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Semiconductor nanoparticle-encapsulating vinyl polymer, vinyl polymer mixture includingthe same, and process of preparing the same

A vinyl polymer, nanoparticle technology, applied in nanotechnology, nanotechnology, nanotechnology for materials and surface science, etc., can solve problems such as technical defects, economic difficulties, etc., to improve mechanical properties, prevent migration, The effect of preventing agglomeration

Inactive Publication Date: 2007-04-18
SEOUL NAT UNIV R&DB FOUND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, based on TiO 2 The selective catalytic reduction system has shown excellent effect of eliminating dioxins, but due to the technical defects of process installations, there are some economical difficulties

Method used

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  • Semiconductor nanoparticle-encapsulating vinyl polymer, vinyl polymer mixture includingthe same, and process of preparing the same
  • Semiconductor nanoparticle-encapsulating vinyl polymer, vinyl polymer mixture includingthe same, and process of preparing the same
  • Semiconductor nanoparticle-encapsulating vinyl polymer, vinyl polymer mixture includingthe same, and process of preparing the same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0077] In this example, a vinyl polymer encapsulating semiconductor nanoparticles was prepared using suspension polymerization. For this, TiO 2 Nanoparticles As semiconductor nanoparticles, styrene was used as the vinyl monomer.

[0078] The additives used in this example are listed in Table 1 below. In Table 1, styrene monomer and polyvinyl alcohol (PVA) were purchased commercially from Aldrich, TiO 2 Nanoparticles were purchased from Degussa under the tradename P25, and azoisobutyronitrile (AIBN) was purchased from Junsei. Using Solsperse 24000 (available from Avecia KK) as a dispersion stabilizer, its number-average molecular weight is several thousand or greater, and a substance such as a nitrogen atom or a sulfur atom with a strong affinity for semiconductor nanoparticles is combined on its main chain, and Has multiple side chains with an affinity for styrene monomer.

[0079] First, stir and dissolve the dispersion stabilizer in the styrene monomer, and gradually add...

Embodiment 2

[0082] In this example, a vinyl polymer encapsulating semiconductor nanoparticles was prepared using emulsion polymerization. For this, TiO 2 Nanoparticles As semiconductor nanoparticles, styrene was used as the vinyl monomer.

[0083] Emulsion polymerization in this example is carried out in the same manner as in Example 1, except that SLS (purchased from Aldrich) is used as an emulsifier instead of PVA used as a surfactant in Example 1, and Potassium persulfate (KPS) (commercially available from Aldrich) was used as the initiator. The constituents and their contents used in this example are listed in Table 1 below. The reaction emulsion was centrifuged at 27000 rpm for 2 hours using a centrifuge to obtain a solid product. The solid product was isolated and dried to obtain encapsulated TiO 2 Nanoparticles of polystyrene powder. DLS analysis and SEM images show that the powder size ranges from tens of nanometers to several micrometers. TEM analysis reveals TiO with avera...

Embodiment 3

[0085] In this example, vinyl polymers encapsulating semiconductor nanoparticles were prepared using dispersion polymerization. For this, TiO 2 Nanoparticles As semiconductor nanoparticles, styrene was used as the vinyl monomer.

[0086] The dispersion polymerization of this example was carried out in the same manner as in Example 1, except that a mixture of ethanol and deionized water (94.5:5.5) was used as a dispersion medium and polyvinylpyrrolidone (available from Aldrich) was used as an emulsifier agent to replace the PVA used as surfactant in Example 1. In addition, in this example, instead of using the dispersion stabilizer (Solsperse) in Example 1, TiO surface-modified with 3-(methacryloyloxy)propyltrimethoxysilane was used. 2 nanoparticles. The constituents and their contents used in this example are listed in Table 1 below. The reaction dispersion was centrifuged at 27000 rpm for 2 hours using a centrifuge to obtain a solid. The solids were separated and dried t...

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Abstract

Provided is a semiconductor nanoparticle-encapsulating vinyl polymer including vinyl polymer particles; and semi-conductor nanoparticles, uniformly dispersed in the vinyl polymer particles, having an average particle size of 1 to 150 nm, wherein the semiconductor nanoparticles are encapsulated by the vinyl polymer particles. Provided is also a mixture of the semiconductor nanoparticle-encapsulating vinyl polymer with a commercially available vinyl polymer. In the nanoparticle-encapsulating vinyl polymer and the mixture, since the semiconductor nanoparticles are encapsulated by the vinyl polymer particles, they are highly dispersed even in vinyl polymer products. Therefore; an aggregation phenomenon of semi-conductor nanoparticles that may be caused by physical mixing of semiconductor nanoparticles and a commercially available vinyl polymer can be prevented, thereby remarkably increasing a reduction in dioxin emission during incineration of the wastes of vinyl polymer products. Furthermore, the semiconductor nanoparticles of the semiconductor nanoparticle-encapsulating vinyl polymer can remarkably increase photodegradation efficiency due to the photocatalytic activity of the nanoparticles. In addition, the semiconductor nanoparticles of the semiconductor nanoparticle-encapsulating vinyl polymer can serve as fillers, thereby enhancing mechanical properties such as tensile strength and modulus of elasticity without lowering impact strength. In particular, in a flexible poly vinylchloride compound manufactured using semiconductor nanoparticles-encapsulating polyvinylchloride and a commercially available phthalate-based low-molecular weight liquid phase plasticizer, a plasticizer migration phenomenon can be prevented by adsorptivity of highly dispersed semiconductor nanoparticles.

Description

technical field [0001] The present invention relates to a semiconductor nanoparticle-encapsulating vinyl polymer, a polymer mixture comprising the polymer, and a method for preparing the polymer. More specifically, the present invention relates to ethylene-wrapped semiconductor nanoparticles that can effectively adsorb dioxin (dioxin) and its precursors produced during the incineration of vinyl polymer product waste and significantly improve its photodegradation efficiency. Base polymers, polymer mixtures comprising the composition and methods of making the composition. Background technique [0002] Synthetic polymer products have been widely used in various industrial fields, such as daily necessities, construction, medical supplies, and agriculture, thereby making human life more convenient and comfortable. Consequently, the consumption of synthetic polymer products has been continuously increasing. However, unlike natural polymers, synthetic polymers do not readily deco...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J3/12
CPCC08J3/128C08J2325/08C08J3/12B82Y30/00B82Y40/00
Inventor 郭承烨崔廷铢
Owner SEOUL NAT UNIV R&DB FOUND
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