Provided is a
semiconductor nanoparticle-encapsulating
vinyl polymer including
vinyl polymer particles; and semi-conductor nanoparticles, uniformly dispersed in the
vinyl polymer particles, having an average particle size of 1 to 150 nm, wherein the
semiconductor nanoparticles are encapsulated by the vinyl
polymer particles. Provided is also a mixture of the
semiconductor nanoparticle-encapsulating vinyl
polymer with a commercially available vinyl
polymer. In the
nanoparticle-encapsulating vinyl polymer and the mixture, since the
semiconductor nanoparticles are encapsulated by the vinyl polymer particles, they are highly dispersed even in vinyl polymer products. Therefore; an
aggregation phenomenon of semi-conductor nanoparticles that may be caused by physical mixing of
semiconductor nanoparticles and a commercially available vinyl polymer can be prevented, thereby remarkably increasing a reduction in dioxin emission during
incineration of the wastes of vinyl polymer products. Furthermore, the
semiconductor nanoparticles of the
semiconductor nanoparticle-encapsulating vinyl polymer can remarkably increase
photodegradation efficiency due to the photocatalytic activity of the nanoparticles. In addition, the semiconductor nanoparticles of the
semiconductor nanoparticle-encapsulating vinyl polymer can serve as fillers, thereby enhancing mechanical properties such as tensile strength and modulus of elasticity without lowering
impact strength. In particular, in a flexible poly vinylchloride compound manufactured using semiconductor nanoparticles-encapsulating polyvinylchloride and a commercially available
phthalate-based low-molecular weight
liquid phase plasticizer, a
plasticizer migration phenomenon can be prevented by adsorptivity of highly dispersed semiconductor nanoparticles.