Provided is a 
semiconductor nanoparticle-encapsulating 
vinyl polymer including 
vinyl polymer particles; and semi-conductor nanoparticles, uniformly dispersed in the 
vinyl polymer particles, having an average particle size of 1 to 150 nm, wherein the 
semiconductor nanoparticles are encapsulated by the vinyl 
polymer particles. Provided is also a mixture of the 
semiconductor nanoparticle-encapsulating vinyl 
polymer with a commercially available vinyl 
polymer. In the 
nanoparticle-encapsulating vinyl polymer and the mixture, since the 
semiconductor nanoparticles are encapsulated by the vinyl polymer particles, they are highly dispersed even in vinyl polymer products. Therefore; an 
aggregation phenomenon of semi-conductor nanoparticles that may be caused by physical mixing of 
semiconductor nanoparticles and a commercially available vinyl polymer can be prevented, thereby remarkably increasing a reduction in dioxin emission during 
incineration of the wastes of vinyl polymer products. Furthermore, the 
semiconductor nanoparticles of the 
semiconductor nanoparticle-encapsulating vinyl polymer can remarkably increase 
photodegradation efficiency due to the photocatalytic activity of the nanoparticles. In addition, the semiconductor nanoparticles of the 
semiconductor nanoparticle-encapsulating vinyl polymer can serve as fillers, thereby enhancing mechanical properties such as tensile strength and modulus of elasticity without lowering 
impact strength. In particular, in a flexible poly vinylchloride compound manufactured using semiconductor nanoparticles-encapsulating polyvinylchloride and a commercially available 
phthalate-based low-molecular weight 
liquid phase plasticizer, a 
plasticizer migration phenomenon can be prevented by adsorptivity of highly dispersed semiconductor nanoparticles.