Thermo-sensitive member, thermo-sensitive film material, detection system, determination system, and electronic and electric apparatus

Abstract

To provide a thermo-sensitive member which can discharge a material in response to heat and has excellent handleability.SOLUTION: A thermo-sensitive member 1 includes: a capsule agent; and a base substance for holding the capsule agent. The capsule agent comprises: a thermo-fusion outer shell; and an included material included in the outer shell. The base substance includes a thermoplastic resin.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure generally relates to a heat-sensitive member, a heat-sensitive film material, a detection system, a determination system, and an electronic / electrical device, and more particularly to a heat-sensitive member capable of releasing a substance in response to heat, a heat-sensitive film material comprising the heat-sensitive member, a detection system comprising the heat-sensitive member, a determination system including the detection system, and an electronic / electrical device comprising the heat-sensitive member. [Background technology]

[0002] Patent Document 1 discloses, as a conventional technology, that when a heat-sensitive capsule containing a liquid odorous substance encapsulated in low-melting point solder is heated by abnormal heat generation from an electrical device and reaches a predetermined temperature, the low-melting point solder sealing the odorous substance melts and the encapsulated odorous substance is dissipated to the outside; by detecting this odorous substance with an odor detector, abnormal heat generation in electrical equipment etc. can be sensed. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2013-148469 A Summary of the Invention [Problem to be solved by the invention]

[0004] The handling of heat-sensitive capsules, which are made by encapsulating liquid odorous substances in low-melting-point solder, is not necessarily easy, and it is not necessarily easy to place heat-sensitive capsules inside various devices.

[0005] An object of the present disclosure is to provide a heat-sensitive member that can release a substance in response to heat and is easy to handle, a heat-sensitive film material comprising the heat-sensitive member, a detection system comprising the heat-sensitive member, a determination system including the detection system, and an electronic / electrical device comprising the heat-sensitive member. [Means for solving the problem]

[0006] A heat-sensitive member according to an embodiment of the present disclosure includes a capsule and a substrate that holds the capsule. The capsule includes a heat-meltable shell and an encapsulated substance that is encapsulated in the shell. The substrate includes a thermoplastic resin.

[0007] A heat-sensitive film material according to one aspect of the present disclosure includes a base film and the heat-sensitive member overlying the base film.

[0008] A detection system according to one aspect of the present disclosure includes the heat-sensitive member or the heat-sensitive film material, and a gas detector that detects the encapsulated substance.

[0009] A determination system according to one aspect of the present disclosure includes the detection system and a determination unit that makes a determination based on a detection result by the gas detector in the detection system.

[0010] An electronic / electrical device according to one aspect of the present disclosure includes a heating element, and the heat-sensitive member or the heat-sensitive film material to which heat generated by the heating element is transferred. Effect of the Invention

[0011] According to one aspect of the present disclosure, there are provided a heat-sensitive member that can release a substance in response to heat and is easy to handle, a heat-sensitive film material comprising the heat-sensitive member, a detection system comprising the heat-sensitive member, a determination system including the detection system, and an electronic / electrical device comprising the heat-sensitive member. [Brief description of the drawings]

[0012] [Figure 1] FIG. 1 is a schematic configuration diagram showing a detection system, a determination system, and an electronic / electrical device according to an embodiment of the present disclosure. [Diagram 2] FIG. 2 is a block diagram of the detection system and the determination system of the embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, the embodiments of the present disclosure will be described with reference to FIG. 1 and FIG. 2. The following embodiments are merely a part of various embodiments of the present disclosure. In addition, the following embodiments can be modified in various ways depending on the design, etc., as long as the object of the present disclosure can be achieved. The figures referred to below are schematic diagrams, and the dimensional ratios of the components in the figures do not necessarily reflect the actual dimensional ratios. The action mechanisms of the embodiments shown below are estimated, and the present disclosure is not bound by the following explanation of the action mechanisms.

[0014] The heat-sensitive member 1 of the embodiment includes a capsule and a base that holds the capsule. The capsule includes a heat-meltable shell and an encapsulated substance that is encapsulated in the shell. The base includes a thermoplastic resin.

[0015] According to the embodiment, when the heat-sensitive member 1 is heated and the outer shell of the capsule melts, the encapsulated substance leaks out of the capsule, and the encapsulated substance may be released from the heat-sensitive member 1. Therefore, by detecting that the encapsulated substance has been released from the heat-sensitive member 1, it can be confirmed that the heat-sensitive member 1 has been heated to such an extent that the outer shell melts.

[0016] In addition, since the capsules are held in a base containing a thermoplastic resin, the heat-sensitive member 1 is easy to handle and can be easily provided at an appropriate location. For example, the heat-sensitive member 1 can be easily additionally provided on an electronic / electrical device 5. In addition, by producing components constituting the electronic / electrical device 5 from the heat-sensitive member 1, the heat-sensitive member 1 can be easily provided on the electronic / electrical device 5.

[0017] The heat-sensitive member 1 will now be described in further detail.

[0018] As described above, the capsule comprises an outer shell and an inner substance.

[0019] The material of the shell is not particularly limited as long as it has thermal melting properties. By appropriately designing the melting point of the shell, the temperature at which the heat-sensitive member 1 responds can be adjusted. The shell contains, for example, a thermoplastic resin. In particular, it is preferable that the shell contains at least one resin selected from the group consisting of polyurethane, polyamide, melamine resin, and urea resin. In this case, the shell can stably encapsulate the encapsulated substance, and the melting point of the shell can be easily designed by appropriately adjusting the structure, molecular weight, etc. of the resin.

[0020] The melting point of the outer shell is designed according to the temperature to which the heat-sensitive member 1 should respond. For example, when the heat-sensitive member 1 is used to detect abnormal heat generation in the electronic / electrical device 5, the melting point of the outer shell is preferably 70°C or higher and 150°C or lower. In this case, when the electronic / electrical device 5 is operating normally, the release of the encapsulated substance from the heat-sensitive member 1 is suppressed, and when abnormal heat generation occurs in the electronic / electrical device 5, the shell melts and the encapsulated substance can be released from the heat-sensitive member 1. It is more preferable that the melting point of the outer shell is 80°C or higher. It is more preferable that the melting point of the outer shell is 100°C or lower. The melting point is measured by a differential scanning calorimeter (DSC).

[0021] The encapsulated substance is, for example, a gas or a volatile substance. In this case, the encapsulated substance leaked from the capsule in the heated heat-sensitive member 1 can be released well from the heat-sensitive member 1. The boiling point of the encapsulated substance is preferably 150°C or less. In this case, the encapsulated substance can be released better from the heat-sensitive member 1. The boiling point of the encapsulated substance is more preferably 130°C or less, and even more preferably 120°C or less. The encapsulated substance contains, for example, a volatile organic compound. More specifically, the encapsulated substance contains at least one selected from the group consisting of, for example, tetrahydrothiophene, 5-ethylidene-2-norbornene, 2-alkyl-3-alkoxypyrazine, tert-butyl mercaptan, dimethyl sulfide, and ethyl mercaptan. It is preferable that the encapsulated substance contains tetrahydrothiophene. Tetrahydrothiophene is easy to handle because it has a history of use as an odorant, and can be easily detected by an appropriate gas sensor or the like. Of course, the encapsulating material may contain any suitable substance other than tetrahydrothiophene.

[0022] The diameter of the capsules is, for example, 300 nm or more and 1000 μm or less. In this case, even if the thickness of the sensitive member is small, for example, when the heat-sensitive member 1 is formed in a film shape, the capsules can be stably held on the base in the heat-sensitive member 1. However, the size of the capsules is not limited to the above.

[0023] As described above, the substrate contains a thermoplastic resin. Therefore, the substrate and the thermal member 1 can be easily formed into an appropriate shape. Furthermore, the thermoplastic resin has a lower crosslink density than the thermosetting resin, and when heated, the molecular chains in the thermoplastic resin tend to move. Therefore, when the thermal member 1 is heated, even if the capsule is embedded in the substrate, the molecules of the encapsulated substance leaking out of the capsule and volatilizing can pass through the substrate and be released from the thermal member 1. The thermoplastic resin contains at least one selected from the group consisting of, for example, acrylic resin, acrylonitrile-butadiene-styrene resin (ABS resin), polyurea, polyurethane, polyamide, melamine resin, urea resin, gelatin, gum arabic, polyvinyl alcohol (PVA), cellulose, and polyethylene.

[0024] In the heat-sensitive member 1, the capsules are dispersed, for example, in a base. The amount of capsules in the heat-sensitive member 1 is appropriately set so that a detectable amount of the encapsulated substance is released when the heat-sensitive member 1 is heated. For example, the ratio of the capsules is 1 part by mass or more and 50 parts by mass or less per 100 parts by mass of the base. If the amount of the capsules is 1 part by mass or more, the released encapsulated substance is more easily detectable. If the amount of the capsules is 100 parts by mass or less, the strength of the heat-sensitive member 1 can be well maintained.

[0025] The heat-sensitive member 1 can be produced by molding a molding resin composition containing, for example, a thermoplastic resin as the raw material of the base and an encapsulant by a suitable molding method. The molding resin composition may further contain suitable additives in addition to the thermoplastic resin and the encapsulant, as necessary.

[0026] The molding resin composition may contain a solvent. In this case, for example, the molding resin composition is applied to form a film, and the solvent is then evaporated from the molding resin composition to produce the film-like heat-sensitive member 1.

[0027] It is also possible to directly mix the capsule agent with the base thermoplastic resin. For example, the molding composition can be prepared by mixing the thermoplastic resin and the capsule agent using a single screw extrusion kneader or a twin screw extrusion kneader.

[0028] When the thermal member 1 is in the form of a film, the thickness of the thermal member 1 is, for example, 0.5 μm to 100 μm, although the thickness is not limited to this range.

[0029] The thermal film material 10 of the embodiment includes a base film 11 and a thermal member 1 overlapping the base film 11. This improves the ease of handling of the thermal member 1. In addition, the thermal film material 10 can be attached to the surface of an appropriate member, so that the thermal member 1 can be easily attached to the appropriate member.

[0030] The base film 11 is a resin film such as a polyethylene terephthalate film.

[0031] The heat-sensitive member 1 in the heat-sensitive film material 10 is, for example, in the form of a film. A molding composition containing, for example, the above-mentioned solvent is applied onto a base film 11, molded into a film, and the solvent is then evaporated from the molding composition, thereby producing a film-like heat-sensitive member 1 superimposed on the base film 11. The thickness of the film-like heat-sensitive member 1 is, for example, 0.5 μm or more and 100 μm or less, as described above.

[0032] The detection system of the embodiment includes a heat-sensitive member 1 or a heat-sensitive film material 10, and a gas detector 2 that detects the encapsulated substance. With this detection system, the heat-sensitive member 1 is heated to release the encapsulated substance, and the gas detector 2 detects the encapsulated substance, thereby making it possible to confirm that the temperature of the heat-sensitive member 1 has reached a temperature at which the encapsulated substance is released. The detection result by the gas detector 2 can be used for various purposes.

[0033] The gas detector 2 preferably includes a detector 21 that detects the encapsulated substance and outputs a signal. The detector 21 is, for example, a gas sensor. In particular, the gas detector 2 preferably includes, as the detector 21, a semiconductor gas sensor that detects the encapsulated substance and outputs a signal. The semiconductor gas sensor is easy to maintain and has good handleability, and furthermore, the encapsulated substance can be detected with good sensitivity by selecting a semiconductor in the semiconductor gas sensor according to the type of the encapsulated substance.

[0034] The determination system of the embodiment includes the above-mentioned detection system and a determination unit 32 that performs a determination based on the detection result by the gas detector 2 in the detection system. According to this determination system, when the heat-sensitive member 1 is heated and the encapsulated substance is released from the heat-sensitive member 1, and this encapsulated substance is detected by the gas detector 2, the determination unit 32 can determine that an event related to the release of the encapsulated substance has occurred, such as the temperature of the heat-sensitive member 1 reaching a level at which the encapsulated substance is released, or the occurrence of a fact that causes the temperature of the heat-sensitive member 1 to reach a level at which the encapsulated substance is released.

[0035] The determination system of the embodiment may further include a notification unit 4 that notifies the result of the determination by the determination unit 32. The notification unit 4 is a means for notifying information in a manner that appeals to the five human senses. The notification unit 4 includes at least one type selected from the group consisting of a display, a lamp, an indicator light, etc. that visually notify information, a speaker, a buzzer, etc. that notify information by sound, and a vibration motor, etc. that notify information by vibration.

[0036] The electronic / electrical device 5 of the embodiment includes the above-mentioned heat-sensitive member 1 or heat-sensitive film material 10. In this case, for example, when abnormal heat generation occurs in the electronic / electrical device 5, the heat-sensitive member 1 releases the encapsulated substance, and when the encapsulated substance is detected, it can be confirmed that abnormal heat generation occurs in the electronic / electrical device 5.

[0037] The electronic / electrical device 5 refers to electronic equipment or electrical equipment, such as lighting equipment, electrical outlets, OA taps, mobile terminals, and information devices.

[0038] The electronic / electrical device 5 including the heat-sensitive member 1 or the heat-sensitive film material 10 may further include the gas detector 2. In this case, the electronic / electrical device 5 can be considered to include a detection system, and the detection system can also be considered to include the electronic / electrical device 5. When the electronic / electrical device 5 includes the gas detector 2, for example, when abnormal heat generation occurs in the electronic / electrical device 5, the heat-sensitive member 1 releases an encapsulated substance, and when the encapsulated substance is detected by the gas detector 2, it can be confirmed that abnormal heat generation occurs in the electronic / electrical device 5 based on the detection result of the gas detector 2.

[0039] An example of the determination system will be described more specifically with reference to FIGS.

[0040] The determination system shown in FIGS. 1 and 2 includes an electronic / electrical device 5, a detection system, a control system 3, and a notification unit 4.

[0041] The electronic / electrical device 5 includes a housing 6 and a heating element 7 provided in the housing 6. The heating element 7 is, for example, a power supply device, a heat generating component such as a power semiconductor, a capacitor, or a motor. A heat-sensitive film including a heat-sensitive member 1 is overlaid on the heating element 7. Therefore, heat generated by the heating element 7 can be transferred to the heat-sensitive member 1. A gas detector 2 is provided in the housing 6. The gas detector 2 includes a detection unit 21 that is sensitive to the encapsulated substance, and an output unit 22 that outputs a signal output by the detection unit 21 to the control system 3. The output unit 22 includes, for example, an appropriate interface for outputting a signal to the control system 3 via a wire. The output unit 22 may include a transmitting antenna that outputs a signal to the control system 3 wirelessly. The output unit 22 may include an amplifier circuit that amplifies the signal before outputting it, or may include a converter that converts the format of the signal before outputting it.

[0042] The control system 3 includes an acquisition unit 31 and a control unit 30. The acquisition unit 31 acquires the signal output by the output unit 22 and sends it to the determination unit 32. The acquisition unit 31 includes, for example, an appropriate interface for receiving a signal transmitted by wire. The acquisition unit 31 may include a receiving antenna for receiving a signal transmitted wirelessly. The acquisition unit 31 may include an amplifier circuit that amplifies the signal before transmitting it to the determination unit 32, and may include a converter that converts the format of the signal before transmitting it to the determination unit 32.

[0043] The control unit 30 includes a determination unit 32 and a notification control unit 33. Note that the determination unit 32 and the notification control unit 33 do not necessarily represent actual configurations, but represent functions realized by the control unit 30.

[0044] The control unit 30 includes, for example, a computer system. The computer system is mainly composed of a processor and a memory as hardware. The function of the control unit 30 is realized by the processor executing a program recorded in the memory of the computer system. The program may be pre-recorded in the memory of the computer system, may be provided through an electric communication line, or may be recorded and provided in a non-transitory recording medium such as a memory card, an optical disk, or a hard disk drive that can be read by the computer system. The processor of the computer system is composed of one or more electronic circuits including a semiconductor integrated circuit (IC) or a large scale integrated circuit (LSI). The integrated circuits such as IC or LSI mentioned here are called by different names depending on the degree of integration, and include integrated circuits called system LSI, VLSI (Very Large Scale Integration), or ULSI (Ultra Large Scale Integration). Furthermore, a field-programmable gate array (FPGA) that is programmed after the manufacture of the LSI, or a logic device that can reconfigure the connection relationship inside the LSI or reconfigure the circuit partition inside the LSI, can also be adopted as a processor. The electronic circuits may be integrated in one chip or distributed across multiple chips. The multiple chips may be integrated into one device, or may be distributed across multiple devices. The computer system referred to here includes a microcontroller having one or more processors and one or more memories. Therefore, the microcontroller is also composed of one or more electronic circuits including a semiconductor integrated circuit or a large-scale integrated circuit.

[0045] The determination unit 32 makes a determination based on the signal sent from the acquisition unit 31. For example, when the gas detector 2 detects an encapsulated substance and outputs a corresponding signal, the determination unit 32 can determine, based on this signal, that the temperature of the heat-sensitive member 1 has reached a level at which the encapsulated substance is released. The determination unit 32 may also determine that an event has occurred related to the temperature of the heat-sensitive member 1 having reached a level at which the encapsulated substance is released. More specifically, for example, the determination unit 32 may determine that abnormal heat generation has occurred in the heating element 7. The determination unit 32 may further determine the degree of abnormal heat generation of the heating element 7 based on the signal.

[0046] The notification control unit 33 controls the notification unit 4 to notify the outside of the determination result by the determination unit 32. That is, the notification control unit 33 causes the notification unit 4 to notify the determination result that the temperature of the heat-sensitive member 1 has reached a level at which the encapsulated substance is released, that abnormal heat has been generated in the heating element 7, and the degree of the abnormal heat generation of the heating element 7.

[0047] 1 and 2, since the electronic / electrical device 5 includes the gas detector 2, as described above, the determination unit 32 can determine that abnormal heat generation has occurred in the electronic / electrical device 5. In addition, when each of the multiple electronic / electrical devices 5 includes the heat-sensitive member 1 or the heat-sensitive film material 10 and the gas detector 2, the determination unit 32 can also determine individually that abnormal heat generation has occurred in each of the multiple electronic / electrical devices 5. In other words, it can be easily confirmed in which of the multiple electronic / electrical devices 5 abnormal heat generation has occurred.

[0048] An example of a series of operations of the determination system shown in Figures 1 and 2 will be described. When abnormal heat is generated in the heating element 7 in the electronic / electrical device 5, which causes the outer shell of the capsule in the heat-sensitive member 1 to melt and release the encapsulated substance from the heat-sensitive member 1, the detection unit 21 in the gas detector 2 senses the encapsulated substance and outputs a signal. The output unit 22 sends this signal to the control system 3. In the control system 3, the acquisition unit 31 acquires the signal and sends it to the control unit 30. In the control unit 30, the determination unit 32 determines that abnormal heat is generated in the heating element 7 in the electronic / electrical device 5 based on the signal. When the determination unit 32 sends this determination result to the notification control unit 33, the notification control unit 33 controls the notification unit 4 so that the notification unit 4 notifies the determination result.

[0049] It is not essential that the multiple functions of the control system 3 are integrated into one housing, and the components of the control system 3 may be distributed across multiple housings. Furthermore, at least some of the functions of each of the control systems 3 may be realized by the cloud (cloud computing) or the like.

[0050] Also, for example, the notification unit 4 may be configured with a display or the like provided in an electronic information terminal such as a personal computer or a smartphone. In this case, the determination unit 32 may be configured with a computer system provided in the electronic information terminal, or may be configured with a computer system in a device such as a server different from the electronic information terminal.

[0051] At least a part of the functions of the determination system may be integrated in one housing. For example, at least a part of the functions of the detection system and the control system 3 may be integrated in the housing 6 of the electronic / electrical device 5, and the function of the notification unit 4 may also be integrated in the housing 6 of the electronic / electrical device 5. That is, for example, the electronic / electrical device 5 may include the determination unit 32 and the notification unit 4 in addition to the heat-sensitive member 1 and the gas detector 2.

[0052] In the example shown in Fig. 1, in the electronic / electrical device 5, a heat-sensitive film having a heat-sensitive member 1 is superimposed on the heating element 7, but as long as the heat generated by the heating element 7 can be transferred to the heat-sensitive member 1, the shape and position of the heat-sensitive member 1 are not limited to the example shown in Fig. 1. For example, an appropriate part made of the heat-sensitive member 1 may be provided near the heating element 7. Furthermore, the housing 6 of the electronic / electrical device 5 may be made of the heat-sensitive member 1. Furthermore, the position of the gas detector 2 is not limited to the example shown in Fig. 1 as long as the encapsulated substance released from the heat-sensitive member 1 can be detected.

[0053] The uses of the thermal member 1, thermal film material 10, detection system and judgment system are not limited to judging abnormal heat generation in the above-mentioned electronic / electrical equipment 5, but can be applied to detect or judge temperature increases and related phenomena in various objects, such as temperature control during storage of food or medicines, etc. EXAMPLES

[0054] As a capsule formulation, Riken Resin NMC-HK manufactured by Miki Riken Kogyo Co., Ltd. was prepared, which contains an organic fragrance as an encapsulating substance and has an outer shell made of an acrylic resin with a melting point of about 80°C.

[0055] As a thermoplastic resin solution, Boncoat CC-6250 (non-volatile content 49% by mass) manufactured by DIC Corporation was prepared.

[0056] A molding composition was prepared by mixing 100 parts by weight of a thermoplastic resin solution and 5 parts by weight of capsules, and adding water as a solvent. This molding composition was applied onto an ABS resin plate (resin plate) and then dried to produce a film-like heat-sensitive member 1 with a thickness of 10 μm.

[0057] A container having an internal space of 30 cm x 30 cm x 30 cm was prepared. A hot plate was placed on the bottom of the internal space of the container, and the resin plate with the heat-sensitive member 1 was placed on the hot plate. A portable odor sensor XP-329IIIR manufactured by New Cosmos Electric Co., Ltd. was placed on the ceiling of the container. The temperature of the hot plate was raised from room temperature to 100°C, and when the temperature of the hot plate reached 85°C, the portable odor sensor detected the encapsulated substance released from the heat-sensitive member 1.

[0058] According to the above results, based on the detection result of the contained substance by the gas detector 2, it is possible to determine whether the heat-sensitive member 1 has been heated to a certain temperature or higher.

[0059] [Aspects] The heat-sensitive member (1) of the first embodiment includes a capsule and a substrate that holds the capsule. The capsule includes a heat-meltable shell and an encapsulated substance that is encapsulated in the shell. The substrate includes a thermoplastic resin.

[0060] According to this embodiment, a heat-sensitive member (1) that can release an encapsulated substance in response to heat and that is easy to handle can be obtained.

[0061] In a second embodiment, in the first embodiment, the shell comprises at least one selected from the group consisting of polyurethane, polyamide, melamine resin, and urea resin.

[0062] According to this embodiment, the temperature at which the encapsulated substance is released can be easily adjusted.

[0063] In a third embodiment, in the first or second embodiment, the encapsulation substance contains tetrahydrothiophene.

[0064] According to this embodiment, tetrahydrothiophene is easy to handle since it has a proven track record of use as an odorant, and can be easily detected by an appropriate gas sensor or the like.

[0065] The heat-sensitive film material (10) of the fourth embodiment comprises a base film (11) and the heat-sensitive member (1) of any one of the first to third embodiments superimposed on the base film (11).

[0066] According to this embodiment, the heat-sensitive member (1) can be more easily handled.

[0067] The detection system of the fifth aspect comprises a heat-sensitive member (1) of any one of the first to third aspects or a heat-sensitive film material (10) of the fourth aspect, and a gas detector (2) that detects an encapsulated substance.

[0068] According to this embodiment, when the heat-sensitive member (1) is heated and the encapsulated substance is released from the heat-sensitive member (1), the gas detector (2) detects the encapsulated substance, and it can be confirmed that the temperature of the heat-sensitive member (1) has reached a temperature sufficient to release the encapsulated substance.

[0069] In a sixth aspect, the gas detector (2) in the fifth aspect includes a semiconductor gas sensor sensitive to the included substance.

[0070] According to this embodiment, the semiconductor gas sensor is easy to maintain and has good handleability, and furthermore, by selecting a semiconductor in the semiconductor gas sensor depending on the type of encapsulated substance, the encapsulated substance can be detected with good sensitivity.

[0071] In a seventh aspect, in the fifth or sixth aspect, the detection system further comprises an electronic / electrical device (5), and the electronic / electrical device (5) comprises a heat-sensitive member (1).

[0072] According to this embodiment, by detecting the encapsulated substance using the gas detector (2), it can be confirmed that the temperature of the heat-sensitive member (1) has reached a level at which the encapsulated substance is released due to the heat generated by the electronic / electrical device (5).

[0073] In an eighth aspect, the electronic / electrical device (5) in the seventh aspect further includes a gas detector (2).

[0074] According to this embodiment, by detecting the encapsulated substance using the gas detector (2), it can be confirmed that the temperature of the heat-sensitive member (1) has reached a level at which the encapsulated substance is released due to the heat generated by the electronic / electrical device (5).

[0075] A determination system of a ninth aspect includes the detection system of any one of the sixth to eighth aspects, and a determination unit (32) that makes a determination based on a detection result by the gas detector (2) in the detection system.

[0076] According to this embodiment, when the encapsulated substance is released from the heat-sensitive member (1) and detected by the gas detector (2), the determination unit (32) can determine that an event has occurred in which the temperature of the heat-sensitive member (1) has reached a level at which the encapsulated substance is released.

[0077] In a tenth aspect, the determination system according to the ninth aspect further includes a notification unit (4) that notifies the result of the determination by the determination unit (32).

[0078] According to this embodiment, when the encapsulated substance is released from the heat-sensitive member (1) and detected by the gas detector (2), the notification unit (4) can notify the occurrence of an event related to the temperature of the heat-sensitive member (1) reaching a level at which the encapsulated substance is released.

[0079] An electronic or electric device (5) according to an eleventh aspect includes a heating element (7) and a heat-sensitive member (1) according to any one of the first to third aspects or a heat-sensitive film material (10) according to the fourth aspect to which heat generated by the heating element (7) is transferred.

[0080] According to this embodiment, the heat-sensitive member (1) releases the encapsulated substance, and by detecting this encapsulated substance, it can be confirmed that the heat generated by the heating element (7) has raised the temperature of the heat-sensitive member (1) to a level at which the encapsulated substance can be released.

[0081] In a twelfth aspect, in the eleventh aspect, the electronic / electrical device (5) further includes a gas detector (2) that detects the included substance.

[0082] According to this embodiment, when the heat-sensitive member (1) releases the encapsulated substance and this encapsulated substance is detected by the gas detector (2), it can be confirmed from the detection result of the gas detector (2) that the heat generated by the heating element (7) has raised the temperature of the heat-sensitive member (1) to a level at which the encapsulated substance can be released. [Explanation of symbols]

[0083] 1 Heat-sensitive material 10 Thermal film material 11 Base film 2 Gas detector 32 Judgment section 4. Notification Department 5. Electronic and Electrical Equipment 7 Heating element

Claims

1. Capsules and a substrate for holding the capsules; The capsule comprises: A heat-fusible shell; An encapsulated substance encapsulated in the outer shell, The substrate comprises a thermoplastic resin. Heat sensitive components.

2. The outer shell contains at least one selected from the group consisting of polyurethane, polyamide, melamine resin, and urea resin. The heat sensitive member of claim 1 .

3. The encapsulated substance includes tetrahydrothiophene. The heat sensitive member of claim 1 .

4. A base film; and the heat-sensitive member according to claim 1 overlying the base film. Thermal film material.

5. The heat-sensitive member according to claim 1 or the heat-sensitive film material according to claim 4; A gas detector for detecting the contained substance. Detection system.

6. The gas detector includes a semiconductor gas sensor that is sensitive to the included substance. The detection system of claim 5 .

7. Further equipped with electronic and electrical equipment, The electronic / electrical device includes the heat-sensitive member. The detection system of claim 5 .

8. The electronic / electrical device further comprises the gas detector. The detection system of claim 7.

9. A detection system according to claim 6; A determination unit that performs a determination based on a detection result by the gas detector in the detection system. Judging system.

10. Further comprising a notification unit that notifies a result of the determination by the determination unit. The determination system according to claim 9 .

11. A heating element; and a heat-sensitive member according to claim 1 or a heat-sensitive film material according to claim 4 to which heat generated by the heat generating element is transferred. Electronic and electrical equipment.

12. Further comprising a gas detector for detecting the contained substance.

12. The electronic / electrical device according to claim 11.

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