Switching device

Abstract

The apparatus includes at least one substrate having at least two conductive paths, at least two connectors disposed in a first plane, and a movable stage connected to one of the at least one substrate and configured to move the one substrate perpendicular to the first plane to form a conductive path between two of the at least two connectors.

Description

[Technical field]

[0001] This disclosure claims the benefit of U.S. Provisional Patent Application No. 63 / 172,375, entitled "High Precision, High Bandwidth Switching Attenuator," filed on April 8, 2021, and U.S. Provisional Patent Application No. 63 / 196,381, entitled "High Precision, High Bandwidth Switching Attenuator," filed on June 3, 2021, both of which are incorporated herein in their entireties.

[0002] The present disclosure relates to test and measurement systems, and more particularly to switching attenuators for test and measurement instruments or systems. [Background technology]

[0003] Test and measurement instruments such as oscilloscopes are used in a variety of applications, including testing devices under test (DUTs) that comply with optical Ethernet, wireless and other high speed standards. These applications often require switching dynamic range of these high precision, wide bandwidth measurement instruments. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] US Patent Publication No. 2011 / 0148456 [Patent Document 2] US Patent Publication No. 2010 / 0141363 [Patent Document 3] US Patent Publication No. 2011 / 0148501 Summary of the Invention [Problem to be solved by the invention]

[0005] Traditional measurement equipment requires users to manually install external coaxial terminators and attenuators to change the dynamic range between various steps of the test procedure, but this manual user intervention is inefficient and error prone, making automation of these test procedures very complex.

[0006] Furthermore, the use of such external terminators or attenuators can introduce errors, such as noise and timing distortions, into the signals measured from the DUT. In some cases, such errors can be calibrated out and corrected, but in traditional test systems, applying such corrections is also a manual process.

[0007] Embodiments of the disclosed technology address these and other shortcomings of conventional test systems. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 illustrates one embodiment of a system including a routing switch device. [Diagram 2] FIG. 2 illustrates an embodiment of a router device. [Diagram 3] FIG. 3 shows two views of one embodiment of a contact plate. [Figure 4] FIG. 4 shows a side view of an embodiment of a router device in various positions. [Diagram 5] FIG. 5 shows side views of an embodiment of a router device in various positions. [Figure 6] FIG. 6 shows a side view of an embodiment of a router device in various positions. [Figure 7] FIG. 7 illustrates one embodiment of a coaxial connector. [Figure 8] FIG. 8 shows one embodiment of a router with a movable stage. [Figure 9] FIG. 9 illustrates one embodiment of a routing board having multiple paths. [Figure 10]FIG. 10 shows an embodiment of a router with a printed circuit board. [Figure 11] FIG. 11 illustrates one embodiment of a contact for a connector. [Figure 12] FIG. 12 illustrates one embodiment of a router having a fixed substrate and a movable substrate with an interface structure. [Figure 13] FIG. 13 illustrates one embodiment of a fixed plate component of the router. [Figure 14] FIG. 14 shows one embodiment of a router with a fixed substrate and a movable substrate. [Figure 15] FIG. 15 illustrates one embodiment of a routing board. [Figure 16] FIG. 16 illustrates one embodiment of conductive paths on a routing substrate. [Figure 17] FIG. 17 illustrates one embodiment of conductive paths on a routing substrate. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] One aspect of the present disclosure includes a small geometry switching mechanism for attenuators that provides industry-leading isolation, low insertion loss, and low reflection. Another aspect of the present disclosure includes a method and system for automatically adjusting the response of a test system, for example, to compensate for parasitic effects caused by a particular position of the switching mechanism, by monitoring the state of the switching mechanism and applying compensation based on the particular position of the switching mechanism. According to an embodiment of the present disclosure technology, the testing of DUTs according to various signaling standards can be automated. According to an embodiment of the present disclosure technology, for example, a test system can test DUTs according to PCIe (Peripheral Component Interconnect Express) Gen 7 or 256 GBd Ethernet standards using on-the-fly dynamic range switching and perform long cycle time tests without interruption for manual attenuator adjustments.

[0010] An embodiment of the present application moves a switching board having at least two different conductive paths between at least two connectors. These paths connect two of the connectors and transmit signals between them. One of the paths consists of a path, referred to herein as a "through path," which connects a signal coming into one of the connectors to another connector, which then transmits the signal. Typically, this connection is made between a device under test (DUT) and a test and measurement instrument, such as an oscilloscope. FIG. 1 shows one embodiment of a system employing switching devices and the like in these instruments.

[0011] The test and measurement system of FIG. 1 includes a test and measurement device 12 and a switch 22. The test and measurement device 12 may be connected to another computing device or may be self-contained. The device 12 may have multiple components, only some of which are described herein. The device may have a user interface 18 consisting of a display (which may be a touch screen), various controls, knobs, lights, etc., that allows a user to input test parameters, and may also have the ability to operate switches 22. The test and measurement device 12 may also include a memory 16 for storing data received from the device under test, settings, test profiles, etc. The hardware 14 may include a wide variety of hardware components, such as analog to digital converters, analyzers, etc. The test and measurement system may also be connected to an external computing device 26, which may perform some or all of the analysis on the received data.

[0012] In these embodiments, the hardware 14 may also include motors and controllers to move the switch platters to change the routing paths, as described in more detail below. Alternatively, the motor and controller machinery 20 may be external to the hardware module 14 and external to the test and measurement instrument 12. Some machinery may include moveable stages for moving the substrate, and each stage may have a motor. For example, in one embodiment, there may be two stages, each with its own motor.

[0013] The router 22 is connected between the device under test (DUT) 24 and the measurement equipment under test. Although FIG. 1 illustrates the routing switch (referred to herein as a router) 22 being external to the test and measurement equipment 12, in some embodiments the router 22 may be in the same enclosure as the test and measurement equipment 12. Generally, the router device 22 allows for a more automated manner of routing (distribution) of high frequency signals and may employ an S-parameter compensation system in the machine. The compensation system monitors the position of the motor, controller or other positioning mechanism and automatically adjusts the response to correct for the particular configuration. Currently, automated testing is very complicated because the user must manually install external coaxial terminators. Furthermore, this approach did not include any type of position compensation.

[0014] As mentioned above, one conductive path may be a through path. Another path may consist of an "attenuator" path. Typically, the term "attenuator" includes an arrangement of resistors that reduces the strength of a signal, i.e., attenuates a signal, such as a radio frequency (RF) or other signal. For purposes of this description, an "attenuator" path may include resistors and other circuit elements to form structures such as low-pass or band-pass filters, continuous-time linear equalization (CTLE) filters, RF limiters, electrostatic discharge (ESD) protection circuits, and the like. Another aspect of this switching device includes the ability to switch in circuits that would otherwise add parasitics to the signal path, such as time domain reflectometry (TDR) function circuits, which will be described in more detail below.

[0015] FIG. 2 shows one embodiment of a router with auto-routing capabilities. The router has connectors 30 and 32. The connectors have coaxial ends that allow the user to connect standard coaxial cables. At the other end of the connectors are contacts 32, shown for connector 30, which may be spring contacts connected to the center conductor of the coaxial end of the connector. Connector 31 has a center conductor that is not visible in this view. These contacts allow boards 36 and 38 to move into position to contact the connector. In FIG. 2, the first board 36 has a first conductive path (not visible in this view) between its contact plate 53, etc., and the other contact plate (not visible in this view) at the other end of board 36. The second board 38 has another conductive path between contact plates 50 and 51. The conductive path may consist of the ground-signal-ground path shown in FIG. 2, ground 40, signal 42, and ground 44. This embodiment of the conductive path includes an attenuator 46 to form an attenuator signal path.

[0016] Contacts 50 and 51 and the like provide conductive paths between the connectors, their respective spring contacts, the signal conductive paths on the board, and the contact plate. Figure 3 shows two views of one embodiment of a contact plate 50. The top view is a side or end view of the contact plate showing the protruding spring contacts 52, 54, 56. The bottom view is a top view of the contact plate, showing the two ground contacts 52 and 54, the center contact 56, and the surrounding dielectric 58.

[0017] 4-6 show these structures, or structures similar to these, in place as the substrates move between different positions within the switch. In this embodiment, both platters 36 and 38 have the ability to move. The two substrates 36 and 38 may be coupled to move up and down as a unit, or a moving stage or other moving part may provide the ability for them to move.

[0018] Figure 4 shows a side view of connectors 30 and 31 positioned adjacent the respective ends of boards 38 and 36. The connectors are positioned so that the center conductors 32 and 33 and ground contacts of the connectors align with corresponding structures on contact plates 50 and 51 of board 38 and contact plates 53 and 54 of board 36 shown in Figure 4. The contact plates are on both boards. The position in Figure 4 is an open position where there is no connection between connectors 30 and 31.

[0019] Figure 5 shows the switch in the upper path configuration. Substrate 36 moves independently or as a unit with substrate 38 to contact connectors 30 and 31. When a connection is made between contacts 32 and 33 on the connectors and contact plates 53 and 54, a conductive path is formed between the two connectors. In Figure 6, the lower substrate 38 moves to form a conductive path between the connectors with contact plates 50 and 51 and a conductive path on substrate 38. The connector allows these connections to be made by its unique structure. The two substrates may provide conductive paths with different characteristics, such as one with an attenuator and one being a through path, or each with a different attenuator.

[0020] Figure 7 shows an embodiment of a connector 48 of a different configuration than connector 30, such as that of Figures 4-6. Connector 48 has a face portion having a center conductor 55 surrounded by dielectric 56 and ground 57. This second portion 49 is an interface assembly having center conductor 47, dielectric 59 and an array of ground contacts such as 58. This interface portion 49 has a similar structure on the opposite side, not visible in this view.

[0021] FIG. 8 shows an embodiment of a switch device having only one movable substrate. A housing 60, shown here as transparent, contains a substrate 62 having various conductive paths, and a linear or translation stage 64. The stage moves the platter between various positions in a first plane, axially shown as the xy plane. The stage typically moves only in one of two directions in this plane (in this case, the x direction of the xy plane). The stage also moves the platter in a z direction (up and down) perpendicular to the xy plane. The contact plate is not shown in FIG. 8 to allow a better view of the routing substrate.

[0022] To make connections between the connectors, the stage moves the substrate 62 upward in the z-axis relative to the drawing to bring the end of the connector into contact with the nearest substrate. The stage also moves the platter downward in the z-axis, moves it (sideways) along the x-axis, and then moves it upward again in the z-axis to make various paths between the connectors. In one embodiment, the connectors 68 and 70 may correspond to input components of a test and measurement instrument. The connector 66 may typically correspond to an oscilloscope input connector from a DUT fixture.

[0023] FIG. 9 shows a closer view of the three possible paths and their associated contact plates shown in FIG. 8. Path 74 forms a connection between connector 66 and connector 68. In this description, paths such as this one are referred to as "laterally offset" paths to indicate that they form connections between connectors that are not in line with one another, with or without damping. Each path may have a precision spring plate 72 or the like to provide contact to the connector. Referring again to FIG. 4, the contact plate here is at the edge of the substrate so that the connector can make contact. In an embodiment with only one movable substrate, the connector can translate in the x-axis (or y-axis) and move to the contact plate in the z-axis so that the contacts can be located away from the edge.

[0024] Lateral offset path 74 may allow connection to a TDR (time domain reflectometer) or a specific ASIC (application specific integrated circuit) designed for a specific purpose such as a specific voltage range. Path 76 provides a through path between connectors 66 and 70, and path 78 provides an attenuating path including an attenuator 80 between connectors 66 and 70. The attenuator path may have several functions, as described above, including lowering the signal voltage to better match large input signals to the dynamic range of the test and measurement equipment input hardware. The board may have a wide variety of paths including many different types of attenuation, but the movement will allow selection of one of at least two conductive paths.

[0025] Figure 10 shows a linear stage whose routing platter has a precision spring plate built on it that engages a ceramic substrate that transmits the signal to an oscilloscope. In this view, the housing 60 is opaque and the connectors 68 etc. are "under" the routing device.

[0026] In some embodiments where only one substrate moves, the contact structure may be different than in the previous embodiment. In this embodiment, the moving substrate may also be called the routing substrate. FIG. 11 shows an embodiment of a different type of contact structure that may be present on the routing substrate. FIG. 11 shows a top view of a connector 82 that may be placed on a fixed substrate in a router. A spring tip 84 forms a connection between the center conductor of the connector and a spring plate on the ceramic substrate. An array of ground contacts 86, etc., may also be present in the connector to connect to the ground braid / body / contact of the coaxial portion.

[0027] FIG. 12 shows an embodiment of a moveable substrate with a different contact structure, similar to FIG. 7. In FIG. 12, the moveable substrate 88 translates along a first axis and also moves up and down relative to the page. The underside of the moveable substrate 88 may include circuitry and other structures. An interface structure 92, which may be similar to the double-sided interface portion 49 of FIG. 7, connects a cable 93 to the moveable substrate 88. The cable 93 has a side 94 with a center conductor 95, a dielectric 96, and a ground 97. There may be multiple cables 93, etc., each making a different connection away from the moveable substrate. Additionally or alternatively, the platter may have multiple interfaces on its underside to allow for connection to the fixed substrate 90 with various transmission paths.

[0028] The interface structure 92 may be present on the cable or on the movable substrate 88. Similarly, additional interface structures, not shown for simplicity, may be present on the movable substrate 88 or on the fixed substrate 90. This embodiment allows connection between the cable 93 and a transmission path 91 on the fixed substrate 90, which may be a 50 Ohm impedance transmission path of the substrate.

[0029] 13 shows one embodiment of a fixed substrate 100 of a router. Fixed substrate 100 has contact structures 102, 104, and 106. Contactor 102 may be an input connector to the hardware of a test and measurement instrument and may be connected to an integrated circuit 112. Contactor 104 is connected to an input cable 110. Contactor 106 is connected to an input cable 108. These are merely examples of possible connections and are not intended to limit the scope of the claims.

[0030] Figure 14 shows a schematic of a routing (distribution) board 114. In the configuration shown, conductive paths connect cables 110 to 108 of Figure 13 via contact structures 106 and 104. As can be seen in Figure 14, the movable board has multiple paths.

[0031] FIG. 15 shows an embodiment of a routing board 114 with four paths. In this embodiment, path 116 forms a bypass route without the input contact structure 102 shown in FIG. 13. Paths 118 and 120 form straight connections between the contact structures 102 and 104 and their corresponding cables. Two of the paths 118 and 120 are CTLE (continuous time linear equalization) paths. CTLE paths typically consist of filters with upward sloping responses matched with downward sloping lossy signal paths. Path 122 forms a through path between connectors. Other types of attenuation paths include low pass, band pass, filters, AC coupling, RF limiters, ESD protection, TDR elements, etc.

[0032] Figure 16 shows one embodiment of a routing path on a routing board that includes a TDR path. In position 1, the test and measurement equipment operates in its normal function, and the signal is transferred from the DUT to the measurement equipment without parasitics. In position 2, the TDR signal source is switched into the signal path. Factory calibration can compensate for the loss of the incident and reflected paths due to the resistive splitter. Note that the resistive splitter may take other forms. Although the TDR is configured with a traditional type of signal, any wideband signal can be used, such as a chirp, impulse, or AC-coupled step. The test and measurement equipment can return any of these signal shapes to a TDR-format display. For grounded co-planar waveguide structures, it may be necessary to place the coupling circuit partially on the back side of the board for optimal performance. Any of these non-ideal points may be calibrated out.

[0033] 17 shows another embodiment of a switching router having a movable substrate 132. An input signal from the DUT is connected through a connector 130. Paths from the connector 130 are then selectively connected to an input IC 144 of the test and measurement instrument. In this embodiment, these paths may include an attenuation path 134, a through path 136, a TDR coupler 138 connected to a TDR signal source 140 for the signal used for the TDR, and a calibration signal source 142. Each path is formed based on the movement of the movable substrate 132.

[0034] Aspects of the disclosed technology can operate on specially created hardware, firmware, digital signal processors, or specially programmed general-purpose computers, including processors that operate according to programmed instructions. The term "controller" or "processor" in this application contemplates microprocessors, microcomputers, ASICs, and dedicated hardware controllers, among others. Aspects of the disclosed technology can be implemented in computer-available data and computer-executable instructions, such as one or more program modules, executed by one or more computers (including a monitoring module) or other devices. Generally, program modules include routines, programs, objects, components, data structures, and the like, which, when executed by a processor in a computer or other device, perform particular tasks or implement particular abstract data formats. The computer-executable instructions may be stored in computer-readable storage media, such as hard disks, optical disks, removable storage media, solid-state memory, RAM, and the like. As will be appreciated by those skilled in the art, the functionality of the program modules may be combined or distributed as desired in various embodiments. Furthermore, such functionality may be embodied in whole or in part in firmware or hardware equivalents, such as integrated circuits, field programmable gate arrays (FPGAs), etc. Certain data structures may be used to more effectively implement one or more aspects of the disclosed techniques, and such data structures are considered to be within the scope of the computer-executable instructions and computer-usable data described herein.

[0035] The disclosed aspects may, in some cases, be implemented in hardware, firmware, software, or any combination thereof. The disclosed aspects may also be implemented as instructions carried by or stored on one or more computer-readable media that may be read and executed by one or more processors. Such instructions may be referred to as computer program products. A computer-readable medium as described herein means any medium that can be accessed by a computing device. By way of example, and not limitation, computer-readable media may include computer storage media and communication media.

[0036] Computer storage media means any medium that can be used to store computer-readable information. By way of example and not limitation, computer storage media may include random access memory (RAM), read-only memory (ROM), electrically erasable programmable read-only memory (EEPROM), flash memory or other memory technology, compact disk read-only memory (CD-ROM), digital video disc (DVD) or other optical disk storage, magnetic cassettes, magnetic tape, magnetic disk storage or other magnetic storage devices, and any other volatile or non-volatile removable or non-removable media implemented in any technology. Computer storage media excludes signals themselves and transitory forms of signal transmission.

[0037] A communication medium refers to any medium capable of communicating computer readable information. By way of example, and not limitation, communication media may include coaxial cables, fiber optic cables, air, or any other medium suitable for communicating electrical, optical, radio frequency (RF), infrared, acoustic, or other types of signals.

[0038] In addition, the present description refers to specific features. It should be understood that the disclosure herein includes all possible combinations of those specific features. When a specific feature is disclosed in connection with a particular aspect or embodiment, that feature can also be used in connection with other aspects and embodiments, to the extent possible.

[0039] Furthermore, when the application refers to a method having two or more defined steps or processes, those defined steps or processes may be performed in any order or simultaneously, unless the context precludes such a possibility. Working Example

[0040] In the following, examples useful for understanding the technology disclosed in the present application are presented. The embodiment of the technology may include one or more of the examples described below and any combination thereof.

[0041] Example 1 is an apparatus comprising: a first substrate having first and second contacts at first and second ends; a second substrate having contacts at first and second ends; at least two connectors arranged in the same plane, at least one connector arranged adjacent to the first ends of the first and second substrates and at least one connector arranged adjacent to the second ends of the first and second substrates; a first stage connected to the first substrate and operable to move the first substrate and bring the at least two connectors into contact with each other to form a first conductive path; and a second stage connected to the second substrate and operable to move the second substrate and bring the at least two connectors into contact with each other to form a second conductive path.

[0042] Example 2 is the apparatus of claim 1, wherein the first and second contactor plates have at least two spring contacts, and at least one of the at least two spring contacts has an insulating sleeve.

[0043] Example 3 is the device of any of Examples 1 and 2, wherein the at least two connectors include a center conductor spring surrounded by an insulating dielectric, a ground contact array within the insulating dielectric, and a coaxial connector around the center conductor.

[0044] Example 4 is the device of any one of Examples 1 to 3, wherein one of the first and second conductive paths comprises a through path.

[0045] Example 5 is the apparatus of example 4, wherein the through path has a lateral offset.

[0046] Example 6 is the apparatus of any of Examples 1 to 5, wherein at least one of the first and second conductive paths includes an attenuator.

[0047] Example 7 is the apparatus of example 6, wherein the attenuator has a filter configured with one of a bandpass, a lowpass, and a continuous-time linear equalization (CTLE) filter.

[0048] Example 8 is the device of any of Examples 1 to 7, further comprising a first motor connected to the first stage and configured to move the first stage, and a second motor connected to the second stage and configured to move the second stage.

[0049] Example 9 is the apparatus of example 8, further comprising an S-parameter correction system configured to monitor a position of at least one of the at least two stages and adjust said position as necessary.

[0050] Example 10 is an apparatus comprising a substrate having at least two conductive paths, a housing for receiving the substrate, a number of coaxial connectors in the housing, each having a contact structure for connecting to a ground and a spring contact, and arranged to connect to at least one of the conductive paths depending on the position of the substrate, and a motorized stage operable to move the substrate to adjust the position of one of the at least two conductive paths to form a connection between the two connectors.

[0051] Example 11 is the apparatus of example 10, further comprising a controller operable to move the stage.

[0052] Example 12 is an apparatus of any of Examples 10 and 11, wherein the at least two conductive paths include three conductive paths, and at least one of the conductive paths is comprised of one of a through path, an attenuated path, and a path having a lateral offset.

[0053] Example 13 is any of the devices of Examples 10 to 12, wherein the at least two conductive paths include four conductive paths, at least one of which is comprised of one of a through path, a path having a lateral offset, and an attenuated path.

[0054] Example 14 is the apparatus of any of examples 10 to 13, wherein at least one of the at least two conductive paths includes a continuous-time linear equalization (CTLE) path.

[0055] Example 15 is the device of any of Examples 10 to 14, wherein at least one of the two conductive paths is comprised of one of a band pass filter or a low pass filter.

[0056] Example 16 is the apparatus of any of examples 10 to 15, wherein at least one of the two conductive paths includes a time domain reflectometer.

[0057] Example 17 is the device of any of examples 10 to 16, wherein the contact structure includes an array of ground pins contained in a dielectric and a spring contact.

[0058] Example 18 is the apparatus of any of examples 10-17, wherein the motorized stage is operable to translate along at least one axis in a first plane.

[0059] Example 19 is the apparatus of example 18, wherein the motorized stage is operable to move perpendicular to the first plane.

[0060] Example 20 is the apparatus of any of examples 10 to 19, further comprising an S-parameter correction system for monitoring a position of the substrate and adjusting the position as necessary.

[0061] Example 21 is the device of any of examples 10 to 20, wherein at least one of the coaxial connectors has an interface structure including a double-sided structure having a center conductor contact, a dielectric contact, and a ground contact, respectively.

[0062] Example 22 is an apparatus comprising at least one substrate having at least two conductive paths, at least two connectors arranged on a first plane, and a movable stage connected to one of the at least one substrate and configured to move the one substrate perpendicular to the first plane to form a conductive path between two of the at least two connectors.

[0063] All features disclosed in the specification, claims, abstract and drawings, and all steps in any disclosed method or process, may be combined in any combination, except where at least some of such features or steps are mutually exclusive combinations. Each feature disclosed in the specification, abstract, claims and drawings may be replaced by an alternative feature serving the same, equivalent or similar purpose, unless expressly stated otherwise.

[0064] For purposes of illustration, specific embodiments of the invention have been illustrated and described, but it will be understood that various modifications can be made without departing from the spirit and scope of the invention. Accordingly, the invention should not be limited, except as by the appended claims.

Claims

1. A first substrate having a first contact at a first end of the first substrate and a second contact at a second end of the first substrate; a second substrate having a first contact at a first end of the second substrate and a second contact at a second end of the second substrate; at least two connectors disposed in the same plane, at least one connector disposed adjacent the first ends of the first and second substrates and at least one other connector disposed adjacent the second ends of the first and second substrates; a first movable stage connected to at least one of the first substrate and the second substrate and operable to move at least one of the first substrate and the second substrate to contact the at least two connectors to form a first conductive path or a second conductive path; A switch device comprising:

2. The first and second contacts are having at least two spring contacts; 2. The switch device of claim 1, wherein at least one of said at least two spring contacts has an insulating sleeve.

3. The at least two connectors a central conductor spring surrounded by an insulating dielectric; an array of ground contacts within the insulating dielectric; A coaxial connector around the central conductor; 2. The switch device of claim 1, further comprising:

4. 2. The switch device of claim 1, wherein one of the first and second conductive paths comprises a through path.

5. 5. The switch apparatus of claim 4, wherein said through path has a lateral offset.

6. 2. The switch device of claim 1, wherein at least one of the first and second conductive paths includes an attenuator.

7. 7. The switch device of claim 6, wherein the attenuator comprises a filter configured as one of a bandpass, a lowpass, and a continuous-time linear equalization (CTLE) filter.

8. A second movable stage connected to the second substrate; a first motor connected to the first movable stage and configured to move the first movable stage; a second motor connected to the second movable stage and configured to move the second movable stage; Further comprising:

2. The switch device of claim 1, wherein said first movable stage is connected to said first substrate.

9. The switch device of claim 8, further comprising an S-parameter correction system that monitors the position of at least one of the first and second stages and adjusts the response of the switch device by applying S-parameter correction based on the position.

10. a substrate having at least two conductive paths; a housing for accommodating the substrate; a plurality of connectors in the housing, each connector having a contact structure for connecting to ground and a spring contact, the connectors being positioned to connect to at least one of the conductive paths depending on the position of the substrate; a motorized stage operable to move the substrate to adjust the position of one of the at least two conductive paths to form a connection between two connectors; A switch device comprising:

11. The switch device of claim 10, further comprising a controller for actuating the motorized stage to move.

12. 11. The switch device of claim 10, wherein the at least two conductive paths include three or four conductive paths, and at least one conductive path among the three or four conductive paths comprises one of a through path, an attenuated path, and a path having a lateral offset.

13. 11. The switch device of claim 10, wherein at least one of the at least two conductive paths comprises a continuous time linear equalization (CTLE) path, a bandpass filter, a lowpass filter, or a time domain reflectometer.

14. 11. The switch device of claim 10, wherein the contact structure includes an array of ground contacts and a spring contact.

15. The switching apparatus of claim 10 , wherein the motorized stage is operable to translate along at least one axis in a first plane.

16. The switching apparatus of claim 15, wherein the motorized stage is operable to move perpendicular to the first plane.

17. 11. The switching device of claim 10, further comprising an S-parameter correction system for monitoring a position of the substrate and adjusting a response of the switching device by applying S-parameter corrections based on the position.

18. 11. The switch apparatus of claim 10, wherein at least one of the coaxial connectors has an interface structure including a double-sided structure having a center conductor contact, a dielectric contact, and a ground contact, respectively.

19. At least one substrate having at least two conductive paths; at least two connectors disposed in a first plane; a first movable stage connected to a first substrate of the at least one substrate and configured to move the first substrate perpendicular to the first plane to form a first conductive path between two of the at least two connectors; A switch device comprising:

20. The switch device of claim 19, further comprising a second movable stage connected to a second substrate in the at least one substrate and adapted to move the second substrate to connect the at least two connectors to a second conductive path.

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