Optoelectronic arrangement

Abstract

To monitor the space inside and / or outside a motor vehicle.SOLUTION: A monitoring system comprises a plurality of photoelectric sensor elements 30 adapted to generate a 3-dimensional mapping of objects in a space. The sensor elements are electrically connected to a substantially transparent carrier layer adapted to be disposed between first and second substantially transparent layers to form a substantially transparent laminate structure 20 for use in one or more windows and / or roof panel of a motor vehicle.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an optoelectronic arrangement in a substantially transparent laminate structure for use in glazing, particularly in vehicles.The present invention further relates to a photoelectronic sensor system for monitoring a space, particularly the interior or exterior of a motor vehicle, and for providing 3D mapping of objects in the space.

[0002] The present invention claims priority from German Patent Application No. 10 2019 133 448.9 (December 6, 2019), Danish Patent Application No. PA202070106 (February 21, 2020), German Patent Application No. 10 2020 123 227.6 (September 4, 2020), and German Patent Application No. 10 2020 123 229.2 (September 4, 2020), the disclosures of which are incorporated herein in their entireties. [Background technology]

[0003] Photoelectronic surveillance systems play an important role in today's automotive industry for safety applications and driver assistance. One area of ​​interest is the monitoring of the cabin or interior of the vehicle and also to determine various characteristics of the driver. The problem with deploying sensor systems for such applications is to place the systems within the different interiors in a way that is discrete yet has good line of sight.

[0004] In light of these problems, it is an object of the present invention to provide a sensor system capable of providing a 3D mapping of a space with unambiguous positioning regardless of the vehicle type. A further object is to provide such a sensor system that can be easily deployed in different vehicle types.

[0005] Additionally, there is a need to monitor and / or display information to vehicle occupants and outsiders, and this need extends to other partially or fully enclosed spaces such as buildings.

[0006] DE 10 2017 122 852 A1 discloses a cover for a motor vehicle roof, which comprises a layer stack. The layer stack comprises a planarly extending window pane, a planarly extending film and an adhesive layer arranged between the window pane and the film for fixing the film to the window pane. A plurality of micro-light-emitting diodes are arranged on the adhesive layer. DE 10 2017 122 852 A1 also discloses a motor vehicle including a motor vehicle roof with such a cover.

[0007] US Patent Application Publication No. 2019 / 0248122 discloses a method for manufacturing a composite window glass for an automobile. The method includes providing a first window glass and a second window glass. The method further includes disposing a plastic film between the first window glass and the second window glass, and disposing light emitting diodes (LEDs) on a surface of the plastic film. Furthermore, the method includes locally heating the plastic film to a liquid state at least in the area of ​​the LEDs by means of a heating source disposed on an outer surface of the first window glass or the second window glass or disposed away from the outer surface of the first window glass or the second window glass. Additionally, the method includes introducing the LEDs into the liquid-heated plastic film while displacing a predetermined volume of the plastic film, and the method includes laminating the first window glass and the second window glass with the intervening plastic film after introducing the LEDs into the plastic film.

[0008] WO 2019 / 186513 discloses laminated automobile glazing comprising an outer glass layer, an inner glass layer, at least one plastic interlayer between the outer and inner glass layers, and at least one camera system, the camera system being laminated between the glass layers as an integral permanent component of the laminate.

[0009] WO 2019 / 008493 discloses a vehicle laminate including an outer glass layer, at least an inner glass layer, at least one plastic bonding layer disposed between the outer glass layer and the inner glass layer, and at least one LED embedded in the plastic bonding layer. A wire is substantially embedded within the plastic bonding layer that forms a circuit for powering the LED.

[0010] It is an object of the present invention to provide an improved optoelectronic arrangement, in particular an at least partially transparent optoelectronic arrangement, which provides improved functionality. In some embodiments, the present invention also aims to integrate electronic or optoelectronic components, such as light sources and / or sensors, into at least partially transparent window panes, in particular of vehicles. Summary of the Invention [Problem to be solved by the invention]

[0011] The above and further objects are achieved in a surveillance system as defined in the accompanying paragraphs.

[0012] More specifically, the present invention resides in a surveillance system for monitoring an interior and / or exterior space of a motor vehicle, comprising a plurality of photoelectronic sensor elements adapted to generate a three-dimensional mapping of objects within the space, the sensor elements being electrically connected to a substantially transparent carrier layer (90) adapted to be disposed between a first substantially transparent layer and a second substantially transparent layer to form a substantially transparent laminate structure for use in one or more window and / or roof panels of the motor vehicle.

[0013] Providing multiple sensors on a carrier that can be integrated into a transparent laminate that serves as a window and / or roof panel means that the sensor system can be spread around a large clear surface of the car, which in turn allows sensors to be optimally positioned to view passenger positions inside the vehicle for safety applications, recognize the driver inside the vehicle to control vehicle start-up, or recognize the driver standing outside the vehicle to select driver preferences and control door locks.

[0014] The possible applications become even greater if, according to a preferred embodiment of the invention, the sensor elements are arranged on said carrier layer in a two-dimensional arrangement.

[0015] According to one embodiment of the present invention, the sensor element is configured to monitor the space using at least one of triangulation, structured light and Time of Flight (ToF).

[0016] Preferably the sensor elements are arranged so as to create a three dimensional detection zone on the interior and / or exterior of the vehicle when attached to the laminate structure of the vehicle.

[0017] According to one preferred embodiment, the sensor element is mounted on a carrier layer. In an alternative embodiment, the sensor element is embedded in the carrier layer, which allows the resulting stack to be thinner.

[0018] An adhesive layer may be provided between the carrier layer and at least one of the first and second layers. Alternatively, the carrier layer may act as an adhesive layer between the first and second layers.

[0019] Preferably, the carrier layer is flexible and comprises wiring for the power supply and signal carrier of the sensor. In this way, the sensor system can be easily deployed in different parts of the vehicle and adapted to different vehicle types. Also, the sensor system may occupy a large surface area if required.

[0020] In a preferred embodiment, the sensor includes photoelectronic emitting elements and photoelectronic detector elements, each photoelectronic detector element preferably including at least one lens configured to provide a directional field of view.

[0021] In a further advantageous embodiment, the sensor includes image processing and control circuitry for controlling at least one photoelectronic emitter element and / or photoelectronic detector element. Allowing for integration of the image processing and control circuitry in a stacked configuration further simplifies deployment of the system to different vehicle types.

[0022] In one particularly preferred embodiment of the invention, the sensor has a dimension of 500 μm or less, preferably 200 μm or less. Limiting the component to this size ensures that it is virtually imperceptible to vehicle occupants and allows the sensor to be placed anywhere on the window or roof panel.

[0023] The present invention further resides in a transparent laminate structure for use on the windows and / or roof panels of a motor vehicle equipped with a surveillance system as configured as above and as described below, and preferably in a motor vehicle equipped with such a transparent laminate structure on at least two of the side windows, rear window, front window and roof panel of the motor vehicle, ensuring sufficient coverage to enable effective 3D mapping of the interior.

[0024] In some embodiments of the present invention, an optoelectronic arrangement is proposed, for example for use in a transparent glazing element of a vehicle, the optoelectronic device comprising a substantially transparent carrier layer, at least one conductor layer including conductor paths provided on at least one side of the carrier layer, at least a plurality of LEDs arranged on the carrier layer and electrically coupled to the conductor paths on the conductor layer, and means for determining a temperature of at least one of the LEDs.

[0025] In some embodiments, the optoelectronic arrangement comprises means for adjusting operating parameters of the optoelectronic components and at least the LEDs in response to the determined temperature For example, the adjusting means may modify the current supplied to the LEDs to correct or modify the color of the LEDs and / or to extend the lifetime of the LEDs.

[0026] In one embodiment of the optoelectronic device, the means for determining the temperature of at least one LED comprises at least one temperature sensor arranged on at least one side of the carrier layer and electrically coupled to a conductor path on the conductor layer.

[0027] In one embodiment, a reflector is disposed around the temperature sensor to reflect heat and / or light away from the carrier layer.

[0028] In one embodiment of the invention, the distance between the temperature sensor and said at least one LED is at most 5 cm, preferably at most 1 cm, even more preferably at most 0.5 cm.

[0029] In one embodiment of the present invention, the means for determining a temperature of the at least one LED includes means for measuring a forward voltage (Vf) of the at least one LED.

[0030] In some embodiments of the present invention, the means for measuring the temperature of the at least one LED comprises means for measuring the electrical conductivity of a conductive path in the conductive layer.

[0031] In one embodiment of the present invention, the optoelectronic device includes at least one substantially transparent outer surface layer and at least one substantially transparent intermediate layer disposed between the carrier layer and the at least one outer surface layer.

[0032] In one embodiment of the invention the carrier layer is thermally insulating. In a further embodiment of the invention the carrier layer comprises two layers separated by a thermally insulating layer.

[0033] In one embodiment of the invention, multiple LEDs are disposed on both sides of the carrier layer.

[0034] In some embodiments of the present invention, at least one photodetector is attached to at least one side of the carrier layer to provide a signal indicative of the light intensity incident on the optoelectronic arrangement.

[0035] In one embodiment of the present invention, the optoelectronic arrangement includes a directional structure disposed over the photodetector for channeling light to the photodetector as a function of the direction of the received light.

[0036] In some embodiments of the present invention, the optoelectronic device includes a directional structure disposed over at least one LED, the directional structure configured to direct light from the LED in a predetermined direction.

[0037] The invention further resides in a carrier layer for use in a substantially transparent laminate structure forming a glazing element suitable for a vehicle, in a vehicle including such an optoelectronic arrangement, and in a method of operating an optoelectronic arrangement.

[0038] An embodiment of the invention is an optoelectronic arrangement for use in a transparent glazing element, for example in a vehicle, comprising at least one substantially transparent carrier layer, at least one conductor layer including conductor paths provided on at least one side of the carrier layer, at least one light-emitting element arranged on the carrier layer and electrically coupled to the conductor paths on the conductor layer, and at least one proximity sensor and / or touch sensor arranged on at least one of the carrier layers, which can be further coupled to a control module for controlling the operation of the at least one light-emitting element in response to information from the at least one proximity sensor and / or touch sensor. By controlling the one or more light-emitting elements in response to information from the proximity sensor and / or touch sensor, the optoelectronic arrangement becomes interactive and responds to movements towards the arrangement and possibly also to touches on the arrangement. Such an arrangement applies to automotive glazing elements such as windshields, side windows or roof panels, but also to static window advertising or transparent information planes.

[0039] In some embodiments, the proximity sensor includes at least one infrared emitter and at least one infrared detector.

[0040] Preferably, the touch sensor comprises a capacitive touch sensor.

[0041] In one embodiment of the present invention, the optoelectronic arrangement includes at least one substantially transparent carrier layer having conductor strips that function as a capacitive touch sensor.

[0042] In some embodiments of the present invention, the control unit is at least partially mounted on at least one carrier layer.

[0043] In a preferred embodiment of the present invention, the light emitting element comprises an LED, preferably a micro LED.

[0044] In some embodiments of the present invention, the light emitting element comprises a laser.

[0045] Preferably, the optoelectronic arrangement includes at least one ambient light detector mounted on the at least one carrier layer, and the control unit is configured to control the illuminance of the light-emitting element in response to a signal from the at least one ambient light detector.

[0046] In some embodiments of the present invention, at least one light-emitting element and at least one proximity sensor are arranged in groups, and the control unit is configured to control the operation of the light-emitting elements of each group in response to a signal from the at least one proximity sensor of the group.

[0047] In a preferred embodiment of the invention, the group includes at least one ambient light detector, and the control unit is configured to control the illumination intensity of the light emitting elements of the group in response to signals from the ambient light detector of the same group.

[0048] In some embodiments of the present invention, the optoelectronic arrangement includes a lens structure disposed over at least one of the proximity sensors.

[0049] In a preferred embodiment of the invention, at least one optical layer is bonded to a carrier layer over the light emitting elements to spread the light from each light emitting element into a light patch of a larger diameter than the light emitting element with substantially uniform illuminance.

[0050] In some embodiments, the optical layer includes an array of optical segments on the input face and an array of optical segments on the output face and on the output face, where the segments on the output face are larger than the segments on the input face.

[0051] Preferably, the lateral dimensions of the light emitting elements, proximity sensors and touch sensors are ≦300 μm.

[0052] In some embodiments, at least one carrier layer is flexible, and is preferably made of a thermoplastic.

[0053] Preferably, at least one conductor layer comprises a substantially transparent metal oxide, such as ITO.

[0054] Another aspect of the invention includes a vehicle equipped with at least one optoelectronic arrangement as claimed and described herein.

[0055] In some embodiments, the optoelectronic arrangement, laminate structure, or monitoring system includes a carrier layer, also referred to as a carrier film, and a front layer and a back layer, also referred to as a cover layer or outer layer. The carrier layer can be disposed between two cover layers. The carrier layer can carry at least one emitter element, also referred to as an LED, and / or at least one detector element, also referred to as a photodetector or temperature sensor. In some embodiments, the at least one emitter element and / or detector element can be partially or completely embedded in the carrier layer.

[0056] In some embodiments, the carrier layer is at least partially transparent and may comprise or consist of a material such as high or low polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polycarbonate (PC), (clear) polyimide (PI), polyurethane (PU), poly(methyl methacrylate) (PMMA), polycyclic aromatic hydrocarbons (PAK), or any other suitable material. In particular, the carrier layer may comprise or consist of an at least partially transparent plastic, in particular an at least partially transparent foil, in particular a flexible foil.

[0057] Each of the front and rear layers may be made of a glass material, a plastic material, and / or any other suitable material. Each of the front and rear layers may include only one layer or several layers of the same or different materials.

[0058] In some embodiments, the optoelectronic arrangement, or the monitoring system, further comprises at least one lamination layer, also referred to as a bonding layer, A first lamination layer can be disposed between the carrier layer and the front layer, and optionally a second lamination layer can be disposed between the carrier layer and the rear layer.

[0059] At least one laminate layer comprises: a layer of molten material, or Adhesive layers, in particular hot melt adhesive layers, Resins such as ethylene vinyl acetate (EVA) and polyvinyl butyral (PVB), or The ionomer-based systems may be formed by one of the following:

[0060] In some embodiments, the at least one laminate layer can encapsulate the carrier layer within the same layer. The at least one laminate layer can have the same height as the carrier layer, but the at least one laminate layer can also have a height that is different, in particular larger, than the height of the carrier layer. The at least one laminate layer can surround the carrier layer not only in the circumferential direction, since the carrier layer can be completely embedded in the at least one laminate layer.

[0061] In some embodiments, at least one laminate layer can be at least partially transparent. In some embodiments, at least one laminate layer can be blackened, resulting in an at least partially transparent laminate layer. When an optoelectronic arrangement includes more than one laminate layer, none of the laminate layers can be blackened, or one, selected, or all of the laminate layers can be blackened.

[0062] In some embodiments, at least one emitter element, in particular an LED, and / or detector element may be less than 300 μm, in particular less than 150 μm, such that due to their spatial extension, at least one emitter element and / or detector element is barely visible to the human eye.

[0063] In some embodiments, at least one radiator element is an LED. The LED can be called a mini-LED, which is a small LED, for example having an edge length of less than 200 μm, in particular less than 40 μm, in particular in the range of 200 μm to 10 μm. Another range is 150 μm to 40 μm.

[0064] LEDs may also be referred to as micro LEDs (also called μLEDs) or μLED chips, especially when the edge length is in the range of 100 μm to 10 μm. In some embodiments, the LEDs may have spatial dimensions of 90×150 μm, or the LEDs may have spatial dimensions of 75×125 μm.

[0065] A mini-LED or μLED chip can be an unpackaged semiconductor chip in some embodiments. Unpackaged can mean that the chip does not have a housing around its semiconductor layers, such as an unpackaged semiconductor die. In some embodiments, unpackaged can mean that the chip does not contain organic materials. Thus, an unpackaged device does not contain organic compounds that contain carbon in covalent bonds.

[0066] In some embodiments, each emitter element can include a mini LED or μLED chip configured to emit light of a selected color. In some embodiments, each emitter element can include one or more mini LED or μLED chips, such as, for example, an RGB pixel including three mini LED or μLED chips. An RGB pixel can emit light of, for example, red, green, and blue, as well as any mixed color.

[0067] In some embodiments, the RGB pixels may further include one or more integrated circuits (ICs), particularly miniature integrated circuits, for example as microintegrated circuits (μICs).

[0068] In some embodiments, the optoelectronic arrangement, stack or monitoring system comprises at least one conductor line, and preferably two conductor lines, also called conductor layers, in particular for supplying electrical energy and / or data signals to at least one emitter element and / or detector element.

[0069] In some embodiments, the carrier layer carries at least one conductor line, however, in some implementations, at least one laminate layer may carry at least one conductor line.

[0070] In some embodiments, the at least one conductor line may be a conductive material, such as, for example, copper. The at least one conductor line may be coated and / or blackened to reduce the reflectivity of the outer surface area of ​​the at least one conductor line. The coating may be, for example, a palladium or molybdenum coating. In some embodiments, the at least one conductor line may have a width in the range of 5 μm to 50 μm.

[0071] In some embodiments, at least one conductor wire can be formed as a conductive mesh, particularly a metal mesh.The mesh can be coated and / or blackened, particularly to reduce the reflectivity of the outer surface area of ​​the conductive mesh.The coating can be, for example, a palladium or molybdenum coating.

[0072] In some embodiments, the optoelectronic arrangement comprises a layer stack including a carrier layer and a first cover and a second cover. The carrier layer is in particular an intermediate layer arranged between the first cover layer and the second cover layer. At least one electronic or optoelectronic element, in particular an optoelectronic light source, is arranged on the carrier layer, and at least one layer of the layer stack, and preferably all layers of the layer stack, are at least partially transparent. The layer stack includes at least one conductive layer, which is arranged between two adjacent layers of the layer stack or embedded within the layers.

[0073] In some embodiments, the at least one conductive layer includes at least one conductive trace electrically connected to a contact pad of the optoelectronic light source. The at least one conductive layer can be, for example, a good electrically and thermally conductive material such as copper, silver, gold and aluminum. The at least one conductive layer, and in particular the at least one conductive trace, can be coated and / or blackened to reduce the reflectivity of the outer surface area of ​​the at least one conductive trace. The coating can be, for example, a palladium or molybdenum coating. In some embodiments, the at least one electrical trace can have a width in the range of 5 μm to 50 μm.

[0074] At least one conductive layer may include a conductive mesh, for example a metal mesh, in particular a copper mesh. The mesh may have nodes and interconnections between knots, and preferably at least a majority of the interconnections are uninterrupted. Thus, at least one conductive layer may be a structure comprising a plurality of conductive traces that are connected to each other.

[0075] The mesh can have a regular or irregular pattern, with irregular patterns being preferred since they can increase the transparency of the conductive layer, as they may be more difficult to perceive by the human eye.

[0076] In some embodiments, the conductive mesh is coated and / or blackened to reduce reflectivity, particularly on the outer surface area of ​​the conductive mesh. The coating can be, for example, a palladium or molybdenum coating.

[0077] At least some embodiments of the optoelectronic arrangements, laminate structures, or monitoring systems described herein can be placed on non-flat or curved surfaces, for example, on the exterior or interior of a vehicle or building. This is particularly possible because at least some embodiments of the optoelectronic arrangements, laminate structures, or monitoring systems described herein can be built on a layer structure that is flexible.

[0078] The invention therefore also relates to a larger entity, such as a vehicle or a building, equipped on its exterior or interior, in particular on its exterior or interior surface, with at least one optoelectronic arrangement, laminate or surveillance system.

[0079] The description using the exemplary embodiments does not limit the invention thereto, but rather the invention includes any novel feature and any combination of features, and in particular any combination of features in the claims, even if this feature or this combination itself is not explicitly recited in the claims or in the exemplary embodiments. [Brief description of the drawings]

[0080] The invention will now be explained in more detail with reference to the following drawings, which show exemplary embodiments. [Figure 1] 1 is a schematic diagram of a placement of sensors in a vehicle, according to one embodiment of the present invention; [Diagram 2] 2 illustrates a schematic representation of a detection field according to an embodiment of the present invention; [Diagram 3] 4 illustrates diagrammatically a detection field according to a further embodiment of the invention; [Figure 4] 4 illustrates a schematic representation of a detection field according to yet another embodiment of the present invention; [Diagram 5] 1 shows a schematic representation of a portion of a substantially transparent stack comprising a 3D sensor according to a first embodiment of the invention; [Figure 6] 13A-B show schematic diagrams of a portion of a substantially transparent laminate with a 3D sensor according to a further embodiment of the present invention; [Figure 7] 13A-B show schematic diagrams of a portion of a substantially transparent laminate with a 3D sensor according to yet another embodiment of the present invention; [Figure 8] 2 shows a schematic representation of a structure of a radiator element and a receiver element according to the invention; [Figure 9] 2A and 2B illustrate diagrammatically a portion of a substantially transparent laminate having a temperature sensor, according to one embodiment of the present invention; [Figure 10a] 1 is a schematic diagram of a temperature sensor arrangement within a vehicle, according to one embodiment of the present invention; [Figure 10b] 1 is a schematic diagram of a temperature sensor arrangement within a vehicle, according to one embodiment of the present invention; [Figure 11] 13A and 13B show schematic diagrams of a portion of a substantially transparent laminate comprising a temperature sensor according to a further embodiment of the present invention; [Figure 12] 13A and 13B show schematic diagrams of a portion of a substantially transparent laminate comprising a temperature sensor according to a further embodiment of the present invention; [Figure 13] 13A and 13B show schematic diagrams of a portion of a substantially transparent laminate comprising a temperature sensor according to a further embodiment of the present invention; [Figure 14] 13A and 13B show schematic diagrams of a portion of a substantially transparent laminate comprising a temperature sensor according to a further embodiment of the present invention; [Figure 15] 13A and 13B illustrate diagrammatically portions of a substantially transparent laminate having a temperature sensor according to yet another embodiment of the present invention; [Figure 16a] 2 illustrates a schematic diagram of a temperature sensor and solar detector arrangement according to an embodiment of the present invention; [Figure 16b]2 illustrates a schematic diagram of a temperature sensor and solar detector arrangement according to an embodiment of the present invention; [Figure 17] 1 illustrates a schematic representation of an optoelectronic arrangement according to one embodiment of the present invention; [Figure 18] 4 shows a schematic representation of an optoelectronic arrangement according to a further embodiment of the invention; [Figure 19] 4 illustrates diagrammatically an optoelectronic arrangement according to yet another embodiment of the present invention; [Figure 20a] 1 illustrates a schematic diagram of the operating principle of an optoelectronic device according to one embodiment of the present invention; [Figure 20b] 1 illustrates a schematic diagram of the operating principle of an optoelectronic device according to one embodiment of the present invention; [Figure 20c] 1 illustrates a schematic diagram of the operating principle of an optoelectronic device according to one embodiment of the present invention; [Figure 21a] 4 illustrates diagrammatically further principles of operation according to embodiments of the present invention; [Figure 21b] 4 illustrates diagrammatically further principles of operation according to embodiments of the present invention; [Figure 21c] 4 illustrates diagrammatically further principles of operation according to embodiments of the present invention; [Figure 22] 1 shows a schematic representation of a carrier layer with an optical segment structure. [Diagram 23] 23 shows a schematic diagram of a laminated structure having optical segments as shown in FIG. 22. [Figure 24] 24 shows a schematic of the illumination pattern obtained with the layered structure of FIG. 23. [Diagram 25] 13 shows a schematic representation of a laminate structure according to a further embodiment of the present invention; [Figure 26] FIG. 26 shows a schematic plan view of the laminated structure of FIG. [Figure 27] 1 illustrates a schematic representation of a laminate structure according to one embodiment of the present invention. [Figure 28] 28 shows a schematic plan view of the laminated structure of FIG. 27. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0081] FIG. 1 shows a schematic plan view of an automobile 10. In the illustrated exemplary embodiment, the motor vehicle is a car, but the invention is applicable to any vehicle equipped with glass windows, including, but not limited to, buses, vans and trucks. The vehicle 10 is equipped in a conventional manner with front, rear and side windows that enclose the interior space of the vehicle. The vehicle may further include a glazed roof panel (not shown). The windows are made from a substantially transparent laminate structure 20, as described in more detail below. Each window laminate structure 20 further includes one or more sensors 30 that form part of a 3D sensor system, in particular a surveillance system. In the illustrated embodiment, the sensors 30 are oriented towards the interior of the automobile, as indicated by the triangles that describe the conical field of view of each sensor.

[0082] The sensor 30 comprises photoelectronic emitter elements 301 and detector elements 302 distributed on the surface of the laminate structure 30 and controlled to operate cooperatively to detect objects and / or movements in the monitored space. In the illustrated example, one sensor 30 can represent one or more photoelectronic emitters 301, one or more photoelectronic detectors 302, or a combination of one or more emitters and detectors. As a result, each sensor 30 can represent a single pixel or an array of pixels. The photoelectronic detector elements 302 can be controlled to detect reflected or transmitted light. In the context of the present disclosure, the term light refers to any wavelength between about 240 nm and about 900 nm, thus encompassing the visible spectrum to ultraviolet to infrared. Thus, the photoelectronic emitter elements 301 and the detector elements 302 can operate at any suitable wavelength within this range.

[0083] Examples of emitter elements 301 include LEDs, such as IREDs, or lasers, such as VCSELs (Vertical Cavity Surface Emitting Lasers), configured to emit a spot or line of light. Detector elements 302 may include one or an array of photodiodes, photodetectors, image sensors, such as CCD or CMOS sensors, ToF cameras, and the like. The emitter elements 301 and detector elements 302 configured in a sensor system are configured and controlled to detect objects in three dimensions. This can be achieved using the principles of triangulation or structured light. Alternatively, detector elements 302 may comprise a ToF (Time of Flight) sensor or array that can provide both 2D image information and depth information in cooperation with the controlled emitter elements, either by measuring the phase shift between the emitted light signal and the received signal, or the time difference between the emitted light pulse and the received signal. Preferably, emitter and detector elements 301, 302 operate with non-visible light, such as infrared, to minimize disturbance to vehicle occupants and to mitigate interference from ambient lighting.

[0084] FIG. 2 shows a schematic arrangement of sensors 30 at different positions on the vehicle's windows to provide detection paths that intersect the entire space. Each photoelectronic emitter 301 and detector 302 can be arranged to emit and detect a cone of light in a particular direction or orientation. In the figure, only two sensors 30 that emit light are shown. These sensors 30 are arranged on the side and front windows of the vehicle, respectively. The light sent by these sensors 30 is detected by the detector elements 302 of the remaining sensors 30 that are located on the opposite and adjacent windows to the emitting window, as shown by the light paths 40. By judiciously arranging the sensors 30, these light paths substantially cover the space inside the vehicle, resulting in a three-dimensional detection zone.

[0085] 3 shows a schematic diagram of an exemplary embodiment of a sensor arrangement including a ToF detector element 302 acting in conjunction with a VCSEL emitter element 301 to monitor the interior of an automobile. In this embodiment, the sensor 30 generates three-dimensional data regarding objects within a designated area, preferably a substantially cone-shaped detection zone, as indicated by the shaded area 50. The overlapping detection zones 50 allow for complete monitoring of the interior space.

[0086] 4 shows a further embodiment of a sensor system using one or more ToF sensors 30 arranged in the driver's side window and facing outwards, thus creating an external 3D detection zone 60. This application can be used for driver recognition to enable automatic unlocking of the car. Those skilled in the art will understand that the ToF sensor 30 can be replaced by a 3D sensor 30 using, for example, triangulation or structured light.

[0087] In the illustrated embodiment, the sensors 30 are shown to be in substantially the same horizontal plane relative to the vehicle interior. However, it will be understood by those skilled in the art that the sensors 30, or at least the emitter and / or detector elements 301, 302, may be located in different horizontal planes to ensure a complete or more targeted monitoring of the space. In addition to the side windows, front window, and rear window, the described sensor system may be provided in the glazed roof panel. It is further possible for different sensor types to be integrated in the same vehicle or the same laminated structure 20 that constitutes the windows. In this way, a ToF sensor located on the front windshield or driver's side window may be used to recognize the driver inside the vehicle, possibly outside the driver's door, while LEDs and photodetectors located on the same and other windows may be used to monitor the position of passengers using triangulation, structured light or other mapping techniques.

[0088] 5, 6 and 7, different embodiments of a portion of a transparent laminate structure 20 for use as a window or roof portion of an automobile incorporating a 3D sensor of the present invention are shown in schematic form. In these figures, like numbers indicate like structures. The figures are provided for illustrative purposes only and the relative dimensions shown do not represent the actual structure.

[0089] In FIG. 5, the transparent laminate structure 20 is composed of a front layer 70 and a rear layer 80 of a substantially transparent material such as glass or polycarbonate or acrylic (PMMA) plastic. Between these two layers 70, 80 is an intermediate carrier layer or film 90, which is bonded to the front and rear layers 70, 80, respectively, by a bonding layer 100. The bonding layer 100 may also be substantially transparent with inherent adhesive properties and may be composed, for example, of a thermoplastic resin. In the illustrated embodiment, only one front layer 70 and one rear layer 80 are shown, but these layers may be composed of further layers or films, for example for UV protection. The carrier layer or film 90 is preferably composed of a flexible substantially transparent material such as a thermoplastic resin. On one or both sides, traces (not shown) are provided, if necessary with connecting channels or vias, to provide contacts to the various components.

[0090] In the illustrated example, emitter and receiver elements 301, 302 are disposed on carrier layer 90 and electrically connected to wiring. Disposed on the opposite side of carrier layer 90, and also electrically connected to the wiring on that layer and to the emitter and receiver elements 301, 302, is image processing and control circuitry 303 for controlling the operation of the emitter and detector elements 301, 302 and for processing received signals. Components 301, 302, 303 may be bonded directly to carrier layer 90 or may be bonded or soldered to contacts in the wiring, which is bonded to carrier layer 90.

[0091] The wiring on the carrier layer 90 serves to supply power to the elements 301, 302, 303. Depending on the application, it is possible to utilize wiring already present in the window laminate, such as that provided for window heating. The wiring also allows communication both between the sensor elements 301, 302, 303 and preferably between the image processing and control circuitry 303 and further processing and control circuitry not present on the carrier layer. This further circuitry may be used for image processing, thus reducing the processing power required for the image processing and control circuitry 303. Additionally or alternatively, this additional processing circuitry may include a control unit, for example, for unlocking the car in response to driver recognition, for enabling triggering in response to driver recognition or airbag deployment in response to the detected driver's position.

[0092] The wiring and components 301, 302, 303 present on the carrier layer 90 are preferably dimensioned such that they are substantially imperceptible to the vehicle occupants, such that the laminate structure 30 is substantially transparent. To that end, all dimensions and wiring widths of the components 301, 302, 303 are preferably smaller than 500 μm, even more preferably smaller than 200 μm. In this way, it is possible to distribute the radiator and receiver elements 301, 302 and the associated processing and control circuitry 303 in a two-dimensional layout on the carrier layer and thus on the laminate structure 30 forming the window and / or roof of the vehicle, without substantially affecting the transparency of the window or glazing panel.

[0093] 5, the radiator elements 301 and receiver elements 302 and the processing and control circuitry 303 are embedded within the bonding layer 100. This can be achieved by locally heating the bonding layer around these components to liquefy the bonding layer prior to attachment of the front layer 70 and rear layer 80.

[0094] In the exemplary embodiment shown here, the radiator element 301 is grouped together with the receiver element 302 and the processing and control circuitry 303. However, as will be appreciated by those skilled in the art, this configuration is merely illustrative and the radiator and receiver elements 301, 302 need not be arranged in pairs, and further, the processing and control circuitry 303 may be associated with multiple radiator elements 301 and / or receiver elements 302. As discussed above, each radiator and / or receiver element 301, 302 may represent a single pixel or an array of pixels. Additionally, it is possible for the radiator element 301 and the receiver element 302 to be packaged together as a single unit.

[0095] During the manufacture of the laminate structure 20, the sensor 30, i.e. the emitter and receiver elements 301, 302 and the image processing and control circuitry 303, are mounted on a carrier layer 90 already provided with wiring, and the front and rear layers 70, 80 are subsequently bonded. It is further possible to provide the carrier layer 90 with the wiring and components in the desired arrangement and then cut or stamp to the appropriate dimensions before assembling the laminate structure 30.

[0096] Figure 6 shows an alternative arrangement of the stack structure 30. This configuration differs from that of Figure 5 in that the photoelectronic emitting and receiving components 301, 302, as well as the image processing and control circuitry 303, are embedded within the carrier layer 90, such that the front faces of the emitting and receiving elements 301, 302 are essentially flush or at the same level as the front face of the carrier layer 90. The processing and control circuitry 303 may be located as shown, i.e. flush with the rear face of the carrier layer 90, or alternatively at the same level as the front face of this layer 90.

[0097] 7 shows yet another arrangement of the laminate structure 30. In this arrangement too, the photoelectronic components 301, 302, 303 are embedded in the carrier layer 90. However, no additional bonding layer is provided. Instead, it is the front and rear layers 70, 80 of the laminate structure that are to be attached directly onto the carrier layer 90, with the carrier layer acting as a bonding material.

[0098] With reference to FIG. 8, the structure of the emitter element 301 and the receiver element 302 is shown in more detail. The photoelectronic emitter element 301 comprises a semiconductor body 310 of conventional structure depending on the type of device (μLED, IRED, VCSEL, etc.) and a lens 311. Similarly, the detector element 302 comprises a semiconductor body 320 and a lens 321. The lenses 311, 321 may be standard optical lenses. Alternatively, they may be formed as Fresnel lenses or may be composed of diffractive optical elements. The lenses 311, 321 serve to limit the emission field and the field of view of the respective underlying devices 310, 320, thus allowing to configure the required light path and detection zone more precisely. Preferably, the lens 311 limits the emission to angles of ±45° from the normal. The lens 321 of the photoelectronic detector element may limit the received light to a similar angle.

[0099] FIG. 9 shows an embodiment of an optoelectronic device according to another aspect of the invention. In FIG. 9, a further laminated structure 200 is shown, which includes at least a plurality of LEDs 240, but which is capable of measuring temperature locally. This laminated structure 200 can be used for glazing buildings or vehicles, thus forming one or more windows or roof panels of a vehicle. It may also be used as a partially glazed cover for other surfaces, such as the walls of a building or the dashboard of a vehicle. The illustrated laminated structure 200 is preferably substantially transparent, but may also be coloured or tinted to filter more or less light.

[0100] The laminated structure 200 has a cover layer 210 that is substantially transparent and made of glass or any suitable glazing material such as polycarbonate or acrylic (PMMA) plastic. This outer layer 210 may be coloured or tinted. In this arrangement, the cover layer 210 forms the front side of the laminated structure for display purposes. On the opposite surface of the laminated structure 200 is a carrier layer or film 230 on which the optoelectronic elements including LEDs 240 are mounted and which may further include a dedicated component 250 for temperature determination. The carrier layer 230 may be flexible and is preferably substantially transparent. The carrier layer is preferably made of a thermoplastic material, such as PET. It further comprises electrical connections or contacts that provide power to the optoelectronic components 240, 250 and form a structured conductor layer 260 to which the optoelectronic elements 240, 250 are bonded. The conductor layer 260 can be made of a metal such as silver or gold, or a substantially transparent conductive material such as a conductive oxide, for example indium tin oxide or ITO. In particular, when made of an opaque material, the conductor paths can have a width small enough to be substantially imperceptible to the human eye at a distance of 0.5 m. In general, the conductor path width should be ≦300 nm.

[0101] Carrier layer 230 may be made of a thermoplastic or other suitable flexible material that allows the carrier layer to conform to the shape of the exterior layer. In other words, the shape of laminate structure 200 may be defined primarily by exterior layer 210 or layers, whether substantially flat or curved. Other layers not shown may be present in laminate structure 210.

[0102] The optoelectronic components include one or more light emitting elements 240, which may be LEDs in a package that may contain one or more semiconductor chips. Additionally, one or more temperature sensors 250 may be provided, which may be thermistors (NTC or PTC), platinum resistance thermometers, etc. Further lamination layers 220 encapsulate the optoelectronic elements 240, 250 and bond the exterior layers together.

[0103] Both the LED 240 and the temperature sensor 250 allow the determination of the local temperature, i.e. the temperature in the immediate vicinity of the component itself. The temperature sensor 250 provides a temperature-dependent signal according to the particular technology employed. The LED 240 also allows the determination of the temperature, for example by measuring the LED forward voltage Vf, which decreases with increasing temperature. The local temperature change may also be determined by monitoring the conductivity of the conductor layer 260, which also varies with temperature. The monitoring of the LED forward voltage is preferably performed by an LED drive or control circuit 280, which controls the operation of the LEDs 240. This control circuit 280 may also monitor the conductivity of a conductor path in the conductor layer 260 close to one or a group of LEDs 240. The control circuit 280 may also be coupled to the temperature sensor 250, if present. Alternatively, a separate circuit may be provided for monitoring and / or controlling the temperature sensor. The control circuit 280 may be external to the stack and connected via contacts. Alternatively, the control circuit 280 may be implemented (not shown) on the carrier layer 230 together with the optoelectronic elements 240, 250. In the latter arrangement, the control circuit 280 is preferably kept small and thus arranged to control fewer LED chips, or even a single LED chip, i.e. a single pixel.

[0104] In this way, the determination of the forward voltage Vf to determine the change in temperature may be performed for each LED chip. The same level of resolution can be achieved when measuring the conductivity of the conductor layer 260. For example, the conductivity of the conductor paths in the conductor layer 260 can be measured between groups of LEDs 240 or groups of LED chips to obtain a smaller resolution of the local temperature. If a dedicated temperature sensor 250 is used, the temperature resolution obtained depends on the distance between the temperature sensor 250 and the LED 240 or group of LEDs to be monitored and also on the area covered by the group of LEDs to be monitored. To ensure optimal operating conditions, the temperature sensor is preferably located as close as possible to the LED chip or chips whose temperature it determines. The distance between the temperature sensor 250 and the LED 240 or group of LEDs, whose temperature is determined, is therefore equal to or less than 5 cm, preferably equal to or less than 1 cm, even more preferably equal to or less than 0.5 cm. Processing circuitry for processing the temperature signal from the temperature sensor 250, the LED 240, and / or processing circuitry for determining the conductivity of the conductor layer 260 may be located external to the laminate structure 210 or may be housed within the laminate structure 200, for example mounted on the carrier layer 230 and electrically coupled to the conductive layer 260.

[0105] Preferably, the optoelectronic components 240, 250 and any associated driving and processing circuits implemented in the stack structure have edge dimensions of 300 μm or less. As mentioned earlier, at a distance of 0.5 m, the human eye no longer perceives objects with dimensions of 300 μm or less. Thus, the stack structure is essentially transparent to the human eye unless the LEDs 240 are illuminated. In some embodiments, micro LEDs (also called μLEDs) or μLED chips can be used as the optoelectronic components. μLEDs are small LEDs, for example, with edge lengths of less than 70 μm, particularly less than 20 μm, particularly in the range of 1 μm to 10 μm. Another range is 10 to 60 μm. This can result in surface areas of hundreds of μm2 to tens of μm2. For example, μ-LEDs can have a surface area of ​​about 2500 μm2 and an edge length of about 50 μm. In some cases, μ-LEDs have edge lengths of 5 μm or less, resulting in surface area sizes of less than 30 μm2. A typical height of such a μ-LED is, for example, in the range of 1.5 μm to 10 μm.

[0106] Micro light-emitting diode chips, also called μLED chips, can be used as optoelectronic components. They form pixels or sub-pixels and can emit light of a selected color.

[0107] When used as a temperature measuring means, the LED 240 preferably simultaneously serves other functions, for example as an indication means, for illumination, or as an emitter in an emitter / detector proximity sensor.

[0108] When operated at a constant current, the lumen output of the LED 240 varies as a function of junction temperature. The color output by an LED typically also varies with temperature. This temperature dependence is also a function of the semiconductor material used. For example, AlInGaP LEDs, typically used for red and amber light, vary more with temperature than InGaN LEDs, used for blue, green, and cyan. In an RGB LED arrangement or similar combined color arrangement, the color balance also changes with temperature. LEDs and other photoelectronic components also experience reduced lifetimes when operated outside their rated temperatures. For LEDs used in vehicle glazing or buildings, the danger is typically high temperatures, due to the heating effect of sunlight impinging on the windows and heating the interior.

[0109] The effects of increasing local temperature can be mitigated in accordance with the present invention by adjusting operational parameters, i.e., by reducing the power dissipation of the affected LEDs, for example, by modifying the current throughput under the control of the control circuit 280. Similarly, a decrease in the determined temperature may trigger a decrease in power to the LEDs by the control circuit 280. In some embodiments, the temperature of all LEDs can be determined at vehicle start-up and optionally periodically, and LED operation can be calibrated or adjusted to optimize operation and / or life. In some embodiments, excessive local temperature changes can generate an alert to trigger adjustment of the operational parameters of the affected LEDs to mitigate the effects of the temperature change.

[0110] In some embodiments, the determined temperature can be used to adjust the operating parameters, e.g., current and / or voltage, of other optoelectronic or electronic components included in the stack structure. Relevant components include photodetectors such as photodiodes, CCD or CMOS cameras, TOF cameras, lasers, etc.

[0111] In the configuration shown in FIG. 9, the temperature measured by the temperature sensitive optoelectronic elements 240, 250 is indicative of the temperature of the laminated structure 200, and is therefore affected by the temperatures on both sides of the structure.

[0112] In some embodiments of the invention, a thermal insulation layer can be placed on the underside of the structure shown in FIG. 1, i.e. adjacent to the carrier layer 230. Temperature measurements by the optoelectronic elements 240, 250 can thereby be restricted to the opposite side of the laminated structure 200. In some embodiments, local temperature determination can be used to regulate air conditioning and / or heating in a localized manner, for example with one window 20 or glazed area representing a local temperature resolution. In this case, temperature readings from each monitored area can be relayed or signaled by the control circuit 280 to separate air conditioning controls in the vehicle or building.

[0113] 10a and 10b, one example of the arrangement of the laminate structure for use in a vehicle is shown in side and top views, respectively. The vehicle is an automobile 10, but the laminate structure 200 can be used in any vehicle with glazing, including mirrors, or other surfaces to which the laminate structure can be applied, such as dashboard elements. The vehicle 10 shown has front and rear windshields and side windows, all of which are at least partially constructed with the laminate structure 200 as described herein. In some embodiments, the laminate structure 200 may be used in only some of the glazed windows of the vehicle 10. Optoelectronic components, including LEDs 240, and possibly also a dedicated temperature sensor 250, are distributed on the surface of the glazed window. Each optoelectronic component can provide information regarding the local temperature. As mentioned above, in some cases, the local temperature around the optoelectronic component may be determined by measuring the change in the electrical conductivity of the conductor layer 260.

[0114] In the vehicle 10 shown in Fig. 10, four temperature locations can be defined based on the front and rear windshields and the four side windows 20. Furthermore, it is possible to separately monitor and control the temperature based on the front and rear side windows 20. In this way, an essentially uniform temperature can be maintained inside the vehicle regardless of different external conditions such as sunlight and wind direction.

[0115] 11, a further embodiment of the laminate structure 200 is shown in which LEDs 240 are arranged to provide light on both sides of the structure. As in the arrangement of FIG. 9, the LEDs 240 and temperature sensor 250 are arranged on a carrier layer 230 in electrical contact with a conductor layer 260 deposited on the carrier layer 230.

[0116] However, in this arrangement, the carrier layer is essentially double-sided with a further conductor layer 260 on its opposite side. The LEDs 240 and temperature sensor 250 are shown attached to the underside of the carrier layer in electrical contact with the second conductor layer 260. The conductor layer 260 may be separate or connected, for example by vias through the carrier layer. On both sides of the carrier layer 230, a cover layer 210 is bonded by means of a bonding layer 220 in the same manner as described in connection with FIG. 9. As in the previous embodiment, additional intermediate or external layers may be present in the structure 200. In this and subsequent embodiments of the stacked structure 200, the control circuit 280 is omitted for clarity, but it should be understood that one or more control circuits 280 are provided as part of or connected to the stacked structure 200. In the arrangement of FIG. 11, the temperature of each LED chip or group of LED chips may be determined by monitoring the forward voltage to the LED or LEDs, by determining the conductivity of the contacts on the conductive layer 260, or by using a dedicated temperature sensor 250 such as an NTC. Similar to the arrangement shown in FIG. 9, a flexible substantially transparent carrier layer 260 is provided with a structured conductor layer 260 on which the LEDs 240 and optionally one or more temperature sensors 250 are attached. However, in the arrangement of FIG. 11, the carrier layer is provided with a conductor layer 260 on both sides, and the optoelectronic components are also bonded to this conductive layer 260 on the underside of the carrier layer. The optoelectronic components 240, 250 on both sides of the carrier layer 260 are encapsulated in a laminate layer 220, similar to the arrangement shown in FIG. 9. The two outer substantially transparent layers 210 form the outer surface of the laminate structure. As for the arrangement of FIG. 9, these outer layers are made of glass or any suitable glazing material, such as polycarbonate or acrylic (PMMA) plastic, and one or both of the outer layers 210 may be coloured or tinted. The laminate structure 200 may include other layers not shown. The carrier layer 230 is thermally insulating so that the optoelectronic components 240, 250 on one side are at least partially independent of temperature fluctuations on the other side.

[0117] Figure 12 shows a further variation of the double-sided laminate structure of Figure 11, where the temperature can be measured and regulated independently on either side. In this arrangement, the carrier layer is composed of two carrier layer parts 230' separated by a thermal insulation layer 232 sandwiched between them. Each carrier layer part 230' comprises a conductor layer 260 to provide a double-sided carrier layer structure to which optoelectronic elements can be connected. The thermal insulation layer 232 is preferably a material that reflects and / or blocks the transmission of IR radiation to reduce localized heating of the laminate structure 200.

[0118] FIG. 13 shows another variation of a double-sided laminate structure, configured, for example, to provide separate temperature determination on each side, thus enabling separate inside and outside temperature determination within a vehicle or building. This configuration is similar to that shown in FIG. 11, and similar reference numbers are given to similar elements and will not be described further here. This structure differs compared to that shown in FIG. 11 by reflecting light and infrared radiation away from the underside of the laminate structure, and thus away from the underlying temperature sensor, by a directional reflector 252 formed on the underside and around the four side walls of the temperature sensor 250. The reflector 252 is preferably a reflective structure formed on the carrier layer 230 or the conductor layer 260 and embedded within the laminate layer. The reflective structure 252 may include a mirror, a metal coating, and / or a dielectric coating, such as a distributed Bragg reflector. Preferably, the reflector 252 is configured to reflect light and infrared radiation back towards the outer surface of the laminate structure, i.e., the vehicle window or the exterior surface of the building. This arrangement is particularly useful where the temperature differential is caused by sunlight shining from outside onto a window or other glazed structure.

[0119] A further variation of the double-sided laminate structure is shown in FIG. 14. This configuration has a similar laminate structure to that shown in FIG. 13. However, in this arrangement, an additional optoelectronic element in the form of a photodetector 270 is mounted on the carrier layer and electrically coupled to the conductor layer 230. The photodetector 270 is preferably located near the LEDs, and possibly also a temperature sensor. In the illustrated arrangement, the photodetectors 270 are attached to both sides of the carrier layer 230, but the laminate structure 200 may include one or more photodetectors 270 on only one side. The photodetectors may be photodiodes or the like, and are preferably suitable for detecting visible or white light, to detect the level of sunlight irradiating the laminate structure. The light intensity signal from the photodetector 270 is received and processed by a control circuit 280 (see FIG. 9) or other circuit module in communication with the control circuit 280. The temperature of the optoelectronic components 240, 250 in the laminate structure 200 is necessarily affected by the length and intensity of the sunlight impinging on the structure. Thus, the photodetector 270 allows the effects of sunlight to be taken into account. In some embodiments, it may be possible to adjust to take temperature variations into account using only measurements from one or more photodetectors.

[0120] The photodetector 270 may further be combined with a directional structure 272 formed around the upper surface of the photodiode and embedded in the stack layer 220. A variation of this stack structure is shown in FIG. 15. The directional structure 272 is configured to collect light in a specific directional portion or propagation channel depending on the direction from which the light is received. It may be formed from a material with a higher refractive index than the surrounding material. Preferably, the difference in refractive index should be greater than 0.02. Light that is perpendicular to the stack structure is collected by all parts of the directional structure 272, while light that is incident at a larger or smaller angle to the stack structure surface is collected by less of the directional structure. Thus, the received intensity is a function of the direction from which the light is received and the impact of sunlight on the stack structure may be determined depending on the angle of incidence.

[0121] One or more of the LEDs 240 may also be provided with a similar directional beam forming structure 242 to allow the emitted light to be directed in a particular direction instead of being uniformly emitted in a cone, in this way the light can be clearly seen at certain viewing angles but not at others.

[0122] An application example of a laminated structure incorporating a photodetector 270 is shown in Figures 16a and 16b. Figures 16a and 16b show an automobile in side and top views, respectively. The automobile 10 has front and rear windshields and side windows 20, all of which are at least partially formed by a laminated structure 200 as described herein. Optoelectronic elements in the form of one or more LEDs 240 are disposed in all of the windows, as indicated by the dots. The laminated structure 200, which forms at least a portion of the front windshield, further includes a photodetector 270 associated with a directional structure 272 (not shown). The directional structure 272 channels light from different directions, as indicated by the conical directional beam shape 274 shown in the figure. This allows the photodetector to determine the intensity of the incoming radiation, or the degree of shading, which depends on the summation of radiation through different beam directions.

[0123] As with previous embodiments described herein, the carrier layer 230, 230' may be provided as a single unit having the single or double conductor layer 260, the optoelectronic element 240, 250, 270, the reflector 252, if present, and possibly the control circuitry 280 mounted thereon. This element may then be incorporated into the laminate structure 200 by bonding to the intermediate laminate layer 220 having the directional structure 272, and the outer layer or layer 210.

[0124] Fig. 17 shows a schematic representation of an optoelectronic arrangement according to a further embodiment of the invention. Fig. 17 shows a laminate structure 400 including an optoelectronic arrangement for interactively providing information to a user, in particular information in the form of illuminated symbols. The laminate structure includes a carrier layer 410 with electrical connections or contacts forming a conductor layer 411 for supplying power to the optoelectronic components. The conductor layer 260 can be made of a substantially transparent conductive material such as a metal such as silver, gold or copper, or a conductive oxide such as indium tin oxide or ITO. In particular, when made of an opaque material, the conductor paths can have a width small enough to be substantially imperceptible to the human eye at a distance of 0.5 m. In general, the conductor path width should be ≦300 nm. Electrically coupled to this conductor layer 411 are a number of optoelectronic components, in particular an LED emitter 408 generating visible light of one or several colors, an infrared emitter (IR emitter) 404 and an infrared detector (IR detector) 406.

[0125] Carrier layer 410 is preferably made of a flexible, substantially transparent material, which may be a thermoplastic material such as PET or the like.

[0126] As with the previous embodiments described herein, the optoelectronic components 404, 406, 408 and any associated driving and processing circuitry mounted within the stack are virtually imperceptible to the human eye when viewed from a distance of 1 m. Preferably, these components have edge dimensions of less than 300 μm. Thus, the stack is essentially transparent to the human eye unless the LED 240 is illuminated.

[0127] In some embodiments, micro LEDs (also called μLEDs) or μLED chips can be used as optoelectronic components. μLEDs are small LEDs, for example with an edge length of less than 70 μm, especially less than 20 μm, especially in the range of 1 μm to 10 μm. Another range is 10 to 60 μm. This can result in a surface area of ​​several hundred μm2 to several tens of μm2. For example, a μ-LED can have a surface area of ​​about 2500 μm2 and an edge length of about 50 μm. In some cases, a μ-LED has an edge length of 5 μm or less, resulting in a surface area size of less than 30 μm2. A typical height of such a μ-LED is, for example, in the range of 1.5 μm to 10 μm.

[0128] Micro light-emitting diode chips, also called μLED chips, can be used as optoelectronic components. They form pixels or sub-pixels and can emit light of a selected color.

[0129] The carrier layer 410 is bonded to the exterior layer 420 using an essentially transparent bonding layer 430, which may be, for example, PVA. The exterior layer 420 forms the exterior surface of the laminate structure. The exterior layer 420 is substantially transparent, but may be coloured or tinted, and may be made from any suitable glazing material, such as glass, or polycarbonate or acrylic (PMMA) plastic. The laminate structure 400 may include additional intermediate layers, not shown. The illustrated laminate structure 400 is suitable for use as a glazing element in a window glass or mirror of a vehicle or building. However, the optoelectronic arrangement described herein may alternatively be used to provide an interactive lighting arrangement on a non-glazed and / or non-transparent surface, such as a dashboard, glove box, or other interior surface of a vehicle, or any suitable surface of a building. Thanks to one or more flexible carrier layers 410, 410', the laminate structure can be applied as a substantially invisible coating or skin to multiple surfaces, including plastic or metal. In such a configuration, one of the exterior layers 420 may be omitted.

[0130] The IR emitter 404 and the IR detector 406 together form a proximity sensor with the IR detector detecting reflected IR radiation from objects located in the vicinity of the laminate structure 400. Typically, objects are detected within a range of 30 cm or less, preferably 20 cm or less, from the laminate structure 400 to eliminate detection of randomly passing objects. In some cases, the IR emitter 404 and the IR detector 406 are configured to detect objects only within a very close distance, on the order of 5 mm or less, so that relatively small changes in the object's position can be identified. This allows hand sliding to be detected. The IR emitter 404, the IR detector 406, and the LED 408 are connected to a control circuit or control unit 440 that is disposed on the carrier layer 410 and thus may form part of the laminate structure, but is located outside the laminate structure in the illustrated arrangement. The control unit 440 can control the operation of the IR emitter to trigger the IR emitter, for example, when the vehicle is stationary, or alternatively, when the vehicle is unlocked and started. The control unit 440 further receives signals from the IR detector and, in response to detected objects in the vicinity of the laminated structure 400, drives the LEDs 408 to generate light in a particular pattern and / or color to provide information to an observer. The control unit may also control other functions of the vehicle or building, such as unlocking doors, lowering windows, etc., either directly or by communicating with additional control circuits external to the laminated structure 400.

[0131] Referring now to FIG. 18, an alternative interactive laminate structure 400 according to the present invention is shown. This arrangement is similar to that shown in FIG. 17, and similar reference numbers are used for similar elements. Thus, the structure 400 includes a carrier layer 410 having a conductor layer 411 and two outer surface layers 420 bonded to the inner layers using a bonding layer 430. The LED emitters 408 are mounted on the carrier layer 410 and are electrically coupled to the conductor layer 411. However, this structure differs from that of FIG. 17 by providing an additional carrier layer 410' with a conductor layer 411' arranged in conductive strips to form a capacitive touch sensor. A control unit 440 in this configuration is connected either wired or wirelessly to the LEDs 408 and the capacitive touch sensor 411' and selectively controls the current to the LEDs to generate specific patterns and / or colors in response to an increase in output capacitance from the touch sensor 411' to provide information to the observer. With respect to the arrangement of FIG. 17, the control unit may further control other functions of the vehicle or building.

[0132] 19, a further embodiment of an optoelectronic arrangement is shown with a different laminate structure 400. Again, similar reference numerals are used to designate similar elements, and a detailed description of these elements is omitted. In this arrangement, the laminate structure comprises both a proximity sensor in the form of an IR emitter 404 and an IR detector 406, and a capacitive touch sensor in the form of a conductive layer 411' formed in a strip on an additional carrier layer 410'. Thus, a control unit 440 responds to both the proximity sensors 406, 408 and the capacitive touch sensors 410', 411' to control the operation of the LEDs 408, and possibly other functions of the vehicle or building.

[0133] It will be appreciated that the laminate structure 400 shown in Figures 17-19 may include any desired arrangement of proximity sensors and / or capacitive touch sensors 411' and LEDs 408. The optoelectronic elements 404, 406, 408, 411' may also be located at any position and in any arrangement within the glazing structure and are not limited to the edges of the window.

[0134] The function of the optoelectronic arrangement shown in figures 17-19 is illustrated in figures 20a-20c. Figures 20a-20c show a car 10 in partial profile with windows, at least one of which includes a laminated structure 400 with an optoelectronic arrangement according to the invention. In figure 17a the window and the laminated structure 400 are transparent and no information is displayed. As the user approaches the window, as symbolized by the hand shown, the proximity sensors 404, 406 detect the approach and signal this to the control unit 440, which activates the LED 408 to generate light in the form of a symbol 401 on the front window. This symbol 401 may be of a first color or may have a specific first shape. When the hand advances and touches the laminated structure 400, this is detected by the capacitive sensor 411' and the control unit 440, which then activates the LED 408 to modify the displayed information. For example, the control unit may drive an LED to change the color of the displayed symbol, e.g., from red to green, as shown by the change from regular symbol 401 to bold symbol 402 in Figures 20b and 20c.

[0135] The modified functionality of the optoelectronic arrangement is shown in Figs. 21a-21c. Figs. 21a-21c are displayed controls for adjusting the window height. Figs. 21a-21c each show a partial side view of another vehicle 10 having a front side window including a laminated structure 400. In Fig. 21a, there is no object close to the laminated structure 400, and the window is substantially transparent with no visible objects. As shown in Fig. 21b, when the hand shown approaches the window within a detectable distance, it is detected by the proximity sensors 404, 406, and the control unit 440 drives the LEDs 408 to display the desired information, in this case the graduation scale represents the slide control 403 for the window position. Finally, in Fig. 21c, the user can adjust the window height to the desired position by sliding or tapping a finger on the slide control. The hand movement is detected by the capacitive touch sensor 411', or by one or more proximity sensors 404, 406, or a combination of both, and the information is relayed to the control unit 440. The control unit 440 may then respond by modifying the current to the LED 408 to effect a change in shape and / or color of the display. For example, the displayed slide control 402 may change color as a finger passes over it to indicate a desired degree of window opening, as indicated by the dark area on the symbol 403 in FIG. 20c. Additionally, the control unit 440 may generate signals to control the opening and closing of the window to the indicated positions.

[0136] It will be understood that the light emitting elements or light sources 408, whether LEDs or other components, may be arranged in any desired configuration on the carrier layer 410, and thus within the laminate structure (400). In other words, the light sources 408 form a single light spot and may therefore be zero dimensional, or alternatively may be arranged in a one or two dimensional configuration. By one dimensional it is meant that a single light spot is perceived by the viewer, although this may be produced by a group of different colored LEDs 408, or one of the LEDs 408 of this group.

[0137] Referring now to FIG. 22, a beam-forming micro-optical element 450 is shown that may be integrated in the laminate structure 400. As shown in FIG. 23, this micro-optical element 450 is essentially a film or layer that may be sandwiched in the laminate structure between a carrier layer 410 on which a light source 456, which may be an LED or a laser, is attached, and an outer surface layer 420, possibly through one or more intermediate layers. The micro-optical element 450 is formed with optical segments or cells 452, 454 on both sides. In the illustrated example, the micro-optical element 450 has a two-dimensional configuration of segments for channeling and diffusing light from a single light source into a two-dimensional field. However, it will be understood that such a beam-forming element may also be used to create a one-dimensional beam. The segment 454 on the front or receiving surface of the optical element 450 is smaller than the segment 452 on the light output surface. The segments 454, 452 are further adapted to the size and divergence of the light source 456. The micro-optical element 450 has a refractive index that is preferably at least 0.02 higher than the surrounding material. The combination of the input / output segments 454, 452 and the layers between them diffuses and deflects the light from the light source 456 into a substantially uniform patch of light that is larger than the size of the light source 456. This is illustrated in FIG. 24, which shows the uniform illumination achievable with the micro-optical element 450. The micro-optical element may be combined with any one of the embodiments described herein to facilitate the generation of desired light symbols while limiting the number of light sources and associated circuitry required, thus improving the transparency of the laminate structure 400.

[0138] The micro-optical elements 450 may be fabricated by roll-to-roll processes or by lithography and UV molding on top of an outer layer substrate.

[0139] 25 and 26 show further embodiments of the optoelectronic arrangement in cross-section and plan view, respectively, where the sensors 406 and light sources 408 are arranged in a two-dimensional array that functions as a basic interactive camera. In the illustrated stack, the light sources 408, which may be LEDs, and the proximity sensors 406 are grouped together such that an object detected by the proximity sensors 406 of a group can trigger an adjustment of the light sources 408 in the same group. The proximity sensor preferably includes an IR emitter 404 and an IR detector 406, but may alternatively or additionally include an RGB detector for detecting ambient light levels. In this way, the illuminance of the light source 408 can be adjusted according to the local ambient light, thus taking into account direct sunlight or shadows, as well as dimming to adjust for low light conditions at night.

[0140] A modified configuration of the optoelectronic arrangement of Figures 25 and 26 is shown in Figures 27 and 28. In the cross-sectional view shown in Figure 25, it can be seen that lens structures 460 are formed above each proximity sensor, specifically above the IR detector. These lens structures may also be formed above the RGB or ambient light detectors, if present. The lenses 460 may be pre-structured in the bonding layer 430 before assembly of the stacked structure 400. The lenses 460 serve to limit the spatial extent of the sensors 406, thus ensuring for each group of proximity sensors 406 and light sources 408 a higher accuracy and a more precise control in the detection of local obstacles.

[0141] In the arrangements of Figures 25-28, the proximity sensors 406 and / or ambient light detectors are mounted adjacent to light sources 408 of the same group, and the special range of the proximity sensor is preferably limited to the group area or just larger than the group area to avoid overlap with adjacent groups.

[0142] Below are itemized lists of various devices and arrangements, as well as methods for manufacturing, processing, and operation. The following items present various aspects and implementations of the proposed principles and concepts, which can be combined in different ways. Such combinations are not limited to those shown below.

[0143] Item 1: A surveillance system for monitoring an interior and / or exterior space of a motor vehicle, comprising a plurality of photoelectronic sensor elements (30) adapted to generate a three-dimensional mapping of objects within the space, the sensor elements (30) being electrically connected to a substantially transparent carrier layer (90) adapted to be disposed between a first substantially transparent layer (70) and a second substantially transparent layer (80) to form a substantially transparent laminate structure (20) for use in one or more window and / or roof panels of the motor vehicle.

[0144] Item 2: The monitoring system described in Item 1, wherein the sensor elements (30) are arranged in a two-dimensional arrangement on the carrier layer (90).

[0145] Item 3: The surveillance system of item 1 or 2, wherein the carrier layer (90) is flexible.

[0146] Item 4: A surveillance system described in any one of items 1 to 3, wherein the sensor element (30) is configured to monitor a space using at least one of triangulation, structured light, and Time of Flight (ToF).

[0147] Item 5: A monitoring system described in any one of items 1 to 4, wherein the sensor element (30), when attached to the laminated structure (20) of a vehicle, is arranged to generate a three-dimensional detection zone (40, 50, 60) on the inside and / or outside of the vehicle.

[0148] Item 6: A monitoring system according to any one of items 1 to 5, wherein the sensor elements (30; 301, 302, 303) are mounted on the carrier layer (90).

[0149] Item 7: A monitoring system according to any one of items 1 to 6, wherein the sensor element (30; 301, 302, 303) is embedded in the carrier layer (90).

[0150] Item 8: A monitoring system described in any one of items 1 to 7, wherein a bonding layer (100) is provided between the carrier layer (90) and at least one of the first and second layers (70, 80).

[0151] Item 9: A monitoring system described in any one of items 1 to 8, wherein the carrier layer (90) comprises wiring for power and signal carriers of the sensor (30).

[0152] Item 10: The monitoring system described in Item 9, wherein the sensor is bonded to the carrier layer (90) via the wiring.

[0153] Item 11: A monitoring system described in any one of items 1 to 10, wherein the sensor (30) comprises a photoelectronic emitter element (301) and a photoelectronic detector element (302).

[0154] Item 12: A monitoring system as described in Item 11, wherein each of the photoelectronic emitter elements (301) and photoelectronic detector elements (302) comprises at least one lens (311, 321) configured to provide a directional field of view.

[0155] Item 13: A monitoring system described in Item 10 or 11, wherein the sensor (30) further comprises an image processing and control circuit (330) for controlling at least one photoelectronic emitter element (301) and / or photoelectronic detector element (302).

[0156] Item 14: A monitoring system according to any one of items 1 to 13, wherein the sensor (30) has a dimension of 500 μm or less, preferably 200 μm or less.

[0157] Item 15: A monitoring system described in any one of items 1 to 14, wherein the sensor (30) operates at infrared wavelengths.

[0158] Item 16: A transparent laminate structure for use in a window and / or roof panel of a motor vehicle, comprising a surveillance system according to any one of items 1 to 15.

[0159] Item 17: A vehicle comprising the transparent laminate structure according to item 16.

[0160] Item 18: The vehicle of item 17, wherein the transparent laminate structure comprises at least two of the automobile's side window, rear window, front window and roof panel.

[0161] Item 19: An optoelectronic arrangement, for example for use in a transparent glazing element of a vehicle, comprising a substantially transparent carrier layer (230), at least one conductor layer (260) including conductor paths provided on at least one side of the carrier layer, at least a plurality of LEDs (240) arranged on the carrier layer (230) and electrically coupled to the conductor paths on the conductor layer, and means (250; 280) for determining a temperature of at least one of the LEDs.

[0162] Item 20: The optoelectronic arrangement of item 19, further comprising means (280) for adjusting operating parameters of the optoelectronic components and at least the LED (240) in response to the determined temperature.

[0163] Item 21: An optoelectronic arrangement according to item 19 or 20, wherein the means for determining the temperature of at least one LED comprises at least one temperature sensor (250) arranged on at least one side of the carrier layer (230) and electrically coupled to a conductor path on the conductor layer (230).

[0164] Item 22: The optoelectronic arrangement of item 21, further comprising a reflector (252) arranged around the temperature sensor (250) to reflect heat and / or light from the carrier layer (230).

[0165] Item 23: An optoelectronic arrangement according to item 20, wherein the distance between the temperature sensor (250) and the at least one LED (240) is at most 5 cm, preferably at most 1 cm, and even more preferably at most 0.5 cm.

[0166] Item 24: An optoelectronic arrangement according to any one of items 19 to 23, wherein the means for determining the temperature of at least one LED comprises means (280) for measuring a forward voltage (Vf) of at least one LED (240).

[0167] Item 25: An optoelectronic arrangement described in any one of items 19 to 24, wherein the means for determining the temperature of at least one LED comprises a means (280) for measuring the electrical conductivity of a conductor path in the conductor layer (260).

[0168] Item 26: An optoelectronic arrangement described in any one of items 19 to 25, further comprising at least one substantially transparent outer surface layer (210) and at least one substantially transparent intermediate layer (220) arranged between the carrier layer (230) and the at least one outer surface layer (210).

[0169] Item 27: An optoelectronic arrangement according to any one of items 19 to 26, wherein the carrier layer (230) is thermally insulating.

[0170] Item 28: An optoelectronic arrangement according to any one of items 19 to 23, wherein the carrier layer (230) comprises two layers (230') separated by a thermal insulation layer (232).

[0171] Item 29: An optoelectronic arrangement described in any one of items 19 to 28, wherein the plurality of LEDs (230) are arranged on both sides of the carrier layer (230).

[0172] Item 30: An optoelectronic arrangement described in any one of items 19 to 29, further comprising at least one photodetector (270) attached to at least one side of the carrier layer to provide a signal indicative of the light intensity incident on the optoelectronic arrangement.

[0173] Item 31: The optoelectronic arrangement of item 30, further comprising a directional structure (242) disposed over the photodetector (270) for directing light to the photodetector as a function of the direction of the received light.

[0174] Item 32: An optoelectronic device described in any one of items 19 to 31, further comprising a directional structure disposed over at least one LED (240), the directional structure configured to direct light from the LED in a predetermined direction.

[0175] Item 33: An optoelectronic arrangement according to any one of items 19 to 32, wherein the lateral dimensions of the LED and the means for monitoring temperature are ≦300 μm.

[0176] Item 34: A carrier layer (230) for use in a substantially transparent laminate structure forming, for example, a glazing element suitable for a vehicle, the carrier layer (230) being substantially transparent and having a conductor layer having conductive paths on at least one side, a plurality of LEDs (240) attached to at least one side and electrically coupled to the conductor paths on the conductor layer (260), and means (250; 280) for determining the temperature of at least one of the LEDs.

[0177] Item 35: The carrier layer according to item 34, further comprising means (280) for adjusting operation of the LEDs (240) depending on the determined temperature.

[0178] Item 36: A carrier layer according to Item 34 or 35, wherein the means for determining the temperature of at least one LED comprises at least one temperature sensor (250) arranged on at least one side of the carrier layer (230) and electrically coupled to a conductor path on the conductor layer (230).

[0179] Item 37: A vehicle comprising at least one optoelectronic arrangement according to any one of items 19 to 33.

[0180] Item 38: The vehicle of item 37, further comprising a controller for controlling an interior temperature of the vehicle in response to the determined temperature of the LED (240).

[0181] Item 39: A method of operating an optoelectronic arrangement according to any one of items 19 to 33, comprising determining a temperature of at least one LED and adjusting operating parameters of the at least one LED to modify a color of light generated by the LED.

[0182] Item 40: The method of item 39, further comprising determining a temperature of at least one LED and adjusting operating parameters of the at least one LED to extend a lifetime of the LED.

[0183] Item 41: A method as described in Item 39 or 40, comprising determining a temperature of at least one LED and signaling the determined temperature to an external air conditioning controller adapted to adjust a temperature in the vicinity of the LED.

[0184] Item 42: An optoelectronic arrangement, for example for use in a transparent glazing element of a vehicle, comprising at least one substantially transparent carrier layer (410), at least one conductor layer (411) including conductor paths provided on at least one side of the carrier layer, at least one light-emitting element (408) arranged on the carrier layer (410) and electrically coupled to conductor paths on the conductor layer (411), and at least one proximity and / or touch sensor (404, 406, 411') arranged on at least one of the carrier layers (410, 410'), and further connectable to a control module (440) for controlling operation of the at least one light-emitting element in response to information from the at least one proximity sensor and / or touch sensor.

[0185] Item 43: The optoelectronic arrangement identified in item 42, wherein the proximity sensor comprises at least one infrared emitter and at least one infrared detector.

[0186] Item 44: The optoelectronic arrangement identified in item 42 or 43, wherein the touch sensor includes a capacitive touch sensor (411').

[0187] Item 45: An optoelectronic arrangement as identified in any one of the previous items 42 to 44, wherein at least one carrier layer (410') includes a conductor strip (411') functioning as a capacitive touch sensor.

[0188] Item 46: The optoelectronic arrangement as identified in any one of items 42 to 45, wherein the control unit (440) is at least partially mounted on at least one carrier layer (410).

[0189] Item 47: An optoelectronic arrangement as identified in any one of items 42 to 46, further comprising a plurality of light-emitting elements arranged in a one-dimensional, preferably two-dimensional, array, at least one of the light-emitting elements being individually controllable by the control unit (440).

[0190] Item 48: The optoelectronic arrangement identified in any one of items 42 to 47, wherein the at least one light-emitting element includes an LED (480), preferably a micro LED.

[0191] Item 49: The optoelectronic arrangement as identified in any one of items 42 to 48, wherein the light emitting element includes a laser (456).

[0192] Item 50: An optoelectronic arrangement as identified in any one of items 42 to 49, further comprising at least one ambient light detector mounted on the at least one carrier layer (410), and the control unit (440) is configured to control the illuminance of the light source in response to a signal from the at least one ambient light detector.

[0193] Item 51: An optoelectronic arrangement identified in any one of items 42 to 50, wherein at least one light-emitting element (408) and at least one proximity sensor (408) are arranged in groups, and the control unit is configured to control the operation of the light-emitting elements of each group in response to a signal from at least one proximity sensor of the same group.

[0194] Item 52: The optoelectronic arrangement identified in Item 50, wherein each group includes at least one ambient light detector, and the control unit (440) is configured to control the illuminance of the light-emitting elements of the group in response to a signal from the ambient light detector of the same group.

[0195] Item 53: The optoelectronic arrangement identified in item 49 or 51, wherein the ambient light detector is a photodiode, preferably an RGB photodiode.

[0196] Item 54: The optoelectronic arrangement identified in any one of items 42 to 53 above, further comprising a lens structure disposed on at least one of the proximity sensors (406).

[0197] Item 55: An optoelectronic arrangement identified in any one of items 42 to 54, further comprising at least one optical layer (450) bonded to the carrier layer (410) on the light source (456) and diffusing light from each light-emitting element (456) into a light patch having a substantially uniform illuminance and a diameter larger than the light source.

[0198] Item 56: An optoelectronic arrangement as identified in Item 54, wherein the optical layer includes an array of optical segments (454) on an input surface and an array of optical segments (452) on an output surface, the segments (452) on the output surface being larger than the segments (454) on the input surface.

[0199] Item 57: The optoelectronic arrangement identified in item 54, wherein the array of optical segments is one-dimensional, preferably two-dimensional.

[0200] Item 58: The optoelectronic arrangement identified in any one of items 42 to 57, wherein lateral dimensions of the light-emitting elements, proximity sensors, and touch sensors are ≦300 μm.

[0201] Item 59: The optoelectronic arrangement as identified in any one of items 42 to 58, wherein the at least one carrier layer (410) is flexible and preferably made of a thermoplastic material such as PET.

[0202] Item 60: An optoelectronic arrangement according to any one of items 42 to 59, wherein the at least one conductor layer (411, 411') is a substantially transparent metal oxide such as ITO.

[0203] Item 61: An optoelectronic arrangement as identified in any one of items 42 to 60, further comprising at least one outer surface layer (420), said outer surface layer being bonded to said at least one carrier layer by a bonding layer (430), said outer surface layer being preferably made of glass, polycarbonate, or PMMA.

[0204] Item 62: A vehicle comprising at least one optoelectronic arrangement as identified in any one of items 42 to 58. [Explanation of symbols]

[0205] 10. Automobiles 20 Transparent laminated structure 30 Photoelectronic Sensors 40 light path 50 detection zones 60 detection zones 70 Front layer 80 Posterior layer 90 Carrier Layer 100 bonding layer 200 Laminated structure 210 Cover Layer 220 laminated layer 230 Carrier Layer 230 Carrier layer 232 Thermal insulation layer 240 LED 242 Directional structure 250 Temperature Sensor 252 Reflector 260 Conductor Layer 270 Photodetector 272 Directional structure 274 Directional Beam 280 Control circuit 301 Radiator element 302 Detector element 303 Image Processing Circuit 310 Semiconductor body 311 Lens 320 Semiconductor body 321 Lens 400 Laminated structure 401 Light Symbol 402 Bold Light Symbol 403 Slide Control Symbol 404 IR emitter 406 IR Detector 408 LED radiator 410 Carrier Layer 410 Carrier Layer 411 Conductor layer 411 Conductor layer 420 Outer layer 430 Bonding layer 440 Control Unit 450 Micro Optical Elements 452 Optical Segments 454 Optical Segments 456 Light source 460 Lens

Claims

1. 1. A surveillance system for monitoring an interior and / or exterior space of a motor vehicle, comprising a plurality of photoelectronic sensor elements (30) adapted to generate a three-dimensional mapping of objects within said space, the sensor elements (30) being electrically connected to a substantially transparent carrier layer (90) adapted to be disposed between a first substantially transparent layer (70) and a second substantially transparent layer (80) to form a substantially transparent laminate structure (20) for use in one or more window and / or roof panels of the motor vehicle.

2. The monitoring system of claim 1 , wherein the sensor elements (30) are arranged in a two-dimensional arrangement on the carrier layer (90).

3. The surveillance system of claim 1 or 2, wherein the carrier layer (90) is flexible.

4. The surveillance system of claim 1 , wherein the sensor element (30) is configured to monitor a space using at least one of triangulation, structured light, and Time of Flight (ToF).

5. 5. The monitoring system according to claim 1, wherein the sensor element (30) is arranged to generate a three-dimensional detection zone (40, 50, 60) on the inside and / or outside of the motor vehicle when attached to the laminate structure (20) of the motor vehicle.

6. 6. The monitoring system according to claim 1, wherein the sensor elements (30; 301, 302, 303) are mounted on the carrier layer (90).

7. 4. The monitoring system according to claim 1, wherein the sensor element (30; 301, 302, 303) is embedded in the carrier layer (90).

8. The monitoring system of any one of claims 1 to 7, wherein a bonding layer (100) is provided between the carrier layer (90) and at least one of the first and second layers (70, 80).

9. The monitoring system according to any one of claims 1 to 8, wherein the carrier layer (90) comprises wiring for power and signal carriers of the sensor element (30).

10. 10. The monitoring system of claim 9, wherein the sensor element (30) is bonded to a carrier layer (90) via the wiring.

11. The monitoring system according to any one of claims 1 to 10, wherein the sensor element (30) comprises a photoelectronic emitter element (301) and a photoelectronic detector element (302).

12. 12. The surveillance system of claim 11, wherein each of the photoelectronic emitter elements (301) and photoelectronic detector elements (302) comprises at least one lens (311, 321) configured to provide a directional field of view.

13. 12. The monitoring system according to claim 10 or 11, wherein the sensor element (30) further comprises an image processing and control circuit (330) for controlling at least one photoelectronic emitter element (301) and / or photoelectronic detector element (302).

14. 14. The monitoring system of any one of claims 1 to 13, wherein the sensor element (30) has a dimension of 500 μm or less.

15. A monitoring system according to any one of claims 1 to 14, wherein the sensor element (30) operates at infrared wavelengths.

16. A transparent laminate structure for use in a window and / or roof panel of a motor vehicle comprising a surveillance system according to any one of claims 1 to 15.

17. 20. A vehicle comprising the transparent laminate structure of claim 16.

18. 20. The vehicle of claim 17, wherein the transparent laminate structure comprises at least two of a side window, a rear window, a front window, and a roof panel of the automobile.

Images