Ultrasonic Excitation Device

Abstract

The assembly includes a printed circuit board (PCB) having a first surface and a second surface, at least one energy transmitter mounted to the first surface, and at least one cooling element coupled to the second surface of the PCB, the cooling element configured to cool the at least one energy transmitter via the PCB.

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims the benefit of priority under 35 USC §119(e) to U.S. Provisional Application No. 63 / 132,629, filed December 31, 2020, the contents of which are incorporated by reference in their entirety. [Background technology]

[0002] The present invention, in some embodiments, relates to energy transmission assemblies, and more particularly, but not exclusively, to ultrasonic energy transmission assemblies. DISCLOSURE OF THEINVENTION [Problem to be solved by the invention]

[0003] Below, several example embodiments of the present invention are described (embodiments may include features from more than one example and / or may include less than all features of each example).

[0004] Example 1 a printed circuit board (PCB) having a first surface and a second surface; at least one energy transmitter mounted to the first surface; at least one cooling element coupled to the second surface of the PCB; the cooling element is configured to cool the at least one energy transmitter via the PCB; assembly.

[0005] Example 2 2. The assembly of Example 1, further comprising at least one temperature sensor mounted on the first surface of the PCB near the at least one energy transmitter.

[0006] Example 3 3. The assembly of Example 2, wherein the at least one energy transmitter includes a plurality of spaced apart energy transmitters mounted on the first surface of the PCB, and the at least one temperature sensor includes at least two temperature sensors, and one of the at least two temperature sensors or at least one temperature sensor is mounted between two adjacent energy transmitters on the first surface.

[0007] Example 4 4. The assembly of any one of Examples 2 to 3, wherein the at least one temperature sensor comprises a thermistor.

[0008] Example 5 The assembly of any one of the preceding examples, wherein the PCB has at least one thermally conductive area between the at least one cooling element and the at least one energy transmitter.

[0009] Example 6 6. The assembly of example 5, wherein the at least one thermally conductive region intersects the first surface on which the at least one energy transmitter is mounted.

[0010] Example 7 6. The assembly of example 5, wherein a PCB region is positioned between the at least one energy transmitter and the at least one thermally conductive region.

[0011] Example 8 The assembly of any one of Examples 5-7, wherein the at least one thermally conductive region is aligned with a position of the at least one energy transmitter on the first surface.

[0012] Example 9 The assembly of any one of Examples 5 to 8, wherein the at least one thermally conductive region has an implant of a thermally conductive material within the PCB.

[0013] Example 10 An assembly described in any one of Examples 5 to 9, wherein the at least one thermally conductive area has a via channel preformed in the PCB, and at least 50% of the volume of the via channel is filled with a thermally conductive material.

[0014] Example 11 11. The assembly of example 9 or 10, wherein the thermally conductive material comprises at least one of copper, gold, silver, silver epoxy, and gold epoxy.

[0015] Example 12 The assembly of any one of the preceding examples, wherein the at least one cooling element has a flat surface, the flat surface being at least partially attached to the second surface of the PCB.

[0016] Example 13 The assembly of any one of the preceding examples, wherein the PCB has at least one cavity with an opening on the second surface, the at least one cavity aligned with the at least one energy transmitter and at least partially intersects the PCB, and the cooling element has a shape and size to penetrate through the opening into the at least one cavity.

[0017] Example 14 The assembly of Example 13, wherein the at least one cooling element has a thermally conductive holder having at least one protrusion, the at least one protrusion having a shape and size to penetrate through the opening into the at least one cavity.

[0018] Example 15 The assembly of any one of Examples 1-12, wherein the at least one cooling element comprises a thermally conductive holder having a flat surface, the flat surface of the thermally conductive holder being in contact with the second surface.

[0019] Example 16 The assembly of any one of Examples 1-11, wherein the at least one cooling element has one or more cooling channels passing through the PCB.

[0020] Example 17 17. The assembly of Example 16, wherein the one or more cooling channels have at least one inlet and / or at least one outlet on the second surface of the PCB.

[0021] Example 18 The assembly of any one of the preceding examples, wherein the at least one energy transmitter has at least one first electrode and at least one second electrode for delivering electricity from the PCB to the at least one energy transmitter.

[0022] Example 19 The assembly of Example 18, wherein the PCB has at least one flexible region for electrically connecting the at least one first electrode to a first conductive pad of the PCB, and the at least one second electrode is electrically connected to a second conductive pad of the PCB via a conductive adhesive layer.

[0023] Example 20 The assembly of Example 18, wherein the PCB has at least two flexible regions, at least one of the flexible regions electrically connecting the at least one first electrode to the PCB, and another of the at least two flexible regions electrically connecting the at least one second electrode to the PCB.

[0024] Example 21 The assembly of Example 18, wherein the at least one first electrode is electrically connected to a first conductive pad of the PCB by wire welding, and the at least one second electrode is electrically connected to a second conductive pad of the PCB via a conductive adhesive layer.

[0025] Example 22 The assembly of Example 18, wherein each of the at least one first electrode and the at least one second electrode is electrically connected to the PCB by a different conductive pad of the PCB via a conductive adhesive layer.

[0026] Example 23 13. The assembly of any one of the preceding examples, wherein the PCB has at least one thermally insulating region between the at least one cooling element and at least one region adjacent to the at least one energy transmitter on the first surface.

[0027] Example 24 24. The assembly of example 23, wherein the at least one insulating region intersects the first surface.

[0028] Example 25 24. The assembly of example 23, wherein at least one layer of the PCB is positioned between the first surface and the at least one insulating region.

[0029] Example 26 24. The assembly of example 23, wherein the at least one insulating region is spaced from each of the first and second surfaces of the PCB by at least one layer of the PCB.

[0030] Example 27 27. The assembly of any one of Examples 23-26, wherein the at least one insulating region is an air-filled opening in the PCB.

[0031] Example 28 The assembly of any one of Examples 23 to 26, wherein the at least one insulating region has an implant of insulating material within the PCB.

[0032] Example 29 27. The assembly of any one of Examples 23-26, wherein the at least one insulating region has vias pre-formed in the PCB and filled with insulating material.

[0033] Example 30 30. The assembly of any one of Examples 28 or 29, wherein the insulating material comprises air, gas, or silica particles containing air.

[0034] Example 31 5. The assembly of any one of Examples 2-4, comprising at least one thermally insulating region between the at least one temperature sensor on the first surface and the at least one cooling element.

[0035] Example 32 The assembly of any one of the preceding examples, wherein the at least one energy transmitter comprises at least one of at least one ultrasonic transducer, at least one radio frequency electrode, and at least one laser diode.

[0036] Example 33 33. The assembly of Example 32, wherein the at least one ultrasonic transducer is configured to deliver unfocused ultrasonic energy.

[0037] Example 34 An assembly described in any one of Examples 31 or 32, wherein the at least one ultrasonic transducer has at least one piezoelectric element.

[0038] Example 35 a rigid region having a first surface and a second surface, the rigid region having one or more cavities intersecting the second surface; at least one energy transmitter positioned on the first surface; the one or more cavities are aligned with a position of the at least one energy transmitter; Printed circuit board (PCB).

[0039] Example 36 36. The printed circuit board of Example 35, comprising a flexible region electrically and mechanically connected to a second surface of the rigid region at a distance from an edge of the rigid region.

[0040] Example 37 37. The printed circuit board of any one of Examples 35 or 36, wherein the rigid region has at least one thermally conductive region between the one or more cavities and the at least one energy transmitter.

[0041] Example 38 The printed circuit board of any one of Examples 35 to 37, wherein the at least one energy transmitter includes a plurality of energy transmitters positioned at a distance from each other on the first surface, and the one or more cavities include a plurality of spaced apart cavities aligned within the rigid region, each cavity of the plurality of spaced apart cavities being aligned with a different energy transmitter of the plurality of energy transmitters.

[0042] Example 39 The printed circuit board according to any one of Examples 35 to 38, wherein the first surface and / or the second surface is flat.

[0043] Example 40 The printed circuit board of any one of Examples 35 to 39, wherein the one or more cavities have a shape and size to receive at least one cooling element.

[0044] Example 41 a printed circuit board (PCB) having a first surface and a second surface; and at least one ultrasonic transducer mounted on the first surface; At least one energy emitting assembly having at least one rigid cover having an opening and configured to geometrically interlock with the PCB; the at least one ultrasonic transducer and the first surface of the PCB are at least partially exposed through the opening in the at least one rigid cover. Ultrasound applicator.

[0045] Example 42 42. The ultrasound applicator of claim 41, wherein the PCB includes at least one recess, and the at least one rigid cover is geometrically interlocked with the at least one recess.

[0046] Example 43 An ultrasonic applicator as described in any one of Examples 41 or 42, wherein the at least one energy radiating assembly comprises at least one cooling element coupled to the second surface of the PCB, the at least one cooling element configured to cool the at least one ultrasonic transducer via the PCB.

[0047] Example 44 An ultrasonic applicator described in any one of Examples 41 to 43, comprising at least one insulating layer attached to the cover distal to the opening, the at least one insulating layer electrically insulating the at least one energy radiating assembly and sealing the at least one energy radiating assembly from ingress of moisture and liquid.

[0048] Example 45 Providing at least one energy transmitter mounted on a surface of a Printed Circuit Board (PCB); cooling the at least one energy transmitter and / or the surface via the PCB; 23. A method for cooling an energy transmitter, comprising:

[0049] Example 46 46. ​​The method of example 45, wherein the cooling step includes cooling the at least one energy transmitter and / or the surface with at least one cooling element that at least partially penetrates into the PCB via a different surface of the PCB.

[0050] Example 47 A method as described in any one of Examples 45 or 46, wherein the preparing step includes preparing at least one ultrasonic transducer mounted on the surface, and the cooling step includes cooling the at least one ultrasonic transducer and / or the surface via the PCB.

[0051] Example 48 48. The method of example 47, comprising activating the at least one ultrasound transducer to generate and deliver unfocused ultrasound energy to skin tissue during the cooling step.

[0052] Example 49 providing a rigid printed circuit board (PCB) having electrical traces, a first surface, and a second surface; mounting at least two ultrasonic transducers spaced apart from one another on the first surface; A method of manufacturing an energy transmission assembly, comprising:

[0053] Example 50 50. The method of example 49, comprising forming at least two cavities in the PCB, each cavity having an opening in the second surface.

[0054] Unless otherwise defined, all technical and / or scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this invention belongs.Although methods and materials similar or equivalent to those described herein can be used to practice or test embodiments of this invention, exemplary methods and / or materials are described below.In case of conflict, the patent specification, including definitions, shall prevail.In addition, the materials, methods, and examples are merely illustrative and are not necessarily intended to be limiting.

[0055] Certain embodiments of the present invention are described herein, by way of example only, with reference to the accompanying drawings, in which it is emphasized that the details shown hereinafter, with particular reference to the drawings, are for the purposes of illustration and for the purpose of detailed description of embodiments of the present invention. Similarly, from viewing the description together with the drawings, it will become apparent to those skilled in the art how embodiments of the present invention may be practiced. [Brief description of the drawings]

[0056] [Figure 1] 1 is a schematic diagram of an energy transmission assembly having at least one energy transmitter positioned on a surface of a PCB according to some exemplary embodiments of the present invention. [Diagram 2] 1 illustrates a general flow chart for cooling at least one energy transmitter via a PCB, according to some exemplary embodiments of the present invention. [Figure 3A] 1 is a schematic diagram of a PCB, according to some exemplary embodiments of the present invention. [Figure 3B] 1A-1C are schematic diagrams of a PCB within an applicator body, according to some exemplary embodiments of the present invention. [Figure 3C] 1A-1C are schematic diagrams of a PCB within an applicator body, according to some exemplary embodiments of the present invention. [Figure 3D] 1A-1C are schematic diagrams of a PCB within an applicator body, according to some exemplary embodiments of the present invention. [Figure 3E] 1A-1C are schematic diagrams of a PCB within an applicator body, according to some exemplary embodiments of the present invention. [Figure 3F] 1A-1C are schematic diagrams of connections between flexible and rigid regions of a PCB, according to some exemplary embodiments of the present invention. [Figure 4A] 1 is a schematic diagram of a PCB having at least one cavity, according to some exemplary embodiments of the present invention. [Figure 4B] 1 is a schematic diagram of a PCB having at least one cavity, according to some exemplary embodiments of the present invention. [Figure 4C]1 is a schematic diagram of a PCB having at least one cavity, according to some exemplary embodiments of the present invention. [Figure 4D] 1 is a schematic diagram of a PCB having at least one cavity, according to some exemplary embodiments of the present invention. [Figure 4E] 1 is a schematic diagram of a PCB having at least one cavity, according to some exemplary embodiments of the present invention. [Figure 4F] 1 is a schematic diagram of a PCB having at least one cavity, according to some exemplary embodiments of the present invention. [Figure 4G] 1 is a schematic diagram of a PCB having at least one cavity, according to some exemplary embodiments of the present invention. [Figure 5A] 1 is a schematic diagram of a thermally conductive holder having multiple finger-shaped extensions that are placed in a cavity of a PCB, according to some exemplary embodiments of the present invention. [Figure 5B] 1 is a schematic diagram of a thermally conductive holder having multiple finger-shaped extensions that are placed in a cavity of a PCB, according to some exemplary embodiments of the present invention. [Figure 5C] 1 is a schematic diagram of a thermally conductive holder having multiple finger-shaped extensions that are placed in a cavity of a PCB, according to some exemplary embodiments of the present invention. [Figure 5D] 1 is a schematic diagram of a thermally conductive holder having multiple finger-shaped extensions that are placed in a cavity of a PCB, according to some exemplary embodiments of the present invention. [Figure 5E] 1 is a schematic diagram of a thermally conductive holder having multiple finger-shaped extensions that are placed in a cavity of a PCB, according to some exemplary embodiments of the present invention. [Figure 5F] 1 is a schematic diagram of a thermally conductive holder having multiple finger-shaped extensions that are placed in a cavity of a PCB, according to some exemplary embodiments of the present invention. [Figure 6A] 1 is a schematic diagram illustrating a PCB having a flat surface placed on top of a holder extension, according to some exemplary embodiments of the present invention. [Figure 6B] 1 is a schematic diagram illustrating a PCB having a flat surface placed on top of a holder extension, according to some exemplary embodiments of the present invention. [Figure 7A] 1 is a schematic diagram of a PCB having at least one thermally conductive region and / or at least one thermally insulating region positioned on a holder extension, according to some exemplary embodiments of the present invention. [Figure 7B] 1 is a schematic diagram of a PCB having at least one thermally conductive region and / or at least one thermally insulating region positioned on a holder extension, according to some exemplary embodiments of the present invention. [Figure 7C] 1 is a schematic diagram of a PCB having at least one thermally conductive region and / or at least one thermally insulating region positioned on a holder extension, according to some exemplary embodiments of the present invention. [Figure 8A] 1 is a schematic diagram of a PCB having a flat surface positioned on a flat surface of a holder, according to some exemplary embodiments of the present invention; [Figure 8B] 1 is a schematic diagram of a PCB having a flat surface and at least one thermally conductive area and / or at least one thermally insulating area positioned on the flat surface of a holder, according to some exemplary embodiments of the present invention. [Figure 8C] 1 is a schematic diagram of a PCB having a flat surface and at least one thermally conductive area and / or at least one thermally insulating area positioned on the flat surface of a holder, according to some exemplary embodiments of the present invention. [Figure 8D] 1 is a schematic diagram of a PCB having a flat surface and at least one thermally conductive area and / or at least one thermally insulating area positioned on the flat surface of a holder, according to some exemplary embodiments of the present invention. [Figure 9A] 1 is a schematic diagram of a PCB having an internal cooling element, according to some exemplary embodiments of the present invention. [Figure 9B]1 is a schematic diagram of a PCB having an internal cooling element and at least one heat conducting element between the internal cooling element and a surface of the PCB on which an energy transmitter is mounted, according to some exemplary embodiments of the present invention. [Figure 9C] 1 is a schematic diagram of a PCB having an internal cooling element and at least one heat conducting element between the internal cooling element and a surface of the PCB on which an energy transmitter is mounted, according to some exemplary embodiments of the present invention. [Figure 10A] 1 is a schematic cross-sectional view of an energy transmitter mounted on a PCB having an internal cooling element, according to some exemplary embodiments of the present invention. [Figure 10B] 1 is a schematic cross-sectional view of an energy transmitter mounted on a PCB having an internal cooling element, according to some exemplary embodiments of the present invention. [Figure 10C] 1 is a schematic cross-sectional view of an energy transmitter mounted on a PCB having an internal cooling element, according to some exemplary embodiments of the present invention. [Figure 11A] 1A-1C are schematic diagrams of an assembly process for an applicator head including a PCB having an energy transmitter mounted on a surface of the PCB, according to some exemplary embodiments of the present invention. [Figure 11B] 1A-1C are schematic diagrams of an assembly process for an applicator head including a PCB having an energy transmitter mounted on a surface of the PCB, according to some exemplary embodiments of the present invention. [Figure 11C] 1A-1C are schematic diagrams of an assembly process for an applicator head including a PCB having an energy transmitter mounted on a surface of the PCB, according to some exemplary embodiments of the present invention. [Figure 11D] 1A-1C are schematic diagrams of an assembly process for an applicator head including a PCB having an energy transmitter mounted on a surface of the PCB, according to some exemplary embodiments of the present invention. [Figure 11E] 1A-1C are schematic diagrams of an assembly process for an applicator head including a PCB having an energy transmitter mounted on a surface of the PCB, according to some exemplary embodiments of the present invention. [Figure 11F]1A-1C are schematic diagrams of an assembly process for an applicator head including a PCB having an energy transmitter mounted on a surface of the PCB, according to some exemplary embodiments of the present invention. [Figure 11G] 1 is a schematic diagram illustrating a flexible region of a PCB attached to a holder, according to some exemplary embodiments of the present invention. [Figure 11H] 1 is a schematic diagram illustrating a flexible region of a PCB attached to a holder, according to some exemplary embodiments of the present invention. [Figure 12A] 1 is a schematic diagram illustrating an electrical connection between a PCB and an energy transmitter on the PCB according to some exemplary embodiments of the present invention. [Figure 12B] 1 is a schematic diagram illustrating an electrical connection between a PCB and an energy transmitter on the PCB according to some exemplary embodiments of the present invention. [Figure 12C] 1 is a schematic diagram illustrating an electrical connection between a PCB and an energy transmitter on the PCB according to some exemplary embodiments of the present invention. [Figure 12D] 1 is a schematic diagram illustrating an electrical connection between a PCB and an energy transmitter on the PCB according to some exemplary embodiments of the present invention. [Figure 12E] 1 is a schematic diagram illustrating an electrical connection between a PCB and an energy transmitter on the PCB according to some exemplary embodiments of the present invention. [Figure 12F] 1 is a schematic diagram illustrating an electrical connection between a PCB and an energy transmitter on the PCB according to some exemplary embodiments of the present invention. [Figure 13A] 1 is a schematic diagram illustrating an electrically isolated region surrounding an electrical connector of a PCB, according to some exemplary embodiments of the present invention. [Figure 13B] 1 is a schematic diagram illustrating an electrically isolated region surrounding an electrical connector of a PCB, according to some exemplary embodiments of the present invention. [Figure 13C] 1 is a schematic diagram illustrating an electrically isolated region surrounding an electrical connector of a PCB, according to some exemplary embodiments of the present invention. [Figure 14A]1 is a schematic diagram of an applicator comprising one or more units of an energy transmission assembly, according to some exemplary embodiments of the present invention. [Figure 14B] 1 is a schematic diagram of an applicator comprising one or more units of an energy transmission assembly, according to some exemplary embodiments of the present invention. [Figure 14C] 1 is a schematic diagram of an applicator comprising one or more units of an energy transmission assembly, according to some exemplary embodiments of the present invention. [Figure 15] 1 is a schematic diagram of an energy transmission assembly comprising at least two different types of energy transmitters on a PCB surface according to some exemplary embodiments of the present invention. [Figure 16] 16A-16F are schematic diagrams of PCB traces and layers, according to some example embodiments of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0057] The present invention, in certain embodiments thereof, relates to energy transmission assemblies, and more particularly, but not exclusively, to ultrasonic energy transmission assemblies.

[0058] overview An aspect of some embodiments relates to an energy transmission assembly having one or more energy transmitters mounted on a circuit board, e.g., a Printed Circuit Board (PCB), and cooling of the one or more energy transmitters via the circuit board. In some embodiments, the one or more energy transmitters are mounted on a flexible area of ​​the PCB, e.g., a flexible PCB, and / or on a rigid area of ​​the PCB, e.g., a rigid PCB. In some embodiments, the one or more energy transmitters have one or more energy transducers, e.g., one or more ultrasonic transducers. In some embodiments, the one or more energy transmitters are mounted on a first surface of the circuit board and cooling is applied via a second surface of the circuit board. Alternatively or additionally, cooling is applied from within the circuit board. In some embodiments, the circuit board has electrical wiring configured to deliver power to the one or more energy transmitters and electrically connect the one or more energy transmitters with a power source and / or control circuitry.

[0059] According to some embodiments, cooling is provided by at least one cooling element coupled to the second surface of the PCB. In some embodiments, the cooling element is attached to the second surface of the PCB and heat is conducted from the one or more energy transmitters to the cooling element via the second surface of the PCB. Alternatively, heat is conducted from the one or more energy transmitters to a cooling element positioned within the PCB.

[0060] According to some embodiments, the cooling element positioned within the PCB has at least one finger of a thermally conductive holder attached to the second surface of the PCB. In some embodiments, the at least one finger penetrates into the PCB. Optionally, the at least one finger, e.g., a long axis of the at least one finger, is aligned with the position of the energy transmitter mounted on the first surface. Alternatively, the cooling element positioned within the PCB comprises at least one channel shaped and sized to allow the flow of a cooling liquid within the PCB.

[0061] According to some embodiments, the PCB has one or more thermally conductive inserts between at least some or each of the energy transmitters and the cooling element. In some embodiments, the thermally conductive inserts are formed from a thermally conductive material and optionally have a shape and size to conduct heat only from the energy transmitters to the cooling element.

[0062] According to some embodiments, the energy emitting assembly has one or more sensors mounted on a first surface of a circuit board (e.g., PCB). In some embodiments, the one or more sensors are positioned between adjacent energy transmitters. In some embodiments, the one or more sensors include a plurality of sensors, each of the plurality of sensors being positioned between two adjacent energy transmitters on the first surface of the circuit board. In some embodiments, the one or more sensors include at least one temperature sensor, e.g., a thermistor. Alternatively or additionally, the one or more sensors include at least one pressure sensor.

[0063] According to some embodiments, the circuit board has one or more insulating regions between the one or more sensors and the at least one cooling element. In some embodiments, the one or more insulating regions include an insulating material, such as air, nitrogen gas, small gas-filled polymer particles, small gas-filled silica particles, and fiberglass, configured to thermally isolate the one or more sensors from the cooling module.

[0064] According to some embodiments, the one or more energy transmitters include a single energy transmission type, such as an ultrasonic transducer, or the one or more energy transmitters include microphones of two or more types of energy transmitters disposed on the first surface of the circuit board.

[0065] A potential advantage of mounting one or more energy transmitters on a circuit board, and most importantly in a planar geometry, may be to enable easy assembly and / or mass production of the energy transmission assembly using, for example, pick-and-place methods and / or machines that are very common and standard in the PCB manufacturing industry.

[0066] An aspect of some embodiments relates to controlling the rate of thermal conduction through a PCB using at least one thermally conductive area in the PCB. In some embodiments, the at least one thermally conductive area is positioned between at least one cooling element coupled to the PCB and a surface of the PCB on which at least one energy transmitter is mounted. In some embodiments, the thermally conductive area is configured to enhance the rate of thermal conduction between the energy transmitter and the cooling element. Optionally, the thermally conductive area allows the cooling element to efficiently cool the energy transmitter. In some embodiments, the thermally conductive area is selectively positioned in the PCB according to, for example, a location or a planned location of a heat generating element, for example, an energy transmitter.

[0067] In some embodiments, at least one thermally conductive region in a PCB is a region that conducts heat with a thermal conduction efficiency of more than 20% compared to other regions of the PCB, e.g., more than 40%, more than 50%, more than 60%, more than 80%, or any intermediate, smaller, or greater percentage value.

[0068] According to some embodiments, the thermally conductive region is positioned between a first surface of the PCB on which the energy transmitter is mounted and a second surface coupled to the cooling element. In some embodiments, the thermally conductive region includes a channel, e.g., a via channel, having an opening at the second surface, filled with a thermally conductive material. In some embodiments, at least 50% of the via channel, e.g., at least 70%, at least 80%, at least 90%, at least 95% of the via channel, is filled with a thermally conductive material. In some embodiments, a portion of the PCB is positioned between the via channel and the first surface of the PCB, e.g., to electrically insulate the energy transmitter mounted on the first surface from the thermally conductive material in the via channel. Alternatively, the via channel intersects the first and second surfaces of the PCB.

[0069] According to some embodiments, the thermally conductive region comprises an insert positioned within an implant, for example, a PCB. In some embodiments, the implant comprises a thermally conductive material. In some embodiments, a portion of the PCB separates the implant and a first surface to which the transducer is attached. Additionally or optionally, a portion of the PCB separates the implant from a second surface of the PCB. Alternatively, the implant intersects the second surface and / or the first surface of the PCB.

[0070] According to some embodiments, the PCB includes at least one thermally isolated region. In some embodiments, a thermally isolated region in a PCB is a region that conducts heat with less than 20%, e.g., less than 40%, less than 50%, less than 60%, less than 80%, or any intermediate, smaller, or greater percentage value, as compared to other regions of the PCB.

[0071] According to some embodiments, at least one thermally isolated region is positioned between the second surface of the PCB and / or the cooling element and a region of the first surface adjacent to or near the energy transmitter. Optionally, at least one thermally isolated region is positioned between the second surface of the PCB and / or the cooling element and a region of the first surface positioned between two adjacent energy transmitters. This region of the first surface is, for example, optionally located between two adjacent energy transmitters to prevent overcooling of the first surface in contact with tissue.

[0072] According to some embodiments, the location of the at least one thermally isolated region is determined according to the location of the energy transmitter and / or the location of the at least one sensor (e.g., temperature sensor) on the surface of the PCB. In some embodiments, the at least one thermally isolated region is selectively positioned between the at least one sensor and the at least one cooling element. In some embodiments, the location of the thermally isolated region is aligned with the region between two adjacent energy transmitters on the first surface and / or the location of the sensor on the first surface.

[0073] According to some embodiments, the at least one thermally isolated region is in contact with the surface on which the at least one sensor is positioned and / or in contact with the at least one cooling element, or alternatively, the at least one thermally isolated region is spaced apart from the surface on which the at least one sensor is positioned and / or spaced apart from the at least one cooling element.

[0074] According to some exemplary embodiments, at least one thermally isolated region intersects the first surface and / or the second surface of the PCB. In some embodiments, a portion of the PCB separates the at least one thermally isolated region from the first surface and / or the second surface of the PCB. In some embodiments, the at least one thermally isolated region includes a via channel filled with a thermally isolating material. In some embodiments, the at least one thermally isolated region has an implant of a thermally isolating material.

[0075] A potential advantage of a PCB having at least one specific thermally isolated region within the PCB body may be to control or limit the thermal effect via the PCB body on the heat sensitive element (e.g., at least one temperature sensor mounted on the surface of the PZT).

[0076] A potential advantage of having thermally conductive and / or thermally insulating regions can be to control the distribution of cooling effect from at least one cooling element through the PCB layers. Thermally isolated regions in the PCB can allow for localized cooling to the location of the energy transmitter (e.g., a piezoelectric transducer (PZT)) and / or localized cooling to areas in the PCB under and / or near the PZT. This can prevent cooling of areas of the PCB without the PZT that contact the skin.

[0077] Control of the cooling effect is important, for example, to prevent excessive cooling of the skin, which can reduce or even prevent the desired thermal effect produced in the tissue by the PZT elements.

[0078] A further potential benefit of the thermal isolation region may be to isolate the thermistor from cooling effects, for example, so that the thermistor may be more responsive to heat flow from the skin.

[0079] The assemblies and applicators described herein are configured to allow for measurement of skin temperature under direct contact and very close to the location on the skin surface where energy is applied.

[0080] An aspect of some embodiments relates to a PCB (e.g., a rigid region of the PCB) having a first surface with at least one energy transmitter and at least one cavity aligned with the location of the energy transmitter on the first surface. In some embodiments, the cavity has an opening in a second surface of the PCB. The second surface is optionally a surface opposite the first surface. In some embodiments, the flexible region is electrically and mechanically coupled to the rigid region at a distance from an end of the rigid region. Optionally, the flexible region electrically and mechanically connects the rigid region with the at least one energy transmitter with at least one different rigid region.

[0081] According to some embodiments, the rigid region has a plurality of spaced apart energy transmitters (e.g., ultrasonic transducers) mounted on the first surface at a distance from each other. In some embodiments, the rigid region has a plurality of spaced apart cavities selectively positioned in the PCB according to the distribution of the energy transmitters on the first surface. In some embodiments, each cavity is aligned with the position of the energy transmitters on the first surface. In some embodiments, a portion of the PCB separates between each cavity and the first surface of the PCB. In some embodiments, the portion of the PCB between each cavity and the first surface of the PCB has a thickness value ranging from 50 μm to 300 μm, for example, 50 μm to 100 μm, 70 μm to 200 μm, 100 μm to 200 μm, 150 μm to 300 μm, or any intermediate, smaller, or larger value.

[0082] In some embodiments, at least one or each of the first surface and the second surface of the PCB is planar.

[0083] According to some embodiments, the rigid region of the PCB has at least one thermally conductive region between the cavity and the first surface, hi some embodiments, the thermally conductive region is separated from the cavity and / or the first surface by a portion of the PCB.

[0084] An aspect of some embodiments relates to an ultrasound applicator comprising a PCB having at least one energy transmitter mounted on a surface of the PCB, and a cover (e.g., a rigid cover) configured to geometrically interlock with the PCB. In some embodiments, the cover has an opening. In some embodiments, when the cover interlocks with the PCB, the at least one energy transmitter is exposed through the opening of the cover. In some embodiments, the ultrasound applicator has at least one insulating layer attached to the cover (e.g., over the opening of the cover). In some embodiments, the at least one insulating layer seals the PCB and / or the at least one energy transmitter from moisture and / or liquid.

[0085] According to some embodiments, the PCB has at least one recess, e.g., a recess positioned laterally from the location of the at least one energy transmitter on the PCB. In some embodiments, the cover is configured to geometrically interlock (e.g., contact) with the at least one recess. In some embodiments, the at least one recess is a recess in a surface on which the at least one energy transmitter is mounted. Alternatively, the at least one recess is a recess in a different surface of the PCB, e.g., a surface opposite to the surface on which the energy transmitter is mounted.

[0086] An aspect of some embodiments relates to a method of manufacturing an energy transmission assembly by mounting at least one energy transmitter (e.g., an ultrasonic transducer) on a surface of a PCB. In some embodiments, a plurality of energy transmitters are mounted on a surface of the PCB at a distance from each other, for example, using a pick-and-place process. In some embodiments, the distance (e.g., minimum distance) between two adjacent energy transmitters on the PCB is in the range of 0.1 mm to 100 mm, such as 0.5 mm to 20 mm, 1 mm to 10 mm, or any intermediate, smaller, or larger value. In some embodiments, the distance (e.g., minimum distance) between two adjacent energy transmitters on the PCB is 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, or any intermediate, smaller, or larger distance. In some embodiments, at least some or all of the energy transmitters are positioned in parallel. Alternatively or optionally, at least some of the energy transmitters are oriented at an angle or in a different orientation relative to the adjacent energy transmitters. Alternatively or optionally, the distance between adjacent energy transmitters is similar or varies between energy transmitters on a PCB.

[0087] According to some embodiments, during the manufacturing process, one or more cavities are formed in the PCB, for example according to a planned location of the at least one energy transmitter. In some embodiments, the one or more cavities have an opening on a surface of the PCB different from (optionally an opposite surface) the surface on which the at least one energy transmitter is or will be mounted. In some embodiments, a portion of the PCB provides a separation between the cavity and the planned location of the at least one energy transmitter on the PCB.

[0088] According to some embodiments, the cavities are formed by drilling holes in the PCB. Alternatively, the cavities are formed by stacking PCB layers each having an opening at a planned location of the cavity. In some embodiments, each cavity is aligned with a planned location or a location of an energy transmitter on the PCB surface. In some embodiments, the cavities are formed with dimensions selected to allow at least one heating element (e.g., an extension of a thermally conductive holder) to penetrate into the cavity.

[0089] According to some embodiments, during the manufacturing process, at least one thermally conductive area is formed in the PCB. In some embodiments, the at least one thermally conductive area is formed between a surface of the PCB on which the at least one energy transmitter is planned to be mounted and a second surface of the PCB. Alternatively, the at least one thermally conductive area is formed between a surface of the PCB on which the at least one energy transmitter is planned to be mounted and a cavity or a planned location of a cavity in the PCB.

[0090] According to some embodiments, the at least one thermally conductive region is formed by placing or introducing a thermally conductive implant into the PCB (e.g., a void or opening formed in the PCB). Alternatively, the thermally conductive region is formed by creating a via channel in the PCB and filling the via channel with a thermally conductive material.

[0091] According to some embodiments, the manufacturing process includes attaching at least one sensor (e.g., a temperature sensor) to a surface on which the at least one energy transmitter is mounted. In some embodiments, the temperature sensor is mounted between two adjacent energy transmitters. In some embodiments, the temperature sensor is mounted using a pick-and-place process.

[0092] Before describing at least one embodiment of the invention in detail, it is to be understood that the invention is not necessarily limited in its application to the details of construction and the arrangement of elements and / or methods set forth in the following description and / or illustrated in the drawings and / or examples. The invention is capable of other embodiments and of being practiced or carried out in various ways.

[0093] Exemplary Energy Transmission Assembly According to some exemplary embodiments, the at least one energy transmitter is used to deliver energy to tissues of the body, for example during a medical or cosmetic procedure. In some embodiments, the at least one energy transmitter has a transducer (e.g., an ultrasound transducer). Optionally, the ultrasound transducer includes a piezoelectric ceramic material, such as lead zirconate titanate, barium titanate, or other material that exhibits piezoelectric behavior. Alternatively or additionally, the at least one energy transmitter has at least one of a radio frequency (RF) electrode and / or a laser diode.

[0094] According to some exemplary embodiments, the at least one energy transmitter is part of an energy transmission assembly. The energy transmission assembly has an electric circuit and a cooling element (e.g., a cooler) configured to cool the at least one energy transmitter and / or body tissue before, during, and / or after activation of the at least one energy transmitter. Reference is now made to FIG. 1, which illustrates an energy emitting assembly according to some exemplary embodiments of the present invention.

[0095] According to some exemplary embodiments, an energy transmission assembly (e.g., assembly 102) includes a circuit board (e.g., PCB 104) having a first surface 106 and at least one additional surface (e.g., second surface 108). In some embodiments, second surface 108 is opposite first surface 106.

[0096] According to some exemplary embodiments, the assembly 102 comprises at least one energy transmitter, e.g., at least two energy transmitters 110 and 112 mounted on the first surface 106. In some embodiments, the at least two energy transmitters 110 and 112 are attached to or embedded in the first surface 106. In some embodiments, the at least two energy transmitters 110 and 112 are spaced apart (e.g., distributed over the first surface 106).

[0097] According to some exemplary embodiments, the assembly 102 has at least one cooling element 114, e.g., at least one cooler, coupled to the second surface 108 of the PCB 104. In some embodiments, the at least one cooling element comprises at least one of a thermoelectric cooler (TEC), a thermally conductive holder, a heat sink, and a cooling fluid or cooling fluid channels disposed through or in contact with the PCB 104. In some embodiments, the at least one cooling element comprises a passive cooling element and / or an active cooling element.

[0098] According to some exemplary embodiments, the cooling element 114 is at least partially attached to the second surface 108. In some embodiments, the cooling element 114 is at least partially in contact with the second surface 108. Alternatively or additionally, the cooling element 114 at least partially penetrates into the PCB 104, and optionally through the second surface 108. In some embodiments, the penetration area of ​​the cooling element 114 into the PCB 104 is aligned with the location of the at least one energy transmitter on the first surface 106 of the PCB 104.

[0099] According to some exemplary embodiments, the assembly 102 includes at least one sensor, e.g., at least two sensors 116 and 118, mounted on the first surface 106 of the PCB 104. In some embodiments, the at least one sensor includes a temperature sensor (e.g., a thermistor). In some embodiments, the at least one sensor is attached to the first surface 106. In some embodiments, the at least one sensor is positioned between two adjacent energy transmitters, e.g., energy transmitters 110 and 112. In some embodiments, each sensor of the at least two sensors 116 and 118 is positioned between an adjacent pair of energy transmitters on the first surface 106.

[0100] According to some exemplary embodiments, the assembly 102 includes at least one thermally conductive region in the PCB, optionally between the cooling element 114 and the at least one energy transmitter, for example, to increase thermal conduction through the PCB from the at least one energy transmitter and the cooling module. In some embodiments, the assembly 102 has at least one thermally insulating region in the PCB (optionally between the at least one sensor (e.g., temperature sensor) and the cooling element), for example, to reduce interference from the cooling module 114 on thermal measurements by the at least one temperature sensor.

[0101] According to some exemplary embodiments, the assembly 102 is part of an energy transmitting applicator, optionally used for medical and / or cosmetic procedures. In some embodiments, the assembly 102 is positioned in a head of the applicator such that the first surface 106 is oriented facing body tissue. In some embodiments, the first surface 106 is configured to be placed in direct or indirect contact with tissue (e.g., skin). In some embodiments, the first surface 106 is adjacent to a skin contacting surface of the applicator. Optionally, the skin contacting surface of the applicator is positioned between the tissue (e.g., skin) or skin surface and the first surface 106 having at least one energy transmitter.

[0102] Exemplary Process for Cooling a Transmitter According to some exemplary embodiments, a device (e.g., an applicator) for delivering energy to tissue has one or more energy transmitters, e.g., energy emitting transducers. In some embodiments, the one or more energy transmitters are mounted on a surface of a circuit board (e.g., PCB) and positioned inside the applicator to face the skin-contacting surface of the applicator. In some embodiments, during activation of the one or more energy transmitters, heat is generated and delivered to the tissue (e.g., skin) in contact with the skin-contacting surface of the applicator. In some embodiments, at least one of the skin-contacting surface of the applicator and / or the energy transmitters is cooled to prevent thermal damage to the tissue.

[0103] Reference is now made to FIG. 2, which illustrates a method for cooling at least one energy transmitter of an applicator, according to some exemplary embodiments of the present invention.

[0104] According to some exemplary embodiments, at block 202, an applicator having at least one energy transmitter is provided. In some embodiments, the applicator has a surface having a shape and size to be placed in contact with tissue (e.g., skin). In some embodiments, the applicator is mounted to a surface of a PCB that is disposed adjacent to a skin-contacting surface of the applicator. In some embodiments, the at least one energy transmitter is positioned between the skin-contacting surface of the applicator and the PCB.

[0105] According to some exemplary embodiments, the applicator may be placed in contact with the skin at block 204. In some embodiments, at least a portion of the skin-contacting surface of the applicator is placed in contact with the skin.

[0106] According to some exemplary embodiments, at block 206, at least one energy transmitter is activated. In some embodiments, activation of the at least one energy transmitter generates energy and delivers the energy from the at least one energy transmitter to the tissue. In some embodiments, the at least one energy transmitter comprises an ultrasound transducer. In some embodiments, activation of the ultrasound transducer generates ultrasound energy (e.g., unfocused ultrasound energy) and delivers the ultrasound energy into a tissue layer of the skin (e.g., into a deeper tissue layer of the skin). In some embodiments, activation of the at least one energy transmitter causes the energy transmitter to generate heat. This may result in thermal damage to tissue in contact with the applicator.

[0107] According to some exemplary embodiments, at block 208, cooling of the at least one energy transmitter is applied through the PCB. In some embodiments, cooling is applied through one or more layers of the PCB structure. In some embodiments, cooling is applied through one or more layers of the PCB to the at least one energy transmitter mounted on a surface of the PCB. In some embodiments, cooling is applied through one or more surfaces of the PCB (e.g., one or more surfaces opposite the surface on which the at least one energy transmitter is mounted). In some embodiments, cooling is applied at block 208 before, during, and / or after actuation at block 208. In some embodiments, cooling is applied through the PCB and the at least one energy transmitter to cool tissue in contact with the applicator and / or the at least one energy transmitter.

[0108] Example of a typical PCB According to some exemplary embodiments, the PCB comprises at least one flexible region and at least one rigid region. Optionally, the at least one flexible region of the PCB interconnects two rigid regions of the PCB, for example forming a PCB body formed from the flexible and rigid regions connected to each other. In some embodiments, the at least one rigid region of the PCB is used as a base for connecting at least one energy transmitter and / or at least one sensor to the PCB. Additionally or alternatively, the at least one region is used as a base for one or more electrical connectors between the PCB and electrical wiring from the energy transmission applicator or other configuration of the system.

[0109] Reference is now made to FIG. 3, which illustrates a PCB having flexible and rigid regions, according to some exemplary embodiments of the present invention.

[0110] According to some exemplary embodiments, PCB 302 has at least one first rigid region 304 and at least one second rigid region 306 interconnected by at least one flexible region 308. In some embodiments, the flexible region of the PCB (e.g., flexible region 308) is thin and formed from a flexible material that allows bending at least 45 degrees, e.g., at least 90 degrees, at least 180 degrees, or any intermediate, lesser, or greater angle, without damaging the flexible region and / or the electrical wiring in the structure of the flexible region.

[0111] According to some exemplary embodiments, the energy transmitter is positioned on a flexible PCB. In some embodiments, a thermally conductive area, optionally including a thermally conductive implant positioned adjacent to and / or aligned with the energy transmitter in the flexible PCB (optionally a thermally conductive implant positioned below the energy transmitter), is used to mechanically support the energy transmitter (e.g., to prevent damage to the energy transmitter when the flexible PCB is bent). Alternatively, the energy transmitter is positioned on the flexible PCB without additional mechanical support.

[0112] According to some exemplary embodiments, the at least one first rigid region 304 has at least one, e.g., at least two, energy transmitters 310 and 312 mounted on a first surface of the rigid region 304. In some embodiments, the at least one two energy transmitters have at least two ultrasonic transducers, and optionally a PZT. In some embodiments, the at least one first rigid region 304 has at least one sensor, e.g., a temperature sensor, mounted on a first surface of the rigid region 304. In some embodiments, the at least one temperature sensor comprises a thermistor, e.g., thermistors 312 and 314. In some embodiments, each of the thermistors is positioned between two adjacent energy transmitters.

[0113] According to some exemplary embodiments, at least one second rigid region 306 comprises at least one electrical connector, e.g., electrical connectors 316 and 318. In some embodiments, the electrical connectors are configured to electrically connect PCB 302 to one or more external electrical networks. In some embodiments, at least one electrical connector, e.g., connectors 316 and 318, is surrounded by a barrier 320, forming an isolation region for connectors 316 and 318. In some embodiments, the barrier separates the electrical connector from other portions of the second rigid region, allowing selective sealing of the isolation region including the connector, e.g., with a sealing liquid or sealing gel.

[0114] According to some demonstrative embodiments, at least one second rigid region 306 has indicators 322 and 324 configured to generate at least one indicator (e.g., a human-detectable notification (e.g., an audio notification and / or a visual notification)). In some embodiments, the at least one indicator generates the notification when an electrical connection is established between PCB 302 and an external element via at least one electrical connector, e.g., connectors 316 and 318. Alternatively or additionally, the at least one indicator generates the notification upon activation of at least one energy transmitter, e.g., transmitters 310 and 312.

[0115] According to some exemplary embodiments, the PCB 302 includes at least one additional flexible region, e.g., flexible region 326 coupled to at least one second rigid region 306. In some embodiments, the flexible region has electrical traces electrically connected to electrical traces of the rigid region 308 and / or the rigid region 304. In some embodiments, the flexible region 326 has at least one indicator, e.g., indicator 328 configured to generate at least one human detectable notification, e.g., audio and / or visual notification. Alternatively or additionally, the flexible region 326 has at least one user interface 330 for receiving at least one user input signal. In some embodiments, the at least one user interface 330 has switches, selectors, and / or buttons for receiving user input. In some embodiments, the at least one user interface 330 is positioned in at least one of the rigid and flexible regions of the PCB 302.

[0116] According to some exemplary embodiments, the PCB 302 has at least one flexible region, such as a flexible strip 332 coupled to the rigid region 304. In some embodiments, the flexible strip comprises at least one temperature sensor, such as a thermistor 334 electrically connected to traces in the flexible strip 332.

[0117] According to some exemplary embodiments, when positioned within the applicator body, the flexible region of PCB 302 allows for the rigid region to be positioned in various positions and / or orientations relative to the flexible region and relative to other elements within the applicator body. For example, flexible strip 332 allows thermistor 334 to be in contact with one or more elements, such as one or more cooling elements, located near rigid region 304.

[0118] According to some exemplary embodiments, PCB 302 having flexible and rigid regions is used as the electrical hub of the applicator body, such that electrical components can be connected to the central electrical traces of PCB 302 and provide a mechanically flexible interface between the electrical components coupled to PCB 302 and other components (e.g., other electrical and / or non-electrical components) within the applicator body.

[0119] 3B and 3C, the PCB is disposed within the applicator body with a cover, e.g., cover 311, configured to prevent contact between the PCB and tissue or other components within the applicator body. In some embodiments, a rigid region of the PCB, e.g., region 304 comprising energy transmitters 312 and 314, is disposed in contact with cover 311.

[0120] According to some exemplary embodiments, as shown, for example, in FIG. 3D , the applicator body has at least one cooling element (e.g., holder 340), which is placed in contact with the PCB (e.g., rigid region 304 having the energy transmitter (e.g., energy transmitter 310)). In some embodiments, holder 340 is a thermally conductive holder and optionally also provides mechanical support for the PCB. In some embodiments, holder 340 is used as a base for rigid region 304 of the PCB. In some embodiments, holder 340 is in contact with a surface of the PCB opposite and / or different from the surface on which transmitter 310 is mounted.

[0121] According to some exemplary embodiments, as shown, for example, in FIG. 3D, the applicator body cover 344 covers at least a portion of the rigid region of the PCB on which the transmitter 310 is mounted, but does not cover the transmitter 310. In some embodiments, as shown, for example, in FIG. 3D, the cover 344 is coupled to the PCB surface that includes the transmitter 310. Alternatively, as shown, for example, in FIG. 3E, the applicator body cover, for example cover 346, is coupled to a surface of the PCB opposite the surface of the PCB that includes the transmitter 310. In some embodiments, as shown, for example, in FIG. 3E, the PCB rigid region 305 is used as part of the applicator body cover.

[0122] According to some exemplary embodiments, as shown, for example, in Figures 3D and 3E, the cover 344 is geometrically interlocked with the PCB, for example with the rigid region 304 of the PCB. In some embodiments, as shown, for example, in Figure 3D, the rigid region 304 includes at least one distal recess 311, for example a lateral distal recess closer to the surface of the PCB on which the transmitter 310 is mounted. In some embodiments, the cover 344 is geometrically interlocked with the at least one distal recess 311.

[0123] According to some exemplary embodiments, as shown, for example, in FIG. 3E, the rigid region 304 has at least one proximal recess 313 (e.g., a lateral proximal recess closer to a surface of the PCB facing the at least one cooling element (e.g., holder 340). In some embodiments, the cover 346 is geometrically interlocked with the at least one proximal recess 313.

[0124] According to some exemplary embodiments, as shown, for example, in Figure 3F, the flexible region 308 is coupled, for example mechanically and electrically, to the rigid region 304 at a distance from the end 305 (e.g., edge) of the rigid region 304. A potential advantage of coupling the flexible region to the rigid region at a distance from the edge of the distal region may be to allow for strain relief when bending the flexible region relative to the rigid region (e.g., when adjusting the shape and / or size of a PCB to be disposed within the applicator body).

[0125] Exemplary PCB with Cavity According to some exemplary embodiments, heat is generated by at least one energy transmitter (e.g., an ultrasound transducer) mounted on the PCB during operation of the at least one energy transmitter. In some embodiments, the generated heat may cause thermal damage to tissue located adjacent to or placed in direct or indirect contact with the energy transmitter. In some embodiments, cooling of the at least one energy transmitter is performed using at least one cooling element coupled to the PCB, for example, via a surface of the PCB different from the surface on which the at least one energy transmitter is mounted.

[0126] According to some exemplary embodiments, the PCB is formed with one or more cavities, for example, that allow for the penetration of at least one cooling element into the PCB. In some embodiments, the one or more cavities are aligned with the location of at least one energy transmitter on a surface of the PCB. Reference is now made to Figures 4A-4G, which show a PCB having a cavity shaped and sized to receive at least a portion of a cooling element, according to some exemplary embodiments of the present invention.

[0127] 4A, the PCB 402 has a thickness 406 ranging from 0.5 mm to 3 mm, e.g., 0.5 mm to 2 mm, 1 mm to 2 mm, 1.5 mm to 3 mm, or any intermediate, smaller, or larger value. Optionally, the PCB 402 is formed in multiple layers, e.g., 3 layers, 4 layers, 5 layers, 6 layers, 7 layers, or any greater number of layers.

[0128] According to some exemplary embodiments, the PCB comprises at least one cavity 404. In some embodiments, the cavity 404 penetrates one or more layers of the PCB 402. In some embodiments, the cavity 404, e.g., the cavity long axis, is aligned with a pad 408 for placement of an energy transmitter, attached to a first surface 410 of the PCB 402. In some embodiments, the thickness 412 of the PCB between the cavity 404 and the pad 408 or between the cavity 404 and the PCB surface 410 is in the range of 0.05 mm to 0.5 mm, e.g., 0.1 mm to 0.2 mm, 0.15 mm to 0.3 mm, 0.25 mm to 0.5 mm, or any intermediate, smaller, or larger value.

[0129] According to some exemplary embodiments, the cavity 404 is formed during the manufacturing process of the PCB, for example by reducing the number of layers in a specific PCB area aligned to a planned location of at least one energy transmitter or a pad for positioning the energy transmitter, or alternatively, the cavity is formed by drilling holes in the PCB after it is manufactured.

[0130] According to some exemplary embodiments, the PCB has a plurality of cavities. In some embodiments, the number of cavities is determined according to the number of heat generating elements mounted on the surface of the PCB (e.g., according to the number of energy transmitters mounted on the surface of the PCB). In some embodiments, the cavities are spaced apart in the PCB. In some embodiments, the distance between two adjacent cavities is determined according to the distance between two adjacent energy transmitters or other heat generating elements aligned with the cavities.

[0131] According to some exemplary embodiments, for example as shown in FIG. 4B, the shape and size of the cavity is a shape and size to receive at least a portion of the cooling element, for example to position the cooling element at a close distance from the heat generating element (e.g., the energy transmitter). In some embodiments, the cooling element has a thermally conductive holder (e.g., a base holder) configured to conduct heat from the energy transmitter toward the optional additional cooling element. In some embodiments, the holder is formed from a thermally conductive material, for example, a thermally conductive metal or metal composition, for example, aluminum or any other metal.

[0132] According to some exemplary embodiments, the holder has at least one protrusion, e.g., finger 414, having a shape and size to at least partially penetrate into PCB 402 through cavity 404. In some embodiments, a distal end 416 of finger 414 is placed in contact with PCB 402 or with pad 408 or at least one layer of the PCB on which the energy transmitter is mounted. In some embodiments, finger 414 penetrates into PCB 402 through surface 418, which is a different surface than surface 410 on which the energy transmitter is mounted, optionally a surface opposite surface 410. In some embodiments, the width of the finger, e.g., finger 414, is smaller than the width of cavity 404, e.g., to allow easy insertion of the finger into the cavity.

[0133] According to some exemplary embodiments, as shown, for example, in FIG. 4C , finger 420 has a distal end 422 that includes at least one opening 424. Optionally, at least one opening 424, optionally filled with air, is positioned between finger 420 and PCB 402 when finger 420 is inserted into cavity 404.

[0134] According to some exemplary embodiments, as shown, for example, in FIG. 4D , a filler material 426, e.g., an electrically and / or thermally conductive filler material, is positioned within the cavity 404 to fill the space between the fingers 420 and / or the distal portions 422 of the fingers (e.g., openings 424) and the cavity walls. In some embodiments, the fingers 420 are pressed into the cavity containing the filler material. In some embodiments, the filler material comprises an adhesive, e.g., an epoxy adhesive, used to secure the fingers 420 within the cavity 404 and / or attach the fingers 420 to the PCB 202. In some embodiments, the adhesive is an electrically and thermally conductive adhesive that includes metal particles, e.g., aluminum, silver and / or gold particles.

[0135] According to some exemplary embodiments, the filler material 426 is used as an interface with the holder and / or the fingers of the holder to, for example, increase adhesion, electrical conductivity, and / or thermal conductivity between the holder and the PCB.

[0136] According to some exemplary embodiments, for example as shown in FIG. 4E, the holder body 428 contacts the PCB 402 while at least one finger 430 extending from the holder body 428 penetrates into the cavity 404 of the PCB 402. In some embodiments, the holder body 428 contacts a surface different from the surface 410 on which the at least one energy transmitter is mounted, optionally a surface 418 opposite the surface 410. In some embodiments, the length of the finger 430 is less than or equal to the length of the cavity 404, for example to allow contact between the holder body and the PCB. Alternatively, for example as shown in FIGS. 4B-4D, the length of the holder finger is greater than the length 405 of the cavity 404.

[0137] According to some exemplary embodiments, as shown in FIG. 4F, the fingers 432 of the holder are configured to interlock with the PCB 434, for example, by a snap-fit ​​assembly. In some embodiments, the PCB 434 has at least one protruding edge 434, e.g., a flexible edge configured to penetrate into the opening 438 of the fingers 432, e.g., a snap-in area. In some embodiments, the snap-fit ​​assembly including the at least one protruding edge 434 of the PCB 434 and the opening 438 of the fingers 432 is a permanent snap-fit. Alternatively, the snap-fit ​​assembly is a multi-use snap-fit. In some embodiments, the protruding edge 436 is formed from one of the layers of the PCB 434. In some embodiments, the protruding edge 436 protrudes into the cavity 404 of the PCB 434.

[0138] According to some exemplary embodiments, a PCB, e.g., PCB 450, has at least one cavity 452 shaped and sized to receive a holder finger 454. In some embodiments, the finger 454 extends from a holder body 456 having at least one electrical connector, e.g., at least one conductive pad, e.g., connectors 458 and 460, configured to contact pads 462 and 464, respectively, of the PCB 450. In some embodiments, when the holder finger 454 is inserted into the cavity 452, the holder electrical connector is coupled to the PCB pad. In some embodiments, an adhesive material 468, optionally a filler material 426 shown in FIGS. 4D and 4E, fills the cavity 452 and optionally fills an opening 468 at a distal end 466 of the finger 454 to bond the finger 454 to the PCB 450. In some embodiments, adhesive material 468 fixes the position of fingers 454 within cavity 452, thereby allowing for maintaining a stable electrical connection between the holder and the PCB via connectors 458 and 460 and pads 462 and 464. In some embodiments, power is delivered from the holder to one or more elements mounted on the PCB via the holder's connectors 458 and 468.

[0139] Exemplary Holder Fingers in Cavity Reference is now made to Figures 5A-5C, which illustrate a PCB and holder, according to some example embodiments of the present invention, where extensions, e.g., fingers, of the holder penetrate into cavities formed in the PCB.

[0140] According to some exemplary embodiments, holder 502 comprises a holder body 504 and a number of extensions, e.g., fingers 506 and 508, extending from body 504. In some embodiments, as shown, for example, in FIG. 5B, each finger penetrates into PCB 512 through a cavity in PCB 512. In some embodiments, each cavity intersects at least 50% of the PCB, e.g., at least 60%, at least 80%, at least 90% of the PCB. In some embodiments, each cavity or at least some of the cavities in the PCB intersect the entire PCB.

[0141] According to some exemplary embodiments, as shown, for example, in FIG. 5C, the PCB 512 has at least one energy transmitter, e.g., ultrasonic transducer 516, mounted to a surface 518 of the PCB 512, for example, by at least one pad 520 attached to the surface 518. In some embodiments, the PCB has at least one sensor, e.g., a thermistor 522, for measuring temperature. In some embodiments, the thermistor 522 is mounted to a surface of the PCB, for example, the surface 518. In some embodiments, as shown, for example, in FIG. 5C, the fingers 524 of the holder are aligned with the location of the ultrasonic transducer 516 on the surface 518 and are laterally spaced from the thermistor 522.

[0142] Reference is now made to Figures 5D and 5E, which show a rigid region of a PCB having a number of openings shaped and sized to receive the fingers of a holder, according to some exemplary embodiments of the present invention.

[0143] According to some exemplary embodiments, the PCB 550 comprises at least one rigid region 552 and at least one flexible region 554 coupled to the rigid region 552. In some embodiments, the flexible region 554 has electrical traces that extend to the rigid region 552. In some embodiments, the rigid region 552 comprises at least two energy transmitters, e.g., at least two ultrasonic transducers 556 and 558, mounted on a first surface 560 of the rigid region 552. In some embodiments, the at least two ultrasonic transducers, e.g., transducers 556 and 558, are spaced apart on the surface 560.

[0144] According to some exemplary embodiments, the rigid region 552 has at least one sensor, e.g., a thermistor 562, mounted on the surface 560. In some embodiments, the thermistor 562 is configured to measure the temperature level of tissue in direct or indirect contact with the surface 560 and / or the transducers 556 and 558. In some embodiments, the thermistor 562 is positioned at a distance from the heat conducting and / or heating elements, e.g., the ultrasonic transducers 556 and 558, e.g., no interference with the temperature measurement occurs. In some embodiments, a single thermistor, e.g., thermistor 562, is positioned between two adjacent ultrasonic transducers 556 and 558 on the surface 560. In some embodiments, at least one electrical connection 564 between the thermistor 562 and / or the ultrasonic transducer and electrical wiring of the PCB is present on the surface 560, e.g., as shown in FIG. 5D.

[0145] According to some exemplary embodiments, as shown, for example, in Figure 5E, rigid region 552 has a number of cavities, e.g., cavities 566, that extend into rigid region 560 through a second surface 568 opposite first surface 560 on which the ultrasonic transducer and / or thermistor are mounted. In some embodiments, the multiple cavities terminate away from first surface 560.

[0146] According to some exemplary embodiments, for example, as shown in FIG. 5F, the rigid region 552 of the PCB is positioned over a holder body 570, for example, a thermally conductive holder body, and a protrusion (e.g., a finger-like portion (e.g., finger portion 572) extending from the holder body 570) is inserted into a cavity in the rigid region 552, for example, as also shown in FIGS. 5A-5C.

[0147] According to some exemplary embodiments, the PCB has at least one additional flexible region 574, for example, electrically and mechanically coupled to the rigid region 552. In some embodiments, the at least one additional flexible region comprises at least one thermistor 576 for measuring the temperature level of the holder body 570.

[0148] Example flat PCB According to some exemplary embodiments, the PCB (e.g., a rigid region of the PCB on which the at least one energy transmitter rests) is flat and does not include a through cavity. In some embodiments, a flat surface of the PCB, e.g., a surface of the PCB different from the surface on which the at least one energy transmitter is mounted, contacts the holder. In some embodiments, the flat surface of the PCB contacts a flat surface of the holder. Alternatively, the flat surface of the PCB contacts one or more extensions, e.g., fingers, of the holder.

[0149] Reference is now made to Figures 6A-6B, which illustrate the assembly of a flat surface of a PCB and a holder having extending fingers, according to some exemplary embodiments of the present invention.

[0150] According to some exemplary embodiments, the PCB 602 comprises a first surface 604 and a second surface 606. In some embodiments, the PCB 602 has at least one energy transmitter, e.g., at least two spaced apart energy transmitters 608 and 610 mounted on the first surface 604. In some embodiments, the PCB 602 comprises at least one sensor, e.g., at least one temperature sensor 612 mounted on the first surface 604. In some embodiments, the at least one temperature sensor comprises at least two temperature sensors, e.g., thermistors 612 and 614. In some embodiments, the at least one temperature sensor is configured to measure a temperature of tissue (e.g., skin) in direct or indirect contact with the surface 602.

[0151] According to some exemplary embodiments, the PCB 602 is mounted on a thermally conductive holder, e.g., holder 616, comprising a holder body 618 and one or more extensions, e.g., spaced apart fingers 620 and 622, extending from the body 618. In some embodiments, the fingers 620 and 622 contact the second surface 606 and are aligned according to the positions of the energy transmitters, e.g., transmitters 608 and 610, on the first surface 604. In some embodiments, aligning the fingers with the energy transmitters allows, e.g., to selectively conduct heat away from the energy transmitters and selectively cool the energy transmitters without thermally affecting a temperature sensor, e.g., a thermistor 612, positioned between two adjacent energy transmitters.

[0152] According to some exemplary embodiments, the openings, e.g., spaces, between adjacent fingers of the holder are aligned according to the location of at least one sensor, e.g., sensor 612, mounted on the first surface 604. In some embodiments, the openings, e.g., openings 624, between the spaced apart fingers are filled with an insulating material to enhance thermal isolation of the at least one temperature sensor, e.g., sensor 612, from the holder 616. In some embodiments, as shown, for example, in FIG. 6A, the openings, e.g., openings 624, are filled with air. Alternatively, as shown, for example, in FIG. 6B, the openings 624 are filled with an insulating material including air, nitrogen gas, small gas-filled polymer particles, small gas-filled silica particles, and / or fiberglass.

[0153] Reference is now made to Figures 7A-7C, which show a flat PCB having at least one thermally conductive area and / or at least one thermally insulating area attached to fingers of a thermally conductive holder, according to some example embodiments of the present invention.

[0154] According to some exemplary embodiments, as shown in, for example, FIG. 7A, the flat surface 606 of the PCB 630 is attached to the fingers of the thermally conductive holder 616. In some embodiments, the PCB 630 comprises at least one via, e.g., a via 632 in the PCB, between the holder (e.g., the fingers of the holder that contact the surface 606) and the energy transmitter (e.g., the energy transmitter 608). In some embodiments, the via 632 formed in the PCB 630 is filled with a thermally conductive material, e.g., copper, gold, aluminum, silver, carbon, or mixtures thereof, to increase the thermal conductivity between the holder 616 and the energy transmitter 608. In some embodiments, at least 50% of the volume of the via 632 is filled with a thermally conductive material, e.g., at least 70%, at least 80%, at least 90%, at least 95%, at least 98%, or any intermediate, smaller, or larger percentage value. Optionally, the entire volume of the via 632 is completely filled with a thermally conductive material. In some embodiments, the via is a hole drilled through the PCB body. In some embodiments, the thermally conductive material filled via 632 is aligned with an energy transmitter and / or laterally spaced from at least one sensor, e.g., a temperature sensor 612 mounted on the surface 604.

[0155] According to some exemplary embodiments, as shown in, for example, FIG. 7B, the flat surface 606 of the PCB 640 contacts the holder 616, e.g., the fingers of the holder. In some embodiments, the PCB 640 has one or more implants, e.g., inserts, in the body of the PCB 640. In some embodiments, the one or more implants (e.g., the implant 642) are thermally conductive implants including a thermally conductive material, e.g., copper, aluminum, brass, gold, and in some embodiments, the thermally conductive implants (e.g., the implant 642) are positioned between the holder (e.g., the fingers 620 of the holder) and the transmitter 608 mounted on the PCB. In some embodiments, the position of the thermally conductive implant is aligned with the position of the energy transmitter 608 and / or is laterally spaced from the sensor (e.g., the temperature sensor 612) mounted on the PCB 640.

[0156] According to some exemplary embodiments, the implant in the PCB body intersects the PCB 640. Alternatively, the implant penetrates at least one surface of the PCB 640. Alternatively, the implant is positioned within the PCB 640 at a distance from the outer surface of the PCB (e.g., surfaces 604 and 606).

[0157] According to some exemplary embodiments, for example as shown in FIG. 7C , the PCB 650 has at least one insulating region 652 (e.g., a via filled with an insulating material, or an implant (e.g., an insert filled with an insulating material). In some embodiments, the at least one insulating region 652 is positioned within the PCB 650 between the holder 616 and the at least one sensor, e.g., a temperature sensor 654 mounted on a surface of the PCB 650. In some embodiments, the at least one insulating region 652 is configured to increase thermal isolation of the at least one sensor from the holder 616. In some embodiments, the insulating material comprises fiberglass.

[0158] According to some exemplary embodiments, the at least one insulating region is aligned with the at least one sensor and / or laterally spaced from the at least one energy transmitter mounted on the PCB 654. In some embodiments, the at least one insulating region intersects the PCB 650 or at least one surface (e.g., an outer surface) of the PCB 650. Alternatively, the at least one insulating region is positioned within the PCB 650 at a distance from an outer surface of the PCB 650.

[0159] According to some exemplary embodiments, as shown, for example, in Figure 7C, PCB 650 has at least one thermally conductive region 654 and at least one thermally insulating region 652. In some embodiments, the at least one thermally conductive region is aligned with the position of energy transmitter 608 and / or is laterally spaced from at least one sensor 654, as shown, for example, in Figures 7A and 7B with respect to via 632 and implant 642, respectively.

[0160] Reference is now made to Figures 8A-8D, which show a PCB having a flat surface contacting a flat surface of a holder (eg, a thermally conductive holder), according to some exemplary embodiments of the present invention.

[0161] According to some exemplary embodiments, for example as shown in FIG. 8A, the PCB 602 previously shown in FIGS. 6A and 6B is placed in contact with a flat surface 802 of a holder 804 .

[0162] According to some exemplary embodiments, as shown, for example, in Figure 8B, the PCB 630 previously shown in Figure 7A is placed in contact with a flat surface of the holder 804. In some embodiments, the PCB 630 has at least one via 632, as described in connection with Figure 7A.

[0163] According to some exemplary embodiments, as shown, for example, in Figure 8C, the PCB 640 previously shown in Figure 7B is placed in contact with a flat surface of the holder 804. In some embodiments, the PCB 640 described in connection with Figure 7B has at least one implant 642.

[0164] According to some exemplary embodiments, as shown in Figure 8D, for example, the PCB 650 previously shown in Figure 7C is placed in contact with a flat surface of the holder 804. In some embodiments, the PCB 650 as described in connection with Figure 7C has at least one thermally conductive region 654 and at least one thermally insulating region 652. Alternatively, the PCB has only at least one thermally insulating region 652.

[0165] Exemplary PCB with at least one internal cooling channel According to some exemplary embodiments, the PCB has at least one energy transmitter mounted on a first surface of the PCB and at least one internal cooling element (e.g., cooling channel) passing through the PCB. In some embodiments, the cooling channel has a shape and size to, for example, circulate a cooling fluid within the PCB to cool the at least one energy transmitter and / or the first surface of the PCB. In some embodiments, the at least one cooling channel passes through at least one second surface of the PCB. Reference is now made to Figures 9A-9C. Figures 9A-9C show a PCB having an internal cooling element according to some exemplary embodiments of the present invention.

[0166] According to some exemplary embodiments, the PCB 902 has a first surface 904 and a second surface 906. In some embodiments, the PCB 902 includes at least one, e.g., at least two, energy transmitters mounted on the first surface 904 and at least one internal cooling element, e.g., a cooling channel 912, passing through the PCB 902. In some embodiments, the at least one cooling channel 912 has at least one inlet 914 and at least one outlet 916, which optionally extend from the PCB 902. In some embodiments, the inlet 914 and / or the outlet 916 extend through a surface different from the first surface 904, e.g., through the second surface 906. Optionally, the second surface 906 is opposite the first surface 904.

[0167] Optionally, the PCB has one or more thermally conductive regions (e.g., region 918) between the internal cooling element (e.g., channel 912) and at least one energy transmitter (e.g., transmitter 908). In some embodiments, region 918 at least partially or completely surrounds channel 912. In some embodiments, region 918 includes a thermally conductive implant made of a thermally conductive material, e.g., copper. In some embodiments, the thermally conductive implant is attached to channel 912, e.g., to a wall of channel 912.

[0168] According to some illustrative embodiments, PCB 902 has a plurality of spaced apart thermally conductive implants, e.g., implants 918 and 920, positioned between channel 912 and energy transmitters, e.g., transmitters 908 and 910, mounted on surface 904. In some embodiments, the spaced apart thermally conductive elements are aligned with the energy transmitters. Optionally, second surface 906 (optionally a flat surface) is in contact with a thermally conductive holder 922, e.g., a flat surface of holder 922.

[0169] According to some exemplary embodiments, for example as shown in FIG. 9B, PCB 924 has at least one cooling channel 926 passing therethrough. In some embodiments, at least one thermally conductive implant is positioned between channel 926 and a surface 928 on which the energy transmitter is positioned. In some embodiments, at least one thermally conductive implant has a polygonal, elliptical, or circular cross-section. Optionally, at least one thermally conductive implant has a rectangular cross-section (e.g., implant 930), or a square cross-section (e.g., implant 932), or a trapezoidal cross-section (e.g., implant 934).

[0170] According to some illustrative embodiments, a thermally conductive implant, e.g., implant 936, is in contact with channel 926 and is spaced apart from surface 928. Alternatively, a thermally conductive implant, e.g., implant 930, is in contact with surface 928 and is spaced apart from channel 926. Alternatively, a thermally conductive implant, e.g., implant 932, is in contact with both channel 926 and surface 928. Alternatively, a thermally conductive implant, e.g., implant 938, is spaced apart from both surface 928 and channel 926.

[0171] According to some exemplary embodiments, the cooling channels have a polygonal cross-section, an elliptical cross-section, or a circular cross-section, as shown, for example, in FIG 9C. In some embodiments, the cooling channels, for example, cooling channel 940, have a rectangular cross-section. In some embodiments, the cooling channels, for example, cooling channel 942, have a diamond-shaped cross-section.

[0172] 9C , a cooling channel, e.g., cooling channel 940, is at least partially surrounded by a thermally conductive implant 944, which optionally contacts a wall of the cooling channel 940. Additionally, the PCB 946 further includes at least one thermally conductive implant (e.g., implant 948) between the channel (e.g., channel 940) and a surface 950 on which the at least one energy transmitter is mounted.

[0173] According to some exemplary embodiments, similar to the description of the thermally conductive implants in Figures 9A-9C, the PCB optionally has at least one thermally insulating implant having a shape and size similar to the thermally conductive implants shown in Figures 9A-9C.

[0174] Exemplary Energy Radiation Assembly Having Internal Cooling Element Reference is now made to Figures 10A-10C, which illustrate an energy emitting assembly comprising a PCB with internal cooling elements, according to some exemplary embodiments of the present invention.

[0175] 10A, an energy emitting assembly 1002 has a first surface 1006 and an optional opposing second surface 1008, and at least one internal cooling element, e.g., a PCB 1004 having a cooling channel 1010 passing through the PCB 1004. In some embodiments, the assembly 1002 has at least one energy emitting transmitter, e.g., ultrasonic transducer 1012 and 1014, mounted to the first surface 1006 via conductive pads, e.g., pads 1016 and 1018, attached to the first surface 1006, and optionally conductive films, e.g., films 1020 and 1022, disposed between the pads and the transducer.

[0176] According to some exemplary embodiments, the assembly 1002 has at least one thermally conductive element between the channel 1010 and the first surface 1006. In some embodiments, the at least one thermally conductive element has a thermally conductive implant, e.g., implant 1024, positioned in the PCB 1004 between the channel 1010 and the surface 1006. Optionally, the implant 1024 is spaced apart from the surface 1006 and / or the channel 1010. In some embodiments, the thermally conductive element has a via 1026 filled with a thermally conductive material and intersects the PCB between the first surface 1006 and the second surface 1008. In some embodiments, the thermally conductive element has a via 1028 filled with a thermally conductive material and positioned between the channel 1010 and the first surface 1006. In some embodiments, the via 1028 intersects the first surface and is spaced apart from the channel 1010.

[0177] According to some exemplary embodiments, the thermally conductive elements, such as implant 1024, via 1026, and via 1028, are aligned with the position of at least one of pads 1016 and 1018 and / or energy transmitters 1012 and 1014.

[0178] 10B, an energy emitting assembly 1042 has a PCB 1004 having a first surface 1046 and an optional opposing second surface 1048, and at least one internal cooling element, e.g., cooling channel 1010 passing through the PCB 1044. In some embodiments, the assembly 1042 has at least one energy emitting transmitter, e.g., ultrasonic transducer 1012 and 1014, mounted to the first surface 1046 via conductive pads, e.g., pads 1016 and 1018, attached to the first surface 1006, and optionally conductive films, e.g., films 1020 and 1022, disposed between the pads and the transducer.

[0179] According to some exemplary embodiments, the assembly 1042 further includes at least one temperature sensor 1050 mounted to the first surface 1006 via a conductive pad 1052 attached to the first surface 1006 .

[0180] According to some exemplary embodiments, the assembly 1042 has at least one thermally conductive element between the channel 1010 and the first surface 1006. In some embodiments, the at least one thermally conductive element has a thermally conductive implant, e.g., implant 1024, positioned in the PCB 1044 between the channel 1010 and the first surface 1046. Optionally, the implant 1024 is spaced apart from the surface 1046 and / or the channel 1010. In some embodiments, the assembly 1042 has at least one insulating element, e.g., insulator 1054, positioned in the PCB 1044 between the channel 1010 and the pad 1052 and / or the temperature sensor 1050.

[0181] According to some exemplary embodiments, the insulator 1054 is aligned with the location of the at least one temperature sensor 1050 on the first surface 1046 of the PCB 1044 .

[0182] According to some exemplary embodiments, as shown, for example, in FIG. 10C , an energy emitting assembly 1060 has a first surface 1066 and an optional opposing second surface 1068, and at least one internal cooling element, for example, a PCB 1064 having cooling channels 1010 passing through the PCB 1064. In some embodiments, the assembly 1060 includes at least one cooling element, for example, thermoelectric coolers (TECs) 1074 and 1076, attached to the first surface 1066. In some embodiments, the TECs are spaced apart on the first surface 1066. In some embodiments, the assembly 1060 has at least one energy emitting transmitter, e.g., ultrasonic transducer 1012 and 1014, mounted to a first surface 1066 via a conductive pad (e.g., pads 1070 and 1072, each attached to a surface of a different one of the TECs 1074 and 1076) and, optionally, a conductive film (e.g., films 1020 and 1022 disposed between the pad and the transducer). In some embodiments, each of the pads, e.g., pads 1020 and 1022, is attached to a cold surface of a TEC, e.g., TECs 1074 and 1076. In some embodiments, the hot surface of each TEC is attached to the first surface 1066 of the PCB 1064.

[0183] According to some illustrative embodiments, the assembly 1042 further comprises at least one thermally conductive element between the channel 1010 and the first surface 1006 and at least one TEC, such as a hot surface of a TEC (e.g., TEC 1076). In some embodiments, the at least one thermally conductive element comprises a thermally conductive implant, such as implant 1024, positioned in the PCB 1044 between the channel 1010 and the first surface 1066 and the TEC 1076.

[0184] According to some exemplary embodiments, the cooling channel 1010 has at least one inlet 1021 and at least one outlet 1023 through the second surface of the PCB, as shown, for example, in Figures 10A-10C.

[0185] According to some exemplary embodiments, several cooling elements, e.g., multiple cooling elements, run through the PCB. In some embodiments, each cooling channel of the multiple cooling channels is aligned with a single energy transmitter on the PCB, e.g., to individually cool a particular energy transmitter. Alternatively, a single cooling channel of the multiple cooling channels is aligned with two or more energy transmitters, e.g., to cool two or more energy transmitters.

[0186] A potential advantage of having several cooling channels, and optionally individual cooling channels for each energy transmitter, may be to allow for a more efficient and / or uniform cooling treatment of all energy transmitters on the PCB.

[0187] Exemplary Energy Emitting Assembly Reference is now made to Figures 11A-11G, which illustrate an energy emitting assembly, according to some exemplary embodiments of the present invention.

[0188] According to some exemplary embodiments, as shown, for example, in FIG. 11A , a PCB 1102 has at least one first rigid region 1104 having at least one energy transmitter, e.g., at least one ultrasonic transducer 1106, and at least one second rigid region 1106, which are mechanically and / or electrically interconnected by a flexible region 1110. In some embodiments, the at least one ultrasonic transducer 1106 is mounted to a first surface of the at least one first rigid region 1104. In some embodiments, at least one sensor, e.g., a temperature sensor 1112, is mounted to the first surface.

[0189] According to some exemplary embodiments, as shown, for example, in FIG. 11B, at least one first rigid region 1104 is arranged in contact with at least one cooling element, for example a thermally conductive holder 1114. In some embodiments, a second surface of at least one rigid region 1104, different from the surface on which at least one ultrasonic transducer is mounted, is in contact with the holder 1114. In some embodiments, at least a portion of the holder 1114 is in contact with at least one additional cooling element, for example a TEC and / or a heat exchanger. Optionally, at least a portion of the holder is in contact with a cold surface of the TEC and a hot surface of the TEC is in contact with the heat exchanger. Alternatively, the second surface of at least one rigid region 1104 is in contact with the heat exchanger.

[0190] According to some exemplary embodiments, as shown, for example, in Figures 11C and 11E, a cover 1118 is disposed over the PCB. In some embodiments, the rigid region 1104 extends through an opening in the cover 1118. In some embodiments, the cover 1118 is a cover for an applicator, for example, an ultrasound applicator. In some embodiments, the cover 1118 surrounds the PCB and holder 1114, for example, to close a gap between the holder and the rigid region of the PCB and prevent ingress of external elements. Additionally or alternatively, the cover 1118 provides mechanical support to the energy transmission assembly 1102.

[0191] According to some exemplary embodiments, the cover 1118 is geometrically interlocked with the PCB, for example with the rigid region 1104 of the PCB.

[0192] According to some exemplary embodiments, as shown, for example, in FIG. 11D and FIG. 11E, the rigid region 1104 and the at least one ultrasonic transducer are covered with at least one coating layer 1120, e.g., an insulating layer, configured to seal the rigid region 1104 and the at least one ultrasonic transducer from fluids and / or moisture. In some embodiments, the at least one coating layer includes a sealing layer, e.g., a sealing layer of parylene and optionally parylene C. Alternatively or additionally, the at least one coating layer includes an electrically insulating material, e.g., Kapton. In some embodiments, as shown, for example, in FIG. 11D, the coating layer 1120 is disposed on the cover 1118, e.g., on or distal to an opening in the cover through which the at least one ultrasonic transducer is exposed.

[0193] According to some exemplary embodiments, as shown, for example, in Figures 11F and 11G, the rigid region 1104 of the PCB is disposed on a holder having one or more extensions or fingers, e.g., finger 1122. In some embodiments, at least some of the or each of the fingers are aligned with the position of at least one ultrasonic transducer, e.g., transducer 1106, mounted on the rigid region 1104. In some embodiments, at least some of the or each of the fingers penetrate into the rigid region 1104 through a cavity in the PCB, as previously described in Figures 4A-4F. Alternatively, the rigid region 1104 is disposed on the fingers.

[0194] According to some exemplary embodiments, as shown, for example, in Figures 11G and 11H, at least one flexible region, e.g., flexible strip 1126, is mechanically and electrically coupled to rigid region 1104. In some embodiments, flexible strip 1126 has a temperature sensor, e.g., a thermistor, for measuring the temperature of the holder. In some embodiments, flexible strip 1126 is configured to bend and bring the thermistor into contact with holder 1114, e.g., within opening 1128 of holder 1126.

[0195] Example PCB and Transmitter Electrical Wiring Reference is now made to Figures 12A-12D, which show electrical wiring between a PCB and an electrode of an ultrasonic transducer, such as an electrode attached to a piezoelectric element of the ultrasonic transducer, according to some exemplary embodiments of the present invention.

[0196] According to some exemplary embodiments, a piezoelectric element, e.g., a PZT 1202, has at least one first electrode 1204, e.g., a distal electrode, located at a distance from a PCB 1206, and at least one second electrode 1208, e.g., a proximal electrode, located closer to the PCB 1206. In some embodiments, a conductive pad 1210 is attached to the PCB 1206. Further, the pad 1210 is attached to the proximal electrode 1208 by a conductive adhesive material 1212, e.g., an adhesive. In some embodiments, the adhesive 1212 includes a plurality of conductive particles within a non-conductive adhesive matrix material. In some embodiments, the pad 1210 is formed from a conductive metal, e.g., copper, silver, gold, aluminum, or any combination thereof.

[0197] According to some exemplary embodiments, electricity is conducted from pad 1210 to the proximal electrode through adhesive 1212, as shown, for example, in FIG 12A. In some embodiments, PCB 1206 comprises a flexible region, for example flexible strip 1214, comprising electrical traces. In some embodiments, flexible strip 1214 electrically connects distal electrode 1204 to electrical traces of PCB 1206.

[0198] According to some exemplary embodiments, similar to Fig. 12A, electricity is delivered from pad 1210 to proximal electrode 1206 via adhesive 1212, as shown in Fig. 12B for example. In some embodiments, the PCB has a second pad 1216 that is electrically coupled to distal electrode 1204 via wire bonding 1218, for example with silver or gold or aluminum wire.

[0199] According to some exemplary embodiments, as shown, for example, in FIG. 12C , a first electrode 1220 of the PCB 1202 is electrically connected to the PCB 1206 by a first flexible region, e.g., a first flexible strip 1222. In some embodiments, the first flexible strip is optionally coupled to the first electrode 1220 by soldering. In some embodiments, a second electrode 1224 of the PCB 1202 is electrically connected to the PCB 1206 by a second flexible region, e.g., a second flexible strip 1226.

[0200] According to some exemplary embodiments, for example as shown in Figure 12D, a first electrode of the PZT 1202 is electrically connected to a first pad 1230 via an adhesive. Additionally, a second electrode 1232 of the PZT 1202 is electrically connected to a second pad 1234 of the PCB 1206 via a separate region of adhesive 1212.

[0201] 12E and 12F provide further examples of electrical connections between a conductive pad 1250 of the PCB 1248 and at least one electrode 1252 of the piezoelectric element. In some embodiments, at A, the conductive pad 1250 is electrically coupled to the electrode 1252 by wire bonding, for example using gold wire. Alternatively or additionally, at B, the conductive pad 1250 is electrically coupled to the electrode 1252 by welding, for example gap welding. In some embodiments, the gap welding is performed using at least one silver strip.

[0202] Exemplary Electrical Insulation of PCB Connectors Reference is now made to Figures 13A-13C, which illustrate selective isolation of electrical connectors on a PCB, according to some exemplary embodiments of the present invention.

[0203] 13A, a rigid region 1302 of a PCB, e.g., an applicator PCB, is coupled and electrically connected to a second rigid region 1304 of a PCB, e.g., an energy transmitter PCB, via a flexible region 1306. In some embodiments, electrical traces in the flexible region 1306 electrically interconnect traces of the applicator PCB 1302, optionally with at least one electrical connector 1308, and traces of the energy transmitter PCB 1304. In some embodiments, the at least one connector 1308 is electrically connectable to an electric braid 1310, which is electrically connectable to a control unit of the applicator.

[0204] According to some demonstrative embodiments, the at least one connector 1308 is surrounded by a barrier 1312 that defines an insulating region 1314 that includes the at least one connector 1308. In some embodiments, the barrier 1312 is configured to trap the insulating material within the confines of the insulating region 1314. In some embodiments, the insulating material comprises a self-hardening material, such as a gel.

[0205] Exemplary Applicators According to some exemplary embodiments, an insulating material 1320 is disposed within the barrier 1312, as shown, for example, in FIG. 14C.

[0206] Reference is now made to Figures 14A-14C, which show an applicator, according to some exemplary embodiments of the present invention.

[0207] According to some exemplary embodiments, the applicator 1402 has at least one energy transmitter, e.g., ultrasonic transducers 1404 and 1406, mounted on a surface 1408 of a PCB 1410. In some embodiments, the applicator 1402 includes at least one cooling element coupled to the PCB 1410 via a surface 1412 that is different from the surface 1408 on which the transducers 1404 and 1406 are mounted.

[0208] According to some exemplary embodiments, the at least one cooling element has at least one cooling channel 1414 passing through the PCB 1410 and is operatively coupled to at least one pump 1416, for example, via at least one inlet channel 1418 and / or at least one outlet channel 1420. In some embodiments, the at least one pump 1416 is configured to circulate a cooling fluid through the cooling channel 1414 to cool, for example, the ultrasonic transducers 1404 and 1406 and / or tissue in direct contact with the surface 1408 or indirectly through at least one insulating layer. In some embodiments, the PCB 1410 has at least one thermally conductive region 1422 between each or at least some of the ultrasonic transducers 1404 and 1406 and the cooling channel 1414.

[0209] According to some exemplary embodiments, the applicator includes multiple energy transmission subassemblies, as shown, for example, in FIG. 14B.

[0210] According to some exemplary embodiments, each energy transmission subassembly, for example subassembly 1424, includes a PCB 1410 having transducers 1404 and 1406 and cooling channels, for example as shown in FIG. 14A.

[0211] According to some exemplary embodiments, the applicator 1430 has a plurality of unit subassemblies 1424 juxtaposed adjacent a skin contacting surface of the applicator 1430 that is positioned against and / or in contact with tissue. In some embodiments, the plurality of subassemblies are coupled to at least one central cooling element of the applicator (e.g., a pump 1432 configured to circulate a cooling fluid through each assembly 1424 of the plurality of assemblies). Additionally or alternatively, each assembly is air-cooled using at least one fan.

[0212] According to some exemplary embodiments, the number of subassemblies and / or the arrangement of the subassemblies within the applicator is determined according to a particular cosmetic or therapeutic application. Alternatively or additionally, the number of subassemblies and / or the arrangement of the subassemblies within the applicator is determined according to the type of tissue and / or tissue anatomy being treated.

[0213] Multi-energy PCB According to some exemplary embodiments, the energy emitting assembly has a PCB with at least two types of energy transmitters coupled to the PCB surface. A potential advantage of having more than one type of energy transmitter may be to enable a wider range of treatment by treating different types of tissue and / or different depths within tissue with different types of energy transmitters, respectively. Reference is now made to FIG. 15, which illustrates an energy emitting assembly with different types of energy transmitters, according to some exemplary embodiments of the present invention.

[0214] According to some exemplary embodiments, the assembly 1502 includes a PCB having a first surface 1506 and a second surface 1508. In some embodiments, the assembly includes at least two types of energy transmitters, such as a piezoelectric element 1510, an RF electrode 1512, and / or a laser diode 1514, coupled to the first surface 1506. In some embodiments, the second surface 1508 is coupled to a cooling element 1516, for example, as previously described in FIG. 1 and other figures of the application.

[0215] Example PCB Routing Reference is now made to Figures 16A-16F, which show different layers of a PCB, according to some exemplary embodiments of the present invention. In some embodiments, for example as shown in Figures 16A-16F, the PCB is formed of several layers. Each figure represents a different layer of the PCB. The figures are ordered from the layer of the PCB that is the most distal layer facing the skin surface (Figure 16A) to the most proximal layer that is closer to the cooling element (Figure 16F).

[0216] According to some exemplary embodiments, each cavity, e.g., cavity 1602, has a polygonal cross-section. Alternatively, the cavity has an elliptical or circular cross-section. In some embodiments, cavity 1602 has a rectangular, e.g., rectangular, cross-section having dimensions of at least about 2 mm by about 1 mm, e.g., about 4 mm by about 2 mm, about 5 mm by about 2 mm, about 6 mm by about 2 mm, or any intermediate, smaller, or larger dimensions.

[0217] According to some exemplary embodiments, the layer has copper, gold, silver, gold coated copper, or carbon fiber at the planned location of the cavity 1602, as shown in Figure 16F. In some embodiments, the electrical traces 1604 in the layer shown in Figure 16B are formed from a conductive material, such as copper.

[0218] As used herein, "about" in reference to an amount or value means "within ±10% of."

[0219] The words "comprises," "comprising," "includes," "including," "has," "having" and their conjugations mean "including but not limited to."

[0220] The term "consisting of" means "including and limited to."

[0221] The term "consisting essentially of" means that a composition, method, or structure may include additional components, steps, and / or moieties, provided that the additional components, steps, and / or moieties are Only if the basic and novel characteristics of the claimed composition, method, or structure are not materially altered.

[0222] As used herein, the singular forms "a," "an," and "the" include plural referents unless the context clearly dictates otherwise. For example, "a compound" or "at least one compound" includes a plurality of compounds, and may also include mixtures thereof.

[0223] Throughout this application, various embodiments of the invention may be presented in a range format. It should be understood that the description in range format is merely for convenience and brevity, and is not an inflexible limitation of the scope of the invention. Thus, the description of a range should be considered to specifically disclose all of the possible subranges, as well as each individual numerical value within that range. For example, the description of a range such as 1 to 6 is intended to specifically disclose not only the subranges 1 to 3, 1 to 4, 1 to 5, 2 to 4, 2 to 6, 3 to 6, etc., but also each individual numerical value within that range, e.g., 1, 2, 3, 4, 5, and 6. This applies regardless of the magnitude of the range.

[0224] Whenever a numerical range is given herein (e.g., any pair of numbers joined by "10-15," "10 to 15," or other similar range designation), it is meant to include any number (fractional or integer) within the range limits indicated, including the range limits, unless the context clearly indicates otherwise. The phrases "range between" a first indicated number and a second indicated number, and "range to," "range to," or "range including" a first indicated number "to" a second indicated number (or other similar range designation terminology) are used interchangeably herein and are meant to include the first and second indicated numbers, and all fractional and integer numbers therebetween.

[0225] Unless otherwise indicated, numbers used herein, and any numerical ranges based thereon, are approximations within the accuracy of reasonable measurement and rounding errors, as will be understood by one of ordinary skill in the art.

[0226] It will be understood that certain features of the invention that are, for clarity, described in the context of separate embodiments, may also be provided in a single embodiment in any combination of those features. Conversely, several features of the invention that are, for brevity, described in the context of a single embodiment, may also be provided separately or in any suitable subcombination or with respect to other described embodiments as appropriate. Certain features described in the context of various embodiments should not be construed as essential to that embodiment, unless the particular embodiment is inoperable without that element.

[0227] While the present invention has been described in conjunction with specific embodiments thereof, many alternatives, modifications, and variations will be apparent to those skilled in the art. Accordingly, it is intended to embrace all such alternatives, modifications, and variations that fall within the spirit and broad scope of the appended claims.

[0228] All publications, patents, and patent applications mentioned in this specification are incorporated herein by reference in their entirety to the same extent as if each individual publication, patent, and patent application was specifically and individually incorporated herein by reference. In addition, citation or identification of any reference in this application should not be construed as an admission that such reference is available as prior art to the present invention. Nor should it be necessarily construed as limiting, to the extent that section headings are used.

[0229] Additionally, any priority document to this application, if any, is incorporated herein by reference in its entirety.

Claims

1. A plurality of ultrasonic transducers; a thin circuit board having a thickness of up to 3 mm, the thin circuit board having a first surface and a second surface, the plurality of ultrasonic transducers being mounted on the first surface; The thin circuit board comprises: electrical wiring in or on the thin circuit board coupled to each of the plurality of ultrasonic transducers; a plurality of thermally conductive regions within the low profile circuit board positioned between the first surface and the second surface for selectively increasing thermal conductivity through the low profile circuit board, at least some of the thermally conductive regions being at least partially filled with a thermally conductive material; An assembly unit comprising:

2. The assembly unit described in claim 1, wherein the thin circuit board is formed from a plurality of layers, and at least one of the plurality of thermal conduction areas penetrates a majority of the plurality of layers.

3. An assembly unit as described in any one of claims 1 to 2, wherein each of the plurality of thermal conduction regions extends along at least 50% of a thickness of the thin circuit board.

4. An assembly unit described in any one of claims 1 to 3, wherein at least one of the plurality of thermal conduction regions is aligned with at least one ultrasonic transducer of the plurality of ultrasonic transducers.

5. An assembly unit as described in any one of claims 1 to 3, wherein each of the plurality of thermally conductive regions is aligned with at least one ultrasonic transducer of the plurality of ultrasonic transducers mounted on the first surface and positioned to selectively increase thermal conductivity from the at least one ultrasonic transducer through the thin circuit board.

6. An assembly unit as described in any one of claims 1 to 5, wherein at least some of the plurality of thermally conductive regions include an implant of the thermally conductive material introduced into an opening in the thin circuit board.

7. An assembly unit as described in any one of claims 1 to 6, wherein each of the plurality of thermally conductive regions within the circuit board is aligned and extends toward a single ultrasonic transducer of the plurality of ultrasonic transducers on the first surface.

8. An assembly unit as described in any one of claims 1 to 7, wherein the thermally conductive material comprises at least one of copper, gold, silver, silver epoxy, and gold epoxy.

9. An assembly unit as described in any one of claims 1 to 8, wherein the multiple thermal conduction regions and / or the second surface are configured to be coupled to a cooling element.

10. An assembly unit as described in claim 9, wherein the plurality of thermally conductive regions include a plurality of cavities extending from the second surface through the thin circuit board toward the plurality of ultrasonic transducers, each of the plurality of cavities having a shape and size to receive a portion of the cooling element.

11. An assembly unit as described in claim 10, comprising the cooling element, the cooling element comprising a thermally conductive base holder having at least one extension portion having a shape and size to penetrate into at least one cavity of the plurality of cavities when the thin circuit board is coupled to the cooling element.

12. An assembly unit as described in claim 11, wherein the thermally conductive base holder has a plurality of finger-shaped extensions, each of the plurality of extensions having a shape and size to penetrate into a cavity of the plurality of cavities.

13. The assembly unit of claim 12, wherein each of the plurality of cavities includes a thermally conductive filler configured to fill a gap between each extension portion and the thin circuit board.

14. An assembly unit as described in any one of claims 10 to 13, wherein the plurality of cavities have channels configured to circulate cooling fluid from the cooling element within the thin circuit board.

15. An assembly unit described in any one of claims 1 to 14, comprising at least one temperature sensor mounted on the first surface between two ultrasonic transducers of the plurality of ultrasonic transducers.

16. The assembly unit described in claim 15, wherein the thin circuit board has at least one thermally insulating area positioned within the circuit board between at least two of the plurality of thermally conductive areas and aligned with the at least one temperature sensor.

17. The assembly unit described in claim 16, wherein at least one thermally insulating region comprises an opening filled with thermally insulating material or an implant of thermally insulating material.

18. The assembly unit of claim 17, wherein the thermal insulation material comprises at least one of air, gas, fiberglass, and gas-filled silica particles.

19. The assembly unit described in claim 15, wherein the thin circuit board has thermal insulation regions within the thin circuit board and between the plurality of thermally conductive regions.

20. An assembly unit as described in claim 19, wherein the thermally insulating area has an opening filled with thermally insulating material or an implant of thermally insulating material.

21. An assembly unit as described in any one of claims 1 to 20, wherein the circuit board includes a conductive pad on the first surface for each of the plurality of ultrasonic transducers, and each of the plurality of ultrasonic transducers is coupled to the conductive pad via a conductive adhesive.

22. The assembly unit described in claim 21, wherein the conductive adhesive comprises a plurality of conductive particles in a non-conductive adhesive matrix.

23. An assembly unit described in any one of claims 1 to 22, wherein the plurality of ultrasonic transducers are thin-type ultrasonic transducers arranged as an array on the first surface of the thin-type circuit board.

24. An assembly unit as described in any one of claims 1 to 23, wherein the thin circuit board is a rigid, thin printed circuit board (PCB) formed from multiple layers, and the first surface and / or the second surface are flat.

25. An assembly unit described in any one of claims 1 to 24, wherein the multiple ultrasonic transducers are configured to supply unfocused ultrasonic energy.

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