Semiconductor module

Abstract

To make a module compact by eliminating the need to mount a support pin specially supporting a printed board.SOLUTION: A semiconductor module comprises an internal terminal unit 61. The internal terminal unit 61 includes an internal terminal group 61g including a plurality of internal terminals 61a, 61b, 61c, and 61d having a first width, and at least one extension internal terminal 61w having a step part sp1 formed to a first width and a second width extended from the first width in one direction so as to support a printed board 7 with the step part sp1. The extension internal terminal 61w is provided at an end part of the internal terminal unit 61. The second width is formed by being extended from the end part as an initial point in the opposite direction from the array direction of the plurality of internal terminals 61a, 61b, 61c, and 61d.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to a semiconductor module. [Background technology]

[0002] In the semiconductor module, a guide pin protruding from the top surface of the housing to the outside has at least one step in the height direction toward the tip furthest from the top surface of the housing (see, for example, Patent Document 1). Also, the height from the top surface of the insulating circuit board to the top surface of the support part is higher than the height from the top surface of the insulating circuit board to the top surface of the semiconductor chip (see, for example, Patent Document 2).

[0003] Furthermore, the terminals at both ends of the multiple terminals attached in a row to the package body are tapered terminals, and the tip portions of the tapered terminals have a third surface that is the surface opposite to the second surface facing the adjacent terminal, and the third surface is formed in a stepped shape (see, for example, Patent Document 3).The package also includes a terminal holding portion that holds the terminal of the high heat generating element, and element holding means made of a non-conductor that is positioned and fixed to the heat sink together with the high heat generating element (see, for example, Patent Document 4).

[0004] Furthermore, a printed circuit board for internal wiring is incorporated in the package, and the conductive pattern of the insulating board and the auxiliary terminals are connected via the printed circuit board (see, for example, Patent Document 5). Also, before soldering the main terminals and signal terminals onto the heat sink, the middle parts of the terminals are soldered to the printed circuit board in advance, and then the assembly consisting of the printed circuit board and the terminals is mounted on the heat sink and the lower ends of the terminals are soldered (see, for example, Patent Document 6).

[0005] Furthermore, a connection terminal is provided in which a protrusion capable of engaging with the through hole in the removal direction is formed on a press-fit portion that is resiliently inserted into a conductive through hole formed in a circuit board and a conductive portion connected to an electronic component (see, for example, Patent Document 7). [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2018-195714 A [Patent Document 2] Patent Publication No. 2021-197490 [Patent Document 3] JP 2010-16289 A [Patent Document 4] JP 2012-69649 A [Patent Document 5] Japanese Patent Application Publication No. 7-335801 [Patent Document 6] Japanese Patent Application Publication No. 6-291230 [Patent Document 7] JP 2017-84553 A Summary of the Invention [Problem to be solved by the invention]

[0007] An object of the present invention is to provide a semiconductor module that enables the module to be miniaturized by eliminating the need for mounting support pins specialized for supporting a printed circuit board. [Means for solving the problem]

[0008] In order to solve the above problem, a semiconductor module is provided. The semiconductor module includes an internal terminal unit. The internal terminal unit includes an internal terminal group including a plurality of internal terminals having a first width, and at least one extended internal terminal having a step portion formed of the first width and a second width obtained by extending the first width in one direction, and supporting the printed circuit board by the step portion. The extended internal terminal is provided at an end portion of the internal terminal unit. The second width is formed by extending from the end portion in a direction opposite to the arrangement direction of the plurality of internal terminals. Effect of the Invention

[0009] According to one aspect, it becomes possible to miniaturize the module by eliminating the need for mounting support pins specialized for supporting a printed circuit board. [Brief description of the drawings]

[0010] [Figure 1] FIG. 2 is a perspective view of a semiconductor module. [Diagram 2] FIG. 2 is a plan view of a semiconductor module. [Diagram 3] 1 is a plan view of a semiconductor module with a printed circuit board supported thereon; [Figure 4] 4A and 4B are diagrams illustrating an example of a configuration of an internal terminal unit. [Diagram 5] FIG. 13 is a diagram for explaining a step portion. [Figure 6] FIG. 4 is a diagram showing the pin width of an internal terminal. [Figure 7] 1 is a diagram showing the relationship between an internal terminal and a hole size of a printed circuit board, in which (a) is a plan view of the internal terminal and the hole of the printed circuit board, and (b) is a plan view of the state in which the internal terminal is inserted into the hole of the printed circuit board. [Figure 8] FIG. 11 is a diagram showing the pin width of an extended internal terminal. [Figure 9] FIG. 11 is a diagram showing the relationship between the extended internal terminal and the hole size of the printed circuit board, where (a) is a plan view of the extended internal terminal and the hole in the printed circuit board, and (b) is a plan view of the extended internal terminal inserted into the hole in the printed circuit board. [Figure 10] 1A and 1B are diagrams showing an example of solder joints between internal terminals and holes in a printed circuit board; [Figure 11] 11A and 11B are diagrams showing an example of solder joints between extension internal terminals and holes in a printed circuit board; [Figure 12] 1A and 1B are diagrams illustrating a state in which an internal terminal unit is joined to a circuit pattern on an insulating substrate, where (a) is a plan view of the internal terminal unit, and (b) is a side view of the internal terminal unit when it supports a printed circuit board. [Figure 13] 5A and 5B are diagrams illustrating a state in which an internal terminal unit is joined to a circuit pattern on a printed circuit board. [Figure 14] 5A and 5B are diagrams illustrating a state in which an internal terminal unit is joined to a circuit pattern on a printed circuit board. [Figure 15] FIG. 1 is a diagram showing an example of an embodiment of a configuration for supporting a printed circuit board. [Figure 16] 11A and 11B are diagrams illustrating a comparative example of a configuration for supporting a printed circuit board. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment of the invention will be described with reference to the drawings. In the following description, the terms "front surface" and "upper surface" refer to the XY surface facing upward (+Z direction) in the semiconductor module 10 in FIG. 1 and FIG. 2, etc. Similarly, "up" refers to the upward (+Z direction) direction in the semiconductor module 10 in FIG. 1 and FIG. 2, etc. Similarly, the terms "back surface" and "lower surface" refer to the XY surface facing downward (-Z direction) in the semiconductor module 10 in FIG. 1 and FIG. 2, etc. Similarly, the terms "lower" refer to the downward (-Z direction) direction in the semiconductor module 10 in FIG. 1 and FIG. 2, etc. Similar directions are used in other drawings as necessary. The terms "front surface", "upper surface", "upper", "back surface", "lower surface", "lower", and "side surface" are merely convenient expressions for identifying relative positional relationships and do not limit the technical idea of ​​the present invention. For example, "upper" and "lower" do not necessarily mean the vertical direction with respect to the ground. In other words, the directions of "upper" and "lower" are not limited to the direction of gravity.

[0012] Fig. 1 is a perspective view of a semiconductor module. Fig. 2 is a plan view of the semiconductor module. In the example of Fig. 1 and Fig. 2, a semiconductor module 10 including a function of a three-phase inverter circuit is shown. The semiconductor module 10 has a metal base 11, a first insulating substrate 21a, a second insulating substrate 21b, a case (terminal case) 30, a first insulating member 40, and a second insulating member 50.

[0013] The metal base 11 is used for dissipating heat from the semiconductor module 10, and is mainly composed of a metal with excellent thermal conductivity. Examples of such metals include copper, aluminum, and alloys containing at least one of these. In order to improve the corrosion resistance of the metal base 11, a plating process may be performed. In this case, the plating material used is, for example, nickel, a nickel-phosphorus alloy, or a nickel-boron alloy.

[0014] The first insulating substrate 21a and the second insulating substrate 21b are disposed on a metal base 11. The first insulating substrate 21a and the second insulating substrate 21b are fixed to the metal base 11 by, for example, soldering. The first insulating substrate 21a and the second insulating substrate 21b are made of ceramics with excellent thermal conductivity. Such ceramics include aluminum oxide, aluminum nitride, silicon nitride, and the like, which have high temperature conductivity.

[0015] 2, a first semiconductor element 22a and a first conductive plate 23a electrically connected to the first semiconductor element 22a are provided on the front surface of the first insulating substrate 21a. Similarly, a second semiconductor element 22b and a second conductive plate 23b electrically connected to the second semiconductor element 22b are provided on the front surface of the second insulating substrate 21b.

[0016] The first semiconductor element 22a and the second semiconductor element 22b shown in Fig. 2 include switching elements such as power MOSFETs (Metal Oxide Semiconductor Field Effect Transistors) or IGBTs (Insulated Gate Bipolar Transistors). The first semiconductor element 22a functions as an upper arm switching element, and the second semiconductor element 22b functions as a lower arm switching element. In the case of a power MOSFET, such switching elements each include a drain electrode, which is an input electrode, as a main electrode on the back surface, and a gate electrode, which is a control electrode, and a source electrode, which is an output electrode, as main electrodes on the front surface.

[0017] In the case of an IGBT, a collector electrode which is an input electrode is provided as a main electrode on the back surface, and a gate electrode which is a control electrode and an emitter electrode which is an output electrode are provided as main electrodes on the front surface.

[0018] The first semiconductor element 22a and the second semiconductor element 22b may be RC (Reverse-Conducting)-IGBTs. The RC-IGBTs have both the functions of an IGBT and a FWD (Free Wheeling Diode), which is a diode element. The first semiconductor element 22a and the second semiconductor element 22b may be power MOSFETs made of silicon carbide. The body diode of a power MOSFET (including those made of silicon carbide) may perform the same function as the FWD of an RC-IGBT.

[0019] The first conductive plate 23a is included in a circuit pattern provided on the front surface of the first insulating substrate 21a. The second conductive plate 23b is included in a circuit pattern provided on the front surface of the second insulating substrate 21b. These circuit patterns are made of a metal with excellent conductivity. Such a metal is copper or a copper alloy.

[0020] The number and shape of the circuit patterns are appropriately selected according to the specifications of the semiconductor module 10. For example, a DCB (Direct Copper Bonding) substrate or an AMB (Active Metal Brazed) substrate can be used as the first insulating substrate 21a and the second insulating substrate 21b on which such circuit patterns are provided.

[0021] Furthermore, internal terminal units 61, . . . , 67 are provided on the bottom surface of the case 30 and are integrated with the resin case 30. The resin is usually molded from a thermoplastic resin. Specifically, there are super engineering plastics such as amorphous polyarylate, polysulfone, polyethersulfone, polyphenylene sulfide, polyetheretherketone, polyimide, polyetherimide, liquid crystal polymer, engineering plastics such as polyacetal, polyamide, polycarbonate, modified polyphenylene ether, polybutylene terephthalate, glass fiber reinforced polyethylene terephthalate, ultra-high molecular weight polyethylene, syndiotactic polyethylene, polyethylene, polypropylene, polyvinyl chloride, polystyrene, polyvinyl acetate, Teflon (registered trademark), acrylonitrile butadiene styrene, acrylic, etc.

[0022] Alternatively, the resin may be a thermosetting resin, specifically, epoxy resin, silicone resin, acrylic resin, urethane resin, phenol resin, melamine resin, urea resin, unsaturated polyester resin, alkyd resin, etc., but is not limited thereto, and ceramics, etc. may also be used.

[0023] On the other hand, the back surface of first semiconductor element 22a and the front surface of first conductive plate 23a are joined by, for example, soldering, thereby electrically connecting first semiconductor element 22a and first conductive plate 23a.

[0024] The output electrode of the first semiconductor element 22a is electrically connected to a third conductive plate 23c included in a circuit pattern provided on the front surface of the first insulating substrate 21a. The gate electrode of the first semiconductor element 22a is electrically connected to a control terminal 35a of an internal terminal unit 66 provided in the case 30. Although not shown in the figure, a wiring member such as a bonding wire is used for the electrical connection.

[0025] Although not shown, the output electrode of the second semiconductor element 22b is electrically connected to the second conductive plate 23b by a wiring member such as a bonding wire. Although not shown, the gate electrode of the second semiconductor element 22b is also electrically connected to the control terminal 35b of the internal terminal unit 62 provided in the case 30 by a wiring member such as a bonding wire. The back surface of second semiconductor element 22b is joined, for example, by soldering, to the front surface of fourth conductive plate 23d included in a circuit pattern provided on the front surface of second insulating substrate 21b.

[0026] Other semiconductor elements may be provided on the first insulating substrate 21a and the second insulating substrate 21b. In the example of Fig. 1 and Fig. 2, a semiconductor element 24b including a diode is provided on the second insulating substrate 21b. The diode is, for example, an SBD (Schottky Barrier Diode) or a PiN (P-intrinsic-N) diode, and is provided in inverse parallel to the switching element as an FWD. Such a semiconductor element 24b has an output electrode (cathode electrode) as a main electrode on the back surface and an input electrode (anode electrode) as a main electrode on the front surface.

[0027] The back surface of the semiconductor element 24b is joined to the front surface of the fourth conductive plate 23d by solder. Although not shown, an input electrode on the front surface of the semiconductor element 24b is electrically connected to the second conductive plate 23b by a wiring member such as a bonding wire.

[0028] 1 and 2, a semiconductor element including a similar diode is also provided on the first insulating substrate 21a. Three pairs of the first insulating substrate 21a and the second insulating substrate 21b on which the above-mentioned semiconductor elements and conductive plates are provided are arranged in the X direction on the metal base 11. An insulating substrate on which a brake circuit or the like is formed may also be arranged on the metal base 11.

[0029] The case 30 is formed by integrally molding a frame-shaped housing 34 with a first lead frame 31, a second lead frame 32, a third lead frame 33, and various terminals such as the above-mentioned control terminals 35a, 35b.

[0030] The first lead frame 31, the second lead frame 32, and the third lead frame 33 are external connection terminals for main current. The first lead frame 31 includes a first wiring portion that is wired in parallel to the front surfaces of the first insulating substrate 21a and the second insulating substrate 21b, and is joined to the first conductive plate 23a.

[0031] The first lead frame 31 and the first conductive plate 23a are joined by soldering, ultrasonic bonding, or the like. Both ends of the first lead frame 31 function as terminal portions 31b, 31c. The terminal portions 31b, 31c are exposed at the top of the housing 34 and on the front surface of a lid (not shown) of the semiconductor module 10.

[0032] The second lead frame 32 includes a second wiring portion that overlaps the front surface of the first wiring portion with a gap therebetween and is wired along the wiring direction (X direction) of the first wiring portion. The second lead frame 32 is also joined to the second conductive plate 23b. The second lead frame 32 and the second conductive plate 23b are joined by solder bonding, ultrasonic bonding, or the like.

[0033] Both ends of the second lead frame 32 function as terminal portions 32b, 32c. The terminal portions 32b, 32c are exposed at the top of the housing 34 and on the front surface of a lid (not shown) of the semiconductor module 10.

[0034] The third lead frame 33 is joined to the third conductive plate 23c and the fourth conductive plate 23d. Soldering, ultrasonic bonding, or the like is used to join the third lead frame 33 to the third conductive plate 23c and the fourth conductive plate 23d. One end of the third lead frame 33 functions as a terminal portion 33a. The terminal portion 33a is exposed at the top of the housing 34. The terminal portion 33a functions as one of the output terminals (U-terminal, V-terminal, or W-terminal) of the semiconductor module 10.

[0035] The first lead frame 31, the second lead frame 32, and the third lead frame 33 are made of a material having excellent electrical conductivity, such as aluminum, iron, silver, copper, or an alloy containing at least one of these metals.

[0036] 3 is a plan view of the semiconductor module with the printed circuit board supported. The printed circuit board 7 includes an insulating plate and a plurality of upper circuit patterns formed on the front surface of the insulating plate, and various circuit elements are mounted on the circuit patterns. In addition, the printed circuit board 7 may include a plurality of lower circuit patterns on the rear surface of the insulating plate, and may further include an inner layer circuit pattern inside the printed circuit board 7, as necessary.

[0037] The printed circuit board 7 is, for example, a through-hole board, with multiple holes 7a penetrating from the front surface to the back surface formed at positions corresponding to the internal terminals and extended internal terminals described below included in the internal terminal units 61, ..., 67.

[0038] The extended internal terminal is provided with a stepped portion, which will be described later, and the internal terminal and the extended internal terminal are inserted into the hole 7a of the printed circuit board 7, and the printed circuit board 7 is inserted up to the position of the stepped portion provided in the extended internal terminal, thereby supporting the printed circuit board 7. Thus, the semiconductor module 10 has a two-layer structure consisting of the first insulating substrate 21a and the second insulating substrate 21b, and the printed circuit board 7.

[0039] 4 is a diagram showing an example of the configuration of the internal terminal unit 61. The internal terminal unit 61 includes an internal terminal group 61g including a plurality of internal terminals 61a, 61b, 61c, and 61d, and an extended internal terminal 61w, on a base portion 61bs. The base portion 61bs is made of resin, and is integrated with the resin case 30 and mounted to the case 30. When the extended internal terminal 61w is provided in the internal terminal unit 61, the extended internal terminal 61w is provided at an end of the internal terminal unit 61.

[0040] The internal terminal unit 62 includes an internal terminal group 62g including multiple internal terminals 62a, 62b, 62c, 62d, and an extended internal terminal 62w, which are disposed on a base portion 62bs. The base portion 62bs is made of resin, and is integrated with a resin case 30 and mounted on the case 30. When the extended internal terminal 62w is provided in the internal terminal unit 62, the extended internal terminal 62w is provided at an end portion of the internal terminal unit 62.

[0041] The extended internal terminal 61w has a step portion sp1, and the extended internal terminal 62w has a step portion sp2. The internal terminals and the extended internal terminals are inserted into holes provided in the printed circuit board 7, and the printed circuit board 7 is inserted up to the positions of the step portions sp1 and sp2 provided in the extended internal terminals 61w and 62w, so that the printed circuit board 7 is supported by the step portions sp1 and sp2. The thickness of the printed circuit board 7 is about 0.9 to 1.3 mm.

[0042] 5 is a diagram for explaining the step portion. In the internal terminal unit 61, the internal terminals 61a, . . . , 61d and the extended internal terminal 61w have a first pin width w1 (first width). The step portion sp1 of the extended internal terminal 61w is formed with a second pin width w2 (second width) obtained by expanding the first pin width w1 in one direction. Furthermore, the width w3 (third width) between the internal terminals 61a, . . . , 61d and the extended internal terminal 61w in the internal terminal unit 61 is constant, and the width w3 is larger than the first pin width w1. The width w3 being larger than the first pin width w1 ensures an insulation distance between each terminal.

[0043] The step portion sp1 is formed by extending from the end of the internal terminal unit 61 where the extended internal terminal 61w is located in the opposite direction to the arrangement direction of the internal terminals 61a, . . . , 61d (it is not formed in the direction perpendicular to the arrangement direction of the terminals). In this way, the step portion sp1 of the extended internal terminal 61w is provided by extending in the -X direction in Fig. 5. This makes it possible to ensure an insulation distance between the internal terminal 61a and the extended internal terminal 61w.

[0044] Similarly, in the internal terminal unit 62, the internal terminals 62a, ···, 62d and the extended internal terminal 62w have a first pin width w1. Also, the stepped portion sp2 of the extended internal terminal 62w is formed with a second pin width w2 that extends the first pin width w1 in one direction. Further, the width w3 between the terminals of each of the internal terminals 62a, ···, 62d and the extended internal terminal 62w within the internal terminal unit 62 is constant, and the width w3 is larger than the first pin width w1. By having the width w3 larger than the first pin width w1, an insulation distance between each terminal is ensured.

[0045] The stepped portion sp2 is formed to extend in a direction opposite to the terminal arrangement direction of the internal terminals 62a, ···, 62d starting from the end of the internal terminal unit 62 where the extended internal terminal 62w is located (it is not formed in a direction perpendicular to the terminal arrangement direction). In this way, the stepped portion sp2 of the extended internal terminal 62w is provided to extend in the X direction of FIG. 5. Thereby, an insulation distance between the internal terminal 62a and the extended internal terminal 62w can be ensured.

[0046] FIG. 6 is a diagram showing the pin width of the internal terminal. FIG. 7 is a diagram showing the relationship between the internal terminal and the hole size of the printed circuit board, where (a) is a plan view of the internal terminal and the hole of the printed circuit board, and (b) is a plan view of the state where the internal terminal is inserted into the hole of the printed circuit board. The first pin width w1 of the internal terminals 61a, ···, 61d (collectively referred to as internal terminal 61-1 when generalized) included in the internal terminal group 61g is smaller than the size (hole size) of the hole 7a of the printed circuit board 7. That is, when the diameter of the hole 7a is D, w1 < D. Therefore, the internal terminal 61-1 can penetrate the hole 7a of the printed circuit board 7.

[0047] Similarly, although not shown, the first pin width w1 of the internal terminals 62a, ···, 62d (collectively referred to as internal terminal 62-1 when generalized) included in the internal terminal group 62g is also smaller than the size of the hole 7a of the printed circuit board 7, and the internal terminal 62-1 can penetrate the hole 7a of the printed circuit board 7.

[0048] FIG. 8 is a diagram showing the pin width of the extended internal terminal. FIG. 9 is a diagram showing the relationship between the extended internal terminal and the hole size of the printed circuit board. (a) is a plan view of the hole of the printed circuit board and the extended internal terminal, and (b) is a plan view of a state where the extended internal terminal is inserted into the hole of the printed circuit board. The second pin width w2 of the extended internal terminal 61w is larger in the -X direction with respect to the size of the hole 7a of the printed circuit board 7. That is, the second pin width w2 of the extended internal terminal 61w is formed larger than the diameter D of the hole 7a. By setting D < w2, the extended internal terminal 61w does not penetrate the hole 7a of the printed circuit board 7 at the step portion sp1, and even if there is a slight misalignment between the hole 7a and the internal terminal, it is possible to stably support the printed circuit board 7.

[0049] Similarly, although not shown, the second pin width w2 of the extended internal terminal 62w is larger in the X direction with respect to the size of the hole 7a of the printed circuit board 7. That is, the second pin width w2 of the extended internal terminal 62w is formed larger than the diameter D of the hole 7a. By setting D < w2, the extended internal terminal 62w does not penetrate the hole 7a of the printed circuit board 7 at the step portion sp2, and even if there is a slight misalignment between the hole 7a and the internal terminal, it is possible to stably support the printed circuit board 7.

[0050] Note that the internal terminal unit having the extended internal terminal formed with such a step portion is preferably provided at least at three locations at a certain distance from each other per printed circuit board 7 so that the printed circuit board 7 can be stably supported. When there are no restrictions such as insulation distance, the internal terminal unit having the extended internal terminal may be provided at four or more locations.

[0051] 10 is a diagram showing an example of soldering between an internal terminal and a hole of a printed circuit board. At a position where the printed circuit board 7 is supported by a step portion of the extended internal terminal, the internal terminal 61-1 and the hole 7a of the printed circuit board 7 are soldered together. At the soldered joints 8a1, . . . , 8a4 between the internal terminal 61-1 and the hole 7a of the printed circuit board 7, the solder fillets 91, . . . , 94 are all secured in equal amounts, and the solder fillets 91, . . . , 94 (first solder fillets) are evenly formed. The joints 8a1 and 8a2 correspond to the front surface of the hole of the printed circuit board 7, and the joints 8a3 and 8a4 correspond to the rear surface of the hole of the printed circuit board 7.

[0052] 11 is a diagram showing an example of soldering between an extended internal terminal and a hole in a printed circuit board. At a position where the printed circuit board 7 is supported by a step portion of the extended internal terminal, the extended internal terminal 61w and the hole 7a in the printed circuit board 7 are joined by solder. Solder fillets 91, 92, and 93 are evenly formed at solder joints 8b1, 8b2, and 8b3 between the extended internal terminal 61w and the hole 7a in the printed circuit board 7. The joints 8b1 and 8b2 correspond to the front surface of the hole in the printed circuit board 7, and the joint 8b3 corresponds to the back surface of the hole in the printed circuit board 7.

[0053] On the other hand, at solder joint portion 8b4 where step portion sp1 is located, a smaller amount of solder fillet 94a (second solder fillet) is attached and joined compared to solder fillets 91, 92, and 93. Note that joint portion 8b4 corresponds to the rear surface of the hole in printed circuit board 7. In this manner, solder joining is performed at a position where printed circuit board 7 is supported by the step portion of the extended internal terminal, thereby making it possible to stably fix and support printed circuit board 7.

[0054] 12 is a diagram showing the state of connection between the internal terminal unit and the circuit pattern on the insulating substrate. (a) is a plan view of the internal terminal unit, and (b) is a side view of the internal terminal unit when it supports a printed circuit board. In the internal terminal unit 62, the extended internal terminal 62w and the internal terminals 62a, 62b, 62c, and 62d are bent perpendicularly to the arrangement direction of the terminals inside the base portion 62bs.

[0055] Here, in the extended internal terminal 62w, if the direction of the wide portion (second pin width w2) were the X-axis or Z-axis direction, the strength required to bend the wide terminal would increase, making it difficult to bend the wide terminal at the same time as the other internal terminals 62a, 62b, 62c, and 62d. In contrast, in the extended internal terminal 62w of the present invention, the wide portion is formed in the Y-axis direction and a step portion is formed, so that it is easy to bend the extended internal terminal 62w from the X-axis to the Z-axis. In this way, the extended internal terminal 62w has a terminal configuration that allows easy formation of a terminal in a bent shape when the wide portion is provided and the bent portion 62w-1 is formed.

[0056] On the other hand, the bent portion 62w-1 of the extended internal terminal 62w protruding outward from the base portion 62bs, and the bent portions 62a-1, 62b-1, 62c-1, and 62d-1 of the internal terminals 62a, 62b, 62c, and 62d protruding outward from the base portion 62bs are wire bonded to a circuit pattern laid on an insulating substrate.

[0057] That is, the bent portion 62w-1 of the extended internal terminal 62w is connected via a wire wr0 to a circuit pattern p11 provided on the insulating substrate 20. In addition, the bent portion 62a-1 of the internal terminal 62a is connected via a wire wr1 to a circuit pattern p12 provided on the insulating substrate 20, and the bent portion 62b-1 of the internal terminal 62b is connected via a wire wr2 to a circuit pattern p13 provided on the insulating substrate 20. Furthermore, the bent portion 62c-1 of the internal terminal 62c is connected to a circuit pattern p14 laid on the insulating substrate 20 via a wire wr3, and the bent portion 62d-1 of the internal terminal 62d is connected to a circuit pattern p15 laid on the insulating substrate 20 via a wire wr4.

[0058] Figures 13 and 14 are diagrams showing the state of connection between the internal terminal unit and the circuit pattern on the printed circuit board. Figure 13 shows a plan view of the internal terminal unit when it supports the printed circuit board, and Figure 14 shows a side view of the internal terminal unit when it supports the printed circuit board. The extended internal terminal 62w of the internal terminal unit 62 has a protruding portion 62w-2 that protrudes from the front surface of the printed circuit board 7. The internal terminals 62a, 62b, 62c, and 62d also have protruding portions 62a-2, 62b-2, 62c-2, and 62d-2 that protrude from the front surface of the printed circuit board 7, respectively.

[0059] The protrusion 62w-2 and the protrusions 62a-2, 62b-2, 62c-2, and 62d-2 are joined by solder at the hole 7a to a circuit pattern (inner layer circuit pattern) provided inside the printed circuit board 7. That is, the protrusion 62w-2 is joined by solder sd1 at the hole 7a to the circuit pattern p21. The protruding portion 62a-2 is joined to the circuit pattern p22 at the portion of the hole 7a with solder sd2, and the protruding portion 62b-2 is joined to the circuit pattern p23 at the portion of the hole 7a with solder sd3. Furthermore, the protrusion 62c-2 is joined to the circuit pattern p24 at the portion of the hole 7a with solder sd4, and the protrusion 62d-2 is joined to the circuit pattern p25 at the portion of the hole 7a with solder sd5.

[0060] Fig. 15 is a diagram showing an example of an embodiment of a configuration for supporting a printed circuit board, and Fig. 16 is a diagram showing a comparative example of a configuration for supporting a printed circuit board. Fig. 15 shows a configuration for supporting a printed circuit board 7 with an extended internal terminal, and Fig. 16 shows a configuration for supporting a printed circuit board 7 with a resin pin. 15, the semiconductor module 10 has internal terminal units 61, . . . , 64 arranged on the bottom surface of the case 30 (illustration of a heat sink, insulating substrate, etc. is omitted). The internal terminal unit 61 includes an internal terminal group 61g and an extended internal terminal 61w having a step portion sp1 on a base portion 61bs, and the base portion 61bs is integrally formed with the resin case 30.

[0061] The internal terminal unit 62 includes an internal terminal group 62g and an extended internal terminal 62w having a step portion sp2 on a base portion 62bs, and the base portion 62bs is integrally formed with the case 30 made of resin. Furthermore, the internal terminal unit 63 includes an internal terminal group 63g and an extended internal terminal 63w having a step portion sp3 on a base portion 63bs, and the base portion 63bs is integrally formed with the case 30 made of resin.

[0062] The internal terminal unit 64 includes an internal terminal group 64g and an extended internal terminal 64w having a stepped portion sp4 on a base portion 64bs, and the base portion 64bs is integrally formed with the resin case 30. The printed circuit board 7 is supported by being inserted up to the positions of the stepped portions sp1, ..., sp4 provided on the extended internal terminals 61w, ..., 64w, respectively.

[0063] 16, semiconductor module 10a has internal terminal units 6a1, . . . , 6a4 arranged on the bottom surface of case 30. Internal terminal unit 6a1 has an internal terminal group 6ag1 on a base portion bs1, which is formed integrally with resin case 30. Internal terminal unit 6a2 has an internal terminal group 6ag2 on a base portion bs2, which is formed integrally with resin case 30.

[0064] Furthermore, the internal terminal unit 6a3 includes an internal terminal group 6ag3 on a base portion bs3, and the base portion bs3 is formed integrally with the resin case 30. Moreover, the internal terminal unit 6a4 includes an internal terminal group 6ag4 on a base portion bs4, and the base portion bs4 is formed integrally with the resin case 30.

[0065] On the other hand, resin pins P1, ..., P5 are provided on the bottom surface of the case 30, and the holes in the printed circuit board 7 are inserted into the internal terminal groups 6ag1, ..., 6ag4 up to the position of the upper surfaces of the resin pins P1, ..., P5, so that the printed circuit board 7 is supported by the resin pins P1, ..., P5.

[0066] In this manner, in the embodiment of the present invention shown in Fig. 15, an internal terminal unit including an extended internal terminal is provided, and the printed circuit board is supported at the stepped portion. Compared to the configuration shown in Fig. 16, the resin pins P1, ..., P5 specialized for supporting the printed circuit board 7 can be eliminated, so that the entire case 30 can be made smaller. Also, the stepped portions sp1, ..., sp4 are formed by expanding in the opposite direction to the arrangement direction of the terminals of the internal terminal group, so there is no problem in ensuring the insulation distance by the extended internal terminal.

[0067] The printed circuit board 7 used in the semiconductor module 10 of the present invention is a low-cost printed circuit board with relatively low strength (a thin printed circuit board with a thickness of about 1 mm, between 0.9 and 1.3 mm, typically a single-layer printed circuit board). Therefore, since it is not a printed circuit board used in a press-fit system (a printed circuit board with a thickness of about 1.7 mm, typically a multi-layer printed circuit board with a thickness of about 1.6 mm to 1.8 mm or more that can withstand press-fitting), the internal terminals and extended internal terminals provided in the internal terminal unit are terminals suitable for solder jointing. There is no problem if the present invention is used for a thick printed circuit board with high strength, but it is preferable to apply it to one with a relatively low strength and a thickness of less than 1.4 mm. [Explanation of symbols]

[0068] 10, 10a Semiconductor module 11 Metal Base 20 Insulating substrate 21a First insulating substrate 21b Second insulating substrate 22a First semiconductor element 22b Second semiconductor element 23a 1st conductive plate 23b Second conductive plate 23c Third conductive plate 23d Fourth conductive plate 24b Semiconductor elements 30 cases 31 First lead frame 31b, 31c, 32b, 32c, 33a terminal section 32 Second lead frame 33 3rd lead frame 34 Case 35a, 35b control terminal 40 First insulating member 50 Second insulating member 61, 62, 63, 64, 65, 66, 67, 6a1, 6a2, 6a3, 6a4 Internal terminal unit 61g, 62g, 63g, 64g, 6ag1, 6ag2, 6ag3, 6ag4 Internal terminal group 61a, 61b, 61c, 61d, 62a, 62b, 62c, 62d, 61-1 Internal terminal 61w, 62w, 63w, 64w Extended internal terminal 62w-1, 62a-1, 62b-1, 62c-1, 62d-1 bent part 62w-2, 62a-2, 62b-2, 62c-2, 62d-2 protrusion sp1, sp2, sp3, sp4 step 61bs, 62b2, 63bs, 64bs, bs1, bs2, bs3, bs4 base 7 Printed Circuit Board Hall 7a 8a1, 8a2, 8a3, 8a4, 8b1, 8b2, 8b3, 8b4 solder joints 91, 92, 93, 94, 94a Solder fillet w1 1st pin width w2 Second pin width w3 Width between terminals in the internal terminal unit wr0, wr10, wr1, wr2, wr3, wr4 wires p11, p12, p1, p14, p15 circuit patterns p21, p22, p23, p24, p25 Circuit pattern (inner layer circuit pattern) sd1, sd2, sd3, sd4, sd5 solder P1, P2, P3, P4, P5 Resin pins

Claims

1. an internal terminal unit including an internal terminal group including a plurality of internal terminals each having a first width, and at least one extended internal terminal having a step portion formed by the first width and a second width obtained by extending the first width in one direction, and supporting a printed circuit board by the step portion; The extension internal terminal is provided at an end of the internal terminal unit, The second width is formed by expanding from the end portion in a direction opposite to the arrangement direction of the plurality of internal terminals. Semiconductor module.

2. 2. The semiconductor module according to claim 1, wherein said internal terminal group and said extended internal terminal are joined to said printed circuit board having a thickness of 0.9 to 1.3 mm.

3. 2. The semiconductor module according to claim 1, wherein said internal terminals and said extended internal terminals are provided on a base portion that is integrated with a case.

4. a first solder fillet having a first amount of solder is attached to a joint between the internal terminal group and the front and rear surfaces of the holes of the printed circuit board, and to a joint between the step portion of the extension internal terminal and the front surface of the holes of the printed circuit board; 2. The semiconductor module according to claim 1, wherein a second solder fillet having a second amount of solder less than the first amount of solder is attached to the joint between the step portion of the extended internal terminal and the rear surface of the hole in the printed circuit board.

5. 4. The semiconductor module of claim 3, wherein the internal terminal group and the extended internal terminal are bent perpendicularly to the arrangement direction inside the base, and the bent portions exposed from the base are connected by wire bonds to a circuit pattern laid on an insulating substrate.

6. 2. The semiconductor module of claim 1, wherein the internal terminal group and the extended internal terminal have protruding portions that protrude from the front surface of the printed circuit board when the printed circuit board is supported, and the protruding portions are connected by solder to wiring laid on the printed circuit board.

7. 2. The semiconductor module according to claim 1, wherein the space between the internal terminals and between the internal terminals and the extended internal terminals in the internal terminal unit have a constant third width, the third width being greater than the first width.

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