Substrate processing apparatus, information processing method and storage medium

Abstract

To provide a substrate processing apparatus in which an abnormality factor related to supply of a process liquid can be particularly and accurately identified.SOLUTION: An application and development apparatus comprises: a removal liquid nozzle that discharges a removal liquid to a peripheral part of a substrate; a flow channel that is a process liquid supply channel flowing the removal liquid between a supply source and a removal liquid nozzle of the removal liquid; an imaging unit of an inspection unit that images the peripheral part of the substrate; a variety of sensors that are provided in the flow channel and function as observation units which observe a flowing state of the removal liquid in the flow channel; and an analysis unit that identifies an abnormality factor related to supply of the removal liquid to the substrate W on the basis of an image imaged by an imaging unit 57 of the inspection unit and results observed by the variety of sensors.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present disclosure relates to a substrate processing apparatus, an information processing method, and a storage medium. [Background technology]

[0002] Patent Document 1 describes a method of treating a semiconductor wafer for adjustment with a treatment liquid in a coating module, and then transporting the wafer to an imaging module to image the outer end surface and the back surface of the semiconductor wafer. Patent Document 1 also discloses a method of determining whether the height dimension of the outer edge of the coating film relative to the inner edge of the bevel portion is within the allowable range based on the imaging result, and adjusting the rotation speed of the coating module if it is not within the allowable range. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2019-96669 A Summary of the Invention [Problem to be solved by the invention]

[0004] The present disclosure provides a substrate processing apparatus capable of identifying an abnormality factor relating to the supply of a processing liquid in detail and accurately. [Means for solving the problem]

[0005] A substrate processing apparatus according to one aspect of the present disclosure includes a nozzle that ejects a processing liquid onto a peripheral portion of a substrate, a processing liquid supply path through which the processing liquid flows between a processing liquid supply source and the nozzle, an imaging unit that images the peripheral portion of the substrate, an observation unit provided in the processing liquid supply path that observes the flow state of the processing liquid in the processing liquid supply path, and an analysis unit that identifies abnormal factors related to the supply of the processing liquid to the substrate based on the image captured by the imaging unit and the observation results by the observation unit. Effect of the Invention

[0006] According to the present disclosure, it is possible to provide a substrate processing apparatus capable of identifying an abnormality cause relating to the supply of a processing liquid in detail and accurately. [Brief description of the drawings]

[0007] [Figure 1] 1 is a schematic diagram illustrating a schematic configuration of a substrate processing system; [Diagram 2] FIG. 2 is a schematic diagram illustrating a schematic configuration of a coating unit. [Diagram 3] 13A and 13B are diagrams illustrating a monitoring configuration in a processing liquid supply path. [Figure 4] FIG. 2 is a schematic diagram illustrating a schematic configuration of an inspection unit. [Diagram 5] 4 is a schematic diagram illustrating a functional configuration of a control unit; FIG. [Figure 6] FIG. 1 is a diagram illustrating splash and roughness, which are specific examples of defect modes. [Figure 7] FIG. 13 is a diagram for explaining how defect modes are separated; [Figure 8] FIG. 1 is a diagram illustrating monitoring using a flow meter. [Figure 9] FIG. 13 is a diagram illustrating monitoring using a liquid pressure sensor. [Figure 10] FIG. 1 is a diagram illustrating monitoring using a surface potential meter. [Figure 11] 4 is a schematic diagram illustrating a hardware configuration of a control unit. FIG. [Figure 12] 13 is a flowchart showing a defect solving process procedure when splash occurs due to rebound from a cup. [Figure 13] 13 is a flowchart showing a defect solving process procedure when splash occurs due to an ejection abnormality. [Figure 14] 11 is a flowchart showing a procedure for solving a defect when roughness occurs. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0008] Hereinafter, the embodiments will be described in detail with reference to the drawings. In the description, the same elements or elements having the same functions are denoted by the same reference numerals, and duplicated description will be omitted.

[0009] [Substrate Processing System] The substrate processing system 1 is a system that performs the processes of forming a photosensitive film on a substrate, exposing the photosensitive film to light, and developing the photosensitive film. Examples of substrates to be processed include semiconductor wafers, glass substrates, mask substrates, and FPDs (Flat Panel Displays). The substrates also include those on which a film or the like has been formed in a previous process on a semiconductor wafer or the like.

[0010] As shown in FIG. 1, the substrate processing system 1 includes a coating / developing apparatus 2 and an exposure apparatus 3. The exposure apparatus 3 performs an exposure process on a resist film (photosensitive coating) formed on a substrate W. The substrate W is, for example, circular, and has a position indicator (for example, a notch) on its periphery that serves as a reference for its position in the circumferential direction. Specifically, the exposure apparatus 3 irradiates an energy beam onto an exposure target portion of the resist film by a method such as immersion exposure. The coating / developing apparatus 2 performs a process of forming a resist film on the surface of the substrate W before the exposure process by the exposure apparatus 3, and performs a development process on the resist film after the exposure process.

[0011] [Substrate Processing Apparatus] The following describes the configuration of the coating and developing apparatus 2 as an example of the substrate processing apparatus. The coating and developing apparatus 2 includes a carrier block 4, a processing block 5, an interface block 6, and a control unit 100.

[0012] The carrier block 4 introduces the substrate W into the coating and developing apparatus 2 and removes the substrate W from the coating and developing apparatus 2. For example, the carrier block 4 can support a plurality of carriers C (accommodation sections) for the substrates W and has a built-in transfer arm A1. The carrier C accommodates, for example, a plurality of circular substrates W. The transfer arm A1 removes the substrate W from the carrier C and transfers it to the processing block 5, and receives the substrate W from the processing block 5 and returns it into the carrier C.

[0013] The processing block 5 has a plurality of processing modules 11, 12, 13, and 14. The processing module 11 incorporates a plurality of coating units U1, a plurality of thermal processing units U2, and a transport arm A3 for transporting substrates W to these units.

[0014] The processing module 11 forms an underlayer film on the surface of the substrate W using a coating unit U1 and a thermal processing unit U2. The coating unit U1 applies a processing liquid for forming an underlayer film onto the substrate W. The thermal processing unit U2 performs various thermal processes associated with the formation of the underlayer film. The thermal processing unit U2 has, for example, a built-in hot plate and a cooling plate, and performs thermal processing by heating the substrate W with the hot plate and cooling the heated substrate W with the cooling plate.

[0015] The processing module 12 (film forming processing section) incorporates a plurality of coating units U1, a plurality of heat treatment units U2, a plurality of inspection units U3, and a transport arm A3 that transports the substrate W to these units. The processing module 12 forms a resist film on the underlayer film using the coating unit U1 and the heat treatment unit U2. The coating unit U1 forms a coating on the surface of the substrate W by applying a processing liquid for forming a resist film onto the underlayer film. Hereinafter, this coating is referred to as a "pre-baked resist film." The heat treatment unit U2 performs various heat treatments associated with the formation of the resist film. As a result, the pre-baked resist film becomes a resist film.

[0016] The coating unit U1 is configured to remove at least a portion of the resist film (specifically, the peripheral portion of the substrate W). Removing at least a portion of the resist film includes removing a portion of the pre-baked resist film prior to the heat treatment by the heat treatment unit U2. For example, the coating unit U1 forms a pre-baked resist film on the surface of the substrate W, and then supplies a removing liquid to the peripheral portion of the substrate W to remove the peripheral portion of the pre-baked resist film.

[0017] The inspection unit U3 performs processing to inspect the state of the front surface Wa (see FIG. 2) of the substrate W. For example, the inspection unit U3 acquires information indicating the state of the front surface Wa of the substrate W. The information indicating the state of the front surface Wa includes information on the portion of the substrate W from which the resist film has been removed (the peripheral portion of the substrate W).

[0018] The processing module 13 incorporates a plurality of coating units U1, a plurality of thermal processing units U2, and a transport arm A3 for transporting the substrate W to these units. The processing module 13 forms an upper layer film on the resist film using the coating units U1 and the thermal processing units U2. The coating units U1 of the processing module 13 apply a liquid for forming an upper layer film onto the resist film. The thermal processing unit U2 of the processing module 13 performs various thermal processes associated with the formation of the upper layer film.

[0019] The processing module 14 incorporates a plurality of developing units U4, a plurality of thermal processing units U5, and a transport arm A3 for transporting the substrate W to these units. The processing module 14 performs development processing of the resist film after exposure using the developing unit U4 and the thermal processing unit U5. The developing unit U4 performs development processing of the resist film by applying a developer onto the surface of the exposed substrate W and then rinsing it off with a rinsing liquid. The thermal processing unit U5 performs various types of thermal processing associated with the development processing. Specific examples of thermal processing include a heating process before the development processing (PEB: Post Exposure Bake), a heating process after the development processing (PB: Post Bake), etc.

[0020] A shelf unit U10 is provided on the carrier block 4 side in the processing block 5. The shelf unit U10 is divided into a plurality of cells arranged in the vertical direction. A lift arm A7 is provided near the shelf unit U10. The lift arm A7 raises and lowers the substrate W between the cells of the shelf unit U10.

[0021] A shelf unit U11 is provided on the interface block 6 side in the processing block 5. The shelf unit U11 is partitioned into a plurality of cells arranged in the vertical direction.

[0022] The interface block 6 transfers the substrate W to and from the exposure apparatus 3. For example, the interface block 6 has a built-in transfer arm A8, and is connected to the exposure apparatus 3. The transfer arm A8 transfers the substrate W placed on the shelf unit U11 to the exposure apparatus 3, receives the substrate W from the exposure apparatus 3, and returns it to the shelf unit U11.

[0023] The control unit 100 controls each element included in the coating and developing apparatus 2. Below, an example is given of a series of control procedures executed by the control unit 100 for one substrate W. For example, the control unit 100 first controls the transfer arm A1 to transport the substrate W in the carrier C to the shelf unit U10, and then controls the lift arm A7 to place the substrate W in a cell for the processing module 11.

[0024] Next, the control unit 100 controls the transport arm A3 to transport the substrate W from the shelf unit U10 to the coating unit U1 and heat treatment unit U2 in the processing module 11. The control unit 100 also controls the coating unit U1 and heat treatment unit U2 to form an underlayer film on the surface of the substrate W. Thereafter, the control unit 100 controls the transport arm A3 to return the substrate W with the underlayer film formed thereon to the shelf unit U10, and controls the lift arm A7 to place the substrate W in a cell for the processing module 12.

[0025] Next, the control unit 100 controls the transport arm A3 to transport the substrate W from the shelf unit U10 to the coating unit U1 and heat treatment unit U2 in the processing module 12. The control unit 100 also controls the coating unit U1 and heat treatment unit U2 to form a resist film on the underlying film of the substrate W. Furthermore, the control unit 100 controls the coating unit U1 to form the pre-baked resist film on the underlying film of the substrate W and to remove the peripheral portion of the pre-baked resist film, and controls the heat treatment unit U2 to subject the substrate W to heat treatment to turn the pre-baked resist film into a resist film.

[0026] Furthermore, the control unit 100 controls the transport arm A3 to transport the substrate W to the inspection unit U3, and obtains from the inspection unit U3 information indicating the surface condition of the substrate W. Thereafter, the control unit 100 controls the transport arm A3 to return the substrate W to the shelf unit U10, and controls the lift arm A7 to place the substrate W in a cell for the processing module 13.

[0027] Next, the control unit 100 controls the transport arm A3 to transport the substrate W from the shelf unit U10 to each unit in the processing module 13, and controls the coating unit U1 and the heat treatment unit U2 to form an upper layer film on the resist film on the substrate W. Thereafter, the control unit 100 controls the transport arm A3 to transport the substrate W to the shelf unit U11.

[0028] Next, the control unit 100 controls the delivery arm A8 to send the substrate W in the shelf unit U11 to the exposure apparatus 3. Thereafter, the control unit 100 controls the delivery arm A8 to receive the substrate W that has been subjected to the exposure process from the exposure apparatus 3 and place it in a cell for the processing module 14 in the shelf unit U11.

[0029] Next, the control unit 100 controls the transport arm A3 to transport the substrate W from the shelf unit U11 to the developing unit U4 and heat-treating unit U5 in the processing module 14, and controls the developing unit U4 and heat-treating unit U5 to perform development processing on the resist film on the substrate W. Thereafter, the control unit 100 controls the transport arm A3 to return the substrate W to the shelf unit U10, and controls the lifting arm A7 and delivery arm A1 to return the substrate W into the carrier C. This completes a series of control procedures for one substrate W.

[0030] [Coating unit] Next, a detailed description will be given of an example of the configuration of the coating unit U1 in the processing module 12. As described above, the coating unit U1 supplies a processing liquid for forming a resist film to the front surface Wa of the substrate W to form the pre-baked resist film. After forming the pre-baked resist film on the front surface Wa of the substrate W, the coating unit U1 supplies a removing liquid to the peripheral portion of the substrate W to remove the peripheral portion of the pre-baked resist film.

[0031] As shown in Fig. 2, the coating unit U1 has a rotary holder 20. The rotary holder 20 holds and rotates the substrate W. For example, the rotary holder 20 has a holder 21 and a rotary driver 22. The holder 21 is a spin chuck that supports the substrate W arranged horizontally with its front surface facing upward and holds the substrate W by suction (for example, vacuum suction). The rotary driver 22 uses, for example, an electric motor as a power source to rotate the holder 21 around a vertical center of rotation. This causes the substrate W to rotate.

[0032] A cup 220 is provided around the substrate W held by the holder 21, and the lower side of the cup 220 is exhausted via an exhaust pipe 221 and is connected to a drainage pipe 222. A circular plate 213 is provided on the lower side of the holder 21 so as to surround the shaft, and a ring-shaped mountain portion 214 having a mountain-shaped cross section is formed around the circular plate 213. A protruding piece 215 is provided at the top of the mountain portion 214 to prevent the mist flowing inside the cup 220 from flowing into the back side of the substrate W.

[0033] The coating unit U1 has a coating liquid nozzle 24 that discharges a coating liquid, and a solvent nozzle 25 that discharges a solvent that is a solvent for the coating liquid. The coating liquid nozzle 24 is connected to a coating liquid supply mechanism 242 via a flow path 241 equipped with an opening / closing valve V1. The solvent nozzle 25 is a nozzle used for pre-processing performed before discharging the coating liquid onto the substrate W, and is connected to a solvent supply mechanism 252 via a flow path 251 equipped with an opening / closing valve V2. The coating liquid nozzle 24 and the solvent nozzle 25 are configured to be freely movable between the center of the substrate W and a retracted position outside the cup 220 by a moving mechanism (not shown).

[0034] Furthermore, the coating unit U1 has a removing liquid nozzle 26, which is a nozzle for removing a film on the peripheral portion of the substrate W, a bevel cleaning nozzle 27 for removing a film on the bevel portion, and a back surface cleaning nozzle 28. The removing liquid nozzle 26 is an EBR (Edge Bead Removal) nozzle that discharges a removing liquid (processing liquid) onto the peripheral portion of the substrate W. The removing liquid nozzle 26 discharges the removing liquid onto the surface of the substrate W held by the holder 21 at a position inside the bevel portion, so that the removing liquid heads toward the downstream side in the rotation direction of the substrate W. The removing liquid nozzle 26 is formed, for example, in a straight tube shape, and its tip is opened as a discharge port for the removing liquid. The removing liquid nozzle 26 is configured to be freely movable between, for example, a processing position where the removing liquid is discharged onto the peripheral portion of the substrate W and a retreat position outside the cup 220 by a moving mechanism (not shown).

[0035] Bevel cleaning nozzle 27 ejects a removing solution from the back surface side of substrate W held by holder 21 toward the bevel portion. This bevel cleaning nozzle 27 is configured to be freely movable along a base 271, and base 271 is provided in a notch (not shown) formed in mountain-shaped portion 214, for example.

[0036] The back surface cleaning nozzle 28 ejects a cleaning liquid onto a back surface of the substrate W held by the holder 21 at a position inside the bevel portion. The back surface cleaning nozzle 28 is configured such that, for example, when the cleaning liquid is ejected toward the substrate W, the landing point of the cleaning liquid on the substrate W is, for example, 70 mm inside from the outer edge of the substrate W. For example, two each of the bevel cleaning nozzles 27 and the back surface cleaning nozzles 28 are provided in the coating unit U1.

[0037] In this example, the removing liquid and the cleaning liquid are both solvents for the coating film, and the removing liquid nozzle 26 is connected to the solvent supply mechanism 252 via a flow path 261 equipped with an on-off valve V3. In this manner, the flow path 261 is a supply path (processing liquid supply path) for the removing liquid, which is a processing liquid, and allows the removing liquid to flow between the solvent supply mechanism 252, which is a supply source of the removing liquid, and the removing liquid nozzle 26. In addition, the bevel cleaning nozzle 27 is connected to the solvent supply mechanism 252 via a flow path 275 equipped with an on-off valve V4. In addition, the back surface cleaning nozzle 28 is connected to the solvent supply mechanism 252 via a flow path 281 equipped with an on-off valve V5.

[0038] (Processing liquid supply path) A monitoring configuration in the flow path 261, which is a processing liquid supply path, will be described with reference to Fig. 3. In the flow path 261, for example, a pump 71 for pumping the removal liquid (processing liquid) from a supply source, a filter 72, and a valve 73 are arranged from the upstream side to the downstream side. That is, the removal liquid pumped by the pump 71 passes through the filter 72 and the valve 73 in an open state, and reaches the removal liquid nozzle 26 (see Fig. 2).

[0039] As described above, the removing liquid nozzle 26 discharges the removing liquid to the peripheral portion of the substrate W. The filter 72 is connected to a drain via a valve 74. The drain may be provided with a conductive ground part 75. The portion of the flow path 261 downstream of the valve 73 and upstream of the removing liquid nozzle 26 is connected to a drain via a valve 76. The drain may be provided with a conductive ground part 77.

[0040] The coating unit U1 is provided in a flow path 261, which is a processing liquid supply path, and includes various sensors 81, 82, 83, 84, 85, 86, and 90 (observation units) that observe the flow state of the removal liquid (processing liquid) in the flow path 261. The sensors 81 and 82 are sensors that observe the flow state of the removal liquid before and after the pump 71 provided in the flow path 261. The sensors 83 and 84 are sensors that observe the flow state of the removal liquid before and after the filter 72 provided in the flow path 261. The sensors 85 and 86 are sensors that observe the flow state of the removal liquid before and after the valve 73 provided in the flow path 261.

[0041] The sensors 81, 82, 83, 84, 85, and 86 may be, for example, any of a flow meter that measures the flow rate of the removal liquid, a liquid pressure sensor that measures the liquid pressure of the removal liquid, and a surface potential meter that measures the surface potential of the removal liquid. The sensors 81, 82, 83, 84, 85, and 86 transmit the observation results to the control unit 100. The sensor 90 is a sensor that observes the discharge (flow) state of the removal liquid discharged from the removal liquid nozzle 26 via the flow path 261, and is, for example, a small high-speed camera. When the sensor 90 is a small high-speed camera, it captures an image of the discharge state of the removal liquid nozzle 26 and transmits the image result to the control unit 100.

[0042] [Inspection unit] Next, an example of the configuration of the inspection unit U3 will be described in detail. The inspection unit U3 acquires image data as surface information indicating the state of the surface Wa by capturing an image of the surface Wa of the substrate W. As shown in FIG. 4, the inspection unit U3 has a holder 51, a rotation drive unit 52, a position index detector 53, and an imaging unit 57.

[0043] The holder 51 supports the substrate W arranged horizontally with its front surface Wa facing upward, and holds the substrate W by suction (e.g., vacuum suction). The rotation drive unit 52 rotates the holder 51 around a vertical center of rotation by a power source such as an electric motor. This causes the substrate W to rotate.

[0044] The position index detection unit 53 detects the notch of the substrate W. For example, the position index detection unit 53 has a light-projecting unit 55 and a light-receiving unit 56. The light-projecting unit 55 emits light toward the peripheral edge of the rotating substrate W. For example, the light-projecting unit 55 is disposed above the peripheral edge of the substrate W and emits light downward. The light-receiving unit 56 receives the light emitted by the light-projecting unit 55. For example, the light-receiving unit 56 is disposed below the peripheral edge of the substrate W so as to face the light-projecting unit 55.

[0045] The imaging unit 57 is a camera that images at least the peripheral portion of the front surface Wa of the substrate W. For example, the imaging unit 57 images the peripheral portion of the front surface Wa of the substrate W where no resist film is formed (where the pre-baked resist film has been removed). For example, the imaging unit 57 is disposed above the peripheral portion of the substrate W held by the holding unit 51 and faces downward. The imaging unit 57 transmits the imaging result to the control unit 100.

[0046] [Control Unit] The coating unit U1 and the inspection unit U3 described above are controlled by the control unit 100. The control procedure of the coating unit U1 and the inspection unit U3 by the control unit 100 includes causing the coating unit U1 to remove the peripheral portion of the resist film formed on the front surface Wa of the substrate W. Furthermore, the control procedure by the control unit 100 includes acquiring, from the inspection unit U3, a captured image of the peripheral portion of the substrate W after the removing liquid has been supplied. Furthermore, the control procedure by the control unit 100 includes acquiring, from the coating unit U1, an observation result of the flow state of the removing liquid in the flow path 261, which is a removing liquid (processing liquid) supply path. Furthermore, the control procedure by the control unit 100 includes identifying an abnormality factor related to the supply of the removing liquid to the substrate W based on the captured image and the observation result.

[0047] Identifying the cause of an abnormality related to the supply of the removal liquid means, when an abnormality occurs in the supply of the removal liquid, identifying which part is at fault and how the abnormality occurred.

[0048] A specific example of the configuration of the control unit 100 for controlling the coating unit U1 and the inspection unit U3 will be described below with reference to Fig. 5. As shown in Fig. 5, the control unit 100 has a transport control unit 111, a film formation control unit 112, an edge removal unit 113, a memory unit 114, and an analysis unit 115 as functional components (hereinafter referred to as "functional blocks").

[0049] The transport control unit 111 controls the transport arm A3 to transport the substrate W based on an operation program stored in the memory unit 114. The operation program for the transport arm A3 includes time-series instructions defined by at least one control parameter. Specific examples of the at least one control parameter include a transport target position of the substrate W and a moving speed to the transport target position.

[0050] The film formation control unit 112 controls the coating unit U1 based on the operation program stored in the storage unit 114 to form a pre-baked resist film on the surface of the substrate W. The edge removal unit 113 controls the coating unit U1 based on the operation program stored in the storage unit 114 to remove the edge portion of the pre-baked resist film.

[0051] The analysis section 115 identifies the cause of the abnormality related to the supply of the removing liquid to the substrate W based on the imaging result by the imaging section 57 (the captured image of the peripheral portion after the removing liquid has been supplied) and the observation results by the various sensors 81, 82, 83, 84, 85, 86, 90 of the coating unit U1.

[0052] The analysis unit 115 may first identify a defect mode based on, for example, each pixel value of a region on the inner periphery side of the substrate W relative to the peripheral region from which the pre-baked resist film has been removed in the image captured by the imaging unit 57. The inner periphery side region here refers to a region that is inside the peripheral region and from which the pre-baked resist film is assumed not to have been removed.

[0053] 6A and 6B are diagrams for explaining splash (FIG. 6A) and roughness (FIG. 6B), which are specific examples of defect modes. As shown in FIGS. 6A and 6B, in a state in which the pre-baked resist film at the peripheral portion has been removed by the removing liquid, a bevel portion BE, a peripheral portion PE from which the pre-baked resist film has been removed, and a resist portion RE are formed in this order from the outer periphery toward the inner periphery of the substrate W.

[0054] 6(a), due to some abnormality, a splash SP of the removing liquid is scattered on a part of the resist portion RE. Such a splash abnormality is one type of defect mode. Possible causes of the splash abnormality include, for example, the removal liquid bouncing off the cup 220 and splashing on the resist portion RE, or an abnormality in the flow state of the removing liquid in the flow path 261 (and thus in the discharge state from the removing liquid nozzle 26), etc.

[0055] 6(b), a roughness portion RO is formed at the boundary surface of the peripheral portion PE with the resist portion RE, where the surface is rough and uneven. Such a roughness abnormality is one type of defect mode. The cause of the roughness abnormality may be, for example, an abnormality in the flow state of the removing liquid in the flow path 261 (and thus in the discharge state from the removing liquid nozzle 26).

[0056] 7 is a diagram for explaining the defect mode separation performed by the analysis unit 115. The analysis unit 115 first separates the defect mode based on each pixel value of a region of the substrate W that is closer to the inner periphery than the peripheral region from which the pre-baked resist film has been removed in the image captured by the imaging unit 57. The analysis unit 115 separates the defect mode into splash anomaly, roughness anomaly, or other anomaly. When each pixel value of a region of the substrate W that is closer to the inner periphery than the peripheral region (resist portion RE in the example of FIG. 6(a)) in the captured image is a discrete value, the analysis unit 115 identifies the defect mode as splash anomaly (first defect mode).

[0057] When the pixel values ​​of the region (resist portion RE in the example of FIG. 6(b)) on the inner periphery side of the substrate W relative to the peripheral region in the captured image become continuous, the analysis unit 115 determines that the defect mode is a roughness abnormality (second defect mode). As described above, possible causes of the splash abnormality include the rebound of the removing liquid from the cup 220 or the flow state of the removing liquid in the flow path 261 (and thus the discharge state from the removing liquid nozzle 26). Also, possible causes of the roughness abnormality include the flow state of the removing liquid in the flow path 261 (and thus the discharge state from the removing liquid nozzle 26). When the analysis unit 115 cannot distinguish between a splash abnormality and a roughness abnormality, it determines that the defect mode is another abnormality.

[0058] When the analysis unit 115 determines that the defect mode is a splash anomaly based on the image captured by the imaging unit 57, and if splashing of the removal liquid from the cup 220 is suspected as the cause of the defect, the analysis unit 115 performs the following first defect solution process. In the first defect solution process, the analysis unit 115 determines whether a change has been made to the recipe for removing the peripheral portion. In the first defect solution process, the analysis unit 115 also determines whether a change has been made to the type of the cup 220, whether a change has been made to the solvent, whether there is a tendency for a splash anomaly to occur in the processing unit (module unit) for removing the peripheral portion, and the like.

[0059] When the recipe has been changed, the analysis unit 115 investigates the difference in the recipe in detail. When the type of the cup 220 has been changed, the analysis unit 115 investigates the dependency of the cup 220, when the type of the cup 220 has been changed, when the solvent has been changed, the analysis unit 115 considers recipe optimization for each type of solvent, and when there is a tendency for defects to occur for each module, the analysis unit 115 investigates the individual difference of the cup 220. When none of the above applies, the analysis unit 115 identifies the flow state of the removing liquid in the flow path 261 (and thus the discharge state from the removing liquid nozzle 26), which is another possible occurrence cause, as the occurrence cause. Note that the first defect resolution process may be performed entirely by a user (a user of the coating / developing apparatus 2) instead of by the analysis unit 115.

[0060] When the analysis unit 115 determines that the defect mode is a splash anomaly based on the image captured by the imaging unit 57 and suspects that the cause of the defect is the flow state of the removing liquid in the flow path 261 (and thus the discharge state from the removing liquid nozzle 26), the analysis unit 115 performs the following second defect resolution process. Similarly, when the defect mode is a roughness anomaly, the analysis unit 115 performs the following second defect resolution process. In the second defect resolution process, the analysis unit 115 identifies the cause of the anomaly (which part is bad and how) based on the type of the identified defect mode and the observation results from the various sensors 81, 82, 83, 84, 85, 86, 90 of the coating unit U1.

[0061] In this case, the analysis unit 115 may acquire the flow conditions before and after the pump 71 from the sensors 81 and 82, the flow conditions before and after the filter 72 from the sensors 83 and 84, and the flow conditions before and after the valve 73 from the sensors 85 and 86. The analysis unit 115 may identify an abnormality factor related to the pump 71 when the flow conditions acquired from the sensors 81 and 82 are abnormal. Furthermore, the analysis unit 115 may identify an abnormality factor related to the filter 72 when the flow conditions acquired from the sensors 83 and 84 are abnormal. Furthermore, the analysis unit 115 may identify an abnormality factor related to the valve 73 when the flow conditions acquired from the sensors 85 and 86 are abnormal.

[0062] For example, in the case where the various sensors 81, 82, 83, 84, 85, and 86 include flow meters, the analysis unit 115 may identify the cause of the abnormality based on whether or not the flow rate of the removal liquid measured by the flow meters is within a predetermined range. In the case where the flow rate of the removal liquid measured by the flow meters is outside the predetermined range, the analysis unit 115 determines that the flow condition of the component corresponding to the flow meter is poor.

[0063] FIG. 8 is a diagram for explaining monitoring using a flow meter. In FIG. 8(a) to FIG. 8(c), the horizontal axis indicates time and the vertical axis indicates the flow rate indicated by the flow meter, and the range of flow rates between two lines indicates the normal range of flow rates. FIG. 8(a) shows a normal waveform (a waveform in which the flow rate is normal) in the flow meter. In the normal waveform shown in FIG. 8(a), the flow rate indicated by the flow meter is within the normal range.

[0064] In contrast, in Fig. 8(b), the flow rate falls immediately after it reaches the normal range, and then continues to fall outside the normal range. In such a case, it is possible that the discharge rate fluctuates in the configuration that the flow meter corresponds to.

[0065] Also, in FIG. 8(c), the flow rate temporarily drops and falls outside the normal range. Such a temporary decrease in flow rate is considered to be due to, for example, the inclusion of bubbles in the configuration corresponding to the flow meter. When bubbles are in the nozzle, the liquid does not cut off well from the removal liquid nozzle 26 and the liquid accumulates at the tip of the removal liquid nozzle 26, making it more likely to drop during processing. Furthermore, removal liquid containing bubbles is more likely to become turbulent during processing and may enter further inward than expected.

[0066] When the flow rate of the flow meter is outside the normal range, the analysis unit 115 implements a predetermined countermeasure process for solving the defect on the configuration corresponding to the flow meter whose flow rate is outside the normal range. For example, when the measurement result of the flow meter of the sensors 83, 84 that measure the flow rate before and after the filter 72 is outside the normal range, the analysis unit 115 determines that the flow condition around the filter 72 is poor. In this case, the analysis unit 115 causes the drain and removal solution nozzle 26 connected to the filter 72 to be purged for a specific period of time.

[0067] The analysis unit 115 repeatedly performs purging until the flow rate of the flow meter falls within the normal range before processing the substrate W. If no change in the flow rate of the flow meter is observed even after repeatedly performing purging, the analysis unit 115 determines that there is a high possibility of a hardware malfunction. In this case, the transport processing of the substrate W is stopped.

[0068] For example, in a case where the various sensors 81, 82, 83, 84, 85, and 86 include hydraulic pressure sensors, the analysis unit 115 may identify the cause of the abnormality based on the difference in hydraulic pressure measured by a pair of hydraulic pressure sensors that measure hydraulic pressures before and after each component. Specifically, the analysis unit 115 may identify the cause of the abnormality based on whether the difference in hydraulic pressure measured by the pair of hydraulic pressure sensors is within a predetermined range. When the difference in hydraulic pressure measured by the pair of hydraulic pressure sensors is outside the predetermined range, the analysis unit 115 determines that the flow condition of the component corresponding to the pair of hydraulic pressure sensors is poor.

[0069] Fig. 9 is a diagram for explaining monitoring using hydraulic pressure sensors. In Fig. 9, the horizontal axis indicates time, the vertical axis indicates the difference in hydraulic pressure measured by a pair of hydraulic pressure sensors, and the dashed line indicates the threshold value of the hydraulic pressure difference. When the difference in hydraulic pressure measured by the pair of hydraulic pressure sensors is outside the normal range (above the threshold value) as shown in Fig. 9, the analysis unit 115 implements a predetermined countermeasure process for solving the defect on the configuration corresponding to the pair of hydraulic pressure sensors.

[0070] Now, for example, when the difference in liquid pressure measured by the liquid pressure sensors (a pair of liquid pressure sensors) of the sensors 83, 84 that measure the liquid pressure before and after the filter 72 is equal to or greater than a threshold value, the analysis unit 115 determines that the flow condition around the filter 72 is poor. Then, the analysis unit 115 performs purging for a specific period of time in the drain and removal liquid nozzle 26 connected to the filter 72. Before processing of the substrate W, the analysis unit 115 performs purging repeatedly until the difference in liquid pressure measured by the pair of liquid pressure sensors falls within the normal range. If the difference in liquid pressure measured by the pair of liquid pressure sensors does not become equal to or less than the threshold value even after repeated purging, the analysis unit 115 determines that there is a high possibility of a hardware malfunction. In this case, the transport process of the substrate W is stopped.

[0071] For example, in a case where the various sensors 81, 82, 83, 84, 85, and 86 include electrostatic potential meters, the analysis unit 115 may identify the cause of the abnormality based on the surface potential of the removal liquid measured by a pair of electrostatic potential meters that measure the surface potential of the removal liquid before and after each component. Specifically, the analysis unit 115 may identify the cause of the abnormality based on whether or not the difference in the surface potential of the removal liquid measured by the pair of electrostatic potential meters is within a predetermined range. When the difference in the surface potential measured by the pair of electrostatic potential meters is outside the predetermined range, the analysis unit 115 determines that the flow condition of the component corresponding to the pair of electrostatic potential meters is poor.

[0072] Fig. 10 is a diagram for explaining monitoring using a surface electrometer. In Fig. 10, the horizontal axis indicates time, the vertical axis indicates the difference (potential difference) between the surface potentials measured by a pair of surface electrometers, and the dashed line indicates the threshold value of the potential difference. When the potential difference measured by the pair of surface electrometers as shown in Fig. 10 is outside the normal range (above the threshold value), the analysis unit 115 implements a predetermined countermeasure process for solving the defect on the configuration corresponding to the pair of surface electrometers.

[0073] Consider now, for example, a case where the potential difference measured by the surface electrometers (a pair of surface electrometers) of the sensors 85, 86 that measure the surface potentials before and after the valve 73 is equal to or greater than the threshold value. In this case, the analysis unit 115 determines that the flow condition around the valve 73 is poor, performs static elimination at the drain ground part 77 connected to the valve 73, and monitors the static elimination condition for a certain period of time. Before processing the substrate W, the analysis unit 115 repeatedly performs static elimination until the potential difference falls within the normal range. If the potential difference does not become equal to or less than the threshold value even after repeated static elimination, the analysis unit 115 determines that there is a high possibility of a hardware malfunction. In this case, the transport process of the substrate W is stopped.

[0074] The analysis unit 115 may identify the cause of the abnormality based on, for example, the discharge (flow) state of the removal liquid discharged from the removal liquid nozzle 26, which is captured by the sensor 90, which is a small high-speed camera. For example, when the image captured by the sensor 90 shows a pool of the removal liquid when the removal liquid nozzle 26 starts to discharge or when the liquid runs out, the analysis unit 115 determines that the flow state of the removal liquid nozzle 26 is poor. In this case, the analysis unit 115 eliminates the pool of the removal liquid by adjusting the opening of a speed controller (speed control valve) associated with the removal liquid nozzle 26 (adjusting the discharge state).

[0075] The analysis unit 115 may notify a user (a user of the coating / developing apparatus 2) of the identified abnormality factor (which part is bad and how). In this case, the analysis unit 115 may notify the user of the abnormality factor by displaying the identified abnormality factor on a display device (not shown), such as a display.

[0076] Furthermore, the analysis unit 115 may acquire a process log of the observation results from the various sensors 81, 82, 83, 84, 85, 86, and 90 of the coating unit U1, and identify each of the abnormality causes related to a plurality of time periods by batch processing based on the process log.

[0077] Fig. 11 is a block diagram illustrating a hardware configuration of the control unit 100. The control unit 100 is configured by one or more control computers. As shown in Fig. 11, the control unit 100 has a circuit 190. The circuit 190 includes at least one processor 191, a memory 192, a storage 193, an input / output port 194, an input device 195, and a display device 196.

[0078] The storage 193 has a computer-readable storage medium such as a hard disk. The storage 193 stores a program for causing the control unit 100 to execute an information processing method of the substrate processing apparatus. For example, the storage 193 stores a program for causing the control unit 100 to configure each of the above-mentioned functional blocks.

[0079] The memory 192 temporarily stores the programs loaded from the storage medium of the storage 193 and the results of calculations by the processor 191. The processor 191 configures each of the functional modules described above by executing the programs in cooperation with the memory 192. The input / output port 194 inputs and outputs electrical signals between the transport arm A3, the coating unit U1, and the inspection unit U3 in response to commands from the processor 191.

[0080] The input device 195 and the display device 196 function as a user interface for the control unit 100. The input device 195 is, for example, a keyboard, and acquires information input by a user. The display device 196 includes, for example, a liquid crystal monitor, and is used to display information to the user. The display device 196 is used, for example, to display the above-mentioned factor information. The input device 195 and the display device 196 may be integrated as a so-called touch panel.

[0081] [Defect Resolution Procedure] Hereinafter, as an example of an information processing method of the substrate processing apparatus, a control procedure (defect resolution processing procedure) of the coating / developing apparatus 2 by the control unit 100 will be illustrated. First, a defect resolution processing procedure (see FIG. 12) will be described when the defect mode is identified as a splash anomaly and splashing of the removing liquid from the cup 220 is suspected as the cause of the defect. Next, a defect resolution processing procedure (see FIG. 13) will be described when the defect mode is identified as a splash anomaly and the flow state of the removing liquid in the flow path 261 (and thus the discharge state from the removing liquid nozzle 26) is suspected as the cause of the defect. Finally, a defect resolution processing procedure (see FIG. 14) will be described when the defect mode is a roughness anomaly. Note that a part or all of the processes shown in FIG. 12 may be performed by the user.

[0082] 12, when a splash anomaly occurs, the control unit 100 first determines whether or not a recipe change related to removal of the peripheral edge has been made (step S1). If a recipe change has been made, the control unit 100 investigates the difference between the recipe before and after the change (step S2).

[0083] On the other hand, if the recipe has not been changed, the control unit 100 determines whether or not the type of the cup 220 has been changed (step S3). If the type of the cup 220 has been changed, the control unit 100 investigates the dependency of the cup 220 on the splash abnormality (step S4).

[0084] On the other hand, if the type of cup 220 has not been changed, the control unit 100 determines whether or not the solvent has been changed (step S5). If the solvent has been changed, the control unit 100 performs recipe optimization for each solvent type.

[0085] On the other hand, if the solvent has not been changed, the control unit 100 determines whether or not there is a tendency for splash abnormalities to occur for each module (step S7). If there is a tendency for splash abnormalities to occur for each module, the control unit 100 investigates individual differences in the cups 220 (step S8).

[0086] On the other hand, if there is no tendency for an abnormality to occur for each module, the control unit 100 determines that it is necessary to investigate the cause of the abnormality in the flow state of the removal liquid in the flow path 261 (and thus in the discharge state from the removal liquid nozzle 26) (step S9). In this case, the process shown in FIG. 13 is performed.

[0087] 13, when a splash anomaly occurs, the control unit 100 first changes the discharge position of the removal liquid nozzle 26 outward by a predetermined amount and determines whether the behavior changes (whether the splash anomaly decreases) (step S11). If the behavior does not change, the control unit 100 checks the cup 220 (step S12).

[0088] On the other hand, if the behavior changes due to a change in the discharge position of the removal liquid nozzle 26, the control unit 100 determines whether the value of the flow meter or the liquid pressure sensor has changed (whether the value is outside the normal range) (step S13). If the value of the flow meter or the liquid pressure sensor is outside the normal range, the control unit 100 performs a purge process at the drain section to discharge bubbles and at the tip of the removal liquid nozzle 26 (step S14).

[0089] On the other hand, if the value of the flow meter or the liquid pressure sensor is not outside the normal range, the control unit 100 judges whether the value of the electrometer has not changed (whether the value is outside the normal range) (step S15). If the value of the electrometer is outside the normal range, the control unit 100 performs a static elimination process in the configuration installed on the drain side (step S16). In this case, the control unit 100 may wait for a certain period of time to elapse before monitoring the static elimination state.

[0090] On the other hand, if the value of the surface electrometer is not outside the normal range, the control unit 100 judges whether or not the image captured by the sensor 90, which is a small high-speed camera, when the removal liquid nozzle 26 runs out of liquid indicates an abnormality (step S17). If an abnormality is indicated, the control unit 100 automatically adjusts the opening of the speed controller (speed control valve) associated with the removal liquid nozzle 26 (step S18).

[0091] On the other hand, if the image when the removal liquid nozzle 26 runs out of liquid does not indicate an abnormality, the control unit 100 checks for other causes of the abnormality (for example, an abnormality related to the substrate W) (step S19).

[0092] The defect processing procedure shown in Fig. 14 (defect solution processing procedure when the defect mode is roughness abnormality) is generally similar to the defect processing procedure shown in Fig. 13. In detail, steps S21 to S27 in Fig. 14 are similar to steps S13 to S19 in Fig. 13. That is, in the defect solution processing procedure shown in Fig. 14, when a roughness abnormality occurs, first, the control unit 100 judges whether there is any change in the value of the flow meter or the liquid pressure sensor (whether the value is outside the normal range) (step S21). If the value of the flow meter or the liquid pressure sensor is outside the normal range, the control unit 100 performs a purge process at the drain unit or the tip of the removal liquid nozzle 26 to discharge bubbles (step S22).

[0093] On the other hand, if the value of the flow meter or the liquid pressure sensor is not outside the normal range, the control unit 100 judges whether there is a change in the value of the electrometer (whether the value is outside the normal range) (step S23). If the value of the electrometer is outside the normal range, the control unit 100 performs a static elimination process in the configuration installed on the drain side (step S24). In this case, the control unit 100 may wait for a certain period of time to elapse before monitoring the static elimination state.

[0094] On the other hand, if the value of the surface electrometer is not outside the normal range, the control unit 100 judges whether or not the image captured by the sensor 90, which is a small high-speed camera, when the removal liquid nozzle 26 runs out of liquid indicates an abnormality (step S25). If an abnormality is indicated, the control unit 100 automatically adjusts the opening of the speed controller (speed control valve) associated with the removal liquid nozzle 26 (step S26).

[0095] On the other hand, if the image when the removal liquid nozzle 26 runs out of liquid does not indicate an abnormality, the control unit 100 checks for other causes of the abnormality (for example, an abnormality related to the substrate W) (step S27).

[0096] [Effects of this embodiment] As described above, the coating and developing apparatus 2 (substrate processing apparatus) includes the removing liquid nozzle 26 that ejects the removing liquid onto the peripheral portion of the substrate W, and the flow path 261 that is a processing liquid supply path that allows the removing liquid to flow between the removing liquid supply source and the removing liquid nozzle 26. The coating and developing apparatus 2 also includes the imaging unit 57 of the inspection unit U3 that images the peripheral portion of the substrate W, and various sensors 81, 82, 83, 84, 85, 86, and 90 that are provided in the flow path 261 and serve as an observation unit that observes the flow state of the removing liquid in the flow path 261. The coating and developing apparatus 2 also includes an analysis unit 115 that identifies an abnormality factor related to the supply of the removing liquid to the substrate W, based on the image captured by the imaging unit 57 of the inspection unit U3 and the observation results by the various sensors 81, 82, 83, 84, 85, 86, and 90.

[0097] In the coating and developing apparatus 2 according to this embodiment, an abnormality factor related to the supply of the removing liquid to the substrate W is identified based on a captured image of the peripheral portion of the substrate W to which the removing liquid is supplied and an observation result showing the flow state of the removing liquid in the flow path 261. According to such a coating and developing apparatus 2, for example, an abnormality in the supply state of the removing liquid to the peripheral portion of the substrate W can be detected by the captured image, and the abnormality factor can be examined. According to the coating and developing apparatus 2, the observation result of the observation unit that is actually provided in the flow path 261 and observes the flow state of the removing liquid is taken into consideration, so that it is possible to appropriately identify which part in the flow path 261 is causing the abnormality in the supply state of the processing liquid. As described above, according to the coating and developing apparatus 2 according to this embodiment, an abnormality factor related to the supply of the removing liquid can be identified in detail and accurately (with high precision).

[0098] The imaging unit 57 may capture an image of the peripheral portion from which the film has been removed by the removing liquid, and the analysis unit 115 may identify a defect mode based on each pixel value of an area on the inner periphery of the substrate W from the area from which the film has been removed in the image, and identify the cause of the abnormality based on the identified defect mode and the above observation results. By taking into account each pixel value of the area on the inner periphery of the substrate W caused by the removing liquid, it is possible to appropriately detect defect modes such as the state of splashing of the removing liquid (occurrence of splash) and unevenness (occurrence of roughness) caused by uneven removal of the film by the removing liquid. By identifying the cause of the abnormality in consideration of such defect modes, it is possible to identify the cause of the abnormality with higher accuracy.

[0099] The defect mode may include, as its types, a first defect mode in which each pixel value is a discrete value and a second defect mode in which each pixel value is a continuous value. The analysis unit 115 may identify the type of defect mode and, based on the identified type of defect mode and the flow state before and after at least one of the components of the pump 71, the filter 72, and the valve 73, identify an abnormality factor related to each of the above components. When a defect (abnormality) is detected based on the captured image, if each pixel value has a discrete value, it is assumed that so-called splash (first defect mode) has occurred. Also, if each pixel value has a continuous value, it is assumed that so-called roughness (second defect mode) has occurred. In addition to such information, by acquiring the observation results of the flow state before and after each component of the flow path 261, it is possible to specify in detail the part where the abnormality has occurred while narrowing down the details of the defect mode, and it is possible to specify the abnormality factor with higher accuracy.

[0100] The analysis unit 115 may implement a predetermined countermeasure process determined for each identified abnormality cause, thereby making it possible to implement an appropriate countermeasure process according to the abnormality cause and to suitably resolve the abnormality related to the supply of the removal liquid.

[0101] The analysis unit 115 may notify a user (a user of the coating / developing apparatus 2) of the identified cause of the abnormality. This makes it possible to inform the user of the apparatus of the location where the abnormality has occurred, and to prompt the user to take action to resolve the abnormality.

[0102] The analysis unit 115 may acquire process logs of the observation results from the various sensors 81, 82, 83, 84, 85, 86, and 90, and identify the causes of anomalies related to multiple time periods by batch processing based on the process logs. This allows the causes of anomalies to be efficiently identified by batch processing.

[0103] The various sensors 81, 82, 83, 84, 85, and 86 may include a flow meter that measures the flow rate of the removal liquid, and the analysis unit 115 may identify the cause of the abnormality based on whether the flow rate of the removal liquid measured by the flow meter is within a predetermined range. This makes it possible to appropriately detect a decrease in the flow rate of the removal liquid, etc., and to identify the cause of the abnormality with high accuracy based on the detected information.

[0104] The various sensors 81, 82, 83, 84, 85, and 86 may include a pair of liquid pressure sensors, and the analysis unit 115 may identify the cause of the abnormality based on whether the difference in the liquid pressure of the removal liquid measured by the pair of liquid pressure sensors is within a predetermined range. This makes it possible to identify the cause of the abnormality with high accuracy based on the difference in liquid pressure before and after the various components.

[0105] The various sensors 81, 82, 83, 84, 85, and 86 may each include a pair of electrometers, and the analysis unit 115 may identify the cause of the abnormality based on whether or not the difference in the surface potential of the removal solution measured by the pair of electrometers is within a predetermined range. This allows the cause of the abnormality to be identified with high accuracy based on the difference in the surface potential before and after each configuration. [Explanation of symbols]

[0106] 2...coating / developing apparatus (substrate processing apparatus), 26...removal liquid nozzle (nozzle), 57...imaging section, 81, 82, 83, 84, 85, 86, 90...sensors (observation section), 115...analysis section, 261...flow path (processing liquid supply path), W...substrate.

Claims

1. A nozzle that discharges a processing liquid onto a peripheral portion of a substrate, a cup that receives the processing liquid discharged from the nozzle, an imaging unit that images the peripheral portion of the substrate, an analysis unit that identifies a defect mode and an abnormal factor related to the supply of the processing liquid to the substrate based on an image captured by the imaging unit, the imaging unit images an image of the peripheral portion from which a film has been removed by the processing liquid, when the analysis unit identifies that the defect mode is a first defect mode in which each pixel value in a region on the inner peripheral side of the substrate rather than the region from which the film has been removed in the image is a discrete value, the analysis unit identifies an abnormal factor based on information of a recipe related to the removal of the film on the peripheral portion or information of the cup, a substrate processing apparatus.

2. The substrate processing apparatus according to Claim 1, wherein the recipe information is information related to a change in the recipe.

3. The substrate processing apparatus according to Claim 1, wherein the recipe information is information related to a change in the type of the processing liquid.

4. The substrate processing apparatus according to Claim 1, wherein the cup information is information related to a change in the type of the cup.

5. The substrate processing apparatus according to Claim 1, wherein the cup information is information related to an individual difference of the cup.

6. A processing liquid supply path through which the processing liquid flows between a supply source of the processing liquid and the nozzle, an observation unit provided in the processing liquid supply path for observing a flow state of the processing liquid in the processing liquid supply path, when the analysis unit identifies that the defect mode is a second defect mode in which each pixel value in a region on the inner peripheral side of the substrate rather than the region from which the film has been removed in the image is a continuous value, the analysis unit identifies an abnormal factor based on an observation result of the observation unit. The substrate processing apparatus according to Claim 1.

7. The observation unit observes a flow state before and after at least one of a valve, a filter, and a pump provided in the processing liquid supply path, when the analysis unit identifies that the defect mode is the second defect mode, the analysis unit identifies the abnormal factor related to the component based on the flow state before and after the at least one component. The substrate processing apparatus according to Claim 6.

8. The substrate processing apparatus according to Claim 1, wherein the analysis unit performs a predetermined countermeasure process determined for each identified abnormal factor.

9. The substrate processing apparatus according to claim 1, wherein the analysis unit notifies the user of the substrate processing apparatus of the identified abnormal factor.

10. An information processing method for processing information of a substrate processing apparatus including a nozzle that discharges a processing liquid to a peripheral portion of a substrate and a cup that receives the processing liquid discharged from the nozzle, an imaging step of obtaining an imaging image of the peripheral portion of the substrate after the processing liquid is supplied; an analysis step of identifying a defect mode and an abnormal factor related to the supply of the processing liquid to the substrate based on the imaging image, wherein, in the analysis step, when it is identified that the defect mode is a first defect mode in which each pixel value is a discrete value based on each pixel value of a region on the inner peripheral side of the substrate rather than a region where a film is removed by the processing liquid in the image, the abnormal factor is identified based on information of a recipe related to the removal of the film at the peripheral portion or information of the cup. Information processing method.

11. The information of the recipe is information related to a change in the recipe, according to the information processing method of claim 10.

12. The information of the recipe is information related to a change in the type of the processing liquid, according to the information processing method of claim 10.

13. The information of the cup is information related to a change in the type of the cup, according to the information processing method of claim 10.

14. The information of the cup is information related to an individual difference of the cup, according to the information processing method of claim 10.

15. The substrate processing apparatus further includes a processing liquid supply path that allows the processing liquid to flow between a supply source of the processing liquid and the nozzle, and further includes an observation step of observing a flow state of the processing liquid in the processing liquid supply path, wherein, in the analysis step, when it is identified that the defect mode is a second defect mode in which each pixel value is a continuous value based on each pixel value of a region on the inner peripheral side of the substrate rather than a region where a film is removed by the processing liquid in the image, the abnormal factor is identified based on an observation result in the observation step, according to the information processing method of claim 10.

16. The observation step observes the flow state before and after at least one of a valve, a filter, and a pump provided in the processing liquid supply path. The information processing method according to claim 15, wherein when the analysis step identifies that the defect mode is the second defect mode, the abnormal factor related to the component is identified based on the flow states before and after the at least one component.

17. The information processing method according to claim 10, wherein the analysis step performs a predetermined countermeasure process defined for each of the identified abnormal factors.

18. The information processing method according to claim 10, wherein the analysis step notifies the identified abnormal factor to the user of the substrate processing apparatus.

19. A program for causing an apparatus to execute an information processing method, wherein the information processing method is an information processing method for processing information of a substrate processing apparatus including a nozzle that discharges a processing liquid to a peripheral portion of a substrate and a cup that receives the processing liquid discharged from the nozzle, an imaging step of acquiring an imaging image of the peripheral portion of the substrate after the processing liquid is supplied, including an analysis step of identifying a defect mode and an abnormal factor related to the supply of the processing liquid to the substrate based on the imaging image, wherein when the analysis step identifies that the defect mode is the first defect mode in which each pixel value is a discrete value based on each pixel value in a region on the inner peripheral side of the substrate rather than a region where the film is removed by the processing liquid in the image, the abnormal factor is identified based on information of a recipe related to the removal of the film at the peripheral portion or information of the cup. Program.

Images