IC module-attached rubber product

Abstract

To provide a novel IC module-attached rubber product in which the failure risk of the IC module can be lowered compared to traditional products, and a production method for the same.SOLUTION: An IC module-attached rubber product 200 includes: a rubber laminate 100 in which a first rubber base material layer 10, a second rubber base material layer 20 and a third rubber base material layer 30 are laminated in this order; a polyethylene-based intermediate layer 40; and an IC module 50. The second rubber base material layer 20 has a through-hole 20a, and the polyethylene-based intermediate layer 40 and the IC module 50 are laminated and housed in the through-hole.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a rubber product with an IC module. [Background technology]

[0002] Currently, non-contact communication media such as IC (Integrated Circuit) modules are widely used.

[0003] Until now, it has not been easy to make products with IC modules embedded in rubber, i.e. rubber products with IC modules. In particular, when using unvulcanized rubber materials to make rubber products, there are problems such as the IC modules embedded in the rubber being damaged by the vulcanization temperature and pressure.

[0004] In response to this problem, Patent Document 1 discloses a method for manufacturing an IC tag with a rubber cover. More specifically, the method of Patent Document 1 is a method for manufacturing an IC tag with a rubber cover, which is made by sandwiching an IC tag with a rubber cover consisting of an IC tag and a rubber cover covering the IC tag between two or more unvulcanized rubber sheets and then vulcanizing the unvulcanized rubber sheets with the IC tag sandwiched between them, characterized in that, prior to sandwiching the IC tag between the two or more unvulcanized rubber sheets, a recess having a depth that is equal to or greater than the thickness of the IC tag and equal to or less than the thickness of the IC tag + 2 mm as a whole is provided in advance in one or more of the two or more unvulcanized rubber sheets, the IC tag is disposed in the recess, and the unvulcanized rubber sheets are vulcanized under a pressure of equal to or greater than atmospheric pressure and equal to or less than atmospheric pressure + 0.2 MPa at a temperature equal to or less than the heat resistance temperature of the IC tag. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] JP 2009-134567 A Summary of the Invention [Problem to be solved by the invention]

[0006] The manufacturing method of Patent Document 1 discloses that the IC tag is disposed in a recess having a depth equal to or greater than the thickness of the IC tag and equal to or less than the thickness of the IC tag plus 2 mm. However, it is difficult to adjust the relationship between the depth of the recess in the rubber sheet and the thickness of the IC tag, and furthermore, the following problems are thought to arise.

[0007] That is, if the depth of the recess in the rubber sheet is greater than the thickness of the IC tag, the IC tag in the rubber will move freely when carrying such a rubber-covered IC tag, which may cause a problem of the IC tag breaking down.Also, if the depth of the recess in the rubber sheet is the same as the thickness of the IC tag, the IC tag will be harder than normal rubber materials, so that a physical load will be applied to the IC tag when the rubber-covered IC tag is deformed, which may cause a problem of the IC tag breaking down.

[0008] Therefore, there is still room for improvement in the production of such rubber products equipped with IC modules or IC tags.

[0009] An object of the present invention is to provide a novel rubber product with an IC module, which can reduce the risk of IC module failure compared to conventional methods, and a manufacturing method thereof. [Means for solving the problem]

[0010] The present invention which achieves the above object is as follows.

[0011] <Aspect 1> a rubber laminate in which a first rubber base layer, a second rubber base layer, and a third rubber base layer are laminated in this order; A polyethylene-based intermediate layer; IC module and Including, the second rubber base layer has a through hole, and the polyethylene-based intermediate layer and the IC module are housed in the through hole in a laminated manner; Rubber products with IC modules. <Aspect 2> 2. The rubber product with an IC module according to claim 1, wherein the through hole has the same general shape as the IC module. <Aspect 3> 3. The rubber product with an IC module according to claim 1 or 2, wherein the thickness of the second rubber base layer is approximately the same as the total thickness of the polyethylene-based intermediate layer and the IC module. <Aspect 4> a first adhesive layer between the first rubber substrate layer and the second rubber substrate layer, and / or a second adhesive layer between the second rubber substrate layer and the third rubber substrate layer; The rubber product with an IC module according to any one of aspects 1 to 3, further comprising: <Aspect 5> The rubber product with an IC module according to any one of aspects 1 to 4, wherein the rubber materials constituting the first rubber base layer, the second rubber base layer, and the third rubber base layer include a vulcanized rubber material. <Aspect 6> 6. The rubber product with an IC module according to claim 1, wherein a material constituting the polyethylene-based intermediate layer includes foamed polyethylene. Aspect 7 Further comprising at least one outermost layer; and 7. The rubber product with an IC module according to any one of aspects 1 to 6, wherein the outermost layer is made of a material containing a vulcanized rubber material. <Aspect 8> The rubber product with an IC module according to any one of aspects 1 to 7, which is a key holder. <Aspect 9> A method for producing a rubber product with an IC module according to any one of claims 1 to 8, comprising the steps of: After the IC module is accommodated in the through hole, no thermal compression step is performed. method. Effect of the Invention

[0012] According to the present invention, it is possible to provide a novel rubber product with an IC module, which can reduce the risk of failure of the IC module compared to conventional methods, and a manufacturing method thereof. [Brief description of the drawings]

[0013] [Figure 1] FIG. 1 is a schematic cross-sectional view showing one embodiment of the configuration of a rubber product with an IC module of the present invention. [Diagram 2] FIG. 2 is a schematic cross-sectional view showing another embodiment of the configuration of the rubber product with an IC module of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0014] Hereinafter, the embodiments for carrying out the present invention will be described in detail with reference to the drawings. For convenience of explanation, the same or corresponding parts in each drawing are given the same reference numerals, and duplicate explanations will be omitted. Not all components of the embodiment are essential, and some components may be omitted. However, the embodiments shown in the following drawings are merely examples of the present invention, and do not limit the present invention.

[0015] <Rubber products with IC modules> The rubber product with IC module of the present invention is a rubber laminate in which a first rubber base layer, a second rubber base layer, and a third rubber base layer are laminated in this order; A polyethylene-based intermediate layer; IC module and Including, the second rubber base layer has a through hole, and the polyethylene intermediate layer and the IC module are housed in the through hole so as to be laminated; Rubber products with IC modules It is.

[0016] The rubber product with an IC module of the present invention can reduce the risk of IC module failure, as compared to, for example, the IC tag with a rubber cover of Patent Document 1.

[0017] Without being limited by theory, this is believed to be mainly an effect derived from the feature that the second rubber base layer of the rubber product with IC module of the present invention has a through hole, and the polyethylene-based intermediate layer and the IC module are accommodated in the through hole so as to be laminated. That is, it is believed that the free movement of the IC module in the rubber product during carrying can be suppressed by laminating the polyethylene-based intermediate layer on the IC module. In addition, since the polyethylene-based intermediate layer is different from the rubber material, even if a bending load is applied to the rubber material, the polyethylene-based intermediate layer has a relatively low friction force with the adjacent rubber base layer (compared to the friction force between the rubber base layers), and therefore is not pulled by the adjacent rubber base layer, and can play a role of protecting the IC module from the bending load. As a result, it is possible to reduce the risk of failure of the IC module according to the present invention.

[0018] In the present invention, the concept of a rubber product with an IC module includes, for example, the "IC tag with a rubber cover" described in Patent Document 1.

[0019] FIG. 1 is a schematic cross-sectional view showing one embodiment of the configuration of a rubber product with an IC module of the present invention.

[0020] As shown in FIG. 1, the rubber product 200 with an IC module of the present invention includes a rubber laminate 100 in which a first rubber base layer 10, a second rubber base layer 20, and a third rubber base layer 30 are laminated in this order, a polyethylene-based intermediate layer 50, and an IC module 50. Here, the second rubber base layer 20 has a through hole 20a. The polyethylene-based intermediate layer 50 and the IC module 50 are accommodated in the through hole 20a so as to be laminated. Note that in FIG. 1 and FIG. 2 described later, for convenience of illustration, it appears that there is a gap between each component, but in reality, each adjacent component is in close contact with each other or in close contact with each other via another layer.

[0021] <Rubber laminate> The rubber product with an IC module of the present invention includes a rubber laminate, which includes a first rubber substrate layer, a second rubber substrate layer, and a third rubber substrate layer.

[0022] In the present invention, the rubber materials constituting the first, second and third rubber base layers are not particularly limited, but preferably contain a vulcanized rubber material, and more preferably do not contain an unvulcanized rubber material, because the use of a vulcanized rubber material eliminates the need for a vulcanization process and reduces the risk of the IC module failing due to the vulcanization temperature or pressure.

[0023] Therefore, in the present invention, the rubber material constituting the first rubber base layer, the second rubber base layer, and the third rubber base layer can be obtained, for example, by molding and vulcanizing a rubber composition. Here, the rubber contained in the rubber composition is not particularly limited, and may be selected according to the application. For example, the rubber contained in the rubber composition includes, but is not limited to, fluororubber (FKM); diene rubber such as natural rubber (NR), styrene-butadiene rubber (SBR), isoprene rubber (IR), butadiene rubber (BR), chloroprene rubber (CR), and acrylonitrile-butadiene rubber (NBR); butyl rubber (IIR); ethylene-propylene rubber (EPM); ethylene-propylene-diene rubber (EPDM); urethane rubber (U); silicone rubber (Q); ethylene acrylic rubber (AEM); and acrylic rubber (ACM).

[0024] In the present invention, the first rubber substrate layer, the second rubber substrate layer, and the third rubber substrate layer may each be made of the same rubber material or different rubber materials. The first rubber substrate layer, the second rubber substrate layer, and the third rubber substrate layer may each independently further contain at least one component other than rubber selected from the group consisting of a vulcanizing agent, a vulcanization aid, a vulcanization accelerator, a vulcanization retarder, an adhesive, an acid acceptor, a colorant, a filler, a plasticizer, a processing aid, and an antioxidant.

[0025] Of course, the first rubber base layer, the second rubber base layer, and the third rubber base layer according to the present invention may be made of commercially available vulcanized rubber sheets as they are.

[0026] In the present invention, the hardness of the first rubber base layer, the second rubber base layer, and the third rubber base layer is not particularly limited and may be the same or different. The hardness of these rubber base layers may be the same as the hardness of the IC module or may be lower than the hardness of the IC module. In the present invention, the hardness can be determined, for example, in accordance with "Determination of durometer hardness of vulcanized rubber and thermoplastic rubber" described in JIS K 6253-3:2012.

[0027] In the present invention, the thickness and shape of the rubber laminate are not particularly limited, and may be appropriately set depending on the purpose.

[0028] The thicknesses of the first rubber base layer, the second rubber base layer, and the third rubber base layer included in the rubber laminate are not particularly limited, and may be approximately the same, for example, from the viewpoint of ease of material procurement, cost, etc. In addition, from the viewpoint of eliminating the complexity of the manufacturing process due to the use of the same sheet and from the viewpoint of inexpensive manufacturing by using the same sheet, it is preferable that the first rubber base layer, the second rubber base layer, and the third rubber base layer are each prepared based on a desired shape from the same sheet. In the present invention, "approximately the same thickness" means that the difference between the thicknesses to be compared is within ±10%, ±5.0%, ±2.0%, ±1.0%, ±0.5%, or ±0.1%.

[0029] As an example, the thickness of the first rubber base layer, the second rubber base layer, and the third rubber base layer according to the present invention may each independently be 0.5 mm or more, 1.0 mm or more, 1.5 mm or more, 2.0 mm or more, 2.5 mm or more, 3.0 mm or more, 3.5 mm or more, 4.0 mm or more, 4.5 mm or more, or 5.0 mm or more, and may be 30 mm or less, 25 mm or less, 20 mm or less, 15 mm or less, 10 mm or less, or 5.0 mm or less.

[0030] In the present invention, since the second rubber base layer houses the IC module in its through hole, it is preferable that the thickness of the second rubber base layer is approximately the same as the total thickness of the polyethylene-based intermediate layer and the IC module.

[0031] In the present invention, the second rubber base layer has a through hole, which is a space for accommodating the IC module and the polyethylene-based intermediate layer according to the present invention.

[0032] From the viewpoint of improving the effect of the present invention, it is preferable that the through hole has the same general shape as the IC module. In the present invention, the through hole having the same general shape as the IC module means that the through hole has a shape capable of accommodating the bottom surface of the IC module (e.g., the surface to be laminated with the third rubber base layer), and the area of ​​the accommodating surface of the through hole may be 5% or less, 4% or less, 3% or less, 2% or less, 1% or less, 0.5% or less, 0.1% or less of the area of ​​the bottom surface of the IC module, or may be substantially the same as the area of ​​the bottom surface of the IC module.

[0033] <Polyethylene-based intermediate layer> The rubber product with an IC module of the present invention includes a polyethylene-based intermediate layer. The polyethylene-based intermediate layer is accommodated in the through hole of the second rubber base layer so as to be laminated with the IC module. In the present invention, the polyethylene-based intermediate layer has a function of protecting the IC module.

[0034] In addition, while Figure 1 shows an embodiment in which one polyethylene-based intermediate layer 40 is accommodated in the through hole of the second rubber base layer so as to be laminated with the IC module, the rubber product with IC module of the present invention may include two or more polyethylene-based intermediate layers, which may be arranged so as to be laminated, for example, on one side, preferably both sides, of the IC module.

[0035] In the present invention, the material constituting the polyethylene-based intermediate layer is not particularly limited and may be, for example, a polyethylene-based resin. In addition, from the viewpoint of further improving the cushioning effect, it is preferable that the material constituting the polyethylene-based intermediate layer contains foamed polyethylene.

[0036] In the present invention, the thickness of the polyethylene-based intermediate layer is not particularly limited and may be appropriately set according to the purpose and in accordance with the depth of the through-holes of the second rubber base layer, the thickness of the IC module, etc. As an example, the thickness of the polyethylene-based intermediate layer may be 0.01 mm or more, 0.05 mm or more, 0.10 mm or more, 0.20 mm or more, 0.30 mm or more, 0.40 mm or more, 0.50 mm or more, 0.60 mm or more, 0.70 mm or more, 0.80 mm or more, 0.90 mm or more, or 1.0 mm or more, and may be 25 mm or less, 20 mm or less, 15 mm or less, 10 mm or less, 5.0 mm or less, or 1.0 mm or less.

[0037] In the present invention, the hardness of the polyethylene-based intermediate layer is not particularly limited, and may be the same as the hardness of the IC module, or may be lower than the hardness of the IC module.

[0038] In the present invention, the shape of the polyethylene-based intermediate layer is not particularly limited, and may, for example, have the same general shape as the above-mentioned through hole, or may have a shape within ±10%, ±8.0%, ±5.0%, ±1.0%, ±0.5%, or ±0.1% of the area of ​​the accommodating surface of the through hole, or may have an area that is the same as the area of ​​the accommodating surface of the through hole. <IC module> In the present invention, the IC module is not particularly limited as long as it has a configuration capable of non-contact communication with the reader / writer. For example, the IC module may include a substrate, an antenna, and an IC chip. The IC module may further include a sealing portion that seals the substrate and the IC chip.

[0039] The material constituting the substrate is not particularly limited and may be, for example, glass-epoxy, polyimide, etc. The substrate has a terminal that can be connected to the contact terminal of the antenna. The material constituting this terminal may be any conductive material, and may be, for example, a metal such as copper, gold, or aluminum.

[0040] The antenna may generally have an antenna portion and a contact terminal portion. The antenna portion is a portion having a non-contact communication function, and may be formed, for example, by winding a conductor wire in a coil shape (spiral shape). The contact terminal portion is a portion that serves to make electrical contact with a terminal of an IC chip. The antenna is not particularly limited, and may be a wound antenna or an etched antenna.

[0041] The IC chip can be electrically connected to the antenna. The IC chip is not particularly limited, and may be, for example, an IC chip for communication standards such as ISO14443 Type A (mifare, etc.), ISO14443 Type B, ISO18092 FeliCa, ISO15693, or other contactless card IC chips.

[0042] The material constituting the sealing portion is not particularly limited, and may be, for example, a thermosetting resin such as an epoxy resin, an acrylic resin, a urethane resin, or a phenol resin.

[0043] <Other configurations> The rubber product with an IC module of the present invention may further include other configurations in addition to the configurations described above. The other configurations will be described below as examples, but the present invention is not limited to these configurations.

[0044] (Adhesive layer) The rubber product with an IC module of the present invention may further include an adhesive layer.

[0045] More specifically, for example, the laminate may further include a first adhesive layer between the first rubber substrate layer and the second rubber substrate layer, and / or a second adhesive layer between the second rubber substrate layer and the third rubber substrate layer.

[0046] FIG. 2 is a schematic cross-sectional view showing one embodiment of the configuration of the rubber product with an IC module of the present invention when it includes an adhesive layer.

[0047] 2, the rubber product 201 with an IC module of the present invention includes a rubber laminate 101 in which a first rubber base layer 11, a second rubber base layer 21, and a third rubber base layer 31 are laminated in this order, a polyethylene-based intermediate layer 41, and an IC module 51, and the second rubber base layer 21 has a through hole 21a, and the polyethylene-based intermediate layer 41 and the IC module 51 are accommodated in the through hole 21a so as to be laminated. Here, the rubber product 201 with an IC module of the present invention further includes a first adhesive layer 60a between the first rubber base layer 11 and the second rubber base layer 21, and a second adhesive layer 60b between the second rubber base layer 21 and the third rubber base layer 31.

[0048] In this way, the first rubber base layer 11 and the second rubber base layer 21, and the second rubber base layer 21 and the third rubber base layer 31 can be bonded to each other via the first adhesive layer 60a and the second adhesive layer 60b, respectively.

[0049] In the present invention, the adhesive layer may be formed by coating, or a double-sided tape may be used. The adhesive layer formed by coating or the adhesive portion of the double-sided tape may be formed by any adhesive or adhesive, and is preferably formed by an adhesive or adhesive that utilizes a pressure bonding method or pressure reaction. The adhesive layer may be formed by a so-called "reactive hot melt adhesive". Here, the reactive hot melt adhesive is an adhesive that does not require the application of heat, for example, one that utilizes moisture curing or low temperature melting. The main component of the reactive hot melt adhesive may include EVA, olefin, synthetic rubber, polyamide, polyester, etc.

[0050] In the present invention, the thickness of the adhesive layer is not particularly limited as long as it is thick enough to bond two adjacent rubber substrate layers together.

[0051] (outermost layer) The rubber product with an IC module of the present invention may further include at least one outermost layer.

[0052] The outermost layer may be provided, for example, only on the front surface of the rubber laminate, or on both the front surface and the back surface of the rubber laminate.

[0053] The outermost layer may be made of any material. When the outermost layer is made of a material containing a rubber material, it is preferable that such a material contains a vulcanized rubber material, and more preferably does not contain an unvulcanized rubber material. This is because the use of a vulcanized rubber material makes the vulcanization process unnecessary, and reduces the risk of the IC module breaking down due to the vulcanization temperature or vulcanization pressure. In the present invention, the rubber material and other components constituting the outermost layer may be appropriately selected from, for example, the rubber material and other components constituting the above-mentioned "rubber base layer".

[0054] Depending on the purpose, a colored rubber may be used as the outermost layer, and designs such as printing or figures may be drawn on it, or cutting or laser cutting may be performed.

[0055] 《Application》 The rubber product with an IC module of the present invention has an IC module built in and is suitable for a variety of uses.

[0056] For example, the rubber product with an IC module of the present invention may be a so-called “key holder.” The key holder may have any shape and any design.

[0057] <Manufacturing method for rubber products with IC modules> The method for producing the rubber product with an IC module of the present invention is not particularly limited, and may be, for example, a method including the following steps (i) to (iv).

[0058] (i) providing a first rubber substrate layer, a second rubber substrate layer, and a third rubber substrate layer, respectively; (ii) providing a through hole in the second rubber substrate layer to accommodate the polyethylene-based intermediate layer and the IC module; (iii) housing a polyethylene-based intermediate layer and an IC module in the through hole of the second rubber base layer; and (iv) laminating the first rubber base layer, the second rubber base layer, and the third rubber base layer to form a rubber laminate.

[0059] In the present invention, the above steps (iii) and (iv) may be performed simultaneously. For example, after laminating a second rubber base layer having a through hole and a third rubber base layer, a polyethylene-based intermediate layer and an IC module may be accommodated in the through hole of the second rubber base layer. Then, after accommodating the polyethylene-based intermediate layer and the IC module, the first rubber base layer may be laminated with the second rubber base layer.

[0060] Furthermore, in step (iii), when the polyethylene-based intermediate layer and the IC module are housed, the polyethylene-based intermediate layer and the IC module may be housed in a stacked state in order, or the polyethylene-based intermediate layer and the IC module may be housed simultaneously in a stacked state.

[0061] In the present invention, when forming the rubber laminate, the first rubber base layer, the second rubber base layer, and the third rubber base layer may be laminated via an adhesive layer by utilizing a pressure bonding method or a pressure reaction. In addition, if the adhesive layer is formed of a reactive hot melt adhesive, the first rubber base layer, the second rubber base layer, and the third rubber base layer may be laminated by utilizing moisture curing or low temperature melting.

[0062] Furthermore, from the viewpoint of reducing the risk of failure of the IC module, it is preferable that the manufacturing method of the rubber product with an IC module of the present invention does not include a heat compression step after accommodating the IC module in the through hole. EXAMPLES

[0063] The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples.

[0064] Example 1 A rubber product with an IC module of Example 1 was produced based on the configuration shown in Figure 2. The components used are as follows:

[0065] First rubber base layer (thickness 1.0 mm): KGR-1300 manufactured by Mitsumitsu Second rubber base layer (thickness 1.0 mm): KGR-1300 manufactured by Mitsukoshi Third rubber base layer (thickness 1.0 mm): KGR-1300 manufactured by Mitsukoshi Through hole size: 26.0mm (long side) x 26.0mm (short side) x 1.0mm (thickness) Polyethylene-based intermediate layer (25.0 mm (long side) x 25.0 mm (short side) x 0.5 mm (thickness)): Miramat (foamed polyethylene sheet) manufactured by JSP IC module size: 25.0mm (long side) x 25.0mm (short side) x 0.5mm (thickness) A first adhesive layer between the first rubber base layer and the second rubber base layer: thickness 0.16 mm A second adhesive layer between the second rubber base layer and the third rubber base layer: thickness 0.16 mm

[0066] The first adhesive layer and the second adhesive layer were both acrylic adhesive tapes, and 5000NSWH manufactured by Nitto Denko Corp. The pressure bonding conditions were as follows: a load of 50 kg was applied to the entire layer for 5 seconds.

[0067] Comparative Examples 1 and 2 For Comparative Examples 1 and 2, a rubber product with an IC module of Comparative Example 1 was produced in the same manner as in Example 1, except that a "PET sheet (W400J, manufactured by Mitsubishi Chemical Corporation)" and a "PET-G sheet (PG700M, manufactured by Taihei Chemical Products Co., Ltd.)" were used instead of the above-mentioned "polyethylene-based intermediate layer."

[0068] "evaluation" Using a drop tester, a destructive test was conducted on each sample of Example 1, Comparative Example 1, and Comparative Example 2. The destructive test is a test to confirm IC failure when the sample is freely dropped onto concrete from a height of 3.0 m. The destructive test was conducted on each sample so that it collided with concrete in three directions, the long side direction, the short side direction, and the face direction.

[0069] As a result, it was found that the IC module of the rubber product with an IC module of Example 1 did not break down, whereas the IC module of the rubber products with an IC module of Comparative Examples 1 and 2 did break down. [Explanation of symbols]

[0070] 10, 11 First rubber base layer 20, 21 Second rubber base layer 20a, 21a through hole 30, 31 Third rubber base layer 40, 41 Polyethylene intermediate layer 50, 51 IC module 60a First adhesive layer 60b Second adhesive layer 100, 101 Rubber laminate 200, 201 Rubber products with IC modules

Claims

1. a rubber laminate in which a first rubber base layer, a second rubber base layer, and a third rubber base layer are laminated in this order; A polyethylene-based intermediate layer; IC module and Including, the second rubber base layer has a through-hole, and the polyethylene-based intermediate layer and the IC module are housed in the through-hole so as to be laminated; Rubber products with IC modules.

2. 2. The rubber product with an IC module according to claim 1, wherein said through-hole has the same general shape as said IC module.

3. 2. The rubber product with an IC module according to claim 1, wherein the thickness of the second rubber base layer is approximately the same as the total thickness of the polyethylene-based intermediate layer and the IC module.

4. a first adhesive layer between the first rubber substrate layer and the second rubber substrate layer; and / or a second adhesive layer between the second rubber substrate layer and the third rubber substrate layer; The rubber product with an IC module according to claim 1 , further comprising:

5. 2. The rubber product with an IC module according to claim 1, wherein the rubber materials constituting the first rubber base layer, the second rubber base layer, and the third rubber base layer include vulcanized rubber materials.

6. 2. The rubber product with an IC module according to claim 1, wherein the material constituting the polyethylene-based intermediate layer includes foamed polyethylene.

7. further comprising at least one outermost layer; and 2. The rubber product with an IC module according to claim 1, wherein the outermost layer is made of a material containing a vulcanized rubber material.

8. 2. The rubber product with an IC module according to claim 1, which is a key holder.

9. A method for producing a rubber product with an IC module according to any one of claims 1 to 8, comprising: After the IC module is accommodated in the through-hole, no thermal compression step is performed. method.

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