Intelligent pattern recognition system for wire bonding and other electronic packaging machines and related methods - Patents.com

Abstract

[Solution] A method of operating a pattern recognition system of an electronic device packaging machine is provided, the method including the steps of: (a) imaging a portion of a workpiece on an electronic device packaging machine using an image acquisition recipe, (b) determining whether an acceptable level of matching occurs using a pattern recognition recipe associated with the image from step (a), and (c) automatically modifying at least one parameter of at least one of (i) the image acquisition recipe and (ii) the pattern recognition recipe if step (b) does not result in the acceptable level of matching.

Description

[Technical field]

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This application claims the benefit of U.S. Provisional Application No. 63 / 138,377, filed January 15, 2021, the contents of which are incorporated herein by reference.

[0002] The present invention relates to intelligent pattern recognition systems and methods for electronic packaging machines, and more particularly to an improved pattern recognition system and method for wire bonding. [Background technology]

[0003] Various equipment is used in the processing and packaging of semiconductor devices or other devices. For example, a traditional method for semiconductor packaging includes a die attach process (e.g., on a die bonding machine, also known as a die attach machine), followed by a wire bonding process (e.g., on a wire bonding machine, such as a wedge bonder or ball bonder). In other examples, advanced packaging equipment (e.g., thermocompression bonding machines, flip chip bonding machines, etc.) may be used.

[0004] Pattern recognition systems are commonly used in connection with such equipment. For example, a pattern recognition system may be used to ensure proper placement prior to attaching a die to a substrate in a die attach process. Similarly, a pattern recognition system may be used to ensure that a wire bond is properly placed prior to forming a wire bond in a wire bonding process. An exemplary pattern recognition system uses an imaging system (where the exemplary imaging system is or includes a camera) and computer image processing software.

[0005] Unfortunately, conventional pattern recognition systems and methods are inefficient and cumbersome, and often, when an acceptable level of matching does not occur in conjunction with a pattern recognition system, operation of the underlying electronic component packaging system is halted to allow an operator to make adjustments.

[0006] It would therefore be desirable to provide improved pattern recognition systems and methods. Summary of the Invention [Means for solving the problem]

[0007] According to an exemplary embodiment of the present invention, a method of operating a pattern recognition system of an electronic device packaging machine is provided, the method including: (a) imaging a portion of a workpiece on an electronic device packaging machine using an image acquisition recipe, (b) determining whether an acceptable level of matching occurs using a pattern recognition recipe associated with the image from step (a), and (c) automatically modifying at least one parameter of at least one of (i) the image acquisition recipe and (ii) the pattern recognition recipe if step (b) does not result in the acceptable level of matching.

[0008] According to another exemplary embodiment of the present invention, there is provided a pattern recognition system for an electronic device packaging machine, the pattern recognition system including an imaging system configured to image a portion of a workpiece on an electronic device packaging machine using an image acquisition recipe, a control system configured to control the imaging system, and a computer configured to determine whether an acceptable level of matching occurs using a pattern recognition recipe associated with an image from the imaging system, the computer altering at least one parameter of at least one of (i) the image acquisition recipe and (ii) the pattern recognition recipe if the acceptable level of matching does not occur in association with the pattern recognition recipe by the computer.

[0009] According to yet another exemplary embodiment of the present invention, there is provided a wire bonding system including a support structure for supporting a workpiece during a wire bonding operation, a bond head assembly for carrying a wire bonding tool, and a pattern recognition system including an imaging system for imaging a portion of the workpiece using an image acquisition recipe, a control system for controlling the imaging system, and a computer configured to determine whether an acceptable level of matching occurs using a pattern recognition recipe associated with an image from the imaging system, the computer altering at least one parameter of at least one of (a) the image acquisition recipe and (b) the pattern recognition recipe if an acceptable level of matching does not occur associated with the pattern recognition recipe by the computer.

[0010] In accordance with yet another exemplary embodiment of the present invention, there is provided a method of operating a pattern recognition system of an electronic device packaging machine, the method including the steps of (a) imaging a portion of a workpiece on an electronic device packaging machine using an image acquisition recipe, and (b) determining whether an acceptable level of matching occurs using a pattern recognition recipe associated with the image from step (a), wherein each of the image acquisition recipe and the pattern recognition recipe is one of a plurality of recipes stored in a memory associated with the electronic device packaging machine. [Brief description of the drawings]

[0011] The invention is best understood from the following detailed description when read in conjunction with the accompanying drawings. According to common practice, the various features of the drawings are not drawn to scale. Rather, dimensions of the various features have been arbitrarily expanded or reduced for clarity. The drawings include the following figures: [Figure 1] FIG. 1 is a side view of a block diagram of an electronic component packaging system in an exemplary embodiment of the invention. [Diagram 2] FIG. 2 is a side view of a block diagram of a wire bonding apparatus in an exemplary embodiment of the invention. [Figure 3A-3C] 3A-3C are overhead block diagrams of field images of fiducial marks on a workpiece useful for explaining various exemplary embodiments of the present invention. [Figure 4] 4-6 are flow charts illustrating various methods of operation of the pattern recognition system of the electronic device packaging machine in various exemplary embodiments. [Diagram 5] 4-6 are flow charts illustrating various methods of operation of the pattern recognition system of the electronic device packaging machine in various exemplary embodiments. [Figure 6] 4-6 are flow charts illustrating various methods of operation of the pattern recognition system of the electronic device packaging machine in various exemplary embodiments. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] According to certain exemplary embodiments of the present invention, a smart device visual pattern recognition system (e.g., a pattern recognition system of an electronic device packaging machine) and method (e.g., a method of operating a pattern recognition system of an electronic device packaging machine) are provided. Such smart device visual pattern recognition system and method can change settings (e.g., parameters) within predefined ranges. That is, to reduce downtime due to failure of visual pattern recognition of the device, the visual settings of the device (e.g., parameters of an image acquisition recipe, parameters of a pattern recognition recipe, etc.) are automatically changed within predefined ranges to increase the recognition success rate.

[0013] More specifically, in certain exemplary embodiments of the present invention, when a previous pattern recognition recipe (and / or image acquisition recipe) fails in an attempt to increase the success rate of pattern recognition, multiple parameters (e.g., light brightness, image pre-processing including filters, camera image acquisition settings, etc.) are automatically adjusted within predefined limits in an attempt to do so.

[0014] If the parameter adjustment results in an improved success rate of pattern recognition (e.g., an acceptable level of matching, a pass mark, etc.), then the adjusted parameter sequence (e.g., a new recipe, or the adjusted / "new" recipe, etc.) can be used as a starting point for the next pattern matching operation of the same type (or as an alternative sequence of parameters for future use). If the adjusted sequence is not successful in pattern recognition, then an operator may need to manually assist in the parameter adjustment (e.g., a manually adjusted recipe), in which case the manually adjusted recipe may be used as a starting point for the next pattern matching operation of the same type (or as an alternative sequence of parameters for future use).

[0015] According to certain exemplary embodiments of the present invention, statistics associated with successful and unsuccessful parameter sets (e.g., recipes) may be recorded for future use (e.g., evaluation and optimization using machine learning algorithms).The pattern recognition system includes (i) imaging hardware (cameras, optics, lighting, filters, lenses, mirrors, etc.) and (ii) image processing software for performing pattern recognition.

[0016] According to aspects of the present invention, a recipe (e.g., image acquisition recipe, pattern recognition recipe, etc.) includes imaging variables / parameters, which may include (i) parameters related to the imaging system (e.g., parameters related to light, exposure, intensity, focus, etc.) and (ii) image processing parameters (e.g., parameters related to pattern matching, software adjustments such as suppression and pre-processing parameters, etc.).

[0017] According to aspects of the present invention, an acceptable level of matching will be understood by one of ordinary skill in the art. For example, an acceptable level of matching may be determined by comparing (a) a pattern in an acquired image (e.g., captured by an imaging system) with (b) a reference pattern (e.g., a reference pattern in a previously taught image, a pattern in a reference image, a pattern in a synthetic image, etc.). Other exemplary aspects of detecting whether an acceptable level of matching occurs include using a score (e.g., a pass score, a fail score, etc.), a threshold, etc.

[0018] Once an acceptable level of matching occurs (e.g., relative to one or more fiducial marks on the workpiece), operations can proceed on a given electronic device packaging machine. For example, on a die attach machine, an acceptable level of matching can allow one or more semiconductor dies to be attached to a workpiece. In another example, on a wire bonding machine, an acceptable level of matching can allow one or more wire loops to be bonded to a workpiece.

[0019] As will be appreciated by those skilled in the art, an acceptable level of matching may not occur for a variety of reasons. For example, the image provided by the imaging system may not be recognizable using an existing image acquisition recipe and / or an existing pattern recognition recipe. Varying one or more parameters (of one or both recipes) in conjunction with the iterative process may result in an acceptable level of matching.

[0020] As used herein, the term "image acquisition recipe" refers to a plurality of parameters / settings associated with (and / or used in connection with) an image acquisition process and / or an imaging system for acquiring an image. Examples of said plurality of parameters / settings associated with an image acquisition process and / or an imaging system include: (i) one or more illumination parameters of the imaging system (e.g., illumination brightness, exposure time, camera gain, light color, etc.), (ii) one or more optical parameters of the imaging system, (iii) one or more positional parameters of the imaging system, and (iv) one or more component parameters associated with the imaging system.

[0021] As used herein, the term "pattern recognition recipe" refers to a number of parameters / settings used in connection with a pattern recognition process, including image processing parameters, such as at least one of image filtering parameters, image resolution parameters, parameters related to pattern matching, and parameters related to determining a matching level.

[0022] Referring now to the drawings, FIG. 1 illustrates an electronics packaging machine 100 (e.g., semiconductor packaging machine, die attach machine, wire bonding machine, thermocompression bonding machine, flip chip bonding machine, pick and place machine, laser welding machine, etc.). The electronics packaging machine 100 includes an overhead assembly 106 (e.g., a bond head assembly), a pattern recognition system 102, and a support structure 114 (shown supporting a workpiece 116). The pattern recognition system 102 includes an imaging system 108 for imaging a portion of the workpiece 116 using an image acquisition recipe, a control system 110 for controlling the imaging system 108, and a computer 112 configured to determine whether an acceptable level of matching occurs using a pattern recognition recipe associated with an image from the imaging system 108.

[0023] 2 illustrates a wire bonding apparatus 200. The wire bonding apparatus 200 includes a bond head assembly 206, a wire bonding tool 218, a support structure 214 (shown supporting a workpiece 216), and a pattern recognition system 202. The pattern recognition system 202 includes an imaging system 208 (for imaging a portion of the workpiece 216 using an image acquisition recipe), a control system 210 (for controlling the imaging system 208), and a computer 212 (configured to determine whether an acceptable level of matching occurs using a pattern recognition recipe associated with an image from the imaging system 208). The imaging system 208 is shown sending light 208a to a portion of the workpiece 216 in association with an imaging step using the image acquisition recipe (see, e.g., steps 402, 502, or 602 of FIG. 4, FIG. 5, or FIG. 6). When a portion of the workpiece 216 is imaged, a reference image (e.g., reference images 322a, 322b, 322c of Figures 3A, 3B, and 3C) is detected and used to determine whether an acceptable level of matching occurs before continuing operation of the wire bonding apparatus.

[0024] 3A-3C, reference images of various illumination exposures are shown. FIG. 3A shows that reference image 322a in field of view 320a is "overexposed" (i.e., too brightly lit). FIG. 3B shows reference image 322b in field of view 320b with an acceptable level of exposure / illumination. FIG. 3C shows that reference image 322c in field of view 320c is "underexposed" (i.e., too dimly lit).

[0025] 4-6 are flow diagrams illustrating various methods of operation of the pattern recognition system of the electronic device packaging machine. As will be appreciated by those skilled in the art, certain steps included in the flow diagrams may be omitted, certain additional steps may be added, and the order of steps may be changed from the order shown, all within the scope of the present invention.

[0026] 4, in step 400, an imaging system (see, e.g., imaging system 108 in FIG. 1, imaging system 208 in FIG. 2) is moved to a position to image a portion of a workpiece (see, e.g., workpiece 116 in FIG. 1, workpiece 216 in FIG. 2). In step 402, a portion of the workpiece on an electronic device packaging machine (e.g., fiducial markings on the workpiece) is imaged using an image acquisition recipe. In step 404, a pattern recognition recipe associated with the image from step 402 is used to determine whether an acceptable level of matching occurs. In step 406, a determination is made as to whether the level of matching is acceptable. If the level of matching is acceptable, operation continues (e.g., automatic mode) in step 408. If the level of matching is not acceptable, a determination is made as to whether a maximum number of operations has been attempted in step 410. If the maximum number of operations has been attempted, automatic mode is stopped in step 412 (e.g., operator intervention). If the maximum number of operations has not been attempted, then in step 414, the parameters of the image acquisition recipe and / or the pattern recognition recipe are modified (e.g., the parameters are modified within the ranges provided in the given recipe). Steps 402 and 404 are then repeated with the modified parameters. In the repetition, step 406, a determination is made as to whether the level of matching is acceptable. If the level of matching is acceptable, then in step 416, the new image acquisition recipe and / or the new pattern recognition recipe is stored in memory (and can be used as a new starting recipe for the device), after which operation continues in step 408 (e.g., automatic mode). If the matching is not acceptable, then in step 410, it is determined whether the maximum number of operations has been attempted. Then, steps 414, 402, 404, 406, and 410 are repeated until step 406 or 410 is satisfied.

[0027] 5, in step 500, an imaging system (see, e.g., imaging system 108 in FIG. 1, imaging system 208 in FIG. 2) is moved to a position to image a portion of a workpiece (see, e.g., workpiece 116 in FIG. 1, workpiece 216 in FIG. 2). In step 502, a portion of the workpiece (e.g., fiducial markings on the workpiece) on an electronic device packaging machine is imaged using an image acquisition recipe (or other image acquisition recipe) from a recipe library. For example, a recipe library may include multiple image acquisition recipes and / or multiple pattern recognition recipes. The initial image acquisition recipe used in step 502 (and the initial pattern recognition recipe used in step 504) may be selected based on some prioritization criteria. For example, in step 504, a recipe that is more likely to result in an acceptable level of matching (e.g., based on past experience) may be prioritized over other recipes in the recipe library.

[0028] At step 504, a pattern recognition recipe (or other pattern recognition recipe) from the recipe library is used in conjunction with the image from step 502 to determine whether an acceptable level of matching occurs. At step 506, a determination is made as to whether the level of matching is acceptable. If the level of matching is acceptable, operations continue (e.g., automatic mode) at step 508. If the level of matching is not acceptable, a determination is made as to whether a maximum number of operations have been attempted at step 510. If the maximum number of operations have been attempted, automatic mode is stopped (e.g., operator intervention) at step 512. If the maximum number of operations have not been attempted, at least one of another image acquisition recipe and another pattern recognition recipe is selected from the recipe library at step 514. The other recipe (e.g., another image acquisition recipe and / or another pattern recognition recipe) may be selected at step 514 based on some prioritization criteria. For example, recipes that are more likely to result in an acceptable level of matching (e.g., based on past experience) may be prioritized over other recipes in the recipe library.

[0029] After the other recipe is selected in step 514, steps 502 and 504 are repeated using at least one of another image acquisition recipe and another pattern recognition recipe from the recipe library. In the repetition, step 506, a determination is made as to whether the level of matching is acceptable. If the level of matching is acceptable, operation continues (e.g., automatic mode) in step 508. If the level of matching is not acceptable, then in step 510 it is determined whether a maximum number of operations have been attempted. Steps 514, 502, 504, 506, and 510 are then repeated until step 506 or 510 is satisfied.

[0030] 6, in step 600, an imaging system (see, e.g., imaging system 108 in FIG. 1, imaging system 208 in FIG. 2) is moved to a position to image a portion of a workpiece (see, e.g., workpiece 116 in FIG. 1, workpiece 216 in FIG. 2). In step 602, an image acquisition recipe (or other image acquisition recipe) from a recipe library is used to image a portion of the workpiece (e.g., fiducial markings on the workpiece) on an electronic device packaging machine. In step 604, a pattern recognition recipe (or other pattern recognition recipe) from a recipe library is used in conjunction with the image from step 602 to determine whether an acceptable level of matching occurs. In step 606, a determination is made as to whether the level of matching is acceptable. If the level of matching is acceptable, then operation continues (e.g., automatic mode) in step 608. If the level of matching is not acceptable, then in step 610, it is determined whether a maximum number of operations have been attempted. If the maximum number of operations have been attempted, the automatic mode is stopped (e.g., operator intervention) at step 612. If the maximum number of operations have not been attempted, a determination is made at step 614 as to change parameters and / or select another recipe. This determination may be made using software (e.g., an intelligent algorithm). For example, after a certain number of recipes from a recipe library have been attempted, one or more parameters of the recipe may be changed. In another example, after one or more parameters of an existing recipe are changed, a different recipe may be selected from a recipe library.

[0031] Additionally, additional considerations may be made in relation to the decision whether to change parameters and / or select other recipes. Historical data (e.g., in the form of histograms, etc.) may be used to prioritize different recipes based on the past pass rates (e.g., acceptable levels of matching) of a particular piece of equipment (e.g., a particular wire bonder). For example, recipes with the highest pass rates may be prioritized first. The user may be provided with options as to whether to (i) change parameters of the current recipe, (ii) select other recipes, (iii) try all recipes in the library first before changing one of the recipes, etc. In other examples, the decision as to whether to change an existing recipe (by changing one or more parameters) or try a new recipe from the library may be made by calculating the amount (e.g., score) of the level of failed matching. If the amount / score is within a predefined tolerance, a small change in the parameters (e.g., image acquisition parameters, pattern recognition parameters, etc.) may be used, whereas if the amount / score is not within a predefined tolerance, a new recipe from the library may be used.

[0032] If another recipe is selected, at step 616, at least one of another image acquisition recipe and another pattern recognition recipe is selected from the recipe library. If it is determined that the parameters should be changed, at step 618, the parameters of at least one of the image acquisition recipe and the pattern recognition recipe are changed (e.g., the parameters are changed within the ranges provided in the given recipe). Steps 602 and 604 are then repeated with the changed parameters and / or the other recipe. At step 606 of the repetition, a determination is made as to whether the level of matching is acceptable. If the level of matching is acceptable, at step 620, the new image acquisition recipe and / or the new pattern recognition recipe (if applicable) is stored in memory (and can be used as a new starting recipe for the device). If the level of matching is not acceptable, at step 610, it is determined whether the maximum number of operations has been attempted. Steps 614, 602, 604, 606 and 610 are then repeated until step 606 or 610 is satisfied.

[0033] Although the invention has been illustrated and described herein with reference to specific embodiments, it is not intended that the invention be limited to the details shown, but rather that various modifications may be made in the details within the scope of the appended claims and the equivalents thereto without departing from the invention.

Claims

1. 1. A method of operating a pattern recognition system of an electronic device packaging machine, comprising: (a) imaging a portion of a workpiece on an electronic device packaging machine using an image acquisition recipe; (b) using a pattern recognition recipe associated with the image from step (a) to determine whether an acceptable level of matching occurs; (c) if step (b) does not result in said acceptable level of matching, automatically modifying at least one parameter of at least one of (i) said image acquisition recipe and (ii) said pattern recognition recipe; The method according to claim 1,

2. The method of claim 1 , wherein the electronic device packaging equipment is a semiconductor packaging equipment.

3. 3. The method of claim 2, wherein the semiconductor packaging equipment is selected from the group consisting of a wire bonding equipment, a die attach equipment, a thermocompression bonding equipment, a flip chip bonding equipment, and a laser welding equipment.

4. The method of claim 2 , wherein the semiconductor packaging equipment is a wire bonding equipment.

5. The method of claim 1 , wherein the portion of the workpiece includes a fiducial mark of the workpiece.

6. The method of claim 1 , wherein the pattern recognition system includes an imaging system, a control system for controlling the imaging system, and a computer.

7. The method of claim 6 , wherein the image acquisition recipe includes a plurality of parameters related to the imaging system.

8. 8. The method of claim 7, wherein the plurality of parameters associated with the imaging system include at least one of: (i) one or more illumination parameters for the imaging system, (ii) one or more optical parameters for the imaging system, (iii) one or more positional parameters for the imaging system, and (iv) one or more component parameters associated with the imaging system.

9. 9. The method of claim 8, wherein the one or more lighting parameters include at least one of lighting brightness, exposure time, camera gain, and light color.

10. 7. The method of claim 6, wherein the pattern recognition recipe includes a plurality of image processing parameters used in connection with step (b).

11. 11. The method of claim 10, wherein the plurality of image processing parameters includes at least one of image filtering parameters, image resolution parameters, parameters related to pattern matching, and parameters related to determining a level of matching in step (b).

12. The method of claim 1 , wherein the alteration of the at least one parameter in step (c) results in at least one of: (i) a new image acquisition recipe; and (ii) a new pattern recognition recipe.

13. 2. The method of claim 1, wherein after step (c), steps (a) and (b) are repeated using at least one of a new image acquisition recipe and a new pattern recognition recipe that includes the at least one parameter changed in step (c).

14. 14. The method of claim 13, wherein if the repeated step (b) results in an acceptable level of matching, at least one of the new image acquisition recipe and the new pattern recognition recipe is stored in memory.

15. 2. The method of claim 1, wherein steps (a)-(c) are repeated until step (b) provides an acceptable level of matching.

16. 10. The method of claim 1, wherein the pattern recognition recipe and the image acquisition recipe are contained in a library, the library comprising a plurality of recipes stored in a memory associated with an electronic device packaging machine.

17. 17. The method of claim 16, wherein if an acceptable level of matching does not occur based on step (b), another recipe of the plurality of recipes stored in memory is selected, and steps (a) and (b) are repeated with the other recipe of the plurality of recipes prior to step (c).

18. 1. A pattern recognition system for an electronic device packaging machine, comprising: an imaging system for imaging a portion of a workpiece on an electronic device packaging machine using an image acquisition recipe; a control system for controlling the imaging system; a computer configured to determine whether an acceptable level of matching occurs using a pattern recognition recipe associated with an image from the imaging system, and if an acceptable level of matching does not occur in association with the pattern recognition recipe, altering at least one parameter of at least one of (i) the image acquisition recipe and (ii) the pattern recognition recipe; A pattern recognition system having

19. 20. The pattern recognition system of claim 18, wherein the electronic device packaging equipment is a semiconductor packaging equipment.

20. 20. The pattern recognition system of claim 19, wherein the semiconductor packaging equipment is selected from the group consisting of a wire bonding equipment, a die attach equipment, a thermo-compression bonding equipment, and a flip chip bonding equipment.

21. 20. The pattern recognition system of claim 19, wherein the semiconductor packaging machine is a wire bonding machine.

22. 20. The pattern recognition system of claim 18, wherein the portion of the workpiece includes a fiducial marking of the workpiece.

23. 20. The pattern recognition system of claim 18, wherein the image acquisition recipe includes a plurality of parameters related to the imaging system.

24. 24. The pattern recognition system of claim 23, wherein the plurality of parameters associated with the imaging system include at least one of: (i) one or more illumination parameters for the imaging system, (ii) one or more optical parameters for the imaging system, (iii) one or more positional parameters for the imaging system, and (iv) one or more component parameters associated with the imaging system.

25. 25. The pattern recognition system of claim 24, wherein the one or more lighting parameters include at least one of lighting brightness, exposure time, camera gain, and light color.

26. 20. The pattern recognition system of claim 18, wherein the image acquisition recipe includes a plurality of image processing parameters.

27. 20. The pattern recognition system of claim 18, wherein alteration of the at least one parameter by the computer results in at least one of: (i) a new image acquisition recipe; and (ii) a new pattern recognition recipe.

28. 20. The pattern recognition system of claim 18, wherein imaging of the portion of the workpiece is repeated using at least one of a new pattern recognition recipe and a new image acquisition recipe that includes the at least one changed parameter.

29. 30. The pattern recognition system of claim 28, wherein at least one of the new pattern recognition recipe and the new image acquisition recipe is stored in memory if the computer determines that an acceptable level of matching occurs using at least one of the new pattern recognition recipe and the new image acquisition recipe.

30. 20. The pattern recognition system of claim 18, wherein the imaging of the portion of the workpiece and the use of the pattern recognition recipe by the computer is repeated until the computer determines that an acceptable level of matching occurs.

31. 20. The pattern recognition system of claim 18, wherein at least one of the image acquisition recipe and the pattern recognition recipe is one of a plurality of recipes stored in a memory associated with the pattern recognition system.

32. 32. The pattern recognition system of claim 31 , wherein if an acceptable level of matching does not occur, another recipe from the plurality of recipes stored in memory is selected, and imaging of the imaging portion and the pattern matching by the computer are repeated using the other recipe from the plurality of recipes.

33. 1. A wire bonding system comprising: a support structure for supporting the workpiece during the wire bonding operation; a bond head assembly carrying a wire bonding tool; 1. A pattern recognition system comprising: (i) an imaging system for imaging a portion of the workpiece using an image acquisition recipe; (ii) a control system for controlling the imaging system; and (iii) a computer configured to determine whether an acceptable level of matching occurs using a pattern recognition recipe associated with an image from the imaging system, where the computer alters at least one parameter of at least one of (a) the image acquisition recipe and (b) the pattern recognition recipe if an acceptable level of matching does not occur in association with the pattern recognition recipe; and The pattern recognition system includes: A wire bonding system having:

34. 1. A method of operating a pattern recognition system of an electronic device packaging machine, comprising: (a) imaging a portion of a workpiece on an electronic device packaging machine using an image acquisition recipe; (b) determining whether an acceptable level of matching occurs using a pattern recognition recipe associated with the image from step (a); having The method, wherein each of the image acquisition recipe and the pattern recognition recipe is one of a plurality of recipes stored in a memory associated with the electronic device packaging machine.

35. 35. The method of claim 34, wherein the image acquisition recipe is selected for use in step (a) based on prioritization criteria.

36. 35. The method of claim 34, wherein the plurality of recipes are used in an order based on a prioritization criteria.

37. 35. The method of claim 34, further comprising automatically modifying at least one parameter of at least one of the image acquisition recipe and the pattern recognition recipe if an acceptable level of matching does not occur in step (b).

38. 35. The method of claim 34, wherein if an acceptable level of matching does not occur in step (b), a choice is made between (i) repeating steps (a)-(b) with other recipes in the plurality of recipes, or (ii) automatically modifying at least one parameter of at least one of the image acquisition recipe and the pattern recognition recipe.

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