Molding mold, resin molding device, and method for manufacturing resin molded product

Abstract

To provide a molding mold in which an alignment pin can be attached to and detached from a main body of the molding mold by a simple method.SOLUTION: A molding mold includes a first mold 10 and a second mold disposed opposite the first mold 10. The first mold 10 has a main body part 11 having an opposing surface 11S and an alignment pin 12 for aligning a molding object 40 held in the first mold 10. The alignment pin 12 includes a base part 13 disposed inside the main body part 11 and a tip part 14 that is attachable / detachable to / from the base part 13 from the opposing surface 11S side of the main body part 11. The tip part 14 has a small diameter part 14A that aligns the molding object 40 by coming into contact with the molding object 40, and the small diameter part 14A has a diameter D1 that is smaller than a diameter D2 of the base part 13.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present specification relates to a molding die, a resin molding apparatus, and a method for manufacturing a resin molded product. [Background technology]

[0002] In a resin molding apparatus, before the object is resin molded using a molding die, the object is aligned in position. In the apparatus disclosed in JP 2002-076442 A (Patent Document 1), alignment pins (referred to as "substrate pilot pins" in Patent Document 1) are provided on the upper die, and the alignment pins are used to align the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2002-076442 A Summary of the Invention [Problem to be solved by the invention]

[0004] The alignment pins for aligning the object to be molded are incorporated into the body of the mold. If the alignment pins are incorporated into the body of the mold and need to be replaced, it is necessary to remove the mold from the resin molding device or disassemble the mold, which takes time and effort.

[0005] The present specification aims to disclose a molding die in which alignment pins can be attached and detached to the main body of the mold using a simple method, a resin molding device equipped with such a molding die, and a method for manufacturing a resin molded product in which an object to be molded is resin-molded using such a molding die. [Means for solving the problem]

[0006] In a first aspect of the present disclosure, a molding die includes a first die and a second die that is arranged opposite the first die and performs resin molding on an object to be molded while being clamped to the first die, the first die having a main body portion with an opposing surface facing the second die and an alignment pin that aligns the object to be molded held in the first die, the alignment pin having a base portion arranged inside the main body portion and a tip portion that is attachable to and detachable from the base portion from the opposing surface side of the main body portion, the tip portion having a small diameter portion that aligns the object to be molded by contacting the object to be molded, and the small diameter portion has a diameter smaller than the diameter of the base portion.

[0007] In a second aspect of the present disclosure, a resin molding apparatus includes the molding die according to the first aspect of the present disclosure, and a clamping mechanism that clamps the molding die.

[0008] In a third aspect of the present disclosure, a manufacturing method of a resin molding apparatus includes a step of resin molding an object to be molded using the molding die according to the first aspect of the present disclosure. Effect of the Invention

[0009] According to the disclosure of this specification, it is possible to obtain a molding die in which an alignment pin can be attached and detached to the main body of the molding die using a simple technique, a resin molding device equipped with such a molding die, and a manufacturing method for a resin molded product in which an object to be molded is resin molded using such a molding die. [Brief description of the drawings]

[0010] [Figure 1] FIG. 2 is a plan view showing a resin molding apparatus 50. [Diagram 2] 2 is a front view showing a molding section 51 provided in a resin molding device 50. FIG. [Diagram 3] 2 is a cross-sectional view showing a molding die 30 in a molding portion 51. FIG. [Figure 4] 4 is a diagram showing the upper mold 10 as viewed from the direction of the arrow IV in FIG. [Diagram 5]4 is an enlarged cross-sectional view showing an alignment pin 12 and its surrounding structure shown in FIG. 3. [Figure 6] FIG. 2 is a perspective view showing an alignment pin 12. [Figure 7] 2 is a cross-sectional view showing a state in which molding die 30 (upper die 10 and lower die 20) are clamped. FIG. [Figure 8] 1 is a perspective view showing a state in which resin 60 is attached around the tip 14 of the alignment pin 12. FIG. [Figure 9] FIG. 11 is a cross-sectional view showing the configuration of a first modified example that can be used in the resin molding apparatus. [Figure 10] 5 is a diagram showing the configuration of a modified example 2 that can be used in the resin molding apparatus, and corresponds to an enlarged view of a portion of FIG. [Figure 11] 5 is a diagram showing another configuration of the modified example 2 that can be used in the resin molding apparatus, and corresponds to an enlarged view of a portion of FIG. [Figure 12] 11 is a perspective view showing an exploded state of a positioning pin 12 according to a second modified example that can be used in a resin molding apparatus. FIG. [Figure 13] FIG. 11 is a perspective view showing an exploded state of an alignment pin (base portion 13) based on a third modified example that can be used in a resin molding apparatus. [Figure 14] 13 is a diagram showing the configuration of a fourth modified example that can be used in the resin molding apparatus, and corresponds to a diagram showing an enlarged portion of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] The following describes the embodiments. In the embodiments described below, when numbers, amounts, etc. are mentioned, the scope of the present disclosure is not necessarily limited to the numbers, amounts, etc., unless otherwise specified. Each component is not necessarily essential to the present disclosure, unless otherwise specified. The same reference numbers are used for the same parts and corresponding parts, and duplicate descriptions may not be repeated.

[0012] [Resin molding equipment 50] 1 is a plan view showing a resin molding apparatus 50. The resin molding apparatus 50 performs resin molding on a molding object. The resin molding apparatus 50 includes a supply storage module 63, a molding module 64, and a material supply module 65 as components.

[0013] (Supply Storage Module 63) The supply storage module 63 is provided with a supply section 67 which supplies a pre-sealing substrate 66 (molding object), a storage section 69 which stores a sealed substrate 68 (resin molded product), a placement section 70 which transfers the pre-sealing substrate 66 and the sealed substrate 68, and a transport mechanism 71 which transports the pre-sealing substrate 66 and the sealed substrate 68. In Fig. 1, the transport mechanism 71 is disposed at a standby position S1.

[0014] (Molding module 64 and molding section 51) Fig. 2 is a front view showing the molding section 51 provided in the resin molding apparatus 50. Fig. 3 is a cross-sectional view showing the molding die 30 in the molding section 51. The molding module 64 (Fig. 1) is provided with the molding section 51. The molding section 51 (see Fig. 2) has the molding die 30, an upper base 52, a lower base 53, tie bars 54, a lifting platen 55, and a mold clamping mechanism 57.

[0015] The molding die 30 includes an upper die 10 (first die) and a lower die 20 (second die) disposed opposite the upper die 10. The upper die 10 is fixed to an upper base 52, and the lower die 20 is disposed below the upper die 10. The lower die 20 (see Figs. 2 and 3) includes a peripheral member 22, a bottom member 23, an elastic body 24, and a base member 25, and the base member 25 is fixed to a lifting platen 55. The peripheral member 22 and the bottom member 23 form a main body 21 of the lower die 20. The peripheral member 22 and the bottom member 23 are driven up and down together by a mold clamping mechanism 57 (lifting platen 55).

[0016] The lower die 20 is provided with a cavity 21C, into which a release film 37 (FIG. 1) and a resin material (not shown) are supplied. In this embodiment, the cavity is formed by the peripheral member 22 and the bottom member 23, but the cavity 21C may be formed integrally. A clamping mechanism 57 clamps and opens the upper die 10 and the lower die 20, and in the clamped state, the upper die 10 and the lower die 20 perform resin molding on the molding object.

[0017] (Material Supply Module 65) The material supply module 65 is provided with a table 72, a supply mechanism 73 that supplies the release film 37 to the table 72, a storage mechanism 74 that stores a resin material, an input mechanism 75 that inputs the resin material into the storage mechanism 74, a transport mechanism 76 that transports the release film 37 and the storage mechanism 74, and a cleaning mechanism 77 that cleans the storage mechanism 74. In Fig. 1, the transport mechanism 76 is disposed at a standby position M1 (a position where the transport mechanism 76 waits when not in operation).

[0018] (Method of manufacturing resin molded products) The manufacturing method of a resin molded product performed by the resin molding apparatus 50 is as follows. In the supply and storage module 63 (FIG. 1), the pre-sealing substrate 66 is sent from the supply section 67 to the placement section 70, and the transport mechanism 71 receives the pre-sealing substrate 66 from the placement section 70. The transport mechanism 71 moves to place the pre-sealing substrate 66 at position C1 on the lower mold 20 of the molding module 64. The transport mechanism 71 moves up to set the pre-sealing substrate 66 on the upper mold 10. At this time, the alignment pins 12 (FIG. 3) are used. Details of the alignment pins 12 will be described later with reference to FIGS. 3 to 8.

[0019] In the material supply module 65, the release film 37 is placed on the table 72 from the supply mechanism 73. The storage mechanism 74 cleaned by the cleaning mechanism 77 is placed on the release film 37, and after the release film 37 and the storage mechanism 74 are integrated, the table 72 moves above the resin input port of the input mechanism 75, and the resin material is supplied from the input mechanism 75 to the storage mechanism 74 on the table 72. Then, the conveying mechanism 76 receives the integrated release film 37 and the storage mechanism 74 from the table 72. The conveying mechanism 76 moves to a position C1 on the lower mold 20 via a position P1 of the molding module 64, where the release film 37 and the resin material supplied thereon are supplied to the cavity 21C of the lower mold 20. The storage mechanism 74 is conveyed to the material supply module 65 by the conveying mechanism 76.

[0020] In the molding section 51, the lower die 20 is raised by the clamping mechanism 57, and the upper die 10 and the lower die 20 are clamped together. With the upper die 10 and the lower die 20 clamped together, resin molding is performed on the pre-sealed substrate 66 (molding object). After a predetermined time has elapsed, the upper die 10 and the lower die 20 are opened. The transport mechanism 71 receives the sealed substrate 68 and delivers the sealed substrate 68 to the placement section 70. The sealed substrate 68 is stored from the placement section 70 in the storage section 69. The method for manufacturing a resin molded product performed by the resin molding apparatus 50 is as described above.

[0021] (Main body 11 and alignment pin 12) Fig. 4 is a diagram showing the upper mold 10 as viewed from the direction of arrow IV in Fig. 3. Fig. 5 is an enlarged cross-sectional view showing the alignment pin 12 and its surrounding structure shown in Fig. 3. As shown in Figs. 3 to 5, the upper mold 10 of the resin molding apparatus 50 has a main body portion 11 and the alignment pin 12.

[0022] The main body 11 includes plate-shaped portions 11A, 11B, and 11C. The plate-shaped portions 11A, 11B, and 11C are stacked in this order from the side closer to the lower mold 20 to the side farther from the lower mold 20. The plate-shaped portion 11A has an opposing surface 11S (parting surface) that faces an upper surface 21S of the lower mold 20. As shown in FIG. 5, a through hole 11M is formed in the plate-shaped portion 11A, and a through hole 11N is formed in the plate-shaped portion 11B. The through holes 11M and 11N extend in a direction parallel to the mold clamping direction (or mold opening direction) and are arranged so that their respective central axes coincide with each other.

[0023] 6 is a perspective view showing the alignment pin 12. The alignment pin 12 aligns the molding object 40 (corresponding to the pre-sealing substrate 66 in FIG. 1) held by the upper die 10. The alignment pin 12 is formed in a generally rod-like shape. The alignment pin 12 includes a base portion 13 and a tip portion 14, and is disposed inside the through-holes 11M, 11N (FIG. 5). The base portion 13 is disposed inside the main body portion 11, and the tip portion 14 is attachable to and detachable from the base portion 13 from the side of the opposing surface 11S of the main body portion 11 (arrow AR in FIG. 5).

[0024] Tip portion 14 is attached to base portion 13 by, for example, screwing (fitting a screw). Tip portion 14 may have a tool hole 14H in a top surface 14T for fitting a tool (such as a hexagonal wrench). The means of attachment is not limited to screwing, and tip portion 14 may be attached to base portion 13 by other detachable means such as press-fitting or fitting.

[0025] The tip 14 of the alignment pin 12 has a small diameter portion 14A, a base portion 14B, and a screw portion 14C. The small diameter portion 14A aligns the object 40 by contacting the object 40 (see FIG. 3). When the upper mold 10 and the lower mold 20 are in an open state, it is preferable that the small diameter portion 14A protrudes from the opposing surface 11S.

[0026] The small diameter portion 14A aligns the object 40 by contacting the outer circumferential surface of the small diameter portion 14A with the side surface 41 of the object 40. The alignment pin 12 functions as a so-called guide pin. If the object 40 has a through hole, the object 40 may be aligned by inserting the small diameter portion 14A into the through hole. In this case, the alignment pin 12 functions as a so-called pilot pin.

[0027] The base portion 14B (FIG. 5) is provided between the small diameter portion 14A and the screw portion 14C. The base portion 14B is attached to the base portion 13 via the screw portion 14C. When the tip portion 14 is attached to the base portion 13, the base portion 14B of the tip portion 14 is located between the small diameter portion 14A and the base portion 13 (top surface 13T). In FIG. 5, the tip portion 14 in a state removed from the base portion 13 is illustrated using a dashed line. The small diameter portion 14A has a diameter D1, and the base portion 14B has a diameter D2, and the diameter D1 is smaller than the diameter D2. The diameter D1 of the small diameter portion 14A is set according to the size of the object 40 to be molded. When the object 40 to be molded has a size of φ300 mm and an external tolerance of, for example, ±0.5 mm, the diameter D1 is, for example, φ2.0 mm to φ2.5 mm.

[0028] Base portion 13 has shaft portion 13A and flange portion 13B. Shaft portion 13A has diameter D3, and small diameter portion 14A has diameter D1 smaller than diameter D3 of shaft portion 13A. Top surface 13T of shaft portion 13A of base portion 13 is provided with hole 13H that screws into screw portion 14C of tip portion 14.

[0029] Here, the upper die 10 further has an elastic member 15. The elastic member 15 is provided on the side opposite to the side where the tip portion 14 of the base portion 13 is attached and detached (i.e., on the side of the flange portion 13B). The elastic member 15 applies the force of the lower die 20 to the base portion 13. A step portion 11J is provided on the plate-like portion 11B, and the flange portion 13B comes into contact with the step portion 11J, thereby restricting the base portion 13 from moving further in the direction approaching the lower die 20 from the state shown in FIG.

[0030] 7 is a cross-sectional view showing the state in which molding die 30 (upper die 10 and lower die 20) are clamped. When molding die 30 is clamped, a portion of molding object 40 to be resin molded (not shown, for example, a semiconductor chip) is accommodated inside cavity 21C of lower die 20 to which a release film (not shown) and resin material (not shown) have been supplied. Top surface 21S of lower die 20 (main body 21) moves alignment pin 12 into through holes 11M, 11N. Resin molding is performed in this state.

[0031] (Action and Effects) In a resin molding device, when resin molding is performed on an object to be molded, the object must be aligned with the mold with high accuracy. When resin molding is performed on objects of different sizes and shapes, or when the alignment pins have deteriorated, the alignment pins are replaced.

[0032] In the resin molding device 50, the alignment pin 12 is composed of two members, a base portion 13 and a tip portion 14. The base portion 13 and the tip portion 14 are separable from each other. For example, a number of types of tip portions 14 with different diameters D1 of the small diameter portion 14A are prepared, and the tip portion 14 that is fully suited to the size and shape of the object to be molded is selected and used. The base portion 13 can be commonly used regardless of the size and shape of the object to be molded 40.

[0033] In the resin molding apparatus 50, the base portion 13 of the alignment pin 12 is disposed inside the main body portion 11, and the tip portion 14 is attachable to and detachable from the base portion 13 from the opposing surface 11S side of the main body portion 11 (arrow AR in FIG. 5). That is, the alignment pin 12 can be attached to and detachable from the main body portion 11 of the upper mold 10 by a simple method. When attaching and detaching the alignment pin 12 to and from the main body portion 11 of the molding die 30 (upper mold 10), there is no particular need to perform tasks such as waiting for the temperature of the molding die 30 to drop to a level at which the molding die 30 can be attached and detached, removing the molding die 30 from the resin molding apparatus 50, or disassembling the molding die 30, and the time and effort required for attachment and detachment are reduced compared to when such tasks are required.

[0034] In particular, when molding object 40 is a large semiconductor wafer or the like, molding die 30 becomes large in size and weight, and therefore, operations such as removing molding die 30 from resin molding apparatus 50 and disassembling molding die 30 involve a large load. In contrast, with resin molding apparatus 50, tip portion 14 can be easily attached to and detached from pedestal portion 13 without such a workload by simply opening molding die 30 (arrow AR in FIG. 5).

[0035] 8, after the resin molding is completed, resin 60 may be attached around small diameter portion 14A of tip portion 14. Resin 60 can be easily removed by removing tip portion 14 from base portion 13.

[0036] (Variation 1) 9 is a cross-sectional view showing the configuration of Modification 1 that can be used in a resin molding apparatus. In Modification 1, the main body 11 of the upper mold 10 does not include the elastic member 15 (FIG. 5). A fixing member 16 is disposed between the base portion 13 and the plate-shaped portion 11C of the alignment pin 12. In Modification 1, the position of the alignment pin 12 does not change before and after mold clamping.

[0037] A recess 26 is formed in the main body 21 of the lower mold 20. The recess 26 is formed corresponding to the position and shape of the tip 14 (small diameter portion 14A) of the alignment pin 12, and the recess 26 accommodates the tip 14 (small diameter portion 14A) of the alignment pin 12 when the mold is closed, and functions as a so-called escape portion. Even in the alignment pin 12 configured in this manner, the tip 14 of the alignment pin 12 is attachable to and detachable from the base portion 13 from the side of the opposing surface 11S of the main body 11 (see the arrow AR in FIG. 5).

[0038] (Variation 2) Fig. 10 is a diagram showing the configuration of a modified example 2 that can be employed in a resin molding apparatus, and corresponds to a diagram showing an enlarged portion of Fig. 4. In the alignment pin 12 of the modified example 2, the small diameter portion 14A is formed in a cylindrical shape, and has a central axis 14AX. The base portion 14B is also formed in a cylindrical shape, and has a central axis 14BX. The central axes 14AX, 14BX extend in a direction parallel to the mold clamping direction (or mold opening direction).

[0039] On the other hand, the small diameter portion 14A is provided eccentrically with respect to the center of the base portion 14B in a direction perpendicular to the mold fastening direction (or mold opening direction). That is, the central axis 14AX is disposed at a position shifted from the central axis 14BX in a direction perpendicular to the mold fastening direction (or mold opening direction).

[0040] When the alignment pin 12 having the above configuration is used, it becomes possible to align objects 40 having different sizes (outline tolerances) by changing the rotation angle of the tip 14 inside the through hole 11M. For example, Fig. 10 shows a state in which an object 40 having a diameter DS1 is being aligned.

[0041] Fig. 11 shows a state in which the object 40 having a diameter DS2 is being aligned. Compared to the case of Fig. 10, in Fig. 11, the central axis 14AX is positioned closer to the side surface 41 of the object 40 with respect to the central axis 14BX. The diameter DS2 of the object 40 is smaller than the diameter DS1 in the case of Fig. 10.

[0042] As shown in Fig. 12, when changing the rotation angle of tip portion 14 inside through-hole 11M, for example, the following method can be adopted. In tip portion 14 shown in Fig. 12, protrusion 14E having an embossed shape is provided on end surface 14S of base portion 14B, and recess 13E corresponding to the shape of protrusion 14E is provided on top surface 13T of shaft portion 13A.

[0043] By preparing a plurality of types of tip portions 14 with different positions of protrusions 14E, it becomes possible to set the rotation angle of tip portion 14 inside through hole 11M to any value, and thus to align objects 40 of different sizes. In order to fix the rotation angle of base portion 13 inside through hole 11N, a reference surface 13K may be provided on a part of the outer periphery of base portion 13. By providing a member that presses reference surface 13K, for example, it is possible to restrict the rotation of base portion 13.

[0044] (Variation 3) As shown in Fig. 13, when changing the rotation angle of tip portion 14 inside through hole 11M, for example, the following method can be adopted. Shank portion 13A shown in Fig. 13 has spacer portion 13A1 and base portion 13A2. An embossed projection 13P is provided on end surface 13X of spacer portion 13A1, and a recess 13Q corresponding to the shape of projection 13P is provided on top surface 13Y of base portion 13A2.

[0045] By preparing multiple types of spacer portions 13A1 with different positions of the protrusions 13P, it becomes possible to set the rotation angle of the spacer portion 13A1 inside the through hole 11M to any value, and thus it becomes possible to set the rotation angle of the tip portion 14 to any value, thereby making it possible to align molded objects 40 having different sizes.

[0046] (Variation 4) As shown in Fig. 14, when changing the rotation angle of the tip portion 14 inside the through hole 11M, for example, the following method can be adopted. In the example shown in Fig. 14, the fastening member 16A is arranged so as to penetrate a part of the upper mold 10 (main body portion 11), and the fastening member 16A is pressed against the outer circumferential surface of the base portion 14B by the fastener 16B. This makes it possible to set the rotation angle of the tip portion 14 inside the through hole 11M to an arbitrary value, and ultimately makes it possible to align objects 40 of different sizes.

[0047] (Other variations) In the resin molding apparatus 50, the upper mold 10 corresponds to the first mold, the lower mold 20 corresponds to the second mold, and the upper mold 10 is provided with an alignment pin 12. This is not limited to the above case, and the lower mold 20 may be provided with an alignment pin having a similar configuration to the alignment pin 12. In this case, the lower mold 20 corresponds to the first mold, and the upper mold 10 corresponds to the second mold.

[0048] In the resin molding apparatus 50, the object to be molded is, for example, a semiconductor wafer. The object to be molded may be a printed circuit board, a ceramic board, a lead frame, or the like. The shape (in plan view) of the object to be molded may be rectangular or square, or may be circular like a semiconductor wafer. The resin molding apparatus 50 uses a compression molding method. The technical concept related to the resin molding apparatus 50 disclosed in the above description is also applicable to a transfer molding method or an injection molding method.

[0049] In the resin molding apparatus 50, the end side surface of the molding object 40 is not resin molded, but the end side surface of the molding object may be resin molded. Also, in the resin molding apparatus 50, a release film is not used on the molding die that holds the molding object 40, but a release film may be used on the molding die that holds the molding object. In this case, the alignment pin aligns the molding object via the release film.

[0050] Although the embodiment of the present disclosure has been described above, the embodiment disclosed herein should be considered as illustrative and not restrictive in all respects. The scope of the present disclosure is defined by the claims, and it is intended to include all modifications within the scope and meaning equivalent to the claims. [Explanation of symbols]

[0051] 10 upper die, 11, 21 main body, 11A, 11B, 11C plate-shaped portion, 11J step portion, 11M, 11N through hole, 11S opposing surface, 12 alignment pin, 13 pedestal portion, 13A shaft portion, 13A1 spacer portion, 13A2 base portion, 13B flange portion, 13E, 13Q recess, 13H hole, 13K reference surface, 13P, 14E protrusion, 13T, 13Y, 14T top surface, 13X, 14S end surface, 14 tip portion, 14A small diameter portion, 14AX, 14BX central axis, 14B base portion, 14C screw portion, 14H tool hole, 15 elastic member, 16 fixing member, 16A fastening member, 16B fastener, 20 lower die, 21C Cavity, 21S, upper surface, 22, peripheral surface member, 23, bottom surface member, 24, elastic body, 25, base member, 26, recess, 30, molding die, 37, release film, 40, molding target object, 41, side, 50, resin molding device, 51, molding section, 52, upper base, 53, lower base, 54, tie bar, 55, lift plate, 57, mold clamping mechanism, 60, resin, 63, supply storage module, 64, molding module, 65, material supply module, 66, pre-sealing substrate, 67, supply section, 68, sealed substrate, 69, storage section, 70, placement section, 71, 76, conveying mechanism, 72, table, 73, supply mechanism, 74, accommodation mechanism, 75, input mechanism, 77, cleaning mechanism, AR, IV, arrow, C1, P1, position, D1, D2, D3, DS1, DS2 Diameter, M1, S1 standby position.

Claims

1. A mold comprising: Type 1 and a second mold that is disposed opposite to the first mold and that performs resin molding on a molding object in a state where the second mold is clamped to the first mold, The first type is A main body portion having an opposing surface facing the second mold; and an alignment pin for aligning the molding object held by the first mold, The alignment pin is A base portion disposed inside the main body portion; a tip portion that is detachable from the base portion from the opposing surface side of the main body portion, the tip portion has a small diameter portion that contacts the object to be molded to align the object, The small diameter portion has a diameter smaller than a diameter of the base portion. Molding mold.

2. The tip portion is attached to the base portion by screwing. The mold according to claim 1 .

3. When the first die and the second die are in an open state, the small diameter portion protrudes from the opposing surface. The mold according to claim 1 or 2.

4. the small diameter portion aligns the object by contacting a side surface of the object; The mold according to any one of claims 1 to 3.

5. the first mold further includes an elastic member on a side of the base portion opposite to a side to which the tip portion is attached and detached, The elastic member applies a force to the base portion in a direction toward the second die. The mold according to any one of claims 1 to 4.

6. The diameter of the small diameter portion is set according to the size of the object to be molded. The mold according to any one of claims 1 to 5.

7. The tip portion has a base portion attached to the pedestal portion, the base portion is located between the small diameter portion and the pedestal portion, The small diameter portion is provided eccentrically with respect to the center of the base portion in a direction perpendicular to a mold clamping direction. The mold according to any one of claims 1 to 6.

8. A resin molding apparatus for resin molding an object to be molded, The mold according to any one of claims 1 to 7, A mold clamping mechanism for clamping the molding die. Resin molding equipment.

9. A method for producing a resin molded product, comprising the step of resin molding an object using the molding die according to claim 1 .

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