Skin treatment device
The skin treatment device uses a sapphire glass contact member with a Peltier element and heat sink system to maintain a 20-degree lower temperature than ambient air, addressing pain relief and improving comfort during laser treatments.
Patent Information
- Application Number
- JP2024085671
- Authority / Receiving Office
- JP · JP
- Patent Type
- Applications
- Current Assignee / Owner
- Priority Date
- 2023-07-24
- Filing Date
- 2024-05-27
- Publication Date
- 2025-02-05
AI Technical Summary
Conventional skin treatment devices do not adequately address pain relief during laser irradiation by maintaining the contact surface at a low temperature relative to the surrounding air, necessitating further improvement in skin treatment comfort.
A skin treatment device is designed with a contact member, such as sapphire glass, equipped with a Peltier element for heat absorption and a heat sink for dissipation, along with insulation and a fan system to maintain the contact surface at a temperature at least 20 degrees lower than the surrounding air, using specific thermal equations to manage heat transfer and dissipation.
The device effectively sets the contact surface temperature to be more than 20 degrees lower than the surrounding air temperature, enhancing user comfort during laser treatments by reducing heat transfer and ensuring efficient heat dissipation.
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Figure 2025017310000001_ABST
Abstract
Description
[Technical field]
[0001] The present disclosure relates to a skin treatment device for performing hair removal treatment and the like. [Background technology]
[0002] A conventional skin treatment device has been proposed that sets the contact surface that comes into contact with the skin of the person being treated (user) at a temperature lower than the air temperature, with the aim of alleviating pain felt by the person being treated (user) due to irradiation with a laser or the like. [Prior art documents] [Patent documents]
[0003] [Patent Document 1] JP 2018-61727 A Summary of the Invention [Problem to be solved by the invention]
[0004] However, there is a demand to set the temperature of the contact surface that comes into contact with the skin at an even lower temperature in order to further promote pain relief caused by irradiation with a laser or the like, as compared to conventional skin treatment devices. Therefore, an object of the present disclosure is to provide a skin treatment device that can set the temperature of the contact surface that comes into contact with the skin to a temperature that is more than 20 degrees lower than the surrounding air temperature, thereby improving the comfort of skin treatment. [Means for solving the problem]
[0005] In one aspect, the following solution is provided. (1) A method for manufacturing a heat absorbing device comprising: a contact member including a contact surface to be brought into contact with an object; heat absorbing means configured to absorb heat from the contact member; and heat dissipating means configured to dissipate the heat absorbed by the heat absorbing means, the contact member further comprising an opposing surface opposing the contact surface and a side surface constituting a surface from one end of the contact surface to one end of the opposing surface, wherein the substantial total area of the contact surface, the opposing surface, and the side surface is expressed in square meters A, the substantial height of the contact surface is expressed in meters L, and the heat absorption amount of the heat absorbing means is expressed in watts Qc, where (heat absorption amount Qc / (heat transfer area A×2.51×0.56)) 0.8 ×Height L 0.2 The present invention is characterized in that the number of the inputs is more than 20. (2) In the configuration of (1) above, the device is characterized in that it has a main body outer shell including the contact member, and at least one of the opposing surface and the side surface is held in place by an insulating means connected to the main body outer shell. (3) In the above configuration (2), the thermal insulation means has a thermal conductivity coefficient smaller than that of the contact member. (4) In the configuration of (1) above, the device is characterized in that it is equipped with the heat absorption means which requires Qd watts of heat supply when generating the heat absorption amount Qc watts, a plurality of fins which form part of the heat dissipation means, a blowing means which blows air onto the fins, and an exhaust port which is formed in a part of the outer casing of the main body, and in which, when the surface area of the fins is expressed in AF square meters, the effective length of the fins through which the air flows is expressed in LF meters, and the wind speed exhausted from the exhaust port is expressed in V meters / second, (Qc+Qd) / (3.86×√(V / LF)×AF) does not exceed 10. (5) In the above configuration (4), the blowing means has an inlet and an outlet, and the outlet is disposed opposite the fins. (6) In the configuration of (5) above, the heat dissipation means is characterized by having a first cooling section that receives the wind blown out from the outlet, and a second cooling section that receives the wind sucked into the inlet. Effect of the Invention
[0006] According to the present disclosure, the temperature of the contact surface that comes into contact with the skin can be set to a temperature that is more than 20 degrees lower than the surrounding air temperature, thereby improving the comfort of skin treatment. [Brief description of the drawings]
[0007] [Figure 1] 1 is an external perspective view of a hair removal device according to an embodiment of the present invention; [Diagram 2] FIG. 2A is a partially cutaway perspective view of the hair removal device of the present embodiment, and FIG. 2B is a side view of the sapphire glass and the Peltier element. [Diagram 3] FIG. 1A is an exploded perspective view of the fan and heat sink, and FIG. 1B is an exploded perspective view of the fan and heat sink as viewed from a different angle. [Figure 4] This is an oblique view of machine A. [Diagram 5] FIG. 1 is a perspective view of machine B. [Figure 6] This is a diagram summarizing the improvement plans, concerns, and improvement suggestions for Machine A. [Figure 7] FIG. 13 is a diagram showing the evaluation results of the degree of influence of each part and combination of parts of Machine A and Machine B on the sapphire glass temperature. [Figure 8] FIG. 13 is a diagram showing the reduction in sapphire glass temperature for each part and combination of machine A and machine B. [Figure 9] FIG. 4 is a characteristic diagram of the amount of heat absorption versus current value of a Peltier element. [Figure 10] FIG. 13 is a diagram for explaining calculation of a coefficient C. [Figure 11] 4 is a characteristic diagram of the amount of heat dissipation versus the current value of a Peltier element. [Figure 12] FIG. 13 is a diagram showing values of each part on the heat dissipation side of machines A and B. [Figure 13] FIG. 4 is a diagram illustrating the amount of heat passing through. [Figure 14] This figure shows the temperature difference when various thermal pads are used on the heat absorption side of machine B. [Figure 15] This figure shows an evaluation of theoretical calculation techniques, parameter design techniques, and simulation techniques for machines A and B. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
[0008] Hereinafter, embodiments will be described in detail with reference to the accompanying drawings.
[0009] As shown in Figures 1 to 3, hair removal device 1, which is a skin treatment device, comprises sapphire glass 2, which is a contact member, a Peltier element 3, which is heat absorption means configured to absorb heat from the sapphire glass 2, a heat sink 4, which is heat dissipation means configured to dissipate the heat absorbed by the Peltier element 3, a fan 5, which is air blowing means for blowing air to the heat sink 4, a laser irradiation unit 6, a power supply unit 7, and a main body casing 10 that houses these components (excluding part of the sapphire glass 2).
[0010] The sapphire glass 2 is a material with high thermal conductivity, and is housed in the main body shell 10 with the contact surface 2a, which is to be in contact with the skin surface of the object, exposed to the outside. The sapphire glass 2 is a flattened rectangular parallelepiped, and has the contact surface 2a, an opposing surface 2b opposing the contact surface 2a, and a side surface 2c constituting the surface from one end of the contact surface 2a to one end of the opposing surface 2b. If the substantial total area of the contact surface 2a, the opposing surface 2b, and the side surface 2c is expressed in A square meters, the substantial height of the contact surface 2a is expressed in L meters, and the amount of heat absorption is expressed in Qc watts, the difference between the surrounding air temperature (e.g., room temperature) and the surface temperature of the sapphire glass 2 is the surface temperature difference ΔTs of the sapphire glass 2, and the surface temperature difference ΔTs of the sapphire glass 2 is expressed by the following formula.
[0011] Surface temperature difference of sapphire glass 2 ΔTs = (amount of heat absorption Qc / (heat transfer area A × 2.51 × 0.56)) 0.8 ×Height L 0.2 and the surface temperature difference ΔTs is configured to exceed 20. The lower limit of the cold temperature is set to a temperature (for example, ΔTs=50) that can prevent low-temperature burns.
[0012] The sapphire glass 2 is held by the main body shell 10 via the heat insulating member 11 and sealed air (not shown) on all four sides, which are heat insulating means. The heat insulating member 11 is, for example, polystyrene foam. The heat conductivity of the heat insulating member 11 is set to be smaller than the heat conductivity of the sapphire glass 2.
[0013] The Peltier element 3 requires a heat supply amount of Qd watts when it generates a heat absorption amount of Qc watts. Thermal pads (not shown) are used for each electrode on the heat absorption side and heat radiation side of the Peltier element 3.
[0014] The heat sink 4 is preferably made of a copper sheet metal material. The thermal conductivity of the copper sheet metal material is 398 (W / mk), which is better than that of aluminum material, and therefore the device can be made smaller. The heat sink 4 has a first cooling section 4A that receives the wind blown out from the outlet 5b of the fan 5 described below, and a second cooling section 4B that receives the wind sucked into the inlet 5a (shown in FIG. 3) described below. The first cooling section 4A and the second cooling section 4B each have a number of fins 4a arranged at intervals from each other, and the first cooling section 4A and the second cooling section 4B are separated by a partition plate 4b to prevent the wind from circulating between them.
[0015] The fan 5 has an air intake 5a (shown in FIG. 3) and an outlet 5b (shown in FIG. 3). The outlet 5b is disposed opposite the fins 4a of the first cooling unit 4A, and blows air against the fins 4a of the first cooling unit 4A. More specifically, the fan 5 is disposed so that the air flows smoothly into the gaps between the multiple fins 4a.
[0016] If the surface area of the fins 4a is AF square meters, the actual length of the fins 4a through which air flows is LF meters, the air speed exhausted from exhaust port 10b described below is V meters / second, the amount of heat generated in the Peltier element 3 is Qc, the amount of heat supplied to the Peltier element 3 to generate Qc is Qd, and the difference between the ambient air temperature and the surface temperature of the fins 4a is the surface temperature difference ΔTh of the heat sink 4, then the surface temperature difference ΔTh of the heat sink 4 can be expressed by the following equation, which is an approximate equation for the heat transfer coefficient of forced convection.
[0017] The surface temperature difference of the heat sink 4 is ΔTh=(Qc+Qd) / (3.86×√(V / LF)×AF), and is configured so that ΔTh does not exceed 10.
[0018] The main body outer shell 10 has a rectangular parallelepiped shape. One side of the main body outer shell 10 is provided with a plurality of intake ports 10a through which the fan 5 draws in air, and a plurality of exhaust ports 10b through which the fan 5 exhausts air. The other side of the main body outer shell 10 is provided with a plurality of exhaust ports 10c through which the wind that has passed through the laser irradiation unit 6 and the power supply unit 7 is exhausted.
[0019] The laser irradiation section 6 is composed of a laser light source, an output circuit section of the laser light source, a reflector surrounding the laser light source, and the like.
[0020] As described above, the device comprises the sapphire glass 2 including the contact surface 2a to be brought into contact with the skin surface, the Peltier element 3 configured to absorb heat from the sapphire glass 2, and the heat sink 4 configured to dissipate the heat absorbed by the Peltier element 3, and is configured so that the surface temperature difference ΔTs of the sapphire glass 2, which is the difference between the surrounding air temperature (e.g., room temperature) and the surface temperature of the sapphire glass 2, exceeds 20 degrees. Therefore, since the surface temperature of the sapphire glass 2 becomes lower than the surrounding air temperature (e.g., room temperature) by more than 20 degrees, the subject (user) who comes into contact with the sapphire glass 2 receives the laser irradiation treatment in a state of feeling a sufficient coolness, improving the comfort of the skin treatment treatment.
[0021] The device includes a Peltier element 3 that requires Qd watts of heat supply when it absorbs Qc watts of heat, a plurality of fins 4a that form part of a heat sink 4, a fan 5 that blows air on the fins 4a, and an exhaust port 10b that is formed in part of a main body outer casing 10. If the surface area of the fins 4a is AF square meters, the effective length of the fins 4a through which air flows is LF meters, and the air speed exhausted from the exhaust port 10b is V meters / second, then (heat sink surface temperature-room temperature) is taken as the surface temperature difference ΔTh of the heat sink 4, and the formula is ΔTh=(Qc+Qd) / (3.86×√(V / LF)×AF), and ΔTh is configured not to exceed 10. Therefore, the surface temperature of the fins 4a becomes less than 10 degrees higher than the surrounding air temperature (for example, room temperature), so sufficient heat dissipation can be achieved.
[0022] The heat sink 4 is equipped with a first cooling section 4A that receives the wind blown out from the outlet 5b of the fan 5, and a second cooling section 4B that receives the wind drawn into the inlet 5a. Therefore, the second cooling section 4B is arranged in the air passage from the inlet 10a of the main body housing 10 to the inlet 5a of the fan 5, so the heat dissipation area of the fins 4a of the heat sink 4 is enlarged, improving the heat dissipation performance. This also makes effective use of space.
[0023] All side surfaces 2c of the sapphire glass 2 are held by the main body outer casing 10 via the heat insulating member 11 and sealed air (no reference number given), which serve as heat insulating means. This makes it possible to prevent the cold heat of the sapphire glass 2 from being dissipated to the main body outer casing 10 as much as possible. In this embodiment, all side surfaces 2c of the sapphire glass 2 are held by the main body outer casing 10 via the heat insulating member 11 and sealed air, but it is only necessary to configure at least one of the opposing surface 2b and the side surfaces 2c of the sapphire glass 2 to be held by the main body outer casing 10 via heat insulating means. The heat insulating member 11 is, for example, polystyrene foam.
[0024] Although the heat insulating member is described as polystyrene foam, it is not limited to this and may be other foamed resins or foamed rubber. By using foamed rubber to surround the contact member, it is possible to improve airtightness in addition to insulation, and the phenomenon of internal condensation due to cooling can be reduced. Although the light source is described as a laser, it is not limited to this and may be an LED or IPL light source. In particular, in the case of an IPL light source, the pain caused by the momentary light emission can be alleviated by cooled sapphire glass, so the generated energy of the IPL can be increased to improve the effect of hair removal, etc.
[0025] Furthermore, although the contact member has been described as being made of sapphire glass, the present invention is not limited to this and may be provided with a filter that cuts off some light wavelengths. This allows the desired light effect to be obtained. In the above description, cooling by a Peltier element has been described, but the present invention is not limited to this and it is also possible to warm the contact member by connecting the heat in the opposite direction, i.e., to collect heat in the air with copper plate fins, have the Peltier element absorb the heat, and release the heat to the contact member. This allows for effective skin treatment, such as increasing blood flow through heating.
[0026] Next, the experiments and theories that led to the proposal of the hair removal device 1 according to the above-mentioned embodiment will be described. As experimental machines, machine A shown in Fig. 4 and machine B shown in Fig. 5 were used. In conclusion, comparative evaluation and theoretical calculation revealed that in order to lower the surface temperature of the sapphire glass 2 to a temperature more than 20 degrees lower than room temperature, the following problem needs to be solved.
[0027] Countermeasure 1: Increase the current to Peltier element 3, improve cooling, and increase the heat absorption capacity to 3.2 W or more. Countermeasure 2: Increase the heat transfer area of sapphire glass 2 to 994 mm 2 Reduce to. Countermeasure 3: Increase the air speed inside the heat sink to 7m / s or more, and increase the heat transfer coefficient to 60W / m 2 Increase to K. Countermeasure 4: By reviewing the material of the heat sink 4, the temperature difference between the heat dissipation side of the Peltier element 3 and the fins 4a is reduced to 5K or less. Solution 5: Fin surface area is 23,136 mm 2 Increase to. Countermeasure 6: Select a thermal pad with high thermal conductivity λ and thin thickness dx.
[0028] The reasons for reaching this conclusion are explained below.
[0029] When considering countermeasures for Machine A, we identified the concerns and proposed improvements shown in Figure 6.
[0030] An experiment was conducted to compare the temperature of the sapphire glass 2 in machine A and machine B, and the contribution of each design parameter was analyzed. As a result, the evaluation results shown in Figure 7 and the results of the sapphire glass surface temperature drop ΔT shown in Figure 8 were obtained.
[0031] In other words, the placement of the fan 5 and the dimensions of the sapphire glass 2 have a large effect on the surface temperature of the sapphire glass 2, while the other factors have a small effect. Therefore, it was found that it was most necessary to improve the parameters that have a large effect.
[0032] The surface temperature of the sapphire glass 2 in the Peltier element 3 is lower in the A model, but this is due to the smaller heat generation of the Peltier element 3. In addition, the combination of parts has a large effect, and it was found that simply changing the current value of the Peltier element 3 was not enough, and that the dimensions of the sapphire glass 2 and the cooling configuration also needed to be reviewed at the same time.
[0033] First, the improvement on the heat absorption side will be described.
[0034] If the difference between the surrounding air temperature (for example, room temperature) and the surface temperature of the sapphire glass 2 is expressed as the surface temperature difference ΔTs of the sapphire glass 2, then the surface temperature difference ΔTs of the sapphire glass 2 is calculated as follows: 0.8 ×Height L 0.2 Therefore, for the B unit, Countermeasure 1: Increase the current to the Peltier element 3, improve cooling, and increase the heat absorption to 3.2 W or more. Countermeasure 2: Increase the heat transfer area of the sapphire glass 2 to 994 mm 2Take measures to reduce this.
[0035] According to the graph shown in FIG. 9, the heat absorption amount Qc of machine B is 3.2 W when the current value of Peltier element 3 is set to about 0.9.
[0036] The heat transfer area A of the sapphire glass 2 of machine B is 0.0009944 m2 in total for the four sides (front, back, left, right) if the glass dimensions are WHD = 30 × 11 × 15 (mm). 2 (=994mm 2 The height L (H) in the above formula is 11 mm. The heat transfer area A of the sapphire glass 2 of the A machine is 0.002282 m2 in total for the four sides (front, back, left, right) with glass dimensions WHD = 32 × 32.6 × 3 (mm). 2 The height L(H) in the above formula is 32.6.
[0037] The value of coefficient C is 0.56 for both machine A and machine B, as shown in Figure 10.
[0038] From these, the results shown in Figure 8 were obtained on the endothermic side.
[0039] Next, improvements on the heat dissipation side will be described.
[0040] The air from the fan 5 is not flowing effectively to the heat sink 4, and the surface area of the heat sink 4 is small, so this needs to be improved. The approximate formula for the heat transfer coefficient of forced convection is expressed as heat transfer coefficient = 3.86 x √ (air speed inside the heat sink V / fin length LF). Convection heat is ignored. Therefore, for Machine B, Countermeasure 3: Increase the air speed inside the heat sink to 7 m / s or more and increase the heat transfer coefficient to 60 W / m 2 K (experimental result: 59.5 W / m 2 Take measures to increase the number of employees to K.
[0041] Heat dissipation Qh = heat transfer coefficient x (heat sink surface temperature - room temperature) x surface area. Therefore, Countermeasure 4: By reviewing the material of the heat sink 4, the temperature difference between the heat dissipation side of the Peltier element 3 and the fin 4a is reduced to 5K or less. Countermeasure 5: By reducing the fin surface area to 23,136 mm 2 Take measures to increase the number of
[0042] Here, if the surface area of the fins 4a is AF square meters, the actual length of the fins 4a through which air flows is LF meters, and the air speed exhausted from exhaust port 10b is V meters / second, the amount of heat generated in the Peltier element 3 is Qc, the amount of heat supplied to the Peltier element 3 to generate Qc is Qd, and (heat sink surface temperature - room temperature) is the surface temperature difference ΔTh of the heat sink 4, then the formula is ΔTh = (Qc + Qd) / (3.86 × √(V / LF) × AF). If the surface temperature difference ΔTh of the heat sink 4 can be set to a small value, a structure with good heat dissipation performance can be obtained.
[0043] Since the value of the current flowing through the Peltier element 3 is 0.9, from FIG. 11, the amount of heat dissipation Qh in the B unit is approximately 13.8, and the amount of heat dissipation Qh in the A unit is approximately 6.0.
[0044] In the case of the A-machine, the heat sink 4 has a structure in which 18 fins 4a with dimensions of 15.3 mm x 18 mm are arranged at intervals. In the A-machine, only 15% of the wind speed of the single fan 5 is utilized. The surface temperature of the heat sink 4 is higher than that of the B-machine, and cooling is insufficient.
[0045] In the B machine, the heat sink 4 has a structure in which 27 fins 4a with dimensions of 20.5 mm x 20.9 mm are arranged at regular intervals. In the B machine, 80% of the wind speed of the single fan 5 is utilized. The wind speed inside the heat sink is 6.4 times that of the A machine, the heat transfer coefficient is 2.3 times that of the A machine, the fin surface area is 2.3 times that of the A machine, and the heat dissipation amount is 2.3 times that of the A machine.
[0046] From these, the results shown in Figure 12 were obtained on the heat dissipation side.
[0047] Next, the temperature gradient and the selection of the thermal pad will be explained.
[0048] If Q is the amount of heat transfer (W), A is the cross-sectional area, λ is the thermal conductivity, and dx is the pad thickness (distance), the temperature difference is expressed as dt = -(Q / A) x (dx / λ). From Figure 13, the amount of heat transfer Q is Q = A λ (Th-Tc) / dx, where Th is the surface temperature and Tc is the temperature after passage.
[0049] Therefore, Countermeasure 6: Select a thermal pad with high thermal conductivity λ and thin thickness dx. On the heat absorption side of machine B, we used thermal conductivity λ: 12W / mk or 6W / mk, pad thickness: 1mm or 2mm, and measured the temperature difference dt. Figure 14 shows the results.
[0050] From FIG. 14, it is clear that even if thermal pads with different thermal conductivities λ and pad thicknesses dx are used, the heat absorption amount Qc and heat dissipation amount Qh of the Peltier element 3 do not change significantly, and therefore the effect is limited.
[0051] From the above, it was found that the data from Machine A is questionable for use in theoretical calculations, parameter design, and simulation technology, but the data from Machine B can be used for theoretical calculations, parameter design, and simulation technology, as shown in Figure 15. Therefore, it was concluded that it is possible to realize a skin treatment device that can lower the temperature of the contact surface that comes into contact with the skin by more than 20 degrees lower than the surrounding air temperature (room temperature) by developing a structure that ensures the desired heat absorption and heat dissipation performance.
[0052] Although the embodiment has been described in detail above, the present invention is not limited to the specific embodiment, and various modifications and changes are possible within the scope of the claims. In addition, it is also possible to combine all or a plurality of the components of the above-described embodiment.
[0053] In addition, the following supplementary notes are disclosed regarding the above embodiment. (Appendix 1) (1) A method for manufacturing a heat absorbing device comprising: a contact member including a contact surface to be brought into contact with an object; heat absorbing means configured to absorb heat from the contact member; and heat dissipating means configured to dissipate the heat absorbed by the heat absorbing means, the contact member further comprising an opposing surface opposing the contact surface and a side surface constituting a surface from one end of the contact surface to one end of the opposing surface, wherein the substantial total area of the contact surface, the opposing surface, and the side surface is expressed in square meters A, the substantial height of the contact surface is expressed in meters L, and the heat absorption amount of the heat absorbing means is expressed in watts Qc, where (heat absorption amount Qc / (heat transfer area A×2.51×0.56)) 0.8 ×Height L 0.2 The present invention is characterized in that the number of the inputs is more than 20. (2) In the configuration of (1) above, the device is characterized in that it has a main body outer shell including the contact member, and at least one of the opposing surface and the side surface is held in place by an insulating means connected to the main body outer shell. (3) In the above configuration (2), the thermal insulation means has a thermal conductivity coefficient smaller than that of the contact member. (4) In the configuration of (1) above, the device is characterized in that it is equipped with the heat absorption means which requires Qd watts of heat supply when generating the heat absorption amount Qc watts, a plurality of fins which form part of the heat dissipation means, a blowing means which blows air onto the fins, and an exhaust port which is formed in a part of the outer casing of the main body, and in which, when the surface area of the fins is expressed in AF square meters, the effective length of the fins through which the air flows is expressed in LF meters, and the wind speed exhausted from the exhaust port is expressed in V meters / second, (Qc+Qd) / (3.86×√(V / LF)×AF) does not exceed 10. (5) In the above configuration (4), the blowing means has an inlet and an outlet, and the outlet is disposed opposite the fins. (6) In the configuration of (5) above, the heat dissipation means is characterized by having a first cooling section that receives the wind blown out from the outlet, and a second cooling section that receives the wind sucked into the inlet. [Explanation of symbols]
[0054] 1 Hair removal device 2 Sapphire glass (contact material) 2a Contact surface 2b Opposite surface 2c side 3 Peltier element (heat absorption means) 4 Heat sink (heat dissipation means) 4A First cooling section 4B Second cooling section 4a Fins 5 Fan (air blowing means) 5a Intake port 10 Body exterior 10b Exhaust port
Claims
1. A contact member including a contact surface to be brought into contact with an object, heat absorbing means configured to absorb heat from the contact member, and heat dissipating means configured to dissipate the heat absorbed by the heat absorbing means, the contact member further comprising an opposing surface opposing the contact surface, and a side surface constituting a surface from one end of the contact surface to one end of the opposing surface, wherein a substantial total area of the contact surface, the opposing surface, and the side surface is expressed in A square meters, a substantial height of the contact surface is expressed in L meters, and a heat absorption amount of the heat absorbing means is expressed in Qc watts, where (heat absorption amount Qc / (heat transfer area A×2.51×0.56)) 0.8 ×Height L 0.2 The skin treatment device is configured so that the number of the skin contacts exceeds 20.
2. The skin treatment device according to claim 1 , further comprising a main body outer shell including the contact member, and at least one of the opposing surface and the side surface is held by the main body outer shell via a heat insulating means.
3. The skin treatment device according to claim 2 , wherein the thermal conductivity of the heat insulating means is smaller than the thermal conductivity of the contact member.
4. 3. The skin treatment device of claim 2, comprising: the heat absorption means which requires Qd watts of heat supply when generating the heat absorption amount Qc watts; a plurality of fins which form part of the heat dissipation means; a blowing means which blows air against the fins; and an exhaust port which is formed in part of the outer casing of the main body, wherein when the surface area of the fins is expressed in AF square meters, the effective length through which the air flows of the fins is expressed in LF meters, and the wind speed exhausted from the exhaust port is expressed in V meters / second, (Qc+Qd) / (3.86×√(V / LF)×AF) is configured so that it does not exceed 10.
5. The skin treatment device according to claim 4 , wherein the air blowing means has an inlet and an outlet, and the outlet is disposed opposite the fins.
6. The skin treatment device according to claim 5 , wherein the heat dissipation means comprises a first cooling section that receives the wind blown out from the outlet, and a second cooling section that receives the wind sucked into the inlet.
Citation Information
Patent Citations
Hair removal device
JP2018061727A