Resin composition, laminate film and laminate film with adhesive layer

The laminated film with a curable silicone resin layer addresses high silicone migration and peelability issues, ensuring stable peeling and low contamination in semiconductor manufacturing.

JP2025006289APending Publication Date: 2025-01-17MITSUBISHI CHEM CORP
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Patent Information

Application Number
JP2023106987
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Filing Date
2023-06-29
Publication Date
2025-01-17

AI Technical Summary

Technical Problem

Existing laminated films used in semiconductor manufacturing face challenges with high silicone migration, insufficient easy peelability, and peeling stability, leading to reduced yield and contamination issues.

Method used

A laminated film composed of a curable silicone resin with controlled alkenyl group and SiH group content, forming a resin layer on a base film, which suppresses silicone migration and ensures both easy peelability and peeling stability.

Benefits of technology

The laminated film achieves low silicone migration, maintaining stable peeling properties under various environmental conditions, suitable for semiconductor manufacturing and other applications requiring low contamination.

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Patent Text Reader

Abstract

To provide a laminate film (silicone release film) which is extremely excellent in silicone non-migration property while achieving easy peelability and peeling stability.SOLUTION: The present invention relates to a resin composition containing a curable silicone resin and a catalyst, and satisfies the following (1) and (2). The present invention also relates to a laminate film having a resin layer obtained by curing a resin composition laminated on at least one surface of a base material film. (1) An amount of an alkenyl group coupled to a polysiloxane chain of a curable silicone resin is 2.9 mol% or less with respect to the total amount of a siloxane component contained in the resin composition. (2) A molar ratio of an amount of an SiH group contained in the resin composition to an amount of an alkenyl group coupled to a polysiloxane chain of the curable silicone resin is 2.4 or less.SELECTED DRAWING: None
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Citation Information

Patent Citations

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    JP2012136029A

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    JP2020070384A