Light emitting device

Abstract

To provide a light emitting device that enables downsizing of a package.SOLUTION: A light emitting device comprises: an optical member having a first light emitting element with a light emitting surface, a lower surface, a first reflective surface that is inclined with respect to the lower surface and transmits a portion of the first light emitted from the light emitting surface of the first light emitting element and reflects the rest upward, and a second reflective surface located further from the light emitting surface of the first light emitting element than the first reflective surface and reflecting part or all of the first light transmitted through the first reflective surface; and a photodetector located below the optical member and having an upper surface with one or more light-receiving regions including a first light-receiving region that receives the first light reflected by the second reflective surface. In the top view, part or all of the first light-receiving region overlaps part or all of the first reflecting surface.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present disclosure relates to a light emitting device. [Background technology]

[0002] Conventionally, optical units are known that receive a part of the light emitted from a light-emitting element with a photoelectric conversion element and perform optical control based on the light reception result. For example, Patent Document 1 discloses an optical unit that includes a laser diode, a mirror having a reflective surface that reflects a part of the light emitted from the laser diode, and a photodiode that is disposed on the back side opposite to the reflective surface of the mirror and receives the light that has passed through the mirror. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2017-98301 A Summary of the Invention [Problem to be solved by the invention]

[0004] To provide a light emitting device capable of reducing the size of its package. [Means for solving the problem]

[0005] In an exemplary but non-limiting embodiment, the light emitting device of the present disclosure includes an optical member having a first light emitting element having a light emitting surface, a bottom surface, a first reflecting surface inclined with respect to the bottom surface, which transmits a portion of a first light emitted from the light emitting surface of the first light emitting element and reflects the remainder upward, and a second reflecting surface located farther from the light emitting surface of the first light emitting element than the first reflecting surface and reflects a portion or all of the first light transmitted through the first reflecting surface; and a first light receiving region located below the optical member and receiving the first light reflected by the second reflecting surface. a photodetector having an upper surface on which a plurality of light receiving regions are provided, and in a top view, a part or all of the first light receiving regions overlap a part or all of the first reflecting surface. Effect of the Invention

[0006] According to the light emitting device of the present disclosure, it is possible to provide a light emitting device that allows the package to be made smaller. [Brief description of the drawings]

[0007] [Figure 1] FIG. 1 is a perspective view of a light emitting device according to an embodiment of the present disclosure. [Diagram 2] FIG. 2 is a perspective view of the light emitting device according to the embodiment of the present disclosure with a lid of the package removed. [Diagram 3] FIG. 3 is a top view of the light emitting device according to the embodiment of the present disclosure with the lid of the package removed. [Figure 4] FIG. 4 is a cross-sectional view taken along line IV-IV in FIG. [Diagram 5] FIG. 5 is a top view illustrating an example of wiring inside the package. [Figure 6] FIG. 6 is an enlarged view of a portion X in the top view of FIG. 5 in a state in which the optical members are removed from the light emitting device according to the embodiment of the present disclosure. [Figure 7] FIG. 7 is an exploded perspective view showing a state in which the optical members are separated from the photodetector. [Figure 8A] FIG. 8A is a diagram showing a typical optical path of light that passes through a first reflecting surface of an optical member and reaches a light receiving region of a photodetector. [Figure 8B] FIG. 8B is a top view showing the positional relationship between the first reflecting surface of the optical member and three light receiving regions provided on the light receiving surface of the photodetector. [Figure 9A] FIG. 9A is a diagram showing a typical optical path of light that passes through a first reflecting surface of another optical member and reaches a light receiving region of a photodetector. [Figure 9B]FIG. 9B is a top view showing the positional relationship between the first reflecting surface of the other optical member and three light receiving regions provided on the light receiving surface of the photodetector. [Figure 10] FIG. 10 is an exploded perspective view showing an optical member, one or more filters, and a photodetector. [Figure 11] FIG. 11 is a top view showing one or more filters disposed on the light receiving surface of a photodetector. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] In this specification and claims, polygons such as triangles and quadrangles are not limited to polygons in the strict mathematical sense, but also include shapes in which the corners of the polygon have been processed, such as rounded corners, chamfered corners, or rounded corners. In addition, shapes in which processing has been applied to the middle part of a side, not just the corners (edges) of a polygon, are also referred to as polygons. In other words, shapes in which partial processing has been applied while leaving the polygon as the base are included in the "polygon" described in this specification and claims.

[0009] This is not limited to polygons, but also applies to words that describe specific shapes such as trapezoids, circles, and irregular shapes. The same is true when dealing with each side that forms the shape. In other words, even if the corners or middle part of a side have been processed, the "side" includes the processed part. When distinguishing a "polygon" or "side" that has no processing from a processed shape, the word "strict" should be added, for example, "strict quadrangle."

[0010] In this specification or claims, when there are multiple elements identified by a certain name and each element is to be expressed separately, an ordinal number such as "first" or "second" may be added to the beginning of each element. For example, if a claim states that "light-emitting elements are arranged on a substrate," the specification may state that "a first light-emitting element and a second light-emitting element are arranged on a substrate." The ordinal numbers "first" and "second" are used simply to distinguish between two light-emitting elements. The order of these ordinal numbers has no particular meaning. Element names with the same ordinal number may not refer to the same element between the specification and the claims. For example, when elements specified by the terms "first light-emitting element", "second light-emitting element", and "third light-emitting element" are described in the specification, the "first light-emitting element" and "second light-emitting element" in the claims may correspond to the "first light-emitting element" and "third light-emitting element" in the specification. In addition, when the term "first light-emitting element" is used but the term "second light-emitting element" is not used in claim 1 described in the claims, the invention according to claim 1 may be provided with one light-emitting element, and the light-emitting element is not limited to the "first light-emitting element" in the specification, but may be the "second light-emitting element" or the "third light-emitting element".

[0011] In this specification or claims, terms indicating a specific direction or position (e.g., "upper", "lower", "right", "left", "front", "rear" and other terms including these terms) may be used. These terms are used merely for the purpose of making it easier to understand the relative direction or position in the referenced drawings. As long as the relationship of the relative direction or position by terms such as "upper" and "lower" in the referenced drawings is the same, the drawings other than this disclosure, the actual product, the manufacturing device, etc. may not be arranged in the same manner as in the referenced drawings.

[0012] The dimensions, dimensional ratios, shapes, arrangement intervals, etc. of elements or members shown in the drawings may be exaggerated for clarity. In addition, in order to avoid the drawings becoming excessively complicated, some elements may be omitted from the illustration.

[0013] Hereinafter, an embodiment of the present invention will be described with reference to the drawings. Although the embodiment embodies the technical idea of ​​the present invention, it does not limit the present invention. The numerical values, shapes, materials, order of processing steps, etc. shown in the description of the embodiment are merely examples, and various modifications are possible as long as no technical contradiction occurs. In the following description, elements identified by the same name and symbol are the same or similar elements, and duplicate descriptions of those elements may be omitted.

[0014] A light emitting device 100 according to the present embodiment will be described. FIGS. 1 to 7 are diagrams for explaining an exemplary embodiment of the light emitting device 100. FIG. 1 is a perspective view of the light emitting device 100 according to the present embodiment. FIG. 2 is a perspective view of the light emitting device 100 with the lid 16 of the package 10 removed. FIG. 3 is a top view of the light emitting device 100 with the lid 16 of the package 10 removed. FIG. 4 is a cross-sectional view taken along the IV-IV line in FIG. 3. FIG. 5 is a top view illustrating an example of wiring inside the package 10. FIG. 6 is an enlarged view of a portion X in the top view of FIG. 5. Note that the optical member 40 shown in FIG. 5 is omitted in FIG. 6 for the sake of explanation. FIG. 7 is an exploded perspective view showing a state in which the photodetector 50 and the optical member 40 are separated.

[0015] To avoid the drawings becoming too complicated, the wiring 70 may not be shown in some of the drawings. In Fig. 3 and Fig. 5, instead of giving all wiring regions the reference numeral 14, all wiring regions are hatched in the same manner. The dashed line indicating the portion X in Fig. 5 is a virtual line for convenience of explanation. In Fig. 4 and Fig. 5, the main portion of the light emitted from the light emitting element 20 is indicated by a dashed line, and in Fig. 5, the elliptical irradiation region on the reflecting surface of the optical member 40 that is irradiated by the main portion of the light is also indicated by a dashed line.

[0016] The light emitting device 100 of this embodiment comprises multiple components including a package 10, one or more light emitting elements 20, one or more submounts 30, an optical member 40, a photodetector 50, one or more protection elements 60, and one or more wirings 70.

[0017] In the illustrated example of the light emitting device 100, a plurality of light emitting elements 20 (specifically, three light emitting elements 20), one submount 30, an optical member 40, a photodetector 50, the same number of protective elements 60 as the light emitting elements 20 (specifically, three protective elements 60), and a plurality of wirings 70 are arranged in the space inside the package 10. Furthermore, the light emitted from the plurality of light emitting elements 20 is reflected upward by the reflective surface of the optical member 40, passes through the light-transmitting region of the package 10, and is emitted to the outside from the light extraction surface 17.

[0018] First, each component will be described.

[0019] (Package 10) The package 10 has a bottom 11 having a mounting surface 11M (or a placement area) on which other components are placed, a sidewall 12 surrounding the mounting surface 11M, and a lid 16 fixed to the upper surface of the sidewall 12. The package 10 also has a recess, which is formed by the mounting surface 11M and the sidewall 12. The recess is recessed from the top to the bottom of the package 10. Here, the surface that forms the bottom of the depression of the recess is called the bottom surface. The bottom surface can be a major part of the mounting surface 11M.

[0020] When viewed from above in the normal direction of mounting surface 11M, package 10 has a rectangular outer shape. When viewed from above, the outer shape of the bottom surface of package 10 is rectangular. The outer shape of package 10 includes the outer shape of the bottom surface of package 10. Note that none of these outer shapes need to be rectangular.

[0021] The bottom portion 11 is a portion that constitutes the mounting surface 11M of the package 10, and includes the bottom surface and the lower surface of the package 10. The sidewall portion 12 surrounds the mounting surface 11M of the package 10, and Sidewall portion 12 is a portion that constitutes a sidewall extending upward from mounting surface 11M. Sidewall portion 12 includes one or more outer side surfaces, one or more inner side surfaces, and a top surface that intersects with the outer and inner side surfaces of package 10.

[0022] The package 10 has one or more step portions 13. The step portions 13 are provided in recessed portions of the package 10. Here, the step portion 13 refers to a portion constituted by an upper surface and an inner side surface that intersects with the upper surface and extends downward. In other words, the step portion 13 does not include an inner side surface that intersects with the upper surface of the step portion 13 and extends upward. The step portion 13 is a part of the side wall portion 12 of the package 10. The step portion 13 is located below the upper surface of the package 10. The step portion 13 has a step structure and is formed along the side wall of the package 10. The step portion 13 can be formed along the entire circumference of the side wall surrounding the mounting surface 11M. The step portion 13 does not have to be formed along the entire circumference.

[0023] The step portion 13 has regions of different widths in a top view. Taking the portion formed along the side wall of the package 10 as an example, the width of the step portion 13 is the length in a direction perpendicular to the side wall in a top view. When distinguishing between two regions of different widths in the step portion 13, the wider one is called the wide portion and the narrower one is called the narrow portion. In the illustrated example of the package 10, the step portion 13 is formed along the four sides of a rectangle in a top view, and the portions along three of the sides are the wide portions and the portion along the remaining side is the narrow portion.

[0024] One or more wiring regions 14 are provided on the upper surface of the step portion 13. In the illustrated example of the package 10, multiple wiring regions 14 are provided. The wiring regions 14 pass through the inside of the package 10 and are electrically connected to a wiring region provided on the lower surface of the package 10. Note that the wiring region electrically connected to the wiring region 14 is not limited to the lower surface of the package 10, and can be provided on another outer surface (upper surface or outer side surface) of the package 10.

[0025] The bottom 11 and sidewall 12 of the package 10 may be formed, for example, primarily from ceramics, examples of which include aluminum nitride, silicon nitride, aluminum oxide, silicon carbide, and the like.

[0026] The package 10 can be formed by integrally forming the bottom 11 and the sidewall 12. For example, it is possible to fabricate a member in which the bottom 11 and the sidewall 12 are integrated by using a processing technique such as molding or etching. Alternatively, the package 10 may be fabricated by joining the bottom 11 and the sidewall 12 which are formed separately using different materials as main materials. In this case, for example, the bottom 11 may be formed mainly using metal, and the sidewall 12 may be formed mainly using ceramic. In this case, it is preferable that the bottom 11 contains a material (material with high thermal conductivity) having better heat dissipation properties than the ceramic used as the main material of the sidewall 12. Examples of such materials may include copper, aluminum, iron, copper molybdenum, copper tungsten, and a copper-diamond composite material.

[0027] The lid portion 16 has a lower surface and an upper surface, and is a member in the shape of a rectangular parallelepiped flat plate. However, the lid portion 16 does not have to be a rectangular parallelepiped. The lid portion 16 is fixed to the upper surface of the side wall portion 12 above the bottom portion 11.

[0028] The lid portion 16 has a light extraction surface 17 including a light-transmitting region that is a region having light-transmitting properties. The lid portion 16 may have a non-light-transmitting region that is a region that does not have light-transmitting properties. The light extraction surface 17 is included in the upper surface of the lid portion 16. Incidentally, having light-transmitting properties means a property in which the transmittance of the main light incident thereon is 80% or more.

[0029] The lid 16 can be made of sapphire. Sapphire has translucency. In addition to sapphire, the lid 16 may be made of a light-transmitting material such as glass, plastic, or quartz.

[0030] The package 10 may have dimensions, for example, a height of 3 mm or less and a length of one side of its rectangular shape of 10 mm or less when viewed from above, or a height of 2 mm or less and a length of one side of its rectangular shape of 7 mm or less when viewed from above.

[0031] (Light emitting element 20) An example of the light-emitting element 20 is a semiconductor laser element. The light-emitting element 20 may have a rectangular outer shape when viewed from above. When the light-emitting element 20 is an edge-emitting semiconductor laser element, a side surface intersecting one of the two short sides of the rectangle is the light-emitting surface 20E. In this example, the upper and lower surfaces of the light-emitting element 20 have a larger area than the light-emitting surface 20E. The light-emitting element 20 is not limited to an edge-emitting semiconductor laser element, and may be a surface-emitting semiconductor laser element or a light-emitting diode (LED).

[0032] The light-emitting element 20 in this embodiment has one or more emitters. The light-emitting element 20 may be a single emitter having one emitter, or may be a multi-emitter having two or more emitters. In the example of FIG. 5, light is emitted from a single-emitter light-emitting element 20.

[0033] Here, a supplementary explanation will be given for the case where the light emitting element 20 is a semiconductor laser element. The light (laser light) emitted from the light emitting surface 20E of the semiconductor laser element is a divergent light having a spread. The laser light forms an elliptical far-field pattern (hereinafter referred to as "FFP") on a plane parallel to the light emitting surface 20E. The FFP refers to the shape and light intensity distribution of the emitted light at a position away from the light emitting surface.

[0034] The light passing through the center of the elliptical shape of the FFP, in other words, the light with the peak intensity in the light intensity distribution of the FFP, is called the light traveling along the optical axis. Also, the optical path of the light traveling along the optical axis is called the optical axis of that light. Also, in the light intensity distribution of the FFP, the light with a 1 / e 2 Light having an intensity equal to or greater than this will be referred to as the "major portion" of light.

[0035] In the elliptical shape of the FFP of light emitted from the light emitting element 20, which is a semiconductor laser element, the minor axis direction of the ellipse is called the slow axis direction, and the major axis direction is called the fast axis direction. A plurality of layers including an active layer that constitute the semiconductor laser element are stacked in the fast axis direction.

[0036] Based on the light intensity distribution of the FFP, the 1 / e 2 The angle corresponding to is defined as the divergence angle of light of the semiconductor laser element. The divergence angle of light in the fast axis direction is defined as the divergence angle of the fast axis direction, and the divergence angle of light in the slow axis direction is defined as the divergence angle of the slow axis direction.

[0037] For example, a semiconductor laser element that emits blue light, a semiconductor laser element that emits green light, or a semiconductor laser element that emits red light can be used as the light emitting element 20. Also, a semiconductor laser element that emits light other than these may be used.

[0038] Here, blue light refers to light whose emission peak wavelength is in the range of 420nm to 494nm, green light refers to light whose emission peak wavelength is in the range of 495nm to 570nm, and red light refers to light whose emission peak wavelength is in the range of 605nm to 750nm.

[0039] As a semiconductor laser element that emits blue light or a semiconductor laser element that emits green light, there is a semiconductor laser element that includes a nitride semiconductor. , GaN, InGaN, and AlGaN can be used. Examples of semiconductor laser elements that emit red light include those containing InAlGaP-based, GaInP-based, GaAs-based, and AlGaAs-based semiconductors.

[0040] (Submount 30) The submount 30 has two bonding surfaces and is configured in the shape of a rectangular parallelepiped. One bonding surface is provided on the opposite side to the other bonding surface. The distance between the two bonding surfaces is shorter than the distance between the other two opposing surfaces. The shape of the submount 30 does not have to be limited to a rectangular parallelepiped. The submount 30 can be formed using, for example, silicon nitride, aluminum nitride, or silicon carbide. A metal film for bonding is provided on the bonding surface. One bonding surface of the submount 30 may be provided with one or more wiring regions that are electrically connected to other components.

[0041] (Optical member 40) An example of the optical member 40 has a shape of a prism. A prism is a columnar body having a polygonal bottom surface. Examples of the bottom surface of the columnar body are a triangle, a rectangle, and a pentagon. The shape of the optical member 40 is not limited to a prism. The optical member 40 may be formed of a light-transmitting material such as glass, plastic, or quartz. The optical member 40 may have a plurality of reflecting surfaces. In this embodiment, the optical member 40 has a first reflecting surface 41, a second reflecting surface 42, and a lower surface 43. The optical member 40 may further have an upper surface 44 that is parallel to the lower surface 43 and located on the opposite side of the lower surface 43. The parallelism here includes an error of ±5 degrees or less. The upper surface 44 may intersect with the first reflecting surface 41 and the second reflecting surface 42. The optical member 40 preferably includes a bonding surface for fixing to another member. In the illustrated example, the lower surface 43 of the optical member 40 may function as a bonding surface to be bonded to a member located below it. In addition, a surface of the optical member 40 other than the lower surface 43 may function as a bonding surface to be bonded to another member.

[0042] The first reflecting surface 41 is configured as a flat surface that forms an inclination angle of, for example, 35° to 55° with respect to the lower surface 43. In the example of the light-emitting device 100 shown in the figure, the first reflecting surface 41 is configured as a flat surface that forms an inclination angle of 45° with respect to the lower surface 43. The first reflecting surface 41 is a partial reflecting surface that transmits a portion of the incident light and reflects the remainder.

[0043] The second reflecting surface 42 is located on the opposite side to the first reflecting surface 41. If the first reflecting surface 41 is a reflecting surface provided on the front surface of the optical member 40, the second reflecting surface 42 can be said to be a reflecting surface provided on the back surface of the optical member 40. The second reflecting surface 42 is not parallel to the lower surface 43. In addition, the second reflecting surface 42 is not parallel to the first reflecting surface 41.

[0044] The first reflecting surface 41 and the second reflecting surface 42 can be formed, for example, by providing a light reflection control film that reflects incident light on a light-transmitting material. The light reflection control film can be formed, for example, from a metal thin film such as Ag or Al. Alternatively, the light reflection control film can be a dielectric multilayer film formed from Ta2O5 / SiO2, TiO2 / SiO2, Nb2O5 / SiO2, or the like. For example, by changing the film thickness or material of the light reflection control film, it is possible to control the reflectance or transmittance of the reflecting surface.

[0045] The reflectance of the first reflecting surface 41 can be, for example, in the range of 80% to 98% with respect to the peak wavelength of the light to be reflected, and is preferably, for example, in the range of 90% to 97%. The transmittance of the first reflecting surface 41 is, for example, in the range of 3% to 10% with respect to the peak wavelength of the light to be transmitted. The reflectance of the second reflecting surface 42 is, for example, 99% or more with respect to the peak wavelength of the light to be reflected, and is preferably close to 100%. The second reflecting surface 42 can also be inclined at a predetermined inclination angle with respect to the lower surface 43. This inclination will be described in detail later.

[0046] The light reflected by and the light transmitted through the first reflecting surface 41 of the optical member 40 can be used for different purposes. For example, the light reflected by the first reflecting surface 41 of the optical member 40 can be used as the main light for screen display or the like, and all or a part of the light transmitted through the first reflecting surface 41 can be used as monitor light for controlling the intensity of the main light. When the incident light is split into the main light and the monitor light in this way, the intensity of the monitor light is smaller than that of the main light.

[0047] The reflectance of the first reflecting surface 41 and the second reflecting surface 42 may vary depending on the wavelength of the incident light. Therefore, when light of different colors is incident on one first reflecting surface 41, the reflectance may differ depending on the color. It is not necessary to make the reflectance equal for all colors of light. It is sufficient to design the reflecting surface so that the reflectance is appropriate for the light to be reflected by the first reflecting surface 41. It is preferable that the above-mentioned conditions of reflectance and transmittance are satisfied for each of the incident light of different wavelengths, even if there is a difference in specific numerical values. The same is true for the second reflecting surface 42.

[0048] When light of different colors is incident, the first reflecting surface 41 may have, for example, a reflecting area with a reflectance suitable for the wavelength of the light for each area where the light of each color is incident. The multiple reflecting areas corresponding to the incident areas where the respective light is incident may be separated from each other, or there may be a partial overlapping area between the multiple reflecting areas.

[0049] (Photodetector 50) The photodetector 50 has a bonding surface 51, a light receiving surface 52, and one or more side surfaces. The bonding surface 51 is a surface where the photodetector 50 is bonded to another component. The bonding surface 51 is located opposite the light receiving surface 52. The light receiving surface 52 is provided on the upper surface of the photodetector 50. The outer shape of the photodetector 50 is a rectangular parallelepiped. However, the outer shape is not limited to a rectangular parallelepiped.

[0050] The light receiving surface 52 has one or more light receiving regions 53. In the light receiving surface 52 having the multiple light receiving regions 53, the multiple light receiving regions 53 are provided spaced apart from each other. The multiple light receiving regions 53 are electrically isolated from each other. Each of the one or more light receiving regions 53 is a photoelectric conversion element that outputs an electrical signal according to the intensity or amount of incident light. A typical example of such a photoelectric conversion element is a photodiode.

[0051] In the photodetector 50 illustrated in FIG. 6 and FIG. 7, three light receiving regions 53 are provided on the light receiving surface 52 of the photodetector 50. The number of light receiving regions 53 of the photodetector 50 does not have to be limited to three. The multiple light receiving regions 53 are arranged at a predetermined interval. Here, the direction in which the multiple light receiving regions 53 are arranged is referred to as the "first direction". Also, the direction perpendicular to the first direction in the top view is referred to as the "second direction". In the example of the light emitting device 100 in FIG. 6, the 1D arrow coincides with the first direction, and the 2D arrow coincides with the second direction.

[0052] An example of the outer shape of the light-receiving surface 52 is a rectangle. The length of the light-receiving surface 52 in the second direction is shorter than the length of the light-receiving surface 52 in the first direction. However, the relationship between the length of the light-receiving surface 52 in the first direction and the length of the light-receiving surface 52 in the second direction is not limited to this.

[0053] In the light receiving surface 52 having a plurality of light receiving regions 53, the light receiving regions 53 are arranged close to one another. The interval between two adjacent light receiving regions 53 is smaller than the width in the first direction (X1, X2, or X3) of either or both of the two adjacent light receiving regions 53. This allows the intervals between the lights incident on the respective light receiving regions 53 to be made closer, and a compact photodetector 50 can be realized. Also, the intensities of the multiple light beams incident on different light receiving regions on the light receiving surface 52 can be measured independently. It becomes Noh.

[0054] Each light receiving area 53 has a rectangular outer shape on the light receiving surface 52. The shape of the light receiving area 53 is not limited to a rectangle, and can be designed appropriately according to the shape of the light incident on the light receiving surface 52. In the example of the photodetector 50 shown in the figure, each light receiving area 53 has a rectangular outer shape. Two of the four sides constituting the rectangle (short sides in the case of a rectangle) are parallel to the first direction. The other two sides (long sides in the case of a rectangle) are parallel to the second direction. Here, the parallelism includes an error of ±5 degrees or less.

[0055] In the light receiving region 53, the length in the second direction (Z1, Z2, Z3) is longer than the length in the first direction (X1, X2, X3) (see FIG. 6). Note that the multiple light receiving regions 53 may include a light receiving region 53 whose lengths in the first direction are equal to those in the second direction, or may include a light receiving region 53 whose length in the first direction is longer than its length in the second direction.

[0056] The length in the first direction and the length in the second direction of each light receiving region 53 may vary depending on, for example, the wavelength of light incident on the light receiving region 53. For example, the light receiving regions 53 may include two light receiving regions 53 on the light receiving surface 52 that have different lengths in the second direction. In the illustrated example of the light detector 50, Z3 <Z1であり、Z3<Z2である。

[0057] The size of Z2-Z1 is, for example, 50 μm to 150 μm, preferably 60 μm to 100 μm. By setting it in this range, this space can be used for the conductive region 55 while ensuring an appropriate size of the light receiving region 53.

[0058] In the light receiving surface 52 having a plurality of light receiving regions 53, the light receiving regions 53 are arranged with one of both ends of the light receiving regions 53 in the second direction aligned. In other words, a straight line connecting one of both ends of each light receiving region 53 in the second direction is parallel to the first direction. Here, parallel includes an error of ±5 degrees or less. By aligning the position of one end, the length of the photodetector 50 in the second direction can be reduced, which contributes to miniaturization of the photodetector 50.

[0059] It should be noted that the size relationship and arrangement relationship between the multiple light receiving regions 53 are not necessarily required for the light emitting device 100 according to this embodiment.

[0060] The photodetector 50 has one or more wiring regions 54. The one or more wiring regions 54 may be provided on the light-receiving surface 52. The one or more wiring regions 54 may be provided on a surface other than the light-receiving surface 52. Each wiring region 54 is electrically connected to the light-receiving region 53.

[0061] In the illustrated example of the photodetector 50, four wiring regions 54 are provided for electrical connection of the three light-receiving regions 53. The photodetector 50 has wiring regions 54 on the light-receiving surface 52 that are greater in number than the light-receiving regions 53 and less than twice the number of the light-receiving regions 53.

[0062] Three of the four wiring regions 54 do not overlap each other and are electrically connected to the anode electrodes of any of the three light-receiving regions 53. The remaining one is electrically connected to the cathode electrode common to the three light-receiving regions 53.

[0063] (Protection element 60) The protective element 60 is a circuit element for preventing an excessive current from flowing through a specific element (for example, the light emitting element 20) and causing the element to be destroyed. A typical example of the protective element 60 is a constant voltage diode such as a Zener diode. A Si diode can be used as the Zener diode.

[0064] (Wiring 70) The wiring 70 is composed of a conductor having a linear shape with joints at both ends. In other words, the wiring 70 has joints at both ends of the linear portion that are joined to other components. The wiring 70 is, for example, a metal wire. Examples of metals include gold, aluminum, silver, copper, etc.

[0065] (Light emitting device 100) Next, the light emitting device 100 will be described.

[0066] In the example of the light emitting device 100 described below, each of the multiple light emitting elements 20 is an edge-emitting semiconductor laser element (laser diode). However, the number of light emitting elements 20 included in the light emitting device according to the embodiment of the present disclosure is not limited to three, and may be one, two, four or more.

[0067] The plurality of light-emitting elements 20 are disposed inside the package 10. The plurality of light-emitting elements 20 are disposed on a mounting surface 11M of the bottom 11 of the package 10, and are surrounded by the sidewall portion 12. The plurality of light-emitting elements 20 are disposed on the mounting surface 11M via a submount 30. The plurality of light-emitting elements 20 may be disposed directly on the mounting surface 11M without the submount 30. However, the use of the submount 30 has the advantage of making it easier to adjust the height from the mounting surface 11M to the light-emitting point located on the light emission surface 20E of the light-emitting element 20.

[0068] The plurality of light emitting elements 20 are bonded to a bonding surface provided on the upper surface 30M of the submount 30. The mounting surface 11M is bonded to a bonding surface provided on the opposite side of the bonding surface. Note that, instead of arranging the plurality of light emitting elements 20 on one submount 30, the light emitting device 100 may include a plurality of submounts 30, and one light emitting element 20 may be arranged on one submount 30.

[0069] The photodetector 50 is disposed inside the package 10. The photodetector 50 is disposed on the mounting surface 11M of the bottom 11, and is surrounded by the sidewall 12. The light receiving surface 52 of the photodetector 50 is disposed at a position lower than the emission point of the light emitted from each light emitting element 20. The photodetector 50 is preferably disposed at a position close to the light emitting element 20. The distance between the photodetector 50 and the light emitting element 20 in a top view is preferably shorter than 300 μm. This makes it possible to realize a miniaturized light emitting device 100.

[0070] In the light emitting device 100 including a plurality of light emitting elements 20, the photodetector 50 may have a plurality of light receiving regions 53 corresponding to the respective lights emitted from the plurality of light emitting elements 20. The plurality of light receiving regions 53 are arranged, for example, side by side in the first direction. Furthermore, the photodetector 50 having the light receiving surface 52 whose length in the second direction is shorter than its length in the first direction can contribute to miniaturization of the light emitting device 100.

[0071] The optical member 40 is disposed above the photodetector 50 such that the lower surface 43 of the optical member 40 faces the light receiving surface 52 of the photodetector 50. Therefore, the photodetector 50 is disposed between the submount 30 and the side wall portion 12 of the package 10, and is located below the optical member 40. For example, the lower surface 43 of the optical member 40 is bonded to the light receiving surface 52 of the photodetector 50 via an adhesive layer such as resin.

[0072] The first reflecting surface 41 is disposed facing the light emitting element 20. A major portion of the light emitted from the light emitting element 20 is irradiated onto the first reflecting surface 41. The first reflecting surface 41 transmits a portion of the light emitted from the light emitting surface 20E of the light emitting element 20 and reflects the remainder upward. For example, the first reflecting surface 41 reflects 90% or more of the incident light and transmits the remaining light, which is less than 10%. .

[0073] The second reflecting surface 42 is located farther from the light emitting surface 20E of the light emitting element 20 than the first reflecting surface 41, and reflects a part or all of the light transmitted through the first reflecting surface 41. For example, the second reflecting surface 42 reflects 99% or more of the incident light. The light reflected by the second reflecting surface 42 is mainly directed toward the lower surface 43.

[0074] In top view, a part or all of the light receiving area 53 may overlap a part or all of the first reflecting surface 41. In top view, the entire light receiving area 53 overlaps the optical member 40. In top view, a part of the light receiving area 53 may overlap the first reflecting surface 41, and the remaining part may overlap the second reflecting surface 42.

[0075] The light-receiving area 53 receives light reflected by the second reflecting surface 42. Furthermore, the light-receiving area 53 can receive light that has passed through the first reflecting surface 41 of the optical member 40 and has not been reflected by the second reflecting surface 42, in other words, light that has been refracted by the first reflecting surface 41 and proceeds toward the lower surface 43. This allows the light-receiving area 53 to receive more light.

[0076] The adhesive layer interposed between the optical member 40 and the photodetector 50 functions as an intermediate refractive index layer having a refractive index higher than that of air (approximately 1.0) and close to that of the optical member 40. For example, the refractive index of the adhesive layer is close to that of glass (e.g., 1.5). By filling the gap with an adhesive layer such as a resin, incident light is less likely to be totally reflected at the interface between the optical member 40 and the intermediate refractive index layer. In addition, the adhesive layer such as a resin preferably has a transmittance of, for example, 80% or more for the light emitted from the light emitting element 20. As a result, most of the light that reaches the lower surface 43 of the optical member 40 reaches the light receiving surface 52 without being totally reflected at the interface between the lower surface 43 and the adhesive layer.

[0077] The light emitting surfaces 20E of the light emitting elements 20 face the first reflecting surface 41 of the optical member 40. The light emitting surfaces 20E of the light emitting elements 20 face the same direction. The light emitting elements 20 are arranged side by side. In the illustrated example, in top view, the light emitting points of the light emitting elements 20 are arranged in the direction indicated by the 1D arrow in the figure, and the optical axis of the light emitted from each light emitting element 20 is parallel to the direction indicated by the 2D arrow in the figure. The parallelism here includes an error of ±5 degrees or less.

[0078] In the illustrated example of the light emitting device 100, the light emitting device 100 includes three light emitting elements 20. For convenience of explanation, the three light emitting elements 20 are respectively distinguished as a first light emitting element 20A, a second light emitting element 20B, and a third light emitting element 20C. The light emitted from the first light emitting element 20A is called the first light, the light emitted from the second light emitting element 20B is called the second light, and the light emitted from the third light emitting element 20C is called the third light. The first light, the second light, and the third light are lights of different colors selected from red light, green light, and blue light, respectively. The configuration in which the three light emitting elements 20 are configured with three colors of light, RGB, can be adopted, for example, for color image display. The color of light emitted by each light emitting element 20 is not limited to this, and is not limited to visible light. The multiple light receiving regions 53 provided on the light receiving surface 52 of the photodetector 50 include a first light receiving region 53A that receives a portion of the first light, a second light receiving region 53B that receives a portion of the second light, and a third light receiving region 53C that receives a portion of the third light.

[0079] 8A and 9A are schematic diagrams showing the optical path of light that passes through the first reflecting surface 41 and reaches the light receiving region 53 in the light emitting device 100. FIG. 8A shows an example of the optical member 40 in which an optical member 40A is used, and FIG. 9A shows an example of the optical member 40 in which an optical member 40B is used. In FIG. 8A, a plane including the lower surface 43 of the optical member 40 and a plane including the first reflecting surface 41 are respectively shown by dashed lines. In both diagrams, the light emitted from the light emitting element 20 is The main part of the light reflected by the first reflecting surface 41 and the representative light rays contained in the main part of the light are indicated by dashed lines. Also, the light reflected by the first reflecting surface 41 is indicated as light L1, the light transmitted through the first reflecting surface 41 and reflected by the second reflecting surface 42 to reach the light receiving area 53 is indicated as light L2, and the light transmitted through the first reflecting surface 41 and reaches the light receiving area 53 without being incident on the second reflecting surface 42 is indicated as light L3.

[0080] 8B and 9B are top views showing the positional relationship between the first reflecting surface 41 of the optical member 40 and the three light receiving regions 53 provided on the light receiving surface 52 of the photodetector 50. Fig. 8B corresponds to Fig. 8A, and Fig. 9B corresponds to Fig. 9A. In Fig. 8B, the outline of the first reflecting surface 41 of the optical member 40 is shown by a solid line, the outline of the upper surface 44 of the optical member 40 is shown by a dotted line, and the three light receiving regions 53 of the photodetector 50 are shown by dashed lines.

[0081] The optical member 40A has a first reflecting surface 41, a second reflecting surface 42, a lower surface 43, and an upper surface 44. However, the upper surface 44 is not an essential surface of the optical member 40A. In other words, the first reflecting surface 41 can be in direct contact with the second reflecting surface 42.

[0082] As shown in FIG. 8A, in the optical member 40A, the angle α between the plane including the first reflecting surface 41 and the plane including the lower surface 43 or the plane including the light receiving surface 52 of the light detector 50 is 10° or more and 80° or less, and is preferably, for example, 35° or more and 55° or less. The angle α is an angle shown by a dashed line in FIG. 8A, which rotates counterclockwise from the plane including the lower surface 43 to the first reflecting surface 41. In the optical member 40A, the angle β between the plane including the lower surface 43 or the plane including the light receiving surface 52 of the light detector 50 and the plane including the second reflecting surface 42 is, for example, 80° or more and 100° or less. The angle β is an angle rotated clockwise from the lower surface 43 to the second reflecting surface 42. In the illustrated example, the angle α is 45°, and the angle β is 90°. The light receiving area 53 is located directly below the intersection of a straight line on the optical axis of the light L2 and the lower surface 43 of the optical member 40, and the light receiving area 53 is located directly below the intersection of a straight line on the optical axis of the light L3 and the lower surface 43 of the optical member 40.

[0083] As shown in FIG. 8B, in the top view, the outer shape of the optical member 40A includes three light receiving regions 53. A part of the light receiving region 53 overlaps a part of the first reflecting surface 41. A part of each of the three light receiving regions 53 overlaps the first reflecting surface 41. The shorter the length of the upper surface 44 in the second direction indicated by the 2D arrow, the more it contributes to the miniaturization of the light emitting device 100 in that direction. With respect to the length in the 2D direction, the length of the lower surface 43 is smaller than twice the length of the first reflecting surface 41, and preferably smaller than 1.5 times. The distance D1 between the first reflecting surface 41 and the second reflecting surface 42 in the optical axis direction of the light emitted from the light emitting element 20 is shorter than the length of the light receiving region 53 in the same direction. The distance D1 means the interval between the two reflecting surfaces between the upper surface 44 and the lower surface 43, and corresponds to the width of the upper surface 44. In the example of the light emitting device 100 shown in the figure, the optical axis direction and the 2D direction coincide with each other.

[0084] 9A and 9B differs from optical member 40A illustrated in Fig. 8A in that the inclination angle of the second reflecting surface 42 is different. Below, the differences from optical member 40A will be mainly described, and a description of commonalities will be omitted.

[0085] The angle β of the optical member 40B can be, for example, 30° or more and 80° or less. Like the optical member 40A, the optical member 40B may further have an upper surface 44 connecting the first reflecting surface 41 and the second reflecting surface 42. In a top view, a part of the light receiving area 53 overlaps with a part of the first reflecting surface 41, and a part or all of the remaining part of the light receiving area 53 overlaps with a part of the second reflecting surface 42. A part of each of the three light receiving areas 53 overlaps with the first reflecting surface 41, and the remaining part overlaps with the second reflecting surface 42.

[0086] One or more protection elements 60 are disposed inside the package 10. The protection elements 60 include: The protective element 60 is disposed to protect the light emitting element 20. The protective element 60 is disposed on a pair of wiring regions 14 provided in the stepped portion 13 of the package 10. In the light emitting device 100, one protective element 60 is provided for one light emitting element 20. In other words, the same number of protective elements 60 as the number of light emitting elements 20 are disposed. Disposing the protective element 60 on the upper surface of the stepped portion 13 can contribute to miniaturization of the light emitting device 100.

[0087] The optical member 40 is disposed so that the narrow portion of the step portion 13 is located on the back side of the optical member 40. The wide portion of the step portion 13 is disposed so as to sandwich the light emitting element 20 and the photodetector 50 in the first direction when viewed from above. The wide portion of the step portion 13 is disposed on the opposite side to the narrow portion of the step portion 13, sandwiching the light emitting element 20 and the photodetector 50 in the first direction.

[0088] The multiple wirings 70 electrically connect the light emitting element 20 and the photodetector 50 to the wiring region 14 of the package 10. One end of each of the multiple wirings 70 is joined to the wiring region 14 of the step portion 13. The one or multiple protection elements 60 and the multiple wirings 70 are arranged in the wide portion of the step portion 13, and are not arranged in the narrow portion of the step portion 13.

[0089] The multiple light-emitting elements 20 emit divergent light toward the first reflecting surface 41 of the optical member 40. The optical axis of the divergent light is parallel to the mounting surface 11M. Here, the parallelism includes an error of ±5 degrees or less. As shown in FIG. 5, each of the multiple light-emitting elements 20A, 20B, and 20C irradiates a main portion of light onto a different region of the first reflecting surface 41 of the optical member 40.

[0090] In the light emitting device 100, a sealed closed space is created inside the package 10. Also, by joining the side wall portion 12 and the lid portion 16 of the package 10 under a predetermined atmosphere, a hermetically sealed closed space is created inside the package 10. By hermetically sealing the space in which the light emitting element 20 is arranged, quality deterioration due to dust collection can be suppressed. Note that, when the entire light emitting device 100 is used in an environment or atmosphere in which there is no need to worry about quality deterioration due to the influence of dust collection or moisture in the air, the lid portion 16 is not necessary. For example, when the entire light emitting device 100 is sealed by an enclosure, it is not necessary to cover the light emitting element 20 with the lid portion 16.

[0091] Light emitted from the light emitting element 20 is reflected upward by the first reflecting surface 41, passes through the light-transmitting region of the lid portion 16 of the package 10, and is emitted to the outside from the light extraction surface 17. The central axis of the light extracted from the light extraction surface 17 is perpendicular to the light extraction surface 17. Here, perpendicular includes an error of ±5 degrees or less. However, the central axis of the light does not necessarily have to be perpendicular to the light extraction surface 17.

[0092] Next, a modification of the light emitting device 100, in which a filter 90 is provided, will be described. In the light emitting device 100 including a plurality of light emitting elements 20 and a photodetector 50 having a plurality of light receiving regions 53, when it is desired to receive light of different wavelengths by each of the light receiving regions 53, it is preferable to provide a filter 90 corresponding to each of the light receiving regions 53. Figs. 10 and 11 are diagrams for explaining the light emitting device 100 in which the filter 90 is provided corresponding to the light receiving region 53.

[0093] Fig. 10 is an exploded perspective view showing the optical member 40, one or more filters 90, and the photodetector 50. Fig. 11 is a top view showing the one or more filters 90 arranged on the light receiving surface 52 of the photodetector 50.

[0094] One or more filters 90 may be disposed between the optical member 40 and the photodetector 50. In the illustrated example, three filters 90 are disposed between the optical member 40 and the photodetector 50. The three filters 90 are each a wavelength-selective filter, and include a first filter, The first filter, the second filter, and the third filter are hereinafter referred to as filter 90A, filter 90B, and filter 90C, respectively.

[0095] The filter 90A is formed in a first region of the lower surface 43 of the optical member 40. The first region is a region of the lower surface 43 located directly above the light receiving region 53A on the light receiving surface 52 of the photodetector 50. The filter 90B is formed in a second region of the lower surface 43 of the optical member 40. The second region is a region of the lower surface 43 located directly above the light receiving region 53B on the light receiving surface 52 of the photodetector 50. The filter 90C is formed in a third region of the lower surface 43 of the optical member 40. The third region is a region of the lower surface 43 located directly above the light receiving region 53C on the light receiving surface 52 of the photodetector 50.

[0096] An example of the filter 90 is a dielectric multilayer film formed of Ta2O5 / SiO2, TiO2 / SiO2, Nb2O5 / SiO2, etc. A dielectric multilayer film having a predetermined wavelength selectivity can be formed in the above-mentioned first region, second region, and third region on the lower surface 43 of the optical member 40.

[0097] First, attention is paid to two adjacent light-emitting elements 20 among the three light-emitting elements 20. The filter 90A has an optical characteristic of cutting the second light and selectively transmitting the first light. The filter 90B has an optical characteristic of cutting the first light and selectively transmitting the second light. The combination of the first light and the second light is, for example, a combination of two colors selected from RGB. However, the combination may include light other than visible light, for example, infrared light. As an example, when the first light is red light and the second light is green light, the filter 90A cuts the green light and selectively transmits the red light, and the filter 90B cuts the red light and selectively transmits the green light.

[0098] In a top view, the filter 90 may be disposed so that a part or the whole overlaps a part or the whole of the light receiving region 53. In the example shown in Fig. 11, the whole of the filter 90A overlaps the whole of the light receiving region 53A, the whole of the filter 90B overlaps the whole of the light receiving region 53B, and the whole of the filter 90C overlaps the whole of the light receiving region 53C.

[0099] The light emitted from one of two adjacent light-emitting elements 20 may reach the light-receiving region 53 that detects the monitor light of the light emitted from the other of the two adjacent light-emitting elements 20, and the light emitted from the other of the two adjacent light-emitting elements 20 may reach the light-receiving region 53 that detects the monitor light of the light emitted from one of the two adjacent light-emitting elements. So-called crosstalk may occur. When the distance between two adjacent light-emitting elements becomes extremely narrow (for example, 0.5 mm or less), crosstalk is likely to occur. Crosstalk may promote noise components in the electrical signal in the photoelectric conversion element and cause a decrease in the signal-to-noise ratio. As a result, the detection accuracy of the monitor light to be detected may decrease.

[0100] According to this embodiment, filters 90 with different wavelength selection characteristics are disposed on two adjacent light receiving regions 53. This makes it possible to suppress the light emitted from one of the two adjacent light emitting elements 20 from being mixed into the light receiving region 53 that detects the monitor light of the light emitted from the other of the two adjacent light emitting elements 20, and to suppress the light emitted from the other of the two adjacent light emitting elements 20 from being mixed into the light receiving region 53 that detects the monitor light of the light emitted from one of the two adjacent light emitting elements 20. As a result, it is possible to suppress a decrease in the detection accuracy of the monitor light.

[0101] In the example of the light emitting device 100 shown in FIG. 5, the first light emitting element 20A and the third light emitting element 20C are disposed on either side of the second light emitting element 20B located in the center. In this case, the filter 90A has the optical property of cutting at least the second light and selectively transmitting the first light. It is preferable that the filter 90A has the optical property of further cutting the third light. This is because a part of the third light emitted from the light emitting element 20C may also be repeatedly reflected inside the optical member 40 and eventually reach the light receiving region 53A. The filter 90B cuts the first light and the third light. Filter 90C has the optical property of cutting off at least the second light and selectively transmitting the third light. Like filter 90A, filter 90C preferably has the optical property of further cutting off the first light.

[0102] In this embodiment, the cut of light by the filter 90 means that the filter 90 has a transmittance of 5% or less for visible light other than the wavelength of light to be selectively transmitted. The filter 90A has a transmittance of 90% or more for red light, and a transmittance of 5% or less for green and blue light, for example. Similarly, the filter 90B has a transmittance of 90% or more for green light, and a transmittance of 5% or less for red and blue light, for example. The filter 90C has a transmittance of 90% or more for blue light, and a transmittance of 5% or less for red and green light, for example.

[0103] Filter 90B is arranged so that it partially or entirely overlaps light receiving region 53B in top view. Furthermore, filter 90B is arranged so that it partially or entirely does not overlap light receiving region 53A and light receiving region 53C. The multiple filters 90 arranged on lower surface 43 of optical member 40 are separated from one another, but do not necessarily have to be separated. The multiple filters 90 may be arranged at regular intervals on lower surface 43. This interval is, for example, about several tens of μm.

[0104] In this manner, by disposing the filter 90 between the optical member 40 and the photodetector 50, it becomes possible to accurately measure the light intensity independently in a light emitting device having multiple light emitting elements that emit light of different wavelengths, such as the light emitting device 100 having RGB light emitting elements.

[0105] Although the embodiments of the present invention have been described above, the light-emitting device of the present invention is not strictly limited to the light-emitting device of the embodiment. In other words, the present invention can be realized only if it is limited to the external shape and structure of the light-emitting device disclosed in the embodiment. For example, it may be a light-emitting device without a protective element. In addition, it can be applied without necessarily having all the components. For example, if some of the components of the light-emitting device disclosed in the embodiment are not described in the claims, the freedom of design by a person skilled in the art, such as substitution, omission, modification of the shape, and change of the material, is recognized for those some components, and the invention described in the claims is specified to be applied. [Industrial Applicability]

[0106] The light emitting device according to the embodiment can be used in head mounted displays, projectors, lighting, displays, and the like. [Explanation of symbols]

[0107] 10:Package 11: Bottom 11M: Mounting surface 12: Side wall 13: Step 14:Wiring area 16: Lid 17:Light extraction surface 20, 20A, 20B, 20C: Light-emitting element 20E: Light exit surface 30: Submount 30M:Top surface 40, 40A, 40B: Optical components 41: 1st reflective surface 42:Second reflective surface 43: Bottom surface 44:Top surface 50: Photodetector 51: Joint surface 52: Light receiving surface 53, 53A, 53B, 53C: Light receiving area 54:Wiring area 55: Conduction area 60: Protective element 70, 71, 72: Wiring 90, 90A, 90B, 90C: Filters 100: Light emitting device

Claims

1. A first light-emitting element having a light-emitting surface, An optical member having a lower surface, a first reflective surface inclined with respect to the lower surface that transmits a portion of the first light emitted from the light-emitting surface of the first light-emitting element and reflects the remainder upward, and a second reflective surface located further away from the light-emitting surface of the first light-emitting element than the first reflective surface, that reflects a portion or all of the first light that has passed through the first reflective surface, A photodetector having an upper surface located below the optical member and provided with one or more light-receiving regions including a first light-receiving region that receives the first light reflected by the second reflective surface, Equipped with, The first light incident on the first reflective surface is divergent light, A light-emitting device in which, when viewed from above, part or all of the first light-receiving area overlaps with part or all of the first reflective surface.

2. The light-emitting device according to claim 1, wherein the first light received by the first light-receiving region is light incident on the first light-receiving region after one reflection by the second reflective surface.

3. The light-emitting device according to claim 1 or 2, wherein the second reflective surface is not parallel to the lower surface of the optical member.

4. The light-emitting device according to any one of claims 1 to 3, wherein the angle relating to the optical member, the angle formed by the plane including the upper surface of the photodetector and the plane including the second reflective surface of the optical member, is 80° or more and 100° or less.

5. The light-emitting device according to any one of claims 1 to 3, wherein the angle relating to the optical member, the angle formed by the plane including the upper surface of the photodetector and the plane including the second reflective surface of the optical member, is 30° or more and 80° or less.

6. The light-emitting device according to any one of claims 1 to 5, wherein, in a top view, the entirety of the first light-receiving region overlaps the optical member.

7. The light-emitting device according to any one of claims 1 to 6, wherein, in a top view, a part of the first light-receiving area overlaps with a part or all of the first reflective surface, and a part or all of the remaining part of the first light-receiving area overlaps with a part or all of the second reflective surface.

8. The light-emitting device according to claim 1, wherein the distance between the first reflective surface and the second reflective surface in the optical axis direction of the first light emitted from the first light-emitting element is smaller than the length of the first light-receiving region in the optical axis direction.

9. The light-emitting device according to any one of claims 1 to 8, wherein the first light-receiving region further receives the first light that has been transmitted through the first reflective surface of the optical member and has not been reflected by the second reflective surface.

10. The device further comprises a second light-emitting element having a light-emitting surface, The first reflective surface of the optical member transmits a portion of the second light emitted from the light-emitting surface of the second light-emitting element and reflects the remainder upward, and the second reflective surface reflects a portion or all of the second light that has passed through the first reflective surface. The light-emitting device according to any one of claims 1 to 9, wherein the one or more light-receiving regions provided on the upper surface of the photodetector further include a second light-receiving region that receives the second light reflected by the second reflective surface.

11. The third light-emitting element further comprises a light-emitting surface, The first reflective surface of the optical member transmits a portion of the third light emitted from the light-emitting surface of the third light-emitting element and reflects the remainder upward, and the second reflective surface reflects a portion or all of the third light that has passed through the first reflective surface. The one or more light-receiving regions provided on the upper surface of the photodetector further include a third light-receiving region that receives the third light reflected by the second reflective surface, The light-emitting device according to claim 10, wherein the first light, the second light, and the third light are each different colors of light selected from red light, green light, and blue light.

12. The optical member comprises a first filter formed in a first region of the lower surface and a second filter formed in a second region of the lower surface. The first filter cuts out the second light and is positioned such that, in a top view, part or all of it overlaps with part or all of the first light-receiving area. The light-emitting device according to claim 10 or 11, wherein the second filter cuts out the first light and is arranged such that, in a top view, part or all of it overlaps with part or all of the second light-receiving area.

13. The second and third light-emitting elements are arranged on either side of the first light-emitting element. The optical member has a first filter formed in the first region of the lower surface, The light-emitting device according to claim 11, wherein the first filter cuts out the second and third light and is arranged so that, in a top view, part or all of it overlaps with part or all of the first light-receiving area.

14. The light-emitting device according to claim 13, wherein the first filter is arranged such that, in a top view, part or all of it does not overlap with the second light-receiving region and the third light-receiving region.

15. The package further comprises a bottom portion having a mounting surface on which the first light-emitting element is arranged, a side wall portion surrounding the first light-emitting element, and a lid portion fixed to the side wall portion above the bottom portion and including a light extraction surface, The light-emitting device according to any one of claims 1 to 14, wherein the light emitted from the first light-emitting element and reflected upward by the first reflective surface of the optical member passes through the lid and is emitted to the outside from the light-extracting surface.

16. The light-emitting device according to any one of claims 1 to 15, wherein the first light-emitting element is a semiconductor laser element.

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