Component mounting system and component mounting method

Abstract

To provide a component mounting system capable of properly recognizing and processing the image results captured by a component recognition camera and a board recognition camera, and a component mounting method.SOLUTION: A component mounting system 1 includes: a first component recognition camera G1 for picking up an image of a component; a first board recognition camera C1 for picking up an image of a board 2; and a system control unit 12. Either one of the first component recognition camera G1 and the first board recognition camera C1 includes: a recognition processing unit 51 that performs recognition processing of the image captured by the first component recognition camera G1 and recognition processing of the image captured by the first board recognition camera C1; and a communication unit 50 that transmits the recognition result obtained by the recognition processing unit 51 to the system control unit 12.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a component mounting apparatus and a component mounting method for mounting components on a board. [Background technology]

[0002] The component mounting device corrects the positions of the components held by the mounting head and the board based on the imaging results from a component recognition camera that images the components held by the mounting head from below and a board recognition camera that images the board from above, and mounts the components on the board with high precision (see, for example, Patent Document 1). The component mounting device disclosed in Patent Document 1 transmits the imaging results from the component recognition camera and the board recognition camera to a CPU that controls the component mounting device, and the CPU performs recognition processing to detect the positions of the components and the board and correct the positions for mounting the components. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2006-245029 A Summary of the Invention [Problem to be solved by the invention]

[0004] Incidentally, component mounting devices equipped with multiple mounting heads have been developed in recent years. For example, a component mounting device equipped with four mounting heads will have a total of eight cameras, including four component recognition cameras and four board recognition cameras. However, in the conventional technology including Patent Document 1, the recognition process of the image capture results by multiple cameras such as the component recognition cameras and the board recognition cameras is processed by a CPU that also controls the movement of the mounting head, which has the following problems. That is, this control device requires an expensive CPU with high processing power, and further requires high capabilities for power supply to the CPU and heat dissipation measures, which increases the cost of the CPU board.

[0005] SUMMARY OF THE PRESENT DISCLOSURE An object of the present invention is to provide a component mounting apparatus and a component mounting method that are capable of appropriately recognizing and processing the image results captured by a component recognition camera and a board recognition camera. [Means for solving the problem]

[0006] A component mounting device of the present invention is a component mounting device that mounts a component on a board, and is equipped with a first imaging means for imaging the component, a second imaging means for imaging the board, and a control means, wherein one of the first imaging means and the second imaging means is equipped with a recognition processing unit that recognizes and processes the imaging result of the first imaging means and the imaging result of the second imaging means, and a communication unit that transmits the recognition result recognized by the recognition processing unit to the control means.

[0007] The component mounting method of the present invention is a component mounting method for mounting a component on a board, and includes a first imaging step of imaging the component by a first imaging means, a second imaging step of imaging the board by a second imaging means, a recognition processing step of recognition processing either the imaging result of the first imaging means or the imaging result of the second imaging means by a recognition processing unit, and a transmission step of transmitting the recognition result recognized by the recognition processing unit to a control means. Effect of the Invention

[0008] According to the present invention, the imaging results obtained by the component recognition camera and the board recognition camera can be appropriately recognized and processed. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a plan view of a component mounting apparatus according to an embodiment of the present invention; [Diagram 2] FIG. 1 is a configuration explanatory diagram of a component mounting device according to an embodiment of the present invention; [Diagram 3] FIG. 1 is a configuration explanatory diagram of a component recognition camera provided in a component mounting device according to an embodiment of the present invention; [Figure 4] FIG. 1 is a configuration explanatory diagram of a board recognition camera provided in a component mounting device according to an embodiment of the present invention; [Diagram 5] FIG. 1 is a block diagram showing a configuration of a control system of a component mounting apparatus according to an embodiment of the present invention. [Figure 6] FIG. 2 is a flow diagram of an imaging processing method in an imaging unit included in a component mounting apparatus according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] An embodiment of the present invention will be described in detail below with reference to the drawings. The configurations, shapes, etc. described below are examples for explanation, and can be appropriately changed according to the specifications of the component mounting device, the component recognition camera, and the board recognition camera. In the following, the same reference numerals are used for corresponding elements in all the drawings, and duplicated explanations are omitted. In FIG. 1 and in a part described later, the X-axis (left and right direction in FIG. 1) in the board transport direction and the Y-axis (up and down direction in FIG. 1) perpendicular to the board transport direction are shown as two axes perpendicular to each other in the horizontal plane. In FIG. 2 and in a part described later, the Z-axis (up and down direction in FIG. 2) is shown as the height direction perpendicular to the horizontal plane.

[0011] First, the configuration of component mounting apparatus 1 will be described with reference to Figures 1 and 2. Component mounting apparatus 1 has a function of performing component mounting work by mounting components supplied from a component supply unit onto a board. Component mounting apparatus 1 is a 4-stage / 4-head component mounting apparatus that has four component supply units that supply components, four mounting work positions that hold boards, and four mounting heads that hold components and mount them on the board.

[0012] In Fig. 1, in the component mounting device 1, a first board transport lane L1 and a second board transport lane L2 are arranged apart in the Y-axis direction to transport a board 2 along the X-axis from upstream (left side of the paper) to downstream (right side of the paper). Hereinafter, in the Y-axis direction, the side where the first board transport lane L1 is arranged is referred to as the front (lower side of the paper), and the side where the second board transport lane L2 is arranged is referred to as the rear (upper side of the paper). Fig. 2 shows a schematic diagram of the upstream configuration of the component mounting device 1 as viewed from the downstream side.

[0013] 1 and 2, a first board transport lane L1 is disposed at the front and a second board transport lane L2 is disposed at the rear in the center of the upper part of the base 3. The first board transport lane L1 is provided with a pair of board transport conveyors K1 for transporting the board 2. The second board transport lane L2 is provided with a pair of board transport conveyors K2 for transporting the board 2. The first board transport lane L1 and the second board transport lane L2 are each provided with mounting work positions at two locations, upstream and downstream, for holding the board 2 on which components are to be mounted.

[0014] That is, a first mounting work position A1 is provided upstream of the first board transport lane L1, and a third mounting work position A3 is provided downstream. Also, a second mounting work position A2 is provided upstream of the second board transport lane L2, and a fourth mounting work position A4 is provided downstream. Hereinafter, unless there is a particular need to distinguish between them, the first mounting work position A1, the second mounting work position A2, the third mounting work position A3, and the fourth mounting work position A4 will simply be referred to as "mounting work positions A."

[0015] 1 and 2, a first component supply unit S1 is disposed upstream and a third component supply unit S3 is disposed downstream in front of the first board transport lane L1. A second component supply unit S2 is disposed upstream and a fourth component supply unit S4 is disposed downstream in front of the second board transport lane L2. Hereinafter, unless there is a need to distinguish between them, the first component supply unit S1, the second component supply unit S2, the third component supply unit S3, and the fourth component supply unit S4 will be referred to simply as "component supply units S."

[0016] In the component supply section S, a cart 5 with a plurality of component supply units 4 (tape feeders) already attached to the upper part is set. The cart 5 holds a reel 7 that stores a carrier tape 6 holding components in a wound state. The carrier tape 6 pulled out from the reel 7 is pitch-fed by the component supply unit 4, and the components held by the carrier tape 6 are supplied to the component supply position.

[0017] In FIG. 1, a Y-axis support section 8 extending along the Y-axis is disposed in the center of the upper surface of the base 3. A first Y-axis table 9A equipped with a linear motor and extending along the Y-axis is disposed in the upstream end of the upper surface of the base 3. A second Y-axis table 9B equipped with a linear motor and extending along the Y-axis is disposed in the downstream end of the upper surface of the base 3. Guide sections 10 extending along the Y-axis are disposed in opposing positions on the first Y-axis table 9A and the Y-axis support section 8. Also, guide sections 10 extending along the Y-axis are disposed in opposing positions on the second Y-axis table 9B and the Y-axis support section 8.

[0018] Between the first Y-axis table 9A and the Y-axis support section 8, a first beam B1 equipped with a linear motor is disposed in front, and a second beam B2 equipped with a linear motor is disposed in the rear. The first beam B1 and the second beam B2 are driven by the linear motor of the first Y-axis table 9A to move back and forth along the guide section 10. In addition, between the second Y-axis table 9B and the Y-axis support section 8, a third beam B3 equipped with a linear motor is disposed in front, and a fourth beam B4 equipped with a linear motor is disposed in the rear. The third beam B3 and the fourth beam B4 are driven by the linear motor of the second Y-axis table 9B to move back and forth along the guide section 10.

[0019] 1 and 2, a first moving member E1 is coupled to the first beam B1, which is driven by a linear motor provided in the first beam B1 and moves left and right along the X-axis. A first component mounting head H1 and a first board recognition camera C1 are attached to the first moving member E1. A second moving member E2 is coupled to the second beam B2, which is driven by a linear motor provided in the second beam B2 and moves left and right along the X-axis. A second component mounting head H2 and a second board recognition camera C2 are attached to the second moving member E2.

[0020] 1, similarly, a third moving member (not shown) that is driven by a linear motor included in the third beam B3 and moves left and right along the X-axis is coupled to the third beam B3. A third component mounting head H3 and a third board recognition camera C3 are attached to the third moving member. In addition, a fourth moving member (not shown) that is driven by a linear motor included in the fourth beam B4 and moves left and right along the X-axis is coupled to the fourth beam B4. A fourth component mounting head H4 and a fourth board recognition camera C4 are attached to the fourth moving member.

[0021] Hereinafter, unless there is a need to distinguish between them, the first component mounting head H1, the second component mounting head H2, the third component mounting head H3, and the fourth component mounting head H4 will be simply referred to as "component mounting head H." In Fig. 2, the component mounting head H is equipped with a plurality of component holding nozzles 11 that hold components at their lower ends. The component mounting head H raises and lowers the component holding nozzles 11 along the Z axis and rotates them around the Z axis.

[0022] 1, the first board recognition camera C1 and the second board recognition camera C2 move above the board 2 held at the first mounting work position A1 upstream of the first board transport lane L1 or the second mounting work position A2 upstream of the second board transport lane L2, and capture an image of a board mark (not shown) provided on the board 2. The third board recognition camera C3 and the fourth board recognition camera C4 move above the board 2 held at the third mounting work position A3 downstream of the first board transport lane L1 or the fourth mounting work position A4 downstream of the second board transport lane L2, and capture an image of a board mark (not shown) provided on the board 2. The image capture result is subjected to image recognition, and the position of the board 2 is recognized (detected).

[0023] 1 and 2, on the upper surface of the base 3, a first component recognition camera G1 that captures an image of the upper side is disposed upstream between the first component supply unit S1 and the first board transport lane L1. A second component recognition camera G2 that captures an image of the upper side is disposed upstream between the second component supply unit S2 and the second board transport lane L2. A third component recognition camera G3 that captures an image of the upper side is disposed downstream between the third component supply unit S3 and the first board transport lane L1. A fourth component recognition camera G4 that captures an image of the upper side is disposed downstream between the fourth component supply unit S4 and the second board transport lane L2.

[0024] When the component mounting head H moves upward after picking up a component from the component supply unit S, the first component recognition camera G1, the second component recognition camera G2, the third component recognition camera G3, or the fourth component recognition camera G4 captures an image of the component held by the component holding nozzle 11. The captured image is subjected to image recognition, and the position and orientation of the component held by the component holding nozzle 11 are recognized (detected).

[0025] 1 and 2, a first operation unit P1 is disposed at a position operable by an operator at the front, and a second operation unit P2 is disposed at a position operable by an operator at the rear, on the Y-axis support unit 8. The first operation unit P1 and the second operation unit P2 are devices such as touch panels equipped with a monitor (display unit) that displays various information and screens, and a touch screen (input unit) that accepts input of various information.

[0026] In FIG. 2, the device control unit 12 is disposed on the base 3. The device control unit 12 is connected to each unit of the component mounting device 1, in addition to the first operation unit P1 and the second operation unit P2 (see FIG. 5). The device control unit 12 controls the board transport conveyors K1 and K2 to transport the board 2 from the upstream, hold the board 2 at the upstream and downstream mounting work positions A, respectively, and carry out the board 2 after the work is completed from the mounting work position A to the downstream. The device control unit 12 also controls the component supply unit 4, the first Y-axis table 9A, the second Y-axis table 9B, the first beam B1, the second beam B2, the third beam B3, the fourth beam B4, and the component mounting head H of the component supply unit S to perform a component mounting work of mounting components on the board 2 held at the mounting work position A.

[0027] Next, the configurations of the first component recognition camera G1, the second component recognition camera G2, the third component recognition camera G3, and the fourth component recognition camera G4 will be described with reference to Fig. 3. The first component recognition camera G1, the second component recognition camera G2, the third component recognition camera G3, and the fourth component recognition camera G4 are first imaging means G that capture images of components held by the component mounting head H from below. Here, the configuration of the first imaging means G will be described using the first component recognition camera G1 as an example. The first component recognition camera G1 (first imaging means G) is equipped with a component imaging unit 20 and an imaging processing unit Q.

[0028] A sensor board 23, on which an imaging element 22 such as a two-dimensional CMOS sensor is mounted, is disposed on the bottom 21a inside the housing 21 of the component imaging unit 20. A lens 24 is disposed above the sensor board 23 inside the housing 21. A component illumination unit 25 is disposed above the lens 24. A transparent member 26 is disposed on the upper portion 21b of the housing 21 by cutting out a part of the housing 21. The transparent member 26 is formed of a plate-shaped glass or the like that transmits light.

[0029] 3, the component illumination unit 25 includes a side illumination unit 25a, a coaxial illumination unit 25b, and a half mirror 25c. The side illumination unit 25a includes a plurality of LED chips and the like, and emits light that illuminates the imaging target from a downward diagonal direction. The coaxial illumination unit 25b includes a plurality of LED chips and the like, and is disposed below the side illumination unit 25a. The half mirror 25c is disposed at a position where the optical axis P of the imaging element 22 passes through, and reflects the light emitted from the coaxial illumination unit 25b in the direction of the imaging target above the half mirror 25c.

[0030] The component illumination unit 25 illuminates the imaging target by switching between side illumination by the side illumination unit 25a and coaxial illumination by the coaxial illumination unit 25b or by combining them according to the illumination conditions transmitted from the device control unit 12. That is, the component illumination unit 25 is a first illumination means that illuminates a component when the component imaging unit 20 of the first component recognition camera G1 (first imaging means G) images the component. The component imaging unit 20 images the component held by the component mounting head H from below according to the imaging conditions transmitted from the device control unit 12. The imaging result by the component imaging unit 20 is transmitted to the imaging processing unit Q. The imaging processing unit Q transmits the recognition result obtained by performing a recognition process on the imaging result, as described below, or the imaging result to the device control unit 12.

[0031] Next, the configurations of the first board recognition camera C1, the second board recognition camera C2, the third board recognition camera C3, and the fourth board recognition camera C4 will be described with reference to Fig. 4. The first board recognition camera C1, the second board recognition camera C2, the third board recognition camera C3, and the fourth board recognition camera C4 are second imaging means C that capture images of the board 2 from above. Here, the configuration of the second imaging means C will be described using the first board recognition camera C1 as an example. The first board recognition camera C1 (second imaging means C) is equipped with a board imaging unit 30.

[0032] The board imaging section 30 has a camera unit 32 and a board illumination section 33 installed inside a housing 31. The camera unit 32 is configured with an imaging element such as a two-dimensional CMOS sensor with an optical axis facing downward, a lens, etc. A window member 34 such as glass that transmits light is installed at the bottom of the housing 31 by cutting out a part of the housing 31. The board illumination section 33 has a side-emitting board illumination section 33a that illuminates the imaging target below from an upward diagonal direction, a coaxial board illumination section 33b, and a half mirror 33c that reflects light irradiated from the coaxial board illumination section 33b toward the imaging target below.

[0033] In Fig. 4, the board illumination unit 33 switches between side illumination by the side board illumination unit 33a and coaxial illumination by the coaxial board illumination unit 33b, or combines them, depending on the illumination conditions transmitted from the device control unit 12. That is, the board illumination unit 33 is a second illumination means that illuminates the board 2 when the board imaging unit 30 of the first board recognition camera C1 (second imaging means C) images the board 2. The board imaging unit 30 images the board 2 from above depending on the imaging conditions transmitted from the device control unit 12. The imaging result by the board imaging unit 30 is transmitted to an imaging processing unit Q provided in the first component recognition camera G1 (first imaging means G). The imaging processing unit Q transmits to the device control unit 12 a recognition result obtained by performing a recognition process on the imaging result, as described later, or the imaging result.

[0034] In this way, the first component recognition camera G1 (first imaging means) and the first board recognition camera C1 (second imaging means) equipped with the imaging processing unit Q constitute a first imaging unit R1 that captures images of the components and the board 2 (see FIG. 5). The first imaging unit R1 also performs recognition processing on the imaging results and transmits the recognition results or the imaging results to the device control unit 12. Similarly, the second component recognition camera G2 and the second board recognition camera C2 equipped with the imaging processing unit Q constitute a second imaging unit R2. The third component recognition camera G3 and the third board recognition camera C3 equipped with the imaging processing unit Q constitute a third imaging unit R3. The fourth component recognition camera G4 and the fourth board recognition camera C4 equipped with the imaging processing unit Q constitute a fourth imaging unit R4.

[0035] In this manner, the component mounting apparatus 1 includes a first imaging means G (first component recognition camera G1, second component recognition camera G2, third component recognition camera G3, fourth component recognition camera G4), a second imaging means C (first board recognition camera C1, second board recognition camera C2, third board recognition camera C3, fourth board recognition camera C4), and a plurality of imaging units (first imaging unit R1, second imaging unit R2, third imaging unit R3, fourth imaging unit R4) each including a recognition processing unit 51 and a communication unit 50. Hereinafter, unless there is a particular need to distinguish between them, the first imaging unit R1, the second imaging unit R2, the third imaging unit R3, and the fourth imaging unit R4 will be simply referred to as "imaging unit R."

[0036] Next, the configuration of the control system of the component mounting apparatus 1 will be described with reference to Fig. 5, focusing on the imaging process by the imaging units R (first imaging unit R1, second imaging unit R2, third imaging unit R3, fourth imaging unit R4). The device control unit 12 provided in the component mounting apparatus 1 includes a mounting processing unit 40 and a mounting storage unit 41. The mounting storage unit 41 is a storage device, and stores mounting data 42, captured image data 43, component position data 44, board position data 45, etc.

[0037] The mounting data 42 stores information necessary for component mounting work, such as the size of the board 2, the position (XY coordinates) of the board mark, the imaging conditions and lighting conditions of the board mark, the type of component to be mounted and the mounting position (XY coordinates), and the imaging conditions and lighting conditions for each type of component, for each type (board type) of the board 2. The captured image data 43 stores captured images (imaging results) of the board marks and components captured by the first imaging unit R1, the second imaging unit R2, the third imaging unit R3, and the fourth imaging unit R4. The captured images are displayed on the display unit of the first operation unit P1 or the second operation unit P2 when the component mounting work is stopped due to an error, for example.

[0038] 5, the component position data 44 stores the positions (recognition results) of the components held by the component holding nozzle 11, which have been recognized by the first imaging unit R1, the second imaging unit R2, the third imaging unit R3, and the fourth imaging unit R4. The board position data 45 stores the positions (recognition results) of the boards 2 held by the board transport conveyors K1 and K2, which have been recognized by the first imaging unit R1, the second imaging unit R2, the third imaging unit R3, and the fourth imaging unit R4.

[0039] The mounting processing unit 40 controls each unit of the component mounting device 1 to perform component mounting work based on the mounting data 42 stored in the mounting storage unit 41. The mounting processing unit 40 transmits the imaging conditions and illumination conditions of the components stored in the mounting data 42 to the first imaging unit R1, the second imaging unit R2, the third imaging unit R3, and the fourth imaging unit R4 according to the type of the components held by the component holding nozzle 11. In addition, the mounting processing unit 40 transmits the imaging conditions and illumination conditions of the board marks stored in the mounting data 42 to the first imaging unit R1, the second imaging unit R2, the third imaging unit R3, and the fourth imaging unit R4 according to the type of the board 2 held by the board transport conveyors K1 and K2.

[0040] In this way, the device control unit 12 (control means) transmits the imaging conditions of the first component recognition camera G1, the second component recognition camera G2, the third component recognition camera G3, and the fourth component recognition camera G4 (first imaging means G) and the imaging conditions of the first board recognition camera C1, the second board recognition camera C2, the third board recognition camera C3, and the fourth board recognition camera C4 (second imaging means C) to the first imaging unit R1, the second imaging unit R2, the third imaging unit R3, and the fourth imaging unit R4 (imaging unit R).

[0041] In addition, the device control unit 12 (control means) transmits the lighting conditions of the component lighting unit 25 (first lighting means) of the first component recognition camera G1, the second component recognition camera G2, the third component recognition camera G3, and the fourth component recognition camera G4 (first imaging means G) and the lighting conditions of the board lighting unit 33 (second lighting means) of the first board recognition camera C1, the second board recognition camera C2, the third board recognition camera C3, and the fourth board recognition camera C4 (second imaging means C) to the first imaging unit R1, the second imaging unit R2, the third imaging unit R3, and the fourth imaging unit R4 (imaging unit R).

[0042] 5, the first component recognition camera G1, the second component recognition camera G2, the third component recognition camera G3, and the fourth component recognition camera G4 (first imaging means G) each include an imaging processing unit Q. Here, the configuration of the imaging processing unit Q included in the imaging unit R will be described using the first component recognition camera G1 of the first imaging unit R1 as an example. The imaging processing unit Q includes a communication unit 50, a recognition processing unit 51, and an imaging storage unit 52.

[0043] The communication unit 50 has a function of transmitting and receiving various control information and data to and from the device control unit 12, the component imaging unit 20, the board imaging unit 30, the component illumination unit 25, and the board illumination unit 33. Of the imaging conditions received, the communication unit 50 transmits the imaging conditions of the component imaging unit 20 (imaging conditions of the first imaging means) to the component imaging unit 20. Of the imaging conditions received, the communication unit 50 transmits the imaging conditions of the board imaging unit 30 (imaging conditions of the second imaging means) to the board imaging unit 30. Of the illumination conditions received, the communication unit 50 transmits the illumination conditions of the component illumination unit 25 (illumination conditions of the first illumination means) to the part illumination unit 25. Of the illumination conditions received, the communication unit 50 transmits the illumination conditions of the board illumination unit 33 (illumination conditions of the second illumination means) to the board illumination unit 33.

[0044] 5, the component imaging unit 20 and the component illumination unit 25 image the components based on the received imaging conditions and illumination conditions, and transmit the imaging results to the communication unit 50. The board imaging unit 30 and the board illumination unit 33 image the board marks based on the received imaging conditions and illumination conditions, and transmit the imaging results to the communication unit 50. The communication unit 50 stores the received imaging results in the imaging storage unit 52. In this manner, the imaging storage unit 52 is a storage device that temporarily stores the imaging results captured by the component imaging unit 20 and the board imaging unit 30. The recognition processing unit 51 performs recognition processing on the imaging results stored in the imaging storage unit 52 based on a preset calculation procedure (program).

[0045] Specifically, the recognition processing unit 51 performs recognition processing on the imaging results of the components imaged by the component imaging unit 20, and detects the position (recognition result) of the component held by the component holding nozzle 11. The recognition processing unit 51 also performs recognition processing on the imaging results of the board marks imaged by the board imaging unit 30, and detects the position (recognition result) of the board 2 held by the board transport conveyors K1, K2.

[0046] 5, in the first imaging unit R1, the component imaging section 20 of the first component recognition camera G1 and the board imaging section 30 of the first board recognition camera C1 do not simultaneously perform imaging processing. That is, in the first imaging unit R1, imaging of components and imaging of board marks are exclusive processes. That is, while the recognition processing section 51 is performing recognition processing on the imaging result of the component imaging section 20 (the imaging result of the first imaging means G), it does not perform recognition processing on the imaging result of the board imaging section 30 (the imaging result of the second imaging means C). Also, while the recognition processing section 51 is performing recognition processing on the imaging result of the board imaging section 30 (the imaging result of the second imaging means C), it does not perform recognition processing on the imaging result of the component imaging section 20 (the imaging result of the first imaging means G).

[0047] In this way, the recognition processing unit 51 does not need the processing power to simultaneously execute the recognition processing of the imaging results of the component imaging unit 20 and the recognition processing of the imaging results of the board imaging unit 30, but only needs to have the processing power to execute these processes sequentially. Therefore, the power consumption of the CPU, etc. of the recognition processing unit 51 can be reduced, and heat dissipation measures can be easily taken.

[0048] 5, when the recognition processing unit 51 performs recognition processing on the imaging result of the component imaging unit 20 (the imaging result of the first imaging means G), the communication unit 50 transmits the identification information of the component imaging unit 20 together with the recognition result (the position of the component held by the component holding nozzle 11) to the device control unit 12 (control means). The device control unit 12 stores the received recognition result in the mounting storage unit 41 as component position data 44.

[0049] Furthermore, when the recognition processing section 51 performs recognition processing on the imaging results of the board imaging section 30 (imaging results of the second imaging means C), the communication section 50 transmits the identification information of the board imaging section 30 together with the recognition results (the position of the board 2 held by the board transport conveyors K1, K2) to the device control section 12 (control means). The device control section 12 stores the received recognition results in the mounting memory section 41 as board position data 45. In this way, since only the recognition results recognized by the recognition processing section 51 of the imaging unit R are transmitted, the amount of data transmitted from the communication section 50 to the device control section 12 is small. Furthermore, there is no need for the device control section 12 to perform recognition processing on the imaging results.

[0050] 5, when a captured image is requested by the device control unit 12, the communication unit 50 transmits the imaging result of the component imaging unit 20 (the imaging result of the first imaging means G) to the device control unit 12 (control means) together with the identification information of the component imaging unit 20. The communication unit 50 also transmits the imaging result of the board imaging unit 30 (the imaging result of the second imaging means C) to the device control unit 12 (control means) together with the identification information of the board imaging unit 30. The device control unit 12 stores the received imaging result in the mounting storage unit 41 as captured image data 43.

[0051] In the above description, the imaging processing unit Q including the communication unit 50 and the recognition processing unit 51 in the imaging unit R (first imaging unit R1) is described as being installed in the first imaging means G (first component recognition camera G1). However, the installation location of the imaging processing unit Q is not limited to the first imaging means G. For example, the imaging processing unit Q may be installed in the second imaging means C (first board recognition camera C1) or the component mounting head H (first component mounting head H1), or may be installed in a location different from the first imaging means G, the second imaging means C, and the component mounting head H. Note that it is more advantageous to install the imaging processing unit Q in a location that does not move other than the moving parts such as the second imaging means C or the component mounting head H, since this does not increase the weight of the moving parts.

[0052] Thus, in the component mounting device 1, one of the first imaging means G (first component recognition camera G1, second component recognition camera G2, third component recognition camera G3, fourth component recognition camera G4) and the second imaging means C (first board recognition camera C1, second board recognition camera C2, third board recognition camera C3, fourth board recognition camera C4) is equipped with a recognition processing unit 51 that recognizes and processes the imaging results of the first imaging means G and also recognizes and processes the imaging results of the second imaging means C, and a communication unit 50 that transmits the recognition results recognized by the recognition processing unit 51 to the device control unit 12 (control means).

[0053] 6, an imaging processing method in the imaging units R (first imaging unit R1, second imaging unit R2, third imaging unit R3, and fourth imaging unit R4) included in the component mounting method for mounting components on the board 2 in the component mounting device 1 will be described. Here, the imaging processing method in the first imaging unit R1 will be described as an example.

[0054] 6, first, when the communication unit 50 receives an imaging command including imaging conditions and illumination conditions from the device control unit 12 (Yes in ST1), if the received imaging command is for the first component recognition camera G1 (Yes in ST2), the communication unit 50 transmits the imaging conditions to the component imaging unit 20 and the illumination conditions to the component illumination unit 25 (ST3). Next, the first component recognition camera G1 (first imaging means G) captures an image of the component held by the component holding nozzle 11 according to the received imaging conditions and illumination conditions (ST4: first imaging step). The imaging result is transmitted to the communication unit 50.

[0055] Furthermore, if the received imaging command is for the first board recognition camera C1 (second imaging means C) (No in ST2), the communication unit 50 transmits the imaging conditions to the board imaging unit 30 and the illumination conditions to the board illumination unit 33 (ST5). Next, the first board recognition camera C1 captures an image of the board mark on the board 2 held by the board transport conveyors K1, K2 according to the received imaging conditions and illumination conditions (ST6: second imaging step). The imaging result is transmitted to the communication unit 50.

[0056] 6, when the communication unit 50 receives the imaging result (Yes in ST7), it stores the received imaging result in the imaging storage unit 52 (ST8). If the next imaging command received is to transmit the captured image (No in ST9), the communication unit 50 transmits the imaging result together with the identification information of the imaging means that captured the image to the device control unit 12 (ST10).

[0057] If the received imaging command is a transmission of a recognition result (Yes in ST9), the recognition processing unit 51 executes a recognition process corresponding to the imaging result. That is, if the imaging result is an imaging result captured by the first component recognition camera G1 (first imaging means G) (Yes in ST11), the recognition processing unit 51 recognizes (detects) the position of the component held by the component holding nozzle 11 from the imaging result (ST12: first recognition processing step). Also, if the imaging result is an imaging result captured by the first board recognition camera C1 (second imaging means C) (No in ST11), the recognition processing unit 51 recognizes (detects) the position of the board 2 held by the board transport conveyors K1 and K2 from the imaging result (ST13: second recognition processing step).

[0058] In FIG. 6, the communication section 50 then transmits the recognition result together with the identification information of the imaging means that captured the image to the device control section 12 (ST14: transmission step).

[0059] Thus, the component mounting method (imaging processing method) of this embodiment includes a first imaging process (ST4) of imaging the components held by the component holding nozzle 11 using the first imaging means G (first component recognition camera G1, second component recognition camera G2, third component recognition camera G3, fourth component recognition camera G4), a second imaging process (ST6) of imaging the board 2 held by the board transport conveyors K1, K2 using the second imaging means C (first board recognition camera C1, second board recognition camera C2, third board recognition camera C3, fourth board recognition camera C4), recognition processing processes (ST12, ST13) of recognition processing of either the imaging result of the first imaging means G or the imaging result of the second imaging means C by the recognition processing unit 51, and a transmission process (ST14) of transmitting the recognition result recognized by the recognition processing unit 51 to the device control unit 12 (control means).

[0060] This allows the imaging results from the component recognition cameras (first component recognition camera G1, second component recognition camera G2, third component recognition camera G3, fourth component recognition camera G4) and the board recognition cameras (first board recognition camera C1, second board recognition camera C2, third board recognition camera C3, fourth board recognition camera C4) to be properly recognized and processed.

[0061] As described above, the component mounting device 1 of this embodiment that mounts components on the board 2 includes a first imaging means G (first component recognition camera G1, second component recognition camera G2, third component recognition camera G3, and fourth component recognition camera G4) that images the components, a second imaging means C (first board recognition camera C1, second board recognition camera C2, third board recognition camera C3, and fourth board recognition camera C4) that images the board 2, and a control means (device control unit 12). One of the first imaging means G and the second imaging means C includes a recognition processing unit 51 that performs recognition processing on the imaging result of the first imaging means G and also performs recognition processing on the imaging result of the second imaging means C, and a communication unit 50 that transmits the recognition result recognized by the recognition processing unit 51 to the control means.

[0062] This allows the imaging results from the component recognition cameras (first component recognition camera G1, second component recognition camera G2, third component recognition camera G3, fourth component recognition camera G4) and the board recognition cameras (first board recognition camera C1, second board recognition camera C2, third board recognition camera C3, fourth board recognition camera C4) to be properly recognized and processed. [Industrial Applicability]

[0063] INDUSTRIAL APPLICABILITY The component mounting apparatus and component mounting method of the present invention have the effect of being able to appropriately recognize and process the image capture results obtained by the component recognition camera and the board recognition camera, and are useful in the field of mounting components onto boards. [Explanation of symbols]

[0064] 1. Component mounting equipment 2. Board 12 Device control section (control means) 25 Component lighting unit (first lighting means) 33 Substrate illumination unit (second illumination means) C. Second imaging means C1 First board recognition camera C2 Second board recognition camera C3 3rd board recognition camera C4 4th board recognition camera G First imaging means G1 1st part recognition camera G2 2nd part recognition camera G3 3rd part recognition camera G4 4th part recognition camera R Imaging unit R1 First imaging unit R2 Second imaging unit R3 3rd imaging unit R4 4th imaging unit

Claims

1. In a component mounting device that mounts components on a board, a first imaging means for imaging the component; A second imaging means for imaging the substrate; A control means; Equipped with One of the first imaging means and the second imaging means is a recognition processing unit that performs recognition processing on an imaging result of the first imaging means and recognizes and processes an imaging result of the second imaging means; a communication unit that transmits a recognition result obtained by the recognition processing unit to the control means.

2. The communication unit is When the recognition processing unit has recognized and processed the image capturing result of the first image capturing unit, it transmits identification information of the first image capturing unit together with the recognition result to the control unit; 2. The component mounting device according to claim 1, wherein when the recognition processing unit has performed recognition processing on the imaging result of the second imaging unit, identification information of the second imaging unit is transmitted to the control unit together with the recognition result.

3. The communication unit is transmitting an imaging result of the first imaging means together with identification information of the first imaging means to the control means; 2. The component mounting apparatus according to claim 1, wherein the imaging result of said second imaging means is transmitted to said control means together with identification information of said second imaging means.

4. The control means transmits imaging conditions of the first imaging means and imaging conditions of the second imaging means to the communication unit, 2. The component mounting device according to claim 1, wherein the communication unit transmits imaging conditions of the first imaging means among the received imaging conditions to the first imaging means, and transmits imaging conditions of the second imaging means among the received imaging conditions to the second imaging means.

5. a first illumination means for illuminating the component when the first imaging means images the component; and a second illumination means for illuminating the substrate when the second imaging means images the substrate, the control means transmits the lighting conditions of the first lighting means and the lighting conditions of the second lighting means to the communication unit; 2. The component mounting device according to claim 1, wherein the communication unit transmits an illumination condition of the first illumination means among the received illumination conditions to the first illumination means, and transmits an illumination condition of the second illumination means among the received illumination conditions to the second illumination means.

6. The recognition processing unit is When the imaging result of the first imaging means is being recognized and processed, the imaging result of the second imaging means is not being recognized and processed; 2. The component mounting device according to claim 1, wherein while the imaging result of said second imaging means is being subjected to recognition processing, the imaging result of said first imaging means is not being subjected to recognition processing.

7. The component mounting device according to claim 1 , further comprising a plurality of imaging units each including the first imaging means, the second imaging means, the recognition processing unit, and the communication unit.

8. A component mounting method for mounting a component on a substrate, comprising the steps of: a first imaging step of imaging the component by a first imaging means; a second imaging step of imaging the substrate by a second imaging means; a recognition processing step of performing recognition processing on either the imaging result of the first imaging means or the imaging result of the second imaging means by a recognition processing unit; A transmitting step of transmitting a recognition result obtained by the recognition processing unit to a control means.

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