​​program, the AI ​​program is transmitted from the external device to the display device via communication.

[0100] When the display device controls display based on visual recognition detection, the display device can be preferably applied to smart glasses further including an imaging device for capturing an image of the outside world. The smart glasses can display captured outside information in real time. EXAMPLES

[0101] Next, examples of the deposition mask 1 according to the present embodiment will be described. Note that the deposition mask 1 according to the present embodiment is not limited to the deposition masks shown in the following examples.

[0102] The deposition mask 1 and the substrate were attached to each other and peeled off 80 times in the same manner as when performing vacuum deposition in a deposition apparatus. The results are shown in Table 1. [Table 1]

[0103] In the table, "deposition mask material" refers to the material used for the surface of the deposition mask 1 where the convex portion 5 comes into contact with the substrate. In addition, W in the "installation area" column indicates that the convex portion 5 is formed within the range of width W in the region 4 of the frame portion 8. In addition, W / 2 in the "installation area" column indicates that at least the convex portion 5 is formed within the range of width W / 2 from the boundary 3 in the region 4 of the frame portion 8. In addition, "◯" in the "material" column indicates that the material of the single or multiple convex portions formed on the deposition mask is a nonmagnetic material. "□" in the "material" column indicates that the material of the single or multiple convex portions formed on the deposition mask is a magnetic material. In addition, "◯□" in the "material" column indicates that the multiple convex portions formed on the deposition mask are a mixture of convex portions formed of a nonmagnetic material and convex portions formed of a magnetic material.

[0104] Furthermore, the "-" in the "Frame 8" and "Rafter 9" columns indicates that no protrusions are formed on the frame 8 or the rail 9. The diagonal lines in the "Rafter 10" column indicate that the deposition mask does not have rails 10 that are thinner than the rails 9. The numerical value in the "Deflection" column indicates the proportion of pixel openings in which deflection occurs among pixel openings in the deposition mask when the deposition mask is repeatedly peeled off from the substrate a predetermined number of times.

[0105] As can be seen from the results of Examples 1 to 11 of the deposition mask according to this embodiment in the table, regardless of the type of material of the deposition mask, according to this embodiment, even if the deposition mask is repeatedly peeled off from the substrate, the occurrence of bending and breakage can be suitably suppressed compared to the conventional deposition mask shown in the comparative example.

[0106] The disclosure of this embodiment includes the following configuration. (Configuration 1) In a deposition mask provided with a plurality of pixel openings corresponding to a deposition pattern to be deposited on a substrate, the plurality of pixel openings are arranged in a surface of the deposition mask facing the substrate, a convex portion made of a material different from that of the deposition mask is formed in a region from a pixel opening arranged in an outermost peripheral portion in the plane among the plurality of pixel openings to an end portion of the deposition mask; A deposition mask comprising: (Configuration 2) The deposition mask according to configuration 1, wherein, when a width of the region from the pixel opening arranged in the outermost peripheral portion is W, the convex portion is formed within a range of W / 2 from the pixel opening arranged in the outermost peripheral portion. (Configuration 3) 3. The deposition mask according to structure 1 or 2, wherein a convex portion made of a material different from that of the deposition mask is formed on at least a part of a crosspiece portion between the plurality of pixel openings on the surface. (Configuration 4) the deposition mask has a frame portion in contact with a support member of the deposition mask, and a first crosspiece portion and a second crosspiece portion formed between the plurality of pixel openings, When the thicknesses of the frame portion, the first rail portion, and the second rail portion in the thickness direction of the deposition mask are d1, d2, and d3, respectively, the following formula (1) is satisfied: d1 ≧ d2 ≧ d3 (1) 4. The deposition mask according to any one of configurations 1 to 3. (Configuration 5) The deposition mask according to configuration 4, wherein a convex portion made of a material different from that of the deposition mask is formed on at least a part of the second crosspiece on the surface. (Configuration 6) A plurality of the protrusions are formed on the second crosspiece, At least one of the plurality of protrusions formed on the second crosspiece is made of a magnetic material. 6. The deposition mask according to claim 5, (Configuration 7) 7. The deposition mask according to claim 1, wherein the convex portion is made of a magnetic material or a non-magnetic material. (Configuration 8) 8. The deposition mask according to any one of configurations 1 to 7, wherein the substrate is made of at least one material selected from the group consisting of quartz, glass, silicon, resin, and metal. (Method 1) A method for producing an organic light-emitting element, comprising forming an organic compound layer constituting an organic light-emitting element by using the deposition mask according to any one of configurations 1 to 8. (Configuration 9) 9. A display device comprising an organic light-emitting element having an organic compound layer formed using the deposition mask according to any one of configurations 1 to 8. (Configuration 10) 9. An imaging device comprising an organic light-emitting element having an organic compound layer formed using the deposition mask according to any one of configurations 1 to 8. (Configuration 11) A method for manufacturing a deposition mask according to any one of claims 1 to 8, comprising the steps of: forming an organic compound layer using the deposition mask according to any one of claims 1 to 8; An electronic device equipped with an organic light-emitting element. (Configuration 12) 9. A lighting device comprising an organic light-emitting element having an organic compound layer formed using the deposition mask according to any one of configurations 1 to 8. (Configuration 13) A mobile object including an organic light-emitting element having an organic compound layer formed using the deposition mask according to any one of configurations 1 to 8. [Explanation of symbols]

[0107] 1 deposition mask, 2 pixel aperture, 11 substrate, 5 protrusion

Claims

1. A deposition mask, a plurality of pixel openings are arranged in a surface of the deposition mask facing a substrate on which a deposition pattern is to be deposited; a convex portion containing a material different from a material contained in the deposition mask is formed in a region from a pixel opening arranged in an outermost peripheral portion in the plane among the plurality of pixel openings to an end of the deposition mask, In the deposition mask, a first crosspiece portion located between two adjacent pixel openings among the plurality of pixel openings contains the material contained in the deposition mask. A deposition mask characterized by:

2. 2. The deposition mask according to claim 1, wherein when a width of the region from the pixel opening arranged in the outermost peripheral portion is W, the convex portion is formed within a range of W / 2 from the pixel opening arranged in the outermost peripheral portion.

3. 2. The deposition mask according to claim 1, wherein the protrusion is formed on the first crosspiece.

4. The deposition mask has a frame portion that contacts a support member of the deposition mask, In a thickness direction of the deposition mask, the thickness of the frame portion is equal to or greater than the thickness of the first crosspiece portion.

2. The deposition mask according to claim 1.

5. the deposition mask has a frame portion in contact with a support member of the deposition mask, and a second crosspiece portion disposed between two adjacent pixel openings among the plurality of pixel openings, When the thicknesses of the frame portion, the first crosspiece portion, and the second crosspiece portion in the thickness direction of the deposition mask are d1, d2, and d3, respectively, the following formula (1) is satisfied: d1 ≧ d2 ≧ d3 ... (1) 2. The deposition mask according to claim 1.

6. The deposition mask according to claim 5 , wherein the convex portion is formed on the second crosspiece portion on the surface.

7. The deposition mask described in Claim 6, characterized in that the convex portion is formed from a magnetic material.

8. 2. The deposition mask according to claim 1, wherein the convex portions are made of a magnetic material or a non-magnetic material.

9. 2. The deposition mask according to claim 1, wherein the substrate is made of at least one material selected from the group consisting of quartz, glass, silicon, resin, and metal.

10. A method for manufacturing an organic light-emitting element, comprising forming an organic compound layer constituting an organic light-emitting element using the deposition mask according to claim 1 .

11. A display device comprising an organic light-emitting element having an organic compound layer formed using the deposition mask according to claim 1 .

12. An imaging device comprising an organic light-emitting element having an organic compound layer formed using the deposition mask according to claim 1 .

13. An electronic device comprising an organic light-emitting element having an organic compound layer formed using the deposition mask according to claim 1 .

14. A lighting device comprising an organic light-emitting element having an organic compound layer formed using the deposition mask according to claim 1 .

15. A moving body comprising an organic light-emitting element having an organic compound layer formed using the deposition mask according to claim 1 .

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